JP2005285925A - Ｌｅｄ - Google Patents

Ｌｅｄ Download PDF

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Publication number
JP2005285925A
JP2005285925A JP2004094774A JP2004094774A JP2005285925A JP 2005285925 A JP2005285925 A JP 2005285925A JP 2004094774 A JP2004094774 A JP 2004094774A JP 2004094774 A JP2004094774 A JP 2004094774A JP 2005285925 A JP2005285925 A JP 2005285925A
Authority
JP
Japan
Prior art keywords
light
led
chip
led chip
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004094774A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005285925A5 (enExample
Inventor
Tadashi Nomura
直史 野村
Minoru Tanaka
稔 田中
Yasumasa Morita
康正 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004094774A priority Critical patent/JP2005285925A/ja
Priority to DE102005014144A priority patent/DE102005014144A1/de
Priority to US11/091,777 priority patent/US7586127B2/en
Priority to CNA2005100594000A priority patent/CN1677702A/zh
Publication of JP2005285925A publication Critical patent/JP2005285925A/ja
Publication of JP2005285925A5 publication Critical patent/JP2005285925A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2004094774A 2004-03-29 2004-03-29 Ｌｅｄ Pending JP2005285925A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004094774A JP2005285925A (ja) 2004-03-29 2004-03-29 Ｌｅｄ
DE102005014144A DE102005014144A1 (de) 2004-03-29 2005-03-29 Leuchtdiode
US11/091,777 US7586127B2 (en) 2004-03-29 2005-03-29 Light emitting diode
CNA2005100594000A CN1677702A (zh) 2004-03-29 2005-03-29 发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004094774A JP2005285925A (ja) 2004-03-29 2004-03-29 Ｌｅｄ

Publications (2)

Publication Number Publication Date
JP2005285925A true JP2005285925A (ja) 2005-10-13
JP2005285925A5 JP2005285925A5 (enExample) 2007-04-12

Family

ID=35184008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004094774A Pending JP2005285925A (ja) 2004-03-29 2004-03-29 Ｌｅｄ

Country Status (1)

Country Link
JP (1) JP2005285925A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123905A (ja) * 2005-10-27 2007-05-17 Lg Innotek Co Ltd 発光ダイオード素子、発光ダイオード素子の製造方法、及び発光ダイオード素子の固着構造
JP2007265993A (ja) * 2006-03-27 2007-10-11 Lg Innotek Co Ltd Ｌｅｄ照明装置およびその製造方法
US8415870B2 (en) 2008-08-28 2013-04-09 Panasonic Corporation Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same
JP2017183734A (ja) * 2009-09-18 2017-10-05 ソラア インコーポレーテッドＳｏｒａａ Ｉｎｃ． 電流密度操作を用いた電力発光ダイオード及び方法
US10553754B2 (en) 2009-09-18 2020-02-04 Soraa, Inc. Power light emitting diode and method with uniform current density operation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11500584A (ja) * 1996-09-20 1999-01-12 シーメンス アクチエンゲゼルシヤフト 波長変換する注型材料、その使用方法及びその製造方法
JP2003176334A (ja) * 2001-01-24 2003-06-24 Nichia Chem Ind Ltd エポキシ樹脂組成物、その製造方法、それを用いた光半導体素子
JP2003203504A (ja) * 2001-09-20 2003-07-18 Patent Treuhand Ges Elektr Gluehlamp Mbh 光源として少なくとも１つのｌｅｄを備えた照明ユニット
JP2004031989A (ja) * 1996-06-26 2004-01-29 Siemens Ag 被覆素子、半導体発光素子及び半導体発光素子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031989A (ja) * 1996-06-26 2004-01-29 Siemens Ag 被覆素子、半導体発光素子及び半導体発光素子の製造方法
JPH11500584A (ja) * 1996-09-20 1999-01-12 シーメンス アクチエンゲゼルシヤフト 波長変換する注型材料、その使用方法及びその製造方法
JP2003176334A (ja) * 2001-01-24 2003-06-24 Nichia Chem Ind Ltd エポキシ樹脂組成物、その製造方法、それを用いた光半導体素子
JP2003203504A (ja) * 2001-09-20 2003-07-18 Patent Treuhand Ges Elektr Gluehlamp Mbh 光源として少なくとも１つのｌｅｄを備えた照明ユニット

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123905A (ja) * 2005-10-27 2007-05-17 Lg Innotek Co Ltd 発光ダイオード素子、発光ダイオード素子の製造方法、及び発光ダイオード素子の固着構造
US8343784B2 (en) 2005-10-27 2013-01-01 Lg Innotek Co., Ltd. Light emitting diode device, manufacturing method of the light emitting diode device and mounting structure of the light emitting diode device
JP2007265993A (ja) * 2006-03-27 2007-10-11 Lg Innotek Co Ltd Ｌｅｄ照明装置およびその製造方法
US8415870B2 (en) 2008-08-28 2013-04-09 Panasonic Corporation Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same
JP2017183734A (ja) * 2009-09-18 2017-10-05 ソラア インコーポレーテッドＳｏｒａａ Ｉｎｃ． 電流密度操作を用いた電力発光ダイオード及び方法
US10553754B2 (en) 2009-09-18 2020-02-04 Soraa, Inc. Power light emitting diode and method with uniform current density operation

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