JP2005275405A5 - - Google Patents

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Publication number
JP2005275405A5
JP2005275405A5 JP2005077458A JP2005077458A JP2005275405A5 JP 2005275405 A5 JP2005275405 A5 JP 2005275405A5 JP 2005077458 A JP2005077458 A JP 2005077458A JP 2005077458 A JP2005077458 A JP 2005077458A JP 2005275405 A5 JP2005275405 A5 JP 2005275405A5
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JP
Japan
Prior art keywords
substrate
polymer
optically active
forming
waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005077458A
Other languages
English (en)
Japanese (ja)
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JP2005275405A (ja
Filing date
Publication date
Priority claimed from US10/805,825 external-priority patent/US20050207693A1/en
Application filed filed Critical
Publication of JP2005275405A publication Critical patent/JP2005275405A/ja
Publication of JP2005275405A5 publication Critical patent/JP2005275405A5/ja
Pending legal-status Critical Current

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JP2005077458A 2004-03-22 2005-03-17 光回路板部品を接続する光学的構造及び方法 Pending JP2005275405A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/805,825 US20050207693A1 (en) 2004-03-22 2004-03-22 Optical structures and methods for connecting optical circuit board components

Publications (2)

Publication Number Publication Date
JP2005275405A JP2005275405A (ja) 2005-10-06
JP2005275405A5 true JP2005275405A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2008-03-13

Family

ID=34986360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005077458A Pending JP2005275405A (ja) 2004-03-22 2005-03-17 光回路板部品を接続する光学的構造及び方法

Country Status (2)

Country Link
US (1) US20050207693A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2005275405A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2895147B1 (fr) * 2005-12-16 2008-07-11 Thales Sa Boitier hyperfrequences a connexions electriques et optiques
JP4664200B2 (ja) * 2005-12-22 2011-04-06 富士ゼロックス株式会社 光接続装置
JP4728857B2 (ja) * 2006-03-28 2011-07-20 古河電気工業株式会社 光結合器
US8487428B2 (en) * 2007-11-20 2013-07-16 Fujitsu Limited Method and system for providing a reliable semiconductor assembly
US7781867B2 (en) * 2007-12-28 2010-08-24 Fujitsu Limited Method and system for providing an aligned semiconductor assembly
US20090200663A1 (en) 2008-02-11 2009-08-13 Daubenspeck Timothy H Polymer and solder pillars for connecting chip and carrier
US7855377B2 (en) * 2008-08-05 2010-12-21 Fujitsu Limited Alignment structures for an optical assembly
US20100034497A1 (en) * 2008-08-05 2010-02-11 Fujitsu Limited Flexible Optical Pillars for an Optical Assembly
DE102008038993B4 (de) * 2008-08-13 2011-06-22 Karlsruher Institut für Technologie, 76131 Optisches Element und Verfahren zu seiner Herstellung
WO2010030295A1 (en) * 2008-09-15 2010-03-18 Hewlett-Packard Development Company, L.P. In-plane optical wave guide with area based splitter
JP2010139562A (ja) * 2008-12-09 2010-06-24 Shinko Electric Ind Co Ltd 光導波路、光導波路搭載基板及び光送受信装置
US20100164030A1 (en) * 2008-12-31 2010-07-01 International Business Machines Corporation Chip carrier bearing large silicon for high performance computing and related method
US8708576B2 (en) * 2011-01-20 2014-04-29 Harris Corporation Electro-optical device having an elastomeric body and related methods
US9490148B2 (en) * 2012-09-27 2016-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Adhesion promoter apparatus and method
US9939578B2 (en) * 2013-05-10 2018-04-10 Intel Corporation Low cost integration of optical components in planar lightwave circuits
US9300036B2 (en) 2013-06-07 2016-03-29 Apple Inc. Radio-frequency transparent window
CN111413763B (zh) * 2020-04-21 2022-02-11 东南大学 一种三维光电互联基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09218321A (ja) * 1996-02-14 1997-08-19 Fujitsu Ltd 光デバイスと光導波路の集積法
US5835646A (en) * 1995-09-19 1998-11-10 Fujitsu Limited Active optical circuit sheet or active optical circuit board, active optical connector and optical MCM, process for fabricating optical waveguide, and devices obtained thereby
JPH0990153A (ja) * 1995-09-20 1997-04-04 Fujitsu Ltd 光導波路の作製方法およびそれにより得られるデバイス
JP3715425B2 (ja) * 1998-03-06 2005-11-09 ブラザー工業株式会社 光導波路付基板の製造方法
JP3764640B2 (ja) * 2000-09-26 2006-04-12 京セラ株式会社 光モジュール及びその製造方法
US6731843B2 (en) * 2000-12-29 2004-05-04 Intel Corporation Multi-level waveguide
JP3900280B2 (ja) * 2003-02-10 2007-04-04 セイコーエプソン株式会社 光素子と光ファイバとの結合構造、光素子と光ファイバとの結合方法、ならびに光モジュール
US7092603B2 (en) * 2004-03-03 2006-08-15 Fujitsu Limited Optical bridge for chip-to-board interconnection and methods of fabrication

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