JP2005274882A - Inspection method for photosensitive coating layer - Google Patents
Inspection method for photosensitive coating layer Download PDFInfo
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- JP2005274882A JP2005274882A JP2004087005A JP2004087005A JP2005274882A JP 2005274882 A JP2005274882 A JP 2005274882A JP 2004087005 A JP2004087005 A JP 2004087005A JP 2004087005 A JP2004087005 A JP 2004087005A JP 2005274882 A JP2005274882 A JP 2005274882A
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- coating layer
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Abstract
Description
本発明は、感光性被覆層の検査方法に関するものである。 The present invention relates to a method for inspecting a photosensitive coating layer.
近年の電子機器の高密度化に伴い、これに用いられるフレキシブル配線板等の回路基板の高密度化、微細化が進んでいる。 With the recent increase in the density of electronic devices, the density and miniaturization of circuit boards such as flexible wiring boards used in the electronic equipment have been advanced.
サブトラクティブ法においてこれらの要求を満足する為の要素として、加工技術、材料が挙げられ材料においては薄膜化により加工精度及び能力が向上されてきており、感光性被覆層(以下DFRという)もそれらに該当する。 In order to satisfy these requirements in the subtractive method, there are processing techniques and materials. In the materials, processing accuracy and capability have been improved by thinning, and a photosensitive coating layer (hereinafter referred to as DFR) is also used. It corresponds to.
しかし、DFRの薄膜化により基材への密着性及び埋め込み性が製品歩留に寄与しており安定した品質のDFRが必須である。(例えば特許文献1)
本発明は、サブトラクティブ法において使用されるDFRについての検査方法を提供することにある。 An object of the present invention is to provide an inspection method for DFR used in a subtractive method.
このような目的は、下記(1)〜(4)に記載の本発明により達成される。
(1)基材の表面に感光性被覆層を積層した後、フォトマスクを用いず前記感光性被覆層を露光させる第1の工程と、露光した前記感光性被覆層を現像する第2の工程とを有する感光性被覆層の検査方法。
(2)前記感光性被覆層は、第1のフィルムと、感光性樹脂と、第2のフィルムから構成されるものである上記(1)に記載の感光性被覆層の検査方法。
(3)前記第2のフィルムは、前記感光性被覆層を基材の表面に積層する際、剥離するものである上記(1)または(2)に記載の感光性被覆層の検査方法。
(4)前記第2の工程の後、前記感光性被覆層の針穴状欠損を検査するものである上記(1)ないし(3)のいずれかに記載の感光性被覆層の検査方法。
Such an object is achieved by the present invention described in the following (1) to (4).
(1) A first step of laminating a photosensitive coating layer on the surface of a substrate and then exposing the photosensitive coating layer without using a photomask; and a second step of developing the exposed photosensitive coating layer A method for inspecting a photosensitive coating layer.
(2) The method for inspecting a photosensitive coating layer according to (1), wherein the photosensitive coating layer includes a first film, a photosensitive resin, and a second film.
(3) The method for inspecting a photosensitive coating layer according to (1) or (2), wherein the second film is peeled off when the photosensitive coating layer is laminated on a surface of a substrate.
(4) The method for inspecting a photosensitive coating layer according to any one of (1) to (3), wherein after the second step, the needle hole-like defect of the photosensitive coating layer is inspected.
本発明によれば、サブトラクティブ法において使用されるDFRのエアーボイド発生率の検出を容易に実現することを可能にするものである。 According to the present invention, it is possible to easily detect the air void generation rate of the DFR used in the subtractive method.
以下、本発明のDFRの検査方法において好適な実施形態に基づいて詳細に説明する。 Hereinafter, the DFR inspection method of the present invention will be described in detail based on preferred embodiments.
図1は、第2のフィルムに異物があり感光性樹脂に凹状のへこみを示した断面を示す概略図である。図2は、凹状のへこみを有する感光性樹脂層を基材に積層し、凹部のエアーだまりを示した断面を示す概略図である。図3は、感光性樹脂層を露光した状態を示した断面を示す概略図である。図4は、露光後、第2のフィルムを除去し現像後、凹部が針穴状欠損になった状態を示した断面を示す概略図である。 FIG. 1 is a schematic view showing a cross section showing foreign matter in the second film and showing a concave dent in the photosensitive resin. FIG. 2 is a schematic view showing a cross section in which a photosensitive resin layer having a concave dent is laminated on a base material and an air pool in the concave portion is shown. FIG. 3 is a schematic view showing a cross section showing a state in which the photosensitive resin layer is exposed. FIG. 4 is a schematic view showing a cross-section showing a state in which the second film is removed after the exposure and development, and the concave portion becomes a needle hole-like defect after the exposure.
図1に示すように、例えば、基材の片面または両面に銅箔が形成されたフレキシブル銅張板を用い、感光性被覆層の密着性向上と銅箔表面の洗浄を目的として前処理を行なう。 As shown in FIG. 1, for example, a flexible copper-clad plate in which a copper foil is formed on one side or both sides of a substrate is used, and a pretreatment is performed for the purpose of improving the adhesion of the photosensitive coating layer and cleaning the copper foil surface. .
前記の前処理は、特に限定はされないが、機械研磨、化学研磨等が挙げられる。微細箇所の検査には、銅箔の表面を均一に処理が可能である化学研磨法が望ましい。 The pretreatment is not particularly limited, and examples thereof include mechanical polishing and chemical polishing. A chemical polishing method that can uniformly treat the surface of the copper foil is desirable for the inspection of the fine portions.
基材の銅箔厚さは、特に限定されないが、一般に用いられている厚さのものを用いればよい。例えは、8〜35μmの電解銅箔または圧延銅箔など特に限定はされない。また、針穴状欠損を検査するのであれば、銅箔付ではなく、エポキシ樹脂積層板、フェノール樹脂積層板、ポリエステルフィルム、ポリイミドフィルムなどを用いて、基材表面に感光性被覆層を積層してもよい。 Although the copper foil thickness of a base material is not specifically limited, The thing of the thickness generally used should just be used. For example, there is no particular limitation such as an electrolytic copper foil of 8 to 35 μm or a rolled copper foil. Also, if you want to inspect needle hole-like defects, laminate a photosensitive coating layer on the surface of the substrate using an epoxy resin laminate, phenol resin laminate, polyester film, polyimide film, etc. instead of with copper foil. May be.
次に、基材銅箔表面にDFRを積層する。積層方法としては、特に限定はされないが、ラミネート法で貼り付けることが好ましい。銅箔表面に張り付ける際に第2のフィルムを剥離し感光性樹脂を銅箔表面にラミネートする。 Next, DFR is laminated on the surface of the base copper foil. Although it does not specifically limit as a lamination method, It is preferable to affix by the lamination method. When pasting on the copper foil surface, the second film is peeled off and the photosensitive resin is laminated on the copper foil surface.
ラミネート条件は特に限定されないが、温度90〜120℃、圧力0.2〜0.4MPa、速度1.0〜3.0m/minで圧着することが好ましい。また、DFRの厚みはサブトラクティブ法において使用される5〜60μmが好ましく、さらには5〜40μmがより好ましく、さらには微細パターン形成を目的として使用される5〜15μm厚がより好ましい。 Lamination conditions are not particularly limited, but it is preferable to perform pressure bonding at a temperature of 90 to 120 ° C., a pressure of 0.2 to 0.4 MPa, and a speed of 1.0 to 3.0 m / min. The thickness of the DFR is preferably 5 to 60 μm used in the subtractive method, more preferably 5 to 40 μm, and further preferably 5 to 15 μm used for the purpose of forming a fine pattern.
次に、DFR全面に露光を実施するがDFR単体の評価であるため露光光源とDFRの間に例えばフォトマスク等が介在しないことが好ましい。露光条件は特に限定されないが50〜150mJ/cm 2の積算光量で露光することが好ましい。 Next, exposure is performed on the entire surface of the DFR, but since it is an evaluation of the DFR alone, it is preferable that no photomask or the like be interposed between the exposure light source and the DFR. Although exposure conditions are not particularly limited, it is preferable to expose with an integrated light quantity of 50 to 150 mJ / cm 2 .
前記の露光手段としては露光装置(密着型、投影型等)、紫外線照射装置等が挙げられるがDFR対象でありサブトラクティブ法でのプロセスに使用される露光装置が好ましい。 Examples of the exposure means include an exposure apparatus (contact type, projection type, etc.), an ultraviolet irradiation apparatus, etc., but an exposure apparatus that is a DFR target and is used in a process using a subtractive method is preferable.
次に現像処理を実施しDFRの表面状態を検査する。 Next, development processing is performed to inspect the surface state of the DFR.
現像条件は特に限定されないが、0.9〜1.1%炭酸ナトリウム水溶液、温度28〜30℃、処理時間10〜50秒が好ましい。また、表面状態の検査は微細なDFRのエアーボイドの観察を目的として10〜40倍の顕微鏡観察が好ましい。 The development conditions are not particularly limited, but a 0.9 to 1.1% sodium carbonate aqueous solution, a temperature of 28 to 30 ° C., and a processing time of 10 to 50 seconds are preferable. In addition, the surface state inspection is preferably 10 to 40 times microscope observation for the purpose of observing fine DFR air voids.
以下、本発明の実施例および比較例に基づいて詳細に説明するが、本発明はこれに限定されるものではない。
(実施例1)
DFR品質が影響する断線系(断線、欠け)不良率が34%の製品形成の際に使用したDFRを基材の前処理、DFRのラミネート、露光、現像工程を経た後にDFRの状態を検査した結果、50×50mmの範囲に30〜50μmのDFR欠如を32個観察した。
Hereinafter, although it demonstrates in detail based on the Example and comparative example of this invention, this invention is not limited to this.
(Example 1)
DFR used for forming products with a disconnection system (disconnection, chipping) defect rate of 34% influenced by DFR quality was inspected for DFR after passing through substrate pretreatment, DFR lamination, exposure, and development processes. As a result, 32 DFR deficiencies of 30-50 μm were observed in the 50 × 50 mm range.
前記DFRの保護フィルムであるポリエチレンフィルムを観察した結果、50×50mmの範囲に30〜50μmのゲル(フィッシュアイ)を27個観察し、ポリエチレンフィルムの品質異常が判明した。
(比較例1)
DFRの保護フィルムであるポリエチレンフィルム品質以外は実施例1と同様にした。
As a result of observing the polyethylene film which is a protective film of the DFR, 27 gels (fish eyes) of 30 to 50 μm were observed in a range of 50 × 50 mm, and the quality abnormality of the polyethylene film was found.
(Comparative Example 1)
The same procedure as in Example 1 was performed except for the quality of the polyethylene film, which is a DFR protective film.
得られたDFRの状態を検査した結果、50×50mmの範囲にDFR欠如は観察されなかった。 As a result of examining the state of the obtained DFR, no lack of DFR was observed in the range of 50 × 50 mm.
前記DFRを使用して製品を形成した結果DFR品質が影響する断線系(断線、欠け)不良率が1%未満と改善された。 As a result of forming a product using the DFR, the disconnection system (disconnection, chipping) defect rate influenced by the DFR quality was improved to less than 1%.
以上の結果より特に薄厚タイプのDFRにおいて保護フィルムであるポリエチレンフィルム品質が微細なエアーボイドに寄与する事が明確になりDFR製造における品質基準を明確にしDFR品質を向上することができた。 From the above results, it was clear that the quality of the polyethylene film as a protective film contributes to fine air voids particularly in the thin type DFR, and the quality standards in DFR production were clarified and the DFR quality was improved.
1 第1のフィルム
2 感光性樹脂
3 第2のフィルム
4 ゲル(フィッシュアイ)
10 感光性樹脂層(DFR)
5 銅箔
6 基材
20 フレキシブル銅張板
7 エアーボイド
8 針穴状欠損
DESCRIPTION OF
10 Photosensitive resin layer (DFR)
5 Copper foil 6
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JP2004087005A JP2005274882A (en) | 2004-03-24 | 2004-03-24 | Inspection method for photosensitive coating layer |
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JP2004087005A JP2005274882A (en) | 2004-03-24 | 2004-03-24 | Inspection method for photosensitive coating layer |
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JP2005274882A true JP2005274882A (en) | 2005-10-06 |
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