JP2005266684A - Method for manufacturing electrooptical device, electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing electrooptical devices in which a plurality of electrooptical devices can precisely and easily be cut together out of a pair of large plates so that mounting terminals are exposed and the yield can be improved when the plurality of electrooptical devices are manufactured by a large-place laminating system, and provide an electrooptical device and electronic equipment. <P>SOLUTION: The manufacturing method for electrooptical devices in which a plurality of element substrates having laminated mounting terminals 62 and a plurality of substrates facing the element substrates are parted from a couple of laminated substrates includes a stage of forming on one surface of a 2nd substrate 200 a plurality of nearly linear 3rd grooves 200x2 facing a 1st groove 100x formed on an element substrate and a stage of forming a plurality of nearly linear 4th grooves 2090x1 nearby the 3rd grooves 200x2 on one surface of the 2nd substrate 200, and is characterized in that the 4th grooves 200x1 are formed deeper than the 3rd groove 200x2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device, and an electronic device, and more particularly to a method for manufacturing an electro-optical device manufactured by a large plate assembly method, an electro-optical device, and an electronic device.

  2. Description of the Related Art As is well known, an electro-optical device, for example, a liquid crystal display device is configured by enclosing liquid crystal between two substrates made of a glass substrate, a quartz substrate, etc., and a thin film transistor (Thin Film Transistor) is provided on one substrate. (Hereinafter, referred to as TFT) switching elements and pixel electrodes are arranged in a matrix, a common electrode is arranged on the other substrate, and the optical characteristics of the liquid crystal layer sealed between the two substrates are determined according to the image signal. By changing it, it is possible to display an image.

  In addition, the TFT substrate on which the TFT is disposed and the counter substrate disposed to face the TFT substrate are manufactured separately. A plurality of TFT substrates and counter substrates are configured, for example, by laminating a semiconductor thin film, an insulating thin film or a conductive thin film having a predetermined pattern on a large glass or quartz substrate. Each layer is formed by repeating a film forming process and a photolithography process for various films.

  At this time, a mounting terminal to which one end of an FPC (Flexible Printed Circuits) that connects the assembled liquid crystal display device and an electronic device such as a projector is connected is mounted near the surface edge of the TFT substrate.

  The TFT substrate and the counter substrate thus formed are bonded with high accuracy in the panel assembly process. In this panel assembling process, first, an alignment film for aligning liquid crystal molecules along the substrate surface is formed on the surfaces of the TFT substrate and the counter substrate manufactured in each substrate manufacturing process, which are in contact with the liquid crystal layer. . This alignment film is formed, for example, by printing polyimide with a thickness of about several tens of nanometers.

  Thereafter, baking is performed, and a rubbing process is performed to determine the alignment of liquid crystal molecules when no voltage is applied. Next, in the case of a liquid crystal dropping method, a plurality of sealing materials that are formed on a large plate, for example, a peripheral edge on a TFT substrate, are each formed with a specified height drawing or printing in a frame shape on the periphery of the TFT substrate. A prescribed amount of liquid crystal is dropped onto a liquid crystal filling region on the substrate inside the material.

  After that, in the case of the large plate assembly method, a large plate having a plurality of TFT substrates is vacuum-sealed through a sealing material so that the TFT substrate and the counter substrate are opposed to a large plate having a plurality of counter substrates. At the bottom, they are bonded and cured by pressure bonding while aligning them. After that, the liquid crystal display device is manufactured by dividing the TFT substrate and the counter substrate that are arranged to face each other from the pair of large plates that are bonded together.

  Here, when a pair of bonded TFT substrates and a counter substrate are divided into a pair from a pair of bonded large plates, first, a plurality of large substrates and a plurality of counter substrates configured with a plurality of TFT substrates are configured. A groove is formed at a desired cutting position of the large plate by, for example, scribing.

  Next, the position of the substrate facing the groove, more specifically, when the groove is formed on the large plate including a plurality of TFT substrates, the position of the large plate including the plurality of counter substrates facing the groove, or facing the groove. When a groove is formed on a large plate composed of a plurality of substrates, the thickness of the TFT substrate and the counter substrate is formed along the groove by pressing the position of the large plate composed of a plurality of TFT substrates opposed to the groove. A technique for generating a crack penetrating the substrate in the vertical direction and dividing the crack using the crack is well known.

Further, in order to prevent the driver circuit formed on the TFT substrate from being damaged by an excessive force used for the division at the time of the division, the counter substrate has a plurality of grooves formed on the large plate including a plurality of TFT substrates. A technology has also been proposed in which a groove is formed deeper than the groove formed in the large plate, specifically, approximately equal to the thickness of the TFT substrate, and a crack is generated in the TFT substrate with a slight force. (For example, refer to Patent Document 1).
JP 2001-83491 A

  By the way, when the paired TFT substrate and the counter substrate are separated from each other from the paired large plates, one end of the FPC that connects the assembled liquid crystal display device and an electronic device such as a projector is used. The mounting terminals to be connected are divided so as to be exposed.

  At this time, in order to expose the mounting terminals from the bonded TFT substrate, it is necessary to divide the counter substrate by a width that exposes the mounting terminals. However, since the width that exposes the mounting terminals is narrow, it is necessary to divide with high accuracy. There was a problem that was difficult.

  Also, from the pair of large plates that are bonded together, the pair of bonded TFT substrates and the counter substrate are divided into sets, and then the mounting terminals are exposed, so that the counter substrate is individually divided by a width that exposes the mounting terminals. Inefficient and low productivity.

  The present invention has been made paying attention to the above-mentioned problems, and its purpose is to mount a plurality of electro-optical devices by a large plate bonding method, easily and collectively from a pair of large plates. An electro-optical device can be cut so that a terminal is exposed, and a method for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus that can improve yield are provided.

  In order to achieve the above object, an electro-optical device manufacturing method according to the present invention includes a first substrate having a plurality of element substrates each having a mounting terminal portion, and a plurality of counter substrates facing the element substrate. A method of manufacturing a multi-piece electro-optical device, in which a plurality of electro-optical devices composed of a pair of the element substrate and the counter substrate are bonded to each other after the second substrate is bonded. In the present invention, a substantially linear first groove and a substantially linear second groove substantially orthogonal to the first groove are formed at the boundary of the plurality of element substrates on one surface of the first substrate. A step of forming a plurality of grooves, a substantially linear third groove facing the first groove formed on the first substrate on one surface of the second substrate, and the third groove; A substantially straight fourth groove located in the vicinity of the third groove, the third groove and the fourth groove, Includes a step of the fifth to plural form and grooves facing the second groove, the said fourth groove, characterized in that it is deeper than the third trench.

  According to the method of manufacturing the electro-optical device of the present invention, the fourth groove is formed deeper than the third groove located in the vicinity thereof, so that the pair of bonded substrates separated from the pair of bonded substrates. Since the mounting terminal portions formed on the element substrate can be accurately and easily exposed collectively from the element substrate and the counter substrate, the yield can be improved.

  The electro-optical device manufacturing method according to the present invention includes a first substrate having a plurality of element substrates each having a mounting terminal portion, and a second substrate having a plurality of counter substrates facing the element substrate. In the manufacturing method of a multi-piece electro-optical device, after the bonding, the plurality of electro-optical devices constituted by the pair of the element substrate and the counter substrate which are bonded are divided into a plurality of pieces. Forming a plurality of substantially linear first grooves and a plurality of substantially linear second grooves substantially orthogonal to the first grooves at boundaries of the plurality of element substrates on one side of Generating a crack penetrating the first substrate along the first groove and the second groove on the first substrate; and forming the first substrate on one surface of the second substrate. A substantially linear third groove facing the first groove formed on the substrate, and the third groove A substantially linear fourth groove located in the vicinity of the first groove, a fifth groove that is substantially orthogonal to the third groove and the fourth groove, and that faces the second groove formed on the first substrate. A step of forming a plurality of grooves, and a crack penetrating the second substrate along the third groove, the fourth groove, and the fifth groove is generated in the second substrate. And a plurality of electro-optical devices including a pair of the element substrate and the counter substrate bonded to each other from the pair of the first substrate and the second substrate bonded to each other. And the step of generating a crack along the fourth groove is performed before the step of generating a crack along the third groove. .

  According to the method for manufacturing an electro-optical device of the present invention, the cracks generated along the fourth groove are pasted together by being generated before the cracks generated along the third groove located in the vicinity. Yield is improved because the mounting terminal portions formed on the element substrate can be accurately and easily exposed collectively from the pair of bonded element substrates and the counter substrate separated from the pair of substrates. It has the effect that it can be made.

  In addition, since the fourth groove is formed deeper than the adjacent third groove, the order in which the cracks are generated is not mistaken when the cracks are generated along the fourth groove and the third groove. It has the effect.

  The first to fifth grooves are formed by scribing or dicing.

  According to the method for manufacturing an electro-optical device of the present invention, the first to fifth grooves can be formed with high accuracy by being formed by scribing or dicing, so that the yield can be improved. Has an effect.

  Furthermore, the fourth groove is formed to have a certain width with respect to the third groove.

  According to the electro-optical device manufacturing method of the present invention, the fourth groove is formed with a certain width with respect to the third groove, so that the mounting terminal portion formed on the element substrate is formed. Since it can be surely exposed in a lump, the yield can be improved.

  Further, the mounting terminal portion of the element substrate is bonded together by generating a crack penetrating the second substrate along the third groove, the fourth groove, and the fifth groove. It is exposed from the element substrate and the counter substrate facing the element substrate.

  According to the method for manufacturing an electro-optical device of the present invention, the cracks penetrating the counter substrate along the third groove, the fourth groove, and the fifth groove are generated, so that the mounting for the element substrate is formed. Since the terminal portions can be easily and accurately exposed at a time, the yield can be improved.

  Furthermore, the crack of the first substrate is generated by applying a pressure to the position of the second substrate facing the first groove and the second groove. In addition, the crack of the second substrate is generated by applying a pressure to the position of the first substrate facing the third groove, the fourth groove, and the fifth groove. .

  According to the method for manufacturing an electro-optical device of the present invention, when the pair of bonded element substrates and the counter substrate are separated from the pair of bonded substrates, the substrate at a position facing the groove formed in the substrate is printed. As a result, it is possible to generate cracks with high accuracy, so that the yield can be improved.

  The electro-optical device according to the present invention is manufactured using the manufacturing method according to any one of claims 1 to 7, and one end of the counter substrate facing the element substrate is the other end. The chamfered portion formed at one end portion of the counter substrate facing the element substrate is constituted by a part of the fourth groove, and is chamfered deeper than the portion. The chamfered portion formed at the end of the third portion is formed of a part of the third groove.

  According to the electro-optical device of the present invention, there is an effect that it is possible to provide an electro-optical device manufactured so that the mounting terminal portion of the element substrate can be easily and accurately exposed from the pair of substrates.

  An electronic apparatus according to the present invention uses the electro-optical device according to claims 8 to 10.

  According to the electronic apparatus of the present invention, it is possible to provide an electronic apparatus using the electro-optical device manufactured so that the mounting terminal portion of the element substrate can be easily and accurately exposed from the pair of substrates.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the electro-optical device will be described using a liquid crystal display device as an example. Therefore, of the pair of substrates used in the liquid crystal display device, one substrate is a TFT substrate which is an element substrate, and the other substrate is a substrate facing the TFT substrate (hereinafter referred to as a counter substrate). I will explain. Further, a liquid crystal display device manufactured by a liquid crystal dropping method will be described as an example.

First, the configuration of a liquid crystal display device according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a plan view of a TFT substrate of a liquid crystal display device as viewed from the counter substrate side together with the components formed thereon, and FIG. 2 is an assembly process for sealing the liquid crystal by bonding the TFT substrate and the counter substrate. It is the cross-sectional view which cut | disconnected the liquid crystal display device after completion | finish along the II-II line | wire in FIG.

  As shown in the figure, the liquid crystal display device 500 is configured by enclosing a liquid crystal 50 between a TFT substrate 10 and a counter substrate 20 provided facing the TFT substrate 10. Pixel electrodes 9a and the like constituting pixels are arranged in a matrix on the TFT substrate 10.

  A light shielding film (BM) 42 is provided on the counter substrate 20 as a frame for partitioning the display area. The light shielding film 42 is made of, for example, a light shielding material.

  A sealing material 41 that encloses liquid crystal is formed between the TFT substrate 10 and the counter substrate 20 in a region outside the light shielding film 42. The sealing material 41 is disposed, for example, so as to substantially match the contour shape of the counter substrate 20, and fixes the TFT substrate 10 and the counter substrate 20 to each other.

  One end of the data line driving circuit 61 and an FPC (none of which is shown) for connecting the assembled liquid crystal display device 500 and an electronic device such as a projector is connected to the region outside the sealing material 41 of the TFT substrate 10. A mounting terminal portion 62 is provided along one side of the TFT substrate 10, and a scanning line driving circuit 63 is provided along two sides adjacent to the one side.

  As shown in FIG. 2, the TFT substrate 10 is formed on one end portion of the TFT substrate 10 where the data line driving circuit 61 and the mounting terminal portion 62 are provided and on the other end portion facing the one end portion. A chamfered portion 10a constituted by a part of a first groove 100x (see FIG. 5) described later is formed.

  At one end of the counter substrate 20 near the data line driving circuit 61 and the mounting terminal portion 62, a chamfered portion 20b composed of a part of a fourth groove 200x1 (see FIG. 6) described later is formed. . In addition, a chamfered portion 20a constituted by a part of a third groove 200x2 (see FIG. 6) described later is formed at the other end facing the one end of the counter substrate 20.

  The chamfered portion 20b described above is chamfered deeper than the chamfered portion 20a and the chamfered portion 10a.

  Next, a manufacturing method of the liquid crystal display device 500 configured as described above will be described with reference to FIGS. In the liquid crystal display device according to the present embodiment, one large plate, which is a first substrate on which a plurality of TFT substrates 10 are configured, and a second substrate on which the same number of counter substrates 20 as the TFT substrates are configured. After laminating the other large plate as a substrate so as to face each other, a plurality of liquid crystal display devices 500 are manufactured by dividing the oppositely arranged TFT substrate 10 and the opposite substrate 20 by a so-called large plate assembly method. Manufactured.

  3 and 4 are process diagrams showing a method of manufacturing a liquid crystal display device according to an embodiment of the present invention. FIG. 5 is a diagram illustrating a method for forming a cutting groove on one large plate on which a plurality of TFT substrates are formed. FIG. 6 is a plan view showing that a cutting groove is formed on the other large plate on which a plurality of counter substrates are formed.

  As shown in FIG. 3A, first, a plurality of TFT substrates 10 each having a component such as a pixel electrode 9a and a mounting terminal 62 (see FIG. 2) formed on the surface are formed by a known film forming process. The counter substrate 20 is formed so that the surface of the one large plate 100 and the other large plate 200 on which components such as pixel electrodes (not shown) are formed by a known film formation process face each other. Are pasted together through a sealing material 41 arranged so as to substantially match the contour shape of.

  As shown in FIGS. 5 and 6, the large plates 100 and 200 have, for example, a circular shape, and are composed of transmissive or reflective quartz, glass, silicon wafer, or the like. Moreover, the plate | board thickness of the large boards 100 and 200 is formed so that it may be 2.5 mm or less, for example.

  Next, as shown in FIG. 3B and FIG. 5, the surface opposite to the surface of the large plate 100, which is one surface, of the pair of large plates 100 and 200 (hereinafter referred to as the back surface). 5), a plurality of first grooves 100x substantially linear in the x direction in FIG. 5 are formed by known scribe using a scribe cutter 70 made of cemented carbide, for example.

  At this time, a substantially linear second groove 100y substantially perpendicular to the first groove 100x in the y direction in FIG. 5 is formed at the boundary of the TFT element of the TFT substrate 10 on the back surface of the large plate 100 with a known scribe. To form a plurality.

  Thereafter, dust (hereinafter referred to as cullet) generated when forming the first groove 100x and the second groove 100y and adhering to the back surface of the large plate 100 is cleaned by, for example, CO2.

  Next, as shown in FIG. 3C, the large plate on the surface opposite to the surface of the large plate 200, which is one of the paired large plates 100 and 200 (hereinafter, referred to as the back surface). A substantially linear position 200 a facing the first groove 100 x formed in 100 is applied by, for example, the blade 80. At this time, a substantially linear position facing the second groove 100y formed on the large plate 100 of the large plate 200 is also applied by the blade 80, for example.

  As a result, a vertical crack 100k that progresses through the large plate 100 in the thickness direction of the large plate 100 along the first groove 100x and the second groove 100y of the large plate 100 is generated.

  Next, as shown in FIG. 3D and FIG. 6, of the pair of large plates 100, 200, a substantially linear position 200 a facing the first groove 100 x on the back surface of the large plate 200, In FIG. 6, a plurality of third grooves 200 x 2 that are substantially linear in the x direction are formed by known scribe using, for example, a scribe cutter 70.

  At this time, the third groove 200x2 is positioned at a position near the third groove 200x2 on the back surface of the large plate 200, for example, at a substantially linear position 200b apart from the third groove 200x2 by a certain width (2 mm or less). Further, a plurality of substantially straight fourth grooves 200x1 in the x direction in FIG. 6 are formed by known scribe. For example, when the third groove depth is 1, the fourth groove depth is provided in the range of 1.1 to 1.4. Note that either the third groove 200x2 or the fourth groove 200x1 may be formed first.

  Further, the back surface of the large plate 200 has a substantially linear first shape that is substantially orthogonal to the third groove 200x2 and the fourth groove 200x1 and faces the second groove 100y (see FIG. 5) formed in the large plate 100. A plurality of five grooves 200y are formed by known scribes in the y direction in FIG.

  Thereafter, the cullet generated when the third groove 200x2, the fourth groove 200x1, and the fifth groove 200y are formed and adhered to the back surface of the large plate 200 is cleaned by, for example, CO2.

  Next, as shown in FIG. 4 (e), of the pair of large plates 100, 200, a substantially linear shape facing the fourth groove 200x1 formed in the large plate 200 on the back surface of the large plate 100. The position 100b is applied by the blade 80, for example. As a result, a vertical crack 200k1 is generated that proceeds along the fourth groove 200x1 of the large plate 200 in the thickness direction of the large plate 200 until it penetrates the large plate 200.

  Since the fourth groove 200x1 is formed deeper than the third groove 200x2, a vertical crack can be generated with high accuracy by a small printing pressure. Therefore, the end portion composed of the crack 200k1 near the data line driving circuit 61 and the mounting terminal portion 62 of the counter substrate 20 is formed vertically with high accuracy.

  In addition, since the third groove 200x2 is formed shallower than the fourth groove 200x1, when the crack 200k1 is formed along the fourth groove 200x1, the third groove 200x2 is inadvertently adjacent to the fourth groove 200x1. A non-vertical crack 200k2, which will be described later, does not occur along the third groove 200x2 formed in this way.

  Next, as shown in FIG. 4 (f), of the pair of large plates 100, 200, the substantially linear shape facing the third groove 200 x 2 formed in the large plate 200 on the back surface of the large plate 100. The position 100a is applied by the blade 80, for example. As a result, a vertical crack 200k2 is generated that proceeds along the third groove 200x2 of the large plate 200 in the thickness direction of the large plate 200 until it penetrates the large plate 200.

  The reason why the back surface 100a of the large plate 100 is printed after the back surface 100b is that the fourth groove 200x1 is formed deeper than the third groove 200x2, and thus is perpendicular to the third groove 200x2. In order to generate the crack 200k2, a larger force is required than to generate the vertical crack 200k1 along the fourth groove 200x1.

  Therefore, if the back surface 100a is pressed first, the fourth groove 200x1 and the third groove 200x2 are formed close to each other, so that the crack 200k1 generated along the fourth groove 200x1 is generated. This is because the vertical shape may not occur, and even if a crack occurs, the pair of TFT substrates 10 and the counter substrate 20 may not be separated from the pair of large plates 100 and 200.

  Furthermore, a substantially linear position facing the fifth groove 200y formed on the back surface of the large plate 200 of the large plate 100 is also applied by the blade 80, for example. As a result, a crack that progresses along the fifth groove 200y of the large plate 200 until it penetrates the large plate 200 in the thickness direction of the large plate 200 is generated.

  It should be noted that pressing the rear surface 100a of the large plate 100 after the rear surface 100b at a substantially linear position facing the fifth groove 200y of the large plate 100 causes the large plate 200 to be pressed in the y direction of the large plate 200. This is because if the penetrating crack is generated first, the progress of the crack 200k1 generated along the fourth groove 200x1 and the crack 200k2 generated along the third groove 200x2 stops midway. .

  Thereafter, the cullet generated when the crack is formed along the third groove 200x2, the fourth groove 200x1, and the fifth groove 200y and adhered to the back surface of the large plate 100 is cleaned by, for example, CO2.

  Finally, the liquid crystal display device 500 including the pair of TFT substrates 10 and the counter substrate 20 bonded together from the pair of large plates 100 and 200 is divided as shown in FIG. As a result, a surplus 20s having a height of 2.5 mm or less and a width of 2 mm or less is generated from the large plate 200. In this way, the liquid crystal display device 500 is manufactured.

  The mounting terminal portion 62 formed on the TFT substrate 10 is exposed from the liquid crystal display device 500 thus manufactured. In addition, the TFT substrate is disposed on one side of the TFT substrate 10 of the liquid crystal display device 500 provided with the data line driving circuit 61 and the mounting terminal portion 62 and on the back side of the other end facing the one end. The chamfered portion 10a formed from a part of the first groove 100x formed in the portion 10 is formed.

  Further, the chamfering chamfered deeper than the chamfered portion 20a formed of a part of the third groove 200x1 on the back surface side of one end portion of the counter substrate 20 near the data line driving circuit 61 and the mounting terminal portion 62. Part 20b is formed. Further, a chamfered portion 20a that is chamfered shallower than the chamfered portion 20b formed of a part of the fourth groove 200x2 is formed on the back surface side of the other end portion facing the one end portion of the counter substrate 20. .

  As described above, in the method of manufacturing a liquid crystal display device according to an embodiment of the present invention, the large board 100 is exposed in order to expose the mounting terminal portions 62 formed on the TFT substrate 10 formed in a plurality on the large board 100. In order to expose the mounting terminal portion 62, the fourth groove 200x1 that is formed in the 200 for generating the crack 200k1 that penetrates the large plate 200 is also generated to generate the crack 200k2 that penetrates the large plate 200. Therefore, it was formed deeper than the third groove 200x2.

  Further, when the crack is generated in the large plate 200 along the fourth groove 200x1 and along the third groove 200x2, the crack 200k1 along the fourth groove 200x1 is made to be more cracked than the crack 200k2 along the third groove 200x2. It was generated first.

  As a result, the vertical crack 200k1 can be generated with high accuracy by a small printing pressure along the fourth groove 200x1. In addition, since the third groove 200x2 is formed shallower than the fourth groove 200x1, when the crack 200k1 is generated along the fourth groove 200x1 before the crack 200k2, the fourth groove 200x2 is inadvertently formed. The crack 200k2 does not occur along the third groove 200x2 adjacent to the groove 200x1.

  Further, since the crack 200k2 is generated along the third groove 200x2 after the crack 200k1 is generated along the fourth groove 200x1, the vertical crack 200k2 can be generated with high accuracy. At this time, since the crack 200k1 along the fourth groove 200x1 has been generated first, when the crack 200k2 is generated along the third groove 200x2, the crack 200k1 along the fourth groove 200x1 is affected. It goes without saying that there is nothing.

  Therefore, the mounting terminal portion 62 formed on the TFT substrate 10 can be easily and collectively integrated from the pair of TFT substrates 10 and the counter substrate 20 separated from the pair of large plates 100 and 200. Therefore, the yield can be improved.

  Further, the fourth groove 200x1 is formed deeper than the adjacent third groove 200x2, so that when the cracks are generated along the fourth groove 200x1 and the third groove 200x2, the order in which the cracks are generated is determined. There is no mistake.

  In the present embodiment, the first groove 100x and the second groove 100y are formed on the large plate 100 by scribing, and the third groove 200x2, the fourth groove 200x1, and the fifth groove are formed on the large plate 200. Although the example in which the grooves are formed using the double-sided scribing method in which 200y is formed by scribing is shown, the present invention is not limited thereto, and only the first groove 100x and the second groove 100y formed in the large plate 100 are formed by dicing. Or the third groove 200x2, the fourth groove 200x1 and the fifth groove 200y formed on the large plate 200 are formed by dicing, or each groove is formed by the single-sided dicing method as in the present embodiment. The effect of can be obtained.

  Further, the first groove 100x and the second groove 100y are formed on the large plate 100 by dicing, and the third groove 200x2, the fourth groove 200x1, and the fifth groove 200y are formed on the large plate 200 by dicing. Even if the grooves are formed by using the dicing method, the same effect as in the present embodiment can be obtained.

  Furthermore, although the liquid crystal display device manufactured by the liquid crystal dropping method has been described as an example, the present invention provides a notch in the sealing material 41, injects liquid crystal from the notch, and after the injection, the notch is removed. You may apply to the liquid crystal display device manufactured by the liquid crystal injection system which closes.

  Further, the electro-optical device has been described by taking a liquid crystal display device as an example, but the present invention is not limited to this, and the electroluminescence device, in particular, an organic electroluminescence device, an inorganic electroluminescence device, etc., a plasma display device, FED (Field Emission Display) devices, SED (Surface-Conduction Electron-Emitter Display) devices, LED (Light Emitting Diode) display devices, electrophoretic display devices, devices using thin televisions such as thin cathode ray tubes or liquid crystal shutters, etc. It can be applied to various electro-optical devices.

  Further, the electro-optical device of the present invention is not limited to the illustrated examples described above, and it is needless to say that various modifications can be made without departing from the gist of the present invention. For example, the above-described liquid crystal display device has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. The present invention can also be applied to an active matrix type liquid crystal display module using active elements such as the above.

  Furthermore, examples of the electronic device in which the liquid crystal display device according to the present invention is used include, for example, a mobile phone, a portable information device called PDA (Personal Digital Assistants), a portable personal computer, a personal computer, a digital still camera, and an in-vehicle monitor. , Digital video cameras, LCD TVs, viewfinder type, monitor direct-view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, POS terminals, etc. A device using a display module can be given. Therefore, it goes without saying that the present invention can also be applied to these electronic devices.

The top view which looked at the TFT substrate of the liquid crystal display device which shows one embodiment of this invention from the counter substrate side with each component formed on it. Sectional drawing cut | disconnected along the II-II line | wire in FIG. FIG. 6 is a process diagram illustrating a method for manufacturing a liquid crystal display device according to an embodiment of the present invention. FIG. 4 is a process diagram (continuation) illustrating the method for manufacturing the liquid crystal display device according to the embodiment of the present invention. FIG. 3B is a plan view of the pair of large plates showing the step as viewed from the large plate on which a plurality of TFT substrates are formed. FIG. 3D is a plan view of a pair of large plates as viewed from the large plate on which a plurality of counter substrates are configured.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... TFT substrate, 20 ... Counter substrate, 20a ... The other chamfer part, 20b ... One chamfer part, 62 ... Mounting terminal part, 100 ... One large board, 100x ... 1st groove | channel, 100y ... 2nd Groove, 100k ... crack, 200 ... other large plate, 200x1 ... fourth groove, 200x2, ... third groove, 200y ... fifth groove, 200k1, 200k2, 200k3 ... crack, 500 ... electro-optical device.

Claims (11)

After bonding a first substrate having a plurality of element substrates each having a mounting terminal portion and a second substrate having a plurality of opposing substrates facing the element substrate, a pair of the bonded substrates In a manufacturing method of a multi-piece electro-optical device that divides a plurality of electro-optical devices composed of an element substrate and the counter substrate,
A plurality of substantially linear first grooves and a plurality of substantially linear second grooves substantially orthogonal to the first grooves are formed at the boundaries of the plurality of element substrates on one surface of the first substrate. Forming, and
A substantially straight third groove facing the first groove formed in the first substrate on one surface of the second substrate, and a substantially straight line located in the vicinity of the third groove Forming a plurality of fifth grooves that are substantially perpendicular to the third grooves and the fourth grooves and that face the second grooves;
Have
The method of manufacturing an electro-optical device, wherein the fourth groove is formed deeper than the third groove. After bonding a first substrate having a plurality of element substrates each having a mounting terminal portion and a second substrate having a plurality of opposing substrates facing the element substrate, a pair of the bonded substrates In a manufacturing method of a multi-piece electro-optical device that divides a plurality of electro-optical devices composed of an element substrate and the counter substrate,
A plurality of substantially linear first grooves and a plurality of substantially linear second grooves substantially orthogonal to the first grooves are formed at the boundaries of the plurality of element substrates on one surface of the first substrate. A process to be performed;
Generating a crack penetrating the first substrate along the first groove and the second groove on the first substrate;
A substantially straight third groove facing the first groove formed in the first substrate on one surface of the second substrate, and a substantially straight line located in the vicinity of the third groove And a plurality of fifth grooves that are substantially orthogonal to the third grooves and the fourth grooves and that face the second grooves formed on the first substrate. A process to be performed;
Generating a crack penetrating the second substrate along the third groove, the fourth groove, and the fifth groove in the second substrate;
A step of dividing a plurality of electro-optical devices composed of the pair of the element substrates and the counter substrate from the pair of the first and second substrates bonded together;
Have
The method of manufacturing an electro-optical device, wherein the step of generating a crack along the fourth groove is performed prior to the step of generating a crack along the third groove.   The method of manufacturing an electro-optical device according to claim 1, wherein the first to fifth grooves are formed by scribing or dicing.   The method of manufacturing an electro-optical device according to claim 1, wherein the fourth groove is formed to have a certain width with respect to the third groove.   The mounting terminal portion of the element substrate has a pair of elements bonded together by generating a crack penetrating the second substrate along the third groove, the fourth groove, and the fifth groove. The method of manufacturing an electro-optical device according to claim 1, wherein the method is exposed from a substrate and a counter substrate facing the element substrate.   The crack of the first substrate is generated by applying pressure to the position of the second substrate facing the first groove and the second groove. A method for manufacturing the electro-optical device according to the item 1.   The crack of the second substrate is generated by applying a pressure to a position of the first substrate facing the third groove, the fourth groove, and the fifth groove. The method for manufacturing the electro-optical device according to any one of 1 to 5.   An electro-optical device manufactured using the manufacturing method according to claim 1.   9. The electro-optical device according to claim 8, wherein one end portion of the counter substrate facing the element substrate is chamfered deeper than the other end portion.   A chamfered portion formed at one end of the counter substrate facing the element substrate is configured by a part of the fourth groove, and a chamfered portion formed at the other end is formed by the third chamfer. The electro-optical device according to claim 9, wherein the electro-optical device includes a part of the groove.   An electronic apparatus using the electro-optical device according to claim 8.

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