JP2005260015A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005260015A5 JP2005260015A5 JP2004070051A JP2004070051A JP2005260015A5 JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5 JP 2004070051 A JP2004070051 A JP 2004070051A JP 2004070051 A JP2004070051 A JP 2004070051A JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- held
- disposed
- plasma
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 21
- 238000007664 blowing Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000005507 spraying Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005260015A JP2005260015A (ja) | 2005-09-22 |
| JP2005260015A5 true JP2005260015A5 (https=) | 2007-04-26 |
| JP4459666B2 JP4459666B2 (ja) | 2010-04-28 |
Family
ID=35085444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004070051A Expired - Fee Related JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4459666B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101218114B1 (ko) * | 2005-08-04 | 2013-01-18 | 주성엔지니어링(주) | 플라즈마 식각 장치 |
| JP2009302401A (ja) * | 2008-06-16 | 2009-12-24 | Tokyo Seimitsu Co Ltd | チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置 |
| JP4696165B2 (ja) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| KR102678588B1 (ko) | 2018-11-14 | 2024-06-27 | 램 리써치 코포레이션 | 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들 |
| US12211691B2 (en) | 2018-12-20 | 2025-01-28 | Lam Research Corporation | Dry development of resists |
| TWI910974B (zh) | 2019-06-26 | 2026-01-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| CN114200776A (zh) | 2020-01-15 | 2022-03-18 | 朗姆研究公司 | 用于光刻胶粘附和剂量减少的底层 |
| WO2022010809A1 (en) | 2020-07-07 | 2022-01-13 | Lam Research Corporation | Integrated dry processes for patterning radiation photoresist patterning |
| WO2022103764A1 (en) * | 2020-11-13 | 2022-05-19 | Lam Research Corporation | Process tool for dry removal of photoresist |
| US12577466B2 (en) | 2020-12-08 | 2026-03-17 | Lam Research Corporation | Photoresist development with organic vapor |
| KR102725782B1 (ko) | 2022-07-01 | 2024-11-05 | 램 리써치 코포레이션 | 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상 |
| WO2024196643A1 (en) | 2023-03-17 | 2024-09-26 | Lam Research Corporation | Integration of dry development and etch processes for euv patterning in a single process chamber |
| KR20250034920A (ko) | 2023-07-27 | 2025-03-11 | 램 리써치 코포레이션 | 금속-함유 포토레지스트에 대한 올-인-원 건식 현상 |
-
2004
- 2004-03-12 JP JP2004070051A patent/JP4459666B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005260015A5 (https=) | ||
| JP2010153680A5 (https=) | ||
| JP2006303309A5 (https=) | ||
| JP2005504855A5 (https=) | ||
| TW202035281A (zh) | 形成cnt-bnnt奈米複合薄層之方法 | |
| WO2004107414A3 (en) | Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith | |
| JP2010115832A5 (https=) | ||
| JP2014072383A5 (https=) | ||
| TW200637666A (en) | Substrate processing equipment | |
| JP2005089823A5 (https=) | ||
| JP2009152576A5 (ja) | 成膜装置及び成膜方法 | |
| TW200700927A (en) | Lithographic device, device manufacturing method and device manufactured thereby | |
| EP2495350A3 (en) | Microwave plasma processing device with a plasma processing gas supply member | |
| CN108885983B (zh) | 等离子处理装置及方法 | |
| WO2008067870A3 (de) | Isolationsvorrichtung mit einer evakuierbaren wärmeisolationsschichtanordnung | |
| JPWO2005037649A1 (ja) | ホローカソード型スパッタリングターゲットの包装装置及び包装方法 | |
| JP5269568B2 (ja) | 基板処理装置及び基板処理装置内部の工程空間を開閉する方法 | |
| JP5063560B2 (ja) | 基板処理装置 | |
| JP2002118098A5 (https=) | ||
| Yang et al. | A low-cost and flexible microplasma generation device to create hydrophobic/hydrophilic contrast on nonflat surfaces | |
| JP2012049349A5 (ja) | 基板処理装置及び半導体装置の製造方法 | |
| JP2002105618A (ja) | 真空処理室用表面構造 | |
| JP2005317734A5 (https=) | ||
| JP4249871B2 (ja) | 基板搬送装置 | |
| JP2002246374A5 (https=) |