JP2005260015A5 - - Google Patents

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Publication number
JP2005260015A5
JP2005260015A5 JP2004070051A JP2004070051A JP2005260015A5 JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5 JP 2004070051 A JP2004070051 A JP 2004070051A JP 2004070051 A JP2004070051 A JP 2004070051A JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5
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JP
Japan
Prior art keywords
substrate
held
disposed
plasma
gas
Prior art date
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Granted
Application number
JP2004070051A
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English (en)
Japanese (ja)
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JP2005260015A (ja
JP4459666B2 (ja
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Priority to JP2004070051A priority Critical patent/JP4459666B2/ja
Priority claimed from JP2004070051A external-priority patent/JP4459666B2/ja
Publication of JP2005260015A publication Critical patent/JP2005260015A/ja
Publication of JP2005260015A5 publication Critical patent/JP2005260015A5/ja
Application granted granted Critical
Publication of JP4459666B2 publication Critical patent/JP4459666B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004070051A 2004-03-12 2004-03-12 除去装置 Expired - Fee Related JP4459666B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004070051A JP4459666B2 (ja) 2004-03-12 2004-03-12 除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004070051A JP4459666B2 (ja) 2004-03-12 2004-03-12 除去装置

Publications (3)

Publication Number Publication Date
JP2005260015A JP2005260015A (ja) 2005-09-22
JP2005260015A5 true JP2005260015A5 (https=) 2007-04-26
JP4459666B2 JP4459666B2 (ja) 2010-04-28

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ID=35085444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004070051A Expired - Fee Related JP4459666B2 (ja) 2004-03-12 2004-03-12 除去装置

Country Status (1)

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JP (1) JP4459666B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101218114B1 (ko) * 2005-08-04 2013-01-18 주성엔지니어링(주) 플라즈마 식각 장치
JP2009302401A (ja) * 2008-06-16 2009-12-24 Tokyo Seimitsu Co Ltd チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置
JP4696165B2 (ja) * 2009-02-03 2011-06-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN113039486B (zh) 2018-11-14 2024-11-12 朗姆研究公司 可用于下一代光刻法中的硬掩模制作方法
US12211691B2 (en) 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
TWI837391B (zh) 2019-06-26 2024-04-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
SG11202108851RA (en) 2020-01-15 2021-09-29 Lam Res Corp Underlayer for photoresist adhesion and dose reduction
EP4078292A4 (en) 2020-07-07 2023-11-22 Lam Research Corporation Integrated dry processes for patterning radiation photoresist patterning
US20230107357A1 (en) * 2020-11-13 2023-04-06 Lam Research Corporation Process tool for dry removal of photoresist
JP7681106B2 (ja) 2020-12-08 2025-05-21 ラム リサーチ コーポレーション 有機蒸気によるフォトレジストの現像
KR102725782B1 (ko) 2022-07-01 2024-11-05 램 리써치 코포레이션 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상
US12474640B2 (en) 2023-03-17 2025-11-18 Lam Research Corporation Integration of dry development and etch processes for EUV patterning in a single process chamber
JP7852072B2 (ja) 2023-07-27 2026-04-27 ラム リサーチ コーポレーション 金属含有フォトレジストのためのオールインワン乾式現像

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