JP2005317734A5 - - Google Patents
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- Publication number
- JP2005317734A5 JP2005317734A5 JP2004133372A JP2004133372A JP2005317734A5 JP 2005317734 A5 JP2005317734 A5 JP 2005317734A5 JP 2004133372 A JP2004133372 A JP 2004133372A JP 2004133372 A JP2004133372 A JP 2004133372A JP 2005317734 A5 JP2005317734 A5 JP 2005317734A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling gas
- processing chamber
- boat
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004133372A JP4282539B2 (ja) | 2004-04-28 | 2004-04-28 | 基板処理装置および半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004133372A JP4282539B2 (ja) | 2004-04-28 | 2004-04-28 | 基板処理装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005317734A JP2005317734A (ja) | 2005-11-10 |
| JP2005317734A5 true JP2005317734A5 (https=) | 2007-06-14 |
| JP4282539B2 JP4282539B2 (ja) | 2009-06-24 |
Family
ID=35444844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004133372A Expired - Fee Related JP4282539B2 (ja) | 2004-04-28 | 2004-04-28 | 基板処理装置および半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4282539B2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8148271B2 (en) | 2005-08-05 | 2012-04-03 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method |
| KR100929815B1 (ko) | 2007-12-27 | 2009-12-07 | 세메스 주식회사 | 냉각 장치 및 이를 이용한 기판 냉각 방법 |
| JP5658463B2 (ja) | 2009-02-27 | 2015-01-28 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| JP6270575B2 (ja) * | 2014-03-24 | 2018-01-31 | 株式会社日立国際電気 | 反応管、基板処理装置及び半導体装置の製造方法 |
| KR102123942B1 (ko) | 2014-09-30 | 2020-06-17 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 반도체 장치의 제조 방법 및 반응관 |
| JP7275470B2 (ja) * | 2020-03-24 | 2023-05-18 | 日新イオン機器株式会社 | 基板冷却装置 |
| CN113451183B (zh) * | 2020-06-03 | 2023-03-31 | 重庆康佳光电技术研究院有限公司 | 一种晶圆盒 |
| TW202410257A (zh) * | 2022-07-04 | 2024-03-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 半導體處理設備 |
-
2004
- 2004-04-28 JP JP2004133372A patent/JP4282539B2/ja not_active Expired - Fee Related
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