JP2005243740A - Package for housing light emitting element and its manufacturing method, light emitting device and lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element that has high radiant intensity and is superior in optical characteristic such as luminance or color rendering property or the like, and to provide its manufacturing method and a light emitting device. <P>SOLUTION: The package for housing a light emitting element is provided with a ceramic substrate 1 that is provided with a projection 1b for mounting a light emitting element 5 on its upper main surface, a reflecting member 2 that is joined to the outer periphery of the upper main surface of the substrate 1 while surrounding the projection 1b, a wiring conductor 7 that is formed on the upper surface of the convex 1b and to which an electrode of the light emitting element 5 is electrically connected, and a conductor layer 9 that is formed around the projection 1b on the upper main surface of the substrate 1. In this case, the surface of the conductor layer 9 is formed of a number of curved recesses with a rough surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light emitting element housing package for housing a light emitting element, a manufacturing method thereof, and a light emitting device and a lighting device using the light emitting element housing package.

  A light emitting element housing package for housing a light emitting element 15 such as a conventional light emitting diode (LED) is shown in FIG. In FIG. 3, the light emitting element storage package has a mounting portion 11a for mounting the light emitting element 15 at the center of the upper surface, and is a light emitting element storage package formed from the mounting portion 11a to the outer surface of the base 11. A base 11 made of an insulator having a wiring conductor 17 made of a lead terminal or a metallized wiring electrically connected inside and outside, and a through-hole 12a that is bonded and fixed to the upper surface of the base 11 and whose upper opening is larger than the lower opening And a frame-like reflecting member 12 whose inner peripheral surface is a reflecting surface 12b that reflects light emitted from the light emitting element 15.

  The light emitting element 15 is mounted on the mounting portion 11a of the light emitting element storage package, the electrode 16 of the light emitting element 15 is electrically connected to the wiring conductor 17, and the light emitting element 15 is covered inside the reflecting member 12. A light emitting device is obtained by filling the transparent member 13 containing a phosphor that excites light emitted from the light emitting element 15 and converts it to a long wavelength.

  This light-emitting device can obtain white light by converting the wavelength of near-ultraviolet light or blue light emitted from the light-emitting element 15 with a plurality of phosphors such as red, green, blue, and yellow contained in the transparent member 13. it can.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramics, the wiring conductor 17 is formed on the upper surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is provided on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the reflecting surface 12b of the reflecting member 12 is coated by polishing or flattening the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. As a result, the light from the light emitting element 15 can be efficiently reflected. Then, the reflecting member 12 is formed on the upper surface of the base 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 with a bonding material such as a conductive adhesive such as solder or silver (Ag) solder or a resin adhesive. Be joined.

  The light emitting element 15 is electrically connected to the wiring conductor 17 disposed on the mounting portion 11a via the electrode 16 provided on the lower surface of the light emitting element 15. The electrode 16 of the light emitting element 15 and the wiring conductor 17 are joined together by a conductive adhesive 18 such as solder or Ag paste (resin containing Ag particles).

  The transparent member 13 is made of a transparent resin such as an epoxy resin or a silicone resin containing a phosphor, and is filled inside the reflecting member 12 so as to cover the light emitting element 15 with an injection machine such as a dispenser and thermally cured in an oven. The light having the desired wavelength spectrum can be extracted by converting the long wavelength of the light from the light emitting element 15 by the phosphor.

  This light-emitting device is used as a light-emitting device by activating the light-emitting element 15 by a current voltage supplied from an external electric circuit (not shown) to emit visible light. The applicable range is used for various indicators, optical sensors, displays, photocouplers, backlight light sources, optical print heads, and the like.

Recently, the light emitting element 15 tends to increase in output and the amount of heat generated by the light emitting element 15 tends to increase. Therefore, the substrate 11 is made of a ceramic material such as a flat aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic to efficiently dissipate heat generated from the light emitting element 15 to the outside. Even when the light emitting element 15 has a high output, an element that can prevent malfunction due to a temperature rise and can constantly keep the output of the light emitting element 15 high and stable has been used.
Japanese Patent Laid-Open No. 2003-37298

  However, in the above conventional light emitting device, since the base 11 has a flat plate shape and the light emitting element 15 is mounted and fixed on the upper surface of the flat plate, the light emitted from the side surface of the light emitting element 15 in the lateral direction or obliquely downward. With respect to the above, it is difficult to efficiently and satisfactorily radiate to the outside at a desired radiation angle by being absorbed or diffusely reflected at the junction between the reflecting member 12 and the base 11 or the surface of the base 11. For this reason, there has been a problem that the radiation intensity of the light emitted from the light emitting device cannot be kept high and stable.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and its purpose is to provide a light emitting element storage package having high radiation intensity and excellent light characteristics such as luminance and color rendering, a manufacturing method thereof, It is to provide a light emitting device.

  The light emitting element storage package of the present invention is bonded to a ceramic base having a convex part for mounting the light emitting element on the upper main surface, and to surround the convex part on the outer peripheral part of the upper main surface of the base. A reflecting member formed on the upper surface of the convex portion, a wiring conductor to which the electrode of the light emitting element is electrically connected, and a conductor layer formed around the convex portion on the upper main surface of the base body, The conductor layer is characterized in that the surface thereof is a rough surface comprising a large number of curved concave portions.

  The method for manufacturing a light emitting element storage package according to the present invention is a method for manufacturing a light emitting element storage package according to the present invention, wherein the wiring conductor and the metal layer are formed on the plurality of ceramic green sheets serving as the base. A step of printing and coating the ceramic green sheet so that the metal paste layer serving as the conductor layer is positioned in the inner layer and then firing to obtain a sintered body, and an upper main surface of the sintered body Removing the periphery of the portion to be the convex portion by blasting, exposing the conductor layer and forming the rough surface on the surface thereof, and forming the base on the upper main surface of the base And a step of bonding the reflecting member.

  The light emitting device of the present invention includes the light emitting element storage package of the present invention, the light emitting element mounted on the convex portion and electrically connected to the wiring conductor, and a transparent member covering the light emitting element. It is characterized by having.

  The illuminating device of the present invention is characterized in that a plurality of the light emitting devices of the present invention are installed in a predetermined arrangement.

  According to the light emitting element storage package of the present invention, the ceramic base having a convex part for mounting the light emitting element on the upper main surface and the outer peripheral part of the upper main surface of the base are joined so as to surround the convex part. A reflective member, a wiring conductor formed on the upper surface of the convex portion, to which the electrode of the light emitting element is electrically connected, and a conductor layer formed around the convex portion on the upper main surface of the substrate. In addition, since the conductor layer is a rough surface composed of a large number of curved concave portions, light that is emitted laterally or obliquely downward from the side surface of the light emitting element is reliably reflected by the reflecting member. It is possible to efficiently radiate the outside efficiently at a desired radiation angle.

  In addition, since the surface of the conductor layer is a rough surface composed of a large number of curved concave portions, light is emitted from the light emitting element at a portion of the conductive layer exposed between the convex portion of the upper main surface of the substrate and the reflecting member. Can be reflected with high efficiency and can be scattered well, effectively preventing unevenness in the light emitted from the light-emitting element storage package, and radiating with uniform intensity distribution Can do. Furthermore, when a phosphor that converts the wavelength of light of the light emitting element is contained inside the reflecting member, the light emitted from the light emitting element is scattered by the conductor layer, and the phosphor can be uniformly irradiated, Variations in wavelength conversion efficiency can be reduced, and color unevenness can be effectively prevented.

  Further, a conductor layer, which is a rough surface composed of a large number of curved concave portions, is excellent in both light reflection efficiency and light scattering property, unlike a rough surface roughened by a method such as etching. That is, a rough surface roughened by a method such as etching has an acute end at the recess, and light is likely to be attenuated by repeated reflection in the recess, and the light reflection efficiency is likely to decrease. By using a rough surface consisting of a large number of curved concave portions, it is possible to effectively prevent light from being repeatedly reflected in the concave portions, and light entering the concave portions can be reflected well outside the concave portions, resulting in light loss. Can be reduced.

  In addition, in the portion of the conductor layer located between the base and the reflecting member, the adhesion between the brazing material and the conductor layer can be further improved by the rough surface of the conductor layer, and the joining of the reflecting member and the base can be improved. Therefore, it is possible to achieve extremely high airtight sealing performance.

  Therefore, the light emitting element storage package can maintain a high radiation intensity of light emitted from the light emitting device, have high radiation intensity, and excellent light characteristics such as luminance and color rendering.

  The method for manufacturing a light emitting element storage package according to the present invention is a method for manufacturing the light emitting element storage package according to the present invention, wherein a plurality of ceramic green sheets serving as a substrate are printed with a metal paste serving as a wiring conductor and a conductor layer. A step of laminating the ceramic green sheet so that the metal paste layer serving as the conductor layer is located in the inner layer, and firing to obtain a sintered body, and a portion to be a convex portion of the upper main surface of the sintered body The method includes a step of producing a substrate by removing the periphery by blasting to expose the conductor layer and forming a rough surface on the surface, and a step of bonding a reflecting member to the upper main surface of the substrate. Therefore, the convex portion of the upper main surface of the substrate and the conductor layer having a rough surface composed of a large number of curved concave portions can be simultaneously and efficiently formed, and the manufacturing process can be simplified. That.

  Also, the height of the convex portion on the upper main surface of the substrate and the roughness of the surface of the conductor layer can be formed with high accuracy and accuracy, and the position of the light emitting element mounted on the substrate can be kept constant. Can do. As a result, it is possible to satisfactorily maintain the desired radiation angle of the light reflected by the reflecting member, and it is possible to manufacture a light emitting element storage package that can obtain extremely excellent radiation intensity.

  As a result of the above, it is possible to manufacture a light-emitting element storage package that keeps the radiation intensity of light emitted from the light-emitting device high and stable, has high radiation intensity, and has excellent light characteristics such as luminance and color rendering, and is suitable for mass production. This is a method for manufacturing a suitable light emitting element storage package.

  A light-emitting device of the present invention includes the light-emitting element storage package of the present invention, a light-emitting element that is mounted on a convex portion and is electrically connected to a wiring conductor, and a transparent member that covers the light-emitting element. Accordingly, the light emitting device using the light emitting element storage package of the present invention has high radiation intensity and excellent light characteristics such as luminance and color rendering.

  Since the illuminating device of the present invention uses a plurality of light emitting devices of the present invention so as to have a predetermined arrangement, and utilizes light emission by recombination of electrons of a light emitting element made of semiconductor, Thus, it is possible to provide a small-sized lighting device that can have lower power consumption and longer life than the lighting device using the above.

  The light emitting element storage package and the light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a substrate, 2 is a reflection member, 3 is a transparent member, 7 is a wiring conductor, and 9 is a conductor layer. The substrate 1, the reflection member 2, the wiring conductor 7 and the conductor layer 9 are mainly used for housing light-emitting elements. A package is configured, and the light emitting element 5 is accommodated in the light emitting element accommodating package, and the light emitting element 5 is sealed with the transparent member 3 to constitute a light emitting device.

  The light emitting element storage package of the present invention surrounds the convex portion 1b around the outer peripheral portion of the upper main surface of the substrate 1 and the ceramic base 1 having the convex portion 1b for mounting the light emitting element 5 on the upper main surface. Formed on the top surface of the convex portion 1b, the wiring conductor 7 to which the electrode of the light emitting element 5 is electrically connected, and the convex portion 1b on the upper main surface of the substrate 1 The conductor layer 9 has a rough surface composed of a large number of curved concave portions.

  The light-emitting device of the present invention includes a light-emitting element storage package having the above structure, a light-emitting element 5 mounted on the convex portion 1 b and electrically connected to the wiring conductor 7, and a transparent member 3 covering the light-emitting element 5. It is equipped with.

  Thereby, the light emitted from the side surface of the light emitting element 5 in the lateral direction or obliquely downward can be favorably reflected on the reflecting surface 2b of the reflecting member 2, and reflected by the reflecting member 2 at a desired radiation angle and externally reflected. Can be emitted well. As a result, the radiation intensity of the light emitted from the light emitting device can be kept high and stable.

  The wiring conductor 7 formed on the upper surface of the convex portion 1 b functions as the wiring conductor 7 connected to the electrode 6 of the light emitting element 5. In addition, the conductor layer 9 formed on the upper main surface of the base body 1 excluding the convex portion 1b functions as a conductor layer for bonding to the reflective member 2, and the base body 1 and the reflective member 2 are connected to, for example, Ag solder, Ag-Cu. It can be airtightly bonded via a brazing material such as brazing, gold (Au) -tin (Sn) solder.

  In addition, when there is a gap between the convex portion 1 b and the reflecting member 2, the portion exposed between the convex portion 1 b and the reflecting member 2 of the conductor layer 9 is light that favorably reflects light from the light emitting element 5. Functions as a reflective layer. That is, the light emitted from the light emitting element 5 by the conductor layer 9 is not absorbed by the surface of the substrate 1. Therefore, the light emitted from the light emitting element 5 can be used to the maximum, and an extremely excellent radiation intensity can be obtained.

  Moreover, since the convex part 1b is formed so that the mounting part 1a protrudes, since the mounting part 1a and the lower end of the reflecting member 2 are reliably insulated, the lower end of the reflecting member 2 is more closely mounted in the mounting part 1a in plan view. Thus, the light emitted from the light emitting element 5 can be more favorably reflected by the reflecting surface of the reflecting member 2.

  The substrate 1 in the present invention is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, or resin such as epoxy resin. The base body 1 has a mounting portion 1a for mounting the light emitting element 5 on a convex portion 1b protruding from the upper main surface.

  The convex portion 1 b may be integrated with the remaining portion of the base body 1. In this case, it can be formed by a known ceramic green sheet laminating method, cutting, mold forming, or the like.

  Moreover, the convex part 1b may join the rectangular parallelepiped convex part 1b to the upper surface of the remaining part of the base | substrate 1 by brazing or an adhesive agent. As such a convex part 1b, ceramics, resin, glass, an inorganic crystal, a metal, etc. are mentioned.

  On the mounting portion 1a, a wiring conductor 7 is formed that mounts and fixes the light emitting element 5 on the base 1 and is electrically connected to the light emitting element 5. The wiring conductor 7 is led out to the outer surface of the light emitting device through an inner conductor (not shown) formed inside the base body 1, and the lead-out portion of the outer surface of the light emitting device is connected to the external electric circuit board. As a result, the light emitting element 5 and the external electric circuit are electrically connected.

  When the substrate 1 is made of ceramic, the wiring conductor 7 is formed by firing a metal paste made of W, Mo—Mn, Cu, Ag, etc. on the upper surface of the wiring conductor 7 at a high temperature. When the substrate 1 is made of resin, lead terminals made of Cu, Fe—Ni alloy, etc. are molded and fixed inside the substrate 1.

  The light emitting element 5 is connected to an electrode 6 provided on the lower surface of the light emitting element 5 via a conductive adhesive 8 such as Ag paste or Au—Sn solder.

  When the substrate 1 is made of ceramic, the conductor layer 9 is formed by firing a metal paste made of W, Mo—Mn, Cu, Ag, or the like on the upper surface of the wiring conductor 7 at a high temperature. Moreover, when the base | substrate 1 consists of resin, it forms by the plating method etc.

  The surface of the conductor layer 9 is a rough surface composed of a large number of curved concave portions. Thereby, in the part exposed between the convex part 1b of the upper side main surface of the base | substrate 1 and the reflection member 2 among the conductor layers 9, the light emitted from the light emitting element 5 can be reflected with high efficiency, and it is favorable. The light emitted from the light-emitting element storage package can be effectively prevented from being uneven, and can be emitted with a uniform intensity distribution. Further, when a phosphor that converts the wavelength of the light of the light emitting element 5 is contained inside the reflecting member 2, the light emitted from the light emitting element 5 is scattered by the conductor layer 9 to uniformly irradiate the phosphor. Therefore, variation in wavelength conversion efficiency can be reduced and color unevenness can be effectively prevented.

  Furthermore, unlike the rough surface roughened by a method such as etching, the conductor layer 9 which is a rough surface including a large number of curved concave portions is excellent in both light reflection efficiency and light scattering property. That is, the rough surface roughened by a method such as etching has an acute corner at the tip of the recess, and light is likely to be attenuated by repeated reflection in the recess, and the light reflection efficiency is likely to decrease. By making 9 a rough surface composed of a large number of curved concave portions, it is possible to effectively prevent light from being repeatedly reflected in the concave portions, and the light entering the concave portions can be reflected well outside the concave portions. Loss can be reduced.

  Moreover, in the part located between the base | substrate 1 and the reflection member 2 among the conductor layers 9, the adhesiveness of a brazing material and the conductor layer 9 can be improved more with the rough surface of the conductor layer 9, and a reflection member 2 and the substrate 1 can be bonded to each other with a very high bondability and an excellent hermetic sealing property.

  The curved concave portion on the surface of the conductor layer 9 preferably has a diameter of 3 to 30 μm in plan view. Thereby, the light from the light emitting element 5 can be scattered favorably, and the adhesion of the brazing material that joins the reflecting member 2 and the conductor layer 9 can be further improved.

  Moreover, it is preferable that the curved concave portion on the surface of the conductor layer 9 has a depth of 1.5 to 15 μm. Thereby, it is possible to effectively prevent the light from the light emitting element 5 from being repeatedly absorbed and attenuated in the concave portion, and to improve the light reflection efficiency.

  The conductor layer 9 having a curved concave portion on its surface can be formed by a blasting method in which particles such as ceramics are applied to a desired portion of the substrate 1 and polished. The diameter and depth of the concave portion in plan view can be made desirable by appropriately adjusting the particle size of the particles applied to the surface.

  In addition, the wiring conductor 7 and the conductor layer 9 are good to deposit the metal which is excellent in corrosion resistance, such as Ni and Au by the thickness of about 1-20 micrometers on the exposed surface. 9 can be effectively prevented, and the connection between the light emitting element 5 and the wiring conductor 7 can be strengthened, and the light emitted from the reflecting member 2 can be more favorably reflected by the conductor layer 9. Become. Therefore, on the exposed surfaces of the wiring conductor 7 and the conductor layer 9, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially formed by an electrolytic plating method or an electroless plating method. More preferably it is deposited.

  In addition, the reflecting member 2 is attached to the upper main surface of the substrate 1 through a conductor layer 9 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. Preferably, the base 1 and the reflecting member 2 are bonded to each other through a brazing material such as Ag brazing, Ag-Cu brazing, Au-Sn solder, etc. Thus, the light-emitting element storage package having excellent airtight reliability can be obtained.

  The reflecting member 2 is made of a metal such as Al or Fe—Ni—Co alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is formed by a molding technique such as cutting, die molding, or extrusion molding. The reflection member 2 has a through hole 2a formed at the center. Preferably, the inner peripheral surface of the through hole 2a is a reflecting surface 2b that efficiently reflects light emitted from the light emitting element 5 or the phosphor.

  The reflecting surface 2b is formed by performing a cutting process, a mold forming process, a polishing process, or the like on the reflecting member 2 to obtain a smooth surface having a high light reflection efficiency. Alternatively, a highly reflective metal thin film such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu is formed on the inner peripheral surface of the through hole 2a by, for example, plating or vapor deposition. By doing so, the reflective surface 2b may be formed. When the reflecting surface 2b is made of a metal that is easily discolored by oxidation such as Ag or Cu, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 2b improves.

  Further, the arithmetic average roughness Ra on the surface of the reflecting surface 2b is preferably 0.004 to 4 μm, whereby the reflecting surface 2b can favorably reflect the light of the light emitting element 5 or the phosphor. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 5 and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  In addition, the reflecting surface 2b has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, and a curved slope that spreads outward as it goes upward Examples of the shape include a surface and a rectangular surface.

  Thus, in the light emitting element storage package of the present invention, the light emitting element 5 is mounted on the mounting portion 1 a and is electrically connected to the wiring conductor 7 via the conductive adhesive 8, and the light emitting element 5 is covered with the transparent member 3. Thus, a light emitting device is obtained.

  The transparent member 3 of the present invention is made of a transparent resin such as an epoxy resin or a silicone resin. The transparent member 3 is filled inside the reflecting member 2 so as to cover the light emitting element 5 with an injection machine such as a dispenser, and is thermally cured in an oven or the like. The transparent member 3 may contain a phosphor that can convert the wavelength of light from the light emitting element 5.

  Further, the upper surface of the transparent member 3 is preferably convex upward as shown in FIG. Thereby, the path length in which the light emitted from the light emitting element 5 in various directions passes through the transparent member 3 can be approximated, and the occurrence of uneven radiation intensity can be effectively suppressed.

  As described above, it is possible to maintain a high radiant intensity of light emitted from the light emitting device, and to obtain a light emitting device having high radiant intensity and excellent light characteristics such as luminance and color rendering.

  Next, the manufacturing method of the light emitting element storage package of this invention is demonstrated in detail below. FIG. 2 is a cross-sectional view showing an example of a method for manufacturing the substrate 1 of the light emitting element storage package of the present invention. In this figure, 1-A is an upper ceramic green sheet and 1-B is a lower ceramic green sheet, and these constitute a substrate 1 mainly used for a light emitting element storage package.

  In the method for manufacturing a light emitting element storage package according to the present invention, first, a plurality of ceramic green sheets (in FIG. 2, an upper ceramic green sheet 1-A and a lower ceramic green sheet 1-B) are prepared. . Next, a metal paste to be the wiring conductor 7 is printed and applied to the mounting surface 1a on which the light emitting element 5 on the upper surface of the upper ceramic green sheet 1-A to be the convex portion 1b is mounted and fixed, and the lower layer ceramic to be the root of the convex portion 1b. A metal paste that becomes the conductor layer 9 is applied to the entire surface of the green sheet 1-B other than the portion where the convex portions 1b are formed. Thereafter, the upper ceramic green sheet 1-A and the lower ceramic green sheet 1-B are laminated and fired, and the periphery of the portion that becomes the convex portion 1b is blasted until the conductor layer 9 is exposed to form the convex portion 1b. . At this time, a rough surface comprising a large number of curved concave portions can be simultaneously formed on the surface of the conductor layer 9.

  Thereby, the convex part 1b of the upper main surface of the base | substrate 1 and the conductor layer 9 whose surface is a rough surface which consists of many curved-shaped recessed parts can be formed efficiently simultaneously, and a manufacturing process can be simplified. it can.

  Further, the height dimension of the convex portion 1b on the upper main surface of the substrate 1 and the roughness of the surface of the conductor layer 9 can be formed with high accuracy and accuracy, and the position of the light emitting element 5 mounted on the substrate 1 can be determined. Can be kept constant. As a result, it is possible to satisfactorily maintain the desired radiation angle of the light reflected by the reflecting member 2, and it is possible to manufacture a light emitting element storage package that can obtain extremely excellent radiation intensity.

  As a result of the above, it is possible to manufacture a light-emitting element storage package that keeps the radiation intensity of light emitted from the light-emitting device high and stable, has high radiation intensity, and has excellent light characteristics such as luminance and color rendering, and is suitable for mass production. This is a method for manufacturing a suitable light emitting element storage package.

Hereinafter, the manufacturing method of the light emitting element accommodation package of this invention is demonstrated in detail using FIG. First, an upper ceramic green sheet 1-A and a lower ceramic green sheet 1-B to be the base 1 are prepared. The upper ceramic green sheet 1-A and the lower ceramic green sheet 1-B to be the base 1 are produced, for example, as follows. Add appropriate organic binder, organic solvent, plasticizer, dispersant, etc. to the raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO). A plurality of ceramic green sheets are obtained by forming into a sheet form by a conventionally known doctor blade method.

  Next, on the upper surface of the upper ceramic green sheet 1-A, a conductor paste obtained by mixing an appropriate binder and solvent with metal powders such as W, Mo, and Mn is printed and applied in a predetermined pattern by a screen printing method or the like. Thus, a metallized layer to be the wiring conductor 7 electrically connected to the electrode 6 of the electronic component 5 is formed. Similarly, for the lower ceramic green sheet 1-B, a conductive paste obtained by mixing an appropriate binder and solvent with metal powder such as W, Mo, Mn, etc. on the upper surface of the lower ceramic green sheet 1-B is used. A metallized layer to be the conductor layer 9 is formed by printing and applying a predetermined pattern over the entire surface around the portion to be the convex portion 1b on the surface by a screen printing method or the like. In addition, it does not matter whether the conductor paste used as the conductor layer 9 is printed or applied to the portion immediately below the convex portion 1b.

  In addition, when it has a penetration conductor which serves as an inner conductor in the inside of substrate 1 (not shown), a through-hole penetrating upper ceramic green sheet 1-A or lower ceramic green sheet 1-B is formed at this time, The through-hole may be filled with a conductor paste similar to the conductor paste that becomes the wiring conductor 7 and the conductor layer 9.

  Then, as shown in FIG. 2A, the upper ceramic green sheet 1-A is laminated on the lower ceramic green sheet 1-B so as to be stacked, and as shown in FIG. The sintered body to be the base body 1 having the conductor layers such as the wiring conductor 7 and the conductor layer 9 is obtained by punching the outer peripheral surface of the substrate and cutting it into predetermined dimensions and firing it at a temperature of about 1600 ° C. Can be produced.

  Next, a mask 1-C such as a photo-curing resin is masked on the portion to be the mounting surface 1a of the sintered body to be the base 1 obtained in FIG. Then, the upper main surface of the substrate 1 excluding the masked portion is removed to the surface of the conductor layer 9 by blasting such as sand blasting.

  When the substrate 1 is removed from the surface of the substrate 1, the conductor layer 9 is harder than the sintered body serving as the substrate 1, so that the processing speed is rapidly reduced on the surface of the conductor layer 9. For this reason, the processing is likely to stagnate in the conductor layer 9, and the height of the convex portion 1b is easily processed to a desired height. Therefore, the height of the convex portion 1b of the base body 1 can be processed with high dimensional accuracy. Also, in blasting, many pieces can be processed at a time, which can be processed efficiently and is suitable for mass production.

  At this time, the depth from the surface of the substrate 1 to the conductor layer 9 is determined by selecting the thickness of the upper ceramic green sheet 1-A, so that the height of the convex portion 1b can be controlled in units of several tens of μm. . The thickness of the wiring conductor 7 may be about 3 to 30 μm.

  Then, after blasting, the mask 1-C is removed to obtain the substrate 1, and finally, the wiring conductor 7 and the conductor layer 9 are appropriately subjected to Ni plating, Au plating or the like, and the reflecting member 2 made of Al or the like is formed as a convex portion. It joins to the outer peripheral part of the upper main surface of the base 1 so as to surround 1b.

  As a result of the above, it is possible to manufacture a light-emitting element storage package that keeps the radiation intensity of light emitted from the light-emitting device high and stable, has high radiation intensity, and has excellent light characteristics such as luminance and color rendering, and is suitable for mass production. This is a method for manufacturing a suitable light emitting element storage package.

  Further, the light emitting device of the present invention has a predetermined arrangement such as a plurality of light emitting device groups formed by concentrically forming a plurality of light emitting device groups composed of a plurality of light emitting devices in a lattice shape, a radial shape, a circular shape or a polygonal shape, for example. It can be set as an illuminating device by installing so. As a result, since the light emitting element 5 made of semiconductor uses light emission due to recombination of electrons, a small illuminating device capable of lower power consumption and longer life than the illuminating device using the conventional discharge, can do.

  Examples of such lighting devices include lighting fixtures used indoors and outdoors, electronic bulletin boards, backlights such as displays, moving image devices, ornaments, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 5 may be provided on the substrate 1 in order to improve the light emission intensity. It is also possible to arbitrarily adjust the angle of the reflecting surface 2b and the distance from the upper end of the reflecting surface 2b to the upper surface of the transparent member 3, thereby obtaining better color rendering by providing a complementary color gamut. it can.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. (A)-(c) is sectional drawing which shows an example of the manufacturing method of the base | substrate in the light emitting element storage package of this invention. It is sectional drawing which shows the conventional light-emitting device.

Explanation of symbols

1: Base 1b: Projection 1-A: Upper ceramic green sheet 1-B: Lower ceramic green sheet 2: Reflecting member 3: Transparent member 5: Light emitting element 7: Wiring conductor 9: Conductive layer

Claims (4)

A ceramic base having a convex portion for mounting the light emitting element on the upper main surface, a reflecting member joined to the outer peripheral portion of the upper main surface of the base so as to surround the convex portion, and an upper surface of the convex portion A wiring conductor that is electrically connected to the electrode of the light emitting element, and a conductor layer formed around the convex portion of the upper main surface of the base, the conductor layer comprising: A package for storing a light emitting element, wherein the surface is a rough surface comprising a large number of curved concave portions. 2. The method for manufacturing a light emitting element storage package according to claim 1, wherein a step of printing and applying a metal paste to be the wiring conductor and the conductor layer to a plurality of ceramic green sheets to be the base; The step of obtaining a sintered body by laminating the metal paste layer to be the conductor layer so as to be positioned in the inner layer, and blasting the periphery of the portion to be the convex portion of the upper main surface of the sintered body And removing the conductive layer to expose the conductor layer and forming the rough surface on the surface, and bonding the reflective member to the upper main surface of the substrate. A method for manufacturing a package for housing a light-emitting element. The light emitting element storage package according to claim 1, the light emitting element mounted on the convex portion and electrically connected to the wiring conductor, and a transparent member covering the light emitting element. A light emitting device characterized. A lighting device comprising a plurality of the light emitting devices according to claim 3 arranged in a predetermined arrangement.

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