JP2005229025A - Wiring-board material, and manufacturing method thereof - Google Patents
Wiring-board material, and manufacturing method thereof Download PDFInfo
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Description
本発明は接着信頼性に優れた配線板材料とその製造方法に関する。 The present invention relates to a wiring board material having excellent adhesion reliability and a method for producing the same.
従来より薄葉配線板材料にはポリエステルやポリイミドが使用されており、近年では耐熱特性と寸法変化率の小さいポリイミドを使用したポリイミド樹脂を用いた銅張積層板が主流となっている。
しかしながら、ポリイミド樹脂を用いた配線板材料は、広い温度範囲での寸法安定性、耐熱特性に優れる一方で、吸湿による接着力の低下、また他接着材との密着力加えて価格的に高価であるという欠点もある。
またポリエステル樹脂を用いた配線板材料は価格的には安価であるが、耐熱性寸法安定性に劣るという欠点があり、使用範囲が限定されてしまう。
また、ガラスクロスにエポキシ樹脂を含浸した薄葉プリプレグについても、エポキシ樹脂のＴｇ以下の温度では線膨張率が大きく、更に薄くなるにつれて欠け、割れなど取り扱い上の不具合が多発する。
Conventionally, polyester or polyimide has been used as a thin wiring board material, and in recent years, a copper-clad laminate using a polyimide resin using a polyimide having a low heat resistance and a small dimensional change rate has become mainstream.
However, while the wiring board material using polyimide resin is excellent in dimensional stability and heat resistance characteristics over a wide temperature range, it is expensive in price due to a decrease in adhesion due to moisture absorption and adhesion to other adhesives. There are also disadvantages.
Moreover, although the wiring board material using a polyester resin is cheap in price, there exists a fault that it is inferior to heat-resistant dimensional stability, and the use range will be limited.
In addition, thin prepregs in which glass cloth is impregnated with epoxy resin also have a large coefficient of linear expansion at temperatures below the Tg of the epoxy resin, and as the thickness becomes thinner, problems such as chipping and cracking frequently occur.
ポリイミド樹脂を用いた薄葉配線板材料にはポリイミド樹脂フィルムにエポキシ系、アクリル系、熱可塑系等のポリイミド接着材を用いて銅箔を積層する３層構造のもの、ポリイミド前駆体を銅箔に直接塗布し、高温化で縮合させた２層構造のもの、ポリイミド樹脂フィルム上にメッキにより銅を析出させる２層構造のものなどがある。
しかしながら、１の構造では耐熱性が使用する接着材に支配されてしまいポリイミド本来の耐熱特性が得られず、２の構造については製造工程による高価格化、３の構造においては、銅箔の厚膜化が難しい、銅の密着信頼性に劣るなどの欠点があり、加えて前記述のポリイミド樹脂が有する欠点も解消し得ない。
更にビニルエステル樹脂組成物をガラスクロスに含浸させこの両面もしくは片面に銅箔を積層して一体化させた薄葉配線板材料（特許文献１）も報告されているがこの方法の場合、ガラスクロスの凹凸が銅箔表面に現れてしまい、平滑性、微細配線加工には好ましくない。
Thin-wiring wiring board materials using polyimide resin have a three-layer structure in which a copper foil is laminated on a polyimide resin film using a polyimide adhesive material such as epoxy, acrylic or thermoplastic. A polyimide precursor is used as a copper foil. There are a two-layer structure directly applied and condensed at a high temperature, and a two-layer structure in which copper is deposited on a polyimide resin film by plating.
However, the heat resistance in the structure of 1 is controlled by the adhesive used, and the inherent heat resistance characteristics of polyimide cannot be obtained. The cost of the structure of 2 is increased by the manufacturing process, and the thickness of the copper foil in the structure of 3. There are drawbacks such as difficulty in film formation and poor adhesion reliability of copper, and in addition, the disadvantages of the polyimide resin described above cannot be solved.
Further, a thin-leaf wiring board material (Patent Document 1) in which a glass cloth is impregnated with a vinyl ester resin composition and copper foils are laminated and integrated on both sides or one side has been reported. Unevenness appears on the surface of the copper foil, which is not preferable for smoothness and fine wiring processing.
本発明は、懸かる状況を鑑み、接着信頼性に優れた配線板材料及びその製造方法を提供するものである。 This invention provides the wiring board material excellent in adhesion reliability, and its manufacturing method in view of the situation which concerns.
本発明は特定の物性を有する樹脂組成物と芯材を複合化し、複合体の両面もしくは片面に導電体を有する配線板材料により上記課題を解決できることを見出したものである。
本発明は以下に記載の各事項に関する。
（１）硬化後の貯蔵弾性率が２０℃で３００〜１７００ＭＰａである樹脂組成物（Ａ）と芯材（Ｂ）との複合体の片面もしくは両面に導電体層を有する配線板材料。
（２）樹脂組成物（Ａ）と芯材（Ｂ）との体積比率がＡ／Ｂ＝０．５〜０．８５である（１）記載の配線板材料。
（３）前記樹脂組成物が粘弾性樹脂組成物であることを特徴とする（１）又は（２）に記載の配線板材料。
（４）前記粘弾性樹脂組成物が重合体中に２〜１０部のグリシジルアクリレートをもちエポキシ価が２〜１８であり、かつ重量平均分子量（Ｍｗ）が５万以上であるアクリル重合体を必須成分とする（３）記載の配線板材料。
（５）前記芯材がガラスクロスであり、ガラスクロスの厚みが１０〜２００μｍであることを特徴とする（１）〜（４）記載の配線板材料。
（６）前記導電体層が銅であり、銅の厚みが３〜３５μｍであることを特徴とする（１）〜（５）に記載の配線板材料。
（７）総厚さが１００μｍ以下である（１）〜（６）記載の配線板材料。
（８）粘弾性樹脂組成物を芯材に含浸してなるプリプレグの片面及び両面に熱ロールラミネートにより導電体を一体化し、横搬送状態で硬化させることを特徴とする、配線板材料の製造方法。
（９）粘弾性樹脂組成物を芯材に含浸したプリプレグの両面もしくは片面に、あらかじめ導電体層の片面に粘弾性樹脂組成物を成膜したものをラミネートして一体化し、硬化することを特徴とする、配線板材料の製造方法。
This invention discovered that the said subject can be solved with the wiring board material which combines the resin composition and core material which have a specific physical property, and has a conductor on both surfaces or one side of a composite.
The present invention relates to each item described below.
(1) A wiring board material having a conductor layer on one side or both sides of a composite of a resin composition (A) and a core material (B) having a storage elastic modulus after curing of 300 to 1700 MPa at 20 ° C.
(2) The wiring board material according to (1), wherein the volume ratio of the resin composition (A) to the core material (B) is A / B = 0.5 to 0.85.
(3) The wiring board material according to (1) or (2), wherein the resin composition is a viscoelastic resin composition.
(4) An acrylic polymer having 2 to 10 parts of glycidyl acrylate, an epoxy value of 2 to 18 and a weight average molecular weight (Mw) of 50,000 or more is essential. The wiring board material according to (3), which is a component.
(5) The wiring board material according to (1) to (4), wherein the core material is a glass cloth, and the thickness of the glass cloth is 10 to 200 μm.
(6) The wiring board material according to any one of (1) to (5), wherein the conductor layer is copper and the thickness of copper is 3 to 35 μm.
(7) The wiring board material according to (1) to (6), wherein the total thickness is 100 μm or less.
(8) A method for producing a wiring board material, characterized in that a conductor is integrated on one side and both sides of a prepreg obtained by impregnating a core material with a viscoelastic resin composition by a hot roll laminate and cured in a laterally conveyed state. .
(9) A prepreg having a core material impregnated with a viscoelastic resin composition is laminated on one or both surfaces, and a laminate of a viscoelastic resin composition previously formed on one surface of a conductor layer is integrated and cured. A method for manufacturing a wiring board material.
本発明により接着信頼性（ＡＣＦ）を有する、ＦＰＣ用基材を含む薄葉配線板材料及びその製造方法を提供することができる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a thin-leaf wiring board material including an FPC base material having adhesion reliability (ACF) and a manufacturing method thereof.
本発明における粘弾性樹脂組成物の成分については、エポキシ樹脂、ゴム変性エポキシ樹脂、ＳＢＲ、ＮＢＲ、ＣＴＢＮ、アクリル樹脂、ポリアミド、ポリアミドイミド、シリコーン変性ポリアミドイミドなど特に限定するものではない、従って粘弾性樹脂組成物は硬化後に特定の物性を得るために複数成分が配合設計されたゴム性を有する混合物である。
好ましくは、アクリル樹脂成分を１００重量部に対し、硬化性成分が６０〜１２０重量部である樹脂組成物であり、特にアクリル樹脂組成物については、重合体中２〜１０部のグリシジルアクリレートを持ちエポキシ価が２〜１８であり、（ＨＬＣ測定法）重量平均分子量（Ｍｗ）が５万以上である重合体であることが好ましい。
アクリル樹脂組成物が１００重量部に対して硬化性成分が１２０重量部を超えるの場合、粘弾性樹脂の貯蔵弾性率が１７００ＭＰａを上回ってしまいやすい。この場合、芯材と複合したときＸＹ方向の線膨張率を樹脂が支配してしまい、寸法安定性が低下してしまう。
また６０重量部未満の場合には貯蔵弾性率が３００ＭＰａを下回りやすい。この場合、取り扱い性に問題が生じやすいと共に、硬化物のＴｇが急激に低下し、高温放置時の劣化による寸法収縮、半田耐熱性の低下等の問題が生じる恐れがある。
アクリル樹脂組成物についてもエポキシ価が２以下の場合には、硬化物のＴｇの低下が見られる傾向にあり、これによって耐熱特性が低下する恐れがある。１８以上の場合には貯蔵弾性率の上昇が見られる傾向にあり、これによって寸法安定性の低下という問題を生じる恐れがある。
The components of the viscoelastic resin composition in the present invention are not particularly limited, such as epoxy resin, rubber-modified epoxy resin, SBR, NBR, CTBN, acrylic resin, polyamide, polyamideimide, silicone-modified polyamideimide, and thus viscoelasticity. The resin composition is a mixture having rubber properties in which a plurality of components are blended and designed to obtain specific physical properties after curing.
Preferably, it is a resin composition in which the curable component is 60 to 120 parts by weight with respect to 100 parts by weight of the acrylic resin component, and particularly the acrylic resin composition has 2 to 10 parts of glycidyl acrylate in the polymer. It is preferably a polymer having an epoxy value of 2 to 18 and (HLC measurement method) having a weight average molecular weight (Mw) of 50,000 or more.
When the curable component exceeds 120 parts by weight with respect to 100 parts by weight of the acrylic resin composition, the storage elastic modulus of the viscoelastic resin tends to exceed 1700 MPa. In this case, when combined with the core material, the resin dominates the linear expansion coefficient in the XY direction, and the dimensional stability is lowered.
In the case of less than 60 parts by weight, the storage elastic modulus tends to be less than 300 MPa. In this case, problems are likely to occur in the handleability, and the Tg of the cured product is drastically reduced, which may cause problems such as dimensional shrinkage due to deterioration when left at high temperatures and a decrease in solder heat resistance.
When the epoxy value of the acrylic resin composition is 2 or less, there is a tendency that the Tg of the cured product is lowered, which may reduce the heat resistance. In the case of 18 or more, there is a tendency that an increase in storage elastic modulus is observed, which may cause a problem of reduction in dimensional stability.
本発明に使用される芯材には、紙、ガラス繊維、アラミド繊維等からなる織布や不織布を用いることができ、特に限定されるものではないが、ガラス繊維が好ましくガラスクロスが特に好ましい。芯材の厚みは１０μｍ〜２００μｍのものが好ましく、厚み２０μｍ〜８０μｍのものが特に好ましい。
芯材にガラスを用いる場合のガラスの材質にはＥガラス、Ｓガラス、Ｄガラスなどがあるが目的に応じていずれも選択できる。
また、芯材に織布を用いる場合、繊維の織り方については、平織朱子織り、綾織り他があるがいずれも適応できる。
本発明において芯材は強度が強く、線膨張率が小さいものであれば、薄いものほど好ましい。
The core material used in the present invention may be a woven fabric or non-woven fabric made of paper, glass fiber, aramid fiber or the like, and is not particularly limited, but glass fiber is preferable and glass cloth is particularly preferable. The thickness of the core material is preferably 10 μm to 200 μm, particularly preferably 20 μm to 80 μm.
There are E glass, S glass, D glass, and the like as the material of the glass when glass is used for the core material, and any of them can be selected according to the purpose.
When a woven fabric is used for the core material, there are plain weaving satin weaving and twill weaving as the fiber weaving method.
In the present invention, the thinner the core material, the stronger the strength and the smaller the linear expansion coefficient.
導電体層としては、導電性を有する膜であれば、金属、有機物、また両者の複合物、他、特に規定するものではなく、目的に応じて選択できる。一般的には銅が配線板材料として使用されており、本発明においても銅を導電体層とすることが好ましい。
このとき導電体層の厚みとしては目的に応じて選択できる。例えば１μｍ〜７０μｍの銅箔などが利用可能であり、目的に合わせて９μｍ以上の厚み銅箔を用いても良い。また、電解銅箔、圧延銅箔なども選択できる。
The conductive layer is not particularly defined as long as it is a conductive film, and can be selected according to the purpose. In general, copper is used as a wiring board material. In the present invention, copper is preferably used as the conductor layer.
At this time, the thickness of the conductor layer can be selected according to the purpose. For example, a copper foil of 1 μm to 70 μm can be used, and a 9 μm or thick copper foil may be used according to the purpose. Moreover, electrolytic copper foil, rolled copper foil, etc. can also be selected.
粘弾性樹脂組成物と芯材を複合化したプリプレグについては特に製造方法を規定するものではないが、含浸塗工が一般的であり、工業的に適した製法といえる。
この際、含浸性を向上させるために、一般のトルエン、メチルエチルケトンなどの有機溶剤などを活用し適性な粘度など物性を調整させることも可能である。また、加熱装置を付帯させホットメルト含浸塗工方法も可能である。
The prepreg in which the viscoelastic resin composition and the core material are combined is not particularly defined as a production method, but impregnation coating is common and can be said to be an industrially suitable production method.
At this time, in order to improve the impregnation property, it is possible to adjust physical properties such as an appropriate viscosity by utilizing an organic solvent such as general toluene and methyl ethyl ketone. Also, a hot melt impregnation coating method with a heating device is possible.
Ａ：粘弾性樹脂組成物とＢ：芯材の体積比率はＡ／Ｂ＝０．５〜０．８５が望ましく０．５以下の場合には、導体層との一体化時に樹脂成分が不足し、高速一体化時に気泡、かすれ等の問題が生じる可能性が高いと共に、一体化した導体表面に芯材の凹凸が反映されてしまい、表面平滑性に欠けるという欠点が生じやすい。
また、０．８５を超えると、高温放置などの耐熱性試験において、基材に歪みが発生するといった寸法安定性の低下がおこる可能性がある。
なお、体積比率はそれぞれの重量と比重から計算できる。
粘弾性樹脂組成物の塗工時の硬化率については１０〜５０％の範囲が好ましい。１０％未満の場合、導電体との一体化時に芯材の凹凸を反映しやすくなり、また、厚み制御が難しくなる。
The volume ratio of A: viscoelastic resin composition and B: core material is preferably A / B = 0.5 to 0.85, and when 0.5 or less, the resin component is insufficient when integrated with the conductor layer. In addition, there is a high possibility that problems such as bubbles and fading will occur during high-speed integration, and the irregularities of the core material are reflected on the integrated conductor surface, which tends to cause a defect that surface smoothness is lacking.
On the other hand, if it exceeds 0.85, there is a possibility that the dimensional stability is lowered such that the base material is distorted in a heat resistance test such as being left at a high temperature.
In addition, a volume ratio can be calculated from each weight and specific gravity.
About 10 to 50% of range is preferable about the hardening rate at the time of the application of a viscoelastic resin composition. If it is less than 10%, it becomes easy to reflect the irregularities of the core material when integrated with the conductor, and thickness control becomes difficult.
硬化率が５０％を超える場合には導体層との一体化時に樹脂成分のフローが不足し、高速一体化時に気泡、かすれ等の問題が生じると共に導体との接着力が低下するという問題がある。 When the curing rate exceeds 50%, there is a problem that the flow of the resin component is insufficient at the time of integration with the conductor layer, and problems such as bubbles and blurring occur at the time of high-speed integration and the adhesive strength with the conductor is reduced. .
本発明における配線板材料において上記記載プリプレグと導電体との一体化についてはメタライズ、プレス積層方法、熱ロール連続積層法等、目的に応じた方法で行うことができる。プリプレグの片面もしくは両面に効率よく導電体層を形成するには熱ロールによる連続ラミネート法が好ましい。 In the wiring board material of the present invention, the integration of the above-described prepreg and conductor can be performed by a method according to the purpose, such as metallization, press lamination method, hot roll continuous lamination method and the like. In order to efficiently form a conductor layer on one side or both sides of a prepreg, a continuous laminating method using a hot roll is preferable.
芯材の表面の凹凸を吸収し、低減する方法として、プリプレグと導電体層を連続積層する時、あらかじめ導電体層の積層面にプリプレグ含浸した樹脂組成物と同様の組成物を用いてなる層を形成しておく事が有効である。 As a method of absorbing and reducing irregularities on the surface of the core material, a layer formed by using the same composition as the resin composition impregnated in advance with the prepreg impregnation on the laminated surface of the conductor layer when the prepreg and the conductor layer are continuously laminated. It is effective to form
また、連続積層物の硬化に関しては、熱硬化、紫外線硬化、電子線硬化等の方法があり、粘弾性樹脂組成物の硬化反応に十分なエネルギー量を与えられる物であれば特に制約される物ではないが、熱硬化による連続硬化法が好ましく、熱ロールによる連続ラミネートを行い連続熱硬化炉に横搬送し硬化後に巻き取り作業を行う方法が、硬化時の硬化収縮による、しわ、おれ等の対策上好ましい。
なお、場合によっては上記硬化、巻き取り後品質安定化のために所定時間の後硬化処理をすることもある。
Moreover, regarding the curing of the continuous laminate, there are methods such as thermosetting, ultraviolet curing, and electron beam curing, which are particularly restricted as long as they can give a sufficient amount of energy for the curing reaction of the viscoelastic resin composition. However, the continuous curing method by heat curing is preferable, and the method of performing continuous laminating with a heat roll and laterally transporting to a continuous heat curing furnace and performing the winding operation after curing is due to shrinkage due to curing shrinkage during curing, wrinkles, wrinkles, etc. It is preferable as a countermeasure.
In some cases, post-curing treatment may be performed for a predetermined time in order to stabilize the quality after curing and winding.
以上に記載のように、本発明に寄れば、耐熱性、寸法安定性、接着信頼性表面平滑性に優れた、芯材を持つＦＰＣを含む薄葉配線板材料を提供することも可能である。薄葉配線板材料は金属層を含む厚さ（総厚さ）が１００μｍ以下であることが好ましい。以下実施例にて本発明の詳細を説明するものである。 As described above, according to the present invention, it is also possible to provide a thin-leaf wiring board material including an FPC having a core material that is excellent in heat resistance, dimensional stability, and adhesion reliability and surface smoothness. The thin wiring board material preferably has a thickness (total thickness) including the metal layer of 100 μm or less. The details of the present invention will be described in the following examples.
実施例１
（１）粘弾性樹脂組成物の調整
１７０℃３０分の熱処理（硬化）により２５℃での貯蔵弾性率が７００ＭＰａとなる下記樹脂組成物を有機溶剤メチルエチルケトンにて７００ｃＰに調整し、ワニスを調整した。
アクリル樹脂組成物ＨＴＲ−８６０Ｐ３（ナガセケムテクス（株））：１００重量部
エポキシ樹脂エピコート−８２８（油化シェル（株））：６０重量部
ノボラックフェノールＶＰ６３７１（日立化成工業（株））：４０重量部
イミダゾール２ＰＺ−ＣＮ（四国化成（株））：０．４重量部
＊アクリル樹脂組成物：その他の樹脂組成物＝１００：１００．４
（２）芯材への含浸塗工
上記（１）で調整したワニスを０．０４ｍｍ厚みのガラスクロス＃１０３７（日東紡（株））に含浸塗工機により体積比で、ワニス固形分／ガラスクロス＝０．６となるように含浸させ、１５０℃にて５分間熱風乾燥させ、粘弾性樹脂組成物の硬化度３０％のプリプレグを作製した。
（３）薄葉配線板材料の作成
上記にて作製したプリプレグの両面に銅箔ＳＬＰ−１８電解銅箔（日本電解（株））を１２０℃に加熱した上下の誘電過熱ロールの間を線圧１ＭＰａにてロール回転速度５ｍ／ｍｉｎの条件で通過加圧熱圧着させ、２００℃の乾燥炉（５ｍ）を横搬送にて通過させた後、ロール状にまきとり粘弾性樹脂組成物の厚みが５０μｍの両面に銅箔を配した薄葉配線板材料を得た。
Example 1
(1) Adjustment of viscoelastic resin composition The following resin composition having a storage elastic modulus at 25 ° C of 700 MPa by heat treatment (curing) at 170 ° C for 30 minutes was adjusted to 700 cP with the organic solvent methyl ethyl ketone to prepare a varnish. .
Acrylic resin composition HTR-860P3 (Nagase ChemteX Corporation): 100 parts by weight Epoxy Resin Epicoat-828 (Oka Shell Co., Ltd.): 60 parts by weight Novolac Phenol VP 6371 (Hitachi Chemical Industry Co., Ltd.): 40 parts by weight Part Imidazole 2PZ-CN (Shikoku Kasei Co., Ltd.): 0.4 parts by weight * Acrylic resin composition: Other resin composition = 100: 100.4
(2) Impregnation coating on core material Varnish solid content / glass by volume ratio of 0.04 mm thick glass cloth # 1037 (Nittobo Co., Ltd.) by impregnation coating machine. It was impregnated so that cross = 0.6 and dried with hot air at 150 ° C. for 5 minutes to prepare a prepreg having a curing degree of 30% of the viscoelastic resin composition.
(3) Preparation of thin-leaf wiring board material Line pressure of 1 MPa between upper and lower dielectric superheated rolls obtained by heating copper foil SLP-18 electrolytic copper foil (Nihon Electrolysis Co., Ltd.) to 120 ° C. on both sides of the prepreg produced above. And pressurizing and thermocompression bonding under conditions of a roll rotation speed of 5 m / min, passing through a drying oven (5 m) at 200 ° C. by lateral conveyance, and then wound into a roll and the thickness of the viscoelastic resin composition is 50 μm. A thin-leaf wiring board material with copper foil on both sides was obtained.
実施例２
実施例１のプリプレグに使用するのと同様の組成物を用い、事前にワニス粘度２０００ｃＰに調整し、乾燥後１０μｍとなるようにダイレクト塗工し、１５０℃５分熱風乾燥して、粘弾性樹脂組成物の硬化度が３０％である樹脂付き銅箔とした。この樹脂付き銅箔を実施例１（３）に記載の銅箔の代わりに使用した以外は実施例１と同様にして、粘弾性樹脂組成物の厚みが７０μｍとなる両面に銅箔を配した薄葉配線板材料を得た。
Example 2
Using the same composition as that used in the prepreg of Example 1, the varnish viscosity was adjusted to 2000 cP in advance, the coating was directly applied to 10 μm after drying, and hot-air drying at 150 ° C. for 5 minutes to obtain a viscoelastic resin. It was set as the copper foil with a resin whose hardening degree of a composition is 30%. The copper foil was disposed on both sides where the thickness of the viscoelastic resin composition was 70 μm in the same manner as in Example 1 except that this copper foil with resin was used instead of the copper foil described in Example 1 (3). A thin-wiring board material was obtained.
実施例３
実施例１、（１）記載の樹脂組成物の組成比率を以下に変更する以外は実施例１と同様とした。
＊アクリル樹脂組成物：その他の樹脂組成物＝１００：１３０
Example 3
Example 1 was the same as Example 1 except that the composition ratio of the resin composition described in (1) was changed to the following.
* Acrylic resin composition: other resin composition = 100: 130
実施例４
実施例１、（１）記載の樹脂組成物の組成比率を以下に変更する以外は実施例１と同様とした。
＊アクリル樹脂組成物：その他の樹脂組成物＝１００：５５
Example 4
Example 1 was the same as Example 1 except that the composition ratio of the resin composition described in (1) was changed to the following.
* Acrylic resin composition: other resin composition = 100: 55
実施例５
実施例１、（２）記載の体積比率ワニス固形分／ガラスクロス＝０．３に変更する以外は実施例１と同様とした。
Example 5
Example 1 was the same as Example 1 except that the volume ratio varnish solid content / glass cloth described in (2) was changed to 0.3.
実施例６
実施例１、（２）記載の体積比率ワニス固形分／ガラスクロス＝１．０に変更する以外は実施例１と同様とした。
Example 6
Example 1 was the same as Example 1 except that the volume ratio varnish solid content / glass cloth described in (2) was changed to 1.0.
実施例７
実施例１、（２）記載の粘弾性樹脂組成物の硬化度を５％に変更する以外は実施例１と同様とした。
Example 7
Example 1 was the same as Example 1 except that the degree of cure of the viscoelastic resin composition described in (2) was changed to 5%.
実施例８
実施例１、（２）記載の粘弾性樹脂組成物の硬化度を６０％に変更する以外は実施例１と同様とした。
Example 8
Example 1 was the same as Example 1 except that the degree of cure of the viscoelastic resin composition described in (2) was changed to 60%.
比較例１
薄葉配線板材料として、ＭＣＬ−Ｅ−６７９Ｆ（日立化成工業（株））を用いた。
Comparative Example 1
MCL-E-679F (Hitachi Chemical Industry Co., Ltd.) was used as a thin wiring board material.
比較例２
薄葉配線板材料として、エスパネックスＡＸ１８２５１８（新日鐵化学（株））を用いた。
Comparative Example 2
Espanex AX182518 (Nippon Steel Chemical Co., Ltd.) was used as the thin-leaf wiring board material.
上記実施例及び比較例により得られた特性結果を表に示す。 The characteristic results obtained by the examples and comparative examples are shown in the table.
表に示す特性結果より、実施例１〜８は比較例１、２と比較して優れた接着信頼性を有する。また、実施例１や２のような特に好ましい態様では、接着信頼性に優れ、さらに耐熱性、寸法安定性、表面平滑性に優れる。 From the characteristic results shown in the table, Examples 1 to 8 have superior adhesion reliability as compared with Comparative Examples 1 and 2. Moreover, in especially preferable aspects like Example 1 and 2, it is excellent in adhesive reliability, and also excellent in heat resistance, dimensional stability, and surface smoothness.
Claims (9)
The prepreg impregnated with the viscoelastic resin composition in the core material is laminated and integrated with a laminate of a viscoelastic resin composition previously formed on one side of the conductor layer, and is cured, A method of manufacturing a wiring board material.
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| JP2004038046A JP4517280B2 (en) | 2004-02-16 | 2004-02-16 | Prepreg, wiring board material and manufacturing method thereof |
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| JP2004038046A JP4517280B2 (en) | 2004-02-16 | 2004-02-16 | Prepreg, wiring board material and manufacturing method thereof |
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| JP2006152261A (en) * | 2004-10-25 | 2006-06-15 | Hitachi Chem Co Ltd | Composite, prepreg, metal foil-clad laminated plate, and multilayer printed wiring board and manufacturing method thereof |
| JP2006152260A (en) * | 2004-10-26 | 2006-06-15 | Hitachi Chem Co Ltd | Composite, prepreg, metal foil-clad laminated plate and multilayer printed wiring board obtained using the same, and manufacturing method of multilayer printed wiring board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723295A (en) * | 1980-07-17 | 1982-02-06 | Toray Industries | Flexible substrate |
| JPH05218602A (en) * | 1991-10-30 | 1993-08-27 | Rogers Corp | Thin flexible circuit laminate using epoxy as base |
| JPH07183632A (en) * | 1993-11-06 | 1995-07-21 | Philips Electron Nv | Printed wiring board and its assembly method |
| JPH08125290A (en) * | 1994-10-25 | 1996-05-17 | Risho Kogyo Co Ltd | Tape base material for printed wiring and manufacture |
| JP2004035847A (en) * | 2002-07-08 | 2004-02-05 | Hitachi Chem Co Ltd | Adhesive composition, adhesive film using the same and semiconductor device using the adhesive film |
-
2004
- 2004-02-16 JP JP2004038046A patent/JP4517280B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723295A (en) * | 1980-07-17 | 1982-02-06 | Toray Industries | Flexible substrate |
| JPH05218602A (en) * | 1991-10-30 | 1993-08-27 | Rogers Corp | Thin flexible circuit laminate using epoxy as base |
| JPH07183632A (en) * | 1993-11-06 | 1995-07-21 | Philips Electron Nv | Printed wiring board and its assembly method |
| JPH08125290A (en) * | 1994-10-25 | 1996-05-17 | Risho Kogyo Co Ltd | Tape base material for printed wiring and manufacture |
| JP2004035847A (en) * | 2002-07-08 | 2004-02-05 | Hitachi Chem Co Ltd | Adhesive composition, adhesive film using the same and semiconductor device using the adhesive film |
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