TWI548526B - Method for manufacturing laminated sheet and apparatus therefor - Google Patents

Method for manufacturing laminated sheet and apparatus therefor Download PDF

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Publication number
TWI548526B
TWI548526B TW100131446A TW100131446A TWI548526B TW I548526 B TWI548526 B TW I548526B TW 100131446 A TW100131446 A TW 100131446A TW 100131446 A TW100131446 A TW 100131446A TW I548526 B TWI548526 B TW I548526B
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Taiwan
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resin composition
resin
laminated sheet
nozzle
base material
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TW100131446A
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Chinese (zh)
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TW201215506A (en
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瀧本恭史
八月朔日猛
金澤敏秀
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住友電木股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/022 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/07Parts immersed or impregnated in a matrix
    • B32B2305/076Prepregs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/10Fibres of continuous length
    • B32B2305/18Fabrics, textiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08Glass
    • B32B2315/085Glass fiber cloth or fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Description

積層片之製造方法及製造裝置Manufacturing method and manufacturing device of laminated sheet

本發明係關於積層片之製造方法及製造裝置。The present invention relates to a method and apparatus for producing a laminated sheet.

習知已將金屬箔或樹脂片與預浸片一體化的積層片使用於多層印刷佈線板的製造(例如參照專利文獻1~4)。A laminate sheet in which a metal foil or a resin sheet and a prepreg sheet are integrated is used for the production of a multilayer printed wiring board (see, for example, Patent Documents 1 to 4).

此處,此種積層片係如下述般進行製造。在金屬箔或樹脂片上塗佈樹脂清漆,然後重疊纖維基材,使上述樹脂清漆含浸。Here, such a laminated sheet is produced as follows. A resin varnish is coated on the metal foil or the resin sheet, and then the fiber substrate is laminated to impregnate the above resin varnish.

另外,本案的背景技術亦有專利文獻5。Further, the background art of the present invention also has Patent Document 5.

[先行技術文獻][Advanced technical literature] [專利文獻][Patent Literature]

專利文獻1:日本專利特開2009-126917號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-126917

專利文獻2:日本專利特開2010-47706號公報Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-47706

專利文獻3:日本專利特開2004-82687號公報Patent Document 3: Japanese Patent Laid-Open Publication No. 2004-82687

專利文獻4:日本專利特開2003-249739號公報Patent Document 4: Japanese Patent Laid-Open Publication No. 2003-249739

專利文獻5:日本專利特開2003-147172號公報Patent Document 5: Japanese Patent Laid-Open Publication No. 2003-147172

此種專利文獻1~4所揭示的製造方法中,係將樹脂清漆塗佈於金屬箔或樹脂片上之後,重疊纖維基材並使上述樹脂清漆含浸,故樹脂清漆對纖維基材的含浸量調整較為困難。例如專利文獻3係利用一對壓接輥夾入銅箔、樹脂及織布(或不織布),再使樹脂依一定量含浸於織布(或不織布)中。依照專利文獻3所揭示的方法,當欲調整樹脂的含浸量時,必需微調整壓接輥的壓接力,導致樹脂的含浸量調整非常困難。In the production method disclosed in Patent Documents 1 to 4, after the resin varnish is applied onto a metal foil or a resin sheet, the fiber base material is laminated and the resin varnish is impregnated, so that the impregnation amount of the resin varnish to the fiber base material is adjusted. More difficult. For example, in Patent Document 3, a copper foil, a resin, and a woven fabric (or a non-woven fabric) are sandwiched by a pair of pressure rollers, and the resin is impregnated into the woven fabric (or non-woven fabric) in a certain amount. According to the method disclosed in Patent Document 3, when the impregnation amount of the resin is to be adjusted, it is necessary to finely adjust the pressure contact force of the pressure roller, which makes it difficult to adjust the impregnation amount of the resin.

根據本發明,可提供一種積層片之製造方法,係在連續饋送出的支撐體、與連續饋送出的纖維基材之間,供應第1樹脂組成物,將上述支撐體與上述纖維基材隔著上述第1樹脂組成物進行壓接而製造積層片的積層片之製造方法,包括有:對上述支撐體其中一面、上述纖維基材其中一面中至少任一者,供應液狀第1樹脂組成物的第1步驟;以及將上述支撐體的上述其中一面與上述纖維基材的上述其中一面,隔著上述第1樹脂組成物進行壓接的第2步驟;其中,上述第1步驟中,在對供應上述液狀第1樹脂組成物的供應手段之供應位置進行調整後,對上述支撐體其中一面、上述纖維基材其中一面中至少任一者供應液狀第1樹脂組成物。According to the present invention, there is provided a method of producing a laminated sheet, wherein a first resin composition is supplied between a continuously fed support and a continuously fed fibrous substrate, and the support is separated from the fibrous substrate. A method for producing a laminated sheet in which the first resin composition is pressure-bonded to produce a laminated sheet, comprising: supplying a liquid first resin to one of the support body and at least one of the fiber base materials; And a second step of pressure-bonding one of the one surface of the support and the one of the fibrous base materials via the first resin composition; wherein, in the first step, After adjusting the supply position of the supply means for supplying the liquid first resin composition, the liquid first resin composition is supplied to at least one of one side of the support and one of the fiber base materials.

根據本發明,第1步驟中在對由供應手段進行的液狀第1樹脂組成物之供應位置進行調整後,對上述支撐體其中一面、上述纖維基材其中一面中至少其中任一者供應液狀第1樹脂組成物。According to the invention, in the first step, after the supply position of the liquid first resin composition by the supply means is adjusted, at least one of the one side of the support body and one of the fiber base materials is supplied with the liquid. A first resin composition.

藉此,可調整第1樹脂組成物對纖維基材的含浸量。藉此,可獲得所需含浸量的積層片。Thereby, the impregnation amount of the first resin composition to the fiber base material can be adjusted. Thereby, a laminated sheet of the desired impregnation amount can be obtained.

再者,本發明亦提供積層片之製造裝置,係具備有:連續饋送出支撐體的手段;連續饋送出纖維基材的手段;對上述支撐體與上述纖維基材之間供應液狀第1樹脂組成物的供應手段;以及隔著上述第1樹脂組成物,將上述支撐體與上述纖維基材施行壓接的壓接手段;其中,具備有對上述供應手段之供應位置進行調整的調整手段。Furthermore, the present invention also provides a manufacturing apparatus for a laminated sheet, comprising: means for continuously feeding out a support; means for continuously feeding out a fibrous base material; and supplying a liquid to the support body and the fibrous base material a means for supplying a resin composition; and a pressure bonding means for pressure-bonding the support body and the fiber base material via the first resin composition; and an adjustment means for adjusting a supply position of the supply means .

此處,所謂「對供應手段之供應位置進行調整」係包括有:使供應手段本身的位置進行移動而調整供應位置的情況,以及在未使供應手段本身移動的情況下,藉由變更第1樹脂組成物的供應口(吐出口)位置,而調整供應手段之供應位置的情況等二者。Here, the "adjustment of the supply position of the supply means" includes a case where the position of the supply means itself is moved to adjust the supply position, and when the supply means itself is not moved, the first change is made. Both the supply port (discharge port) of the resin composition and the supply position of the supply means are adjusted.

依如上述,根據本發明可獲得所需的積層片。As described above, according to the present invention, a desired laminated sheet can be obtained.

上述目的以及其他目的、特徵及優點,藉由以下所述較佳實施形態及其所附示的以下圖式便可更加清楚明瞭。The above and other objects, features, and advantages of the invention will be apparent from

以下,針對本發明積層片之製造方法及積層片,根據所附示圖式的較佳實施形態進行詳細說明。另外,所有圖式中,同樣的構成要件係賦予同樣的元件符號,並適當省略說明。Hereinafter, the method for producing a laminated sheet of the present invention and the laminated sheet will be described in detail based on preferred embodiments of the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description is omitted as appropriate.

圖1所示係本發明積層片的實施形態剖視圖,圖2所示係本發明積層片的實施形態另一構造例示意剖視圖,圖3~圖5所示係本發明積層片之製造方法的實施形態中所使用積層片製造裝置的構造例圖。1 is a cross-sectional view showing an embodiment of a laminated sheet of the present invention, and FIG. 2 is a schematic cross-sectional view showing another structural example of the laminated sheet of the present invention, and FIGS. 3 to 5 are views showing a method of manufacturing the laminated sheet of the present invention. An example of the structure of a laminated sheet manufacturing apparatus used in the form.

<積層片><Laminated film>

首先,針對本發明積層片的實施形態進行說明。另外,若將積層片切斷為既定尺寸便可獲得預浸片。First, an embodiment of the laminated sheet of the present invention will be described. Further, the prepreg can be obtained by cutting the laminated sheet into a predetermined size.

另外,以下的說明中,將圖1(以下各圖亦同)中的上側當作「上」,將下側當作「下」而進行說明。又,圖1(以下各圖亦同)係在厚度方向(圖中的上下方向)有誇大圖示情形。In the following description, the upper side in FIG. 1 (the same applies to the following drawings) will be referred to as "upper" and the lower side will be referred to as "lower". Further, Fig. 1 (the same applies to the following drawings) is exaggerated in the thickness direction (vertical direction in the drawing).

圖1所示積層片1係整體形狀呈帶狀,具備有薄板狀(平板狀)支撐體5、薄板狀(平板狀)纖維基材2、第1樹脂層3及第2樹脂層4,該第1樹脂層3係被覆著纖維基材2其中一面(上面)側,且由第1樹脂組成物構成,該第2樹脂層4係被覆著纖維基材2的另一面(下面)側,且由第2樹脂組成物構成。支撐體5與纖維基材2係隔著第1樹脂層3(第1樹脂組成物)進行接合。另外,該積層片1係經切斷為既定尺寸而使用。The laminated sheet 1 shown in Fig. 1 has a strip shape as a whole, and includes a thin plate-like (flat-plate) support 5, a thin plate-like (flat-plate) fiber base material 2, a first resin layer 3, and a second resin layer 4. The first resin layer 3 is coated on one side (upper surface) side of the fiber base material 2, and is composed of a first resin composition, and the second resin layer 4 is coated on the other surface (lower surface) side of the fiber base material 2, and It is composed of a second resin composition. The support 5 and the fiber base 2 are joined together via the first resin layer 3 (first resin composition). Further, the laminated sheet 1 is used by being cut into a predetermined size.

支撐體5係例如由金屬箔(金屬層)或樹脂薄膜構成。The support 5 is made of, for example, a metal foil (metal layer) or a resin film.

金屬箔係例如後續會被加工為佈線部(電路)等的部分。構成該金屬箔的金屬材料係可舉例如銅或銅系合金、鋁或鋁系合金、鐵或鐵系合金、不銹鋼等。而構成金屬箔的金屬材料,在該等之中從導電性優異、容易利用蝕刻進行電路形成、且低價的觀點而言,較佳係銅或銅系合金。又,支撐體5亦可使用極薄金屬箔(例如厚度2~5μm)。但,從處置性的觀點而言,支撐體5亦可使用將前述極薄金屬箔設置於載體材料上者。The metal foil is, for example, subsequently processed into a portion such as a wiring portion (circuit). The metal material constituting the metal foil may, for example, be copper or a copper alloy, an aluminum or aluminum alloy, an iron or iron alloy, or stainless steel. The metal material constituting the metal foil is preferably a copper or copper alloy from the viewpoint of excellent conductivity, easy circuit formation by etching, and low cost. Further, the support 5 may be an extremely thin metal foil (for example, having a thickness of 2 to 5 μm). However, from the viewpoint of handleability, the support 5 may be formed by providing the above-mentioned ultra-thin metal foil on a carrier material.

再者,構成樹脂薄膜的樹脂材料係可舉例如氟系樹脂、聚醯亞胺樹脂、聚對苯二甲酸丁二酯、聚對苯二甲酸乙二酯等聚酯樹脂等等。而構成樹脂薄膜的樹脂材料,在該等之中從耐熱性優異、低價的觀點而言,較佳係聚對苯二甲酸乙二酯。又,樹脂薄膜較佳係對該樹脂薄膜靠第1樹脂層3側的面施行過可剝離處理者。藉此,後續便可輕易地將支撐體5與第1樹脂層3予以分離。In addition, examples of the resin material constituting the resin film include a polyester resin such as a fluorine resin, a polyimide resin, a polybutylene terephthalate or a polyethylene terephthalate. Further, among these, the resin material constituting the resin film is preferably polyethylene terephthalate from the viewpoint of excellent heat resistance and low cost. Moreover, it is preferable that the resin film is subjected to a peelable treatment on the surface of the resin film on the side of the first resin layer 3. Thereby, the support body 5 and the first resin layer 3 can be easily separated later.

支撐體5的平均厚度並無特別的限定,較佳係8~70μm左右、更佳係12~40μm左右。The average thickness of the support 5 is not particularly limited, but is preferably about 8 to 70 μm, more preferably about 12 to 40 μm.

纖維基材2係具有提升積層片1之機械強度的機能。The fibrous base material 2 has a function of enhancing the mechanical strength of the laminated sheet 1.

該纖維基材2係可舉例如由以玻璃織布、玻璃不織布等玻璃纖維基材;聚醯胺樹脂纖維、芳香族聚醯胺樹脂纖維、全芳香族聚醯胺樹脂纖維等聚醯胺系樹脂纖維;聚酯樹脂纖維、芳香族聚酯樹脂纖維、全芳香族聚酯樹脂纖維等聚酯系樹脂纖維;聚醯亞胺樹脂纖維、氟樹脂纖維等作為主成分的織布或不織布所構成的合成纖維基材,或以牛皮紙、棉短絨紙、短毛纖與牛皮紙漿的混抄紙等作為主成分之紙纖維基材等有機纖維基材等之纖維基材等。The fiber base material 2 may be, for example, a glass fiber base material such as a glass woven fabric or a glass nonwoven fabric; a polyamide resin such as a polyamide resin fiber, an aromatic polyamide resin fiber, or a wholly aromatic polyamide resin fiber; Resin fiber; polyester resin fiber such as polyester resin fiber, aromatic polyester resin fiber, or wholly aromatic polyester resin fiber; woven fabric or non-woven fabric as a main component such as polyimine resin fiber or fluororesin fiber A synthetic fiber base material, or a fibrous base material such as an organic fiber base material such as a paper fiber base material containing kraft paper, cotton linter paper, a mixed paper of short-hair fiber and kraft pulp, or the like as a main component.

該等之中,纖維基材2較佳係玻璃纖維基材。藉由使用該玻璃纖維基材,可更加提升積層片1的機械強度。又,亦可達減小積層片1之熱膨脹係數的效果。Among these, the fibrous base material 2 is preferably a glass fiber base material. By using the glass fiber substrate, the mechanical strength of the laminated sheet 1 can be further improved. Further, the effect of reducing the thermal expansion coefficient of the laminated sheet 1 can be achieved.

構成此種玻璃纖維基材的玻璃係可舉例如E玻璃、C玻璃、A玻璃、S玻璃、D玻璃、NE玻璃、T玻璃、H玻璃等。該等之中,玻璃較佳係S玻璃、或T玻璃。藉此,可使玻璃纖維基材的熱膨脹係數比較小,故可盡量減小積層片1的熱膨脹係數。Examples of the glass constituting the glass fiber base material include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, and H glass. Among these, the glass is preferably S glass or T glass. Thereby, the coefficient of thermal expansion of the glass fiber base material can be made relatively small, so that the thermal expansion coefficient of the laminated sheet 1 can be minimized.

纖維基材2的平均厚度並無特別的限定,較佳係100μm以下、更佳係50μm以下、特佳係10~30μm左右。藉由使用該厚度的纖維基材2,便可在確保積層片1的機械強度情況下達薄型化。且亦可提升積層片1的加工性‧尺寸安定性。The average thickness of the fibrous base material 2 is not particularly limited, but is preferably 100 μm or less, more preferably 50 μm or less, and particularly preferably 10 to 30 μm. By using the fiber base material 2 of this thickness, it is possible to reduce the thickness of the laminated sheet 1 while ensuring the mechanical strength of the laminated sheet 1. Moreover, the workability and dimensional stability of the laminated sheet 1 can be improved.

在該纖維基材2的其中一面側設有第1樹脂層3,且在另一面側設置第2樹脂層4。又,第1樹脂層3係由第1樹脂組成物構成,另一方面,第2樹脂層4在本實施形態中係由與上述第1樹脂組成物不同組成的第2樹脂組成物構成。The first resin layer 3 is provided on one surface side of the fiber base material 2, and the second resin layer 4 is provided on the other surface side. In addition, the first resin layer 3 is composed of a first resin composition, and the second resin layer 4 is composed of a second resin composition having a composition different from that of the first resin composition.

藉由該構成,便可因應對各樹脂層所要求的特性,適當設定樹脂組成物的組成。According to this configuration, the composition of the resin composition can be appropriately set in response to the characteristics required for each resin layer.

另外,當然第1樹脂組成物與第2樹脂組成物亦可相互組成為相同。Further, of course, the first resin composition and the second resin composition may have the same composition.

本實施形態中,因為在第1樹脂層3上形成佈線部(導體圖案),故第1樹脂組成物係設定為與金屬間之密接性優異的組成。又,為了在由積層片1所獲得預浸片的第2樹脂層4中,可確實地埋入由積層片1所獲得之其他預浸片的佈線部或其他纖維基材,第2樹脂組成物係設定為第2樹脂層4的可撓性(柔軟性)高於第1樹脂層3的組成。相關此種各樹脂組成物,於後詳述。In the present embodiment, since the wiring portion (conductor pattern) is formed on the first resin layer 3, the first resin composition is set to have a composition excellent in adhesion to the metal. Further, in the second resin layer 4 of the prepreg obtained from the laminated sheet 1, the wiring portion or other fibrous substrate of the other prepreg obtained by the laminated sheet 1 can be surely embedded, and the second resin is composed. The system is set such that the flexibility (flexibility) of the second resin layer 4 is higher than that of the first resin layer 3. Such respective resin compositions are described in detail later.

如圖1所示,本實施形態中,在纖維基材2的厚度方向其中一部分中含浸第1樹脂組成物(第1樹脂層3)(以下將此部分稱「第1含浸部31」),並在纖維基材2未含浸第1樹脂組成物的殘餘部分中含浸第2樹脂組成物(第2樹脂層4)(以下將此部分稱「第2含浸部41」)。藉此,第1樹脂層3其中一部分的第1含浸部31、與第2樹脂層4其中一部分的第2含浸部41便位於纖維基材2內。而在纖維基材2內,第1含浸部31(第1樹脂層3的下面)與第2含浸部41(第2樹脂層4的上面)相接觸。換言之,第1樹脂組成物係從纖維基材2的上面側含浸於纖維基材2中,第2樹脂組成物則從纖維基材2的下面側含浸於纖維基材2中,由該等樹脂組成物填充纖維基材2內的空隙。As shown in Fig. 1, in the present embodiment, a part of the thickness direction of the fiber base material 2 is impregnated with a first resin composition (first resin layer 3) (hereinafter referred to as "first impregnation portion 31"). The second resin composition (second resin layer 4) is impregnated into the remaining portion of the fibrous base material 2 in which the first resin composition is not impregnated (hereinafter referred to as "second impregnation portion 41"). Thereby, a part of the first impregnation portion 31 of the first resin layer 3 and a part of the second impregnation portion 41 of the second resin layer 4 are located in the fiber base material 2. In the fiber base material 2, the first impregnation portion 31 (the lower surface of the first resin layer 3) is in contact with the second impregnation portion 41 (the upper surface of the second resin layer 4). In other words, the first resin composition is impregnated into the fiber base material 2 from the upper surface side of the fiber base material 2, and the second resin composition is impregnated into the fiber base material 2 from the lower surface side of the fiber base material 2, and the resin is used. The composition fills the voids in the fibrous substrate 2.

藉由該構成,纖維基材2可由第1樹脂層3與第2樹脂層4進行保護。結果,即便對積層片1施加來自外部的衝擊時,仍可防止纖維基材2本身遭受破壞,可確實發揮提升由纖維基材2所帶來的積層片1之機械強度的效果。With this configuration, the fiber base material 2 can be protected by the first resin layer 3 and the second resin layer 4. As a result, even when an impact from the outside is applied to the laminated sheet 1, the fiber base material 2 itself can be prevented from being damaged, and the effect of improving the mechanical strength of the laminated sheet 1 by the fiber base material 2 can be surely exhibited.

再者,較佳係微觀觀看纖維基材2內部的第1含浸部31與第2含浸部41間之界面20時,該界面20形成凹凸(參照圖1中的放大詳細圖)。藉此,不僅各樹脂層對纖維基材2的錨釘(anchor)效應,亦可提高樹脂層彼此間的密接性,並可更確實防止各樹脂層從纖維基材2上剝離。藉此,可達積層片1的耐久性提升。Further, when the interface 20 between the first impregnation portion 31 and the second impregnation portion 41 in the fiber base material 2 is microscopically observed, the interface 20 is formed with irregularities (see an enlarged detailed view in Fig. 1). Thereby, not only the anchor effect of each resin layer on the fiber base material 2 but also the adhesiveness between the resin layers can be improved, and the peeling of each resin layer from the fiber base material 2 can be prevented more reliably. Thereby, the durability of the laminated sheet 1 can be improved.

如前述,第2樹脂層4的可撓性係高於第1樹脂層3。當獲得此種大小關係時,較佳係設定為第1含浸部31的平均厚度ta1[μm]大於第2含浸部41的平均厚度tb1[μm](ta1>tb1)。理由如下。As described above, the flexibility of the second resin layer 4 is higher than that of the first resin layer 3. Upon obtaining such a magnitude relation, the preferred system setting the average thickness of the first portion 31 is impregnated t a1 [μm] greater than the average thickness of the second portion 41 is impregnated t b1 [μm] (t a1 > t b1). The reasons are as follows.

當將第2樹脂層4的可撓性設為高於第1樹脂層3時,會有第2樹脂層4的熱膨脹率(線膨脹係數)大於第1樹脂層3的傾向。故,若設為與「ta1>tb1」相反大小的關係「ta1<tb1」,當積層片1被加熱時,在纖維基材2的內部,第2含浸部41會出現較第1含浸部31更大的變形,會有纖維基材2的部分處出現翹曲之可能性。該纖維基材2的部分處之翹曲,會對積層片1整體造成頗大影響,有導致積層片1本身出現翹曲的可能性。When the flexibility of the second resin layer 4 is higher than that of the first resin layer 3, the thermal expansion coefficient (linear expansion coefficient) of the second resin layer 4 tends to be larger than that of the first resin layer 3. Therefore, if the set of "t a1> t b1" opposite size relationship "t a1 <t b1" when the laminated sheet 1 is heated, the inside of the fiber substrate 2, the second portion 41 there will be more impregnation of 1 The deformation of the impregnation portion 31 is greater, and there is a possibility that warpage may occur at a portion of the fibrous base material 2. The warpage at the portion of the fiber base material 2 has a considerable influence on the entire laminated sheet 1, and there is a possibility that warpage of the laminated sheet 1 itself is caused.

相對於此,若設為「ta1>tb1」,便可解決上述不良情況的發生,可防止或抑制積層片1發生翹曲情形。On the other hand, when "t a1 > t b1 " is set, the occurrence of the above-described problem can be solved, and the warpage of the laminated sheet 1 can be prevented or suppressed.

另外,所謂「第2樹脂層4的線膨脹係數高於第1樹脂層3的線膨脹係數」,係指25℃~300℃下的面方向及/或厚方向之平均線膨脹係數較高。In addition, the "linear expansion coefficient of the second resin layer 4 is higher than the linear expansion coefficient of the first resin layer 3" means that the average linear expansion coefficient in the plane direction and/or the thick direction at 25 ° C to 300 ° C is high.

具體而言,將纖維基材2的最大厚度設為T[μm]時,上述平均厚度ta1較佳係0.7T~0.95T、更佳係0.8T~0.9T。藉由將平均厚度ta1設定於該範圍內,可確實防止各樹脂層從纖維基材2剝離,同時更確實地防止或抑制積層片1發生翹曲情形。Specifically, when the maximum thickness of the fiber base material 2 is T [μm], the average thickness t a1 is preferably 0.7T to 0.95T, more preferably 0.8T to 0.9T. By setting the average thickness t a1 within this range, it is possible to surely prevent the peeling of the respective resin layers from the fiber base material 2 while more reliably preventing or suppressing the warpage of the laminated sheet 1.

再者,將第1樹脂層3除去第1含浸部31的部分(第1非含浸部32)之平均厚度設為ta2[μm],將第2樹脂層4除去第2含浸部41的部分(第2非含浸部42)的平均厚度設為tb2[μm]時,較佳係滿足ta2≦tb2的關係、更佳係滿足1.5×ta2<tb2的關係。藉由滿足此種關係,便可對積層片1上面側的部分賦予較高的剛性,故可在該積層片1的上面(第1非含浸部32上的支撐體5)依高加工性形成佈線部。另一方面,因為第2樹脂層4可具有高的可撓性與充分的厚度,故當在由積層片1所獲得之預浸片的第2樹脂層4(第2非含浸部42)中埋入由積層片1所獲得之其他預浸片的佈線部或其他纖維基材時,便可確實地執行該埋藏。亦即,可提升對由積層片1所獲得之其他預浸片的佈線部與其他纖維基材的埋入性。In addition, the average thickness of the portion (the first non-impregnated portion 32) in which the first resin layer 3 is removed from the first impregnation portion 31 is t a2 [μm], and the second resin layer 4 is removed from the second impregnation portion 41. When the average thickness of the (second non-impregnated portion 42) is t b2 [μm], it is preferable to satisfy the relationship of t a2 ≦t b2 and more preferably satisfy the relationship of 1.5 × t a2 < t b2 . By satisfying such a relationship, it is possible to impart high rigidity to the upper portion of the laminated sheet 1, so that the upper surface of the laminated sheet 1 (the support 5 on the first non-impregnated portion 32) can be formed with high workability. Wiring department. On the other hand, since the second resin layer 4 can have high flexibility and a sufficient thickness, it is in the second resin layer 4 (second non-impregnated portion 42) of the prepreg obtained from the laminated sheet 1. When the wiring portion or other fiber substrate of the other prepreg obtained by the laminated sheet 1 is buried, the burying can be surely performed. That is, the embedding property of the wiring portion of the other prepreg obtained by the laminated sheet 1 and other fibrous substrates can be improved.

具體而言,平均厚度ta2較佳係2~15μm、更佳係3~10μm。另一方面,平均厚度tb2較佳係3~20μm、更佳係5~15μm。Specifically, the average thickness t a2 is preferably 2 to 15 μm, more preferably 3 to 10 μm. On the other hand, the average thickness t b2 is preferably 3 to 20 μm, more preferably 5 to 15 μm.

另外,積層片1在圖1所示構成中,平均厚度ta2與平均厚度tb2間之大小關係為ta2<tb2,惟不僅限定於此,例如亦可為ta2>tb2,亦可為ta2=tb2Further, in the configuration shown in FIG. 1, the laminated sheet 1 has a magnitude relationship between the average thickness t a2 and the average thickness t b2 as t a2 <t b2 , but is not limited thereto, and may be, for example, t a2 >t b2 . Can be t a2 =t b2 .

再者,為能分別獲得具有上述特性的第1樹脂層3與第2樹脂層4,第1樹脂組成物與第2樹脂組成物較佳係設為如下述組成。In addition, in order to obtain the first resin layer 3 and the second resin layer 4 having the above characteristics, the first resin composition and the second resin composition are preferably formed as follows.

第1樹脂組成物係含有例如硬化性樹脂,視需要亦可含有硬化助劑(例如硬化劑、硬化促進劑等)及無機填充材中之至少1種而構成。The first resin composition contains, for example, a curable resin, and may contain at least one of a curing aid (for example, a curing agent, a curing accelerator, and the like) and an inorganic filler.

為提升與構成佈線部的金屬(支撐體5)間之密接性,可舉例如使用與金屬間之密接性優異的硬化性樹脂之方法、使用提升與金屬間之密接性的硬化助劑(例如硬化劑、硬化促進劑等)之方法、所使用的無機填充材係可溶於酸中的方法、以及併用無機填充材與有機填充材的方法等。In order to improve the adhesion to the metal (support 5) constituting the wiring portion, for example, a method of using a curable resin excellent in adhesion to metal and a curing aid for improving adhesion to metal (for example, for example) The method of the hardening agent, the hardening accelerator, etc.), the inorganic filler used, the method of being soluble in an acid, the method of using the inorganic filler and the organic filler, and the like.

該硬化性樹脂較佳係使用例如脲(尿素)樹脂、三聚氰胺樹脂、雙馬來醯亞胺樹脂、聚胺基甲酸酯樹脂、具苯并環的樹脂、氰酸酯樹脂、雙酚S型環氧樹脂、雙酚F型環氧樹脂、及雙酚S與雙酚F的共聚合環氧樹脂等熱硬化性樹脂。該等之中,硬化性樹脂特佳係使用氰酸酯樹脂(包括氰酸酯樹脂的預聚物)。The curable resin is preferably, for example, a urea (urea) resin, a melamine resin, a bismaleimide resin, a polyurethane resin, and a benzoate. A thermosetting resin such as a ring resin, a cyanate resin, a bisphenol S type epoxy resin, a bisphenol F type epoxy resin, and a copolymerized epoxy resin of bisphenol S and bisphenol F. Among these, a curable resin (a prepolymer including a cyanate resin) is particularly preferably used as the curable resin.

藉由使用熱硬化性樹脂(特別係氰酸酯樹脂),可減小積層片1的熱膨脹係數(以下亦稱「低熱膨脹化」)。且,亦可達成積層片1的電氣特性(低介電常數、低介電損耗)等之提升。By using a thermosetting resin (particularly a cyanate resin), the coefficient of thermal expansion of the laminated sheet 1 (hereinafter also referred to as "low thermal expansion") can be reduced. Further, an improvement in electrical characteristics (low dielectric constant, low dielectric loss) of the laminated sheet 1 can be achieved.

該氰酸酯樹脂係例如使鹵化氰化合物與酚類進行反應,且視需要利用加熱等方法施行預聚物化而可獲得。The cyanate resin is obtained by, for example, reacting a halogenated cyanide compound with a phenol, and if necessary, prepolymerizing by a method such as heating.

具體的氰酸酯樹脂係可舉例如酚醛型氰酸酯樹脂、雙酚A型氰酸酯樹脂、雙酚E型氰酸酯樹脂、四甲基雙酚F型氰酸酯樹脂等雙酚型氰酸酯樹脂等。該等之中,氰酸酯樹脂較佳係酚醛型氰酸酯樹脂。Specific examples of the cyanate resin include a bisphenol type such as a novolac type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, and a tetramethyl bisphenol F type cyanate resin. Cyanate resin and the like. Among these, the cyanate resin is preferably a novolac type cyanate resin.

若使用酚醛型氰酸酯樹脂,在製作後述基板10(參照圖7)後,硬化後的第1樹脂層3中交聯密度的增加,故可達成硬化後的第1樹脂層3(所獲得基板)之耐熱性與難燃性提升。When the phenolic-type cyanate resin is used, after the substrate 10 (see FIG. 7) described later is produced, the crosslinking density of the first resin layer 3 after curing increases, so that the cured first resin layer 3 can be obtained. The heat resistance and flame retardancy of the substrate are improved.

此處,耐熱性的提升可認為係因酚醛型氰酸酯樹脂在硬化反應後形成三環的緣故。又,難燃性的提升係可認為酚醛型氰酸酯樹脂在構造上苯環比例較高,故該苯環容易碳化(石墨化),導致在經硬化後的第1樹脂層3中出現碳化部分的緣故。Here, the improvement in heat resistance is considered to be due to the formation of three phenolic cyanate resins after the hardening reaction. The reason for the ring. Further, the improvement of the flame retardancy is considered to be that the phenolic type cyanate resin has a high proportion of the benzene ring in the structure, so that the benzene ring is easily carbonized (graphitized), resulting in carbonization in the hardened first resin layer 3. Part of the reason.

再者,若使用酚醛型氰酸酯樹脂,即便將積層片1施行薄型化(例如厚度35μm以下)的情況,仍可對積層片1賦予優異剛性。又,該硬化物在加熱時的剛性亦優異,故所獲得之基板10在安裝半導體元件500(參照圖8)時的可靠度亦優異。Further, when the phenolic-type cyanate resin is used, even if the laminated sheet 1 is made thinner (for example, having a thickness of 35 μm or less), the laminated sheet 1 can be provided with excellent rigidity. Moreover, since the cured product is excellent in rigidity at the time of heating, the obtained substrate 10 is also excellent in reliability when the semiconductor element 500 (see FIG. 8) is mounted.

具體可使用式(I)所示酚醛型氰酸酯樹脂。Specifically, a novolac type cyanate resin represented by the formula (I) can be used.

[化1][Chemical 1]

式(I)所示酚醛型氰酸酯樹脂中,其平均重複單位數「n」並無特別的限定,較佳係1~10、更佳係2~7。若平均重複單位數「n」未滿上述下限值,因為酚醛型氰酸酯樹脂容易結晶化,故對通用溶劑的溶解性會降低。故,依照酚醛型氰酸酯樹脂的含有量等因素,會有第1樹脂組成物的清漆難以取用之情況。又,在製作積層片1時會出現黏性,導致由積層片1所獲得之預浸片彼此間相接觸時會出現相互附著、或其中一預浸片的第1樹脂組成物移往於另一預浸片的現象(轉印)。另一方面,若平均重複單位數「n」超過上述上限值,會有第1樹脂組成物的清漆黏度變為過高,導致製作積層片1時的效率(第1樹脂層3之成形性)降低之情況。In the phenolic cyanate resin represented by the formula (I), the average repeating unit number "n" is not particularly limited, but is preferably 1 to 10, more preferably 2 to 7. When the average repeating unit number "n" is less than the above lower limit value, since the novolac type cyanate resin is easily crystallized, the solubility in a general-purpose solvent is lowered. Therefore, depending on factors such as the content of the phenolic cyanate resin, the varnish of the first resin composition may be difficult to obtain. Further, when the laminated sheet 1 is produced, stickiness occurs, and when the prepreg obtained by the laminated sheet 1 comes into contact with each other, adhesion occurs, or the first resin composition of one of the prepreg sheets moves to another The phenomenon of a prepreg (transfer). On the other hand, when the average number of repeating units "n" exceeds the above upper limit value, the varnish viscosity of the first resin composition becomes too high, and the efficiency in producing the laminated sheet 1 (formability of the first resin layer 3) ) Reduce the situation.

再者,併用後述提升與金屬間之密接性用的硬化劑或硬化促進劑時,除上述硬化性樹脂之外,尚可使用例如酚酚醛樹脂、甲酚酚醛樹脂、雙酚A酚醛樹脂等酚醛型酚樹脂;未改質的酚醛酚樹脂、或經諸如桐油、亞麻仁油、核桃油等改質的油改質酚醛酚樹脂等酚醛型酚樹脂等酚樹脂;雙酚A環氧樹脂、雙酚F環氧樹脂等雙酚型環氧樹脂;酚醛環氧樹脂、甲酚酚醛環氧樹脂等酚醛型環氧樹脂;聯苯型環氧樹脂等環氧樹脂;不飽和聚酯樹脂、鄰苯二甲酸二烯丙酯樹脂、聚矽氧樹脂等其他的熱硬化性樹脂。When a curing agent or a curing accelerator for improving the adhesion to the metal is used in combination, a phenolic phenol resin, a cresol novolac resin, or a phenolic phenol resin such as a bisphenol A phenol resin may be used in addition to the curable resin. Phenolic resin; unmodified phenolic phenol resin, or phenolic resin such as phenolic phenolic resin modified by tung oil, linseed oil, walnut oil, etc.; bisphenol A epoxy resin, double Bisphenol type epoxy resin such as phenol F epoxy resin; phenolic epoxy resin such as phenolic epoxy resin and cresol novolac epoxy resin; epoxy resin such as biphenyl type epoxy resin; unsaturated polyester resin, ortho benzene Other thermosetting resins such as diallyl dicarboxylate resin and polyfluorene oxide resin.

再者,在硬化性樹脂中,除了熱硬化性樹脂之外,尚可使用例如紫外線硬化性樹脂、厭氣硬化性樹脂等。Further, in the curable resin, for example, an ultraviolet curable resin, an anaerobic resin, or the like can be used in addition to the thermosetting resin.

硬化性樹脂的含有量並無特別的限定,較佳係佔第1樹脂組成物全體的5~50重量%、更佳係10~40重量%。若硬化性樹脂含有量未滿上述下限值,依照硬化性樹脂的種類等,會有第1樹脂組成物的清漆黏度過低,導致較難形成積層片1的情況。另一方面,若硬化性樹脂含有量超過上述上限值,則因為其他成分之量過少,故依照硬化性樹脂的種類等,會有積層片1的機械強度降低之情況。The content of the curable resin is not particularly limited, but is preferably 5 to 50% by weight, more preferably 10 to 40% by weight based on the total of the first resin composition. When the content of the curable resin is less than the above lower limit, the varnish viscosity of the first resin composition may be too low depending on the type of the curable resin, etc., and it may be difficult to form the laminated sheet 1. On the other hand, when the content of the curable resin is more than the above-mentioned upper limit, the amount of the other component is too small, and the mechanical strength of the laminated sheet 1 may be lowered depending on the type of the curable resin or the like.

上述硬化助劑(例如硬化劑、硬化促進劑等)係可舉例如三乙胺、三丁胺、二氮雜雙環[2,2,2]辛烷等三級胺類;2-乙基-4-乙基咪唑、2-苯基-4-甲基咪唑、2-苯基-4-甲基-5-羥甲基咪唑、2-苯基-4,5-二羥甲基咪唑、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-s-三、2,4-二胺基-6-(2'-十一烷基咪唑基)-乙基-s-三、2,4-二胺基-6-[2'-乙基-4-甲基咪唑基-(1')]-乙基-s-三、1-苄基-2-苯基咪唑等咪唑化合物。The above-mentioned curing aid (for example, a curing agent, a curing accelerator, etc.) may, for example, be a tertiary amine such as triethylamine, tributylamine or diazabicyclo[2,2,2]octane; 2-ethyl- 4-ethylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2 ,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-three 2,4-Diamino-6-(2'-undecylimidazolyl)-ethyl-s-three 2,4-Diamino-6-[2'-ethyl-4-methylimidazolyl-(1')]-ethyl-s-three An imidazole compound such as 1-benzyl-2-phenylimidazole.

該等之中,硬化助劑較佳係具有2個以上之從脂肪族烴基、芳香族烴基、羥烷基及氰烷基中選擇的官能基之咪唑化合物,更佳係2-苯基-4,5-二羥甲基咪唑。Among these, the curing aid is preferably an imidazole compound having two or more functional groups selected from the group consisting of an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a hydroxyalkyl group, and a cyanoalkyl group, and more preferably a 2-phenyl-4 group. , 5-dimethylol imidazole.

再者,第1樹脂組成物中,亦可組合使用例如環烷酸鋅、環烷酸鈷、辛酸錫、辛酸鈷、雙乙醯丙酮酸鈷(II)、參乙醯丙酮酸鈷(III)等有機金屬鹽;酚、雙酚A、壬酚等酚化合物;、醋酸、苯甲酸、水楊酸、對甲苯磺酸等有機酸等等。Further, in the first resin composition, for example, zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octoate, cobalt (II) acetoacetate, and cobalt (III) acetyl acetonate may be used in combination. And other organic metal salts; phenolic compounds such as phenol, bisphenol A, and indophenol; and organic acids such as acetic acid, benzoic acid, salicylic acid, p-toluenesulfonic acid, and the like.

當使用硬化助劑的情況,其含有量較佳係佔第1樹脂組成物全體的0.01~3重量%、更佳係0.1~1重量%。When a curing aid is used, the content thereof is preferably from 0.01 to 3% by weight, more preferably from 0.1 to 1% by weight based on the total of the first resin composition.

再者,第1樹脂組成物較佳係含有無機填充材。藉此,即便將積層片1薄型化(例如厚度35μm以下),仍可獲得機械強度優異的積層片1。且,亦可提升積層片1的低熱膨脹化。Further, the first resin composition preferably contains an inorganic filler. Thereby, even if the laminated sheet 1 is made thin (for example, the thickness is 35 μm or less), the laminated sheet 1 excellent in mechanical strength can be obtained. Moreover, the low thermal expansion of the laminated sheet 1 can also be improved.

無機填充材係可舉例如滑石、氧化鋁、玻璃、熔融二氧化矽之類的二氧化矽,或雲母、氫氧化鋁、氫氧化鎂等。又,配合無機填充材的使用目的,可適當選擇破碎狀、球狀物。該等之中,從低熱膨脹性優異的觀點而言,無機填充劑較佳係二氧化矽、更佳係熔融二氧化矽(特別係球狀熔融二氧化矽)。Examples of the inorganic filler include cerium oxide such as talc, alumina, glass, and molten cerium oxide, or mica, aluminum hydroxide, magnesium hydroxide, or the like. Further, in accordance with the purpose of use of the inorganic filler, a crushed shape or a spherical shape can be appropriately selected. Among these, from the viewpoint of excellent low thermal expansion property, the inorganic filler is preferably cerium oxide, more preferably molten cerium oxide (especially spherical molten cerium oxide).

無機填充材的平均粒徑較佳係0.01~5.0μm、更佳係0.2~2.0μm。另外,該平均粒徑係例如可利用粒度分佈計(HORIBA製「LA-500」)進行測定。The average particle diameter of the inorganic filler is preferably 0.01 to 5.0 μm, more preferably 0.2 to 2.0 μm. In addition, the average particle diameter can be measured, for example, by a particle size distribution meter ("LA-500" manufactured by HORIBA).

尤其,無機填充材較佳係平均粒徑5.0μm以下的球狀熔融二氧化矽、更佳係平均粒徑0.01~2.0μm(特別係0.1~0.5μm)的球狀熔融二氧化矽。藉此,可更確實地使第1樹脂組成物的清漆含浸於纖維基材2內,且亦可在所形成之第1樹脂層3(第1含浸部31)的纖維基材2內部之面上,更確實地形成凹凸。In particular, the inorganic filler is preferably a spherical molten cerium oxide having an average particle diameter of 5.0 μm or less, more preferably a spherical molten cerium oxide having an average particle diameter of 0.01 to 2.0 μm (particularly 0.1 to 0.5 μm). Thereby, the varnish of the first resin composition can be more reliably impregnated into the fiber base material 2, and the inside of the fiber base material 2 of the first resin layer 3 (first impregnation portion 31) to be formed can be formed. On the upper side, the unevenness is formed more reliably.

再者,為提升第1樹脂層3與佈線部間之密接性,無機填充材亦可使用可溶於酸中的無機填充材。藉此,當佈線部(導體層)係利用鍍敷法形成於第1樹脂層3上的情況,可提升該佈線部對第1樹脂層3的密接性(鍍敷密接性)。該可溶於酸中的無機填充材係可舉例如碳酸鈣、氧化鋅、氧化鐵等金屬氧化物等。Further, in order to improve the adhesion between the first resin layer 3 and the wiring portion, an inorganic filler which is soluble in an acid may be used as the inorganic filler. By this, when the wiring portion (conductor layer) is formed on the first resin layer 3 by a plating method, the adhesion (plating adhesion) of the wiring portion to the first resin layer 3 can be improved. The inorganic filler which is soluble in an acid may, for example, be a metal oxide such as calcium carbonate, zinc oxide or iron oxide.

再者,為提升第1樹脂層3與佈線部間之密接性,亦可併用無機填充材與有機填充材。該有機填充材係可舉例如液晶聚合物、聚醯亞胺等樹脂系填充材。Further, in order to improve the adhesion between the first resin layer 3 and the wiring portion, an inorganic filler and an organic filler may be used in combination. The organic filler is, for example, a resin-based filler such as a liquid crystal polymer or a polyimide.

使用無機填充材的情況,其含有量並無特別的限定,較佳係佔第1樹脂組成物全體的20~70重量%、更佳係30~60重量%。In the case of using an inorganic filler, the content thereof is not particularly limited, but is preferably 20 to 70% by weight, more preferably 30 to 60% by weight based on the total of the first resin composition.

當硬化性樹脂係使用氰酸酯樹脂(特別係酚醛型氰酸酯樹脂)的情況,較佳係併用環氧樹脂(實質上不含鹵原子)。該環氧樹脂係可舉例如酚酚醛型環氧樹脂、雙酚型環氧樹脂、萘型環氧樹脂、芳香伸烷型環氧樹脂等。When a curable resin is used as the curable resin (particularly a phenolic cyanate resin), it is preferred to use an epoxy resin (substantially free of halogen atoms). Examples of the epoxy resin include a phenol novolak type epoxy resin, a bisphenol type epoxy resin, a naphthalene type epoxy resin, and an aromatic alkylene type epoxy resin.

該等之中,環氧樹脂較佳係芳香伸烷型環氧樹脂。藉由使用芳香伸烷型環氧樹脂,硬化後的第1樹脂層3(所獲得基板)可提升吸濕焊錫耐熱性(吸濕後的焊錫耐熱性)與難燃性。Among these, the epoxy resin is preferably an aromatic alkylene type epoxy resin. By using an aromatic paraffin-type epoxy resin, the cured first resin layer 3 (the obtained substrate) can improve the heat resistance of the moisture-absorbing solder (solder heat resistance after moisture absorption) and the flame retardancy.

所謂「芳香伸烷型環氧樹脂」係指重複單位中具有一個以上之芳基伸烷基的環氧樹脂,可舉例如伸苯二甲基型環氧樹脂、聯苯二亞甲基型環氧樹脂等。該等之中,芳香伸烷型環氧樹脂較佳係聯苯二亞甲基型環氧樹脂。The "aromatic alkylene type epoxy resin" refers to an epoxy resin having one or more arylalkylene groups in a repeating unit, and examples thereof include a benzoyl type epoxy resin and a biphenyl dimethylene type epoxy resin. Resin, etc. Among these, the aromatic alkylene type epoxy resin is preferably a biphenyl dimethylene type epoxy resin.

具體係可使用式(II)所示聯苯二亞甲基型環氧樹脂。Specifically, a biphenyl dimethylene type epoxy resin represented by the formula (II) can be used.

[化2][Chemical 2]

式(II)所示聯苯二亞甲基型環氧樹脂的平均重複單位數「n」並無特別的限定,較佳係1~10、更佳係2~5。若平均重複單位數「n」未滿上述下限值,因為聯苯二亞甲基型環氧樹脂容易結晶化,故對通用溶劑的溶解性會降低。故,會有第1樹脂層組成物的清漆難以取用之情況。另一方面,若平均重複單位數「n」超過上述上限值,依照所使用溶劑,會有第1樹脂組成物的清漆黏度上升之可能性。此情況,無法將第1樹脂組成物充分地含浸於纖維基材2中,結果成為積層片1的成形不良與機械強度降低之原因。The average repeating unit number "n" of the biphenyl dimethylene type epoxy resin represented by the formula (II) is not particularly limited, but is preferably 1 to 10, more preferably 2 to 5. When the average repeating unit number "n" is less than the above lower limit value, since the biphenyl dimethylene type epoxy resin is easily crystallized, the solubility in a general-purpose solvent is lowered. Therefore, there is a case where the varnish of the first resin layer composition is difficult to access. On the other hand, when the average repeating unit number "n" exceeds the above upper limit value, the varnish viscosity of the first resin composition may increase depending on the solvent to be used. In this case, the first resin composition cannot be sufficiently impregnated into the fiber base material 2, and as a result, the molding failure of the laminated sheet 1 and the mechanical strength are lowered.

併用環氧樹脂的情況,其含有量並無特別的限定,較佳係佔第1樹脂組成物全體的1~55重量%、更佳係2~40重量%。In the case of using an epoxy resin, the content thereof is not particularly limited, and is preferably from 1 to 55% by weight, more preferably from 2 to 40% by weight, based on the total of the first resin composition.

再者,在第1樹脂組成物中亦可添加提升與金屬間之密接性的成分(包括樹脂等)。該成分係可舉例如苯氧樹脂、聚乙烯醇系樹脂、偶合劑等。Further, a component (including a resin or the like) for improving the adhesion to the metal may be added to the first resin composition. The component may, for example, be a phenoxy resin, a polyvinyl alcohol resin, a coupling agent or the like.

苯氧樹脂係可舉例如具雙酚骨架的苯氧樹脂、具萘骨架的苯氧樹脂、具聯苯基骨架的苯氧樹脂等。又,亦可使用具有該等骨架複數種之構造的苯氧樹脂。Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, and a phenoxy resin having a biphenyl skeleton. Further, a phenoxy resin having a structure of a plurality of skeletons may be used.

該等之中,苯氧樹脂較佳係使用具有聯苯基骨架與雙酚S骨架的苯氧樹脂。藉此,利用聯苯基骨架所具有的剛硬性,可提高苯氧樹脂的玻璃轉移溫度,並可利用雙酚S骨架的存在,而提升苯氧樹脂與金屬間之密接性。結果,可達第1樹脂層3的耐熱性提升,且當製造多層基板之際,亦可提升佈線部(金屬)對第1樹脂層3的密接性。Among these, a phenoxy resin preferably uses a phenoxy resin having a biphenyl skeleton and a bisphenol S skeleton. Thereby, the glass transition temperature of the phenoxy resin can be increased by the rigidity of the biphenyl skeleton, and the adhesion between the phenoxy resin and the metal can be improved by utilizing the presence of the bisphenol S skeleton. As a result, the heat resistance of the first resin layer 3 can be improved, and the adhesion of the wiring portion (metal) to the first resin layer 3 can be improved when the multilayer substrate is manufactured.

再者,苯氧樹脂使用具雙酚A骨架與雙酚F骨架的苯氧樹脂亦佳。藉此,在多層基板製造時,可更加提升佈線部對第1樹脂層3的密接性。Further, the phenoxy resin is preferably a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton. Thereby, in the production of the multilayer substrate, the adhesion of the wiring portion to the first resin layer 3 can be further improved.

苯氧樹脂的分子量並無特別的限定,重量平均分子量較佳係5,000~70,000、更佳係10,000~60,000。The molecular weight of the phenoxy resin is not particularly limited, and the weight average molecular weight is preferably 5,000 to 70,000, more preferably 10,000 to 60,000.

使用苯氧樹脂的情況,其含有量並無特別的限定,較佳係佔第1樹脂組成物全體的1~40重量%、更佳係5~30重量%。In the case of using a phenoxy resin, the content thereof is not particularly limited, and is preferably from 1 to 40% by weight, more preferably from 5 to 30% by weight based on the total of the first resin composition.

偶合劑較佳係使用從例如環氧矽烷偶合劑、鈦酸酯系偶合劑、胺基矽烷偶合劑、及聚矽氧油型偶合劑中選擇之1種以上。The coupling agent is preferably one or more selected from the group consisting of, for example, an epoxy decane coupling agent, a titanate coupling agent, an amino decane coupling agent, and a polyoxygen oxy-type coupling agent.

使用偶合劑的情況,其含有量並無特別的限定,相對於無機填充材100重量份,較佳係0.05~3重量份、更佳係0.1~2重量份。In the case of using a coupling agent, the content thereof is not particularly limited, and is preferably 0.05 to 3 parts by weight, more preferably 0.1 to 2 parts by weight, per 100 parts by weight of the inorganic filler.

再者,第1樹脂組成物係除了以上所說明成分之外,視需要尚可含有諸如:消泡劑、均塗劑、顏料、抗氧化劑等添加劑。Further, the first resin composition may contain additives such as an antifoaming agent, a leveling agent, a pigment, and an antioxidant, in addition to the components described above.

第2樹脂組成物係與第1樹脂組成物不同的組成,具體而言,第2樹脂層4係設定為可撓性高於第1樹脂層3的組成。另外,所謂「組成不同」係指第1樹脂組成物與第2樹脂組成物非由相同樹脂組成物構成,例如有構成第1樹脂組成物的成分至少一者不同於第2樹脂組成物的情況,以及構成第1樹脂組成物的成分含有量不同於第2樹脂組成物的情況等。更具體而言,藉由使樹脂或填充材等的種類及含有量、樹脂的分子量(平均重複單位數)等之至少一者不同,第2樹脂組成物的組成便會不同於第1樹脂組成物。結果,第2樹脂層4便具有與第1樹脂層3不同的特性。The second resin layer 4 is different in composition from the first resin composition. Specifically, the second resin layer 4 is set to have a higher flexibility than the first resin layer 3 . In addition, the "different composition" means that the first resin composition and the second resin composition are not composed of the same resin composition, and for example, at least one of the components constituting the first resin composition is different from the second resin composition. And the case where the component content of the first resin composition is different from that of the second resin composition. More specifically, the composition of the second resin composition is different from that of the first resin composition by at least one of the type and content of the resin, the filler, and the like, and the molecular weight (average number of repeating units) of the resin. Things. As a result, the second resin layer 4 has characteristics different from those of the first resin layer 3.

該第2樹脂層4的面方向、即積層片1的長邊方向(X方向)及寬度方向(Y方向)之熱膨脹係數並無特別的限定,較佳係20ppm/℃以下、更佳係5~16ppm/℃。若第2樹脂層4的熱膨脹係數在上述範圍內,積層片1便可具有高的連接可靠度,所獲得之基板對半導體元件等的安裝可靠度優異。The thermal expansion coefficient of the surface direction of the second resin layer 4, that is, the longitudinal direction (X direction) and the width direction (Y direction) of the laminated sheet 1 is not particularly limited, but is preferably 20 ppm/° C. or less, and more preferably 5 ~16ppm/°C. When the thermal expansion coefficient of the second resin layer 4 is within the above range, the laminated sheet 1 can have high connection reliability, and the obtained substrate is excellent in mounting reliability to a semiconductor element or the like.

再者,積層片1整體的面方向熱膨脹係數並無特別的限定,較佳係16ppm/℃以下、更佳係12ppm/℃以下、特佳係5~10ppm/℃。若積層片1的熱膨脹係數在上述範圍內,可提升所獲得之基板對重複熱衝擊的耐龜裂性。Further, the thermal expansion coefficient in the plane direction of the entire laminated sheet 1 is not particularly limited, but is preferably 16 ppm/° C. or less, more preferably 12 ppm/° C. or less, and particularly preferably 5 to 10 ppm/° C. If the thermal expansion coefficient of the laminated sheet 1 is within the above range, the crack resistance of the obtained substrate against repeated thermal shock can be improved.

面方向的熱膨脹係數係例如可使用TMA裝置(TA Instruments公司製),依10℃/分的升溫進行評價。The thermal expansion coefficient in the surface direction can be evaluated, for example, by using a TMA apparatus (manufactured by TA Instruments Co., Ltd.) at a temperature rise of 10 ° C /min.

另外,該積層片1亦可在第2樹脂層4與纖維基材2相反側之面上,設置例如未圖示樹脂薄膜等。此情況,積層片1係經剝離該樹脂薄膜之後才使用。另外,樹脂薄膜係可使用與作為支撐體5的樹脂薄膜所說明者為同樣者。In addition, the laminated sheet 1 may be provided with, for example, a resin film (not shown) on the surface of the second resin layer 4 opposite to the fiber base material 2. In this case, the laminated sheet 1 is used after peeling off the resin film. Further, the resin film can be the same as those described for the resin film as the support 5 .

其次,針對積層片的另一構造例進行說明。另外,以與前述積層片1的相異處為中心進行說明,相關同樣的事項係省略說明。Next, another structural example of the laminated sheet will be described. In addition, the description will be made focusing on the difference from the laminated sheet 1, and the same matters will be omitted.

如圖2(a)所示,積層片1A係在纖維基材2的厚度方向未含浸有第1樹脂組成物(第1樹脂層3)與第2樹脂組成物(第2樹脂層4)。例如藉由調整供應第1樹脂組成物的位置,使第1樹脂組成物乾燥,亦可形成如圖2(a)所示幾乎未含浸第1樹脂組成物的構造。又,藉由將清漆狀第2樹脂組成物的黏度設為非常高,或如圖5所示,利用貼合裝置65施行加熱時,將薄片狀第2樹脂組成物的熔融黏度設為非常高,便可成為如圖2(a)所示幾乎未含浸第2樹脂組成物的構造。As shown in Fig. 2 (a), the laminated sheet 1A is not impregnated with the first resin composition (first resin layer 3) and the second resin composition (second resin layer 4) in the thickness direction of the fiber base material 2. For example, by adjusting the position at which the first resin composition is supplied, the first resin composition is dried, and a structure in which the first resin composition is hardly impregnated as shown in Fig. 2(a) can be formed. In addition, when the viscosity of the varnish-like second resin composition is extremely high, or as shown in FIG. 5, when the heating is performed by the bonding device 65, the melt viscosity of the flaky second resin composition is extremely high. Thus, the structure in which the second resin composition is hardly impregnated as shown in Fig. 2(a) can be obtained.

如圖2(b)所示,積層片1B在纖維基材2的厚度方向整體係含浸有第1樹脂組成物,但並未含浸第2樹脂組成物。As shown in Fig. 2 (b), the laminated sheet 1B is impregnated with the first resin composition as a whole in the thickness direction of the fibrous base material 2, but the second resin composition is not impregnated.

如圖2(c)所示,積層片1C係在纖維基材2的厚度方向整體含浸有第2樹脂組成物,但並未含浸第1樹脂組成物。例如藉由調整供應第1樹脂組成物的位置,使第1樹脂組成物乾燥,亦可成為如圖2(c)所示幾乎未含浸第1樹脂組成物的構造。As shown in Fig. 2 (c), the laminated sheet 1C is impregnated with the second resin composition as a whole in the thickness direction of the fibrous base material 2, but the first resin composition is not impregnated. For example, by adjusting the position at which the first resin composition is supplied, the first resin composition is dried, and the first resin composition is hardly impregnated as shown in FIG. 2(c).

如圖2(d)所示,積層片1D係在纖維基材2的厚度方向其中一部分含浸有第1樹脂組成物,但未含浸第2樹脂組成物。As shown in Fig. 2(d), the laminated sheet 1D is partially impregnated with the first resin composition in the thickness direction of the fibrous base material 2, but is not impregnated with the second resin composition.

如圖2(e)所示,積層片1E係在纖維基材2的厚度方向其中一部分含浸第2樹脂組成物,但並未含浸第1樹脂組成物。例如藉由調整供應第1樹脂組成物的位置,使第1樹脂組成物乾燥,亦可成為如圖2(e)所示幾乎未含浸第1樹脂組成物的構造。As shown in Fig. 2(e), the laminated sheet 1E is partially impregnated with the second resin composition in the thickness direction of the fibrous base material 2, but is not impregnated with the first resin composition. For example, by adjusting the position at which the first resin composition is supplied, the first resin composition is dried, and the first resin composition may be hardly impregnated as shown in FIG. 2(e).

如圖2(f)所示,積層片1F係省略第2樹脂層(第2樹脂組成物)。又,圖示的構造係在纖維基材2的厚度方向未含浸第1樹脂組成物。例如藉由調整供應第1樹脂組成物的位置,使第1樹脂組成物乾燥,亦可成為如圖2(f)所示幾乎未含浸第1樹脂組成物的構造。As shown in FIG. 2(f), the laminated sheet 1F omits the second resin layer (second resin composition). Moreover, the structure shown in the figure is not impregnated with the first resin composition in the thickness direction of the fiber base material 2. For example, by adjusting the position at which the first resin composition is supplied, the first resin composition is dried, and the first resin composition may be hardly impregnated as shown in FIG. 2(f).

另外,其他尚可舉出在纖維基材2的厚度方向整體含浸有第1樹脂組成物者、或在纖維基材2的厚度方向其中一部分含浸有第1樹脂組成物者等。In addition, the first resin composition is impregnated in the entire thickness direction of the fiber base material 2, or the first resin composition is partially impregnated in the thickness direction of the fiber base material 2.

以上所說明的積層片1A~1E亦與前述積層片1同樣,第1樹脂組成物與第2樹脂組成物係可為相互組成不同、亦可為相互組成相同。Similarly to the laminated sheet 1 described above, the laminated sheets 1A to 1E described above may have the same composition of the first resin composition and the second resin composition, or may have the same composition.

<積層片製造裝置><Laminar sheet manufacturing apparatus>

其次,針對本發明積層片之製造方法的實施形態中所使用的積層片製造裝置,即積層片製造時所使用的積層片製造裝置構造例進行說明。參照圖3~圖5進行說明。Next, the laminated sheet manufacturing apparatus used in the embodiment of the method for producing a laminated sheet of the present invention, that is, the structural example of the laminated sheet manufacturing apparatus used in the production of the laminated sheet will be described. Description will be made with reference to Figs. 3 to 5 .

本發明製造裝置的概要係如下述。The outline of the manufacturing apparatus of the present invention is as follows.

製造裝置係具備有:連續饋送出支撐體5的手段621;連續饋送出纖維基材2的手段623;對上述支撐體5與上述纖維基材2之間供應液狀第1樹脂組成物的供應手段611~613(或611);以及隔著第1樹脂組成物,將上述支撐體5與上述纖維基材2施行壓接的壓接手段625。而製造裝置係具備有對利用上述供應手段進行的上述液狀第1樹脂組成物之供應位置進行調整的調整手段661~663(或使供應手段611改變位置的手段)。The manufacturing apparatus includes: means 621 for continuously feeding out the support 5; means 623 for continuously feeding out the fibrous base material 2; and supplying a liquid first resin composition between the support 5 and the fibrous base 2 Means 611 to 613 (or 611); and a pressure bonding means 625 for pressing the support 5 and the fiber base material 2 via the first resin composition. Further, the manufacturing apparatus includes adjustment means 661 to 663 (or means for changing the position of the supply means 611) for adjusting the supply position of the liquid first resin composition by the supply means.

圖3所示積層片製造裝置6、圖4所示積層片製造裝置6a、圖5所示積層片製造裝置6b,分別係連續製造積層片的裝置。而積層片製造裝置6與6a係可對應於後述積層片之製造方法的第1實施形態與第2實施形態。又,積層片製造裝置6b係可對應於後述積層片之製造方法的第3實施形態與第4實施形態。The laminated sheet manufacturing apparatus 6 shown in Fig. 3, the laminated sheet manufacturing apparatus 6a shown in Fig. 4, and the laminated sheet manufacturing apparatus 6b shown in Fig. 5 are apparatuses for continuously producing a laminated sheet. The laminated sheet manufacturing apparatuses 6 and 6a can correspond to the first embodiment and the second embodiment of the method for producing a laminated sheet to be described later. Further, the laminated sheet manufacturing apparatus 6b can correspond to the third embodiment and the fourth embodiment of the method for producing a laminated sheet to be described later.

(積層片製造裝置6)(Laminated sheet manufacturing apparatus 6)

首先,針對積層片製造裝置6進行說明。First, the laminated sheet manufacturing apparatus 6 will be described.

如圖3所示,積層片製造裝置6係具備有輥(roll)621~628、噴嘴(狹縫式塗佈機)611~614、及乾燥裝置64。 As shown in FIG. 3, the laminated sheet manufacturing apparatus 6 is equipped with rolls 621-628, nozzles (slit coater) 611-614, and drying apparatus 64.

輥621係饋送出(繞出)對象物的手段,在該輥621上捲繞著支撐體5。輥621係構成為利用未圖示之馬達(驅動源)進行旋轉,若該輥621旋轉,則從輥621饋送出支撐體5(連續的供應)。 The roller 621 is a means for feeding out (circling) the object, and the support 5 is wound around the roller 621. The roller 621 is configured to be rotated by a motor (drive source) (not shown), and when the roller 621 is rotated, the support 5 is fed from the roller 621 (continuous supply).

再者,輥623係饋送出對象物的手段,在該輥623上捲繞著纖維基材2。輥623係構成為利用未圖示之馬達進行旋轉,若該輥623旋轉,則從輥623饋送出纖維基材2(連續的供應)。 Further, the roller 623 is a means for feeding out an object, and the fiber base material 2 is wound around the roller 623. The roller 623 is configured to be rotated by a motor (not shown), and when the roller 623 is rotated, the fiber base material 2 is fed from the roller 623 (continuous supply).

再者,輥622係規範支撐體5之移動方向的手段,設置於輥621的後段。 Further, the roller 622 is a means for regulating the moving direction of the support 5, and is provided at the rear stage of the roller 621.

再者,輥624係規範纖維基材2之移動方向的手段,設置於輥623的後段。 Further, the roller 624 is a means for regulating the moving direction of the fiber base material 2, and is provided in the rear stage of the roller 623.

再者,輥625係規範對象物之移動方向,且將對象物彼此間(亦即支撐體5與纖維基材2)予以貼合的手段,設置於輥622與624的後段。 Further, the roller 625 is a means for guiding the moving direction of the object, and the means for bonding the objects to each other (that is, the support 5 and the fiber base material 2) are provided in the rear stage of the rollers 622 and 624.

沿該輥625的外周面,依直接接觸上述外周面的方式搬送支撐體5。此時,支撐體5係面接觸到輥625的圓周之1/4以上。 The support body 5 is conveyed along the outer peripheral surface of the roller 625 so as to directly contact the outer peripheral surface. At this time, the support body 5 is in contact with the 1/4 or more of the circumference of the roller 625.

再者,纖維基材2亦是沿輥625的外周面,依接觸到上述外周面的方式進行搬送。纖維基材2係在輥625接觸到支撐體5的處所,隔著支撐體5接觸到輥625。其中,纖維基材 2與輥625間之接觸面積係小於支撐體5與輥625間之接觸面積。具體而言,支撐體5係依輥625的圓周之1/4~1/2進行面接觸,相對於此,纖維基材2係依輥625的圓周之1/6~1/4進行面接觸。藉此,可降低對纖維基材2所施加的張力,俾可抑制纖維基材2的變形。 Further, the fiber base material 2 is also conveyed so as to be in contact with the outer peripheral surface along the outer peripheral surface of the roller 625. The fiber base material 2 is in a position where the roller 625 contacts the support body 5, and contacts the roller 625 via the support body 5. Among them, the fiber substrate The contact area between the 2 and the roller 625 is smaller than the contact area between the support 5 and the roller 625. Specifically, the support 5 is in surface contact with 1/4 to 1/2 of the circumference of the roller 625, whereas the fiber substrate 2 is in surface contact with 1/6 to 1/4 of the circumference of the roller 625. . Thereby, the tension applied to the fiber base material 2 can be reduced, and the deformation of the fiber base material 2 can be suppressed.

再者,雖於後亦有詳述,纖維基材2與支撐體5會被朝饋送出方向拉伸,並對該等施加張力。 Further, although detailed later, the fibrous base material 2 and the support 5 are stretched in the feeding direction, and tension is applied thereto.

藉此,利用輥625的外周面,便可將支撐體5與纖維基材2隔著第1樹脂組成物進行壓接。另外,本實施形態中,並沒有配置相對於輥625為對向配置,且用以將支撐體5與纖維基材2施行壓接的輥。 Thereby, the support body 5 and the fiber base material 2 can be pressure-bonded via the 1st resin composition by the outer peripheral surface of the roll 625. Further, in the present embodiment, the roller which is disposed opposite to the roller 625 and which presses the support 5 and the fiber base material 2 is not disposed.

此處,輥625係至少表面由金屬構成的金屬輥。此種金屬輥係表面平滑性高,可穩定地支撐著支撐體5、第1樹脂組成物及纖維基材2。故,可使第1樹脂組成物的纖維基材2寬度方向之重量分佈均勻。 Here, the roller 625 is a metal roller whose surface is made of at least metal. Such a metal roll has high surface smoothness and can stably support the support 5, the first resin composition, and the fiber base 2. Therefore, the weight distribution of the fiber base material 2 in the width direction of the first resin composition can be made uniform.

再者,輥626與輥627分別係規範對象物之移動方向的手段,在輥625的後段依此順序設置。 Further, the roller 626 and the roller 627 are means for regulating the moving direction of the object, respectively, and are disposed in this order in the subsequent stage of the roller 625.

再者,輥628係捲取對象物(即積層片1)的手段。輥628係構成為利用未圖示之馬達進行旋轉,若該輥628進行旋轉,積層片1便被捲取於輥628上。 Further, the roller 628 is a means for winding up the object (that is, the laminated sheet 1). The roller 628 is configured to rotate by a motor (not shown), and when the roller 628 rotates, the laminated sheet 1 is wound up on the roller 628.

噴嘴611~613分別係吐出(供應)常溫(25℃)下呈液狀(清漆狀)之第1樹脂組成物的手段(例如狹縫式塗佈機)。該供應手段係可調整液狀第1樹脂組成物的供應位置。亦即,該供應手段係可在支撐體5之其中一面、或纖維基材2之其中一面、或支撐體5之其中一面與纖維基材2之其中一面之間,選擇至少任1處所並供應液狀第1樹脂組成物。更詳細說明,供應手段係設有噴嘴611~613,噴嘴611係朝支撐體5的其中一面吐出液狀第1樹脂組成物,噴嘴612係朝纖維基材2的其中一面吐出第1樹脂組成物,噴嘴613係朝支撐體5的其中一面與纖維基材2的其中一面之間吐出液狀第1樹脂組成物。又,製造積層片1之際,從噴嘴611~613中選擇吐出第1樹脂組成物的至少1個噴嘴。藉此,使供應手段的供應位置(亦即吐出口的位置)被調整。該選擇係藉由在噴嘴611~613下游側的流路中分別設置之閥(調整手段)661~663進行開閉而實施。Each of the nozzles 611 to 613 is a means for discharging (supplying) a first resin composition which is liquid (varnish-like) at normal temperature (25 ° C) (for example, a slit coater). This supply means can adjust the supply position of the liquid first resin composition. That is, the supply means can select at least one of the one side of the support body 5, or one of the fiber base materials 2, or one of the support body 5 and one of the fiber base materials 2, and supply A liquid first resin composition. More specifically, the supply means is provided with nozzles 611 to 613, and the nozzle 611 discharges the liquid first resin composition toward one side of the support body 5, and the nozzle 612 discharges the first resin composition toward one side of the fiber base material 2. The nozzle 613 discharges a liquid first resin composition between one surface of the support 5 and one side of the fiber base material 2. When the laminated sheet 1 is produced, at least one nozzle that discharges the first resin composition is selected from the nozzles 611 to 613. Thereby, the supply position of the supply means (that is, the position of the discharge port) is adjusted. This selection is performed by opening and closing the valves (adjustment means) 661 to 663 provided in the flow paths on the downstream side of the nozzles 611 to 613.

另外,所謂「液狀」並不僅侷限於液體,亦涵蓋具流動性者的概念。In addition, the term "liquid" is not limited to liquids, but also covers the concept of fluidity.

再者,噴嘴614係朝支撐體5與第1樹脂組成物相反側之面上,吐出(供應)常溫(25℃)呈液狀(清漆狀)第2樹脂組成物的手段(例如狹縫式塗佈機)。Further, the nozzle 614 is a means for discharging (supplying) a second resin composition in a liquid state (varnish-like) at a normal temperature (25 ° C) toward the surface of the support 5 opposite to the first resin composition (for example, a slit type) Coating machine).

乾燥裝置64係設置於噴嘴614(輥625)與輥626之間。乾燥裝置64在本實施形態中係使用將對象物(第2樹脂組成物、纖維基材2、第1樹脂組成物、支撐體5)一邊朝水平搬送一邊施行乾燥者。藉此,可使對纖維基材2施加的張力比較小,俾可防止或抑制內部應變。Drying device 64 is disposed between nozzle 614 (roller 625) and roller 626. In the present embodiment, the drying device 64 is configured to dry the object while the object (the second resin composition, the fiber base material 2, the first resin composition, and the support 5) is conveyed horizontally. Thereby, the tension applied to the fibrous base material 2 can be made relatively small, and the internal strain can be prevented or suppressed.

另外,乾燥裝置64係藉由對上述對象物施行加熱,而將上述對象物予以乾燥者。經乾燥後的積層片中,第1樹脂層3與第2樹脂層4均呈B階段(B-stage)狀態,成為薄片狀。Further, the drying device 64 is configured to dry the object by heating the object. In the dried laminated sheet, both the first resin layer 3 and the second resin layer 4 are in a B-stage state, and are in a sheet form.

(積層片製造裝置6a)(Laminated sheet manufacturing apparatus 6a)

其次,針對積層片製造裝置6a進行說明。另外,以與前述積層片製造裝置6的相異處為中心進行說明,相關同樣的事項係省略說明。Next, the laminated sheet manufacturing apparatus 6a will be described. In addition, the description of the difference from the laminated sheet manufacturing apparatus 6 will be mainly described, and the description of the same matters will be omitted.

如圖4所示,積層片製造裝置6a中,對積層片製造裝置6省略噴嘴612、613,而屬於液狀第1樹脂組成物之供應手段的噴嘴611係設置成可利用未圖示之致動器(調整手段)進行改變位置。亦即,噴嘴611係依其吐出口可朝支撐體5之其中一面、或纖維基材2之其中一面、或支撐體5與纖維基材2之間等任一處所的方式,進行移動或姿勢變更。製造積層片1之際,選擇上述噴嘴611的吐出口位置及朝向,朝支撐體5之其中一面、或纖維基材2之其中一面、或支撐體5與纖維基材2之間等至少一者吐出第2樹脂組成物。As shown in FIG. 4, in the laminated sheet manufacturing apparatus 6a, the nozzles 612 and 613 are omitted from the laminated sheet manufacturing apparatus 6, and the nozzle 611 which is a supply means of the liquid first resin composition is provided so as to be unillustrated. The actuator (adjustment means) changes the position. That is, the nozzle 611 is moved or moved in such a manner that one of the support body 5, one of the fiber base materials 2, or the support body 5 and the fiber base material 2 can be moved to one of the support bodies 5, or the like. change. When the laminated sheet 1 is produced, the discharge port position and orientation of the nozzle 611 are selected, and one of the support body 5, one of the fiber base materials 2, or the support body 5 and the fiber base material 2 is at least one of The second resin composition was discharged.

更具體說明,從噴嘴611朝支撐體5之其中一面供應液狀第1樹脂組成物。More specifically, the liquid first resin composition is supplied from one of the nozzles 611 toward the support 5 .

再者,當從噴嘴611朝纖維基材2之其中一面供應液狀第1樹脂組成物時,係朝向由輥624所支撐的處所供應液狀第1樹脂組成物。依此的話,可提高第1樹脂組成物對纖維基材2的含浸程度。When the liquid first resin composition is supplied from one of the nozzles 611 to the fiber base material 2, the liquid first resin composition is supplied toward the space supported by the roller 624. According to this, the degree of impregnation of the first resin composition with respect to the fibrous base material 2 can be improved.

再者,當從噴嘴611朝向支撐體5與纖維基材2之間供應液狀第1樹脂組成物時,係朝由纖維基材2與支撐體5所包夾的空間供應第1樹脂組成物。更詳細說明,係朝向接觸到輥625的支撐體5、與相對向於該支撐體5且對輥625呈遠離狀態的纖維基材2之間,由噴嘴611供應液狀第1樹脂組成物,本實施形態中,第1樹脂組成物係供應給由輥625所支撐的支撐體5。When the liquid first resin composition is supplied from the nozzle 611 toward the support 5 and the fiber base material 2, the first resin composition is supplied to the space surrounded by the fiber base material 2 and the support body 5. . More specifically, the liquid first resin composition is supplied from the nozzle 611 between the support body 5 that is in contact with the roller 625 and the fiber base material 2 that is opposite to the support body 5 and that is opposite to the roller 625. In the present embodiment, the first resin composition is supplied to the support 5 supported by the roller 625.

再者,噴嘴611係藉由使其位置改變位置,而可調整支撐體5其中一面的供應位置,即沿支撐體5饋送出方向的第1樹脂組成物之供應位置。Further, the nozzle 611 can adjust the supply position of one side of the support body 5, that is, the supply position of the first resin composition in the feed direction of the support body 5, by changing its position.

同樣的,噴嘴611係就藉由使其位置改變位置,而可調整纖維基材2其中一面的供應位置,即纖維基材2饋送出方向的第1樹脂組成物之供應位置。Similarly, the nozzle 611 can adjust the supply position of one side of the fiber base material 2, that is, the supply position of the first resin composition in the direction in which the fiber base material 2 is fed, by changing its position.

(積層片製造裝置6b)(Laminated sheet manufacturing apparatus 6b)

接著,針對積層片製造裝置6b進行說明。另外,以與前述積層片製造裝置6的相異處為中心進行說明,相關同樣的事項係省略說明。Next, the laminated sheet manufacturing apparatus 6b will be described. In addition, the description of the difference from the laminated sheet manufacturing apparatus 6 will be mainly described, and the description of the same matters will be omitted.

如圖5所示,積層片製造裝置6b中,對積層片製造裝置6係省略噴嘴614,但設有貼合裝置65及輥629。As shown in Fig. 5, in the laminated sheet manufacturing apparatus 6b, the nozzle 614 is omitted for the laminated sheet manufacturing apparatus 6, but the bonding apparatus 65 and the roller 629 are provided.

貼合裝置65係設置於輥627與輥629之間。貼合裝置65係具備有對向配置的1對輥651與652、以及對輥651與652施行加熱的未圖示之加熱部;在輥651與輥652之間包夾對象物,構成對該對象物施行加壓且加熱狀態。The bonding device 65 is disposed between the roller 627 and the roller 629. The bonding apparatus 65 includes a pair of rollers 651 and 652 that are opposed to each other, and a heating unit (not shown) that heats the pair of rollers 651 and 652. The object is sandwiched between the roller 651 and the roller 652. The object is subjected to a pressurized and heated state.

輥629係設置於貼合裝置65的前段。輥629係饋送出對象物的手段,在該輥629上捲繞著後述片材7。輥629係構成為利用未圖示之馬達進行旋轉,若該輥629進行旋轉,便從輥629饋送出片材7(連續的供應)。The roller 629 is disposed in the front stage of the bonding device 65. The roller 629 is a means for feeding out an object, and a sheet 7 to be described later is wound around the roller 629. The roller 629 is configured to be rotated by a motor (not shown), and when the roller 629 is rotated, the sheet 7 is fed from the roller 629 (continuous supply).

<積層片之製造方法><Method of Manufacturing Laminate Sheet>

首先,針對以下實施形態的積層片之製造方法的概要進行說明。First, an outline of a method of manufacturing a laminated sheet of the following embodiment will be described.

積層片1之製造方法係對連續饋送出的支撐體5與連續饋送出的纖維基材2之間,供應第1樹脂組成物,並將支撐體5與纖維基材2隔著上述第1樹脂組成物施行壓接而製造積層片的方法。In the manufacturing method of the laminated sheet 1, the first resin composition is supplied between the continuously fed support 5 and the continuously fed fibrous base material 2, and the support 5 and the fibrous base 2 are interposed between the first resin. A method in which a composition is pressure-bonded to produce a laminated sheet.

積層片之製造方法係包括有:對支撐體5之其中一面與纖維基材2之其中一面中至少任一者,供應液狀第1樹脂組成物的第1步驟;以及將支撐體5之上述其中一面與上述纖維基材2之上述其中一面,隔著上述第1樹脂組成物施行壓接的第2步驟。其中,在第1步驟中,在對供應上述液狀第1樹脂組成物的供應手段之供應位置進行調整後,對支撐體5之其中一面與纖維基材2之其中一面中至少其中一者,供應液狀第1樹脂組成物。The manufacturing method of the laminated sheet includes a first step of supplying a liquid first resin composition to at least one of one of the support body 5 and one of the fiber base materials 2; and the above-described support body 5 One of the one surface of the fibrous base material 2 is subjected to a second step of pressure-bonding through the first resin composition. In the first step, at least one of one side of the support body 5 and one side of the fiber base material 2 is adjusted after the supply position of the supply means for supplying the liquid first resin composition is adjusted. A liquid first resin composition was supplied.

<第1實施形態><First embodiment>

其次,針對本發明積層片之製造方法的第1實施形態進行說明。另外,第1實施形態係使用積層片製造裝置6。 Next, a first embodiment of a method for producing a laminated sheet according to the present invention will be described. Further, in the first embodiment, the laminated sheet manufacturing apparatus 6 is used.

(第1步驟) (Step 1)

如圖3所示,使積層片製造裝置6的輥621旋轉,從該輥621饋送出(連續供應)支撐體5,並使輥623旋轉而從該輥623饋送出(連續供應)纖維基材2,且使輥628旋轉,而使該輥628捲取含有支撐體5與纖維基材2的積層片。 As shown in FIG. 3, the roller 621 of the laminated sheet manufacturing apparatus 6 is rotated, the support 5 is fed (continuously supplied) from the roller 621, and the roller 623 is rotated to feed (continuously supply) the fibrous substrate from the roller 623. 2, and the roller 628 is rotated, and the roller 628 is wound up to form a laminated sheet containing the support 5 and the fibrous base material 2.

從輥621所饋送出的支撐體5及從輥623所饋送出的纖維基材2係被朝輥625的外周面供應,纖維基材2與支撐體5間之距離係越朝輥625越狹窄。 The support body 5 fed from the roller 621 and the fiber base material 2 fed from the roller 623 are supplied toward the outer peripheral surface of the roller 625, and the distance between the fiber base material 2 and the support body 5 is narrower toward the roller 625. .

再者,選擇噴嘴611~613中至少其中一噴嘴,並從該所選擇噴嘴吐出液狀第1樹脂組成物。藉此,供應手段供應第1樹脂組成物的位置(吐出位置)便被調整。另外,該噴嘴的選擇係可為噴嘴611~613中之任1個的情況、或任2個的情況、或任3個的情況等任一者均可。另外,當第1樹脂組成物欲較厚塗佈的情況,可選擇複數噴嘴。 Further, at least one of the nozzles 611 to 613 is selected, and a liquid first resin composition is discharged from the selected nozzle. Thereby, the position (discharge position) at which the supply means supplies the first resin composition is adjusted. Further, the selection of the nozzle may be any one of the nozzles 611 to 613, or any two, or any three. Further, when the first resin composition is to be applied thickly, a plurality of nozzles may be selected.

選擇噴嘴611的情況,係從該噴嘴611朝支撐體5之其中一面吐出(供應)第1樹脂組成物。此處,朝向支撐體5中沒有接觸到輥625的處所,由噴嘴611供應液狀第1樹脂組成物。 When the nozzle 611 is selected, the first resin composition is discharged (supplied) from one of the nozzles 611 toward one side of the support body 5. Here, the liquid first resin composition is supplied from the nozzle 611 toward the space where the roller 625 is not in contact with the support body 5.

再者,選擇噴嘴612的情況,係從該噴嘴612朝纖維基材2之其中一面吐出第1樹脂組成物。在此,朝向纖維基材2 中由輥624所支撐的處所,由噴嘴612供應液狀第1樹脂組成物。藉此,可提高第1樹脂組成物對纖維基材2的含浸程度。 Further, when the nozzle 612 is selected, the first resin composition is discharged from one side of the fiber base material 2 from the nozzle 612. Here, towards the fiber substrate 2 In the space supported by the roller 624, the liquid first resin composition is supplied from the nozzle 612. Thereby, the degree of impregnation of the first resin composition with respect to the fiber base material 2 can be improved.

再者,選擇噴嘴613的情況,係從該噴嘴613朝向支撐體5與纖維基材2之間吐出第1樹脂組成物。朝向由纖維基材2與支撐體5所包夾空間,由噴嘴613供應第1樹脂組成物。更詳細說明,朝向在接觸到輥625的支撐體5、與相對向於該支撐體5且對輥625呈遠離狀態的纖維基材2之間所形成空間,由噴嘴613供應液狀第1樹脂組成物。來自噴嘴613的液狀第1樹脂組成物便成為對支撐體5與纖維基材2雙方均供應之狀態。從噴嘴611朝支撐體5的液狀第1樹脂組成物之供應處所,係較由噴嘴613所供應液狀第1樹脂組成物的供應處所,更靠支撐體5供應方向(從輥621的饋送出方向)前端側。同樣的,從噴嘴612朝纖維基材2的液狀第1樹脂組成物之供應處所,係較由噴嘴613所供應液狀第1樹脂組成物的供應處所,更靠纖維基材2供應方向(從輥623的饋送出方向)前端側。 Further, when the nozzle 613 is selected, the first resin composition is discharged from the nozzle 613 toward the support 5 and the fibrous base material 2. The first resin composition is supplied from the nozzle 613 toward the space surrounded by the fiber base material 2 and the support body 5. More specifically, the liquid first resin is supplied from the nozzle 613 toward the space formed between the support 5 contacting the roller 625 and the fibrous base material 2 facing away from the support 5 and facing the roller 625. Composition. The liquid first resin composition from the nozzle 613 is in a state of being supplied to both the support 5 and the fiber base 2. The supply position of the liquid first resin composition from the nozzle 611 to the support 5 is higher than the supply position of the liquid first resin composition supplied from the nozzle 613, and further to the supply direction of the support 5 (feed from the roller 621) Outward direction) Front end side. Similarly, the supply position of the liquid first resin composition from the nozzle 612 to the fiber base material 2 is higher than the supply position of the liquid first resin composition supplied from the nozzle 613, and further to the supply direction of the fiber base material 2 ( The front end side is from the feeding direction of the roller 623.

另外,從噴嘴611~613所吐出的第1樹脂組成物組成,在本實施形態中係可相互為相同,惟並不僅侷限此,亦可為不同。 Further, the composition of the first resin composition discharged from the nozzles 611 to 613 may be the same as each other in the present embodiment, but it is not limited thereto or may be different.

(第2步驟) (Step 2)

其次,在輥625中,將支撐體5與纖維基材2隔著第1 樹脂組成物進行壓接。 Next, in the roller 625, the support 5 and the fibrous substrate 2 are separated by the first The resin composition is crimped.

首先,支撐體5接觸到輥625的外周面。此時,纖維基材2並未接觸到支撐體5的外周面,在纖維基材2與支撐體5之間形成空間。然後,纖維基材2隔著支撐體5與液狀第1樹脂組成物接觸到輥625的外周面,藉此,纖維基材2與支撐體5便被壓接。此時的支撐體5與纖維基材2間之夾角角度(貼合角度:接觸到輥625的支撐體5、與相對向於該支撐體5且遠離支撐體5的纖維基材2之夾角度)θ,較佳係銳角。藉此,可防止或抑制纖維基材2產生應變。 First, the support 5 comes into contact with the outer peripheral surface of the roller 625. At this time, the fiber base material 2 does not contact the outer peripheral surface of the support body 5, and a space is formed between the fiber base material 2 and the support body 5. Then, the fibrous base material 2 is in contact with the liquid first resin composition via the support 5 to the outer peripheral surface of the roller 625, whereby the fibrous base material 2 and the support 5 are pressure-bonded. The angle between the support body 5 and the fiber base material 2 at this time (the angle of attachment: the angle between the support body 5 contacting the roller 625 and the fiber base material 2 facing the support body 5 and away from the support body 5 θ is preferably an acute angle. Thereby, strain of the fiber base material 2 can be prevented or suppressed.

再者,纖維基材2側的張力較佳係較小於支撐體5側的張力。具體而言,纖維基材2側的張力較佳係30N以下、更佳係15~25N左右。藉此,可防止或抑制纖維基材2的尺寸變化與內部應變。 Further, the tension on the side of the fibrous base material 2 is preferably smaller than the tension on the side of the support 5 . Specifically, the tension on the side of the fiber base material 2 is preferably 30 N or less, more preferably about 15 to 25 N. Thereby, dimensional change and internal strain of the fibrous base material 2 can be prevented or suppressed.

(第3步驟) (Step 3)

其次,從噴嘴614吐出液狀第2樹脂組成物,而朝纖維基材2與第1樹脂組成物相反側之面,供應該第2樹脂組成物。 Then, the liquid second resin composition is discharged from the nozzle 614, and the second resin composition is supplied to the surface of the fiber base material 2 opposite to the first resin composition.

第1樹脂組成物與第2樹脂組成物係相互組成不同。藉此,可配合對第1樹脂層3、第2樹脂層4所要求的特性,分別適當設定樹脂組成物的組成。 The first resin composition and the second resin composition are different in composition from each other. Thereby, the composition of the resin composition can be appropriately set in accordance with the characteristics required for the first resin layer 3 and the second resin layer 4.

另外,當第2樹脂組成物欲較厚塗佈的情況,例如可在複數處所設置吐出第2樹脂組成物的噴嘴。 Further, when the second resin composition is to be applied thickly, for example, a nozzle for discharging the second resin composition may be provided in a plurality of places.

(第4步驟(乾燥步驟)) (Step 4 (drying step))

接著,利用乾燥裝置64,使第1樹脂組成物與第2樹脂組成物乾燥。藉此,獲得積層片1。該積層片1係被捲取於輥628上。 Next, the first resin composition and the second resin composition are dried by the drying device 64. Thereby, the laminated sheet 1 is obtained. The laminated sheet 1 is taken up on a roller 628.

乾燥條件並無特別的限定,係配合第1樹脂組成物與第2樹脂組成物的組成及諸條件而適當設定,較佳係第1樹脂組成物與第2樹脂組成物中的揮發成分,相對於樹脂分別設定在1.5wt%以下、更佳係0.8~1.0wt%左右。具體而言,乾燥溫度較佳係60~180℃左右、更佳係80~150℃左右。又,乾燥時間較佳係2~10分鐘左右、更佳係2~5分鐘左右。 The drying conditions are not particularly limited, and are appropriately set in accordance with the composition and conditions of the first resin composition and the second resin composition, and are preferably volatile components in the first resin composition and the second resin composition. The resin is set to be 1.5 wt% or less, more preferably 0.8 to 1.0 wt%, respectively. Specifically, the drying temperature is preferably about 60 to 180 ° C, more preferably about 80 to 150 ° C. Further, the drying time is preferably about 2 to 10 minutes, more preferably about 2 to 5 minutes.

根據如上述的本實施形態,可達以下的效果。 According to the embodiment as described above, the following effects can be obtained.

本實施形態中,供應液狀第1樹脂組成物之際,選擇噴嘴611~613中至少任一個。例如從噴嘴611朝支撐體5其中一面供應液狀第1樹脂組成物時,使液狀第1樹脂組成物乾燥,直到纖維基材2與支撐體5被壓接為止,便可使對纖維基材2的含浸程度變為較少。另一方面,從噴嘴612朝纖維基材2其中一面供應液狀第1樹脂組成物時,含浸液狀第1樹脂組成物,直到纖維基材2與支撐體5被壓接為止,便可使對纖維基材2的含浸程度變為比較大。 In the present embodiment, at least one of the nozzles 611 to 613 is selected when the liquid first resin composition is supplied. For example, when the liquid first resin composition is supplied from one of the nozzles 611 to the support 5, the liquid first resin composition is dried, and the fiber base 2 and the support 5 are pressure-bonded to form a fiber-based base. The degree of impregnation of the material 2 becomes less. On the other hand, when the liquid first resin composition is supplied from one of the nozzles 612 to one side of the fiber base material 2, the liquid resin-like first resin composition is impregnated until the fiber base material 2 and the support body 5 are pressure-bonded. The degree of impregnation of the fibrous base material 2 becomes relatively large.

再者,從噴嘴613將液狀第1樹脂組成物供應給纖維基材2與支撐體5時,對纖維基材2含浸程度可設定為從噴嘴613供應的情況、與從噴嘴612供應的情況之間。 When the liquid first resin composition is supplied from the nozzle 613 to the fiber base material 2 and the support 5, the degree of impregnation of the fiber base material 2 can be set to be supplied from the nozzle 613 or to be supplied from the nozzle 612. between.

依此,可調整第1樹脂組成物對纖維基材2的含浸程度。故,可調整第2樹脂組成物與第1樹脂組成物的含浸比例,俾可製造所需預浸片。Accordingly, the degree of impregnation of the first resin composition with respect to the fibrous base material 2 can be adjusted. Therefore, the impregnation ratio of the second resin composition and the first resin composition can be adjusted, and the desired prepreg can be produced.

再者,本實施形態中,使用輥625施行纖維基材2與支撐體5間之壓接。當利用一對輥夾壓纖維基材2與支撐體5的情況,會有從纖維基材2中滲出第1樹脂組成物的可能性,但如本實施形態,藉由使用輥625,且調整纖維基材2接觸到輥625的面積並使面積變為較小,藉此可抑制從纖維基材2中滲出第1樹脂組成物。Further, in the present embodiment, the pressure contact between the fiber base material 2 and the support 5 is performed using the roller 625. When the fiber base material 2 and the support body 5 are sandwiched by a pair of rolls, there is a possibility that the first resin composition is oozing out from the fiber base material 2. However, in the present embodiment, the roll 625 is used and adjusted. The fiber substrate 2 is in contact with the area of the roller 625 and the area is made small, whereby the first resin composition is oozing out from the fiber base material 2.

該第1實施形態係可製造前述積層片1、1A、1B、1C、1D、1E之全部。後述第2實施形態~第4實施形態亦同。In the first embodiment, all of the laminated sheets 1, 1A, 1B, 1C, 1D, and 1E can be manufactured. The second embodiment to the fourth embodiment to be described later are also the same.

<第2實施形態><Second embodiment>

本實施形態係使用圖4所示積層片製造裝置6a。此情況,使噴嘴611改變位置,調整噴嘴611供應第1樹脂組成物的位置(吐出位置),從該噴嘴611朝支撐體5之其中一面、或纖維基材2之其中一面、或支撐體5與纖維基材2之間等至少其中一者吐出第1樹脂組成物。依此,可減少噴嘴數量。又,後述第3實施形態亦可變更為圖5所示積層片製造裝置6b的噴嘴構造,並同樣地實施。In the present embodiment, the laminated sheet manufacturing apparatus 6a shown in Fig. 4 is used. In this case, the nozzle 611 is changed in position, and the position (discharge position) at which the first resin composition is supplied from the nozzle 611 is adjusted, and the nozzle 611 faces one side of the support body 5, or one side of the fiber base material 2, or the support body 5 At least one of the fiber substrate 2 and the like is discharged to discharge the first resin composition. Accordingly, the number of nozzles can be reduced. Further, the third embodiment to be described later can be changed to the nozzle structure of the laminated sheet manufacturing apparatus 6b shown in Fig. 5, and the same can be applied.

首先,與第1實施形態同樣的,從輥621饋送出支撐體5,並從輥623饋送出纖維基材2。First, as in the first embodiment, the support 5 is fed out from the roller 621, and the fibrous base material 2 is fed out from the roller 623.

其次,調整噴嘴611的位置,調整來自噴嘴611的第1樹脂組成物之供應位置。例如使噴嘴611朝圖4中右側改變位置,而對由輥622所支撐的支撐體5上供應液狀第1樹脂組成物。又,亦可使噴嘴611朝圖4中左側改變位置,而對由輥624所支撐的纖維基材2上供應液狀第1樹脂組成物。此外,亦可對由輥625所支撐的支撐體5上供應液狀第1樹脂組成物。Next, the position of the nozzle 611 is adjusted to adjust the supply position of the first resin composition from the nozzle 611. For example, the nozzle 611 is changed to the right side in FIG. 4, and the liquid first resin composition is supplied to the support 5 supported by the roller 622. Moreover, the nozzle 611 can be changed to the left side in FIG. 4, and the liquid-like first resin composition can be supplied to the fiber base material 2 supported by the roller 624. Further, a liquid first resin composition may be supplied to the support 5 supported by the roller 625.

再者,亦可調整噴嘴的位置,調整支撐體5其中一面的供應處所,調整沿支撐體5饋送出方向的第1樹脂組成物之供應處所。Further, the position of the nozzle can be adjusted, the supply position of one side of the support body 5 can be adjusted, and the supply place of the first resin composition in the feeding direction of the support body 5 can be adjusted.

同樣的,亦可調整噴嘴611的位置,調整纖維基材2其中一面的供應處所,調整纖維基材2饋送出方向的第1樹脂組成物之供應位置。Similarly, the position of the nozzle 611 can be adjusted, the supply position of one side of the fiber base material 2 can be adjusted, and the supply position of the first resin composition in the feeding direction of the fiber base material 2 can be adjusted.

依此,可高度地控制第1樹脂組成物對纖維基材2的含浸程度。Accordingly, the degree of impregnation of the fibrous base material 2 by the first resin composition can be highly controlled.

後續步驟係與第1實施形態同樣。具體而言,在輥625中,將支撐體5與纖維基材2隔著液狀第1樹脂組成物施行壓接,並從噴嘴614吐出液狀第2樹脂組成物,利用乾燥裝置64使第1樹脂組成物與第2樹脂組成物乾燥。進而將積層片1捲取於輥628上。The subsequent steps are the same as in the first embodiment. Specifically, in the roll 625, the support 5 and the fibrous base material 2 are pressure-bonded via the liquid first resin composition, and the liquid second resin composition is discharged from the nozzle 614, and the drying device 64 is used. 1 The resin composition and the second resin composition are dried. Further, the laminated sheet 1 is taken up on the roller 628.

根據此種本實施形態,可達與第1實施形態同樣的效果。According to this embodiment, the same effects as those of the first embodiment can be obtained.

<第3實施形態><Third embodiment>

其次,針對本發明積層片之製造方法的第3實施形態進行說明。另外,針對第3實施形態,以與前述第1實施形態的相異處為中心進行說明,相關同樣的事項係省略說明。Next, a third embodiment of the method for producing a laminated sheet of the present invention will be described. In the third embodiment, the differences from the first embodiment will be mainly described, and the same matters will be omitted.

第3實施形態係使用積層片製造裝置6或6a。而,第2實施形態中係除了第1樹脂組成物與第2樹脂組成物為相互組成相同之外,其餘均與上述第1實施形態同樣。In the third embodiment, the laminated sheet manufacturing apparatus 6 or 6a is used. In the second embodiment, the first resin composition and the second resin composition have the same mutual composition, and the rest are the same as those in the first embodiment.

<第4實施形態><Fourth embodiment>

其次,針對本發明積層片之製造方法的第4實施形態進行說明。另外,針對第4實施形態,以與前述第1實施形態的相異處為中心進行說明,相關同樣的事項係省略說明。Next, a fourth embodiment of the method for producing a laminated sheet of the present invention will be described. In the fourth embodiment, the differences from the first embodiment will be mainly described, and the same matters will be omitted.

第4實施形態係使用積層片製造裝置6b。該積層片製造裝置6b的第1步驟與第2步驟係與第1實施形態同樣。又,除乾燥步驟係在第2步驟與後述第3步驟之間實施之外,其餘均與第1實施形態同樣。In the fourth embodiment, the laminated sheet manufacturing apparatus 6b is used. The first step and the second step of the laminated sheet manufacturing apparatus 6b are the same as those of the first embodiment. Further, the drying step is the same as that of the first embodiment except that the drying step is performed between the second step and the third step described later.

(第3步驟)(Step 3)

使積層片製造裝置6b的輥629旋轉,而從該輥629饋送出(連續供應)片材7。The roller 629 of the laminated sheet manufacturing apparatus 6b is rotated, and the sheet 7 is fed (continuously supplied) from the roller 629.

片材7係如圖5所示,具備有樹脂薄膜8、與設置於該樹脂薄膜8其中一面且由固態或半固態的第2樹脂組成物所構成之第2樹脂層(樹脂層)4。第2樹脂層4係呈被加工為薄片狀的狀態,且為B階段狀態。As shown in FIG. 5, the sheet 7 is provided with a resin film 8 and a second resin layer (resin layer) 4 composed of a solid resin or a semi-solid second resin composition provided on one surface of the resin film 8. The second resin layer 4 is in a state of being processed into a sheet shape and is in a B-stage state.

樹脂薄膜8係可使用與作為支撐體5的樹脂薄膜所說明者同樣者。The resin film 8 can be the same as that described for the resin film as the support 5 .

本步驟中,片材7、以及纖維基材2與支撐體5的積層體係通過貼合裝置65的輥651與輥652之間,此時片材7、以及纖維基材2與支撐體5的積層體,係利用該貼合裝置65被加壓且被加熱。藉此,片材7隔著第2樹脂層4而壓接於纖維基材2與第1樹脂組成物相反側之面,而獲得積層片1。該積層片1被捲取於輥628上。In this step, the sheet 7 and the layered system of the fibrous base material 2 and the support 5 pass between the roll 651 of the bonding device 65 and the roll 652, at which time the sheet 7, and the fibrous substrate 2 and the support 5 are The laminate is pressurized and heated by the bonding device 65. Thereby, the sheet 7 is pressure-bonded to the surface of the fiber base material 2 and the side opposite to the first resin composition via the second resin layer 4, whereby the laminated sheet 1 is obtained. The laminated sheet 1 is taken up on a roller 628.

上述壓接時的條件並無特別的限定,係配合第2樹脂層4的第2樹脂組成物組成與諸條件而適當設定,壓力較佳係0.1~1.0MPa/cm2左右、更佳係0.3~0.5MPa/cm2左右。又,加熱溫度較佳係40~100℃左右、更佳係60~80℃左右。The conditions at the time of the pressure bonding are not particularly limited, and are appropriately set in accordance with the composition of the second resin composition of the second resin layer 4 and the conditions, and the pressure is preferably about 0.1 to 1.0 MPa/cm 2 , more preferably 0.3. ~0.5MPa/cm 2 or so. Further, the heating temperature is preferably about 40 to 100 ° C, more preferably about 60 to 80 ° C.

該第4實施形態中,因使用在其中一面側設有由固態或半固態第2樹脂組成物構成之第2樹脂層4的片材7,故適用於在纖維基材2的厚度方向未含浸第2樹脂組成物的情況。In the fourth embodiment, since the sheet material 7 having the second resin layer 4 composed of the solid or semi-solid second resin composition is provided on one surface side, it is suitable for being impregnated in the thickness direction of the fiber base material 2. The case of the second resin composition.

此種第4實施形態除可達與第1實施形態同樣的效果之外,尚可達到以下的效果。In addition to the effects similar to those of the first embodiment, the fourth embodiment can achieve the following effects.

藉由使用設有被加工為薄片狀之第2樹脂層4的片材7,可防止纖維基材2內部出現第1樹脂組成物與第2樹脂組成物相混合情形。藉此,可確實獲得具有所需特性的預浸片。By using the sheet material 7 provided with the second resin layer 4 processed into a sheet shape, it is possible to prevent the first resin composition from being mixed with the second resin composition in the fiber base material 2. Thereby, a prepreg having desired characteristics can be surely obtained.

尤其,第1樹脂組成物係在利用乾燥裝置64進行乾燥後,才貼合第2樹脂層4,故可確實防止第1樹脂組成物與第2樹脂組成物相混合。In particular, since the first resin composition is bonded to the second resin layer 4 after being dried by the drying device 64, it is possible to surely prevent the first resin composition from being mixed with the second resin composition.

<基板><Substrate>

其次,針對使用本發明積層片進行製造的基板,參照圖6進行說明。該圖6所示基板10係具備有將第2樹脂層4彼此間朝向內側配置的2個預浸片1g、以及由第2樹脂層4彼此間夾持的內層電路基板13。另外,預浸片1g係經將積層片1裁剪為既定尺寸者。 Next, a substrate manufactured by using the laminated sheet of the present invention will be described with reference to Fig. 6 . The substrate 10 shown in FIG. 6 includes two prepreg sheets 1g that are disposed to face the second resin layer 4 inward, and an inner layer circuit board 13 that is sandwiched between the second resin layers 4. Further, the prepreg 1g is obtained by cutting the laminated sheet 1 into a predetermined size.

內層電路基板13係可使用與前述纖維基材2同樣者。又,本實施形態中,因為第2樹脂層4具有如前述特性(可撓性),故內層電路基板13至少其中一部分確實地埋入(埋設)於第2樹脂層4中。 The inner layer circuit board 13 can be the same as the fiber base material 2 described above. Further, in the present embodiment, since the second resin layer 4 has the above-described characteristics (flexibility), at least a part of the inner layer circuit board 13 is surely embedded (embedded) in the second resin layer 4.

亦可使一對第2樹脂層4分別被覆內層電路基板13的表背面,且一對第2樹脂層4在內層電路基板13內部呈相互接觸,使內層電路基板13內部完全被一對第2樹脂層4埋入。又,亦可使一對第2樹脂層4分別被覆纖維基材2的表背面,且在一對第2樹脂層4間形成隙間,並在內層電路基板13內部形成空隙。 The pair of second resin layers 4 may be coated on the front and back surfaces of the inner layer circuit board 13, and the pair of second resin layers 4 may be in contact with each other inside the inner layer circuit board 13, so that the inner layer of the inner layer circuit board 13 is completely covered. The second resin layer 4 is buried. In addition, the pair of second resin layers 4 may cover the front and back surfaces of the fiber base material 2, and a gap may be formed between the pair of second resin layers 4, and a void may be formed inside the inner layer circuit board 13.

在各第1樹脂層3與纖維基材2相反側之面上所設置之金屬層12,分別有由金屬箔構成支撐體5的情況。本實施形態中,因為第1樹脂層3具有如前述特性,故可依高密接性保持金屬層12,且能依高加工精度在佈線部形成金屬層12。 The metal layer 12 provided on the surface of the first resin layer 3 opposite to the fiber base material 2 may have a support 5 formed of a metal foil. In the present embodiment, since the first resin layer 3 has the above-described characteristics, the metal layer 12 can be held with high adhesion, and the metal layer 12 can be formed in the wiring portion with high processing precision.

金屬層12與第1樹脂層3間之剝離強度較佳係0.5kN/m以上、更佳係0.6kN/m以上。藉此,將金屬層12加工為佈線部,可更加提升所獲得之半導體裝置100(參照圖7)的連接可靠度。 The peeling strength between the metal layer 12 and the first resin layer 3 is preferably 0.5 kN/m or more, more preferably 0.6 kN/m or more. Thereby, the metal layer 12 is processed into a wiring portion, and the connection reliability of the obtained semiconductor device 100 (see FIG. 7) can be further improved.

此種基板10係可準備2個預浸片1g,在由該等預浸片1g夾持著內層電路基板13之狀態下,使用例如真空層壓法、真空壓合法等進行製造。 In the substrate 10, two prepreg sheets 1g can be prepared, and the inner layer circuit board 13 is sandwiched between the prepreg sheets 1g, for example, by vacuum lamination, vacuum pressing, or the like.

另外,基板10可省略內層電路基板13,2個預浸片1g係含有由第2樹脂層4彼此間直接接合構成的積層體,亦可省略金屬層12。 Further, the substrate 10 can omit the inner layer circuit board 13, and the two prepreg sheets 1g include a layered body in which the second resin layers 4 are directly joined to each other, and the metal layer 12 can be omitted.

<半導體裝置> <semiconductor device>

其次,針對使用本發明積層片進行製造的半導體裝置,參照圖7進行說明。另外,圖7中,省略纖維基材2、內層電路基板13而圖示,且第1樹脂層3與第2樹脂層4呈一體圖示。 Next, a semiconductor device manufactured by using the laminated sheet of the present invention will be described with reference to FIG. In FIG. 7, the fiber base material 2 and the inner layer circuit board 13 are omitted, and the first resin layer 3 and the second resin layer 4 are integrally shown.

圖7所示半導體裝置100係具備有多層基板200與半導體元件500,該多層基板200係上面設有焊墊部300、下面設有佈線部400,該半導體元件500係利用凸塊501連接於焊墊部300,藉此搭載於多層基板200上。 The semiconductor device 100 shown in FIG. 7 includes a multilayer substrate 200 on which a pad portion 300 is provided on the upper surface, and a wiring portion 400 on the lower surface. The semiconductor device 500 is connected to the solder by bumps 501. The pad portion 300 is mounted on the multilayer substrate 200.

多層基板200係具備有當作核心基板而設置的基板10;在該基板10上側設置的3個預浸片1a、1b、1c;以及在基板10下側設置的3個預浸片1d、1e、1f。預浸片1a~1f分別係將積層片1裁剪為既定尺寸者。又,分別構成預浸片1a~1c的纖維基材2、第1樹脂層3、第2樹脂層4從基板10起的配置順序。係與分別構成預浸片1d~1f的纖維基材2、第1樹脂層3、第2樹脂層4從基板10起的配置順序相同。即,預浸片1a~1c與預浸片1d~1f係形成相互上下顛倒狀態。The multilayer substrate 200 is provided with a substrate 10 provided as a core substrate, three prepreg sheets 1a, 1b, and 1c provided on the upper side of the substrate 10, and three prepreg sheets 1d and 1e provided on the lower side of the substrate 10. , 1f. The prepreg sheets 1a to 1f are each formed by cutting the laminated sheet 1 into a predetermined size. Moreover, the arrangement order of the fiber base material 2, the first resin layer 3, and the second resin layer 4 constituting the prepreg sheets 1a to 1c from the substrate 10 is formed. The order of arrangement of the fiber base material 2, the first resin layer 3, and the second resin layer 4 constituting the prepreg sheets 1d to 1f from the substrate 10 is the same. That is, the prepreg sheets 1a to 1c and the prepreg sheets 1d to 1f are formed in an upside down state.

另外,上述焊墊部300係將由預浸片1c的金屬箔所構成之支撐體5加工為既定圖案者,且上述佈線部400係將由預浸片1f的金屬箔所構成之支撐體5加工為既定圖案者。Further, the pad portion 300 is formed by processing the support 5 composed of the metal foil of the prepreg 1c into a predetermined pattern, and the wiring portion 400 is formed by processing the support 5 composed of the metal foil of the prepreg 1f. The original pattern.

再者,在預浸片1a、1b上面側所配置的電路部201a、201b,分別係將由金屬箔構成的支撐體5加工為既定圖案者,又,在預浸片1d、1e下面側所配置的電路部201d、201e,分別係將由金屬箔構成的支撐體5加工為既定圖案者。Further, the circuit portions 201a and 201b disposed on the upper surface side of the prepreg sheets 1a and 1b are formed by processing the support 5 made of a metal foil into a predetermined pattern, and are disposed on the lower side of the prepreg sheets 1d and 1e, respectively. Each of the circuit portions 201d and 201e is formed by processing a support 5 made of a metal foil into a predetermined pattern.

再者,多層基板200係具備有分別貫通各預浸片1a~1f而設置,且將相鄰電路部彼此間、或電路部與焊墊部間予以電氣式連接的導體部202。Further, the multilayer substrate 200 is provided with a conductor portion 202 that is provided to penetrate each of the prepreg sheets 1a to 1f, and to electrically connect the adjacent circuit portions or the circuit portion and the pad portion.

再者,基板10的各金屬層12分別被加工為既定圖案,該經加工的金屬層12彼此間係利用貫通基板10而設置的導體部203而電氣式連接。Further, each of the metal layers 12 of the substrate 10 is processed into a predetermined pattern, and the processed metal layers 12 are electrically connected to each other by a conductor portion 203 provided through the substrate 10.

另外,半導體裝置100(多層基板200)亦可在基板10的單面側設置4個以上預浸片。進而,半導體裝置100亦可含有從前述積層片所獲得之預浸片以外的預浸片。Further, in the semiconductor device 100 (multilayer substrate 200), four or more prepreg sheets may be provided on one side of the substrate 10. Further, the semiconductor device 100 may contain a prepreg other than the prepreg obtained from the laminated sheet.

另外,本發明並不僅侷限於前述實施形態,舉凡在可達成本發明目的之範疇內的變形、改良等,均涵蓋於本發明內。Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope of the purpose of the invention are encompassed by the present invention.

以上,針對本發明積層片之製造方法及積層片,根據圖示之實施形態進行說明,惟本發明並不僅侷限於此,各部位的構造亦可取代為具有同樣功能的任意構造者。又,本發明亦可附加其他的任意構造物與步驟。The method for producing a laminated sheet of the present invention and the laminated sheet are described above based on the embodiments shown in the drawings, but the present invention is not limited thereto, and the structure of each portion may be replaced by any structure having the same function. Further, the present invention may be added with any other structure and steps.

例如圖8所示,裝置6中亦可設置抽吸手段67。For example, as shown in FIG. 8, a suction means 67 may be provided in the apparatus 6.

該抽吸手段67係用以使第1樹脂組成物含浸於纖維基材2中者。藉由利用抽吸手段67抽吸空氣,第1樹脂組成物被拉引,可確實地調整對纖維基材2的含浸程度。裝置6a、6b中同樣的亦可設置抽吸手段67。The suction means 67 is for impregnating the first resin composition with the fibrous base material 2. By sucking air by the suction means 67, the first resin composition is pulled, and the degree of impregnation with the fiber base material 2 can be surely adjusted. A suction means 67 can also be provided in the devices 6a, 6b.

再者,第2實施形態中,來自噴嘴611的第1樹脂組成物之供應位置,係沿支撐體5或纖維基材2的饋送出方向進行調整,惟並不僅侷限此。例如亦可調整支撐體5或纖維基材2的寬度方向(饋送出方向的正交方向)之供應位置。依此,可調整纖維基材2寬度方向的第1樹脂組成物之含浸量。In the second embodiment, the supply position of the first resin composition from the nozzle 611 is adjusted along the feeding direction of the support 5 or the fiber base material 2, but it is not limited thereto. For example, the supply position of the support body 5 or the fiber base material 2 in the width direction (orthogonal direction of the feed direction) may be adjusted. Thereby, the impregnation amount of the first resin composition in the width direction of the fiber base material 2 can be adjusted.

本申請案係以2010年9月1日所提出申請的日本專利申請案特願2010-195494為基礎主張優先權,並將其揭示寫入於本案中。The present application claims priority on the basis of Japanese Patent Application No. 2010-195494, filed on Sep. 1, 2010, the disclosure of which is incorporated herein.

1...積層片1. . . Laminate

1A~1D...積層片1A~1D. . . Laminate

1a~1g...預浸片1a~1g. . . Prepreg

2...纖維基材2. . . Fiber substrate

3...第1樹脂層3. . . First resin layer

4...第2樹脂層4. . . Second resin layer

5...支撐體5. . . Support

6...積層片製造裝置6. . . Laminate manufacturing device

6a...積層片製造裝置6a. . . Laminate manufacturing device

6b...積層片製造裝置6b. . . Laminate manufacturing device

7...片材7. . . Sheet

8...樹脂薄膜8. . . Resin film

10...基板10. . . Substrate

12...金屬層12. . . Metal layer

13...內層電路基板13. . . Inner circuit board

20...界面20. . . interface

31...第1含浸部31. . . First impregnation

41...第2含浸部41. . . 2nd impregnation

64...乾燥裝置64. . . Drying device

65...貼合裝置65. . . Laminating device

67...抽吸手段67. . . Suction means

100...半導體裝置100. . . Semiconductor device

200...多層基板200. . . Multilayer substrate

201a、201b、201d、201e...電路部201a, 201b, 201d, 201e. . . Circuit department

202、203...導體部202, 203. . . Conductor

300...焊墊部300. . . Solder pad

400...佈線部400. . . Wiring department

500...半導體元件500. . . Semiconductor component

501...凸塊501. . . Bump

611~614...噴嘴(狹縫式塗佈機)611~614. . . Nozzle (slit coater)

621~628...輥621~628. . . Roll

629...輥629. . . Roll

651、652...輥651, 652. . . Roll

661~663...調整手段661~663. . . Adjustment means

圖1係積層片的實施形態剖視圖。Fig. 1 is a cross-sectional view showing an embodiment of a laminated sheet.

圖2係積層片的實施形態之另一構造例示意剖視圖。Fig. 2 is a schematic cross-sectional view showing another structural example of the embodiment of the laminated sheet.

圖3係本發明積層片之製造方法的實施形態中所使用的積層片製造裝置圖。Fig. 3 is a view showing a device for manufacturing a laminated sheet used in an embodiment of a method for producing a laminated sheet of the present invention.

圖4係本發明積層片之製造方法的實施形態中所使用的積層片製造裝置圖。Fig. 4 is a view showing a device for manufacturing a laminated sheet used in an embodiment of a method for producing a laminated sheet according to the present invention.

圖5係本發明積層片之製造方法的實施形態中所使用的積層片製造裝置圖。Fig. 5 is a view showing a device for manufacturing a laminated sheet used in an embodiment of a method for producing a laminated sheet according to the present invention.

圖6係基板的剖視圖。Fig. 6 is a cross-sectional view of the substrate.

圖7係半導體裝置的實施形態剖視圖。Fig. 7 is a cross-sectional view showing an embodiment of a semiconductor device.

圖8係本發明變化例的製造裝置圖。Fig. 8 is a view showing a manufacturing apparatus of a modification of the present invention.

1...積層片1. . . Laminate

2...纖維基材2. . . Fiber substrate

5...支撐體5. . . Support

6...積層片製造裝置6. . . Laminate manufacturing device

64...乾燥裝置64. . . Drying device

611~614...噴嘴(狹縫式塗佈機)611~614. . . Nozzle (slit coater)

621~628...輥621~628. . . Roll

661...調整手段661. . . Adjustment means

662...調整手段662. . . Adjustment means

Claims (14)

一種積層片之製造方法,係在連續饋送出的支撐體、與連續饋送出的纖維基材之間,供應第1樹脂組成物,並將上述支撐體與上述纖維基材隔著上述第1樹脂組成物進行壓接而製造積層片者,包括有:對上述支撐體其中一面、上述纖維基材其中一面中至少任一者,供應液狀第1樹脂組成物的第1步驟;以及將上述支撐體的上述其中一面與上述纖維基材的上述其中一面,隔著上述第1樹脂組成物進行壓接的第2步驟;其中,上述第1步驟中,在對供應上述液狀第1樹脂組成物的供應手段之供應位置進行調整後,對上述支撐體其中一面、上述纖維基材其中一面中至少任一者,供應液狀第1樹脂組成物;上述第2步驟中,將上述支撐體依面接觸於層壓輥圓周1/4以上範圍的方式,沿上述層壓輥外周面連續搬送;該層壓輥不存在有對向配置之輥;在上述層壓輥與上述支撐體相接觸的處所,依隔著上述支撐體與上述第1樹脂組成物而接觸於上述層壓輥的方式,將上述纖維基材朝上述層壓輥連續搬送,藉此將上述纖維基材與上述支撐體隔著上述第1樹脂組成物施行壓接。 A method for producing a laminated sheet, wherein a first resin composition is supplied between a continuously fed support and a continuously fed fibrous base material, and the support and the fibrous base material are interposed between the first resin The method of producing a laminated sheet by pressure bonding the composition includes: a first step of supplying a liquid first resin composition to at least one of the support body and one of the fiber base materials; and the supporting a second step of pressing one of the one surface of the body and the one of the fiber base materials via the first resin composition; wherein, in the first step, the liquid first resin composition is supplied to the first resin composition After the supply position of the supply means is adjusted, a liquid first resin composition is supplied to one of the support body and one of the fiber base materials; and in the second step, the support body is placed in the surface Continuously transporting along the outer circumferential surface of the laminating roller in contact with the circumference of the laminating roller; the laminating roller does not have a roller disposed oppositely; and the laminating roller and the support The fiber substrate is continuously conveyed toward the laminating roller so as to be in contact with the laminating roller so as to be in contact with the first resin composition via the support, and the fiber substrate and the fiber substrate are The support is pressure-bonded through the first resin composition. 如申請專利範圍第1項之積層片之製造方法,其中,上 述第1步驟中,依選擇上述支撐體其中一面、上述纖維基材其中一面中至少其中一面,並對所選擇的面供應液狀第1樹脂組成物的方式,調整上述供應手段的供應位置。 For example, the manufacturing method of the laminated sheet of the first application of the patent scope, wherein In the first step, the supply position of the supply means is adjusted such that one of the support members and at least one of the ones of the fiber base materials are supplied, and the liquid first resin composition is supplied to the selected surface. 如申請專利範圍第2項之積層片之製造方法,其中,上述第1步驟中,上述供應手段係由下述所構成:朝上述支撐體之上述其中一面吐出上述第1樹脂組成物的噴嘴;朝上述纖維基材之上述其中一面吐出上述第1樹脂組成物的噴嘴;以及朝在相對向的上述支撐體其中一面與上述纖維基材其中一面之間所形成的空間吐出,且朝上述支撐體其中一面與上述纖維基材其中一面雙方吐出上述第1樹脂組成物的噴嘴;藉由從上述複數噴嘴中選擇吐出上述第1樹脂組成物的至少1個噴嘴,而調整上述供應手段的供應位置,並供應上述液狀第1樹脂組成物。 The method of manufacturing a laminated sheet according to the second aspect of the invention, wherein in the first step, the supply means comprises: a nozzle that discharges the first resin composition toward one of the support bodies; a nozzle that discharges the first resin composition toward one of the fiber base materials; and a space that is formed between one of the opposing support bodies and one of the fiber base materials, and that faces the support body a nozzle for discharging the first resin composition on one of the fiber base materials; and selecting at least one nozzle for discharging the first resin composition from the plurality of nozzles to adjust a supply position of the supply means; The liquid first resin composition was supplied. 如申請專利範圍第1項之積層片之製造方法,其中,上述第1步驟中,上述供應手段係噴嘴;依該噴嘴的吐出口朝向上述支撐體之上述其中一面、上述纖維基材之上述其中一面中至少一者的方式,使上述噴嘴改變位置,藉此調整上述供應手段的供應位置,使上述第1樹脂組成物從上述噴嘴吐出。 The manufacturing method of the laminated sheet according to the first aspect of the invention, wherein the supply means is a nozzle; the discharge port of the nozzle faces the one side of the support body, and the fiber substrate is the same In a manner of at least one of the surfaces, the nozzle is changed in position to adjust the supply position of the supply means, and the first resin composition is discharged from the nozzle. 如申請專利範圍第1項之積層片之製造方法,其中,上述第1步驟中,使屬於上述供應手段的噴嘴改變位置,調整上述支撐體其 中一面在支撐體饋送出方向的上述供應手段之供應位置,或者調整上述纖維基材其中一面在纖維基材饋送出方向的上述供應手段之供應位置後,供應上述液狀第1樹脂組成物。 The method of manufacturing a laminated sheet according to claim 1, wherein in the first step, the nozzle belonging to the supply means is changed in position, and the support is adjusted. The liquid first resin composition is supplied to the supply position of the supply means in the feeding direction of the support or to the supply position of the supply means in the fiber substrate feeding direction. 如申請專利範圍第1項之積層片之製造方法,其中,包括有:朝上述纖維基材與上述第1樹脂組成物相反側之面,供應液狀第2樹脂組成物的第3步驟。 The method for producing a laminated sheet according to the first aspect of the invention, comprising the third step of supplying the liquid second resin composition to the surface of the fibrous substrate opposite to the first resin composition. 如申請專利範圍第6項之積層片之製造方法,其中,上述第2樹脂組成物的供應係從噴嘴吐出該第2樹脂組成物而實施。 The method for producing a laminated sheet according to the sixth aspect of the invention, wherein the supply of the second resin composition is performed by discharging the second resin composition from a nozzle. 如申請專利範圍第1項之積層片之製造方法,其中,包括有:將其中一面側設有由第2樹脂組成物所構成之薄片狀樹脂層、且連續供應的片材,在上述纖維基材與上述第1樹脂組成物相反側之面上,隔著上述片材的上述樹脂層進行壓接之第3步驟。 The method for producing a laminated sheet according to the first aspect of the invention, wherein the sheet-like resin layer composed of the second resin composition is provided on one side thereof, and the sheet is continuously supplied, and the fiber base is The third step of pressure-bonding the resin layer on the surface of the material opposite to the first resin composition via the resin layer of the sheet. 如申請專利範圍第8項之積層片之製造方法,其中,在上述第2步驟與上述第3步驟之間,具有施行乾燥的步驟。 The method for producing a laminated sheet according to the eighth aspect of the invention, wherein the step of drying is performed between the second step and the third step. 如申請專利範圍第6項之積層片之製造方法,其中,上述第1樹脂組成物與上述第2樹脂組成物係相互組成不同。 The method for producing a laminated sheet according to the sixth aspect of the invention, wherein the first resin composition and the second resin composition are different in composition from each other. 如申請專利範圍第1項之積層片之製造方法,其中,上述支撐體係金屬箔或樹脂薄膜。 The method for producing a laminated sheet according to the first aspect of the invention, wherein the supporting system is a metal foil or a resin film. 一種積層片之製造裝置,係具備有: 連續饋送出支撐體的手段;連續饋送出纖維基材的手段;對上述支撐體與上述纖維基材之間供應液狀第1樹脂組成物的供應手段;以及隔著上述第1樹脂組成物,將上述支撐體與上述纖維基材施行壓接的壓接手段;其中,上述壓接手段係由不存在有對向配置之輥的層壓輥所構成;並具備有調整手段,對上述供應手段所進行之上述液狀第1樹脂組成物的供應位置進行調整。 A manufacturing device for a laminated sheet, comprising: a means for continuously feeding out a support; means for continuously feeding the fibrous base material; means for supplying a liquid first resin composition between the support and the fibrous base material; and a first resin composition interposed therebetween a pressure bonding means for pressing the support body and the fiber base material; wherein the pressure bonding means is constituted by a laminating roller having no oppositely disposed rolls; and the adjusting means is provided for the supply means The supply position of the liquid first resin composition to be carried out is adjusted. 如申請專利範圍第12項之積層片之製造裝置,其中,上述供應手段係由下述所構成:朝上述支撐體之其中一面吐出上述第1樹脂組成物的噴嘴;朝上述纖維基材之其中一面吐出上述第1樹脂組成物的噴嘴;以及朝在相對向的上述支撐體其中一面與上述纖維基材其中一面之間所形成的空間吐出,且朝上述支撐體其中一面與上述纖維基材其中一面之雙方吐出上述第1樹脂組成物的噴嘴;上述調整手段係連接於上述各噴嘴,並執行各噴嘴之開閉的閥。 The apparatus for manufacturing a laminated sheet according to claim 12, wherein the supply means comprises: a nozzle for discharging the first resin composition toward one of the support members; and the fiber substrate a nozzle for discharging the first resin composition; and a space formed between one of the opposing support members and one of the fiber substrates, and facing one side of the support body and the fiber substrate A nozzle for discharging the first resin composition on both sides; and the adjustment means is a valve that is connected to each of the nozzles and that opens and closes each nozzle. 如申請專利範圍第12項之積層片之製造裝置,其中,上述供應手段係噴嘴;上述調整手段係藉由使噴嘴改變位置,而以使噴嘴的吐出 口朝向上述支撐體之上述其中一面、上述纖維基材之上述其中一面中至少1者的方式,使上述噴嘴的吐出口改變位置,或者,藉由使噴嘴改變位置,而調整在上述支撐體其中一面的支撐體饋送出方向上之上述液狀的上述供應手段的供應位置,或調整在上述纖維基材其中一面的纖維基材饋送出方向上之上述供應手段的供應位置。 The manufacturing apparatus of the laminated sheet of claim 12, wherein the supply means is a nozzle; and the adjusting means causes the nozzle to be discharged by changing the position of the nozzle Orienting the discharge port of the nozzle to a position of the one or more of the one of the fiber base materials, or adjusting the position of the nozzle to adjust the position of the nozzle to adjust the position of the nozzle to the support body The support body on one side feeds the supply position of the above-described liquid supply means in the direction, or adjusts the supply position of the supply means in the fiber substrate feed direction on one side of the fiber base material.
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