TW201215506A - Method for manufacturing laminated sheet and apparatus therefor - Google Patents

Method for manufacturing laminated sheet and apparatus therefor Download PDF

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Publication number
TW201215506A
TW201215506A TW100131446A TW100131446A TW201215506A TW 201215506 A TW201215506 A TW 201215506A TW 100131446 A TW100131446 A TW 100131446A TW 100131446 A TW100131446 A TW 100131446A TW 201215506 A TW201215506 A TW 201215506A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
laminated sheet
support
nozzle
Prior art date
Application number
TW100131446A
Other languages
Chinese (zh)
Other versions
TWI548526B (en
Inventor
Yasushi Takimoto
Takeshi Hosomi
Toshihide Kanazawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201215506A publication Critical patent/TW201215506A/en
Application granted granted Critical
Publication of TWI548526B publication Critical patent/TWI548526B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/022 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/07Parts immersed or impregnated in a matrix
    • B32B2305/076Prepregs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/10Fibres of continuous length
    • B32B2305/18Fabrics, textiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08Glass
    • B32B2315/085Glass fiber cloth or fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method for manufacturing a laminated sheet, comprising the following first and second steps. The first step is to supply a liquid first resin composition to at least one of one side of the support body (5) and one side of the fiber substrate (2). The second step is to press and contact the side of the support body (5) and the side of the fiber substrate (2) with the first resin composition disposed therebetween. In the first step, after the supply positions of the supply means (611-613) for supplying the liquid first resin composition are adjusted, the liquid first resin composition is supplied to at least one of one side of the support body (5) and one side of the fiber substrate (2).

Description

201215506 六、發明說明: 【發明所屬之技術領域】 本發明係關於積層片之製造方法及製造裝置。 【先前技術】 習知已將金屬箔或樹脂片與預浸片一體化的積層片使用 於多層印刷佈線板的製造(例如參照專利文獻1〜4)。 此處’此種積層片係如下述般進行製造。在金屬箔戒樹脂 片上塗佈樹脂清漆,然後重疊纖維基材’使上述樹脂清漆含 另外’本案的背景技術亦有專利文獻5。 [先行技術文獻] [專利文獻] 專利文獻1 :曰本專利特開2009-126917號公報 專利文獻2 :日本專利特開2010-47706號公報 專利文獻3 :曰本專利特開2004-82687號公報 專利文獻4 :日本專利特開2003-249739號公報 專利文獻5 :曰本專利特開2003-147172號公報 【發明内容】 此種專利文獻1〜4所揭示的製造方法中,係將樹脂清漆塗 佈於金屬结或樹脂片上之後,重疊纖維基材並使上述樹脂清 漆含浸’制m清漆對纖維基材的含浸量調 : 如專利文獻3係利用 卜 加難。例 f C接輥夾入銅箔、樹脂及織布(戈 100131446 201215506 不織布)’再使樹脂依―定量含浸 專利文獻3 W法,當欲轉樹糾。依照 微调整壓接輥的壓接力,導 ,又里時,必需 根據本發明,可提供一 送出的支撐體、與連續饋送出的纖維基材之間=連續鎖 樹脂組成物’將上述支撐體與上述纖维基材上、應第1 =組成物進㈣接㈣造積層W積W之料 上4支撐體其中—面、上述纖維基材其中—面中至少任 者,供應液狀第i樹脂組成物的第i步驟;以及 们:述支撐體的上述其中—面與上述纖維基材的上述其 h著上述第1樹脂組成物進行壓接的第2步驟; 4其中’上述第1步驟中,在對供應上述液狀第1樹脂組成 勿的仏應手段之供應位置進行調整後,對上述支撐體其中一 上I戴維基材其中—面中至少任—者供應液狀第i樹脂 組成物。 士根據本㈣’第1步驟中在對由供應手段進行的液狀第1 樹月曰經成物之供應位置進行調整後,對上述支撐體其中一 面上逃纖維基材其中一面中至少其中任一者供應液狀第i b十脂組成物。 藉此了 5周整第1樹脂組成物對纖維基材的含浸量。藉 此,可獲得所需含浸量的積層片。 ^00131446 201215506 再者,本發明亦提供積層片之製造裳置,係 連續饋送出支撐體的手段; 有. 連續饋送出纖維基材的手段; 1樹脂級 對上述支撐體與上述纖維基材之間供應液狀第 成物的供應手段;以及 纖維基材 隔者上述第1樹脂組成物,將上述支樓體與上述 施行壓接的壓接手段; 手段 Γ,具備有對上述供應手段之供應位置進行調整的調整 此處’所谓「對供應手段之供應位置進行調整」係包括有: 使仏應手&本身的位置進行移動而調整供應位置的情況,以 及在未使供應手段本身移動的情況下,藉由變更第1樹脂組 成物的供應σ (吐出口)位置,而調整供應手段之供應位置的 情況等二者。 依如上述,根據本發明可獲得所需的積層片。 上述目的以及其他目的、特徵及優點,藉由以下所述較佳 貫施形癌及其所附示的以下圖狀可更加清楚明瞭。 【實施方式】 以下,針對本發明積層片之製造方法及積層片,根據所附 示圖式的較佳實施形態進行詳細說明。另外’所有圖式中, 同樣的構成要件係料祕的元件符號,並適當省略說明。 圖1所不係本發明積層片的實施形態剖視圖,圖2所示係 100131446 201215506 本發明積層片的實施形態另一構造例示意剖視圖,圖3〜圖5 所示係本發明積層片之製造方法的實施形態中所使用積層 片製造裝置的構造例圖。 <積層片> 首先’針對本發明積層片的實施形態進行說明。另外,若 將積層片切斷為既定尺寸便可獲得預浸片。 另外’以下的說明中,將圖1(以下各圖亦同)中的上侧當 作「上」,將下側當作「下」而進行說明。又,圖1(以下各 圖亦同)係在厚度方向(圖中的上下方向)有誇大圖示情形。 圖1所示積層片1係整體形狀呈帶狀,具備有薄板狀(平 板狀)支撐體5、薄板狀(平板狀)纖維基材2、第1樹脂層3 及第2樹脂層4,該第i樹脂層3係被覆著纖維基材2其中 一面(上面)側,且由第1樹脂組成物構成,該第2樹脂層4 係被覆著纖維基材2的另一面(下面)側,且由第2樹脂組成 物構成。支撐體5與纖維基材2係隔著第丨樹脂層3(第工 樹脂組成物)進行接合。另外,該積層片1係經切斷為既定 尺寸而使用。 支樓體5係例如由金屬箱(金屬層)或樹脂薄膜構成。 金屬箱侧如後續會被加H㈣(電路)等的部分。構 成該金屬㈣金屬材料係可舉例如喊銅系合金、或銘系 口金铖或鐵系合金、不銹鋼等。而構成金屬落的金屬材料, 在β等導電性優異、容易利用触刻進行電路形成、且 100131446 201215506 低價的觀點而言,較佳仙或銅系合金。又,支撐體 使用極薄金屬箔(例如厚度 ^^ ^ 7 攸處置性的觀點 上^支撐體5亦可使用將前述極薄金屬箱設置於載體材料 再者’構成樹脂薄膜的樹脂材料係可舉例如氣系樹脂 酿亞胺樹脂、聚對笨m、聚對苯:甲酸乙二酿等 水酉顧4等。而構成樹脂薄膜的樹脂材料,在該等之中從 对熱性優異、低價的觀點而言,較佳係聚對苯二曱酸乙二 酉旨。又’樹脂薄膜較佳係對該樹脂薄膜靠第i樹脂層3側的 剝離處理者。藉此,後續便可輕易地將支樓體5 與第1秘脂層3予以分離。 支樓體5的平均厚度並無特別的限定,較佳係8〜7〇_ 左右、更佳係12〜40# m左右。 纖維基材2係具有提升積層片1之機械強度的機能。 該纖維基材2係可舉例如由以玻璃織布、玻璃不織布等玻 璃纖維基材;《卿旨纖維、_^_喊維、全 芳香族聚醯胺樹脂纖維等聚醯胺系樹月旨纖維;㈣樹脂纖 維、芳香族聚賴脂纖維、全料族一樹錢維等聚醋系 樹脂纖維,祕亞麟脂纖維、咖旨纖維料為主成分的 織布或不織布所職的合成纖維基材4以牛皮紙、棉短織 紙、短毛纖與牛皮紙㈣混抄紙等作為主成分之紙纖維基材 等有機纖維基材等之纖維基材等。 100131446 8 201215506 該等之中,纖維基材2較佳係玻璃纖維基材。藉由使用該 玻璃纖維基材,可更加提升積層片丨的機械強度。又,亦可 達減小積層片1之熱膨脹係數的效果。 構成此種玻璃纖維基材的玻璃係可舉例如E破璃、c玻 璃、A玻璃、s玻璃、D玻璃、NE玻璃、T玻璃、H玻璃等。 該等之中,玻璃較佳係S玻璃、或τ玻璃。藉此,可使玻 璃纖維基材的熱膨脹係數比較小,故可盡量減小積層片】 的熱膨脹係數。 纖維基材2的平均厚度並無特別的限定,較佳係1〇〇//m 以下,·更佳係50# m以下、特佳係1〇〜30/zm左右。藉由使 用該厚度的纖維基材2,便可在確保積層片1的機械強度情 況下達薄型化。且亦可提升積層片i的加工性•尺寸安定性。 在°玄纖維基材2的其中一面側設有第1樹脂層3,且在另 一面側設置第2樹脂層4。又,第1樹脂層3係由第1樹脂 組成物構成,另一方面’第2樹脂層4在本實施形態中係由 與上述第1樹脂組成物不同組成的第2樹脂組成物構成。 藉由該構成,便可因應對各樹脂層所要求的特性,適當設 定樹脂組成物的組成。 另外’當然第1樹脂組成物與第2樹脂組成物亦可相互組 成為相同。 本實施形態中’因為在第1樹脂層3上形成佈線部(導體 圖案),故第1樹脂組成物係設定為與金屬間之密接性優異 100131446 9 201215506 的組成。又’為了在由積層片1所獲得預浸片的第2樹月旨層 4中,可確實地埋入由積層片1所獲得之其他預浸片的佈線 部或其他纖維基材’第2樹脂組成物係設定為第2樹脂層4 的可撓性(柔軟性)高於第1樹脂層3的組成。相關此種各樹 脂組成物,於後詳述。 如圖1所示,本實施形態中,在纖維基材2的厚度方向其 中一部分中含浸第1樹脂組成物(第1樹脂層3)(以下將此部 分稱「第1含浸部31」),並在纖維基材2未含浸第1樹脂 組成物的殘餘部分中含浸第2樹脂組成物(第2樹脂層以 下將此部分稱「第2含浸部41」)。藉此,第1樹脂層3其 中一部分的第1含浸部31、與第2樹脂層4其中一部分的 第2含浸部41便位於纖維基材2内。而在纖維基材2内, 第1含浸部31(第1樹脂層3的下面)與第2含浸部41(第2 樹脂層4的上面)相接觸。換言之,第丨樹脂組成物係從纖 維基材2的上面側含浸於纖維基材2中,第2樹脂組成物則 從纖維基材2的下面側含浸於纖維基材2中,由該等樹脂組 成物填充纖維基材2内的空隙。 藉由該構成’纖維基材2可由第1樹脂層3與第2樹脂層 4進行保護。結果’即便對積層片i施加來自外部的衝擊時, 仍可防止纖維基材2本身遭受破壞’可確實發揮提升由纖維 基材2所帶來的積層片1之機械強度的效果。 再者,較佳係微觀觀看纖維基材2内部的第丨含浸部31 100131446 201215506 與第2含浸部41間之界面2〇時,該界面2〇形成凹凸(參照 圖1中的放大詳細圖)。藉此,不僅各樹脂層賴維基材2 的錨釘(anchor)效應,亦可提高樹脂層彼此間的密接性,並 • 可更確實防止各樹脂層從纖維基材2上剝離。藉此,可達積 '層片1的财久性提升。 如前述,第2樹脂層4的可換性係高於第i樹脂層3。當 獲得此種大小關係時’較佳係設定為第】含浸部31的平均 厚度大於第2含浸部41的平均厚度心[㈣⑹> tbi)。理由如下。 當將第2樹脂層4的可撓性設為高於第1樹脂層3時,會 有第2樹脂層4的熱膨脹率(線膨脹係數)大於第i樹脂層3 的傾向。故’若設為與「tal > tbi」相反大小的關係「、】〈〜」, 當積層片1被加熱時,在纖維基材2的内部,第2含浸部 41會出現較第1含浸部31更大的變形,會有纖維基材2的 部分處出現翹曲之可能性。該纖維基材2的部分處之勉曲, 會對積層>^整體造成敎影響,有導致積層片丨本身出現 翹曲的可能性。 彳目對於此’若設為「tal>tbl」,便可解決上述不良情況的 發生,可防止或抑制積層片丨發生翹曲情形。 另外’所謂「第2樹脂層4的線膨脹係數高於第j樹脂層 3的線膨脹係數」,係指25t〜3〇〇t下的面方向及/或厚方向 之平均線膨脹係數較高。 100131446 11 201215506 具體而言’將纖維基材2的最大厚度設為丁^叫時,上 述平均厚度tal較佳係0.7T〜0.95T、更佳係〇.8T〜〇.9τ。藉由 將平均厚度tal設定於該範圍内’可確實防止各樹脂層從纖 維基材2剝離,同時更確實地防止或抑制積層片丨發生翹曲 情形。 再者,將苐1樹脂層3除去第1含浸部31的部分(第j非 含浸部32)之平均厚度設為ta2[/zm],將第2樹脂層4除去 第2含浸部41的部分(第2非含浸部42)的平均厚度設為 tb2[ // m]時’較佳係滿足taZ $ tb2的關係、更佳係滿足1 $ xta2 <“的關係。藉由滿足此種關係,便可對積層片i上面側 的部分賦予較高的剛性,故可在該積層片丨的上面(第i非 含浸部32上的支撐體5)依高加工性形成佈線部。另一方 面,因為第2樹脂層4可具有高的可撓性與充分的厚度,故 當在由積層片1所獲得之預浸片的第2樹脂層4(第2非含 反部42)中埋入由積層片丨所獲得之其他預浸片的佈線部或 其他纖維基材時,便可確實地執行該埋藏。亦即,可提升對 由積層片1所獲得之其他預浸片的佈線部與其他纖維基材 的埋入性。 具驵而θ,平均厚度h較佳係2〜15〆m、更佳係3〜10 ^m。另一方面’平均厚度h較佳係3〜20//m、更佳係5〜15 μ m。 另外’積層片1在圖丨所示構成中,平均厚度“與平均 100131446 12 201215506 厚度tb2間之大小關係、為ta2<tb2,惟不僅限定於此,例如亦 可為 ta2 > tb2 ’ 亦可為 ta2=tb2。 再者’為能分別獲得具有上述特性的第】樹脂層3與第2 樹脂層4 ’第丨樹脂組成物與第2樹脂組成物較佳係設為如 下述組成。 第1樹脂組成物係含有例如硬化性樹脂,視需要亦可含有 硬化助劑(例如硬化劑、硬化促進劑等)及無機填充材中之至 少1種而構成。 為提升與構成佈線部的金屬(支撐體5)間之密接性,可舉 例如使用與金屬間之密接性優異的硬化性樹脂之方法、使用 k升與金屬間之密接性的硬化助劑(例如硬化劑、硬化促進 劑等)之方法、所使用的無機填充材係可溶於酸中的方法、 以及併用無機填充材與有機填充材的方法等。 該硬化性樹脂較佳係使用例如脲(尿素)樹脂、三聚氰胺樹 脂、雙馬來醯亞胺樹脂、聚胺基曱酸酯樹脂、具苯并哼啡環 的樹脂、氰酸酯樹脂、雙盼s型環氧樹脂、雙酴F型環氧 樹脂、及雙酚S與雙酚F的共聚合環氧樹脂等熱硬化性樹 脂。該等之中,硬化性樹脂特佳係使用氰酸酯樹脂(包括氰 酸酯樹脂的預聚物)° 藉由使用熱硬化性樹脂(特別係氰酸酯樹脂)’可減小積層 片1的熱膨脹係數(以下亦稱「低熱膨脹化」)。且,亦可達 成積層片1的電氣特性(低介電常數、低介電損耗)等之提升。 100131446 13 201215506 該氰酸醋樹脂係例如使!I化氰化合物與酚類進行反應,且 視需要利用加熱等方法施行預聚物化而可獲得。 具體的氰酸醋樹脂係可舉例如酚醛型氰酸酯樹脂、雙酚A 型氰酸酯樹脂、雙酚E型氰酸酯樹脂、四曱基雙酚F型氰 酸醋樹脂等雙_氰酸賴脂等。料之中,級自旨樹脂較 佳係酚酸型氰酸酯樹脂。 若使用祕型氰酸醋樹脂,在製作後述基板1〇(參照圖7) 後’硬化後的第1樹脂層3中交聯密度的增加,故可達成硬 化後的第1樹脂層3(所獲得基板)之耐熱性與難燃性提升。 此處,财熱性的提升可認為係因祕型氰酸略樹脂在硬化 反應後形成三㈣的緣故…難祕的提升係可認為雜 型氰酸_脂在構造上苯環比例較高,故該苯環容易碳化 (石墨化)’導致在經硬化後的第丨樹脂層3中出現碳化部分 的緣故。 積層片1施行薄 積層片1賦予優 再者,若使用酚醛型氰酸酯樹脂,即便將 型化(例如厚度35//m以下)的情況,仍可對 異剛性。又,該硬化物在加熱時的剛性亦優異,故所獲得之 基板10在安裝半導體元件(參照圖8)時的可靠度亦優 異。 又 具體可使用式(I)所示酚醛型氰酸酯樹脂。 [化1] 100131446 14 201215506201215506 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method and apparatus for manufacturing a laminated sheet. [Prior Art] A laminated sheet in which a metal foil or a resin sheet and a prepreg are integrated is used for the production of a multilayer printed wiring board (see, for example, Patent Documents 1 to 4). Here, such a laminated sheet is produced as follows. A resin varnish is coated on a metal foil or a resin sheet, and then the fiber substrate is superposed to make the above-mentioned resin varnish contain. Further, the background art of the present invention is also disclosed in Patent Document 5. [PRIOR ART DOCUMENT] [Patent Document] Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-126917, Patent Document 2: Japanese Patent Laid-Open No. 2010-47706, Patent Document 3: Japanese Patent Laid-Open No. 2004-82687 Patent Document 4: Japanese Laid-Open Patent Publication No. 2003-249739 (Patent Document No. 2003-147172) SUMMARY OF THE INVENTION In the manufacturing method disclosed in Patent Documents 1 to 4, a resin varnish is applied. After being laid on the metal knot or the resin sheet, the fibrous base material is overlapped and the resin varnish is impregnated. The impregnation amount of the m varnish to the fibrous base material is adjusted: as in Patent Document 3, it is difficult to use it. Example f C-roller is sandwiched between copper foil, resin and woven fabric (go 100131446 201215506 non-woven fabric), and then the resin is immersed in the patented 3 W method. According to the micro-adjustment of the crimping force of the crimping roller, it is necessary to provide a support body and a continuously fed fiber substrate according to the present invention. On the above-mentioned fiber substrate, the first = composition is connected to (four), (four) the build-up layer W is formed on the material 4, the support is at least one of the surface, and the surface of the fiber substrate is supplied with the liquid i-th resin. The i-th step of the composition; and the second step of the above-mentioned surface of the support and the above-mentioned fiber substrate being pressure-bonded to the first resin composition; 4 wherein the above-mentioned first step After adjusting the supply position of the means for supplying the liquid first resin composition, the liquid i-th resin composition is supplied to at least one of the upper surface of the upper support substrate. According to the fourth step of the present invention, in the first step, after adjusting the supply position of the liquid first tree sap through the supply means, at least one of the one side of the support body is escaping the fiber substrate. One of them supplies a liquid ib decant composition. Thereby, the impregnation amount of the first resin composition to the fiber base material was adjusted for 5 weeks. Thereby, a laminated sheet of the desired impregnation amount can be obtained. ^00131446 201215506 Furthermore, the present invention also provides a manufacturing device for laminating sheets, which is a means for continuously feeding out a support; a means for continuously feeding out a fibrous substrate; 1 a resin grade to the above-mentioned support and the above fibrous substrate And a supply means for supplying the liquid first product; and the first resin composition of the fiber substrate, the pressure-receiving means for pressing the support body and the pressure-receiving means; and means for supplying the supply means Adjustment of Position Adjustment Here, "the so-called "adjustment of the supply position of the supply means" includes: a situation in which the position of the hand/amp; itself is moved to adjust the supply position, and the supply means itself is not moved. In this case, both of the supply σ (discharge port) position of the first resin composition are changed, and the supply position of the supply means is adjusted. As described above, according to the present invention, a desired laminated sheet can be obtained. The above and other objects, features and advantages will be more apparent from the following description of the preferred embodiments. [Embodiment] Hereinafter, a method for producing a laminated sheet according to the present invention and a laminated sheet will be described in detail based on preferred embodiments of the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description is omitted as appropriate. 1 is a cross-sectional view showing an embodiment of a laminated sheet according to the present invention, and FIG. 2 is a schematic cross-sectional view showing another structural example of the laminated sheet according to the present invention, and FIGS. 3 to 5 show a manufacturing method of the laminated sheet of the present invention. An example of the structure of a laminated sheet manufacturing apparatus used in the embodiment. <Laminated sheet> First, an embodiment of the laminated sheet of the present invention will be described. Further, the prepreg can be obtained by cutting the laminated sheet into a predetermined size. In the following description, the upper side in Fig. 1 (the same applies to the following figures) will be referred to as "upper" and the lower side will be referred to as "lower". Further, Fig. 1 (the same applies to the drawings below) is exaggerated in the thickness direction (up and down direction in the drawing). The laminated sheet 1 shown in Fig. 1 has a strip shape as a whole, and includes a thin plate-like (flat-plate) support 5, a thin plate-like (flat-plate) fiber base material 2, a first resin layer 3, and a second resin layer 4. The i-th resin layer 3 is coated on one side (upper surface) side of the fiber base material 2, and is composed of a first resin composition, and the second resin layer 4 is coated on the other surface (lower surface) side of the fiber base material 2, and It is composed of a second resin composition. The support 5 and the fiber base material 2 are bonded via the second resin layer 3 (the first resin composition). Further, the laminated sheet 1 is used by being cut into a predetermined size. The branch body 5 is made of, for example, a metal case (metal layer) or a resin film. The metal box side will be added with H (four) (circuit) and the like as follows. The metal (tetra) metal material may be, for example, a copper alloy, a metal or iron alloy, or stainless steel. The metal material constituting the metal falling is excellent in conductivity such as β, and it is easy to form a circuit by contact, and it is preferable to use a copper-based alloy from the viewpoint of low cost of 100131446 201215506. Further, the support body is made of an extremely thin metal foil (for example, the thickness of the support material). The support body 5 may be a resin material in which the ultrathin metal case is provided on the carrier material and the resin film is formed. For example, a gas-based resin-based imine resin, a poly-p-m, a poly-p-benzene: a formic acid, a second-stranded water, etc., and a resin material constituting a resin film, among which heat is excellent and low in price. In view of the above, it is preferred to use polyethylene terephthalate. The resin film is preferably a releaser for the resin film on the side of the i-th resin layer 3. Thus, the subsequent process can be easily performed. The branch body 5 is separated from the first secret layer 3. The average thickness of the branch body 5 is not particularly limited, but is preferably about 8 to 7 〇 _, more preferably about 12 to 40 # m. The material 2 has the function of improving the mechanical strength of the laminated sheet 1. The fiber base material 2 is, for example, a glass fiber substrate such as glass woven fabric or glass non-woven fabric; "Qingzhi fiber, _^_ shouting, full aromatic Polyamide-based resin such as polyamidamide resin fiber; (4) Resin fiber, aromatic polymerization The synthetic fiber substrate 4 of the woven fabric or the non-woven fabric which is mainly composed of the phenolic resin fiber such as the fat fiber, the whole material group, the tree, and the polyester fiber, and the knit paper, the cotton woven paper, A fiber base material such as an organic fiber base material such as a paper fiber base material such as a short-fiber fiber or a kraft paper (4) mixed paper, etc. 100131446 8 201215506 Among these, the fiber base material 2 is preferably a glass fiber base material. By using the glass fiber substrate, the mechanical strength of the laminated sheet can be further enhanced, and the effect of reducing the thermal expansion coefficient of the laminated sheet 1 can be achieved. The glass system constituting the glass fiber substrate can be, for example, E-glass. , c glass, A glass, s glass, D glass, NE glass, T glass, H glass, etc. Among these, the glass is preferably S glass or τ glass. Thereby, the glass fiber substrate can be thermally expanded. Since the coefficient is relatively small, the thermal expansion coefficient of the laminated sheet can be minimized. The average thickness of the fibrous base material 2 is not particularly limited, but is preferably 1 〇〇//m or less, and more preferably 50 Å or less. Good system is about 1~30/zm. By using this thickness The fiber base material 2 can be made thinner while ensuring the mechanical strength of the laminated sheet 1. The workability and dimensional stability of the laminated sheet i can also be improved. In the resin layer 3, the second resin layer 4 is provided on the other surface side. Further, the first resin layer 3 is composed of the first resin composition, and the second resin layer 4 is in the present embodiment. The second resin composition having a different composition of the first resin composition is configured. With this configuration, the composition of the resin composition can be appropriately set in response to the characteristics required for each resin layer. Further, of course, the first resin composition and the first resin composition In the present embodiment, the first resin composition is set to have excellent adhesion to the metal, because the wiring portion (conductor pattern) is formed on the first resin layer 3 in the present embodiment. 9 The composition of 201215506. Further, in order to reliably embed the wiring portion or other fibrous substrate of the other prepreg obtained by the laminated sheet 1 in the second tree layer 4 of the prepreg obtained from the laminated sheet 1, the second portion The resin composition is set such that the flexibility (flexibility) of the second resin layer 4 is higher than that of the first resin layer 3. Such various resin compositions are described in detail later. As shown in Fig. 1, in the present embodiment, a part of the thickness direction of the fiber base material 2 is impregnated with a first resin composition (first resin layer 3) (hereinafter referred to as "first impregnation portion 31"). The second resin composition is impregnated into the remaining portion of the fibrous base material 2 in which the first resin composition is not impregnated (the second resin layer is referred to as "the second impregnation portion 41" hereinafter). Thereby, a part of the first impregnation portion 31 of the first resin layer 3 and a part of the second impregnation portion 41 of the second resin layer 4 are located in the fiber base material 2. In the fiber base material 2, the first impregnation portion 31 (the lower surface of the first resin layer 3) is in contact with the second impregnation portion 41 (the upper surface of the second resin layer 4). In other words, the second resin composition is impregnated into the fiber base material 2 from the upper surface side of the fiber base material 2, and the second resin composition is impregnated into the fiber base material 2 from the lower surface side of the fiber base material 2, and the resin is used. The composition fills the voids in the fibrous substrate 2. According to this configuration, the fiber base material 2 can be protected by the first resin layer 3 and the second resin layer 4. As a result, even when an impact from the outside is applied to the laminated sheet i, the fibrous base material 2 itself can be prevented from being damaged. The effect of improving the mechanical strength of the laminated sheet 1 by the fibrous base material 2 can be surely exhibited. Further, when the interface between the second impregnation portion 31 100131446 201215506 and the second impregnation portion 41 inside the fibrous base material 2 is preferably microscopically observed, the interface 2〇 is formed with irregularities (refer to the enlarged detailed view in FIG. 1). . Thereby, not only the anchor effect of each resin layer lining substrate 2 but also the adhesion between the resin layers can be improved, and the peeling of each resin layer from the fiber base material 2 can be more reliably prevented. Thereby, the product of the product can be improved. As described above, the exchangeability of the second resin layer 4 is higher than that of the i-th resin layer 3. When such a size relationship is obtained, the average thickness of the impregnation portion 31 is preferably larger than the average thickness center of the second impregnation portion 41 [(4) (6) > tbi). The reasons are as follows. When the flexibility of the second resin layer 4 is higher than that of the first resin layer 3, the coefficient of thermal expansion (linear expansion coefficient) of the second resin layer 4 tends to be larger than that of the i-th resin layer 3. Therefore, when the laminated sheet 1 is heated, when the laminated sheet 1 is heated, the second impregnation portion 41 will appear to be the first impregnation in the inside of the fibrous base material 2 as long as it is set to the same size as "tal > tbi". The larger deformation of the portion 31 causes the possibility of warpage at the portion of the fibrous substrate 2. The distortion of the portion of the fibrous base material 2 may cause an influence on the laminate layer as a whole, and may cause warpage of the laminated sheet bundle itself. If this is set to "tal> tbl", the above-mentioned problem can be solved, and the warpage of the laminated sheet can be prevented or suppressed. Further, the term "the linear expansion coefficient of the second resin layer 4 is higher than the linear expansion coefficient of the j-th resin layer 3" means that the average linear expansion coefficient in the plane direction and/or the thickness direction at 25t to 3〇〇t is high. . 100131446 11 201215506 Specifically, when the maximum thickness of the fibrous base material 2 is set to be squeezing, the average thickness tal is preferably 0.7T to 0.95T, more preferably 88T to 〇.9τ. By setting the average thickness tal within this range, it is possible to surely prevent the peeling of the respective resin layers from the fiber substrate 2, and more reliably prevent or suppress the occurrence of warpage of the laminated sheets. In addition, the average thickness of the portion (the j-th non-impregnated portion 32) in which the first impregnation portion 31 is removed from the crucible 1 resin layer 3 is ta2 [/zm], and the portion of the second impregnation portion 41 is removed from the second resin layer 4 When the average thickness of the (second non-impregnated portion 42) is tb2 [ // m], it is preferable to satisfy the relationship of taZ $ tb2 and more preferably satisfy the relationship of 1 $ xta2 < " by satisfying such a relationship. On the other hand, the upper portion of the laminated sheet i can be made highly rigid, so that the wiring portion can be formed on the upper surface of the laminated sheet (the support 5 on the i-th non-impregnated portion 32) with high workability. Since the second resin layer 4 can have high flexibility and a sufficient thickness, it is buried in the second resin layer 4 (second non-reverse portion 42) of the prepreg obtained from the laminated sheet 1. When the wiring portion of the other prepreg obtained by the laminated sheet or other fibrous substrate is used, the burying can be surely performed. That is, the wiring portion of the other prepreg obtained by the laminated sheet 1 can be improved. The embedding property of other fiber substrates. With 驵 and θ, the average thickness h is preferably 2 to 15 μm, more preferably 3 to 10 μm. On the other hand, the average thickness h is preferably 3 20//m, more preferably 5 to 15 μm. In addition, in the configuration shown in Fig. ,, the average thickness "is related to the average value of 100131446 12 201215506 thickness tb2, which is ta2 < tb2, but not limited Here, for example, ta2 > tb2 ' may also be ta2=tb2. Further, it is preferable that the resin layer 3 and the second resin layer 4' having the above-described characteristics are respectively obtained from the resin composition and the second resin layer. The first resin composition contains, for example, a curable resin, and may contain at least one of a curing aid (for example, a curing agent, a curing accelerator, and the like) and an inorganic filler. In order to improve the adhesion to the metal (support 5) constituting the wiring portion, for example, a method using a curable resin excellent in adhesion to metal and a hardening aid using k-lift and adhesion between metals (for example) For example, a method of a curing agent, a curing accelerator, or the like, an inorganic filler to be used, a method of dissolving in an acid, a method of using an inorganic filler and an organic filler, and the like. The curable resin is preferably, for example, a urea (urea) resin, a melamine resin, a bismaleimide resin, a polyamino phthalate resin, a resin having a benzoxanthene ring, a cyanate resin, and a double expectation. A thermosetting resin such as an s-type epoxy resin, a biguanide F-type epoxy resin, and a copolymerized epoxy resin of bisphenol S and bisphenol F. Among these, the curable resin is particularly preferably a cyanate resin (prepolymer including a cyanate resin). The laminated sheet 1 can be reduced by using a thermosetting resin (particularly a cyanate resin). The coefficient of thermal expansion (hereinafter also referred to as "low thermal expansion"). Further, the electrical characteristics (low dielectric constant, low dielectric loss) of the laminated sheet 1 can be improved. 100131446 13 201215506 The cyanic acid anhydride resin is obtained by, for example, reacting a cyanohydrin compound with a phenol, and prepolymerizing it by a method such as heating, if necessary. Specific examples of the cyanate resin include phenolic cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetradecyl bisphenol F type cyanate resin. Acid lyophile, etc. Among the materials, the grade is preferably a phenolic acid type cyanate resin. When the cyanate vinegar resin is used, the crosslinking density of the first resin layer 3 after curing is increased after the substrate 1 (see FIG. 7) described later is produced, so that the cured first resin layer 3 can be obtained. The heat resistance and flame retardancy of the substrate are improved. Here, the increase in the heat efficiency is considered to be due to the formation of three (four) of the secret type cyanate resin after the hardening reaction. It is considered that the heterogeneous cyanate-ester has a higher proportion of the benzene ring in the structure. The benzene ring is easily carbonized (graphitized) to cause a carbonized portion to appear in the hardened second resin layer 3. When the laminated sheet 1 is applied to the laminated sheet 1, it is preferable to use a phenolic type cyanate resin even when it is molded (for example, a thickness of 35/m or less). Further, since the cured product is excellent in rigidity during heating, the reliability of the obtained substrate 10 when mounting a semiconductor element (see Fig. 8) is also excellent. Further, a phenolic type cyanate resin represented by the formula (I) can be specifically used. [Chemical 1] 100131446 14 201215506

式⑴所示酚醛型氰酸酯樹脂中,其平均重複單位數「n」 並無特別的限定,較佳係卜⑺、更佳係2~7。若平均重複 單位數「n」未滿上述下限值,因為祕型氰酸s旨樹脂容易 結晶化’故對通用溶劑的溶解性會降低。故’依照_型氮 酸醋樹脂的含有量等因素,會有第丨樹脂組成物的清漆難以 取用之情況。又,在製作積層片!時會出現黏性,導致由積 層片1所獲得之預浸片彼此間相接觸時會出現相互附著、或 其中--預浸片的第!樹脂組成物移往於另一預浸片的現象 (轉印)。另-方面,若平均重複單位數「n」超過上述上限 值’會有第1樹脂組成物的清漆黏度變為過高,導致製作積 層片1時的效率(第1樹脂層3之成形性)降低之情況。、 再者’個後述提升與金屬間之密接㈣的硬化劑或硬化 =進=,除上述硬化性樹脂之外,尚可使用例如__ 改質的祕紛㈣脂、雙紛A祕樹脂等祕型紛樹脂;未 質二改、或經諸如桐油、亞麻仁油、核桃油等改 環氧樹/ 脂等祕型_脂等_脂;雙齡入 環氧樹脂等魏型環氧樹脂:_環_ Μ環氧樹脂等義型環氧樹脂;聯苯型環氧樹脂 100131446 15 201215506 等環氧樹脂;不飽和聚s旨樹脂、鄰苯二甲酸二稀丙醋樹脂、 聚石夕氧樹脂等其他的熱硬化性樹脂。 再者’在硬化性樹脂令,除了熱硬化性樹脂之外,尚可使 用例如紫外線硬化性樹脂、厭氣硬化性樹脂等。 硬化性樹脂的含有量並無特別的限定,較佳係佔第!樹脂 、、且成物全體的5〜50重量❶/。、更佳係1〇〜4〇重量。若硬化 性樹脂含有量未滿上述下限值,依照硬化性樹脂的種類等, 會有第1樹脂組成物的清漆黏度過低,導致較難形成積層片 1的情況。另一方面,若硬化性樹脂含有量超過上述上限 值,則因為其他成分之量過少,故依照硬化性樹脂的種類 等,會有積層片1的機械強度降低之情況。 上述硬化助劑(例如硬化劑、硬化促進劑等)係可舉例如三 乙胺、二丁胺、二氮雜雙環[2,2,2]辛烷等三級胺類;2-乙基 -4-乙基咪唑、2-苯基-4-曱基咪唑、2-苯基-4-曱基-5-羥曱基 咪唑、2-苯基-4,5-二羥甲基咪唑、2,4-二胺基-6-[2,-甲基咪唑 基-(Γ)]-乙基-s-三讲、2,4-二胺基-6-(2,-十一烷基咪唑基)-乙 基-s-三畊、2,4-二胺基-6·[2,-乙基-4-曱基咪唑基-(Γ)]-乙基-s_ 二讲、1-苄基_2-苯基咪唾等咪唾化合物。 s亥等之中’硬化助劑較佳係具有2個以上之從脂肪族烴 基、芳香族烴基、羥烷基及氰烷基中選擇的官能基之咪唑化 合物,更佳係2-笨基-4,5·二羥曱基咪唑。 再者’第1樹脂組成物中,亦可組合使用例如環烷酸鋅、 100131446 201215506 鈷 '辛酸錫、辛⑽、雙乙醯丙酮酸即、參乙驢 丙酮酸钻(ΙΠ)等有機金屬鹽;⑤、雙紛A、壬酿等紛化合 物’、醋酸、笨曱酸 '水楊酸、對甲苯石黃酸等有機酸等等。 田使用硬化助劑的情況’其含有量較佳係佔第i樹脂組成 物全體的0.01〜3重量%、更佳係0.1〜1重量%。 再者第1樹脂組成物較佳係含有無機填充材。藉此,即 更將潰層# 1 型化(例如厚度35"m以下),仍可獲得機械 強度優異的積層片i。且,亦可提升積層片W低熱膨脹化。 無機填充材係可舉例如滑石、氧化鋁、玻璃、熔融二氧化 夕之類的—氧切,或雲母、氫氧化銘、氫氧化錢等。又, 配,無機填充材的使用目的,可適當選擇破碎狀、球狀物。 從低熱雜性優異的觀點而言,無機填充劑較佳 糸氧化石夕、更佳係炫融二氧化啊特別係球狀溶融二氧化 無機 Μ 、材的平均粒徑較佳係0.01〜5.0/zm、更佳係 〇.2〜2.〇 " $外’斜均粒㈣、例如可利用粒度分佈計 (riba製「LA-遍」)進行測定。 尤卜機填充材較佳係平均粒徑50_以下的球狀熔 ™ 一、二矽、更佳係平均粒徑0.01〜2.0#m(特別係0.1〜0·5 二:東狀熔融二氧化矽。藉此’可更確實地使第1樹脂 L旨層2料紗_歸2内,且村在賴成之第1 '(第1含浸部31)的纖維基材2内部之面上,更確實 100131446 17 201215506 地形成凹凸。 再者,為提升第丨樹脂芦 充材亦可使用可溶於酸^ _、線部'之密接性’無機填 體層)係利用錢敷法形成於第、U填充材。藉此’當佈線部(導 該佈線部對第!樹月旨層3 /脂層的情況,可提升 酸中的無機填充材係可舉 性(鍍敷密接性)。該可溶於 屬氧化物等。、'*酸辦、氧化鋅、氧化鐵等金 再者’為提升第!樹脂層3與佈線部間之密接性 用無機填充材與有機填充材。該/ 亦可併 聚合物、聚酿亞胺等樹脂系填^材/材係可舉例如液晶 使用無機填充材的情況,其旦、 係佔第1樹月旨組成物全體的2〇〜、^。、特別的限疋,較佳 量%。 重置。/。、更佳係30〜6〇重 當硬化性樹脂係❹氰動旨樹 脂)的情況,較佳係併用環氧樹月旨(=別係騎型氰酸酉旨樹 氧樹脂係可舉例如酴祕型貝上不含4原子)。該環 型環氧樹脂、芳香伸燒型環氧樹=型環氧樹脂、蔡 該等之卜環氧樹職佳㈣香 用芳香伸炫型環氧樹脂,硬化後的由使 板何提升吸濕谭錫耐熱性(吸濕後的_ =基 所謂「芳嫩崎_」蝴她、 上之芳基伸議環氧樹脂’可舉例如伸苯二甲二: 100131446 201215506 脂、聯苯二亞甲基型環氧樹脂等。該等之中,芳香伸燒型環 氧樹脂較佳係聯苯二亞甲基型環氧樹脂。 具體係可使用式(II)所示聯苯二亞曱基型環氧樹脂。 [化2]In the phenolic cyanate resin represented by the formula (1), the average repeating unit number "n" is not particularly limited, and is preferably (7), more preferably 2 to 7. When the average number of repeating units "n" is less than the above lower limit value, since the secret type cyanic acid s is intended to be easily crystallized, the solubility in a general-purpose solvent is lowered. Therefore, it is difficult to obtain a varnish of the second resin composition in accordance with factors such as the content of the KOH type vinegar resin. Also, making a layered piece! Viscosity occurs when the prepreg obtained by the laminated sheet 1 comes into contact with each other, or in which the prepreg is the first! The phenomenon in which the resin composition is transferred to another prepreg (transfer). On the other hand, when the average repeating unit number "n" exceeds the above upper limit value, the varnish viscosity of the first resin composition is too high, and the efficiency in producing the laminated sheet 1 (formability of the first resin layer 3) ) Reduce the situation. Furthermore, the hardener or hardening = in addition to the adhesion between the metals (4) will be described later. In addition to the above-mentioned curable resin, for example, __ modified secrets (four) fat, double-sided A secret resin, etc. The secret type is resin; the second type is changed, or the secret type such as tung oil, linseed oil, walnut oil, etc. is changed to epoxy tree/fat, etc. _ ring _ Μ epoxy resin equivalent epoxy resin; biphenyl type epoxy resin 100131446 15 201215506 and other epoxy resin; unsaturated poly s resin, phthalic acid diisopropyl vinegar resin, polyoxet Other thermosetting resins. Further, in the curable resin, for example, an ultraviolet curable resin, an anaerobic resin, or the like can be used in addition to the thermosetting resin. The content of the curable resin is not particularly limited, but is preferably in the first place! Resin, and 5 to 50 weights of the entire product. More preferably, the weight is 1〇~4〇. When the content of the curable resin is less than the above-mentioned lower limit, the varnish viscosity of the first resin composition may be too low depending on the type of the curable resin, etc., and it may be difficult to form the laminated sheet 1. On the other hand, when the content of the curable resin is more than the above-mentioned upper limit, the amount of the other component is too small, and the mechanical strength of the laminated sheet 1 may be lowered depending on the type of the curable resin or the like. Examples of the above-mentioned curing aid (for example, a curing agent, a curing accelerator, etc.) include tertiary amines such as triethylamine, dibutylamine, and diazabicyclo[2,2,2]octane; 2-ethyl- 4-ethylimidazole, 2-phenyl-4-mercaptoimidazole, 2-phenyl-4-mercapto-5-hydroxydecylimidazole, 2-phenyl-4,5-dimethylolimidazole, 2 ,4-diamino-6-[2,-methylimidazolyl-(indenyl)]-ethyl-s-tris, 2,4-diamino-6-(2,-undecylimidazole Base)-ethyl-s-three tillage, 2,4-diamino-6·[2,-ethyl-4-mercaptoimidazolyl-(indenyl)]-ethyl-s_ bis, 1-benzyl Base 2 - phenyl imino saliva and other sodium saliva compounds. The hardening aid in shai or the like is preferably an imidazole compound having two or more functional groups selected from an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a hydroxyalkyl group, and a cyanoalkyl group, and more preferably a 2-phenyl group. 4,5·dihydroxydecyl imidazole. Further, in the first resin composition, for example, an organic metal salt such as zinc naphthenate, 100131446 201215506 cobalt 'lithium octoate, octyl (10), diacetyl acetonate or ginseng pyruvate (ΙΠ) may be used in combination. ; 5, double A, brewing and other compounds ', acetic acid, alum acid 'salicylic acid, p-toluene, such as organic acids and so on. In the case where the hardening aid is used in the field, the content thereof is preferably 0.01 to 3% by weight, more preferably 0.1 to 1% by weight based on the total of the i-th resin composition. Further, the first resin composition preferably contains an inorganic filler. Thereby, even if the layer #1 is formed (for example, the thickness is 35 " m or less), the laminated sheet i excellent in mechanical strength can be obtained. Moreover, it is also possible to increase the low thermal expansion of the laminated sheet W. Examples of the inorganic fillers include talc, alumina, glass, oxygen dioxide, or mica, oxyhydroxide, and hydrazine. Further, for the purpose of use of the inorganic filler, the crushed shape or the spherical shape can be appropriately selected. From the viewpoint of excellent low thermal friction, the inorganic filler is preferably 糸 糸 夕 、 、 、 、 、 、 、 、 炫 炫 炫 炫 炫 炫 炫 炫 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别Zm, more preferably 2.2~2. 〇" $外的斜均均粒(四), for example, can be measured by a particle size distribution meter ("LA-pass" manufactured by Riba). Preferably, the Ub machine filler is a spherical melt TM having an average particle diameter of 50 Å or less, preferably having an average particle diameter of 0.01 to 2.0 #m (particularly 0.1 to 0·5 2: east-like molten dioxide)矽 矽 借此 借此 ' 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 , , , , , , More specifically, 100131446 17 201215506 The surface is formed with irregularities. In addition, in order to improve the second resin refill material, it is also possible to use the acid-soluble _ and the line portion 'intimate 'inorganic filler layer'. U filler. Therefore, when the wiring portion is used, the inorganic filler in the acid can be lifted (plating adhesion) in the case where the wiring portion is applied to the first layer 3/lip layer. This is soluble in oxidation. , etc., '*acid, zinc oxide, iron oxide, etc., are added to enhance the second! The inorganic filler and the organic filler are used for the adhesion between the resin layer 3 and the wiring portion. In the case of a resin-based material or a material such as a poly-imine, for example, when an inorganic filler is used for a liquid crystal, it is a 〇 、 、 、 、 、 、 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋Preferably, the amount of % is reset. /., more preferably 30 to 6 〇 when the curable resin is a cyanide-based resin, and it is preferred to use an epoxy resin. The sputum resin may be, for example, a scorpion-type shell which does not contain 4 atoms. The ring-shaped epoxy resin, the aromatic stretch-burning epoxy tree=type epoxy resin, the Tsai, etc., the epoxy resin, the good (4) fragrance, the aromatic stretch-type epoxy resin, and the hardened Wet tan tin heat resistance (after the moisture absorption _ = base called "Fang Nen Saki _" butterfly her, the upper aryl base to discuss epoxy resin' can be, for example, exophthalene: 100131446 201215506 fat, biphenyl dimethine A base type epoxy resin, etc. Among them, the aromatic stretch-type epoxy resin is preferably a biphenyl dimethylene type epoxy resin. Specifically, a biphenyl diazinium group type represented by the formula (II) can be used. Epoxy resin.

_CHr_CHr

式 <11) η係任意整數 式(II)所示聯苯二亞甲基型環氧樹脂的平均重複單位數 「η」並無特別的限定’較佳係卜⑺、更佳係w。若平均 重複單位數「η」未滿上述下限值,因為聯苯二亞曱基型環 乳樹脂容易結晶化’故對通聽躺溶解性會降低。故,會 有第1樹脂層組成物的清漆難以取用之情況。另—方面,若 平均重複單位數「η」超過上述上限值,依照所使用溶劑, 會有第1樹脂組成物的清漆黏度上升之可能性。此情況,無 法將第1樹脂組成物充分地含浸於纖維基材2中,結果成為 積層片1的成形不良與機械強度降低之原因。 併用環氧樹脂的情況,其含有量並無特別的限定,較佳係 佔第1樹脂組成物全體的1〜55重量%、更佳係2〜4〇重量%。 再者,在第1樹脂組成物巾亦可添加提升與金制之密接 3成她括樹脂等)。該成分係可舉例如苯氧樹脂、聚乙 稀醇糸樹脂、偶合劑等。 苯氧樹脂係可舉例如具雙时架的苯氧樹脂、具蔡骨架的 100131446 201215506 苯氧樹脂、具聯苯基骨架的苯氧樹脂等。又,亦可使用具有 該等骨架複數種之構造的苯氧樹脂。 該等之中,苯氧樹脂較佳係使用具有聯苯基骨架與雙酚s 骨架的苯氧樹脂。藉此,利用聯苯基骨架所具有的剛硬性, 可提高苯氧樹脂的玻璃轉移溫度,並可利用雙酚s骨架的存 在,而提升苯氧樹脂與金屬間之密接性。結果,可達第1 樹脂層3的耐熱性提升,且當製造多層基板之際,亦可提升 佈線部(金屬)對第1樹脂層3的密接性。 再者,苯氧樹脂使用具雙酚A骨架與雙酚F骨架的苯氧 樹脂亦佳。藉此,在多層基板製造時,可更加提升佈線部對 第1樹脂層3的密接性。 苯氧樹脂的分子量並無特別的限定,重量平均分子量較佳 係 5,000〜70,000、更佳係 10,000〜60,000。 使用苯氧樹脂的情況,其含有量並無特別的限定,較佳係 佔第1樹脂組成物全體的1〜40重量%、更佳係5〜30重量%。 偶合劑較佳係使用從例如環氧矽烷偶合劑、鈦酸酯系偶合 劑、胺基矽烷偶合劑、及聚矽氧油型偶合劑中選擇之1種以 上。 使用偶合劑的情況,其含有量並無特別的限定,相對於無 機i真充材100重量份,較佳係0.05〜3重量份、更佳係0.1〜2 重量份。 再者,第1樹脂組成物係除了以上所說明成分之外,視需 100131446 20 201215506 要尚可含有諸如:消泡劑、均塗劑、顏料、抗氧 劑。 劑專添加 第2樹脂組成物係與第丨樹脂組成物不同的組成,具_ 言,第2樹脂層4係設定為可撓性高於第!樹 而 J 日j的組。 另外,所謂「組成不同」係指第1樹脂組成物與第2杓月t、 成物非由相同樹脂組成物構成,例如有構成第丨樹浐纟曰汲 的成分至少一者不同於第2樹脂組成物的情況,以成物 1樹脂組成物的成分含有量不同於第2樹脂組成物的2 等。更具體而言,藉由使樹脂或填充材等的種類及含= 樹脂的分子量(平均重複單位數)等之至少一者不同 里 脂組成物軸成便衫同於第丨樹餘成物。結果第2樹 樹脂層4便具有與第1樹脂層3不同的特性。。,第2 該第2樹脂層4的面方向、即積層片1的長邊方 向)及寬度方向(Y方向)之熱膨脹係數並無特別的=方 係脚帅/t以下、更佳係5〜l6ppmrc。若第2樹脂層= 熱膨服係數在上述範圍内,積層片1便可具有高的連接可靠 度’所獲狀基㈣半導體元料的安裝可靠度優異。 再者’積層片1整體的面方向熱膨脹係數並無特別的限 定,較佳係16PPm/t以下、更佳係12ppm/t:以下、特佳係 5〜10ppm/C。若積層片1的熱膨脹係數在上述範圍内,可 提升所獲得之基板對重複熱衝擊的耐龜裂性。 面方向的熱膨脹係數係例如可使用TMA裝置(ΤΑ 100131446 21 201215506 ::二依_分的升溫進行評價。 側之面上,設置例如未圖t 與纖維基材2相反 係經剝離該樹脂薄膜之後月况積層片 ς 使用另外,樹脂薄膜係可使用 與作為支雜5的樹脂薄膜所朗者為同樣者。 其次,針對積層片的另一止 構仏例進行說明。另外,以與前 述積層片1的相異處為中心 進订°兄月,相關同樣的事項係省 略說明。 如圖2⑷所示’積層片1A係在纖維基材2的厚度方向未 含浸有第i樹脂組成物(第1樹脂層3)與第2樹脂組成物(第 2樹脂層4)。例如藉由調整供應第1樹脂組成物的位置,使 第1樹脂組成物賴,亦可形成如圖2⑷所示幾乎未含浸第 i樹脂組成物的構造。又,藉由將清漆狀第2樹脂組成物的 黏度設為非常高’或如圖5所示,利㈣合裝置&施行加 熱時,將薄片狀第2樹脂組成物的炼融黏度設為非常高,便 可成為如圖2(a)所示幾乎未含浸第2樹脂組成物的構造。 如圖2(b)所示,積層片1B在纖維基材2的厚度方向整體 係含浸有第1樹脂組成物,但並未含浸第2樹脂組成物。 如圖2(c)所示,積層片1 c係在纖維基材2的厚度方向整 體含浸有第2樹脂組成物,但並未含浸第1樹脂組成物。例 如藉由調整供應第1樹脂組成物的位置,使第1樹脂組成物 乾燥,亦可成為如圖2(c)所示幾乎未含浸第〗樹脂組成物的 100131446 22 201215506 構造。 如圖2(d)所示,積層片1D係在纖維基材2的厚度方向其 中一部分含浸有第1樹脂組成物,但未含浸第2樹脂組成物。 如圖2(e)所示,積層片1E係在纖維基材2的厚度方向其 中一部分含浸第2樹脂組成物,但並未含浸第i樹脂組成 物。例如藉由調整供應第丨樹脂組成物的位置,使第1樹脂 組成物乾燥,亦可成為如圖2(e)所示幾乎未含浸第丨樹月^ 成物的構造。 、如圖2(f)所示’積層片1F係省略第2樹脂層(第2樹脂組 成物\又,圖不的構造係在纖維基材2的厚度方向未含浸 第1祕脂組成物。例如藉由調整供應第1樹脂組成物的位 置、It第1樹脂組成物乾燥,亦可成為如圖2_示幾乎未 含浸第1樹脂組成物的構造。 ★另士卜其他尚可舉出在纖維基材2的厚度方向整體含浸有 第才十月曰、.且成物者、或在纖維基材2的厚度方向其中一部分 含浸有第1樹脂組成物者等。 :亡所說明的積層片1Α〜1Ε亦與前述積層片i同樣,第 1細日組成物與第2樹脂組成物係可為相互組成*同、亦可 為相互級成相同。 <積層片製造裝置> -針對本發明積層片之製造方法的實施形態中所使用 的積層 製造裝置’即積層片製造時所使用的積層片製造裝 100131446 23 201215506 置構造例進行說明。參照圖3〜圖5進行說明。 本發明製造裝置的概要係如下述。 製造裝置係具備有: 連續饋送出支撐體5的手段621 ; 連續饋送出纖維基材2的手段623; 對上述支撐體5與上述纖維基材2之間供應液狀第】樹脂 組成物的供應手段611〜613(或6ιι);以及 隔著第1樹脂組成物,將上述支撐體5與上述纖維基材2 施行壓接的壓接手段625。而冑造裝置係具備有對利用上述 供應手段進行的上述液狀第丨樹脂組成物之供應位置進行 调整的調整手段661〜663(或使供應手段611改變位置的手 段)。 圖3所示積層片製造裝置6、圖4所示積層片製造裝置 6a、圖5所示積層片製造裝置6b,分別係連續製造積層片 的裝置。而積層片製造裝置6與6a係可對應於後述積層片 之製造方法的第1實施形態與第2實施形態。又,積層片製 造裝置6b係可對應於後述積層片之製造方法的第3實施形 態與第4實施形態。 (積層片製造裝置6) 首先,針對積層片製造裝置6進行說明。 如圖3所示,積層片製造裝置6係具備有輥 (roll)621〜628、喷嘴(狭縫式塗佈機)611〜614、及乾燥裝置 100131446 24 201215506 64 ° 輥· 621係饋送出(繞出)對象物的 于奴,在該輥021上捲繞 者支撐體5。輥621係構成為利用未 — 禾圖不之馬達(驅動源)進 仃方疋轉,若該輥621旋轉,則從較6 續的供應)。 饋送出支樓體5(連 著饋送_物的手段,在該_上捲繞 :,2。1“23係構成為利用未圖示之馬達進行旋 轉右忒輥623旋轉,則從輥623 的供應)。 ‘出纖維基材2(連續 再者’親622係規範支撐體5之移 輥621的後段。 向的手段,設置於 再者,輥624係規範纖維基材2 於輥622的後段。 移動方向的手段,設置 再者,輥625係規範對象物之 設置於輥 間(亦即支撐體5與纖維基材 向’且將對象物彼此 622與624的後段- 乂貼合的手段, 沿該輥625的外周面,依直 支撐體5。此時,支斤触, 上述外周面的方式搬送 牙月a 5係面接觸 以上。 〗季叱625的圓周之1/4 再者,纖維基材2价θ + 亦疋沿輥625的& 外周面的方式進行枷、、, 卜周面’依接觸到上述 呶迗。纖維基材2係 體5的處所,隔著支 m在輥625接觸到支撐 八得體5接觸到輟 100131446 t46 b 625。其中,纖維基材 25 201215506 2與輕6M間之接觸面積係小於支撐體5與觀仍間之接觸 面積。具體而言,支撐體5係依輥625的圓周之1/4〜1/2進 行面接觸,相對於此,纖維基材2係依輥625的圓周之 1/6〜1/4進行面接觸。藉此,可降低對纖維基材2所施加的 張力’俾可抑制纖維基材2的變形。 再者,雖於後亦有詳述,纖維基材2與支撐體5會被朝饋 送出方向拉伸,並對該等施加張力。 藉此,利用輥625的外周面,便可將支撐體5與纖維基材 2隔著第1樹脂組成物進行壓接。另外,本實施形態中,並 沒有配置相對於輥625為對向配置,且用以將支禮體5與纖 維基材2施行壓接的輥。 此處’輥625係至少表面由金屬構成的金屬輥。此種金屬 輥係表面平滑性高,可穩定地支撐著支撐體5、第1樹脂組 成物及纖維基材2。故,可使第1樹脂組成物的纖維基材2 寬度方向之重量分佈均勻。 再者’輥626與輥627分別係規範對象物之移動方向的手 段,在輥625的後段依此順序設置。 再者’親628係捲取對象物(即積層片1)的手段。親628 係構成為利用未圖示之馬達進行旋轉,若該輥628進行旋 轉’積層片1便被捲取於輥628上。 喷嘴611〜613分別係吐出(供應)常溫(25°C )下呈液狀(清漆 狀)之第1樹脂組成物的手段(例如狹縫式塗佈機)。該供應手 100131446 26 201215506 段係可調整液狀第1樹脂組成物的供應位置。亦即,該供應 手段係可在支撐體5之其中一面、或纖維基材2之其中一 面、或支撐體5之其中一面與纖維基材2之其中一面之間, 選擇至少任1處所並供應液狀第1樹脂組成物。更詳細說 • 明’供應手段係設有喷嘴611〜613,噴嘴611係朝支樓體5 的其中一面吐出液狀第1樹脂組成物,喷嘴612係朝纖維基 材2的其中一面吐出第丨樹脂組成物,噴嘴613係朝支撐體 5的其中一面與纖維基材2的其中一面之間吐出液狀第}樹 脂組成物。又,製造積層片i之際’從喷嘴611〜613中選擇 吐出第1樹脂組成物的至少1個喷嘴。藉此,使供應手段的 供應位置(亦即吐出π的位置)被調整。該選擇係藉由在喷嘴 611〜613下游側的流路中分別設置之閥(調整手段1 “a 進行開閉而實施。 另外,所谓「液狀」並不僅侷限於液體,亦涵蓋具流動性 者的概念。 再者噴嘴614係朝支撐體5與第i樹脂組成物相反側之 面上,吐出(供應)常溫(坑)呈液狀(清漆狀)第2樹脂組成 • 物的手段(例如狹缝式塗佈機)。 ,。乾燥裝置64係設置於噴嘴614(報625)與報626之間。乾 裝置64在本實施形態中係使用將對象物(第2樹脂組成 、纖維基材2、第1樹脂組成物、支樓體5)—邊朝水平搬 送一邊施行乾燥者。#此,可使輯維紐2施加的張力比 100131446 27 201215506 較小,俾可防止或抑制内部應變。 另外,乾燥裝置64係藉由對上述對象物施行加熱’而將 上述對象物予以乾燥者。經乾燥後的積層片中,第1樹脂層 3與第2樹脂層4均呈B階段(B-stage)狀態’成為薄片狀。 (積層片製造裝置6a) 其次,針對積層片製造裝置6a進行說明。另外’以與前 述積層片製造裝置6的相異處為中心進行說明’相關同樣的 事項係省略說明。 如圖4所示,積層片製造裝置6&中’對積層片製造裝置 6省略噴嘴612、613 ’而屬於液狀第1樹脂組成物之供應手 段的噴嘴611係設置成可利用未圖示之致動器(調整手段)進 行改變位置。亦即,喷嘴611係依其吐出口可朝支撐體5 之其中一面、或纖維基材2之其中一面、或支撐體5與纖維 基材2之間等任一處所的方式,進行移動或姿勢變更。製造 積層片1之際,選擇上述喷嘴611的吐出口位置及朝向,朝 支撑體5之其中一面、或纖維基材2之其中一面、或支樓體 5與纖維基材2之間等至少一者吐出第2樹脂組成物。 更具體說明,從喷嘴611朝支樓體5之其中一面供應液狀 第1樹脂組成物。 再者,當從喷嘴611朝纖維基材2之其中一面供應液狀第 1 Μ脂組成物時,係朝向由報624所支撐的處所供應液狀第 1樹脂組成物。依此的話,可提高第1樹脂組成物對纖維基 100131446 28 201215506 材2的含浸程度。 再者,當從喷嘴611朝向支撐體5與纖維基材2之間供應 液狀第1樹脂組成物時,係朝由纖維基材2與支樓體5所包 夾的空間供應第1樹脂組成物。更詳細說明,係朝向接觸到 •輥62:5的支撐體5、與相對向於該支撐體5且對輥625呈遠 - 離狀態的纖維基材2之間,由喷嘴611供應液狀第1樹脂組 成物,本實施形態中,第1樹脂組成物係供應給由輥625 所支撐的支撐體5。 再者,喷嘴611係藉由使其位置改變位置,而可調整支樓 體5其中一面的供應位置,即沿支撐體5饋送出方向的第1 樹脂組成物之供應位置。 同樣的,喷嘴611係就藉由使其位置改變位置,而可調整 纖維基材2其中一面的供應位置,即纖維基材2饋送出方向 的第1樹脂組成物之供應位置。 (積層片製造裝置6b) 接著,針對積層片製造裝置6b進行說明。另外,以與前 述積層片製造裝置6的相異處為中心進行說明,相關同樣的 事項係省略說明。 如圖5所示,積層片製造裝置6b中,對積層片製造裝置 6係省略喷嘴614,但設有貼合裝置65及輥629。 貼合裝置65係設置於輥627與輥629之間。貼合裝置65 係具備有對向配置的1對輥651與652、以及對輥651與652 100131446 29 201215506 施行加熱的未圖示之加熱部;在輥651與輥652之間包夾對 象物,構成對該對象物施行加壓且加熱狀態。 輥629係設置於貼合裝置65的前段。輥629係饋送出對 象物的手段,在該輥629上捲繞著後述片材7。輥629係構 成為利用未圖不之馬達進行旋轉,若該輥629進行旋轉,便 從輥629饋送出片材7(連續的供應)。 <積層片之製造方法> 首先’針對以下實施形態的積層片之製造方法的概要進行 說明。 積層片1之製造方法係對連續饋送出的支撐體$與連續饋 送出的纖維基材2之間’供應第1樹脂組絲,並將支撐體 5與纖維基材2隔著上述第丨樹脂組成物施行壓接而製造積 層片的方法。 積層片之製造方法係包括有: 對支撐體5之其中一面與纖維基材2之其中一面中至少任 一者’供應液狀第1樹脂組成物的第i步驟;以及 將支撐體5之上述其中一面與上述纖維基材2之上述其中 -面’隔著上述第丨樹脂組成物施賴接的第2步驟。其中, 在第i步驟中,在對供應上述液狀第丨樹脂組成物的供應手 段之供應位置進賴整後,對支撐體5之其巾—面與纖維基 材2之其中-面中至少其中—者,供應液狀第i樹脂組成物。 <第1實施形態> 100131446 30 201215506 ▲其次’針對本㈣積層狀製造方法的第1實施形態進行 °兒月另外,第1實施形態係使用積層片製造裝置6。 (第1步驟) ° . *圖、3所示’使積廣片製造裝置6的輥621旋轉,從該親 .621饋送出(連續供應)支稽體5,並使親⑵旋轉而從該親 ' 623饋送出(連續供應)纖維基材2,且使輥628旋轉,而使 該輥628捲取含有支㈣5與纖維基材2的積層片。 從輥621所饋送出的支撐體5及從親623所饋送出的纖維 基材.2係被朝輥625的外周面供應,纖維基材2與支撐體$ 間之距離係越朝輥625越狹窄。 再者,選擇喷嘴611〜613中至少其中一喷嘴,並從該所選 擇喷嘴吐出液狀第1樹脂組成物。藉此,供應手段供應第i 樹脂組成物的位置(吐出位置)便被調整。另外,該噴嘴的選 擇係可為喷嘴611〜613中之任丨個的情況、或任2個的情 況、或任3個的情況等任一者均可。另外,當第〗樹脂組成 物欲較厚塗佈的情況,可選擇複數喷嘴。 選擇喷嘴611的情況,係從該喷嘴611朝支撐體$之其中 • 一面吐出(供應)第1樹脂組成物。此處,朝向支撐體5中沒 - 有接觸到輥625的處所,由喷嘴611供應液狀第丨樹脂組成 物。 再者,選擇喷嘴612的情況,係從該噴嘴612朝纖維基材 2之其中-面吐出第1樹脂組成物。在此,朝向纖維基材2 100131446 31 201215506 中由概所支撐的處所,由喷嘴612供應液狀第丨樹脂組 成物。藉此,可提高第】樹腊紐成物對纖维基材2的含浸程 度。 再者選擇喷紫6U的情況,係從該喷嘴⑴朝向支撐體 5與纖維基材2之射㈣1樹驗成物。朝向由纖維基材 2與支擇體5所包央空間’由嘴嘴613供應第】樹脂組成物。 更詳細說明,朝向在接觸到親625的支撐體5、與相對向於 «亥支樓體5且對輥62 5王遠離狀態的纖維基材2之間所形成 空間,由喷嘴613供應液狀第1樹脂組成物。來自喷嘴613 的液狀第組絲便成為敎撐體5與纖絲材2雙方 均供應之㈣。財嘴613蚊频5的液« 1樹脂組成 物之供應處所’係較由喷嘴川所供應液狀第1樹脂組成物 的供應處所’更靠支撐體5供應方向(從輕621的饋送出方 向)前端側。同樣的,從噴嘴⑴朝纖維基材2的液狀第丨 樹脂組成物之供應處所,係較由喷嘴犯所供應液狀第1 _組成㈣供應處所,更靠纖維基们供應方向(從親⑵ 的饋送出方向)前端側。 另外’從嘴嘴611〜⑴所吐出的第!樹脂組成物組成,在 本實施形態中係可相互為相同,惟並不僅侷限此,亦可為不 同。 (第2步驟) ”在麵625中,將支撐體5與纖維基材2隔著第1 100131446 32 201215506 樹脂組成物進行壓接。 2括去ϋ支撐體5接觸到觀625的外周面。此時,纖維基材 之严m㈣支撐體5的相面,在纖維紐2與支樓體5 之間形成空間。然後,纖 、哉、准基材2隔著支撐體5與液狀第1 树月曰組成物接觸到輥625 ,外周面,错此,纖維基材2與支 撐體5便被壓接。此時的 找體5與纖維基材2間之夾角角 度(貼合角度:接觸至丨丨1 喊a 的支擇體5、與相對向於該支 撐體.5且迆離支撐體5的 么_ 哉卓基材2之夾角度)Θ,較佳係銳 角。措此,可防止或抑制纖維基材2產生應變。 再者,纖維基材2側的張力較佳係較铸支撐體5侧的張 力。具體而言’纖維基材2側的張力較佳係麵以下、更 佳係15〜25N左右。藉此,可防止或抑制纖維基材2的尺寸 變化與内部應變。 (第3步驟) 其次,從喷嘴614吐出液狀第2樹 树月日組成物,而朝纖維基 材2與第㈣脂組成物相反側之面,供應該第2樹脂組成物。 第i樹脂組成物與第2樹脂組成物係相互組成不同。藉 此,可配合對第1樹脂層3、第2樹脂風/ w 曰 W月曰層4所要求的特性, 分別適當設定樹脂組成物的組成。 另外,當第2樹脂組成物欲較厚塗備沾 主种的情況,例如可在複 數處所設置吐出第2樹脂組成物的嗔嘴。 (第4步驟(乾燥步驟)) 100131446 33 201215506 接著,利用乾燥裝置64,使第i樹脂組成物與第2樹脂 組成物乾燥。藉此,獲得積層片丨。該積層片丨係被捲取於 幸昆628上。 乾燥條件並無特別的限定,係配合第丨樹脂組成物與第2 樹脂組成物的組成及諸條件而適當設定,較佳係第丨樹脂組 成物與第2樹脂組錢巾的揮發齡,相對於旨分別設定 在1.5wt/〇以下、更佳係〇 8〜左右。具體而言,乾燥 /瓜度較佳係60〜18〇〇C左右、更佳係8〇〜15〇艽左右。又,乾 燥時間較佳係2〜1G分鐘左右、更佳係2〜5分鐘左右。 根據如上述的本實施形態,可達以下的效果。 本實施形悲中,供應液狀第1樹脂組成物之際,選擇喷嘴 611〜613中至少任一個。例如從噴嘴613朝支撐體5其中一 面(、應液狀第1樹脂組成物時,使液狀第1樹脂組成物乾 燥,直到纖維基材2與支撑體5被壓接為止,便可使對纖維 基材2的含次程度變為較少。另一方面,從喷嘴朝纖維 基材2其巾—面供應液狀第1細旨組成物時,含浸液狀第1 樹脂組成物’直_維基材2與支撐體5被壓接為止,便可 使對纖維基材2的含浸程度變為比較大。 再者’從賀鳴611將液狀第1樹脂組成物供應給纖維基材 ”支樓體5日夺’對纖維基# 2含浸程度可^^定為從喷嘴⑴ 供應的情況、與從噴嘴612供應的情況之間。 依此,可調整第1樹脂組成物對纖維基材2的含浸程度。 100131446 201215506 故,可調整第2樹脂組成物與第1樹脂組成物的含浸比例, 俾可製造所需預浸片。 再者,本實施形態中,使用輥025施行纖維基材2與支撐 體5間之壓接。當利用一對輥夾壓纖維基材2與支撐體5 • 的情況’會有從纖維基材2中滲出第1樹脂組成物的可能 ' 性,但如本實施形悲,藉由使用輥625,且調整纖維基材2 接觸到輥625的面積並使面積變為較小,藉此可抑制從纖維 基材2中滲出第1樹脂組成物。 該第1實施形態係可製造前述積層片1、1A、IB、lc、 ID、1E之全部。後述第2實施形態〜第4實施形態亦同。 <第2實施形態> 本實施形態係使用圖4所示積層片製造裝置6a。此情況, 使喷嘴611改變位置,調整噴嘴611供應第丨樹脂組成物的 位置(吐出位置),從該噴嘴611朝支撐體5之其中一面、或 纖維基材2之其中一面、或支樓體5與纖維基材2之間等至 少其中一者吐出第1樹脂組成物。依此’可減少喷嘴數量。 又,後述第3實施形態亦可變更為圖5所示積層片製造裝置 • 6b的喷嘴構造,並同樣地實施。 • 首先,與第1實施形態同樣的,從輥621饋送出支撐體5, 並從輥623饋送出纖維基材2。 其次,調整喷嘴611的位置,調整來自喷嘴611的第1樹 脂組成物之供應位置。例如使喷嘴611朝圖4中右側改變位 100131446 35 201215506 置而對由輥622所支撑的支稽體5上供應液狀第1樹脂組 成物。又,亦可使嘴嘴611朝圖4中左側改變位置,而對由 輕624所支撐的纖維基材2上供應液狀第1樹脂組成物。此 外’亦可對由報625所支樓的支樓體5上供應液狀第1樹脂 組成物。 再者’亦可調整嘴嘴的位置,調整支撐體5其中-面的供 應處所’調整沿切體5饋送出方向的第丨樹脂組成物之供 應處所。 同樣的,亦可調整喷嘴611的位置,調整纖維基材2其中 一面的供應處所,調整纖維基材2饋送出方向的第丨樹脂組 成物之供應位置。 依此’可向度地控制第1樹脂組成物對纖維基材2的含浸 程度。 後續步驟係與第1實施形態同樣。具體而言,在親625 中,將支撐體5與纖維基材2隔著液狀第1樹脂組成物施行 壓接’並從喷嘴614吐出液狀第2樹脂組成物,利用乾燥裝 置64使第1樹脂組成物與第2樹脂組成物乾燥。進而將積 層片1捲取於輥628上。 根據此種本實施形態,可達與第1實施形態同樣的效果。 <第3實施形態〉 其次,針對本發明積層片之製造方法的第3實施形態進行 說明。另外,針對第3實施形態,以與前述第1實施形態的 100131446 36 201215506 相異處為中心進行說明,相關同樣的事項係省略說明。 第3實施形態係使用積層片製造裝置6或6a。而,第2 實施形態中係除了第1樹脂組成物與第2樹脂組成物為相互 組成相同之外,其餘均與上述第1實施形態同樣。 • <第4實施形態> • 其次,針對本發明積層片之製造方法的第4實施形態進行 說明。另外,針對第4實施形態,以與前述第1實施形態的 相異處為中心進行說明,相關同樣的事項係省略說明。 第4實施形態係使用積層片製造裝置6b。該積層片製造 裝置6b的第1步驟與第2步驟係與第1實施形態同樣。又, 除乾燥步驟係在第2步驟與後述第3步驟之間實施之外,其 餘均與第1實施形態同樣。 (第3步驟) 使積層片製造裝置6b的輥629旋轉,而從該輥629饋送 出(連續供應)片材7。 片材7係如圖5所示,具備有樹脂薄膜8、與設置於該樹 脂薄膜8其中一面且由固態或半固態的第2樹脂組成物所構 . 成之第2樹脂層(樹脂層)4。第2樹脂層4係呈被加工為薄 • 片狀的狀態,且為B階段狀態。 樹脂薄膜8係可使用與作為支撑體5的樹脂薄膜所說明者 同樣者 本步驟中,片材7、以及纖維基材2與支撐體5的積層體 100131446 37 201215506 係通過貼合裝置65的輥651與輥652之間,此時片材7、 以及纖維基材2與支樓體5的積層體,係利用該貼合裝置 65被加壓且被加熱。藉此,片材7隔著第2樹脂層4而壓 接於纖維基材2與第1樹脂組成物相反側之面,而獲得積層 片1。該積層片1被捲取於親628上。 上述壓接時的條件並無特別的限定,係配合第2樹脂層4 的第2樹脂組成物組成與諸條件而適當設定,壓力較佳係 〇·1〜l.OMPa/cm2左右、更佳係〇 3〜〇 5MPa/cm2左右。又, 加熱溫度較佳係40〜100¾左右、更佳係60〜80。(:左右。 該第4實施形態中,因使用在其中一面側設有由固態或半 固態第2樹脂組成物構成之第2樹脂層4的片材7,故適用 於在纖維基材2的厚度方向未含浸第2樹脂組成物的情況。 此種第4實施形態除可達與第丨實施形態同樣的效果之 外,尚可達到以下的效果。 藉由使用设有被加工為薄片狀之第2樹脂層4的片材7, 可防止纖維基材2㈣出現第i樹脂組成物與第2樹脂組成 物相混合情形。藉此’可確實獲得具有所需特性的預浸月。 尤其’第1樹脂組成物係在利用乾燥裝置64進行乾燥後, 才貼合第2樹脂層4,故可確實防止第丨樹脂組成物與第2 樹脂組成物相混合。 <基板> 其次’針對使用本發明積層片進行製造的基板,參照圖6 100131446 38 201215506 進行說明。該圖6所示基板1 〇係具備有將第2樹脂層4彼 此間朝向内側配置的2個預浸片lg、以及由第2樹脂層4 彼此間夾持的内層電路基板13。另外,預浸片係經將積 層片1裁剪為既定尺寸者。 •内層電路基板13係可使用與前述纖維基材2同樣者。又, ^ 本實施形態中,因為第2樹脂層4具有如前述特性(可撓 性),故内層電路基板13至少其中一部分確實地埋入(埋設) 於第2樹脂層4中。 亦可使一對第2樹脂層4分別被覆纖維基材13的表背 面,且一對第2樹脂層4在纖維基材13内部呈相互接觸, 使纖維基材13内部完全被一對第2樹脂層4埋入。又,亦 可使一對第2樹脂層4分別被覆纖維基材2的表背面,且在 一對第2樹脂層4間形成隙間,並在纖維基材13内部形成 空隙。 在各第1樹脂層3與纖維基材2相反側之面上所設置之金 屬層12 ’分別有由金屬箔構成支撐體5的情況。本實施形 態中’因為第1樹脂層3具有如前述特性,故可依高密接性 . 保持金屬層12’且能依高加工精度在佈線部形成金屬層12。 - 金屬層12與第1樹脂層3間之剝離強度較佳係〇.5kN/m 以上、更佳係〇.6kN/m以上。藉此,將金屬層12加工為佈 線部,可更加提升所獲得之半導體裝置1〇〇(參照圖7)的連 接可靠度。 100131446 39 201215506 b種基板10係可準備2個預浸片lg,在由該等 夾持著内爲 ^ ^電路基板13之狀態下,使用例如真空層壓法、 真空壓合法等進行製造。 另夕卜 , ,基板W可省略内層電路基板13,2個預浸片lg 3有由第2樹脂層4彼此間直接接合構成的積層體,亦可 省略金屬層12。 <半導體敦置> /、人’針詩使用本發明積層月進行製造的半導體裝置,參 :圖7進仃說明。另外,圖7中,省略纖維基材2、13而圖 不’且第1樹脂層3與第2樹脂層4呈一體圖示。 圖7所示半導體裝置100係具備有多層基板200與半導體 元件500 ’該多層基板200係上面設有焊墊部300、下面設 有佈線部400 ’該半導體元件500係利用凸塊5〇1連接於焊 墊部300,藉此搭载於多層基板2〇〇上。 多層基板200係具備有當作核心基板而設置的基板; 在該基板10上側設置的3個預浸片la、lb、lc ;以及在基 板10下側設置的3個預浸片id、le、If。預浸片ia〜1£分 別係將積層片1裁剪為既定尺寸者。又,分別構成預浸片 la〜lc的纖維基材2、第1樹脂層3、第2樹脂層4從基板 10起的配置順序。係與分別構成預浸片Id〜If的纖維基材 2、第1樹脂層3、第2樹脂層4從基板10起的配置順序相 同。即,預浸片la〜lc與預浸片Id〜If係形成相互上下顛倒 100131446 40 201215506 狀態。 另外’上述焊墊部300係將由預浸片1〇的金屬箔所構成 之支撐體5加工為既定圖案者,且上述佈線部4〇〇係將由預 浸片If的金屬箔所構成之支撐體5加工為既定圖案者。 •再者,在預浸片la、lb上面側所配置的電路部2〇1&、 . 201b,分別係將由金屬箔構成的支撐體5加工為既定圖案 者,又,在預浸片Id、le下面侧所配置的電路部2〇ld、2〇ie, 分別係將由金屬箔構成的支撐體5加工為既定圖案者。 再者’多層基板200係具備有分別貫通各預浸片ia〜lf而 <1又置,且將相鄰電路部彼此間、或電路部與焊塾部間予以電 氣式連接的導體部202。 再者’基板10的各金屬層12分別被加工為既定圖案,該 經加工的金屬層12彼此間係利用貫通基板10而設置的導體 部203而電氣式連接。 另外,半導體裝置100(多層基板200)亦可在基板10的單 面側設置4個以上預浸片。進而,半導體裝置1〇〇亦可含有 從前述積層片所獲得之預浸片以外的預浸片。 另外’本發明並不僅侷限於前述實施形態,舉凡在可達成 • 本發明目的之範疇内的變形、改良等,均涵蓋於本發明内。 以上’針對本發明積層片之製造方法及積層片,根據圖示 之實施形態進行說明,惟本發明並不僅侷限於此,各部位的 構造亦可取代為具有同樣功能的任意構造者。又,本發明亦 100131446 41 201215506 可附加其他的任意構造物與步驟。 例如圖8所示,裝置6中亦可設置抽吸手段67。 έ亥抽吸手段67係用以使第1樹脂組成物含浸於纖維基材 2中者。藉由利用抽吸手段67抽吸空氣,第1樹脂組成物 被拉引,可確實地調整對纖維基材2的含浸程度。裝置6a、 6b中同樣的亦可設置抽吸手段67。 再者’第2實施形態中,來自噴嘴611的第1樹脂組成物 之供應位置,係沿支撐體5或纖維基材2的饋送出方向進行 調整’惟並不僅侷限此。例如亦可調整支撐體5或纖維基材 2的寬度方向(饋送出方向的正交方向)之供應位置。依此, 可調整纖維基材2寬度方向的第1樹脂組成物之含浸量。 本申請案係以2010年9月1日所提出申請的日本專利申 凊案特願2010-195494為基礎主張優先權,並將其揭示寫入 於本案中。 【圖式簡單說明】 圖1係積層片的實施形態剖視圖。 圖2係積層片的實施形態之另一構造例示意剖視圖。 圖3係本發明積層片之製造方法的實施形態中所使用的 積層片製造裝置圖。 圖4係本發明積層片之製造方法的實施形態中所使用的 積層片製造裝置圖。 圖5係本發明積層片之製造方法的實施形態中所使用的 100131446 42 201215506 積層片製造裝置圖。 圖6係基板的剖視圖。 圖7係半導體裝置的實施形態剖視圖。 圖8係本發明變化例的製造裝置圖。 * 【主要元件符號說明】 1 積層片 1A 〜1D 積層片 1 a~ 1 g 預浸片 2 纖維基材 3 第1樹脂層 4 第2樹脂層 5 支撐體 6 積層片製造裝置 6a 積層片製造裝置 6b 積層片製造裝置 7 片材 8 樹脂薄膜 10 基板 12 金屬層 13 内層電路基板 20 界面 31 第1含浸部 100131446 43 201215506 41 第2含浸部 64 乾燥裝置 65 貼合裝置 67 抽吸手段 100 半導體裝置 200 多層基板 201a、201b、201d、201e 電路部 202 、 203 導體部 300 焊墊部 400 佈線部 500 半導體元件 501 凸塊 611〜614 喷嘴(狹縫式塗佈機) 621〜628 輥 629 輥 651 ' 652 輥 661〜663 調整手段 100131446 44Style <11) η-form arbitrary integer The number of average repeating units of the biphenyl dimethylene type epoxy resin represented by the formula (II) "η" is not particularly limited. It is preferably (7), more preferably w. If the average repeating unit number "η" is less than the above lower limit value, the biphenyl dihydrazinyl type cyclic latex resin is easily crystallized, so that the solubility in the listening layer is lowered. Therefore, there is a case where the varnish of the first resin layer composition is difficult to use. On the other hand, if the average repeating unit number "η" exceeds the above upper limit value, the varnish viscosity of the first resin composition may increase depending on the solvent to be used. In this case, the first resin composition cannot be sufficiently impregnated into the fibrous base material 2, and as a result, the molding failure of the laminated sheet 1 and the mechanical strength are lowered. In the case of using an epoxy resin, the content thereof is not particularly limited, and is preferably 1 to 55% by weight, more preferably 2 to 4% by weight based on the total of the first resin composition. Further, in the first resin composition, it is also possible to add and enhance the adhesion to the gold system. The component may, for example, be a phenoxy resin, a polyethylene oxime resin, a coupling agent or the like. Examples of the phenoxy resin include a phenoxy resin having a double time frame, a 100131446 201215506 phenoxy resin having a Cai skeleton, a phenoxy resin having a biphenyl skeleton, and the like. Further, a phenoxy resin having a structure of a plurality of skeletons may be used. Among these, the phenoxy resin is preferably a phenoxy resin having a biphenyl skeleton and a bisphenol s skeleton. Thereby, the glass transition temperature of the phenoxy resin can be increased by the rigidity of the biphenyl skeleton, and the adhesion between the phenoxy resin and the metal can be improved by utilizing the existence of the bisphenol s skeleton. As a result, the heat resistance of the first resin layer 3 can be improved, and the adhesion of the wiring portion (metal) to the first resin layer 3 can be improved when the multilayer substrate is manufactured. Further, the phenoxy resin is preferably a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton. Thereby, in the production of the multilayer substrate, the adhesion of the wiring portion to the first resin layer 3 can be further improved. The molecular weight of the phenoxy resin is not particularly limited, and the weight average molecular weight is preferably 5,000 to 70,000, more preferably 10,000 to 60,000. In the case of using a phenoxy resin, the content thereof is not particularly limited, and is preferably from 1 to 40% by weight, more preferably from 5 to 30% by weight based on the total of the first resin composition. The coupling agent is preferably one selected from the group consisting of, for example, an epoxy decane coupling agent, a titanate coupling agent, an amino decane coupling agent, and a polyoxygen oxy-type coupling agent. In the case of using a coupling agent, the content thereof is not particularly limited, and is preferably 0.05 to 3 parts by weight, more preferably 0.1 to 2 parts by weight, based on 100 parts by weight of the inorganic i-filled material. Further, the first resin composition may contain, for example, an antifoaming agent, a leveling agent, a pigment, and an antioxidant, in addition to the above-described components, as needed, 100131446 20 201215506. The composition of the second resin composition is different from that of the second resin composition, and the second resin layer 4 is set to have higher flexibility than the first! Tree and J J group. In addition, the "different composition" means that the first resin composition and the second month t are not composed of the same resin composition, and for example, at least one of the components constituting the second eucalyptus is different from the second. In the case of the resin composition, the component content of the resin composition of the product 1 is different from that of the second resin composition. More specifically, at least one of the types of the resin, the filler, and the like, the molecular weight of the resin (the average number of repeating units), and the like are different from the eucalyptus remainder. As a result, the second resin layer 4 has characteristics different from those of the first resin layer 3. . The thermal expansion coefficient of the second surface of the second resin layer 4, that is, the longitudinal direction of the laminated sheet 1 and the width direction (Y direction) is not particularly limited to the following: L6ppmrc. When the second resin layer = the thermal expansion coefficient is within the above range, the laminated sheet 1 can have high connection reliability. The obtained semiconductor material is excellent in mounting reliability. Further, the thermal expansion coefficient in the plane direction of the entire laminated sheet 1 is not particularly limited, but is preferably 16 ppm/t or less, more preferably 12 ppm/t: or less, and particularly preferably 5 to 10 ppm/C. If the coefficient of thermal expansion of the laminated sheet 1 is within the above range, the crack resistance of the obtained substrate against repeated thermal shock can be improved. The coefficient of thermal expansion in the plane direction can be evaluated, for example, by using a temperature rise of a TMA device (ΤΑ100131446 21 201215506::2). On the side of the side, for example, not shown in the figure t, after the resin film is peeled off, the resin film is peeled off. In the case of the resin film, the resin film can be used in the same manner as the resin film as the filler 5. Next, another example of the structure of the laminated sheet will be described. The difference between the first and the second is the same as the case where the same thing is omitted. As shown in Fig. 2 (4), the laminated sheet 1A is not impregnated with the i-th resin composition in the thickness direction of the fibrous base material 2 (first The resin layer 3) and the second resin composition (second resin layer 4). For example, by adjusting the position at which the first resin composition is supplied, the first resin composition may be formed, and the second resin composition may be formed as shown in Fig. 2 (4). The structure of the i-th resin composition. Further, by setting the viscosity of the varnish-like second resin composition to be extremely high or as shown in Fig. 5, when the heating is performed, the flaky second resin is used. The composition's smelting viscosity is set to As shown in Fig. 2(a), the laminated sheet 1B is impregnated with the entire thickness of the fibrous base material 2 as shown in Fig. 2(a). 1. The resin composition is not impregnated with the second resin composition. As shown in Fig. 2(c), the laminated sheet 1 c is impregnated with the second resin composition in the thickness direction of the fibrous base material 2 as a whole, but is not impregnated. For example, by adjusting the position at which the first resin composition is supplied, the first resin composition is dried, and the first resin composition may be impregnated as shown in Fig. 2(c). 100131446 22 201215506 As shown in Fig. 2(d), the laminated sheet 1D is partially impregnated with the first resin composition in the thickness direction of the fibrous base material 2, but is not impregnated with the second resin composition. The laminated sheet 1E is partially impregnated with the second resin composition in the thickness direction of the fibrous base material 2, but is not impregnated with the i-th resin composition. For example, by adjusting the position at which the second resin composition is supplied, the first resin composition is formed. Drying, it can also become almost impregnated with the first elm tree as shown in Figure 2(e) As shown in Fig. 2 (f), the second resin layer is omitted from the laminated sheet 1F (the second resin composition is further infiltrated in the thickness direction of the fibrous base material 2 without impregnating the first secret grease). For example, by adjusting the position at which the first resin composition is supplied and the first first resin composition is dried, it may have a structure in which the first resin composition is hardly impregnated as shown in Fig. 2. In the thickness direction of the fiber base material 2, the first resin composition is impregnated, and the first resin composition is partially impregnated in the thickness direction of the fiber base material 2, etc. Similarly to the laminated sheet i, the first layer composition and the second resin composition may be the same composition or the same level. <Laminating sheet manufacturing apparatus> - The laminated manufacturing apparatus used in the embodiment of the manufacturing method of the laminated sheet of the present invention, that is, the laminated sheet manufacturing apparatus used in the production of the laminated sheet, is described. Description will be made with reference to Figs. 3 to 5 . The outline of the manufacturing apparatus of the present invention is as follows. The manufacturing apparatus includes: means 621 for continuously feeding out the support 5; means 623 for continuously feeding out the fibrous base material 2; and supplying a liquid resin composition to the support 5 and the fibrous base 2 Means 611 to 613 (or 6 ιι); and a pressure bonding means 625 for pressing the support 5 and the fiber base material 2 via the first resin composition. Further, the manufacturing apparatus includes adjustment means 661 to 663 (or means for changing the position of the supply means 611) for adjusting the supply position of the liquid second resin composition by the supply means. The laminated sheet manufacturing apparatus 6 shown in Fig. 3, the laminated sheet manufacturing apparatus 6a shown in Fig. 4, and the laminated sheet manufacturing apparatus 6b shown in Fig. 5 are apparatuses for continuously producing a laminated sheet. The laminated sheet manufacturing apparatuses 6 and 6a can correspond to the first embodiment and the second embodiment of the method for manufacturing a laminated sheet to be described later. Further, the laminated sheet manufacturing apparatus 6b can correspond to the third embodiment and the fourth embodiment of the method for producing a laminated sheet to be described later. (Laminated sheet manufacturing apparatus 6) First, the laminated sheet manufacturing apparatus 6 will be described. As shown in Fig. 3, the laminated sheet manufacturing apparatus 6 is provided with rolls 621 to 628, nozzles (slot coaters) 611 to 614, and drying apparatus 100131446 24 201215506 64 ° rolls and 621 series feeds ( The slave of the object is circumvented, and the support 5 is wound on the roller 021. The roller 621 is configured to be rotated by a motor (drive source) that is not in the figure, and if the roller 621 is rotated, it is supplied from a more than six. The branch body 5 is fed out (the means for feeding the object is wound on the _: the 2-1" is configured to rotate the right nip roller 623 by a motor (not shown), and then the roller 623 is rotated. Supply). 'Finished fiber substrate 2 (continuously further) 'the rear section of the transfer roller 621 of the 622 series specification support 5. The means of the direction is set, and the roller 624 is the standard fiber substrate 2 at the rear of the roller 622. The means for moving the direction is provided, and the roller 625 is a means for arranging the object to be placed between the rollers (that is, the support body 5 and the fiber substrate are in a direction, and the objects 622 and 624 are attached to the rear section - 乂, The outer peripheral surface of the roller 625 is supported by the support body 5. At this time, the outer peripheral surface of the roller 625 is conveyed to the tooth surface of the tooth month a 5 surface contact or more. The base material 2 valence θ + is also entangled along the & outer peripheral surface of the roll 625, and the peripheral surface 'contacts the enthalpy. The fiber substrate 2 is the space of the body 5, and is placed on the roll with the branch m interposed therebetween. 625 contacted the support octopus 5 contact 辍100131446 t46 b 625. Among them, the contact between the fiber substrate 25 201215506 2 and the light 6M The product system is smaller than the contact area between the support body 5 and the viewing body. Specifically, the support body 5 is in surface contact with 1/4 to 1/2 of the circumference of the roller 625, whereas the fiber substrate 2 is roller-dependent. 1/6 to 1/4 of the circumference of 625 is in surface contact, whereby the tension applied to the fiber base material 2 can be reduced, and deformation of the fiber base material 2 can be suppressed. Further, although detailed later, The fiber base material 2 and the support body 5 are stretched in the feeding direction, and tension is applied thereto. Thereby, the support body 5 and the fiber base material 2 can be separated by the first surface by the outer peripheral surface of the roll 625. The resin composition is pressure-bonded. Further, in the present embodiment, a roller that is disposed opposite to the roller 625 and that presses the ball body 5 and the fiber base material 2 is not disposed. Here, the roller 625 A metal roll having at least a surface made of a metal. The metal roll has a high surface smoothness and stably supports the support 5, the first resin composition, and the fiber base 2. Therefore, the first resin composition can be used. The weight distribution of the fiber base material 2 in the width direction is uniform. Further, the 'roller 626 and the roll 627 are the moving directions of the standard object, respectively. The means is provided in this order in the rear stage of the roller 625. Further, the "pro-628" is a means for winding up the object (that is, the laminated sheet 1). The pro-628 system is configured to be rotated by a motor (not shown), and the roller 628 Rotating 'the laminated sheet 1 is taken up on the roll 628. The nozzles 611 to 613 are means for discharging (supplying) the first resin composition which is liquid (varnished) at normal temperature (25 ° C). Sewing coater. The supply hand 100131446 26 201215506 section can adjust the supply position of the liquid first resin composition. That is, the supply means may select at least one of the one side of the support body 5, or one of the fiber base materials 2, or one of the support body 5 and one of the fiber base materials 2, and supply A liquid first resin composition. More specifically, the "supply means" are provided with nozzles 611 to 613, and the nozzle 611 discharges a liquid first resin composition toward one side of the branch body 5, and the nozzle 612 discharges the third layer toward one side of the fiber base material 2. In the resin composition, the nozzle 613 discharges a liquid resin composition between one surface of the support 5 and one side of the fiber base material 2. In the production of the laminated sheet i, at least one nozzle that discharges the first resin composition is selected from the nozzles 611 to 613. Thereby, the supply position of the supply means (i.e., the position at which π is discharged) is adjusted. This selection is performed by opening and closing the valve (the adjustment means 1 "a) provided in the flow path on the downstream side of the nozzles 611 to 613. Further, the "liquid" is not limited to liquid, but also includes fluidity. Further, the nozzle 614 is a means for discharging (supplying) a second resin composition at a normal temperature (pit) toward the surface on the opposite side of the support member 5 from the i-th resin composition (for example, a slit) The slitting machine 64 is disposed between the nozzle 614 (reported 625) and the newspaper 626. In the present embodiment, the drying device 64 uses the object (the second resin composition, the fiber substrate 2). The first resin composition and the branch body 5) are dried while being horizontally conveyed. #This allows the tension applied by the Vivian 2 to be smaller than 100131446 27 201215506, which prevents or suppresses internal strain. The drying device 64 dries the object by heating the object. In the dried laminated sheet, the first resin layer 3 and the second resin layer 4 are both in a B-stage (B-stage). The state 'becomes a sheet shape. (Laminar sheet manufacturing apparatus 6a) Next, the laminated sheet manufacturing apparatus 6a will be described. The description of the same items as the center of the laminated sheet manufacturing apparatus 6 will be omitted. As shown in Fig. 4, the laminated sheet manufacturing apparatus 6 & The nozzle 611 which is a means for supplying the liquid first resin composition to the laminated sheet manufacturing apparatus 6 is provided so that the nozzle 611 which is a supply means of the liquid first resin composition can be changed in position by an actuator (adjustment means) (not shown). In other words, the nozzle 611 can be moved or changed in posture such that one of the support body 5, one of the fiber base materials 2, or the support body 5 and the fiber base material 2 can be moved in accordance with the discharge port. When the laminated sheet 1 is produced, the discharge port position and orientation of the nozzle 611 are selected, and one of the support body 5, one of the fiber base materials 2, or the support body 5 and the fiber base material 2 is at least In one embodiment, a liquid first resin composition is supplied from one of the nozzles 611 to one side of the branch body 5. Further, when the liquid is supplied from one of the nozzles 611 toward one side of the fiber base material 2 In the case of the first resin composition, the liquid first resin composition is supplied to the space supported by the newspaper 624. Accordingly, the degree of impregnation of the first resin composition with respect to the fiber base 100131446 28 201215506 material 2 can be improved. When the liquid first resin composition is supplied from the nozzle 611 toward the support 5 and the fiber base material 2, the first resin composition is supplied to the space surrounded by the fiber base material 2 and the branch body 5. More specifically, the liquid is supplied from the nozzle 611 between the support body 5 that is in contact with the roll 62:5 and the fiber base material 2 that is relatively far away from the support body 5 and the roll 625. In the first resin composition, in the present embodiment, the first resin composition is supplied to the support 5 supported by the roller 625. Further, the nozzle 611 can adjust the supply position of one side of the branch body 5, that is, the supply position of the first resin composition in the feeding direction of the support body 5, by changing its position. Similarly, the nozzle 611 can adjust the supply position of one side of the fiber base material 2, i.e., the supply position of the first resin composition in the direction in which the fiber base material 2 is fed, by changing its position. (Laminated sheet manufacturing apparatus 6b) Next, the laminated sheet manufacturing apparatus 6b will be described. In addition, the description will be made focusing on the difference from the above-described laminated sheet manufacturing apparatus 6, and the same matters will be omitted. As shown in Fig. 5, in the laminated sheet manufacturing apparatus 6b, the nozzle 614 is omitted for the laminated sheet manufacturing apparatus 6, but the bonding apparatus 65 and the roller 629 are provided. The bonding device 65 is disposed between the roller 627 and the roller 629. The bonding device 65 includes a pair of rollers 651 and 652 that are opposed to each other, and a heating unit (not shown) that heats the pair of rollers 651 and 652 100131446 29 201215506. The object is sandwiched between the roller 651 and the roller 652. The object is subjected to pressurization and heating. The roller 629 is disposed in the front stage of the bonding device 65. The roller 629 is a means for feeding out an object, and a sheet 7 to be described later is wound around the roller 629. The roller 629 is configured to rotate by a motor not shown, and if the roller 629 is rotated, the sheet 7 is fed from the roller 629 (continuous supply). <Manufacturing Method of Laminate Sheet> First, the outline of the method for producing a laminated sheet of the following embodiment will be described. The manufacturing method of the laminated sheet 1 is to supply the first resin composition yarn between the continuously fed support body $ and the continuously fed fiber base material 2, and the support body 5 and the fiber base material 2 are interposed between the above-mentioned second resin. A method in which a composition is pressure-bonded to produce a laminated sheet. The manufacturing method of the laminated sheet includes: an i-th step of supplying a liquid first resin composition to at least one of one of the support body 5 and one of the fiber base materials 2; and the above-described support body 5 One of the steps is to adhere to the above-mentioned "mean surface" of the fibrous base material 2 via the second resin composition. Wherein, in the step i, after the supply position of the supply means for supplying the liquid second resin composition is completed, at least the surface of the support body 5 and the surface of the fibrous substrate 2 are at least Among them, the liquid i-th resin composition is supplied. <First Embodiment> 100131446 30 201215506 ▲ Secondly, the first embodiment of the (four) layered manufacturing method is carried out. In addition, in the first embodiment, the laminated sheet manufacturing apparatus 6 is used. (1st step) ° * As shown in Fig. 3, the roller 621 of the integrated sheet manufacturing apparatus 6 is rotated, and the prosthesis body 5 is fed (continuously supplied) from the pro-621, and the pro (2) is rotated from the The fiber substrate 2 is fed (continuously supplied) and the roller 628 is rotated, and the roller 628 is taken up to take up the laminated sheet containing the branch (4) 5 and the fibrous substrate 2. The support 5 fed from the roller 621 and the fibrous substrate .2 fed from the parent 623 are supplied toward the outer peripheral surface of the roller 625, and the distance between the fibrous substrate 2 and the support is more toward the roller 625. narrow. Further, at least one of the nozzles 611 to 613 is selected, and a liquid first resin composition is discharged from the selected nozzle. Thereby, the position (discharge position) at which the supply means supplies the i-th resin composition is adjusted. Further, the selection of the nozzle may be any one of the nozzles 611 to 613, or any two of the nozzles, or any three. Further, when the first resin composition is intended to be thickly coated, a plurality of nozzles may be selected. When the nozzle 611 is selected, the first resin composition is discharged (supplied) from the nozzle 611 toward the support body. Here, the liquid second resin composition is supplied from the nozzle 611 toward the space in the support body 5 where there is no contact with the roller 625. Further, when the nozzle 612 is selected, the first resin composition is discharged from the nozzle 612 toward the center surface of the fiber base material 2. Here, the liquid second resin composition is supplied from the nozzle 612 toward the space supported by the fiber substrate 2 100131446 31 201215506. Thereby, the degree of impregnation of the first substrate to the fibrous substrate 2 can be improved. Further, in the case where the spray violet 6U is selected, the (four) 1 tree test product is projected from the nozzle (1) toward the support 5 and the fibrous base material 2. The resin composition is supplied from the mouth 613 to the space covered by the fibrous base material 2 and the support body 5. More specifically, the liquid is supplied from the nozzle 613 toward the space formed between the support body 5 that is in contact with the pro-625 and the fiber base material 2 that is relatively distant from the "Haizhilou body 5 and the opposite roller 65". The first resin composition. The liquid first filament from the nozzle 613 is supplied to both the yoke 5 and the filament 2 (4). The liquid supply of the liquid repeller 613 is a supply space of the liquid resin of the first resin composition supplied by the nozzle, and is supplied by the support body 5 (from the feeding direction of the light 621). ) Front end side. Similarly, the supply of the liquid enamel resin composition from the nozzle (1) to the fiber substrate 2 is more than the supply of the first constitutive (four) supply space by the nozzle, and the supply direction of the fiber base (from the pro (2) Feed out direction) Front end side. In addition, the first spit from the mouth 611~(1)! The composition of the resin composition may be the same as each other in the present embodiment, but it is not limited thereto or may be different. (Second Step) "In the surface 625, the support 5 and the fibrous base material 2 are pressure-bonded via the first 100131446 32 201215506 resin composition. 2 The ruthenium support 5 is brought into contact with the outer peripheral surface of the 625. At the time of the fiber substrate, the surface of the support body 5 of the m (four) support body forms a space between the fiber core 2 and the support body 5. Then, the fiber, the crucible, and the quasi-substrate 2 are separated from the support body 5 and the liquid first tree. The lunar composition is in contact with the roller 625 and the outer peripheral surface. Otherwise, the fibrous base material 2 and the support 5 are crimped. At this time, the angle between the body 5 and the fibrous base material 2 is at an angle (contact angle: contact to丨丨1 喊 的 的 的 支 、 、 、 、 、 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 支 的Or suppressing the strain of the fiber base material 2. Further, the tension on the side of the fiber base material 2 is preferably the tension on the side of the cast support body 5. Specifically, the tension on the side of the fiber base material 2 is preferably less than the surface area, and more preferably It is about 15 to 25 N. Thereby, the dimensional change and the internal strain of the fiber base material 2 can be prevented or suppressed. (Step 3) Next, the liquid is discharged from the nozzle 614. The second resin composition is supplied to the surface of the fiber substrate 2 opposite to the (four) lipid composition, and the second resin composition and the second resin composition are different in composition from each other. Therefore, the composition of the resin composition can be appropriately set in accordance with the characteristics required for the first resin layer 3 and the second resin wind/w 曰W 曰 layer 4. Further, when the second resin composition is intended to be thicker In the case of the main species, for example, a nozzle for discharging the second resin composition may be provided in a plurality of places. (Step 4 (drying step)) 100131446 33 201215506 Next, the i-th resin composition and the second resin are made by the drying device 64. The composition is dried, whereby a laminated sheet is obtained. The laminated sheet is wound up on the Kokon 628. The drying conditions are not particularly limited, and the composition of the second resin composition and the second resin composition are combined. It is preferable to set the conditions, and it is preferable that the volatility of the second resin group and the second resin group are set to be 1.5 wt/〇 or less, more preferably about 8 to about 1. /The degree of melon is preferably about 60~18〇〇C Further, the drying time is preferably about 8 to 15 Torr. Further, the drying time is preferably about 2 to 1 G minutes, more preferably about 2 to 5 minutes. According to the present embodiment as described above, the following effects can be obtained. In the case of the liquid resin, the first resin composition is supplied, and at least one of the nozzles 611 to 613 is selected. For example, from the nozzle 613 to one side of the support body 5 (the liquid resin is used as the first resin composition) The first resin composition is dried until the fibrous base material 2 and the support 5 are pressure-bonded, so that the degree of inclusion of the fibrous base material 2 is reduced. On the other hand, the nozzle is directed toward the fibrous base material 2 When the liquid-like first composition is supplied to the surface of the towel, the impregnation liquid-like first resin composition 'the straight-dimensional base material 2 and the support 5 are pressure-bonded, so that the degree of impregnation of the fibrous base material 2 can be changed. bigger. Furthermore, 'the liquid resin first resin composition is supplied from the Heming 611 to the fiber base material." The branch body 5's impregnation degree to the fiber base #2 can be determined as the supply from the nozzle (1), and the nozzle is supplied. In the case of the supply of 612, the impregnation degree of the first resin composition to the fiber base material 2 can be adjusted. 100131446 201215506 Therefore, the impregnation ratio of the second resin composition and the first resin composition can be adjusted, and the crucible can be produced. Further, in the present embodiment, the pressure contact between the fiber base material 2 and the support 5 is performed using the roller 025. When the fiber base material 2 and the support 5 are sandwiched by a pair of rolls, ' There is a possibility that the first resin composition is oozing out from the fibrous base material 2, but as in the present embodiment, by using the roller 625, the area of the fibrous base material 2 in contact with the roller 625 is adjusted and the area is changed. In this case, it is possible to suppress the bleed out of the first resin composition from the fiber base material 2. In the first embodiment, all of the laminated sheets 1, 1A, IB, lc, ID, and 1E can be produced. The fourth embodiment is also the same. <Second Embodiment> In the present embodiment, the laminated sheet manufacturing apparatus 6a shown in Fig. 4 is used. In this case, the nozzle 611 is changed in position, and the position (discharge position) at which the second resin composition is supplied from the nozzle 611 is adjusted, from the nozzle 611 toward one side of the support body 5, or one side of the fiber base material 2, or the branch body At least one of the fifth and the fibrous base material 2 ejects the first resin composition. According to this, the number of nozzles can be reduced. Further, the third embodiment to be described later can be similarly changed to the nozzle structure of the laminated sheet manufacturing apparatus 6b shown in Fig. 5, and is similarly implemented. • First, as in the first embodiment, the support 5 is fed out from the roller 621, and the fibrous base material 2 is fed out from the roller 623. Next, the position of the nozzle 611 is adjusted to adjust the supply position of the first resin composition from the nozzle 611. For example, the nozzle 611 is changed to the right side in Fig. 4 by the position 100131446 35 201215506, and the liquid first resin composition is supplied to the branch body 5 supported by the roller 622. Further, the nozzle 611 can be changed to the left side in Fig. 4, and the liquid first resin composition can be supplied to the fibrous base material 2 supported by the light 624. Further, a liquid first resin composition may be supplied to the branch body 5 of the building 625. Further, the position of the mouth can be adjusted, and the supply space of the center surface of the support body 5 can be adjusted to adjust the supply position of the second resin composition in the direction in which the cut body 5 is fed. Similarly, the position of the nozzle 611 can be adjusted, the supply space of one side of the fiber base material 2 can be adjusted, and the supply position of the second resin composition in the direction in which the fiber base material 2 is fed can be adjusted. According to this, the degree of impregnation of the first resin composition with respect to the fibrous base material 2 can be controlled. The subsequent steps are the same as in the first embodiment. Specifically, in the pro-625, the support 5 and the fibrous base material 2 are pressure-bonded via the liquid first resin composition, and the liquid second resin composition is discharged from the nozzle 614, and the drying device 64 is used. 1 The resin composition and the second resin composition are dried. Further, the laminated sheet 1 is taken up on the roller 628. According to this embodiment, the same effects as those of the first embodiment can be obtained. <Third Embodiment> Next, a third embodiment of the method for producing a laminated sheet according to the present invention will be described. In the third embodiment, the description will be focused on the differences from the above-described first embodiment of 100131446 36 201215506, and the same matters will be omitted. In the third embodiment, the laminated sheet manufacturing apparatus 6 or 6a is used. In the second embodiment, the first resin composition and the second resin composition have the same composition, and the rest are the same as those in the first embodiment. • <Fourth Embodiment> • Next, a fourth embodiment of the method for producing a laminated sheet according to the present invention will be described. In the fourth embodiment, the differences from the first embodiment will be mainly described, and the same matters will be omitted. In the fourth embodiment, the laminated sheet manufacturing apparatus 6b is used. The first step and the second step of the laminated sheet manufacturing apparatus 6b are the same as those of the first embodiment. Further, the drying step is the same as that of the first embodiment except that the drying step is performed between the second step and the third step described later. (Third Step) The roller 629 of the laminated sheet manufacturing apparatus 6b is rotated, and the sheet 7 is fed (continuously supplied) from the roller 629. As shown in FIG. 5, the sheet 7 is provided with a resin film 8 and a second resin layer (resin layer) composed of a solid resin or a semi-solid second resin composition provided on one surface of the resin film 8. 4. The second resin layer 4 is in a state of being processed into a thin sheet shape and is in a B-stage state. The resin film 8 can be used in the same manner as the resin film as the support 5, and the sheet 7 and the laminated body 100131446 37 201215506 of the fiber base material 2 and the support 5 are passed through the roll of the bonding device 65. Between 651 and the roller 652, the sheet 7 and the laminate of the fibrous base material 2 and the branch body 5 are pressurized and heated by the bonding device 65. Thereby, the sheet material 7 is pressed against the surface of the fiber base material 2 opposite to the first resin composition via the second resin layer 4, whereby the laminated sheet 1 is obtained. The laminated sheet 1 is taken up on the pro 628. The conditions at the time of the pressure bonding are not particularly limited, and are appropriately set in accordance with the composition of the second resin composition of the second resin layer 4 and the conditions, and the pressure is preferably about 〜1 to 1.0 MPa/cm 2 , more preferably The system is about 3 to 〇5 MPa/cm2. Further, the heating temperature is preferably about 40 to 1003⁄4, more preferably 60 to 80. In the fourth embodiment, since the sheet 7 having the second resin layer 4 composed of the solid or semi-solid second resin composition is provided on one side, it is applied to the fiber substrate 2. In the case where the thickness of the second resin composition is not impregnated in the thickness direction, the fourth embodiment can achieve the following effects in addition to the effects of the third embodiment. The sheet material 7 of the second resin layer 4 prevents the fiber base material 2 (four) from being mixed with the second resin composition and the second resin composition. Thus, it is possible to surely obtain a prepreg having desired characteristics. (1) After the resin composition is dried by the drying device 64, the second resin layer 4 is bonded, so that the second resin composition can be surely prevented from being mixed with the second resin composition. <Substrate> Next, a substrate manufactured using the laminated sheet of the present invention will be described with reference to Fig. 6 100131446 38 201215506. The substrate 1 shown in Fig. 6 includes two prepreg sheets lg which are disposed to face the second resin layer 4 toward each other, and an inner layer circuit board 13 which is sandwiched between the second resin layers 4. Further, the prepreg is cut into a predetermined size by the laminated sheet 1. The inner layer circuit board 13 can be the same as the fiber base material 2 described above. Further, in the present embodiment, since the second resin layer 4 has the above-described characteristics (flexibility), at least a part of the inner layer circuit board 13 is surely embedded (embedded) in the second resin layer 4. The pair of second resin layers 4 may be coated on the front and back surfaces of the fiber base material 13, and the pair of second resin layers 4 may be in contact with each other inside the fiber base material 13, so that the inside of the fiber base material 13 is completely paired with the second one. The resin layer 4 is buried. Further, the pair of second resin layers 4 can cover the front and back surfaces of the fiber base material 2, and a gap is formed between the pair of second resin layers 4, and a void is formed inside the fiber base material 13. The metal layer 12' provided on the surface of the first resin layer 3 opposite to the fiber base material 2 may have a support 5 formed of a metal foil. In the present embodiment, since the first resin layer 3 has the above-described characteristics, it can be made to have high adhesion. The metal layer 12' can be held and the metal layer 12 can be formed in the wiring portion with high processing precision. The peeling strength between the metal layer 12 and the first resin layer 3 is preferably 55 kN/m or more, more preferably 66 kN/m or more. Thereby, the metal layer 12 is processed into a wiring portion, and the connection reliability of the obtained semiconductor device 1 (see Fig. 7) can be further improved. 100131446 39 201215506 The b-type substrate 10 is prepared by preparing two prepreg sheets 1g, and is manufactured by, for example, a vacuum lamination method, a vacuum press method, or the like in a state in which the circuit board 13 is held by the above. Further, the substrate W can omit the inner layer circuit board 13, and the two prepreg sheets lg 3 have a laminated body in which the second resin layers 4 are directly joined to each other, and the metal layer 12 can be omitted. <Semiconductor Dunhuang>/, Human's poetry The semiconductor device manufactured by laminating month of the present invention is referred to in Fig. 7. In Fig. 7, the fiber base materials 2 and 13 are omitted, and the first resin layer 3 and the second resin layer 4 are integrally shown. The semiconductor device 100 shown in FIG. 7 includes a multilayer substrate 200 and a semiconductor device 500. The multilayer substrate 200 is provided with a pad portion 300 on the upper surface and a wiring portion 400 on the lower surface. The semiconductor device 500 is connected by bumps 5〇1. The pad portion 300 is mounted on the multilayer substrate 2A. The multilayer substrate 200 includes a substrate provided as a core substrate, three prepreg sheets la, lb, and lc provided on the upper side of the substrate 10, and three prepreg sheets id and le provided on the lower side of the substrate 10. If. The prepreg ia~1 £ is divided into a predetermined size by the laminated sheet 1. Further, the order of arrangement of the fiber base material 2, the first resin layer 3, and the second resin layer 4 constituting the prepreg sheets la to lc from the substrate 10 is formed. The fiber substrate 2, the first resin layer 3, and the second resin layer 4, which constitute the prepreg sheets Id to If, are arranged in the same order from the substrate 10. That is, the prepreg sheets la to lc and the prepreg sheets Id to If are formed upside down with each other up to the state of 100131446 40 201215506. Further, the above-described pad portion 300 is formed by processing a support 5 made of a metal foil of a prepreg sheet 1 into a predetermined pattern, and the wiring portion 4 is a support body composed of a metal foil of the prepreg sheet If. 5 processing is a given pattern. Further, in the circuit portions 2〇1 &, 201b disposed on the upper side of the prepreg sheets 1a and 1b, respectively, the support 5 made of a metal foil is processed into a predetermined pattern, and the prepreg Id, The circuit portions 2〇1 and 2〇ie disposed on the lower side of the le are processed into a predetermined pattern by the support 5 made of a metal foil. Further, the multilayer substrate 200 is provided with each of the prepreg sheets ia to lf. <1 is further disposed, and the conductor portion 202 is electrically connected between adjacent circuit portions or between the circuit portion and the solder joint portion. Further, each of the metal layers 12 of the substrate 10 is processed into a predetermined pattern, and the processed metal layers 12 are electrically connected to each other by a conductor portion 203 provided through the substrate 10. Further, in the semiconductor device 100 (multilayer substrate 200), four or more prepreg sheets may be provided on one side of the substrate 10. Further, the semiconductor device 1A may further contain a prepreg other than the prepreg obtained from the laminated sheet. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope of the object of the present invention are encompassed by the present invention. The above description of the method for producing a laminated sheet of the present invention and the laminated sheet will be described based on the embodiments shown in the drawings, but the present invention is not limited thereto, and the structure of each portion may be replaced by any structure having the same function. Further, the present invention is also possible to add any other structure and steps to 100131446 41 201215506. For example, as shown in FIG. 8, a suction means 67 may be provided in the apparatus 6. The 抽吸 抽吸 suction means 67 is used to impregnate the first resin composition into the fibrous base material 2. By sucking air by the suction means 67, the first resin composition is pulled, and the degree of impregnation with the fibrous base material 2 can be surely adjusted. A suction means 67 can also be provided in the devices 6a, 6b. Further, in the second embodiment, the supply position of the first resin composition from the nozzle 611 is adjusted along the feeding direction of the support 5 or the fiber base material 2, but this is not limited thereto. For example, the supply position of the support 5 or the fiber substrate 2 in the width direction (orthogonal direction of the feed direction) can be adjusted. Thereby, the impregnation amount of the first resin composition in the width direction of the fiber base material 2 can be adjusted. The present application claims priority on the basis of Japanese Patent Application No. 2010-195494, filed on Sep. 1, 2010, and the disclosure of which is incorporated herein. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a laminated sheet. Fig. 2 is a schematic cross-sectional view showing another structural example of the embodiment of the laminated sheet. Fig. 3 is a view showing a device for manufacturing a laminated sheet used in an embodiment of a method for producing a laminated sheet according to the present invention. Fig. 4 is a view showing a device for manufacturing a laminated sheet used in an embodiment of a method for producing a laminated sheet according to the present invention. Fig. 5 is a view showing a manufacturing apparatus of a laminated sheet using 100131446 42 201215506 used in the embodiment of the method for producing a laminated sheet of the present invention. Fig. 6 is a cross-sectional view of the substrate. Fig. 7 is a cross-sectional view showing an embodiment of a semiconductor device. Fig. 8 is a view showing a manufacturing apparatus of a modification of the present invention. * [Description of main component symbols] 1 laminated sheet 1A to 1D laminated sheet 1 a~ 1 g prepreg 2 fibrous base material 3 first resin layer 4 second resin layer 5 support 6 laminated sheet manufacturing apparatus 6a laminated sheet manufacturing apparatus 6b Laminate manufacturing apparatus 7 Sheet 8 Resin film 10 Substrate 12 Metal layer 13 Inner layer circuit board 20 Interface 31 First impregnation unit 100131446 43 201215506 41 Second impregnation unit 64 Drying device 65 Bonding device 67 Suction means 100 Semiconductor device 200 Multilayer substrate 201a, 201b, 201d, 201e Circuit portion 202, 203 Conductor portion 300 Pad portion 400 Wiring portion 500 Semiconductor element 501 Bumps 611 to 614 Nozzles (slit coater) 621 to 628 Roller 629 Roller 651 '652 Roller 661~663 Adjustment means 100131446 44

Claims (1)

201215506 七、申請專利範圍: 1. 一種積層片之製造方法,係在連續饋送出的支撐體、與 連續饋送出的纖維基材之間,供應第丨樹脂組成物,並將上 述支撐體與上述纖維基材隔著上述第丨樹脂組成物進行壓 * 接而製造積層片者,包括有: • 對上述支撐體其中一面、上述纖維基材其中一面中至少任 一者,供應液狀第i樹脂組成物的第丨步驟;以及 將上述支撐體的上述其中一面與上述纖維基材的上述其 中一面,隔著上述第【樹脂組成物進行壓接的第2步驟; 其中,上述第1步驟中,在對供應上述液狀第丨樹脂組成 物的供應手段之供應位置進行調整後,對上述支撐體其中— 面、上述纖維基材其中一面中至少任—者,供應液狀第i 樹脂組成物。 2. 如申請專利範圍第丨項之積層片之製造方法,其中,上 述第1步驟中,依選擇上述支撐體其中一面、上述纖維基材 其中一面中至少其中一面,並對所選擇的面供應液狀第工 樹脂組成物的方式,調整上述供應手段的供應位置。 . 3.如申請專利範圍第2項之積層片之製造方法,其中,上 • 述第1步驟中,上述供應手段係由下述所構成:朝上述支撐 體之上述其中一面吐出上述第1樹脂組成物的噴嘴;朝上述 纖維基材之上述其中—面吐出上述第丨樹脂組成物的嘴 嘴;以及朝在相對向的上述支撐體其中一面與上述纖維基材 100131446 45 201215506 了中一面之間所形成的空間吐出,且朝上述支撐體其中一面 =述纖維基材其中—面雙方吐出上述第丨_組成物的 科;藉由從上述複數喷嘴中選擇吐出上述第丨樹脂組成物 、1個噴t ’而I上核應手段的供應位置,並供應 上述液狀第1樹脂組成物。 4.如申請專利範圍第1項之 述第】步驟中,上述供應手‘=之製造方法’其中’上 向上述支魏之上料中料;依該喷嘴的吐出口朝 δ ψ 5 、上述纖維基材之上述其中一 ^ Α 延噴嘴改變位置,藉此調整上述 供應手段的供應位置,使上逃 年1树脂組成物從上述喷嘴吐 出。 、 項之積層片之製造方法,其中,上 5.如申請專利範圍第 述第1步驟中, 使屬於上述供應手段的噴嘴改變位置,調整上述支樓體其 中一面在支碰饋送出方㈣上述供應手段之供應位置,或 者》周正上韻維基材其巾〜面在纖絲材饋送出 方向的上 述供應手段之供應位置後,供應上述液狀第ι樹脂組成物。 6·如申請專利範圍第1項之積層片之製造方法,其中,上 述第2步驟中, 依上述支#體面接觸於層壓_周1/4以上範圍的方式, 將上述支#_上述㈣_周面連續搬送; 在上述層壓輥與上述支料彳目賴祕所,㈣著上述支 100131446 46 201215506 撐體與上述第1樹脂組成物而接觸於上述層壓輥的方式,將 上述纖維基材朝上述層壓輥連續搬送’藉此將上述纖維基材 與上述支撐體隔著上述第丨樹脂組成物施行壓接。 7·如申請專利範圍第1項之積層片之製造方法,其中,包 括有.朝上述纖維基材與上述第1樹脂組成物相反側之面, •供應液狀第2樹脂組成物的第3步驟。 8.如申請專利範圍第7項之積層片之製造方法,其中,上 述第靡旨組成物的供應係從噴嘴吐出該第2樹脂組成物而 實施。 9·如申請專鄕圍第1項之積層片之製造方法,立中,包 括有:將其中—面側設有由第2樹脂組成物所構成之薄片狀 樹脂詹、錢續供應的騎,在上雜維基材與上述第i 樹脂組成物相反側之面上’隔著上述片材的上述樹脂層進行 壓接之第3步驟。 T 1〇·如申請專鄕圍第9項之積層片之製造方法,盆中, 在上述第2步驟與上述第3步驟之間,具有施行乾燥的 11·如申請專利範圍第7項之積層片之製造方法,^中 ^述第1樹脂組成物與上述第2樹脂組成物係、相互組成不 12. 如”專利範圍第1項之積層>1之製造方法,盆中, 上述支撐體係金屬箔或樹脂薄膜。 13. -種積層片之製造裝置,係具備有: 100131446 201215506 連續饋送出支撐體的手残^ 連續饋送出纖維基材的手段; 對上述支撐體與上述纖維基材之間供應液狀第 成物的供應手段;以及 s 隔著上述第1樹脂組成物,將上述支撐體與上述纖 施行壓接的壓接手段; 、'土材 置進行調整的調整 其中,具備有對上述供應手段之供應位 手段。 14.如申請專利範圍第13項之積層片之製造裝置 上述供應手段係由下述所構成:朝上述支撐體之其卜面 出上述第1樹脂組成物的噴嘴;朝上述纖維基材之其中—吐 吐出上述第1樹脂組成物的噴嘴;以及朝在相對向的上: 樓體其中-面與上述纖維基材其中—面之間所形成的= 吐出’且朝上述支㈣其中—面與上述纖維基材其中 雙方吐出上述第1樹脂組成物的喷嘴. 上述調整手段係連接於上述各噴嘴,並執行各喷嘴之開閉 如甲睹寻利顯弟13項之積層片之製造裝置,其中, 上述供應手段係喷嘴; 上述調整手段係藉由使喷嘴改變位置,而以使嗔嘴的吐出 口朝向上述支撲體之上述其中—面、上述纖維基材之上述盆 中一面中至少1者的方式’使上述嘴嘴的吐出口改變位置, 100131446 48 201215506 或者, 藉由使喷嘴改變位置,而調整在上述支撐體其中一面的支 撐體饋送出方向上之上述液狀的上述供應手段的供應位 置,或調整在上述纖維基材其中一面的纖維基材饋送出方向 ►上之上述供應手段的供應位置。 100131446 49201215506 VII. Patent application scope: 1. A method for manufacturing a laminated sheet, which is a method for supplying a second resin composition between a continuously fed support and a continuously fed fibrous substrate, and the above support and the above The fiber base material is laminated by the above-mentioned second resin composition to produce a laminated sheet, and includes: • supplying a liquid i-th resin to one of the support body and at least one of the fiber base materials a second step of the composition; and a second step of pressing one of the one surface of the support and the one of the fiber base materials via the first [resin composition]; wherein, in the first step, After adjusting the supply position of the supply means for supplying the liquid second resin composition, the liquid i-th resin composition is supplied to at least one of the surface of the support and one of the fiber base materials. 2. The method of manufacturing a laminated sheet according to the ninth aspect of the invention, wherein, in the first step, one side of the support body and at least one of the one side of the fiber substrate are selected, and the selected surface is supplied. The supply position of the above-mentioned supply means is adjusted in the manner of the liquid resin composition. 3. The method of manufacturing a laminated sheet according to the second aspect of the invention, wherein in the first step, the supply means comprises: discharging the first resin toward one of the one side of the support; a nozzle of the composition; a nozzle for discharging the second resin composition toward the surface of the fiber substrate; and a surface of the opposite support body and the fiber substrate 100131446 45 201215506 The formed space is discharged, and one of the above-mentioned support bodies is discharged to the surface of the fiber substrate, and the second layer is discharged from the plurality of nozzles; and the second resin composition and one of the plurality of nozzles are selectively discharged. The supply position of the means is measured by spraying t' and I, and the liquid first resin composition is supplied. 4. In the step of the first aspect of the patent application scope, the above-mentioned method of supplying the hand '=', wherein the upper side of the above-mentioned support is fed; according to the discharge port of the nozzle, δ ψ 5 , the above One of the above-mentioned fiber substrates is changed in position, whereby the supply position of the supply means is adjusted, and the resin composition of the escaped year 1 is discharged from the nozzle. The manufacturing method of the laminated sheet of the item, wherein, in the first step of the patent application scope, the nozzle belonging to the supply means is changed in position, and one side of the branch body is adjusted to be in contact with the feeding side (four) The supply position of the supply means, or "the liquid-like resin composition of the above-mentioned supply means in the direction in which the filament material is fed out, is supplied to the surface of the substrate." 6. The method of manufacturing a laminated sheet according to the first aspect of the invention, wherein in the second step, the branch is in contact with the range of 1/4 or more of the lamination_week. _Continuously transporting the circumferential surface; the fiber is contacted by the above-mentioned laminating roller and the above-mentioned support material, and (4) the support of the above-mentioned support 100101446 46 201215506 and the first resin composition, and the fiber is contacted The base material is continuously conveyed toward the laminating roller, whereby the fiber base material and the support body are pressure-bonded via the second resin composition. 7. The method for producing a laminated sheet according to the first aspect of the invention, comprising: a surface facing the fiber substrate and the surface opposite to the first resin composition, and a third liquid resin composition. step. 8. The method for producing a laminated sheet according to the seventh aspect of the invention, wherein the supply of the above-mentioned composition is carried out by discharging the second resin composition from a nozzle. 9. If you apply for the manufacturing method of the laminated sheet of the first item, the Lizhong, including: the flaky resin composed of the second resin composition on the side of the surface, and the supply of the continuation supply. A third step of pressure-bonding the resin layer interposed between the upper sheet and the surface of the upper side of the i-th resin composition. T1〇·If applying for the manufacturing method of the laminated sheet of the ninth item, in the pot, between the second step and the third step, there is a layer 11 which is subjected to drying. In the method for producing a sheet, the first resin composition and the second resin composition are not related to each other. The manufacturing method of the laminate of the first aspect of the patent range, in the pot, the support system described above A metal foil or a resin film. 13. A manufacturing apparatus for a laminated sheet, comprising: 100131446 201215506 means for continuously feeding out a support of a support; continuously feeding out a fibrous base material; and the above-mentioned support body and said fibrous base material And a supply means for supplying the liquid first product; and s a pressure bonding means for pressure-bonding the support body to the fiber via the first resin composition; and adjusting the adjustment of the soil material The means for supplying the above-mentioned supply means. 14. The apparatus for manufacturing a laminated sheet according to claim 13 of the patent application, wherein the supply means is constituted by the first resin group facing the support body a nozzle for forming a product; a nozzle for discharging the first resin composition toward the fiber substrate; and a surface formed between the opposite side of the floor body and the fiber substrate; a nozzle that discharges the above-mentioned first resin composition to both the surface of the above-mentioned support and the fiber substrate. The adjustment means is connected to each of the nozzles, and the opening and closing of each nozzle is performed. The manufacturing apparatus of the laminated sheet of the thirteenth item, wherein the supply means is a nozzle; wherein the adjusting means changes the position of the nozzle so that the discharge opening of the nozzle faces the above-mentioned surface of the baffle body, the fiber A method of changing at least one of one of the ones of the bases of the substrate to change the position of the spout of the nozzle, 100131446 48 201215506 or, by changing the position of the nozzle, adjusting the feeding direction of the support on one side of the support a supply position of the above-mentioned liquid supply means, or the above-mentioned fiber substrate feeding direction on one side of the fiber substrate Supply location of supply means. 100131446 49
TW100131446A 2010-09-01 2011-09-01 Method for manufacturing laminated sheet and apparatus therefor TWI548526B (en)

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