JP2005210089A - Manufacturing method for nitride compound semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a nitride semiconductor device by which damage layers are not formed despite the fact that dry etching is performed, and by which wet etching is performed with a small number of processes and through simple batch processing. <P>SOLUTION: The manufacturing method for the nitride semiconductor device comprises a step to form a nitride semiconductor layer 13 on a base substrate 11, a step to form a conductive film 14 of an electron emitting layer 14b and dry etching mask layer 14a in sequence on a part of the upper surface of the nitride semiconductor layer 13, a step to perform dry etching on the nitride semiconductor layer 13, and a step to perform wet etching on the nitride semiconductor layer 13 by emitting electrons from the nitride semiconductor layer 13 to the outside through the conductive film 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a nitride-based compound semiconductor device (hereinafter simply referred to as “nitride semiconductor device”), and more particularly to a method for manufacturing a nitride semiconductor device including a wet etching step.

The nitride semiconductor element represented by Al _x Ga _y In _(1-xy) N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ 1-xy ≦ 1) has a visible region to an ultraviolet region. It is expected as a light emitting device material having a wide band gap, and has already been put into practical use for blue light emitting diodes and laser diodes. Nitride semiconductor elements are also expected as electronic element materials for high power and high frequency devices.

When manufacturing such a nitride semiconductor device, a nitride-based compound semiconductor layer (hereinafter simply referred to as “nitride semiconductor layer”) is processed by etching in order to form the structure of the device and the shape of the device. Often to do. In general, there are wet etching and dry etching, but the nitride semiconductor layer is physically and chemically stable, and it is difficult to perform wet etching on the semiconductor layer. Therefore, conventionally, dry etching that performs etching in a reactive gas atmosphere such as Cl ₂ or HCl or a plasma atmosphere disclosed in Non-Patent Document 1 is applied.

Other patent documents include Patent Documents 1 to 3 described later.
Japanese Patent Laid-Open No. 2001-250809 (paragraphs 0014 to 0019), FIG. Japanese Patent Laid-Open No. 10-233385 (paragraphs 0013 to 0014), FIG. JP 2002-231705 (paragraphs 0013 to 0017) LT Romano et al, "Dry and Wet Etching For Group III-Nitrides", MRS Internet Journal of Nitride Semiconductor Research, 4S1 1999 G1.4

  However, when dry etching is performed on the nitride semiconductor layer, there is a drawback that a damaged layer is formed by an etchant for dry etching on the surface of the nitride semiconductor layer after dry etching. Here, the damaged layer is a defect portion of the crystal structure, and the electrical characteristics of the damaged layer and the optical characteristics such as the band gap are different from the electrical characteristics and optical characteristics of the internal nitride semiconductor layer. Show.

  Until now, since this damaged layer exists, the portion of the nitride semiconductor layer where the damaged layer exists has not been used as a semiconductor element. Actually, the formed damage layer was left unattended. However, recently, in order to improve the performance of a semiconductor device, it has been considered to use a portion of a nitride semiconductor layer subjected to dry etching as a semiconductor device. However, if the nitride semiconductor layer portion in which the damaged layer is formed without removing the damaged layer as in the prior art is used as a semiconductor element, the electrical characteristics and optical characteristics are the damage layer and the nitride semiconductor inside. Since it differs from layer to layer, the performance of this semiconductor element may be poor. Therefore, when the portion of the nitride semiconductor layer in which the damaged layer is formed is used as a semiconductor element, the damaged layer must be removed in order for the semiconductor element to exhibit a commercially usable performance. In addition, when a semiconductor device is manufactured by re-growing another nitride semiconductor layer on the surface of the nitride semiconductor layer on which the damaged layer is formed, the re-grown nitride semiconductor layer affects the damage layer. There is a risk that a highly defective crystal structure will be received, and as a result, the performance of the semiconductor element may be poor. Therefore, also in this case, the damaged layer must be removed.

  The present invention has been made in view of the above points, and the object of the present invention is to remove a damage layer formed on the nitride semiconductor layer during dry etching during the manufacturing process of the nitride semiconductor element. In other words, the present invention provides a method of manufacturing a nitride semiconductor device in which a damaged layer is not formed despite dry etching. Another object is to provide a method of manufacturing a nitride semiconductor device by performing wet etching with a small number of steps and a simple batch process.

  In the first manufacturing method of the present invention, a nitride-based compound semiconductor layer is formed on a base material substrate, and a conductive film as an etching mask is formed on a part of the surface of the nitride-based compound semiconductor layer. A step of performing dry etching on the nitride-based compound semiconductor layer, and discharging electrons from the nitride-based compound semiconductor layer to the outside through the conductive film, thereby the nitride-based compound semiconductor layer Performing wet etching on the substrate.

Here, the nitride-based compound semiconductor element is a semiconductor represented by Al _x Ga _y In _(1-xy) N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ 1-xy ≦ 1). Means an element.

  The second manufacturing method of the present invention includes a step of forming a nitride compound semiconductor layer on a base material substrate, and a dry etching mask layer as a top layer on a part of the surface of the nitride compound semiconductor layer. Forming a multi-layered conductive film; performing a dry etching on the nitride-based compound semiconductor layer; removing the dry etching mask layer; and the nitride via the conductive film And a step of performing wet etching on the nitride compound semiconductor layer by emitting electrons from the compound compound semiconductor layer to the outside.

  In the first and second manufacturing methods of the present invention, a damage layer is formed in the nitride-based compound semiconductor layer in the dry etching step, and at least the damage layer is removed in the wet etching step. Is preferred.

  In the first and second manufacturing methods of the present invention, the conductive film may have a layer containing Ni.

  In the first and second manufacturing methods of the present invention, the nitride-based compound semiconductor layer includes at least one Al-containing layer, and the dry etching is performed on the Al-containing layer. May be.

  In the first and second manufacturing methods of the present invention, it is preferable that an external voltage is not applied to the conductive film in the wet etching step.

  The third manufacturing method of the present invention includes a step of forming a nitride compound semiconductor layer on a base material substrate, and a part of the surface of the nitride compound semiconductor layer from the nitride compound semiconductor layer to the outside. A step of forming a conductive film as an electron emission film for emitting electrons to the substrate, and an electron is emitted from the nitride compound semiconductor layer to the outside through the conductive film, and an external voltage is applied to the conductive film. Performing wet etching on the nitride-based compound semiconductor layer without applying.

  In the third manufacturing method of the present invention, the nitride-based compound semiconductor layer has an n-type nitride-based compound semiconductor layer as an uppermost layer, and a lower layer than the n-type nitride-based compound semiconductor layer as a p-type nitride-based layer. Preferably, the p-type nitride-based compound semiconductor layer is a wet etching stop layer formed from a plurality of compound semiconductor layers.

  Here, “the lower layer than the n-type nitride compound semiconductor layer is a p-type nitride compound semiconductor layer” means that the layer immediately below the n-type nitride compound semiconductor layer is a p-type nitride compound semiconductor layer. It may be a layer, and one or more n-type nitride compound semiconductor layers may exist between the n-type nitride compound semiconductor layer and the p-type nitride compound semiconductor layer.

  Further, “the p-type nitride compound semiconductor layer is a wet etching stop layer” means that the p-type nitride compound semiconductor layer and a semiconductor layer located below the semiconductor layer are wet. It means that etching is not performed.

  In the third manufacturing method of the present invention, the n-type nitride compound semiconductor layer is preferably an AlGaN layer.

  In the first, second, and third manufacturing methods of the present invention, it is preferable that the conductive film has a layer containing Ti and either Au or Pt.

  In the first, second, and third manufacturing methods of the present invention, the nitride-based compound semiconductor layer is formed of a plurality of layers, and each of the plurality of layers has a plurality of nitrides having different element composition ratios. It may be formed of a system semiconductor.

In the first, second and third manufacturing methods of the present invention, a solution containing any one of KOH, NaOH, H ₃ PO ₄ , H ₂ SO ₄ , and HCl may be used in the wet etching.

  In the first, second, and third manufacturing methods of the present invention, it is preferable that the nitride compound semiconductor layer is irradiated with ultrasonic waves in the wet etching step.

  In the first, second, and third manufacturing methods of the present invention, another nitride-based compound semiconductor layer may be provided on the nitride-based compound semiconductor layer that has been subjected to the wet etching.

  In the method for manufacturing a nitride semiconductor device of the present invention, a damage layer formed on the nitride semiconductor layer when dry etching is performed can be removed during the manufacturing process of the nitride semiconductor device. Therefore, the nitride semiconductor device manufactured by the method for manufacturing a nitride semiconductor device of the present invention does not have a damaged layer even though it is manufactured by dry etching. Therefore, the portion of the nitride semiconductor layer in which the damaged layer is formed, that is, the portion of the nitride semiconductor layer subjected to dry etching can be used as a semiconductor element. Further, in the method for manufacturing a nitride semiconductor device of the present invention, wet etching can be performed with a small number of steps and simple batch processing. Therefore, the nitride semiconductor device can be easily manufactured.

  Before describing the embodiments of the present invention, a method for manufacturing a nitride-based compound semiconductor element (hereinafter simply referred to as “nitride semiconductor element”) investigated by the inventors will be described.

  As already described, the effective etching method for the nitride-based compound semiconductor layer (hereinafter simply referred to as “nitride semiconductor layer”) is currently only dry etching. In this case, a damaged layer is formed on the surface of the nitride semiconductor layer subjected to dry etching. Here, the damage layer is 1) a portion where a molecule is peeled off, 2) a non-stoichiometric portion formed by a defect of an element constituting the semiconductor, and 3) a crystal structure inside the semiconductor which is formed near the surface. Non-Patent Document 1 describes a lattice defect portion that can affect 4) a portion where a dry etching agent or hydrogen gas has been injected into a semiconductor. Until now, the portion of the nitride semiconductor layer that has been subjected to dry etching has not been used as a semiconductor element, so that the damaged layer formed on the nitride semiconductor layer due to dry etching has been left unattended. However, the performance of the semiconductor element was not adversely affected. However, recently, in order to improve the performance of a semiconductor device, it has been considered to use a portion of a nitride semiconductor layer subjected to dry etching as a semiconductor device. In order to manufacture a semiconductor device with good performance, this damaged layer must be removed. Note that using a part of the nitride semiconductor layer as a semiconductor element means, for example, that a part of the nitride semiconductor layer is used as a waveguide portion.

  However, there has been no example studied so far regarding the removal of the above-mentioned damaged layer, and the present inventors have conducted this examination for the first time. Specifically, the present inventors examined performing wet etching as described below as a method for removing the damaged layer. First, the inventors of the present application formed a wet etching mask on a part of the surface of the nitride semiconductor layer, and simply immersed the nitride semiconductor layer in an etching solution such as an aqueous sodium hydroxide solution. Then, no wet etching was performed on the nitride semiconductor layer. Therefore, the inventors of the present application tried to increase the temperature of this etching solution. Then, only a part of the damaged layer is removed, and the surface of the wet-etched nitride semiconductor layer has many irregularities, and it is impossible to use the nitride semiconductor layer after the wet etching as a semiconductor element. I found out. Therefore, the validity of performing known wet etching on the nitride semiconductor layer was examined.

  For example, in wet etching disclosed in Patent Document 1, wet etching is performed using an electrochemical cell. An electrochemical battery disclosed in Patent Document 1 is shown in FIG. In this electrochemical cell, a GaN (nitride semiconductor layer) 70 to be wet-etched is used as an anode, a platinum rod 75 is used as a cathode, and a base solution such as potassium hydroxide or a dilute acid such as sulfuric acid is used as an electrolyte (etching). Liquid) 72. Then, as shown in FIG. 15, the platinum rod 75 is connected to the negative terminal of the bias source 76 using the conductive wire 78, and the contact 74 provided on the GaN 70 is connected to the positive terminal of the bias source 76 using the conductive wire 79. To do. In this way, the voltage generated by the bias source 76 is applied to the GaN 70 via the contact 74. When the voltage supplied from the bias source 76 exceeds the resistance loss of the electrolyte 72, the resistance loss of the GaN 70, and the standard electrochemical cell potential of the electrochemical cell, wet etching on the GaN 70 is started. At this time, the wet etching rate is proportional to the level of the bias voltage supplied by the bias source 76. Moreover, it is described that when wet etching is performed while irradiating the GaN 70 with the ultraviolet rays 77, the GaN 70 is wet-etched at a higher rate than when the GaN 70 is not irradiated.

In the wet etching disclosed in Patent Document 2, crystal defects are artificially generated in the portion of the nitride semiconductor layer where wet etching is performed. FIG. 16 is an explanatory view showing the wet etching process disclosed in Patent Document 2. In FIG. First, as shown in FIG. 16A, a SiO ₂ mask 86 is formed on a part of the surface of a GaN film (nitride semiconductor layer) 83 formed on the sapphire substrate 81. Next, Ga ions are implanted into the portion of the GaN film where the SiO ₂ mask 86 is not formed. Then, as shown in FIG. 16B, a crystal structure defect (defect portion) 85 is formed in the GaN film 83. Then, as shown in FIG. 16C, the SiO ₂ mask 86 is removed from the surface of the GaN film 83. Thereafter, when the GaN film 83 from which the SiO ₂ mask 86 has been removed is immersed in an aqueous solution of KOH or the like, as shown in FIG. Is performed. Further, Patent Document 2 discloses a technique in which wet etching can be performed on a GaN film by artificially forming a region having a highly defective crystal structure. Although this method is not shown, specifically, an Al ₂ O ₃ film having a highly defective crystal structure is first formed on a part of the sapphire substrate. Then grown the the Al ₂ O ₃ film on the upper surface the Al ₂ O ₃ film is GaN on the sapphire substrate which has not been formed (the nitride semiconductor layer). Then, GaN grown on the Al ₂ O ₃ film shows a highly defective crystal structure. That is, when growing GaN by this method, Al is the ₂ O ₃ film and GaN is grown to exhibit high crystal structure defect resistance, compared to on the sapphire substrate without the Al ₂ O ₃ film is formed on the upper surface GaN showing a crystal structure with low mechanical defects grows. Therefore, it is described that when this GaN is immersed in an aqueous KOH solution, wet etching is performed on the GaN grown on the Al ₂ O ₃ film. In the technique disclosed in Patent Document 2, wet etching can be selectively performed on a portion of GaN having a high defect density by artificially increasing the defect density of the nitride semiconductor layer.

  Patent Document 3 describes that if a portion having a highly defective crystal structure is formed in a semiconductor layer by ion implantation, wet etching can be selectively performed on the portion.

  However, when wet etching is performed using the electrochemical cell described in Patent Document 1, the GaN 70 and the positive terminal of the bias source 76 are electrically connected using the conductive wire 79 and the cathode 75 is used using the conductive wire 78. And the negative terminal of the bias source 76 are electrically connected. Further, it is necessary to apply a voltage between the GaN 70 and the cathode 75. Therefore, the structure of wet etching becomes complicated, and this wet etching method has a drawback that it is not suitable for mass production of nitride semiconductor devices. In particular, when all the patterns that do not perform wet etching are connected on one substrate, it is only necessary to wire the conductive wire once on the surface of the nitride semiconductor layer, but there are some patterns that are not connected to wet etching. If they are separated, it is necessary to provide a contact for each of these patterns. In other words, when there are some patterns that are not etched and are not separated from each other, the conductive wires must be attached to and detached from the surface of the nitride semiconductor layer for each pattern. Therefore, the method of performing wet etching with the electrochemical cell described in Patent Document 1 is very disadvantageous for mass production of nitride semiconductor elements and restricts the wet etching pattern. Further, when the nitride semiconductor layer is wet-etched, the wet etching rate greatly depends on the quality of the nitride semiconductor crystal. For this reason, whisker-like irregularities due to defects remain on the surface of the nitride semiconductor layer on which wet etching has been performed, and the flatness of the surface is poor. In addition, since the defect quality of the crystal structure becomes lower as the crystal quality of the nitride semiconductor becomes better, there is a disadvantage that the wet etching speed becomes slower when a nitride semiconductor with good crystal quality is wet etched. It was.

  Furthermore, when the nitride semiconductor layer is composed of a plurality of layers having different element composition ratios, for example, if there are a layer containing Al or a high resistance layer due to low carrier density, The in-plane distribution of chemical potential cannot be ignored and uniform wet etching becomes impossible. In addition, for example, when a layer having a large Al composition ratio and a large band gap exists in the plurality of layers, the band gap of the semiconductor layer becomes about the energy of light, and the effect of inducing and promoting wet etching is weakened. The wet etching rate becomes extremely slow or the wet etching is not performed. Therefore, the wet etching method performed using the electrochemical cell described in Patent Document 1 cannot perform wet etching on an Al-containing layer such as an AlGaN layer.

In addition, when wet etching is performed by implanting ions disclosed in Patent Documents 2 and 3, the depth of implanted ions may be controlled in order to control wet etching. It is not easy to control, and there is a drawback that accurate control of wet etching is difficult. In addition, when a nitride semiconductor layer is grown on an Al ₂ O ₃ film described in Patent Document 2 and wet etching is performed, the Al ₂ O ₃ film must be formed on the sapphire substrate before performing wet etching. Therefore, there is a disadvantage that the number of manufacturing steps of the nitride semiconductor element increases and the manufacturing process becomes complicated.

  As described above, the conventional wet etching method is difficult to apply industrially. Therefore, as a result of earnestly examining the etching method that can be easily applied industrially by the inventors of the present application, it is possible to remove the damaged layer formed by dry etching by performing wet etching with a small number of steps and simple batch processing, The present invention has been achieved in which wet etching can be performed without applying an external voltage. Embodiments of the present invention will be described below with reference to the drawings. The following embodiments are examples, and the present invention is not limited to these embodiments.

Embodiment 1 of the Invention
Hereinafter, the first embodiment will be described in detail with reference to FIGS. 1 and 2. FIG. 1 is a diagram illustrating an etching process in the present embodiment, and FIG. 2 is a diagram illustrating a configuration of wet etching in the present embodiment. In the present embodiment, a method for manufacturing a semiconductor laser device in which a portion where dry etching is performed is used as a waveguide portion will be described.

  First, as shown in FIG. 1A, a GaN-based buffer layer 12 is formed on a base material substrate 11 by metal organic chemical vapor deposition (MOCVD), and a GaN-based buffer layer is formed. A nitride semiconductor layer 13 is formed on 12. Thereby, the nitride semiconductor 10 is formed.

Here, the base material substrate 11 may be any substrate of sapphire, SiC, GaN, silicon, Ga ₂ O ₃ , MgAlO ₂ , and ZnO, and is known as a base material substrate for nitride semiconductor elements. A material substrate may be used, but a sapphire substrate is preferable.

  The nitride semiconductor layer 13 is made of GaN, AlN, InN, or a mixed crystal thereof. The nitride semiconductor layer 13 is AlGaN / p-GaN / InGaN MQW / n-GaN including an active layer made of InGaN multiple quantum well (MQW) and an AlGaN current blocking layer. Specifically, in the nitride semiconductor layer 13, an n-GaN layer and an active layer of InGaN MQW are formed on the surface of the GaN-based buffer layer 12 (indicated as one layer 13c in FIG. 1A). A p-GaN layer 13b is formed on the layer, and an AlGaN current blocking layer 13a is formed on the p-GaN layer 13b. Here, a layer formed by sequentially stacking an n-GaN layer (guide layer), an n-AlGaN layer (cladding layer), and an n-GaN layer is referred to as an n-GaN layer. The film thickness of the AlGaN current blocking layer 13a is preferably 50 nm or more and 300 nm or less, and the film thickness of the p-GaN layer 13b is preferably 20 nm or more and 200 nm or less. The film thickness of the n-GaN layer (guide layer) constituting the n-GaN layer is preferably 50 nm or more and 200 nm or less, and the n-AlGaN layer (cladding layer) constituting this n-GaN layer ) Is preferably 500 nm or more and 2000 nm or less. Most preferably, the AlGaN current blocking layer 13a has a thickness of 150 nm, the p-GaN layer 13b has a thickness of 125 nm, and the n-GaN layer has a thickness of 4000 nm. The n-GaN layer (guide layer) has a thickness of 150 nm, and the n-AlGaN layer (cladding layer) constituting the n-GaN layer has a thickness of 1200 nm. The film thickness of the n-GaN layer is 3000 nm. The nitride semiconductor layer 13 may be a single layer film of a nitride semiconductor, and the active layer of the nitride semiconductor layer 13 may be an InGaN single quantum well.

  Next, the conductive film 14 is formed by laminating the Ti layer, the Au layer, and the Ni layer in this order on both ends of the upper surface of the nitride semiconductor layer 13 using vapor deposition and a normal lithography technique. Thereby, as shown in FIG. 1B, a nitride semiconductor in which the conductive film 14 is provided on a part of the surface of the nitride semiconductor layer 13 (hereinafter simply referred to as “nitride semiconductor with conductive film”). .) 101 is formed.

Here, the Ni layer is a dry etching mask layer 14a, and acts as a mask when dry etching described later is performed. Therefore, the dry etching mask layer 14a is not limited to the Ni layer as long as it is a material that is resistant to the etching agent for dry etching. For example, the dry etching mask layer 14a may be a tungsten layer, a molybdenum layer, or the like, or may be a layer made of SiO ₂ , but is removed after the dry etching step as described later. Therefore, in consideration of removing the dry etching mask layer 14a later, the dry etching mask layer 14a is preferably a Ni layer.

  Further, the Ti layer and the Au layer are electron emission film layers 14b, and act as films for emitting electrons from the nitride semiconductor layer 13 to the outside when performing wet etching. Therefore, the electron emission film layer 14b is not limited to Ti and Au, and may be formed of a Ti layer and a Pt layer, or may be formed of a Ni layer and an Au layer. And a Pt layer, a Cr layer and an Au layer, or a Cr layer and a Pt layer. However, as will be described later, the electron emission film layer 14b is removed after the wet etching process. Therefore, considering that the electron emission film layer 14b is removed later, the electron emission film layer 14b is preferably composed of a Ti layer and an Au layer. Further, since the Ti layer is excellent in adhesion to the nitride semiconductor layer, the electron emission film layer 14b is preferably composed of a Ti layer and an Au layer in order to function stably as a mask for wet etching. In order to avoid complication of the figure, FIGS. 1B and 1C show the electron emission film layer 14b as one layer. The thickness of the dry etching mask layer 14a is preferably 200 nm or more, and more preferably 400 nm. The thickness of the electron emission film layer 14b is preferably 50 nm or more, and more preferably 200 nm.

Subsequently, dry etching is performed on the nitride semiconductor 101 with the conductive film by ECR plasma or ICP plasma using a gas containing chlorine atoms such as chlorine gas (Cl ₂ ). Thereby, dry etching is performed on the surface portion of nitride semiconductor layer 13 where dry etching mask layer 14a is not formed. Then, as shown in FIG. 1C, the entire AlGaN current blocking layer 13a in which the dry etching mask layer 14a is not formed and a part of the p-GaN layer 13b in which the dry etching mask layer 14a is not formed. Damage layer 15 is formed on the surface of p-GaN layer 13b that has been removed and subjected to dry etching. That is, as shown in FIG. 1C, the damage layer 15 is formed on the surface of the p-GaN layer 13b where the dry etching mask layer 14a is not formed.

  At this time, the dry etching is performed to a depth of 175 ± 25 nm by performing dry etching for about 2 minutes with the plasma for performing dry etching at a high frequency power of 200 W. Note that the value of the high frequency power for generating plasma is not limited to 200 W. The power value is preferably 50 W or more and 300 W or less.

  Thereafter, using a nitric acid solution, only the dry etching mask layer 14a is removed from the nitride semiconductor 102 after dry etching shown in FIG. 1C to form the nitride semiconductor 103 with the electron emission film. Thus, the dry etching process is completed, and the process proceeds to the wet etching process.

In the wet etching process, as shown in FIG. 2, first, an aqueous solution of potassium hydroxide (0.01 to 1 mol / dm ³ ) as an etching solution 2 is put in the container 1, and the electron emission film shown in FIG. The attached nitride semiconductor 103 is immersed in the etching solution 2. Then, the container 1 is put into the ultrasonic generator 3. Thereafter, the nitride semiconductor 103 with the electron emission film is irradiated with ultraviolet rays 7 having energy larger than the band gap of the p-GaN layer 13b, and ultrasonic waves (not shown) generated from the ultrasonic generator 3 are applied to the etching solution 2 and the electrons. The nitride semiconductor 103 with the emission film is irradiated. Thus, wet etching is performed on the nitride semiconductor 103 with the electron emission film. Further, by performing wet etching while irradiating the nitride semiconductor 103 with the electron emission film with ultrasonic waves, whisker-like irregularities due to crystal defects are not formed on the surface of the wet-etched p-GaN layer 13b. The surface roughness (RMS) can be 1 nm or less. Then, when the damaged layer 15 is completely removed from the nitride semiconductor 103 with the electron emission film, the wet etching process is completed. The etching solution 2 may be a sodium hydroxide (NaOH) aqueous solution, a heated phosphoric acid (H ₃ PO ₄ ) aqueous solution, sulfuric acid (H ₂ SO ₄ ), or a hydrochloric acid (HCl) aqueous solution. The ultrasonic generator 3 is a known ultrasonic generator, and the generated ultrasonic wave preferably has a frequency of 10 kHz to 100 KHz and an output of 10 W to 200 W. More preferably, the nitride semiconductor 103 with an electron emission film is irradiated with ultrasonic waves having a frequency of 20 kHz to 40 kHz and an output of 20 W to 50 W.

  Here, the mechanism by which wet etching is performed by the above configuration will be briefly described. Since the electron emission film layer 14b is formed on a part of the surface of the nitride semiconductor 103 with the electron emission film, electrons in the nitride semiconductor 103 with the electron emission film pass through the electron emission film layer 14b. The nitride semiconductor 103 with the emission film is released into the etching solution 2. Therefore, holes are collected near the surface of the nitride semiconductor 103 with the electron emission film. At this time, a damage layer 15 is formed on the surface of the dry-etched p-GaN layer 13b. As described above, since the electrical characteristics of the damaged layer 15 are different from the electrical characteristics of the internal semiconductor layer, the holes in the nitride semiconductor 103 with the electron emission film are selectively collected on the surface portion of the damaged layer 15. It becomes. Therefore, the damaged layer 15 formed by dry etching is selectively wet etched. That is, only by immersing the nitride semiconductor 103 with an electron emission film in the etching solution 2, wet etching is performed on the damage layer 15 formed by dry etching. As a result, the damage layer 15 is nitrided with an electron emission film. It is removed from the physical semiconductor 103.

  In the present embodiment, since the semiconductor layer to be wet-etched is the p-GaN layer 13b, it originally has holes. Therefore, it is not necessary to irradiate the p-GaN layer 13b with the ultraviolet rays 7 shown in FIG. 2 to generate electron-hole pairs in the p-GaN layer 13b. Further, in the wet etching in the present embodiment, the damaged layer 15 formed on the p-GaN layer 13b is simply removed by dry etching performed before the wet etching. As described above, in this embodiment, it is not always necessary to perform wet etching by irradiating the nitride semiconductor 103 with the electron emission film with the ultraviolet light 7 shown in FIG. However, since the progress rate of wet etching is slightly increased by irradiating the ultraviolet ray 7, it is preferable to perform the wet etching while irradiating the ultraviolet ray 7 also in this embodiment.

  After the wet etching step, the electron emission film layer 14b is removed from the nitride semiconductor 103 with the electron emission film using hydrofluoric acid, buffer hydrofluoric acid, or the like. . Thereafter, another nitride semiconductor layer 17 is grown on the surface of the nitride semiconductor after the wet etching by MOCVD. Thereby, the nitride semiconductor element 104 shown in FIG. 1E is formed. The nitride semiconductor element 104 can be used as a semiconductor laser element in which a portion of the nitride semiconductor layer 13 subjected to dry etching is used as a waveguide portion.

  Below, the effect which the manufacturing method of the nitride semiconductor device in this embodiment shows is explained.

  In the nitride semiconductor device manufacturing method of this embodiment, since the electron emission film layer 14b is formed on the surface of the nitride semiconductor 103 with the electron emission film, the nitride semiconductor 103 with the electron emission film is removed from the etching solution 2. Then, the electrons in the nitride semiconductor 103 with the electron emission film are emitted from the nitride semiconductor layer 13 to the etching solution 2 through the layer 14b of the electron emission film. As a result, holes exist on the surface of the nitride semiconductor 103 with the electron emission film. Further, since the nitride semiconductor 103 with the electron emission film is dry-etched before this wet etching, a damage layer 15 is formed on the surface of the p-GaN layer 13b that has been dry-etched. ing. Since the electrical characteristics of the damaged layer 15 are different from the electrical characteristics of the internal nitride semiconductor layer, holes existing in the vicinity of the surface of the nitride semiconductor 103 with the electron emission film are selectively formed on the surface of the damaged layer 15. get together. As a result, wet etching is performed on the damaged layer 15. That is, wet etching is performed on the damaged layer 15 simply by immersing the nitride semiconductor 103 with the electron emission film in the etching solution 2. Therefore, unlike the prior art, it is not necessary to apply an external voltage to the nitride semiconductor layer or perform ion implantation to the nitride semiconductor layer when performing wet etching. Since the external voltage is not applied to the nitride semiconductor layer, the structure of the wet etching does not become complicated, and the semiconductor which becomes the anode using the time and effort to electrically connect the cathode and the negative terminal of the bias source using the conductive wire It is possible to save the trouble of electrically connecting the layer and the positive terminal of the bias source. Here, not applying an external voltage to the nitride-based compound semiconductor layer means that the nitride-based compound semiconductor layer is simply immersed in an etching solution used for wet etching. In addition, since ion implantation is unnecessary, it is possible to save time and effort for implanting ions into the substrate or nitride semiconductor layer, and the number of steps in wet etching can be reduced.

  In addition, as shown in FIG. 1B, even when a pattern that is not wet-etched is not connected and there are some spaced patterns, an electron emission film layer 14b reflecting the pattern is formed. The nitride semiconductor 103 with an electron emission film can be wet etched only by immersing the nitride semiconductor 103 with an electron emission film in the etching solution 2 once. Therefore, the wet etching method of the present embodiment can perform wet etching very easily and various patterns of etching as compared with the conventional wet etching method.

  Further, in the manufacturing method according to the present embodiment, the damage layer 15 formed in the dry etching process can be removed by performing dry etching on the nitride semiconductor 10 and then performing wet etching. Therefore, unlike the conventional nitride semiconductor element, the nitride semiconductor element 104 can use a portion of the nitride semiconductor layer subjected to dry etching as a semiconductor element. For example, the nitride semiconductor element 104 can be used as a semiconductor laser element in which a portion of the p-GaN layer 13b subjected to dry etching is used as a waveguide portion. In the nitride semiconductor element 104, the refractive index difference between the waveguide portion and the AlGaN current blocking layer 13a can be controlled by selecting the composition of the AlGaN current blocking layer 13a. As a result, the nitride semiconductor element 104 becomes a high-power or low-noise semiconductor laser element.

  Further, in the manufacturing method according to the present embodiment, since dry etching is performed, it is possible to easily etch the Al-containing layer, that is, the AlGaN current blocking layer 13a, which is difficult to etch by conventional wet etching. . Therefore, the nitride semiconductor element 104 can be manufactured without worrying about the material of the nitride semiconductor layer 13. Further, a layer containing Al, such as the AlGaN current blocking layer 13a, can be used as the waveguide portion of the semiconductor laser device, and the manufactured nitride semiconductor device 104 has a wider range of use of the semiconductor device.

  Further, in the wet etching process, wet etching is performed while irradiating the etching solution 2 and the nitride semiconductor 103 with the electron emission film with ultrasonic waves. Therefore, the surface of the p-GaN layer 13b after the wet etching is caused by crystal defects. The formation of whisker-like irregularities can be suppressed, and the surface roughness (RMS) can be reduced to 1 nm or less. Therefore, even if another nitride semiconductor layer 17 is crystal-grown on the surface of the nitride semiconductor layer after the wet etching, the crystal structure of the other nitride semiconductor layer 17 hardly includes crystal defects, and as a result, The performance of the manufactured semiconductor device does not deteriorate. Therefore, the nitride semiconductor element 104 can also be used as a semiconductor element having a current confinement structure such as a laser diode.

  Further, in this embodiment, since the AlGaN current blocking layer 13a and part of the p-GaN layer 13b are dry-etched, the damage layer 15 has a p-type as shown in FIG. It is formed on the surface of the GaN layer 13b. A p-type semiconductor such as p-GaN originally has holes, but the holes do not exist on the surface of the semiconductor layer. Application of a voltage is an essential requirement (this is described in detail in the section of the etching mechanism in Embodiment 4 below). Therefore, in the wet etching of the present embodiment in which no external voltage is applied, only the damaged layer 15 formed by performing the dry etching is removed, and the semiconductor layer below the damaged layer 15 is removed. Thus, wet etching cannot be performed. That is, in this embodiment, the p-GaN layer 13b functions as a wet etching stop layer.

<< Embodiment 2 of the Invention >>
Hereinafter, the second embodiment will be described with reference to FIGS. FIG. 3 is a diagram for explaining an etching process in the present embodiment, and FIG. 4 is a diagram showing a configuration of wet etching in the present embodiment. Also, in FIG. 3, the same reference numerals as those in FIG. In FIG. 4, the same reference numerals as those in FIG.

  In the present embodiment, unlike the first embodiment, the conductive film 14 is provided at the substantially central portion of the upper surface of the nitride semiconductor layer 13. And in this embodiment, detailed description is abbreviate | omitted about the part which overlaps with the said Embodiment 1. FIG.

  First, as shown in FIG. 3A, a GaN-based buffer layer 12 is formed on a base material substrate 11 by MOCVD, and then a nitride semiconductor layer 13 is formed on the GaN-based buffer layer 12. The semiconductor 10 is formed.

  Next, as shown in FIG. 3 (b), the dry etching mask layer 14a and the electron emission film are formed at substantially the center of the upper surface of the nitride semiconductor layer 13 of the nitride semiconductor 10 by using vapor deposition and ordinary lithography techniques. A conductive film 14 made of the layer 14b is formed. Thereby, the nitride semiconductor 111 with a conductive film is formed.

  Subsequently, dry etching is performed on the nitride semiconductor 111 with the conductive film shown in FIG. Thereby, dry etching is performed on the surface portion of the nitride semiconductor layer 13 where the dry etching mask layer 14a is not formed, and the damage layer 15 is formed on the surface of the p-GaN layer 13b.

  Then, using the nitric acid solution, only the dry etching mask layer 14a is removed from the nitride semiconductor 112 after dry etching shown in FIG. 3C, and the nitride semiconductor 113 with electron emission film shown in FIG. Form. Thereafter, wet etching shown in FIG. 4 is performed on the nitride semiconductor 113 with the electron emission film. Thereby, the damaged layer 15 is removed from the nitride semiconductor 113 with the electron emission film.

  After the wet etching process is completed and the electron emission film layer 14b is removed, an insulating film 19 is formed on the surface of the nitride semiconductor layer 13 subjected to the etching. At this time, the insulating film 19 may be formed of a material having an appropriate refractive index difference from the nitride semiconductor layer 13, or formed of a material having a composition different from the composition of the nitride semiconductor layer 13. Also good. Thereafter, another nitride semiconductor layer 17 is crystal-grown on the surface of the nitride semiconductor layer 13 and the surface of the insulating film 19 that have not been etched by MOCVD. Thereby, the nitride semiconductor device 114 shown in FIG. 3E is formed.

  And the manufacturing method of the nitride semiconductor element in this embodiment has an effect substantially the same as the effect which the manufacturing method of the nitride semiconductor element in the said Embodiment 1 show | plays. In the nitride semiconductor device 114 according to the present embodiment, the difference in refractive index between the waveguide portion and the current blocking layer 19 can be controlled by selecting the material of the current blocking layer 19.

<< Embodiment 3 of the Invention >>
Hereinafter, the third embodiment will be described with reference to FIGS. FIG. 5 is a diagram for explaining an etching process in the present embodiment, and FIG. 6 is a diagram showing a configuration of wet etching in the present embodiment. Further, in FIG. 5, the same reference numerals as those in FIG. Further, in FIG. 6, the same reference numerals as those in FIG.

  In the present embodiment, unlike the first embodiment, the conductive film is a single layer. In other respects, the manufacturing method in the present embodiment and the manufacturing method in the first embodiment are substantially the same. Therefore, in the present embodiment, detailed description of the same parts as those in the first embodiment is omitted.

  First, as shown in FIG. 5A, a GaN-based buffer layer 12 is formed on a base material substrate 11 by a MOCVD method, and then a nitride semiconductor layer 23 is formed on the GaN-based buffer layer 12. The semiconductor 20 is formed.

  Next, as shown in FIG. 5B, the conductive film 16 is formed on both ends of the upper surface of the nitride semiconductor layer 23 of the nitride semiconductor 20 by using vapor deposition and ordinary lithography techniques. Here, the conductive film 16 is a film made of, for example, Ni or Pt, and has both a function as a mask for dry etching and a function as a film for emitting electrons. Thereby, the nitride semiconductor 121 with a conductive film is formed.

  Subsequently, dry etching is performed on the nitride semiconductor 121 with the conductive film shown in FIG. Thereby, dry etching is performed on the surface portion of the nitride semiconductor layer 23 where the conductive film 16 is not formed, and the damage layer 15 is formed on the surface of the nitride semiconductor layer 23. After that, wet etching shown in FIG. 6 is performed on the nitride semiconductor 122 after dry etching shown in FIG. 5C without removing the conductive film 16. Thereby, the damaged layer 15 is removed from the nitride semiconductor 122 after dry etching.

  After the wet etching process is completed and the conductive film 16 is removed, another nitride semiconductor layer 17 is crystal-grown on the surface of the nitride semiconductor layer 23 that has been etched by MOCVD. Thereby, the nitride semiconductor element 123 shown in FIG. 5D is formed.

  Below, the effect which the manufacturing method of the nitride semiconductor device in this embodiment shows is explained.

  The manufacturing method of the nitride semiconductor device in the present embodiment has the following effects in addition to the effects in the first embodiment. The effect is that since the conductive film 16 has a function as a mask for dry etching and a function as a film for emitting electrons, the nitride semiconductor 20 includes a mask layer for dry etching, a layer for electron emission film, It is possible to save the trouble of providing the two layers made of and to remove the conductive film 16 in two stages.

  The nitride semiconductor device 114 described in the second embodiment can also be manufactured by using the method for manufacturing a nitride semiconductor device in the present embodiment.

<< Embodiment 4 of the Invention >>
Hereinafter, Embodiment 4 is demonstrated based on FIG.7 and 8. FIG. FIG. 7 is a diagram for explaining an etching process in the present embodiment, and FIG. 8 is a diagram showing a configuration of wet etching in the present embodiment. Further, in FIG. 7, the same reference numerals as those in FIG. Further, in FIG. 8, the same reference numerals as those in FIG. 2 are attached to the portions showing the same structures and functions as those in FIG.

  In the present embodiment, a case will be described in which the damaged layer 15 formed by dry etching is removed by wet etching, and the p-type nitride semiconductor layer 33a inside the damaged layer is also wet etched. Detailed descriptions of the same parts as those in the first embodiment are omitted.

  First, as shown in FIG. 7A, after the GaN-based buffer layer 12 is formed on the base material substrate 11 by MOCVD, the nitride semiconductor layer 33 is formed on the GaN-based buffer layer 12, and the nitride is formed. The semiconductor 30 is formed. At this time, a p-type semiconductor layer 33 a such as p-GaN is formed in the nitride semiconductor layer 33.

  Next, as shown in FIG. 7B, the dry etching mask layer 14a and the electron emission film layer are formed on both ends of the upper surface of the nitride semiconductor layer 33 of the nitride semiconductor 30 by using vapor deposition and ordinary lithography techniques. A conductive film 14 made of 14b is formed. Thereby, the nitride semiconductor 131 with a conductive film is formed. The conductive film 14 may be the conductive film 16 described in the third embodiment.

  Subsequently, dry etching is performed on the nitride semiconductor 131 with the conductive film shown in FIG. Thereby, dry etching is performed on the surface portion of the p-type semiconductor layer 33a where the dry etching mask layer 14a is not formed, and the damage layer 15 is formed on the surface of the p-type semiconductor layer 33a.

  Then, using the nitric acid solution, only the dry etching mask layer 14a is removed from the nitride semiconductor 132 after dry etching shown in FIG. 7C, and the nitride semiconductor 133 with electron emission film shown in FIG. Form. Thereafter, wet etching shown in FIG. 8 is performed on the nitride semiconductor 133 with the electron emission film. Thereby, the damage layer 15 is removed from the nitride semiconductor 133 with the electron emission film.

  Here, when the nitride semiconductor 133 with the electron emission film is immersed in the etching solution 2, the damage layer 15 formed by dry etching as described in the first embodiment can be removed. However, when wet etching described below is performed, the p-type semiconductor layer 33a inside the damaged layer 15 formed by dry etching can also be etched. Before describing the wet etching method, a mechanism by which the p-type semiconductor layer 33a is wet etched will be briefly described.

  In order to perform wet etching, it is necessary that holes exist on the surface of the semiconductor layer. A p-type semiconductor originally has holes as majority carriers, but due to the band shape of the p-type semiconductor, the holes exist inside the semiconductor layer and do not exist on the surface of the semiconductor layer. However, using a conductive wire, the nitride semiconductor layer serving as the anode and the positive terminal of the bias source are electrically connected, and the platinum rod serving as the cathode and the negative terminal of the bias source are electrically connected, and the anode and When an external voltage is applied to the nitride semiconductor layer through a bias source after the cathode is immersed in an etching solution such as an aqueous potassium hydroxide solution, the band shape of the p-type semiconductor layer changes. As a result, holes can exist on the surface of the p-type semiconductor layer, whereby wet etching is performed on the p-type semiconductor layer. At this time, electrons existing inside the nitride semiconductor layer are released into the etching solution via the platinum rod as the cathode. The specific method is shown below.

  As shown in FIG. 8, first, the electron emission film layer 14b of the nitride semiconductor 133 with the electron emission film is connected to the positive terminal of the bias source 6 using a conducting wire, and the platinum rod 5 and the negative terminal of the bias source 6 are connected. And connect. Next, the container 1 is placed in the ultrasonic generator 3, an etching solution 2 such as an aqueous potassium hydroxide solution is placed in the container 1, and the nitride semiconductor 133 with an electron emission film and the platinum rod 5 are immersed in the etching solution 2. . Thereafter, an external voltage is applied to the nitride semiconductor 133 with the electron emission film via the bias source 6. Then, the ultrasonic wave generated from the ultrasonic generator 3 is irradiated to the etching solution 2, the nitride semiconductor 133 with an electron emission film, and the platinum rod 5. Thereby, wet etching is performed not only on the damaged layer 15 but also on the p-type semiconductor layer 33a, and whisker-like irregularities due to crystal defects are not formed on the surface of the semiconductor layer after etching. The surface roughness (RMS) can be 1 nm or less. Moreover, the wet etching speed can be slightly increased by irradiating the nitride semiconductor 133 with electron emission film and the etching solution 2 with the ultraviolet rays 7.

  When the base material substrate 11 is made of a conductive material such as SiC, it is also possible to wire the + terminal of the bias source 6 on the base material substrate 11 instead of on the electron emission film layer 14b. In the present embodiment, since the semiconductor layer to be wet-etched is the p-type semiconductor layer 33a, it originally has holes. Therefore, irradiation with ultraviolet rays 7 is not an indispensable requirement for wet etching in the present embodiment. However, since the progress rate of wet etching is slightly increased by irradiating the nitride semiconductor 133 with an electron emitting film with ultraviolet rays 7, Also in the embodiment, it is preferable to perform wet etching while irradiating the nitride semiconductor 133 with the electron emission film with ultraviolet rays 7.

  After the wet etching step is completed as described above and the electron emission film layer 14b is removed, another nitride semiconductor layer 17 is grown on the surface of the nitride semiconductor after the wet etching by MOCVD. Thereby, the nitride semiconductor element 134 shown in FIG. 7E is formed.

  In addition to the effect of the first embodiment, the effect of the present embodiment can perform wet etching to the p-type nitride semiconductor layer 33a inside the damage layer 15 formed by dry etching. Generally, in dry etching, it is not possible to perform etching by specifying a layer. Therefore, when dry etching is performed on the nitride semiconductor layer above the desired layer, the desired layer can be etched by performing the etching method in this embodiment. . On the other hand, when a desired layer can be etched in the dry etching process, it is not necessary to apply an external voltage, and the etching can be performed by the etching method in the first embodiment.

  The nitride semiconductor device 114 described in the second embodiment can also be manufactured by using the method for manufacturing a nitride semiconductor device in the present embodiment.

<< Embodiment 5 of the Invention >>
Hereinafter, Embodiment 5 will be described with reference to FIGS. FIG. 9 is a diagram for explaining an etching process in the present embodiment, and FIG. 10 is a diagram showing a configuration of wet etching in the present embodiment. Further, in FIG. 9, the same reference numerals as those in FIG. Further, in FIG. 10, the same reference numerals as those in FIG.

  In the present embodiment, a case will be described in which the damaged layer 15 formed by dry etching is removed by wet etching, and the n-type nitride semiconductor layer 43a inside the damaged layer is also wet etched. Detailed descriptions of the same parts as those in the first embodiment are omitted.

  First, as shown in FIG. 9A, after the GaN-based buffer layer 12 is formed on the base material substrate 11 by MOCVD, the nitride semiconductor layer 43 is formed on the GaN-based buffer layer 12, and the nitride is formed. A semiconductor 40 is formed. At this time, an n-type semiconductor layer 43a such as n-GaN is formed in the nitride semiconductor layer 43.

  Next, as shown in FIG. 9B, the dry etching mask layer 14a and the electron emission film layer are formed on both ends of the upper surface of the nitride semiconductor layer 43 of the nitride semiconductor 40 using vapor deposition and ordinary lithography techniques. A conductive film 14 made of 14b is formed. Thereby, the nitride semiconductor 141 with the conductive film is formed. The conductive film 14 may be the conductive film 16 described in the third embodiment.

  Subsequently, dry etching is performed on the nitride semiconductor 141 with the conductive film shown in FIG. Thereby, dry etching is performed on the surface portion of the n-type semiconductor layer 43a where the dry etching mask layer 14a is not formed, and the damage layer 15 is formed on the surface of the n-type semiconductor layer 43a.

  Then, using the nitric acid solution, only the dry etching mask layer 14a is removed from the nitride semiconductor 142 after dry etching shown in FIG. 9C, and the nitride semiconductor 143 with electron emission film shown in FIG. Form. Thereafter, wet etching shown in FIG. 10 is performed on the nitride semiconductor 143 with an electron emission film. Thereby, the damaged layer 15 is removed from the nitride semiconductor 143 with the electron emission film.

  Here, when the nitride semiconductor 143 with an electron emission film is immersed in the etching solution 2, the damage layer 15 formed by dry etching as described in the first embodiment can be removed. However, when the wet etching described below is performed, the n-type semiconductor layer 43a inside the damaged layer 15 formed by dry etching can also be etched. Before describing the wet etching method, a mechanism by which the n-type semiconductor layer 43a is wet etched will be briefly described.

  In order to perform wet etching, it is necessary that holes exist on the surface of the semiconductor layer. The n-type semiconductor layer originally has no holes. However, when the n-type semiconductor layer is irradiated with ultraviolet rays having energy equal to or higher than the band gap of the n-type semiconductor layer, hole-electron pairs are generated in the n-type semiconductor layer. When the hole-electron pair is generated, the holes move to the surface of the n-type semiconductor layer from the band shape of the n-type semiconductor layer without applying an external voltage to the n-type semiconductor layer. . As a result, wet etching is started on the n-type semiconductor layer. Therefore, when wet etching is performed on the n-type semiconductor layer, it is not necessary to apply an external voltage to the n-type semiconductor layer as in the fourth embodiment, and the n-type semiconductor layer may be irradiated with ultraviolet rays. A specific wet etching method will be described below.

  As shown in FIG. 10, first, the container 1 is placed in the ultrasonic generator 3, the etching solution 2 such as a potassium hydroxide aqueous solution is placed in the container 1, and the nitride semiconductor 143 with an electron emission film is etched into the etching solution 2 Soak in. Next, the nitride semiconductor 143 with an electron emission film and the etching solution 2 are irradiated with ultraviolet rays 7 having a center wavelength of 365 nm or less. Thereby, wet etching is performed not only on the damaged layer 15 but also on the n-type semiconductor layer 43a. Then, while irradiating the nitride semiconductor 143 with the electron-emitting film with the ultraviolet light 7, the ultrasonic wave generated from the ultrasonic generator 3 is irradiated onto the etching solution 2 and the nitride semiconductor 143 with the electron-emitting film. As a result, wet etching is performed on the n-type semiconductor layer 43a, and whisker-like irregularities due to crystal defects are not formed on the surface of the n-type semiconductor layer 43a after etching, and the surface roughness (RMS) Can be made 1 nm or less.

  In this case, as shown in FIG. 8, when wet etching is performed while applying an external voltage to the nitride semiconductor 143 with an electron emission film, the wet etching speed can be increased.

  Thus, after the wet etching process is completed and the electron emission film layer 14b is removed, another nitride semiconductor layer 17 is crystal-grown on the surface of the nitride semiconductor after the etching by MOCVD. Thereby, the nitride semiconductor device 144 shown in FIG. 9E is formed.

  The effect in the present embodiment is the same as that in the fourth embodiment except that the n-type semiconductor can be etched.

Embodiment 6 of the Invention
Hereinafter, the sixth embodiment will be described with reference to FIGS. FIG. 11 is a diagram for explaining an etching process in the present embodiment, and FIG. 12 is a diagram showing a configuration of wet etching in the present embodiment. In FIG. 11, the same reference numerals as those in FIG. 1 are assigned to the same substances and functions as those in FIG. In FIG. 12, the same reference numerals as those in FIG. 2 are assigned to the same substances and functions as those in FIG.

  Unlike the first embodiment, the present embodiment is a method of manufacturing a nitride semiconductor device by performing only wet etching without performing dry etching.

  First, as shown in FIG. 11A, after the GaN-based buffer layer 12 is formed on the base substrate 11 by the MOCVD method, the nitride semiconductor layer 53 is formed on the GaN-based buffer layer 12, and the nitride is formed. A semiconductor 50 is formed.

  Here, the nitride semiconductor layer 53 is made of GaN, AlN, InN and mixed crystals thereof. The nitride semiconductor layer 53 is n-AlGaN / p-GaN / InGaN MQW / n-GaN including an active layer made of InGaN MQW and an n-AlGaN current blocking layer 53a. Specifically, in the nitride semiconductor layer 53, an n-GaN layer and an active layer of InGaN MQW are formed on the surface of the GaN-based buffer layer 12 (indicated as one layer 53c in FIG. 11A). A p-GaN layer 53b is formed on the layer, and an n-AlGaN current blocking layer 53a is formed on the p-GaN layer 53b. Here, a layer formed by laminating an n-GaN layer, an n-AlGaN layer (cladding layer), and an n-GaN layer (guide layer) in this order is referred to as an n-GaN layer. The n-AlGaN current blocking layer 53a preferably has a thickness of 50 nm to 300 nm, and the p-GaN layer 53b preferably has a thickness of 20 nm to 200 nm. Most preferably, the film thickness of the n-AlGaN current blocking layer 53a is 150 nm, the film thickness of the p-GaN layer 53b is 125 nm, and the film thickness of the n-GaN layer is 4350 nm. The n-GaN layer (guide layer) constituting the film has a thickness of 150 nm, and the n-AlGaN layer (cladding layer) constituting the n-GaN layer has a thickness of 1200 nm. The thickness of the n-GaN layer constituting the layer is 3000 nm. The p-GaN layer 53b functions as a wet etching stop layer in the later-described wet etching. The active layer of the nitride semiconductor layer 53 may be InGaN SQW.

  Next, as shown in FIG. 11B, electron emission is performed by stacking Ti and Pt in this order on both ends of the upper surface of the nitride semiconductor layer 53 of the nitride semiconductor 50 using vapor deposition and ordinary lithography technology. A film layer 54b is formed. Thereby, the nitride semiconductor 151 with an electron emission film is formed. The electron-emitting film layer 54b is not limited to a film made of Ti and Pt, and may be formed using another film described in the first embodiment.

  Subsequently, wet etching shown in FIG. 12 is performed on the nitride semiconductor 151 with the electron emission film. In order to perform wet etching in the present embodiment, first, the container 1 is placed in the ultrasonic generator 3, the etching solution 2 such as an aqueous potassium hydroxide solution is placed in the container 1, and the nitride semiconductor with the electron emission film is placed. 151 is immersed in the etching solution 2. Then, while irradiating the nitride semiconductor 151 with the electron emission film with the ultraviolet ray 7, the ultrasonic wave generated from the ultrasonic generator 3 is irradiated to the nitride semiconductor 151 with the etching solution 2 and the electron emission film. Thereby, wet etching is performed on the n-AlGaN current blocking layer 53a.

  At this time, the n-AlGaN current blocking layer 53a is wet etched by the wet etching mechanism of the n-type semiconductor layer described in the fifth embodiment. Specifically, it is shown below.

  The n-AlGaN current blocking layer 53a originally has no holes. However, by irradiating the surface of the nitride semiconductor 151 with the electron emission film with ultraviolet rays 7, hole-electron pairs are generated in the n-AlGaN current blocking layer 53a. At this time, since the electron emission film layer 54b is formed on a part of the surface of the nitride semiconductor 151 with the electron emission film, the generated electrons block the n-AlGaN current through the electron emission film layer 54b. It is discharged from the layer 53a into the etching solution 2. Further, the generated holes exist on the surface of the n-AlGaN current blocking layer 53a, and the n-AlGaN current blocking layer 53a is wet-etched by the reaction between the holes and the etching solution 2. In the configuration of this embodiment, since the lower layer of the n-AlGaN current blocking layer 53a is the p-GaN layer 53b, the portion of the n-AlGaN current blocking layer 53a in which the electron emission film layer 54b is not formed is all. When wet etching is performed, the p-GaN layer 53b is exposed. Here, in general, the band shape in the vicinity of the surface of the semiconductor layer is different between the p-type semiconductor layer and the n-type semiconductor layer, and holes cannot exist on the surface of the p-type semiconductor layer (see Embodiment 4 above). Therefore, in the wet etching of the present embodiment, the wet etching is not performed on the p-GaN layer 53b. That is, the p-GaN layer 53b functions as a wet etching stop layer. Thereby, in the etching method in the present embodiment, the n-AlGaN current blocking layer 53a can be etched by the thickness of the n-AlGaN current blocking layer 53a, and as a result, the semiconductor element is manufactured with high accuracy as designed. be able to.

  Thus, after the wet etching process is completed and the electron emission film layer 54b is removed, another nitride semiconductor layer 17 is crystal-grown on the surface of the nitride semiconductor after etching by MOCVD. Thereby, the nitride semiconductor element 152 shown in FIG. 11C is formed. The nitride semiconductor element 152 can be used as a semiconductor laser element in which a portion of the nitride semiconductor layer 53 that has been wet-etched is used as a waveguide portion.

  In the etching method according to this embodiment, only the n-AlGaN current blocking layer 53a can be selectively wet etched. Therefore, there is no possibility of damaging the active layer located below the n-AlGaN current blocking layer 53a due to overetching, and the thickness of the p-GaN layer 53b below the n-AlGaN current blocking layer 53a is reduced. can do. Therefore, if a semiconductor laser device is manufactured using this etching method, a high-power semiconductor laser device can be manufactured with a high yield.

<< Embodiment 7 of the Invention >>
Hereinafter, the seventh embodiment will be described in detail with reference to FIGS. FIG. 13 is a diagram for explaining an etching process in the present embodiment, and FIG. 14 is a diagram showing a configuration of wet etching in the present embodiment. Further, in FIG. 13, the same reference numerals as those in FIG. In FIG. 14, the same reference numerals as those in FIG.

  In the first to sixth embodiments, the method for manufacturing a nitride semiconductor device when used as a laser device used in a semiconductor laser has been described. In the present embodiment, a method for manufacturing a nitride semiconductor device when used in a heterostructure field-effect transistor (hereinafter simply referred to as “HFET”) that forms a two-dimensional electron gas will be described. . Note that a detailed description of portions overlapping the etching process in the first embodiment is omitted.

First, as shown in FIG. 13A, a GaN-based buffer layer 12 is formed on a base material substrate 11 by MOCVD. Then, a nitride semiconductor layer 63 is formed on the GaN-based buffer layer 12 by sequentially stacking a GaN electron transit layer 63a, an AlGaN electron supply layer 63b, and an AlGaInN cap layer 63c. Thereby, the nitride semiconductor 60 can be formed. Here, the Al composition in the AlGaN electron supply layer 63b is 25%, and the Al composition in the AlGaInN cap layer 63c is smaller than that value. Also, Si in the AlGaN electron supply layer 63b 2 × 10 ¹⁸ cm ^-3 is added as an n-type dopant, Si of 5 × 10 ¹⁸ cm ^-3 is added as an n-type dopant in the AlGaInN cap layer 63c ing. That is, the AlGaN electron supply layer 63b and the AlGaInN cap layer 63c are n-type semiconductors. A two-dimensional electron gas 64 is formed at the interface between the GaN electron transit layer 63a and the AlGaN electron supply layer 63b.

  Next, as shown in FIG. 13B, the dry etching mask layer 14a is formed on both ends of the upper surface of the AlGaInN cap layer 63c of the nitride semiconductor layer 63 of the nitride semiconductor 60 by using vapor deposition and ordinary lithography technology. And a conductive film 14 composed of the electron emission film layer 14b. Thereby, the nitride semiconductor 161 with a conductive film is formed. Note that the conductive film 14 described in the third embodiment may be used as the conductive film 14.

  Subsequently, dry etching is performed on the nitride semiconductor 161 with the conductive film shown in FIG. Thereby, dry etching is performed on the surface portion of the AlGaInN cap layer 63c where the dry etching mask layer 14a is not formed, and the damage layer 15 is formed on the surface of the AlGaInN cap layer 63c.

  Then, using a nitric acid solution, only the dry etching mask layer 14a is removed from the nitride semiconductor after the dry etching to form a nitride semiconductor 162 with an electron emission film shown in FIG. Thereafter, wet etching shown in FIG. 14 is performed on the nitride semiconductor 162 with the electron emission film. Thereby, the damage layer 15 is removed from the nitride semiconductor 163 with the electron emission film, and the nitride semiconductor 163 after the wet etching shown in FIG. 13D is formed.

  Thus, the wet etching process is completed, and after the electron emission film layer 14b is removed from the nitride semiconductor 163 after the wet etching, the source electrode 66 and the drain electrode 67 are formed on the unetched AlGaInN cap layer 63c. Then, a gate electrode 68 is formed on the AlGaN electron supply layer 63b in the recess formed by dry etching. At this time, the source electrode 66 is provided on the left side of FIG. 13D, and the drain electrode 67 is provided on the right side of FIG. 13D. Thereby, the nitride semiconductor device 164 shown in FIG. 13E is manufactured. It can be used as a switching HFET.

  Here, an operation method of the switching HFET in the nitride semiconductor device 164 will be described. At the interface between the GaN electron transit layer 63a and the AlGaN electron supply layer 63b, an energy gap due to the difference between the AlGaN band gap and the GaN band gap and an internal electric field due to the piezoelectric effect due to lattice mismatch exist. As a result, electrons in the AlGaN electron supply layer 63b are localized near the interface between the GaN electron transit layer 63a and the AlGaN electron supply layer 63b, and form a two-dimensional electron gas 64. Since the concentration of the two-dimensional electron gas 64 is determined by the magnitude of the internal electric field existing at the interface between the GaN electron transit layer 63a and the AlGaN electron supply layer 63b, a voltage is applied to the gate electrode 68 to change the internal electric field. Then, the concentration of the two-dimensional electron gas 64 can be controlled. When a voltage is applied to the gate electrode 68 to increase its internal electric field, the concentration of the two-dimensional electron gas 64 increases, a current flows between the source electrode 66 and the drain electrode 67, and the switch is turned on. When a reverse electric field is applied to the gate electrode 68, the internal electric field decreases and the concentration of the two-dimensional electron gas 64 decreases. Therefore, it becomes difficult for current to flow, and the switch is turned off. As described above, by controlling the voltage applied to the gate electrode 68, the current flowing through the source electrode 66 and the drain electrode 67 can be controlled. As a result, the nitride semiconductor element 164 can be used as a switching HFET. Note that the source electrode 66 and the drain electrode 67 are not limited to the form shown in FIG. 13E, and the source electrode 66 may be provided on the right side and the drain electrode 57 may be provided on the left side on the paper surface.

  Finally, the effects exhibited by the method for manufacturing the nitride semiconductor device 164 in the present embodiment will be described. When dry etching is performed on the nitride semiconductor, a damage layer 15 is formed on the surface of the nitride semiconductor. Until now, no method for removing the damaged layer 15 has been proposed. If the gate electrode 68 or the like is provided in the dry-etched portion, the damaged layer 15 is formed and a leakage current is generated. . As a result, the performance of the transistor manufactured by the conventional method was poor. However, in this embodiment, since the damaged layer 15 is removed by performing wet etching after performing dry etching using the conductive film 14 as a mask, the gate electrode is formed on the surface of the nitride semiconductor layer 63 subjected to dry etching. Even if 68 is provided, the leakage current can be suppressed because the damaged layer 15 is removed. As a result, a transistor with good performance can be manufactured. Furthermore, in this embodiment, since the voltage applied to the gate electrode 68 provided in the nitride semiconductor element 164 can be changed, the electron concentration in the two-dimensional electron gas 64 can be changed. It can be used as an HFET for switching. The effect obtained in the first embodiment, that is, the wet etching configuration can be simplified and the surface roughness of the nitride semiconductor element after manufacture can be reduced to 1 nm or less is the present embodiment. It can also be obtained by the manufacturing method in

<< Other Embodiments >>
Any known dry etching can be applied to the dry etching described in the first to seventh embodiments.

  In the first to sixth embodiments, a semiconductor laser using a nitride semiconductor multilayer film including an InGaN active layer is described. In the seventh embodiment, an HFET having a heterostructure that forms a two-dimensional electron gas is described. The method of manufacturing the nitride semiconductor device is not limited to these processes, but other nitride semiconductor devices such as light emitting devices such as LEDs (Light Emitting Diodes) and HBTs (Heterojunction Bipolar Transistors). Needless to say, the present invention can also be applied to electronic devices.

  The wet etching method in the sixth and seventh embodiments is not limited to the wet etching described in the first embodiment, and the wet etching described in the fourth embodiment can be performed. In that case, the effect described in the fourth embodiment can be obtained.

  The method for manufacturing a nitride semiconductor device of the present invention is a method for manufacturing a light-emitting device having a current confinement structure or a waveguide structure using a nitride semiconductor, typically a laser diode or LED in the visible or ultraviolet region. Useful. It is also useful as a method for manufacturing a high-speed transistor having a two-dimensional electron gas layer using a nitride semiconductor.

FIG. 4 is an etching process diagram according to the first embodiment. 3 is a configuration diagram of wet etching in Embodiment 1. FIG. FIG. 6 is an etching process diagram according to Embodiment 2. 10 is a configuration diagram of wet etching in Embodiment 2. FIG. FIG. 10 is a process diagram of etching in the third embodiment. 6 is a configuration diagram of wet etching in Embodiment 3. FIG. FIG. 10 is a process diagram of etching in the fourth embodiment. It is a block diagram of the wet etching in Embodiment 4. FIG. 10 is an etching process chart in embodiment 5. 10 is a configuration diagram of wet etching in Embodiment 5. FIG. FIG. 10 is an etching process diagram in embodiment 6. It is a block diagram of the wet etching in Embodiment 6. FIG. 10 is an etching process diagram in embodiment 7. FIG. 10 is a configuration diagram of wet etching in a seventh embodiment. It is a block diagram of the wet etching in a prior art example. It is process drawing of wet etching in a conventional example.

Explanation of symbols

2 Etching solution 3 Ultrasonic generators 13, 23, 33, 43, 53, 63 Nitride semiconductor layers 14, 16 Conductive film 14a Dry etching mask layer 14b Electron emission film layer 15 Damaged layer 17 Another nitride semiconductor layer 104, 114, 123, 134, 144, 152, 164 Nitride semiconductor element

Claims (14)

Forming a nitride compound semiconductor layer on a base material substrate;
Forming a conductive film as an etching mask on a part of the surface of the nitride-based compound semiconductor layer;
Performing dry etching on the nitride-based compound semiconductor layer;
Emitting electrons from the nitride compound semiconductor layer to the outside through the conductive film, and performing wet etching on the nitride compound semiconductor layer;
The manufacturing method of the nitride type compound semiconductor element containing this. Forming a nitride compound semiconductor layer on a base material substrate;
Forming a multi-layered conductive film having a dry etching mask layer as an uppermost layer on a part of the surface of the nitride-based compound semiconductor layer;
Performing dry etching on the nitride-based compound semiconductor layer;
Removing the dry etching mask layer;
Emitting electrons from the nitride compound semiconductor layer to the outside through the conductive film, and performing wet etching on the nitride compound semiconductor layer;
The manufacturing method of the nitride type compound semiconductor element containing this. In the dry etching step, a damage layer is formed on the nitride compound semiconductor layer,
The method for manufacturing a nitride-based compound semiconductor device according to claim 1, wherein at least the damaged layer is removed in the wet etching step.   The method for manufacturing a nitride-based compound semiconductor element according to claim 1, wherein the conductive film includes a layer containing Ni.   5. The nitriding according to claim 1, wherein the nitride-based compound semiconductor layer includes at least one Al-containing layer, and the dry etching is performed on the Al-containing layer. A method for manufacturing a physical compound semiconductor device.   6. The method of manufacturing a nitride-based compound semiconductor device according to claim 1, wherein an external voltage is not applied to the conductive film in the wet etching step. 7. Forming a nitride compound semiconductor layer on a base material substrate;
Forming a conductive film as an electron emission film for emitting electrons to the outside from the nitride compound semiconductor layer on a part of the surface of the nitride compound semiconductor layer;
Electrons are emitted from the nitride compound semiconductor layer to the outside through the conductive film, and wet etching is performed on the nitride compound semiconductor layer without applying an external voltage to the conductive film. A process of performing;
The manufacturing method of the nitride type compound semiconductor element containing this. The nitride compound semiconductor layer is formed of a plurality of layers, the uppermost layer being an n-type nitride compound semiconductor layer and the lower layer being a p-type nitride compound semiconductor layer. And
8. The method of manufacturing a nitride-based compound semiconductor element according to claim 7, wherein, in the wet etching step, the p-type nitride-based compound semiconductor layer is a wet-etching stop layer.   The method for manufacturing a nitride-based compound semiconductor element according to claim 8, wherein the n-type nitride-based compound semiconductor layer is an AlGaN layer.   10. The method of manufacturing a nitride-based compound semiconductor element according to claim 1, wherein the conductive film has a layer containing Ti and either Au or Pt. The nitride compound semiconductor layer is formed of a plurality of layers,
11. The method for manufacturing a nitride-based compound semiconductor element according to claim 1, wherein the plurality of layers are each formed of a plurality of nitride-based semiconductors having different elemental composition ratios. 11. 12. The nitride compound semiconductor device according to claim 1, wherein a solution containing any of KOH, NaOH, H ₃ PO ₄ , H ₂ SO ₄ , and HCl is used in the wet etching. Manufacturing method.   The method for manufacturing a nitride-based compound semiconductor element according to claim 1, wherein, in the wet etching step, ultrasonic waves are applied to the nitride-based compound semiconductor layer.   The method for producing a nitride-based compound semiconductor element according to claim 1, wherein another nitride-based compound semiconductor layer is provided on the nitride-based compound semiconductor layer subjected to the wet etching.

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