JP2005210080A5 - - Google Patents

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Publication number
JP2005210080A5
JP2005210080A5 JP2004344150A JP2004344150A JP2005210080A5 JP 2005210080 A5 JP2005210080 A5 JP 2005210080A5 JP 2004344150 A JP2004344150 A JP 2004344150A JP 2004344150 A JP2004344150 A JP 2004344150A JP 2005210080 A5 JP2005210080 A5 JP 2005210080A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004344150A
Other versions
JP2005210080A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004344150A priority Critical patent/JP2005210080A/ja
Priority claimed from JP2004344150A external-priority patent/JP2005210080A/ja
Priority to US10/583,847 priority patent/US20080271471A1/en
Priority to PCT/JP2004/019406 priority patent/WO2005064659A1/ja
Publication of JP2005210080A publication Critical patent/JP2005210080A/ja
Publication of JP2005210080A5 publication Critical patent/JP2005210080A5/ja
Pending legal-status Critical Current

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JP2004344150A 2003-12-25 2004-11-29 温度調節方法及び温度調節装置 Pending JP2005210080A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004344150A JP2005210080A (ja) 2003-12-25 2004-11-29 温度調節方法及び温度調節装置
US10/583,847 US20080271471A1 (en) 2003-12-25 2004-12-24 Temperature Controlling Method for Substrate Processing System and Substrate Processing System
PCT/JP2004/019406 WO2005064659A1 (ja) 2003-12-25 2004-12-24 基板処理システムのための温度調節方法および基板処理システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003430954 2003-12-25
JP2004344150A JP2005210080A (ja) 2003-12-25 2004-11-29 温度調節方法及び温度調節装置

Publications (2)

Publication Number Publication Date
JP2005210080A JP2005210080A (ja) 2005-08-04
JP2005210080A5 true JP2005210080A5 (ja) 2008-01-17

Family

ID=34742121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004344150A Pending JP2005210080A (ja) 2003-12-25 2004-11-29 温度調節方法及び温度調節装置

Country Status (3)

Country Link
US (1) US20080271471A1 (ja)
JP (1) JP2005210080A (ja)
WO (1) WO2005064659A1 (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564973B2 (ja) * 2007-01-26 2010-10-20 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5032269B2 (ja) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
JP2009168403A (ja) * 2008-01-18 2009-07-30 Nishiyama Corp チラー装置
JP5191806B2 (ja) * 2008-05-30 2013-05-08 株式会社ユリカイ 工場における複数負荷温調装置
WO2010039773A1 (en) * 2008-09-30 2010-04-08 Vette Corp. Free-cooling including modular coolant distribution unit
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
KR101108337B1 (ko) * 2009-12-31 2012-01-25 주식회사 디엠에스 2단의 냉매 유로를 포함하는 정전척의 온도제어장치
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) * 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US20110269314A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Process chambers having shared resources and methods of use thereof
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
JP5750304B2 (ja) * 2011-05-18 2015-07-22 株式会社日立製作所 電子機器の冷却システム
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5942459B2 (ja) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
US9957601B2 (en) * 2013-03-15 2018-05-01 Applied Materials, Inc. Apparatus for gas injection in a physical vapor deposition chamber
CN105247288B (zh) * 2013-05-31 2018-01-30 三菱电机株式会社 热介质变换装置以及具备该热介质变换装置的空调装置
KR101367086B1 (ko) * 2013-10-17 2014-02-24 (주)테키스트 반도체 제조 설비를 위한 온도제어 시스템
JP5841281B1 (ja) * 2015-06-15 2016-01-13 伸和コントロールズ株式会社 プラズマ処理装置用チラー装置
JP5938506B1 (ja) * 2015-09-17 2016-06-22 株式会社日立国際電気 基板処理システム、半導体装置の製造方法、プログラム及び記録媒体
US10662529B2 (en) * 2016-01-05 2020-05-26 Applied Materials, Inc. Cooled gas feed block with baffle and nozzle for HDP-CVD
JP6294365B2 (ja) * 2016-01-29 2018-03-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体
EP3728686A4 (en) * 2017-12-20 2021-09-29 Technetics Group LLC DEPOSIT TREATMENT SYSTEMS WITH ACTIVE TEMPERATURE REGULATION AND ASSOCIATED PROCESSES
KR101940287B1 (ko) * 2018-02-08 2019-01-18 (주)테키스트 반도체 제조용 온도 조절 장치
WO2021002228A1 (ja) * 2019-07-01 2021-01-07 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
JP7277400B2 (ja) 2020-02-19 2023-05-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102339630B1 (ko) * 2021-02-16 2021-12-23 ㈜엑스포 반도체 공정용 칠러
CN115786868A (zh) * 2022-08-30 2023-03-14 新倍司特系统科技(苏州)有限公司 一种均匀涂覆低温涂层的设备及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529261A (ja) * 1991-07-19 1993-02-05 Hitachi Ltd ステージ温調装置
JPH05163096A (ja) * 1991-12-11 1993-06-29 Applied Materials Japan Kk 半導体製造装置における冷凍機を用いた真空装置の電極の低温温度コントロールシステム
FR2716959B1 (fr) * 1994-03-04 1996-05-15 Thermique Generale Vinicole Ensemble de distribution et/ou collection de froid et/ou de chaud.
JP3095377B2 (ja) * 1997-12-24 2000-10-03 イノテック株式会社 チラー装置
US6062485A (en) * 1998-04-22 2000-05-16 Erie Manufacturing Company Radiant heating system reset control
JP2000284832A (ja) * 1999-03-31 2000-10-13 Komatsu Ltd 温度制御装置及び同装置のバルブ制御部

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