JP2005209789A - Method for manufacturing bonding structure of circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for bonding while an adhesive material is prevented from flowing out. <P>SOLUTION: An obstacle is provided among wires so that a bonding resin among the wires is difficult to be flown out or on an extension line, so that no sharp flowing out of an anisotropic conductive adhesive material may occur. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a circuit board bonding structure.

  In recent years, with the downsizing, weight reduction, and thinning of electrical products, electrical circuit devices such as electrical mounting components mounted on electrical products have become more densely integrated and miniaturized along with the speeding up of electrical signals. (Fine pitch) and the number of pins are increasing.

  Along with miniaturization of signal wiring (fine pitch) and increase in the number of pins, electrical connection between circuit boards such as semiconductor integrated circuit devices including a die and a package, a glass substrate and a flexible printed circuit board has also been increased in a fine pitch and multiple pins. . For this reason, it is becoming more and more difficult to obtain connection reliability as well as mounting position accuracy in the bonding of wiring between circuit boards. For this reason, many methods using an anisotropic conductive adhesive, which is a bonding adhesive resin, are used for electrical bonding between circuit boards.

  An anisotropic conductive adhesive paste (ACP: Anisotropic Conductive Paste) in which conductive particles are dispersed in an insulating adhesive and an anisotropic conductive adhesive paste formed into a film shape are used for the anisotropic conductive adhesive. There is an anionic conductive film (ACF).

  For example, as shown in Japanese Patent Application Publication No. 2003-317546, an anisotropic conductive film is sandwiched between an IC chip to be connected and a wiring substrate and thermocompression bonded. Thereby, the IC chip and the wiring board are bonded and fixed by the adhesive, and the terminals of the IC chip and the terminals of the wiring board are electrically connected.

  In the case of the anisotropic conductive adhesive paste, the anisotropic conductive adhesive paste is filled between the substrates and then thermocompression bonded.

  On the other hand, with the miniaturization (fine pitch) of signal wiring, a phenomenon in which a short circuit occurs between electrodes, a so-called migration phenomenon has become a problem. In migration, when a voltage with a different potential difference or polarity is applied between adjacent wirings of a plurality of wirings, the wiring metal is ionized and moved from one wiring to the other adjacent wiring, whereby a conduction path is formed. This is a phenomenon in which the wiring is short-circuited, and the occurrence becomes more remarkable when the width between the wirings is narrow or when the potential difference is large.

  The migration phenomenon occurs even in a circuit board using normal copper or aluminum wiring, but is particularly noticeable when a silver paste is used in a glass substrate for liquid crystal or a glass substrate for PDP (plasma display panel).

  When an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive is used, bubbles (voids) are generated in the anisotropic conductive adhesive portion between both substrate wiring electrodes when pressure bonding. This is thought to be the cause.

  FIG. 18 is a conceptual diagram showing bubbles, in which a plurality of parallel silver wiring electrodes 2 formed on a glass substrate 1 and a copper wiring electrode 5 formed on a flexible printed circuit board are connected by an anisotropic conductive adhesive 8. FIG. Here, the resin joint 18 between the silver wiring electrode 5 formed on the glass substrate 1 and the copper wiring electrode 2 formed on the flexible printed circuit board (not shown) is a position where the anisotropic conductive pressure heating tool comes into contact. In general, an anisotropic conductive film is provided on the wiring of one of the substrates. In the anisotropic conductive film, excess anisotropic conductive adhesive flows out from the resin bonding portion 18 that becomes the bonding portion of the wiring electrode by pressure heating, and a resin protrusion 19 is formed.

  When excess anisotropic conductive adhesive protrudes from the resin bonding portion 18 by pressurization and heating, bubbles 17 are generated in the anisotropic conductive bonding portion of the inter-wiring electrode portion 6 and the lower portion (not shown) of the wiring. When the bubbles 17 are formed in the anisotropic conductive adhesive, the moisture in the bubbles becomes a cause of generation or promotion of migration. Moreover, since the inside of the bubble is a space, it becomes a passage for moisture from the outside. Furthermore, since the bubble portion is not filled with an adhesive, when bubbles are generated, the bonding area is reduced and the bonding strength between the substrates is lowered. Decrease in adhesive strength causes peeling of the substrate, and moisture enters from the peeling interface to induce migration.

  The bubble 17 appears more noticeably as the substrate wiring electrode interval is narrower (wiring with a narrow pitch), and becomes more noticeable as the viscosity of the anisotropic conductive adhesive is lower.

As measures for preventing the generation of bubbles, for example, as described in Japanese Patent Application Laid-Open No. 2001-237265, there is a method of providing a bubble outlet wall so as to surround a location where bubbles are likely to be generated on the lower surface of the wiring side of an electrical component. As described in Japanese Unexamined Patent Publication No. 2000-183485, there has been proposed a method of forming a notch for allowing air bubbles to escape in an end cover layer of a flexible printed circuit board.
JP 2003-317546 A JP 2001-237265 A JP 2000-183485 A

  As a result of intensive studies by the inventor of the present application, it has been found that the generation of bubbles in the adhesive portion is caused by the fact that the adhesive flows out between the wirings during bonding.

  This application makes it a subject to implement | achieve the method which can adhere | attach in the state which suppressed the outflow of the adhesive material. Specifically, the invention according to the present invention is characterized in that the bonding step is performed using an outflow restraint that suppresses the outflow of the adhesive.

  According to the present invention, the outflow of the adhesive can be suppressed.

One of the inventions according to the present application is configured as follows. That is,
A first circuit board having a plurality of first wiring electrodes formed via a gap; and a plurality of second wiring electrodes formed via a gap at a position corresponding to the first wiring electrode. And a second circuit board having a connection structure in which the first wiring electrode and the second wiring electrode corresponding to each other are connected to each other,
Aligning the first wiring and the second wiring;
The first circuit is configured such that the first wiring electrode and the second wiring electrode corresponding to each other are connected in a state where the first wiring electrode and the second wiring electrode are aligned. A bonding step of bonding the substrate and the second circuit board with an adhesive;
The bonding step includes one first wiring electrode, the second wiring electrode corresponding to the one first wiring electrode, and the first wiring electrode adjacent to the one first wiring electrode. It is performed in a state in which an outflow suppression material that suppresses the outflow of the adhesive from the region surrounded by the second wiring electrode that is electrically connected to the first wiring electrode is disposed, and the outflow suppression material is A circuit provided on one of the first circuit board and the second circuit board and having a shape that narrows an outflow path of the adhesive material in a gap between the electrode wirings on the other circuit board. It is a manufacturing method of the joining structure of a board | substrate.

  In particular, in the present invention, it is possible to suitably employ a configuration in which the bonding step is performed in a state where a further spillage suppressor is disposed at a position sandwiching the region together with the spillage suppressor. The outflow suppression substance and / or the further outflow suppression object may be fixedly provided on the one circuit board or may be non-fixed. As the former, a configuration in which a cover that covers the electrode wirings of the circuit board is used as the outflow suppressor can be particularly preferably employed. As an example in which the latter is adopted, for example, a configuration in which the bonding step is performed in a state where the object that is the outflow suppressor is placed on the circuit board without bonding.

The present application also includes an invention having the following configuration. That is,
A first circuit board having a plurality of first wiring electrodes formed through gaps, and a plurality of second circuits formed through the gaps at positions that can correspond to the plurality of first wiring electrodes, respectively. A second circuit board having a plurality of wiring electrodes, wherein the first wiring electrode and the second wiring electrode corresponding to each other are joined so as to be connected,
Aligning the first wiring and the second wiring;
The first circuit is configured such that the first wiring electrode and the second wiring electrode corresponding to each other are connected in a state where the first wiring electrode and the second wiring electrode are aligned. A bonding step of bonding the substrate and the second circuit board with an adhesive;
The bonding step includes one first wiring electrode, the second wiring electrode corresponding to the one first wiring electrode, and the first wiring electrode adjacent to the one first wiring electrode. It is performed in a state where an outflow suppression jig for suppressing outflow of the adhesive material from a region surrounded by a second wiring electrode electrically connected to the first wiring electrode is arranged. This is a method for manufacturing a circuit board bonding structure.

  Here, the flow suppressing jig means a member that is separated from the manufactured bonded structure after the manufacturing of the bonded structure is completed.

  In particular, in the present invention, it is preferable that the outflow suppression jig has a shape that follows an uneven shape of at least one of the plurality of first wiring electrodes or the plurality of second wiring electrodes. Furthermore, it is preferable to have a shape similar to the concavo-convex shape formed by the one plurality of wiring electrodes and a gap between them. The shape following the concavo-convex shape need not be maintained in a state where the jig is separated from the circuit board.

  Hereinafter, examples of the present invention will be described with reference to FIGS.

In addition, in the figure of a present Example, electroconductive particle (filler) is abbreviate | omitted. Furthermore, all the wiring on the circuit board is described only in the vicinity of the wiring junction. For example, when the glass substrate is a liquid crystal substrate, at least one end of the wiring is connected to the liquid crystal device, but that portion is omitted. Moreover, in FIG.1, FIG7 and FIG.16, the polyimide base film layer of the flexible printed circuit board is abbreviate | omitted.
<First embodiment>
In the first embodiment, one circuit board is a glass (rigid) board, the other circuit board is a flexible printed board, and an obstacle is formed on the flexible printed board.

  FIG. 1 is a schematic plan view showing a state in which a glass (rigid) substrate and a two-layer flexible printed circuit board are resin-bonded. In this embodiment, the flexible printed board is described using a flexible printed board having a two-layer structure without an adhesive for bonding the board and the wiring. However, the board and the wiring are bonded using an adhesive. Needless to say, the same applies even when a flexible printed circuit board having a layer structure is used.

  A plurality of parallel silver wiring electrodes 2 formed on the glass substrate 1 and a copper wiring 5 having a positional relationship corresponding to the silver wiring formed on a flexible printed circuit board base film (not shown), Electrical bonding is performed through an anisotropic conductive adhesive 8 that is an adhesive. The exposed joint portion of the wiring electrode formed on the flexible printed circuit board is sandwiched between the cover layer 3 that covers the main body side of the flexible printed circuit board and the cover layer 4 that covers the end side. An anisotropic conductive film 8 made of an anisotropic conductive adhesive is formed. The cover layer 3 that covers the main body side of the flexible printed circuit board made of a resin film (film) is a protective film that protects the wiring. The cover layer 4 that covers the end side of the flexible printed circuit board is a protective film made of a resin film (film) that protects the wiring end, and may be the same resin film (film) as the cover layer 3, Another resin film (membrane) may be used.

  The cover layer 3 that covers the main body side of the flexible printed circuit board and the cover layer 4 that covers the end side of the flexible printed circuit board are bonded to the flexible printed circuit board through an adhesive layer 9.

  For example, a polyimide resin can be used for the cover layer 4 that covers the end side of the flexible printed circuit board of this embodiment. In this case, the cover layer 3 that covers the main body side of the flexible printed circuit board and the cover layer 4 that covers the end side can be formed simultaneously. The optimum thickness of the cover layer is 5 to 20 μm.

  In addition, after aligning a board | substrate, you may fill the paste-form anisotropic conductive adhesive 8 between wiring.

  Whether the anisotropic conductive contact film is formed on the wiring or the anisotropic conductive adhesive is filled, the connection is completed by performing pressure heating thereafter.

  The same applies to the second and third examples. In the first example, CP9731, CP9742, and CP7131 manufactured by Sony Chemical Co., Ltd. were used as the anisotropic conductive film.

  The cover layer 3 that covers the main body side of the flexible printed circuit board and the cover layer 4 that covers the end side are fitted into the inter-wiring electrode portion 6 of the glass substrate 1 in an uneven shape (see FIGS. 4 and 5). This uneven shape becomes an obstacle between the wiring electrodes, and the outflow of the anisotropic conductive adhesive 8 can be controlled. The area shown by hatching in FIG. 5 is surrounded by one wiring electrode 5, the wiring electrode 2 corresponding thereto, the wiring electrode 5 adjacent to the one wiring electrode 5, and the wiring electrode 2 corresponding to the wiring electrode 5. Indicates the area. Of course, there is also a region surrounded by another set of four wiring electrodes (a group constituted by two adjacent wiring electrodes 5 and two corresponding wiring electrodes 2). In the figure, only one such area is illustrated. This region includes a set of the four wiring electrodes, a surface of the circuit board having the wiring electrodes 5 on which the wiring electrodes 5 are not formed, and a surface of the circuit board having the wiring electrodes 2 on which the wiring electrodes 2 are not formed. Surrounded by The cover layer 4, which is an outflow suppressor, suppresses the outflow of the adhesive 8 from this region. Specifically, the cover layer 4 is disposed on the circuit board 7 and has a shape that enters the gap between the wiring electrodes 2 on the circuit board 1, and has a shape that narrows the outflow path of the adhesive in the gap. ing. FIG. 4 shows one gap between the wiring electrodes 2 by hatching. The cover layer 4 that is an outflow restraint enters the gap.

  The concavo-convex shape may be formed by deforming the cover layer before pressurization / heat-compression-bonding or at the initial stage of pressurization-heat-compression-bond, or by using a photolithography method as shown below. You can also.

A photosensitive polyimide resin is coated and pre-baked for the thickness of the obstacle. Then, after exposure light curing using an exposure mask that matches the shape of the obstacle, development is performed.
In the case of a negative type photosensitive polyimide resin, a portion exposed to light is cured to form a convex shaped obstacle, and the concave shape is formed by developing with a reduced exposure amount. The concave shape is controlled by the exposure and development conditions. When the uneven shape is formed in advance, the outflow amount can be controlled within a range in which the effect of the present invention can be obtained by changing the shape and size.

  2 is a schematic cross-sectional view taken along the line AA ′, FIG. 3 is a schematic cross-sectional view taken along the line BB ′, FIG. 4 is a schematic cross-sectional view taken along the line C-C ′, FIG. A schematic sectional view of E ′ is shown in FIG.

  As shown in FIGS. 2, 4, and 6, the cover layer 3 that covers the main body side of the flexible printed board and the cover layer 4 that covers the end side are convex obstacles that reach the substrate surface of the glass substrate 1. Thus, the anisotropic conductive adhesive 8 is prevented from suddenly flowing out in the direction in which the wiring extends. As shown in FIG. 6, the cover layer 3 also has a shape that has a portion that functions as an outflow suppressor, and the hatched region in FIG. 5 is sandwiched with the portion that functions as the outflow suppressor of the cover layer 4. It is arranged.

  3 and 5 are schematic cross-sectional views in which the silver wiring electrode 2 formed on the glass substrate 1 and the copper wiring electrode 5 formed on the flexible printed board are joined. In this cross section, at the portion where the silver wiring electrode 2 and the copper wiring electrode 5 are joined, each of the cover layer 3 covering the main body side of the flexible printed circuit board and the cover layer 4 covering the end side has a plurality of each other. The silver wiring electrode 2 and the copper wiring electrode 5 which are arranged in parallel are straddled, and the convex portions of the wiring which are the outermost circumferences on both sides of the plurality of the copper wiring electrodes 5 which are arranged in parallel with each other are connected.

7, 8, and 9 show that the cover layer (main body side) 3 of the flexible printed circuit board does not fit between the silver wiring electrodes and becomes an obstacle at the end of the silver wiring electrode 2 and the adhesive material 8 flows out. It shows the state that is arranged so that can be suppressed. 7 is a plan view, FIG. 8 is a schematic cross-sectional view taken along line AA ′ of FIG. 7, and FIG. 9 is a schematic cross-sectional view taken along line BB ′ of FIG. The cover layer at this time is not an uneven shape, but covers the end of the silver wiring electrode 2 as a connected end surface.
<Second embodiment>
In the second embodiment, one circuit board is a glass (rigid) board, the other circuit board is a flexible printed board, and an obstacle is formed on the glass (rigid) board.

  FIGS. 10-12 show the structure which formed the obstruction formed on a glass substrate in the both ends of the junction part by the side of the flexible printed circuit board of the silver wiring electrode 2. FIG. The obstacle 10 is provided separately from the cover layer 3 so as to be separated from the cover layer 3 that covers the main body side of the flexible printed circuit board. The obstacle is in a continuous form. FIG. 10 is a schematic plan view showing a state in which a glass (rigid) substrate and a two-layer flexible printed circuit board are resin-bonded. FIG. 11 is a schematic cross-sectional view taken along line AA ′, and FIG. It is a saddle type cross section. The obstacle 10 which is an outflow restraint has a shape that enters the gap between the wiring electrodes 5 provided on the flexible printed board, that is, a shape that can suppress the outflow of the adhesive in the gap.

  Also in this example, a flexible printed board having a two-layer structure was used as in the first example.

  In FIG. 10, the end of the wiring electrode 5 and the resin outflow prevention pattern a (obstacle) 10 are provided apart from each other by the gap 11. The size of the gap 11 is set to the outflow amount of the anisotropic conductive adhesive 8. The generation of voids in the anisotropic conductive adhesive 8 can be prevented by adjusting together.

  In the structure shown in FIG. 10, the silver wiring electrode 2 formed on the glass substrate 1 and the copper wiring electrode 5 formed on the flexible printed circuit board base film 7 are electrically joined via the anisotropic conductive adhesive 8. ing. The joint portion of the wiring electrode is sandwiched between the resin outflow prevention pattern a (obstacle) 10 provided on the glass substrate 7 and the cover layer 4 covering the end portion side of the flexible printed circuit board base film 7. Is filled with an anisotropic conductive adhesive 8.

  The outflow of the anisotropic conductive adhesive 8 is controlled by the resin outflow prevention pattern a (obstacle) 10 provided on the glass substrate and the cover layer 4 covering the end side of the flexible printed circuit board base film 7. .

FIG. 13 shows an example in which the obstacles formed on the glass substrate are not continuous but independent for each pattern. When the substrate is heated under pressure, the excess anisotropic conductive adhesive 8 flows out through the wiring gap. Generation of bubbles can be prevented by providing an obstacle for preventing excess anisotropic conductive adhesive 8 from flowing out at a time when the substrate is pressed.
The obstacle may be at the ends of the silver wiring electrodes or between the silver wiring electrodes.

  A schematic plan view of only the glass substrate 1 is shown in FIGS. FIG. 14 is a schematic plan view of FIG. 10 in which an obstacle is provided so as to extend from one end of the silver electrode wiring 2 by a gap 11 to the wiring end. FIG. 15 is a schematic plan view of only the glass substrate 1 of FIG. 13, in which two resin outflow prevention patterns (inter-wiring obstacles) 13 are provided at both ends of the wiring gap and one end of the wiring gap. This is an example in which a resin outflow prevention pattern b (obstacle on the extension line) 12 is provided on the other end and a resin outflow prevention pattern (obstacle between wires) 13 is provided on the other end.

  The amount of outflow of the anisotropic conductive adhesive 8 is the resin outflow prevention pattern b (extension obstruction) 12 provided on the silver wiring electrode end side or the resin outflow prevention pattern (interwiring failure) provided between the silver wiring electrodes. It can be adjusted by the size and position of the object.

  The obstacle of the second embodiment may be the same material as the silver wiring electrode or may be different. If they are the same, care must be taken not to contact the silver wiring electrodes. In order to be electrically independent, a resin insulating material such as epoxy or polyimide is desirable. The height is the same as “silver wiring + adhesive for flexible printed circuit board” to “silver wiring + adhesive for flexible printed circuit board + base film”, and coating is performed so as to be embedded in the adhesive layer.

  As a method for applying the silver paste at both ends of the electrical joint, a dispenser, a screen printing method, a transfer method, or the like is used.

It is desirable that the obstacle formed on the glass substrate is not completely sealed so that the air bubbles trapped inside are discharged both in the case of between the wirings and on the extension (wiring end). If the above embodiment is used, even if the gap 21 between the outflow prevention pattern (obstacle) and the cover layer fluctuates, the resin and the gap (bubble discharge flow path) 11 are constant, so that the amount of outflow can be controlled more accurately. I was able to do it.
<Example 3>
FIG. 16 shows a state where pressure is applied by using a tool provided with an adhesive resin outflow prevention elastic body 15 as an outflow suppression jig at the end of a pressure heating and pressing tool that is a part of the joining apparatus. Yes. The adhesive resin outflow prevention elastic body 15 is provided so as to intersect the wiring direction on one end side of the wiring, and the cover layer 3 is provided on the other end side as in the first embodiment. For this reason, it becomes an outflow prevention obstacle which prevents that an anisotropic conductive adhesive flows out at a stretch, and generation | occurrence | production of a bubble can be prevented.

  FIG. 17 is a schematic diagram from the right side surface of FIG. 16 (viewed from the direction of the arrow). After aligning the wiring of the flexible printed circuit board with the silver wiring 2 of the glass substrate 1 to which the anisotropic conductive adhesive 8 formed in a film shape is attached, temporary pressing and main pressing are performed with the pressure heating tool 14. . Before the pressure heating tool 14 contacts the flexible printed circuit board base film 7, the adhesive resin outflow prevention elastic body 15 is attached to the end of the flexible printed circuit board so that the anisotropic conductive adhesive 8 does not flow out between the wirings by pressing. It is necessary to pressurize the part. Thereafter, the outflow of the anisotropic conductive adhesive 8 from between the wirings can be controlled by causing the pressurizing / heating tool 14 to contact and pressurize.

  The adhesive resin outflow prevention elastic body 15 is preferably a material having a weak bonding force with other materials, and needs to be peeled off from the anisotropic conductive adhesive 8 after being heated under pressure, and may be a Teflon or Teflon-coated material. preferable.

  Here, the gap 22 becomes smaller as the pressure surface of the silver wiring electrode of the elastic body 15 for preventing the outflow of the adhesive resin matches the wiring shape, and the gap 19 is generated when pressure is applied on a flat surface. The amount of outflow can be adjusted by the uneven shape matched to the silver wiring electrode or the hardness of the elastic body.

  The processing of the concavo-convex shape can be formed by photolithography and etching as in the case of forming the concavo-convex on the cover layer. When the material for the adhesive resin outflow prevention elastic body 15 is a polyimide resin, the unevenness of the adhesive resin outflow prevention elastic body 15 can be formed by using xylene, NMP (N-methyl 2-pyrrolidone), or the like as an etching solution. When the depth of the unevenness is 10 μm, it can be formed by etching for 180 seconds.

  According to this embodiment, it is possible to prevent the bonding resin from flowing out without processing the glass substrate 1. This example also had the same bonding reliability as the first and second examples. In the present embodiment, only the pressurization / heating / crimping tool needs to be changed, so that it can be manufactured at a cost equivalent to the conventional one.

  In the above first to third examples, the curing temperature of the anisotropic conductive adhesive was 170 ° C., and the heating time was 30 seconds. The flexible printed board uses a two-layer flexible type that does not have an adhesive layer for laminating a polyimide base film and a copper foil layer, but may also be a three-layer flexible type having an adhesive layer.

  In this example, the silver wiring electrode pitch of the glass substrate 1 was set at a wiring width of 70 μm, but a preferable application range is 50 μm to 90 μm. The inter-wiring width was 90 μm, but a preferable application range is 70 μm to 110 μm. The silver wiring electrode has a thickness of 10 μm and the flexible printed circuit board has a wiring electrode height of 10 μm. The preferred range of the thickness (height) of the wiring formed on the substrate is 5 μm to 15 μm.

According to the present invention, as a result of resin bonding between the glass substrate and the flexible printed circuit board, the generation of bubbles hardly occurs, the high temperature and high humidity bias test of 85 ° C./85% DC 10V is performed for 1000 hours, and the insulation resistance value between the adjacent wirings thereafter. As a result of measurement, there was no portion where the insulation resistance value was lowered, and the insulation property of 1 × 10 ⁸ Ω or more was maintained as before the test. Moreover, the silver migration part which is short-circuited between wiring also in the junction part was not observed.

  As can be seen from the above results, it is possible to prevent the generation of bubbles by forming an obstacle between the wiring electrodes and suppressing the outflow of the adhesive resin. This prevents moisture from entering between the joint wirings and enables highly reliable resin bonding between circuit boards without causing an electrical short circuit due to silver migration.

  In addition, although the present Example demonstrates by the combination of a glass substrate and a flexible printed circuit board, as a rigid board | substrate, from resin materials, such as an epoxy board | substrate generally used as a circuit board other than a glass substrate. Needless to say, the substrate may be a silicon substrate, a ceramic substrate, or the like, and the combination may be rigid substrates or flexible printed substrates.

FIG. 2 is a schematic plan view showing a first embodiment. The A-A 'schematic sectional view of the schematic plan view showing the first embodiment. B-B 'schematic sectional drawing of the model top view which shows 1st Example. C-C 'schematic sectional drawing of the model top view which shows a 1st Example. D-E 'schematic cross section of a schematic plan view showing a first embodiment. E-E 'schematic sectional drawing of the schematic top view which shows 1st Example. FIG. 2 is a schematic plan view showing a first embodiment. The A-A 'schematic sectional view of the schematic plan view showing the first embodiment. B-B 'schematic sectional drawing of the model top view which shows 1st Example. The schematic plan view which shows the 2nd Example. A-A 'schematic sectional view of a schematic plan view showing a second embodiment. B-B 'schematic sectional drawing of the model top view which shows a 2nd Example. The schematic plan view which shows the 2nd Example. The schematic plan view which shows the 2nd Example. The schematic plan view which shows the 2nd Example. The schematic diagram which shows the state crimped | bonded using the tool by which the elastic body for adhesion resin outflow prevention was provided in the pressurization heating crimping tool edge of the 3rd Example. The schematic diagram which looked at FIG. 16 from the side. The schematic diagram which shows the structure of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Silver wiring electrode 3 Cover layer which covers the main body side of a flexible printed circuit board 4 Cover layer which covers the edge part side of a flexible printed circuit board 5 Copper electrode 6 Between wiring electrodes 7 Flexible printed circuit board base film 8 Anisotropy Conductive adhesive 9 Adhesive layer 10 Resin outflow prevention pattern a (obstacle)
11 Clearance (resin and bubble discharge flow path)
12 Resin spill prevention pattern b (obstacle on extension line)
13 Resin outflow prevention pattern (inter-wiring obstacle)
14 Pressure heating member (tool)
15 Elastic body for preventing outflow of adhesive resin 17 Bubble
18 Resin joint of silver wiring electrode and flexible printed circuit board electrode (Pressure and heating tool contact part)
19 Resin protrusion (Pressure and heating tool non-contact part)
20 Cover layer notch 21 Clearance between the outflow prevention pattern (obstacle) and cover layer 22 Clearance

Claims (4)

A first circuit board having a plurality of first wiring electrodes formed via a gap, and a plurality of second wiring electrodes formed via a gap at a position corresponding to the first wiring electrode. And a second circuit board having a connection structure in which the first wiring electrode and the second wiring electrode corresponding to each other are connected to each other,
Aligning the first wiring and the second wiring;
The first circuit is configured such that the first wiring electrode and the second wiring electrode corresponding to each other are connected in a state where the first wiring electrode and the second wiring electrode are aligned. A bonding step of bonding the substrate and the second circuit board with an adhesive;
The bonding step includes one first wiring electrode, the second wiring electrode corresponding to the one first wiring electrode, and the first wiring electrode adjacent to the one first wiring electrode. It is performed in a state in which an outflow suppression material that suppresses the outflow of the adhesive from the region surrounded by the second wiring electrode that is electrically connected to the first wiring electrode is disposed, and the outflow suppression material is A circuit provided on one of the first circuit board and the second circuit board and having a shape that narrows an outflow path of the adhesive material in a gap between the electrode wirings on the other circuit board. A method for manufacturing a bonding structure of substrates. The manufacturing method of the joining structure of Claim 1 which performs the said adhesion process in the state which has arrange | positioned the further outflow suppression substance in the position which pinches | interposes the said area | region with the said outflow suppression object. A first circuit board having a plurality of first wiring electrodes formed through gaps, and a plurality of second circuits formed through the gaps at positions that can correspond to the plurality of first wiring electrodes, respectively. A method of manufacturing a connection structure in which a second circuit board having a plurality of wiring electrodes is joined so that the first wiring electrode and the second wiring electrode corresponding to each other are connected to each other,
Aligning the first wiring and the second wiring;
The first circuit is configured such that the first wiring electrode and the second wiring electrode corresponding to each other are connected in a state where the first wiring electrode and the second wiring electrode are aligned. A bonding step of bonding the substrate and the second circuit board with an adhesive;
The bonding step includes one first wiring electrode, the second wiring electrode corresponding to the one first wiring electrode, and the first wiring electrode adjacent to the one first wiring electrode. It is performed in a state where an outflow suppression jig for suppressing outflow of the adhesive material from a region surrounded by a second wiring electrode electrically connected to the first wiring electrode is arranged. A method for manufacturing a circuit board bonding structure. 4. The method for manufacturing a joint structure according to claim 3, wherein the outflow suppression jig has a shape that follows an uneven shape of at least one of the plurality of first wiring electrodes or the plurality of second wiring electrodes.

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