JP2005197007A - 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 - Google Patents

金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 Download PDF

Info

Publication number
JP2005197007A
JP2005197007A JP2003435757A JP2003435757A JP2005197007A JP 2005197007 A JP2005197007 A JP 2005197007A JP 2003435757 A JP2003435757 A JP 2003435757A JP 2003435757 A JP2003435757 A JP 2003435757A JP 2005197007 A JP2005197007 A JP 2005197007A
Authority
JP
Japan
Prior art keywords
metal fine
containing resin
fine particle
particle
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003435757A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005197007A5 (enExample
Inventor
Naoko Yamaguchi
直子 山口
Hideo Aoki
秀夫 青木
Tomoaki Takubo
知章 田窪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2003435757A priority Critical patent/JP2005197007A/ja
Priority to TW093137960A priority patent/TW200521171A/zh
Priority to US11/018,473 priority patent/US7939171B2/en
Priority to KR1020040111799A priority patent/KR100612170B1/ko
Priority to CNA2004101034389A priority patent/CN1649471A/zh
Publication of JP2005197007A publication Critical patent/JP2005197007A/ja
Publication of JP2005197007A5 publication Critical patent/JP2005197007A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Developing Agents For Electrophotography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP2003435757A 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 Pending JP2005197007A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003435757A JP2005197007A (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法
TW093137960A TW200521171A (en) 2003-12-26 2004-12-08 Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
US11/018,473 US7939171B2 (en) 2003-12-26 2004-12-22 Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
KR1020040111799A KR100612170B1 (ko) 2003-12-26 2004-12-24 금속 미립자 함유 수지 입자, 금속 미립자 함유 수지층,금속 미립자 함유 수지층의 형성 방법 및 전자 회로 기판
CNA2004101034389A CN1649471A (zh) 2003-12-26 2004-12-27 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003435757A JP2005197007A (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法

Publications (2)

Publication Number Publication Date
JP2005197007A true JP2005197007A (ja) 2005-07-21
JP2005197007A5 JP2005197007A5 (enExample) 2005-09-02

Family

ID=34815725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003435757A Pending JP2005197007A (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法

Country Status (1)

Country Link
JP (1) JP2005197007A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007087979A (ja) * 2005-09-16 2007-04-05 Toshiba Corp 回路基板およびその製造方法
JP2007251006A (ja) * 2006-03-17 2007-09-27 Murata Mfg Co Ltd 回路形成用荷電性粉末およびその製造方法ならびに回路パターンを有するガラス基板の製造方法
CN105573076A (zh) * 2016-03-11 2016-05-11 中物院成都科学技术发展中心 一种用于打印导电图案的粉末的制备方法
JP2018170446A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 回路部品の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007087979A (ja) * 2005-09-16 2007-04-05 Toshiba Corp 回路基板およびその製造方法
JP2007251006A (ja) * 2006-03-17 2007-09-27 Murata Mfg Co Ltd 回路形成用荷電性粉末およびその製造方法ならびに回路パターンを有するガラス基板の製造方法
CN105573076A (zh) * 2016-03-11 2016-05-11 中物院成都科学技术发展中心 一种用于打印导电图案的粉末的制备方法
JP2018170446A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 回路部品の製造方法

Similar Documents

Publication Publication Date Title
US6977130B2 (en) Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
KR100612170B1 (ko) 금속 미립자 함유 수지 입자, 금속 미립자 함유 수지층,금속 미립자 함유 수지층의 형성 방법 및 전자 회로 기판
JP3505993B2 (ja) 回路形成用荷電性粉末及びそれを用いた多層配線基板
KR100578440B1 (ko) 배선 기판, 배선 기판의 제조 장치 및 배선 기판의 제조방법
US7877871B2 (en) Method of manufacturing an electronic circuit formed on a substrate
JP4166686B2 (ja) 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
US8220147B2 (en) Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
JP2005197007A (ja) 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法
CN100421533C (zh) 电子电路的制造方法和电子电路基板
JP2010219242A (ja) 回路パターン形成装置
JP4745025B2 (ja) 電子回路基板の製造方法
JP4363488B2 (ja) 回路形成用荷電性粉末及びそれを用いた多層配線基板
JP4363487B2 (ja) 回路形成用荷電性粉末及びそれを用いた多層配線基板
JP2006222324A (ja) 配線基板の製造方法
JP2005302955A (ja) 画像形成装置
JP2001284770A (ja) 回路パターン形成方法及びそれによって形成された配線基板

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050509

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050509

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070417

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070615

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080415