JP2005194613A - 基板の湿式処理方法及び処理装置 - Google Patents

基板の湿式処理方法及び処理装置 Download PDF

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Publication number
JP2005194613A
JP2005194613A JP2004004819A JP2004004819A JP2005194613A JP 2005194613 A JP2005194613 A JP 2005194613A JP 2004004819 A JP2004004819 A JP 2004004819A JP 2004004819 A JP2004004819 A JP 2004004819A JP 2005194613 A JP2005194613 A JP 2005194613A
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Japan
Prior art keywords
substrate
chemical solution
chemical
wet processing
cleaning
Prior art date
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Pending
Application number
JP2004004819A
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English (en)
Japanese (ja)
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JP2005194613A5 (cg-RX-API-DMAC10.html
Inventor
Akira Fukunaga
明 福永
Akira Owatari
晃 尾渡
Masahiko Sekimoto
雅彦 関本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2004004819A priority Critical patent/JP2005194613A/ja
Priority to US11/029,675 priority patent/US20050208774A1/en
Publication of JP2005194613A publication Critical patent/JP2005194613A/ja
Publication of JP2005194613A5 publication Critical patent/JP2005194613A5/ja
Pending legal-status Critical Current

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  • Chemically Coating (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2004004819A 2004-01-08 2004-01-09 基板の湿式処理方法及び処理装置 Pending JP2005194613A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004004819A JP2005194613A (ja) 2004-01-09 2004-01-09 基板の湿式処理方法及び処理装置
US11/029,675 US20050208774A1 (en) 2004-01-08 2005-01-06 Wet processing method and processing apparatus of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004004819A JP2005194613A (ja) 2004-01-09 2004-01-09 基板の湿式処理方法及び処理装置

Publications (2)

Publication Number Publication Date
JP2005194613A true JP2005194613A (ja) 2005-07-21
JP2005194613A5 JP2005194613A5 (cg-RX-API-DMAC10.html) 2007-02-15

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ID=34819321

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JP2004004819A Pending JP2005194613A (ja) 2004-01-08 2004-01-09 基板の湿式処理方法及び処理装置

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JP (1) JP2005194613A (cg-RX-API-DMAC10.html)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007222754A (ja) * 2006-02-22 2007-09-06 Hoya Corp スピン洗浄装置
JP2007332445A (ja) * 2006-06-16 2007-12-27 Ebara Corp 無電解めっき方法及び無電解めっき装置
JP2008198882A (ja) * 2007-02-15 2008-08-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2009188048A (ja) * 2008-02-04 2009-08-20 Mitsumi Electric Co Ltd 半導体装置の製造方法及びウエットエッチング装置
CN103065996A (zh) * 2012-12-31 2013-04-24 上海新阳半导体材料股份有限公司 晶圆表面处理装置
JP2014212237A (ja) * 2013-04-19 2014-11-13 株式会社荏原製作所 基板処理装置
US9050635B2 (en) 2007-02-15 2015-06-09 SCREEN Holdings Co., Ltd. Substrate processing apparatus
CN111190331A (zh) * 2018-11-14 2020-05-22 三星电子株式会社 基底干燥方法、显影方法、光刻方法和基底干燥系统
CN116344389A (zh) * 2021-12-24 2023-06-27 细美事有限公司 用于处理基板的设备及用于处理基板的方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007222754A (ja) * 2006-02-22 2007-09-06 Hoya Corp スピン洗浄装置
JP2007332445A (ja) * 2006-06-16 2007-12-27 Ebara Corp 無電解めっき方法及び無電解めっき装置
US9050635B2 (en) 2007-02-15 2015-06-09 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP2008198882A (ja) * 2007-02-15 2008-08-28 Dainippon Screen Mfg Co Ltd 基板処理装置
US9050634B2 (en) 2007-02-15 2015-06-09 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP2009188048A (ja) * 2008-02-04 2009-08-20 Mitsumi Electric Co Ltd 半導体装置の製造方法及びウエットエッチング装置
CN103065996A (zh) * 2012-12-31 2013-04-24 上海新阳半导体材料股份有限公司 晶圆表面处理装置
JP2014212237A (ja) * 2013-04-19 2014-11-13 株式会社荏原製作所 基板処理装置
US9630296B2 (en) 2013-04-19 2017-04-25 Ebara Corporation Substrate processing apparatus
CN111190331A (zh) * 2018-11-14 2020-05-22 三星电子株式会社 基底干燥方法、显影方法、光刻方法和基底干燥系统
CN116344389A (zh) * 2021-12-24 2023-06-27 细美事有限公司 用于处理基板的设备及用于处理基板的方法
JP2023095803A (ja) * 2021-12-24 2023-07-06 セメス カンパニー，リミテッド 基板処理装置及び基板処理方法
JP7660548B2 (ja) 2021-12-24 2025-04-11 セメス カンパニー，リミテッド 基板処理装置及び基板処理方法
US12635444B2 (en) 2021-12-24 2026-05-19 Semes Co., Ltd. Apparatus for treating substrate and method for treating substrate
CN116344389B (zh) * 2021-12-24 2026-06-05 细美事有限公司 用于处理基板的设备及用于处理基板的方法

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