JP2005175261A5 - - Google Patents

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Publication number
JP2005175261A5
JP2005175261A5 JP2003414653A JP2003414653A JP2005175261A5 JP 2005175261 A5 JP2005175261 A5 JP 2005175261A5 JP 2003414653 A JP2003414653 A JP 2003414653A JP 2003414653 A JP2003414653 A JP 2003414653A JP 2005175261 A5 JP2005175261 A5 JP 2005175261A5
Authority
JP
Japan
Prior art keywords
electronic component
substrate
underfill
terminals
conductive portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003414653A
Other languages
English (en)
Japanese (ja)
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JP2005175261A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003414653A priority Critical patent/JP2005175261A/ja
Priority claimed from JP2003414653A external-priority patent/JP2005175261A/ja
Publication of JP2005175261A publication Critical patent/JP2005175261A/ja
Publication of JP2005175261A5 publication Critical patent/JP2005175261A5/ja
Pending legal-status Critical Current

Links

JP2003414653A 2003-12-12 2003-12-12 基板の電子部品実装構造および方法 Pending JP2005175261A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003414653A JP2005175261A (ja) 2003-12-12 2003-12-12 基板の電子部品実装構造および方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003414653A JP2005175261A (ja) 2003-12-12 2003-12-12 基板の電子部品実装構造および方法

Publications (2)

Publication Number Publication Date
JP2005175261A JP2005175261A (ja) 2005-06-30
JP2005175261A5 true JP2005175261A5 (https=) 2007-02-01

Family

ID=34734385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003414653A Pending JP2005175261A (ja) 2003-12-12 2003-12-12 基板の電子部品実装構造および方法

Country Status (1)

Country Link
JP (1) JP2005175261A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685601B2 (ja) 2005-11-16 2011-05-18 新光電気工業株式会社 実装基板および半導体装置
JP2007258605A (ja) * 2006-03-24 2007-10-04 Toshiba Corp 部品内蔵プリント配線板、部品内蔵プリント配線板の製造方法および電子機器
JP5549066B2 (ja) * 2008-09-30 2014-07-16 凸版印刷株式会社 リードフレーム型基板とその製造方法、及び半導体装置
CN103180943B (zh) * 2010-11-04 2016-04-13 阿尔卑斯电气株式会社 电子部件模块
JP5954075B2 (ja) * 2012-09-21 2016-07-20 ソニー株式会社 半導体装置及び半導体装置の製造方法
US10672625B2 (en) 2016-04-01 2020-06-02 Intel Corporation Electronic device package with recessed substrate for underfill containment
JP7815630B2 (ja) * 2021-06-29 2026-02-18 Ｔｏｐｐａｎホールディングス株式会社 配線基板

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