JP2005163085A5 - - Google Patents

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Publication number
JP2005163085A5
JP2005163085A5 JP2003402006A JP2003402006A JP2005163085A5 JP 2005163085 A5 JP2005163085 A5 JP 2005163085A5 JP 2003402006 A JP2003402006 A JP 2003402006A JP 2003402006 A JP2003402006 A JP 2003402006A JP 2005163085 A5 JP2005163085 A5 JP 2005163085A5
Authority
JP
Japan
Prior art keywords
substrate
porous body
plated
anode
planar shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003402006A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005163085A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003402006A priority Critical patent/JP2005163085A/ja
Priority claimed from JP2003402006A external-priority patent/JP2005163085A/ja
Priority to US10/932,126 priority patent/US20050051437A1/en
Publication of JP2005163085A publication Critical patent/JP2005163085A/ja
Publication of JP2005163085A5 publication Critical patent/JP2005163085A5/ja
Pending legal-status Critical Current

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JP2003402006A 2003-09-04 2003-12-01 めっき装置及びめっき方法 Pending JP2005163085A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003402006A JP2005163085A (ja) 2003-12-01 2003-12-01 めっき装置及びめっき方法
US10/932,126 US20050051437A1 (en) 2003-09-04 2004-09-02 Plating apparatus and plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402006A JP2005163085A (ja) 2003-12-01 2003-12-01 めっき装置及びめっき方法

Publications (2)

Publication Number Publication Date
JP2005163085A JP2005163085A (ja) 2005-06-23
JP2005163085A5 true JP2005163085A5 (enrdf_load_stackoverflow) 2007-01-18

Family

ID=34725747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003402006A Pending JP2005163085A (ja) 2003-09-04 2003-12-01 めっき装置及びめっき方法

Country Status (1)

Country Link
JP (1) JP2005163085A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
JP5731866B2 (ja) * 2011-03-22 2015-06-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7176468B2 (ja) * 2019-04-26 2022-11-22 トヨタ自動車株式会社 金属皮膜の成膜装置
JP7316908B2 (ja) * 2019-10-30 2023-07-28 株式会社荏原製作所 アノード組立体
CN118969669B (zh) * 2024-07-29 2025-05-13 锐杰微科技(郑州)有限公司 一种用于集成电路芯片封装覆膜的装置及方法

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