JP2005163085A5

JP2005163085A5 -

Info

Publication number: JP2005163085A5
Application number: JP2003402006A
Authority: JP
Filing date: 2003-12-01
Publication date: 2007-01-18

Description

前記多孔質体は、平面円形の形状であることが好ましい。
前記多孔質体は、平面扇状の形状であってもよい。
前記多孔質体は、平面矩形状の形状であってもよい。 Before SL porous body is preferably a flat circular shape.
Before SL porous body may be a flat fan shape.
Before SL porous body may be a flat rectangular shape.

前記多孔質体は、基板に区画形成された一つのダイの平面形状と同じ平面形状を有することが好ましい。これにより、基板に区画形成されたダイ毎に個別にめっきを行って、ダイ毎に面内均一性が良好で膜質の良好なめっき膜を得ることができる。
前記多孔質体は、棒状の形状であってもよい。 Before SL porous body preferably has the same planar shape as the planar shape of one of the dies are defined and formed on the substrate. As a result, plating can be performed individually for each die formed on the substrate, and a plating film with good in-plane uniformity and good film quality can be obtained for each die.
Before SL porous body may be in the form of rod-shaped.

請求項３に記載の発明は、前記アノードは、前記多孔質体の平面形状に対応した平面形状を有することを特徴とする請求項１または２に記載のめっき装置である。これにより、互いに対応する平面形状を有するアノードと多孔質体とを互いに食み出すことなく上下に重ね合わせてめっきを行うことで、多孔質体が対峙する基板上の所定の部位のみにめっきを行うことができる。
請求項４に記載の発明は、前記電極ヘッドは、前記多孔質体の平面形状に対応した形状を有することを特徴とする請求項１乃至３のいずれかに記載のめっき装置である。これにより、アノードと多孔質体とを上下に備えた電極ヘッドの小型コンパクト化を図ることができる。 The invention according to claim 3, wherein the anode is a plating apparatus according to claim 1 or 2, characterized in that it has a planar shape corresponding to the planar shape of the porous body. Accordingly, plating is performed only on a predetermined portion on the substrate facing the porous body by overlapping the anode and the porous body having a planar shape corresponding to each other and performing plating without overlapping each other. It can be carried out.
A fourth aspect of the present invention is the plating apparatus according to any one of the first to third aspects, wherein the electrode head has a shape corresponding to a planar shape of the porous body. As a result, it is possible to reduce the size and size of the electrode head including the anode and the porous body at the top and bottom.

請求項５に記載の発明は、前記電極ヘッドは、複数個備えられていることを特徴とする請求項１乃至４のいずれかに記載のめっき装置である。これにより、基板ステージで基板を保持した状態で、複数の電極ヘッドによる基板の各部位毎の個別のめっきを同時に行うことができる。
前記相対運動は、振動であることが好ましい。多孔質体と基板ステージで保持した基板の表面（被めっき面）が接触と非接触とを繰り返すように振動させることで、多孔質体と基板ステージで保持した基板との相対運動を行わせることができる。 The invention according to claim 5 is the plating apparatus according to any one of claims 1 to 4 , wherein a plurality of the electrode heads are provided. Thereby, individual plating for each part of the substrate by the plurality of electrode heads can be simultaneously performed while the substrate is held on the substrate stage.
Before SL relative motion is preferably vibration. By causing the porous body and the surface of the substrate (surface to be plated) held by the substrate stage to vibrate so as to repeat contact and non-contact, the relative movement between the porous body and the substrate held by the substrate stage is performed. Can do.

前記相対運動は、回転運動であってもよい。多孔質体と基板ステージで保持した基板の少なくとも一方を回転させることで、回転運動による相対運動を行わせることができる。
前記相対運動は、スクロール回転運動であってもよい。多孔質体と基板ステージで保持した基板の少なくとも一方をスクロール回転運動、すなわち自転を伴わない公転運動（並進回転運動）させることで、スクロール回転運動による相対運動を行わせることができる。 Before SL relative movement may be a rotational movement. By rotating at least one of the porous body and the substrate held by the substrate stage, a relative motion by a rotational motion can be performed.
Before SL relative motion may be a scroll rotary motion. By causing at least one of the porous body and the substrate held by the substrate stage to perform a scroll rotation motion, that is, a revolving motion without translation (translation rotation motion), a relative motion by the scroll rotation motion can be performed.

前記相対運動は、自公転運動であってもよい。この自公転運動による相対運動は、多孔質体の中心と基板ステージで保持した基板の中心とを互いに変位させてそれぞれの中心周りに自転させることで行わせることができる。
前記相対運動は、直線運動であってもよい。この直線運動からなる相対運動は、例えば多孔質体と基板ステージで保持した基板の一方を固定して、他方を直線運動させてもよく、双方を互いに逆方向に直線運動させて行ってもよい。 Before SL relative motion may be a self-revolving motion. The relative motion by this self-revolving motion can be performed by displacing the center of the porous body and the center of the substrate held by the substrate stage and rotating around the respective centers.
Before SL relative movement may be a linear movement. The relative motion consisting of this linear motion may be performed, for example, by fixing one of the porous body and the substrate held by the substrate stage and linearly moving the other, or by linearly moving both in opposite directions. .

請求項６に記載の発明は、基板の被めっき面とアノードとの間に該被めっき面の平面形状より小さな平面形状を有する保水性材料からなる多孔質体を介在させ、前記基板と前記アノードとの間にめっき液を満たし、前記多孔質体と前記基板の被めっき面とを互いに接触または近接させ、前記基板と前記アノードとの間に通電してめっきを行うことを特徴とするめっき方法である。
前記アノードは、前記多孔質体の平面形状に対応した平面形状を有することが好ましい。
前記多孔質体の平面形状に対応した形状で、該多孔質体と前記アノードとを上下に備えた電極ヘッドを有することが好ましい。 According to a sixth aspect of the present invention, a porous body made of a water retention material having a planar shape smaller than the planar shape of the surface to be plated is interposed between the surface to be plated of the substrate and the anode, and the substrate and the anode A plating solution, filling the porous body and the surface to be plated of the substrate with each other or bringing them into contact with each other, and energizing between the substrate and the anode to perform plating. It is.
Before SL anode preferably has a planar shape corresponding to the planar shape of the porous body.
In a shape corresponding to the planar shape before Symbol porous body preferably has an electrode head provided with said a porous body anode vertically.

前記電極ヘッドを複数個備え、この複数個の電極ヘッドで基板の被めっき面をめっきすることが好ましい。
前記多孔質体は、基板に区画形成された一つのダイの平面形状と同じ平面形状を有し、基板に区画形成された一つのダイ毎にめっきを行うことが好ましい。
Comprising a plurality of pre-Symbol electrode head, it is preferable to plate the surface to be plated of the substrate in this plurality of electrode head.
Before SL porous body has the same planar shape as the planar shape of one of the dies are defined and formed on the substrate, it is preferable to perform plating one for each die that is defined and formed on the substrate.

Claims

A substrate stage for holding the substrate;
A cathode portion provided with a sealing material that abuts a peripheral portion of the surface to be plated of the substrate held by the substrate stage and seals the peripheral portion in a water-tight manner, and a cathode electrode that contacts and energizes the substrate;
An anode disposed to face the surface to be plated of the substrate;
A porous body made of a water retention material disposed between the anode and the surface to be plated of the substrate and having a planar shape smaller than the surface to be plated of the substrate;
An electrode head provided with the anode and the porous body vertically;
A plating apparatus comprising a drive mechanism for moving the electrode head and the substrate relative to each other.

The plating apparatus according to claim 1, further comprising a pressing mechanism that presses the porous body onto a surface to be plated of the substrate held by the substrate stage with an arbitrary pressure.

The anode, the plating apparatus according to claim 1 or 2, characterized in that it has a planar shape corresponding to the planar shape of the porous body.

The electrode head, the plating apparatus according to any one of claims 1 to 3, characterized in that it has a shape corresponding to the planar shape of the porous body.

The electrode head, the plating apparatus according to any one of claims 1 to 4, characterized in that are provided a plurality.

A porous body made of a water retention material having a planar shape smaller than the planar shape of the surface to be plated is interposed between the surface to be plated of the substrate and the anode;
Fill the plating solution between the substrate and the anode,
Bringing the porous body and the surface to be plated of the substrate into contact or close to each other;
A plating method, wherein plating is performed by energizing between the substrate and the anode.