JP7176468B2 - Metal film deposition equipment - Google Patents

Metal film deposition equipment Download PDF

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JP7176468B2
JP7176468B2 JP2019084847A JP2019084847A JP7176468B2 JP 7176468 B2 JP7176468 B2 JP 7176468B2 JP 2019084847 A JP2019084847 A JP 2019084847A JP 2019084847 A JP2019084847 A JP 2019084847A JP 7176468 B2 JP7176468 B2 JP 7176468B2
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film forming
electrolyte membrane
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JP2020180352A (en
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祐規 佐藤
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Toyota Motor Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

本発明は、基材の表面に金属皮膜を成膜する成膜装置に関する。 The present invention relates to a film forming apparatus for forming a metal film on the surface of a substrate.

従来から、基材の表面に金属を析出させて（金属イオンを還元して）金属皮膜を成膜することがある。例えば、特許文献１には、陽極と、陽極および陰極となる基材の間に配置される電解質膜と、陽極および電解質膜の間に、金属イオンを含む金属溶液を収容する液収容部と、陽極および基材の間に電圧を印加する電源部と、を備えた成膜装置が提案されている。成膜装置は、電解質膜を基材に押圧する押圧装置をさらに備えており、液収容部は、押圧装置の押圧方向に弾性変形自在となる弾性体を介して、押圧装置に取付けられている。 Conventionally, a metal film is formed by depositing a metal on the surface of a substrate (reducing metal ions). For example, in Patent Document 1, an anode, an electrolyte membrane disposed between a base material serving as the anode and the cathode, a liquid storage section for accommodating a metal solution containing metal ions between the anode and the electrolyte membrane, A film forming apparatus has been proposed that includes a power supply that applies a voltage between an anode and a substrate. The film forming apparatus further includes a pressing device that presses the electrolyte membrane against the substrate, and the liquid container is attached to the pressing device via an elastic body that is elastically deformable in the pressing direction of the pressing device. .

この成膜装置では、電解質膜を基材に押圧したときに、弾性体が基材の押圧方向に弾性変形し、弾性変形した弾性体の復元力により、電解質膜で基材の表面を押圧することができる。このとき、基材から電解質膜に作用する反力で、液収容部内の金属溶液の液圧が増圧する。この結果、増圧された金属溶液の液圧により、電解質膜で基材の表面を均一に押圧することができる。この押圧状態で、陽極と基材との間に電圧を印加して、電解質膜の内部に含有された金属イオンを還元することで均一な金属皮膜を基材の表面に成膜することができる。 In this film forming apparatus, when the electrolyte membrane is pressed against the substrate, the elastic body is elastically deformed in the pressing direction of the substrate, and the restoring force of the elastically deformed elastic body presses the surface of the substrate with the electrolyte membrane. be able to. At this time, the reaction force acting on the electrolyte membrane from the substrate increases the liquid pressure of the metal solution in the liquid container. As a result, the surface of the substrate can be uniformly pressed by the electrolyte membrane due to the increased hydraulic pressure of the metal solution. A uniform metal film can be formed on the surface of the substrate by applying a voltage between the anode and the substrate in this pressed state to reduce the metal ions contained inside the electrolyte membrane. .

特開２０１７－８８９１８号公報JP 2017-88918 A

しかしながら、特許文献１に係る成膜装置では、たとえば、複数の電解質膜を用いて、基材の複数の箇所に金属皮膜を同時に成膜する際には、各電解質膜で基材の表面を均一に押圧できないことがある。特に、押圧前において、各電解質膜と基材の表面との距離が異なる場合には、このような現象は顕著なものとなる。この結果、各電解質膜に接触した基材の表面に金属皮膜を均一に成膜できないことがある。 However, in the film forming apparatus according to Patent Document 1, for example, when a plurality of electrolyte membranes are used to simultaneously form a metal film on a plurality of locations on a substrate, the surface of the substrate is uniformly coated with each electrolyte membrane. It may not be possible to press the In particular, when the distance between each electrolyte membrane and the surface of the substrate is different before pressing, such a phenomenon becomes remarkable. As a result, it may not be possible to form a uniform metal film on the surface of the base material in contact with each electrolyte membrane.

本発明は、このような点を鑑みてなされたものであり、各電解質膜を基材の表面に均一に押圧することにより、各電解質膜に押圧された基材の表面に、均一に金属皮膜を成膜することができる金属皮膜の成膜装置を提供することを課題とする。 The present invention has been made in view of these points, and by uniformly pressing each electrolyte membrane against the surface of the substrate, the surface of the substrate pressed against each electrolyte membrane is uniformly coated with a metal film. An object of the present invention is to provide a metal film deposition apparatus capable of depositing a

前記課題を鑑みて、本発明に係る金属皮膜の成膜装置は、金属イオンを還元することで基材の表面に金属皮膜を成膜する成膜装置であって、前記成膜装置は、陽極と、前記陽極と前記基材との間に配置される電解質膜と、前記電解質膜が取付けられ、前記金属イオンを含む金属溶液が前記電解質膜に接触するように、前記金属溶液が密封された状態で収容された液収容部とを有した複数の成膜ユニットと、前記各成膜ユニットを連結する連結部と、前記連結部を介して前記各成膜ユニットの前記電解質膜で前記基材を押圧する押圧部とを有した押圧装置と、前記各成膜ユニットの前記電解質膜が前記基材に接触した状態で、前記電解質膜に含浸された前記金属イオン由来の金属が前記基材の表面に析出するように、前記陽極と前記基材との間に電圧を印加する電源部と、を備えており、前記成膜ユニットは、前記成膜ユニットごとに、前記押圧部の押圧方向に弾性変形する第１弾性体を介して、前記連結部に連結されていることを特徴とする。 In view of the above problems, a metal film forming apparatus according to the present invention is a film forming apparatus for forming a metal film on a surface of a substrate by reducing metal ions, wherein the film forming apparatus comprises an anode and an electrolyte membrane disposed between the anode and the substrate; and the electrolyte membrane is attached, and the metal solution is sealed such that the metal solution containing the metal ions is in contact with the electrolyte membrane. a plurality of film forming units each having a liquid containing portion accommodated in a state; a connection portion connecting each of the film forming units; and the electrolyte membrane of each film forming unit is in contact with the base material, and the metal derived from the metal ion impregnated in the electrolyte membrane is applied to the base material. a power supply section for applying a voltage between the anode and the base material so as to deposit on the surface; It is characterized in that it is connected to the connecting portion via a first elastic body that is elastically deformable.

本発明によれば、基材の表面に金属皮膜を成膜する際には、押圧装置の押圧部で、連結部を介して各成膜ユニットの電解質膜を基材に押圧する。この際、押圧装置の連結部には、成膜ユニットごとに第１弾性体が連結されており、各第１弾性体が圧縮方向に弾性変形する。これにより、１つの連結部に対して、各成膜ユニットの電解質膜を押圧方向に独立して変位させることができる。このような結果、たとえば、押圧前において、各電解質膜と基材の表面との距離が異なる場合であっても、この距離の差分を各第１弾性体の弾性変形により吸収し、各成膜ユニットの電解質膜で、基材の表面を均一に押圧することができる。 According to the present invention, when forming a metal film on the surface of a base material, the pressing part of the pressing device presses the electrolyte membrane of each film forming unit against the base material through the connecting part. At this time, the first elastic body is connected to the connecting portion of the pressing device for each film forming unit, and each first elastic body is elastically deformed in the compression direction. Thereby, the electrolyte membrane of each film-forming unit can be independently displaced with respect to one connection part in a pressing direction. As a result, for example, even if the distance between each electrolyte membrane and the surface of the substrate is different before pressing, the difference in the distance is absorbed by the elastic deformation of each first elastic body, and each film is formed. The electrolyte membrane of the unit can uniformly press the surface of the substrate.

このようして、各成膜ユニットの電解質膜で基材の表面を均一に押圧しながら、電源部で各成膜ユニットの陽極と基材との間に電圧を印加すると、電解質膜に含有させた金属イオンが基材の表面で還元する。これにより、基材の表面に均一な金属皮膜を成膜することができる。 In this manner, while the surface of the base material is uniformly pressed by the electrolyte membrane of each film forming unit, when a voltage is applied between the anode of each film forming unit and the base material by the power supply section, the electrolyte film is made to contain the electrolyte film. The metal ions are reduced on the surface of the substrate. Thereby, a uniform metal film can be formed on the surface of the substrate.

さらに好ましい態様としては、前記電解質膜は、前記押圧方向に対して弾性変形する第２弾性体を介して前記液収容部に取付けられており、前記第１弾性体の前記押圧方向のばね定数は、前記第２弾性体の前記押圧方向のばね定数よりも小さい。 As a further preferred aspect, the electrolyte membrane is attached to the liquid container via a second elastic body that elastically deforms in the pressing direction, and the spring constant of the first elastic body in the pressing direction is , smaller than the spring constant of the second elastic body in the pressing direction.

この態様によれば、第１弾性体の押圧方向のばね定数は、第２弾性体の押圧方向のばね定数よりも小さいので、押圧時に、各成膜ユニットにおいて、第２弾性体よりも第１弾性体をより大きく圧縮変形させることができる。このような結果、たとえば、押圧前において、各電解質膜と基材の表面との距離が異なる場合には、この距離の差分を第１弾性体の弾性変形により吸収することができる。さらに、第２弾性体の弾性変形により、各成膜ユニットの電解質膜を、基材の表面に均一に倣わせることができる。 According to this aspect, the spring constant of the first elastic body in the pressing direction is smaller than the spring constant of the second elastic body in the pressing direction. The elastic body can be compressed and deformed to a greater extent. As a result, for example, when the distance between each electrolyte membrane and the surface of the substrate differs before pressing, the difference in distance can be absorbed by the elastic deformation of the first elastic body. Furthermore, the elastic deformation of the second elastic body allows the electrolyte membrane of each membrane formation unit to uniformly conform to the surface of the substrate.

ここで、押圧部は連結部を介して、各電解質膜で基材の表面を押圧することができるのであれば、押圧部と連結部との取付け状態は、特に限定されるものではない。しかしながら、より好ましくは、前記押圧部の押圧により前記各第１弾性体が弾性変形した際に、前記連結部が枢動するように、前記連結部は、前記押圧部に枢着されている。 Here, the attachment state of the pressing portion and the connecting portion is not particularly limited as long as the pressing portion can press the surface of the substrate with each electrolyte membrane via the connecting portion. However, more preferably, the connecting portion is pivotally attached to the pressing portion so that the connecting portion pivots when each of the first elastic bodies is elastically deformed by pressing of the pressing portion.

この態様によれば、連結部が押圧部に枢着されているので、各電解質膜と、これに対応する基材との距離が異なる場合であっても、この距離の差分に応じて連結部が枢動し、各第１弾性体の圧縮変形量を近づけることができる。これにより、各成膜ユニットの電解質膜で押圧する押圧力をより均一にすることができる。 According to this aspect, since the connecting portion is pivotally attached to the pressing portion, even if the distance between each electrolyte membrane and the corresponding base material is different, the connecting portion can be adjusted according to the difference in distance. pivots, and the amount of compressive deformation of each first elastic body can be brought closer. As a result, the pressure applied by the electrolyte membrane of each film forming unit can be made more uniform.

本発明によれば、各電解質膜を基材の表面に均一に押圧することにより、各電解質膜に押圧された基材の表面に、均一に金属皮膜を成膜することができる。 According to the present invention, by uniformly pressing each electrolyte membrane against the surface of the base material, a metal coating can be uniformly formed on the surface of the base material pressed by each electrolyte membrane.

本発明の第１実施形態に係る金属皮膜の成膜装置の模式的断面図である。1 is a schematic cross-sectional view of a metal film deposition apparatus according to a first embodiment of the present invention; FIG. 図１Ａに示す成膜装置における金属皮膜の成膜状態を説明するための模式的断面図である。1B is a schematic cross-sectional view for explaining a state of forming a metal film in the film forming apparatus shown in FIG. 1A; FIG. 図１Ｂに示す成膜装置における第１および第２成膜ユニットの各電解質膜の押圧力を説明するための図である。FIG. 1C is a diagram for explaining the pressing force of each electrolyte membrane of the first and second film forming units in the film forming apparatus shown in FIG. 1B; 変形例に係る成膜装置における第１および第２成膜ユニットの各電解質膜の押圧力を説明するための図である。FIG. 10 is a diagram for explaining the pressing force of each electrolyte membrane of the first and second film forming units in the film forming apparatus according to the modified example; 比較例に係る成膜装置における第１および第２成膜ユニットの各電解質膜の押圧力を説明するための図である。FIG. 10 is a diagram for explaining the pressing force of each electrolyte membrane of first and second film forming units in a film forming apparatus according to a comparative example; 図２Ｂに示す成膜装置において、第１および第２成膜ユニットが第１および第２基材に非接触の状態を示すモデルである。2C is a model showing a state in which the first and second film forming units are not in contact with the first and second substrates in the film forming apparatus shown in FIG. 2B. 図３Ａの状態から、第１成膜ユニットの電解質膜が第１基材に接触を開始した状態を示すモデルである。FIG. 3B is a model showing a state in which the electrolyte membrane of the first film forming unit starts contacting the first substrate from the state of FIG. 3A. 図３Ｂの状態から、第１成膜ユニットの第１弾性体が圧縮変形し、第２成膜ユニットの電解質膜が第２基材に接触を開始した状態を示すモデルである。3C is a model showing a state in which the first elastic body of the first film forming unit is compressed and deformed from the state of FIG. 3B, and the electrolyte membrane of the second film forming unit starts to come into contact with the second substrate. 図２Ｃに示す成膜装置において、第１および第２成膜ユニットの第１弾性体が圧縮変形し、第１および第２基材に金属皮膜を成膜する状態を示すモデルである。2D is a model showing a state in which the first elastic bodies of the first and second film forming units are compressed and deformed to form metal films on the first and second substrates in the film forming apparatus shown in FIG. 2C. 図３Ｄに示すモデルから、第１および第２成膜ユニットの第１弾性体ばね係数に対する、第１および第２電解質膜の押圧力の圧力差と、第２成膜ユニットの圧縮変形量との関係を算出したグラフである。From the model shown in FIG. 3D, the pressure difference between the pressing force of the first and second electrolyte membranes with respect to the first elastic body spring coefficient of the first and second film forming units, and the amount of compressive deformation of the second film forming unit. It is the graph which calculated relationship.

以下に、まず、図１～図４を参照しながら本発明に係る実施形態について説明する。 Embodiments according to the present invention will be described below with reference to FIGS. 1 to 4. FIG.

１．成膜装置１について
図１は、本発明の第１実施形態に係る金属皮膜の成膜装置１の模式的断面図である。図１に示すように、第１実施形態に係る成膜装置１は、金属イオンを還元することで金属を析出させて、析出した金属からなる金属皮膜Ｆを少なくとも１つの基材（具体的には、本実施形態では第１および第２基材ＳＡ、ＳＢ）の表面に成膜する装置である。 1. About Film Forming Apparatus 1 FIG. 1 is a schematic cross-sectional view of a metal film forming apparatus 1 according to a first embodiment of the present invention. As shown in FIG. 1, the film forming apparatus 1 according to the first embodiment deposits metal by reducing metal ions, and deposits a metal film F made of the deposited metal on at least one substrate (specifically, is an apparatus for forming films on the surfaces of the first and second substrates SA and SB in this embodiment.

金属皮膜が成膜される第１および第２基材ＳＡ、ＳＢは、成膜される表面が陰極（すなわち導電性を有した表面）として機能するものであれば、特に限定されるものではない。具体的には、第１および第２基材ＳＡ、ＳＢは、エポキシ樹脂などの高分子樹脂、セラミックス等の絶縁部に、銅、ニッケル、銀、または鉄などの導体部を陰極として部分的に形成されたものであってもよい。第１および第２基材ＳＡ、ＳＢは、アルミニウム、鉄等の金属材料からなってもよい。本実施形態では、第１および第２基材ＳＡ、ＳＢのそれぞれに表面に、第１および第２成膜ユニット１０Ａ、１０Ｂで金属皮膜ＦＡ、ＦＢを成膜する。 The first and second substrates SA and SB on which the metal film is formed are not particularly limited as long as the surface on which the metal film is formed functions as a cathode (that is, a surface having conductivity). . Specifically, the first and second base materials SA and SB are partially composed of a polymer resin such as epoxy resin, an insulating portion such as ceramics, and a conductor portion such as copper, nickel, silver, or iron as a cathode. It may be formed. The first and second base materials SA, SB may be made of metal materials such as aluminum and iron. In this embodiment, the metal films FA and FB are formed on the surfaces of the first and second base materials SA and SB respectively by the first and second film forming units 10A and 10B.

本実施形態では、以下に示す成膜装置１の効果をより明確に示すため、第１基材ＳＡの厚さが、第２基材ＳＢの厚さに比べて厚い場合を例示している。具体的には、後述する押圧方向において、第１基材ＳＡと第１成膜ユニット１０Ａ（具体的には電解質膜１３Ａ）との距離は、第２基材ＳＢと第２成膜ユニット１０Ｂ（具体的には電解質膜１３Ｂ）との距離よりも短い。なお、第１基材ＳＡと第２基材ＳＢとが同じ厚さであってもよく、第１および第２成膜ユニット１０Ａ、１０Ｂで１つの基材の表面に金属皮膜を成膜してもよい。 In this embodiment, in order to more clearly show the effect of the film forming apparatus 1 described below, the case where the thickness of the first base material SA is thicker than the thickness of the second base material SB is exemplified. Specifically, in the pressing direction described later, the distance between the first substrate SA and the first film forming unit 10A (specifically, the electrolyte membrane 13A) is the same as that between the second substrate SB and the second film forming unit 10B ( Specifically, it is shorter than the distance to the electrolyte membrane 13B). Note that the first base material SA and the second base material SB may have the same thickness, and the first and second film forming units 10A and 10B form a metal film on the surface of one base material. good too.

本実施形態では、成膜装置１は、第１および第２成膜ユニット１０Ａ、１０Ｂを備えている。以下に示す、第１および第２成膜ユニット１０Ａ、１０Ｂの各構成は、第１成膜ユニット１０Ａの各構成を説明し、第２成膜ユニット１０Ｂの対応する各構成は、第１成膜ユニット１０Ａの各構成の符号の後に括弧を付けて、その詳細な説明を省略する。 In this embodiment, the film forming apparatus 1 includes first and second film forming units 10A and 10B. Each configuration of the first and second film forming units 10A and 10B shown below describes each configuration of the first film forming unit 10A, and each corresponding configuration of the second film forming unit 10B is the first film forming unit. Parentheses are added after each component of the unit 10A, and detailed description thereof is omitted.

図１Ａに示すように、各成膜ユニット１０Ａ（１０Ｂ）は、陽極１１Ａ（１１Ｂ）と、電解質膜１３Ａ（１３Ｂ）と、液収容部１５Ａ（１５Ｂ）と、を備えている。 As shown in FIG. 1A, each film forming unit 10A (10B) includes an anode 11A (11B), an electrolyte membrane 13A (13B), and a liquid storage section 15A (15B).

各陽極１１Ａ（１１Ｂ）は、後述する金属溶液ＬＡ（ＬＢ）に対して不溶性を有した陽極（溶解しない陽極）であり、ブロック状または平板状の陽極である。このような陽極１１Ａ（１１Ｂ）としては、金属溶液ＬＡ（ＬＢ）に対して不溶性を有した酸化ルテニウム、白金、酸化イリジウムなどを挙げることができ、これらの金属が銅またはチタンからなる基板に被覆された陽極であってもよい。 Each anode 11A (11B) is an anode that is insoluble (anode that does not dissolve) in a metal solution LA (LB), which will be described later, and is a block-shaped or plate-shaped anode. Examples of the anode 11A (11B) include ruthenium oxide, platinum, iridium oxide, etc., which are insoluble in the metal solution LA (LB). It may be an anode with a

陽極１１Ａ（１１Ｂ）は、金属溶液ＬＡ（ＬＢ）に対して可溶性を有し、かつ、成膜される金属皮膜ＦＡ（ＦＢ）と同じ種類の金属であってもよい。たとえば、金属皮膜ＦＡ（ＦＢ）が銅皮膜である場合には、陽極１１Ａ（１１Ｂ）は銅からなり、金属皮膜ＦＡ（ＦＢ）がニッケル皮膜である場合には、陽極１１Ａ（１１Ｂ）は、ニッケルからなる。なお、第１成膜ユニット１０Ａと第２成膜ユニット１０Ｂとで異なる金属種の金属皮膜ＦＡ、Ｆ２を成膜してもよく、この場合には、第１成膜ユニット１０Ａの陽極１１Ａの材料と、第２成膜ユニット１０Ｂの陽極１１Ｂの材料は、成膜される金属皮膜ＦＡ、ＦＢに応じた異なる金属材料である。 The anode 11A (11B) is soluble in the metal solution LA (LB) and may be the same type of metal as the metal film FA (FB) to be deposited. For example, when the metal film FA (FB) is a copper film, the anode 11A (11B) is made of copper, and when the metal film FA (FB) is a nickel film, the anode 11A (11B) is made of nickel. consists of Note that the metal films FA and F2 of different metal types may be formed by the first film forming unit 10A and the second film forming unit 10B. In this case, the material of the anode 11A of the first film forming unit 10A is And, the material of the anode 11B of the second film forming unit 10B is a different metal material depending on the metal films FA and FB to be formed.

電解質膜１３Ａ（１３Ｂ）は、陽極１１Ａ（１１Ｂ）と、基材ＳＡ（ＳＢ）との間に配置されている。電解質膜１３Ａ（１３Ｂ）は、後述する金属イオンを含む金属溶液ＬＡ（ＬＢ）に接触することで、金属イオンを内部に含浸することができ、電圧を印加したときに基材ＳＡ（ＳＢ）の表面で、金属イオン由来の金属が析出することができるのであれば、特に限定されるものではない。電解質膜１３Ａ（１３Ｂ）の材質としては、たとえばデュポン社製のナフィオン（登録商標）などのフッ素系樹脂、炭化水素系樹脂、ポリアミック酸樹脂、旭硝子社製のセレミオン（ＣＭＶ、ＣＭＤ、ＣＭＦシリーズ）などの陽イオン交換機能を有した樹脂を挙げることができる。 The electrolyte membrane 13A (13B) is arranged between the anode 11A (11B) and the substrate SA (SB). The electrolyte membrane 13A (13B) can be impregnated with metal ions by coming into contact with a metal solution LA (LB) containing metal ions, which will be described later. There is no particular limitation as long as metal derived from metal ions can be deposited on the surface. Examples of materials for the electrolyte membrane 13A (13B) include fluorine-based resins such as Nafion (registered trademark) manufactured by DuPont, hydrocarbon-based resins, polyamic acid resins, Selemion (CMV, CMD, CMF series) manufactured by Asahi Glass Co., Ltd., and the like. A resin having a cation exchange function can be mentioned.

液収容部１５Ａ（１５Ｂ）には、成膜用の金属イオンを含む金属溶液ＬＡ（ＬＢ）が密封された状態で収容されており、金属溶液ＬＡ（ＬＢ）は、電解質膜１３Ａ（１３Ｂ）に接触している。本実施形態では、液収容部１５Ａ（１５Ｂ）には、成膜用の金属イオンを含む金属溶液ＬＡ（ＬＢ）が収容されている。液収容部１５Ａ（１５Ｂ）の材料は、金属溶液ＬＡ（ＬＢ）を収容する耐食性を有した材料であれば特に限定されるものではなく、たとえばステンレス鋼などの金属材料を挙げることができる。 The liquid containing portion 15A (15B) contains a metal solution LA (LB) containing metal ions for film formation in a sealed state. in contact. In this embodiment, the liquid containing portion 15A (15B) contains a metal solution LA (LB) containing metal ions for film formation. The material of the liquid containing portion 15A (15B) is not particularly limited as long as it is a material having corrosion resistance for containing the metal solution LA (LB), and examples thereof include metal materials such as stainless steel.

本実施形態では、液収容部１５Ａ（１５Ｂ）の内部の一方側には、陽極１１Ａ（１１Ｂ）が配置されており、その他方側には、開口部１５ａ（１５ｂ）が形成されている。電解質膜１３Ａ（１３Ｂ）は、開口部１５ａ（１５ｂ）を覆うように、第２弾性体１７Ａ（１７Ｂ）を介して、液収容部１５Ａ（１５Ｂ）に取付けられている。なお、成膜装置１の第１弾性体３０Ａ（３０Ｂ）については、後述する。 In this embodiment, the anode 11A (11B) is arranged on one side inside the liquid containing portion 15A (15B), and the opening 15a (15b) is formed on the other side. The electrolyte membrane 13A (13B) is attached to the liquid reservoir 15A (15B) via the second elastic body 17A (17B) so as to cover the opening 15a (15b). Note that the first elastic body 30A (30B) of the film forming apparatus 1 will be described later.

第２弾性体１７Ａ（１７Ｂ）は、後述する押圧方向に弾性変形（圧縮弾性変形）するものである。本実施形態では、たとえば、第２弾性体１７Ａ（１７Ｂ）は、液収容部１５Ａ（１５Ｂ）と電解質膜１３Ａ（１３Ｂ）との間の隙間を埋める樹脂またはゴム製のシール材であり、金属溶液ＬＡ（ＬＢ）に対して、耐久性を有するものであることが好ましい。第２弾性体１７Ａ（１７Ｂ）は、開口部１５ａ（１５ｂ）の周縁を周回するように配置されている。これにより、液収容部１５Ａ（１５Ｂ）の内部に、金属溶液ＬＡ（ＬＢ）を密封することができ、金属溶液ＬＡ（ＬＢ）を、電解質膜１３Ａ（１３Ｂ）に接触させることができる。 The second elastic body 17A (17B) is elastically deformed (compressive elastically deformed) in a pressing direction, which will be described later. In this embodiment, for example, the second elastic body 17A (17B) is a sealing material made of resin or rubber that fills the gap between the liquid storage portion 15A (15B) and the electrolyte membrane 13A (13B), It is preferable to have durability against LA (LB). The second elastic body 17A (17B) is arranged so as to surround the periphery of the opening 15a (15b). Thereby, the metal solution LA (LB) can be sealed inside the liquid containing portion 15A (15B), and the metal solution LA (LB) can be brought into contact with the electrolyte membrane 13A (13B).

金属溶液ＬＡ（ＬＢ）に含まれる金属イオンの金属としては、銅、ニッケル、銀、または鉄を挙げることができ、金属溶液ＬＡ（ＬＢ）は、これらの金属を、硝酸、リン酸、コハク酸、硫酸、またはピロリン酸などの酸で溶解（イオン化）した水溶液である。たとえば、成膜される金属皮膜ＦＡ（ＦＢ）の金属がニッケルの場合には、金属溶液ＬＡ（ＬＢ）としては、たとえば、硝酸ニッケル、リン酸ニッケル、コハク酸ニッケル、硫酸ニッケル、またはピロリン酸ニッケルなどの水溶液を挙げることができる。各金属溶液ＬＡ、ＬＢに含まれる金属イオンの金属は、成膜される金属皮膜ＦＡ、ＦＢの金属に対応している。したがって、成膜すべき金属皮膜ＦＡ、ＦＢの金属が異なれば、各金属溶液ＬＡ、ＬＢに含まれる金属イオンの金属も異なる。 The metal of the metal ion contained in the metal solution LA (LB) can include copper, nickel, silver, or iron, and the metal solution LA (LB) converts these metals into nitric acid, phosphoric acid, succinic acid It is an aqueous solution dissolved (ionized) with an acid such as , sulfuric acid, or pyrophosphoric acid. For example, when the metal of the metal film FA (FB) to be formed is nickel, the metal solution LA (LB) may be nickel nitrate, nickel phosphate, nickel succinate, nickel sulfate, or nickel pyrophosphate. Aqueous solutions such as The metal of the metal ions contained in each of the metal solutions LA and LB corresponds to the metal of the metal films FA and FB to be formed. Therefore, if the metals of the metal films FA and FB to be formed are different, the metals of the metal ions contained in the respective metal solutions LA and LB are also different.

成膜装置１は、第１基材ＳＡおよび第２基材ＳＢを載置する載置台５０をさらに備えている。載置台５０には、第１基材ＳＡに電気的に導通する導通部５０ａと、第２基材ＳＢに電気的に導通する導通部５０ｂとが、設けられている。 The film forming apparatus 1 further includes a mounting table 50 for mounting the first substrate SA and the second substrate SB. The mounting table 50 is provided with a conducting portion 50a electrically conducting to the first substrate SA and a conducting portion 50b electrically conducting to the second substrate SB.

成膜装置１は、電源部１６Ａ、１６Ｂをさらに備えている。電源部１６Ａ（１６Ｂ）は、電解質膜１３Ａ（１３Ｂ）が第１基材ＳＡ（第２基材ＳＢ）に接触した状態で、第１基材ＳＡ（第２基材ＳＢ）の表面に金属が析出するように、第１成膜ユニット１０Ａ（第２成膜ユニット１０Ｂ）の陽極１１Ａ（１１Ｂ）と第１基材ＳＡ（第２基材ＳＢ）との間に電圧を印加するものである。具体的には、電源部１６Ａ（１６Ｂ）のプラス極は、陽極１１Ａ（１１Ｂ）に接続されており、電源部１６Ａ（１６Ｂ）のマイナス極は、導通部５０ａ（５０ｂ）に接続されている。これにより、陽極１１Ａ（１１Ｂ）と第１基材ＳＡ（第２基材ＳＢ）との間に電圧を印加し、第１基材ＳＡ（第２基材ＳＢ）を陰極として機能させることができる。 The film forming apparatus 1 further includes power supply units 16A and 16B. In the power supply unit 16A (16B), the electrolyte membrane 13A (13B) is in contact with the first base material SA (second base material SB), and the metal is applied to the surface of the first base material SA (second base material SB). A voltage is applied between the anode 11A (11B) of the first film forming unit 10A (second film forming unit 10B) and the first substrate SA (second substrate SB) so as to deposit. Specifically, the positive pole of the power supply section 16A (16B) is connected to the anode 11A (11B), and the negative pole of the power supply section 16A (16B) is connected to the conductive section 50a (50b). Thereby, a voltage can be applied between the anode 11A (11B) and the first base material SA (second base material SB) to cause the first base material SA (second base material SB) to function as a cathode. .

このようにして、各成膜ユニット１０Ａ（１０Ｂ）の電解質膜１３Ａ（１３Ｂ）が第１基材ＳＡ（第２基材ＳＢ）に接触した状態で、電解質膜１３Ａ（１３Ｂ）に含浸された金属イオン由来の金属が第１基材ＳＡ（ＳＢ）の表面に析出する。なお、本実施形態では、成膜装置１は、第１および第２成膜ユニット１０Ａ、１０Ｂに応じて、２つの電源部１６Ａ、１６Ｂを設けたが、たとえば、１つの電源部により、第１および第２成膜ユニット１０Ａ、１０Ｂの陽極１１Ａ、１１Ｂと、第１および第２基材ＳＡ、ＳＢとの間に電圧を印加してもよい。 In this way, the electrolyte membrane 13A (13B) of each film forming unit 10A (10B) is in contact with the first base material SA (second base material SB), and the metal impregnated in the electrolyte membrane 13A (13B) is A metal derived from ions is deposited on the surface of the first base material SA (SB). In this embodiment, the film forming apparatus 1 is provided with the two power supply units 16A and 16B corresponding to the first and second film forming units 10A and 10B. A voltage may be applied between the anodes 11A, 11B of the second film forming units 10A, 10B and the first and second substrates SA, SB.

成膜装置１は、押圧装置２０をさらに備えている。押圧装置２０は、第１および第２成膜ユニット１０Ａ、１０Ｂを連結する連結部２１と、連結部２１を介して第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂで、第１基材ＳＡおよび第２基材ＳＢを押圧する押圧部２４とを有している。 The film forming apparatus 1 further includes a pressing device 20 . The pressing device 20 includes a connecting portion 21 that connects the first and second film forming units 10A and 10B, and electrolyte membranes 13A and 13B of the first and second film forming units 10A and 10B via the connecting portion 21. It has a pressing portion 24 that presses the first base material SA and the second base material SB.

押圧部２４は、押圧部本体２４ａを備えており、押圧部本体２４ａは、連結部２１を第１および第２基材ＳＡ、ＳＢ側に移動させ、電解質膜１３Ａ、１３Ｂで、それぞれ第１基材ＳＡおよび第２基材ＳＢを押圧することができるのであれば、特に限定されるものではない。押圧部本体２４ａとしては、たとえば、シリンダとピストンで構成される油圧式または空圧式のアクチュエータ、モータ等で昇降する電動式のアクチュエータなどを挙げることができる。押圧部２４は、本実施形態では、押圧部本体２４ａの押圧方向の先端に取付けられたユニバーサルジョイント２４ｂと、さらにその先端に取付けられた支持部材２４ｃと、をさらに備えている。 The pressing portion 24 includes a pressing portion main body 24a. The pressing portion main body 24a moves the connecting portion 21 toward the first and second substrates SA and SB, and the electrolyte membranes 13A and 13B each connect the first substrates. It is not particularly limited as long as it can press the material SA and the second base material SB. Examples of the pressing portion main body 24a include a hydraulic or pneumatic actuator composed of a cylinder and a piston, and an electric actuator that moves up and down with a motor or the like. In this embodiment, the pressing portion 24 further includes a universal joint 24b attached to the tip of the pressing portion body 24a in the pressing direction, and a support member 24c attached to the tip.

本実施形態では、連結部２１は押圧部２４に接続されている。第１および第２成膜ユニット１０Ａ、１０Ｂは、成膜ユニット１０Ａ（１０Ｂ）ごとに、第１弾性体３０Ａ（３０Ｂ）を介して、連結部２１に連結されている。第１弾性体３０Ａ（３０Ｂ）は、押圧部２４の押圧方向に対して弾性的に圧縮変形するものである。本実施形態では、第１弾性体３０Ａ（３０Ｂ）は、圧縮変形時に弾性変形することができるものであればよく、たとえばゴム、ばねなどを挙げることができる。本実施形態では、第１弾性体３０Ａ（３０Ｂ）は、ばねであり、第１成膜ユニット１０Ａの第１弾性体３０Ａのばね定数と、第２成膜ユニット１０Ｂの第１弾性体３０Ｂのばね定数は、同じ値である。 In this embodiment, the connecting portion 21 is connected to the pressing portion 24 . The first and second film forming units 10A and 10B are connected to the connecting portion 21 via the first elastic bodies 30A (30B) for each film forming unit 10A (10B). The first elastic body 30</b>A ( 30</b>B) is elastically compressed and deformed in the pressing direction of the pressing portion 24 . In this embodiment, the first elastic body 30A (30B) may be any material as long as it can be elastically deformed at the time of compressive deformation, and examples thereof include rubber and springs. In this embodiment, the first elastic body 30A (30B) is a spring, and the spring constant of the first elastic body 30A of the first film forming unit 10A and the spring of the first elastic body 30B of the second film forming unit 10B A constant is the same value.

本実施形態では、第１弾性体３０Ａ（３０Ｂ）の押圧方向のばね定数は、第２弾性体１７Ａ（１７Ｂ）の押圧方向のばね定数よりも小さい。これにより、第２弾性体１７Ａ（１７Ｂ）よりも第１弾性体３０Ａ（３０Ｂ）をより大きく圧縮変形させることができる。 In this embodiment, the spring constant in the pressing direction of the first elastic body 30A (30B) is smaller than the spring constant in the pressing direction of the second elastic body 17A (17B). As a result, the first elastic body 30A (30B) can be compressed and deformed more than the second elastic body 17A (17B).

このような結果、たとえば、図１Ａ等に示すように、押圧前において、各電解質膜１３Ａ（１３Ｂ）と第１基材ＳＡ（第２基材ＳＢ）の表面との距離が異なる場合には、この距離の差分ｄを第１弾性体３０Ａ、３０Ｂの圧縮変形により吸収することができる。さらに、第２弾性体１７Ａ（１７Ｂ）の圧縮変形により、各成膜ユニット１０Ａ（１０Ｂ）の電解質膜１３Ａ（１３Ｂ）を第１基材ＳＡ（第２基材ＳＢ）の表面に倣わせることができる。なお、第１基材ＳＡ（第２基材ＳＢ）および第２弾性体１７Ａ（１７Ｂ）の圧縮変形は、弾性変形である。 As a result, for example, as shown in FIG. This distance difference d can be absorbed by compressive deformation of the first elastic bodies 30A and 30B. Furthermore, the compressive deformation of the second elastic body 17A (17B) causes the electrolyte membrane 13A (13B) of each film forming unit 10A (10B) to conform to the surface of the first base material SA (second base material SB). can be done. The compressive deformation of the first base material SA (second base material SB) and the second elastic body 17A (17B) is elastic deformation.

さらに、本実施形態では、図１Ｂに示すように、押圧部２４の押圧により第１弾性体３０Ａ、３０Ｂが弾性変形した際に、これらの復元力により連結部２１が枢動するように、連結部２１は、押圧部２４に枢着されている。 Further, in the present embodiment, as shown in FIG. 1B, when the first elastic bodies 30A and 30B are elastically deformed by the pressure of the pressing portion 24, the connecting portion 21 is pivoted by the restoring force of these elastic members. The portion 21 is pivotally attached to the pressing portion 24 .

具体的には、本実施形態では、押圧部２４に対して連結部２１が枢動するように、連結部２１が、枢動の中心となるピン２１ｃを介して、押圧部２４の支持部材２４ｃに枢着されている。第１弾性体３０Ａ、３０Ｂは、ピン２１ｃを挟んだ位置２１ａ、２１ｂに接続されている。本実施形態では、第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂで、第１基材ＳＡおよび第２記載ＳＢを押圧する押圧力が均一になる位置２１ａ、２１ｂ（押圧力がより近い圧力となる位置）に、第１弾性体３０Ａ、３０Ｂが接続されていることが好ましい。なお、本実施形態では、連結部２１の枢動範囲は、位置２１ａ（２１ｂ）において、第１弾性体３０Ａ（３０Ｂ）の最大変形量の範囲に制限されている。 Specifically, in the present embodiment, the connecting portion 21 is connected to the supporting member 24c of the pressing portion 24 via the pin 21c serving as the center of pivotal movement so that the connecting portion 21 pivots with respect to the pressing portion 24. is pivotally attached to The first elastic bodies 30A and 30B are connected to positions 21a and 21b across the pin 21c. In the present embodiment, the positions 21a and 21b (pressing force ) is preferably connected to the first elastic bodies 30A and 30B. In this embodiment, the pivoting range of the connecting portion 21 is limited to the range of the maximum deformation amount of the first elastic body 30A (30B) at the position 21a (21b).

本実施形態では、第１および第２成膜ユニット１０Ａ、１０Ｂは、同じ構造であるため、第１弾性体３０Ａ、３０Ｂが接続される位置２１ａ、２１ｂから、枢動中心となるピン２１ｃまでの距離が等しい。 In this embodiment, since the first and second film forming units 10A and 10B have the same structure, the distance from the positions 21a and 21b where the first elastic bodies 30A and 30B are connected to the pin 21c as the pivot center is Equal distance.

このようにして、図１Ａに示すように、連結部２１が押圧部２４に枢動自在に取付けられているので、電解質膜１３Ａと第１基材ＳＡとの距離と、電解質膜１３Ｂと第２基材ＳＢとの距離とが異なる場合であっても、この距離の差分ｄに応じて、連結部２１が枢動する。これにより、各第１弾性体３０Ａ、３０Ｂの圧縮変形量を近づけることができる。この結果、第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂで押圧する押圧力をより均一にすることができる。 In this way, as shown in FIG. 1A, the connecting portion 21 is pivotally attached to the pressing portion 24, so that the distance between the electrolyte membrane 13A and the first base material SA and the distance between the electrolyte membrane 13B and the second base material SA Even if the distance from the base material SB is different, the connecting portion 21 pivots according to the difference d in this distance. Thereby, the amounts of compression deformation of the first elastic bodies 30A and 30B can be made close to each other. As a result, the pressure applied by the electrolyte membranes 13A and 13B of the first and second film forming units 10A and 10B can be made more uniform.

２．成膜装置１を用いた成膜方法について
以下に本実施形態に係る成膜装置１を用いた成膜方法を、図１Ａ、図１Ｂ、図２Ａ～図２Ｃを参照しながら説明する。 2. Film Forming Method Using Film Forming Apparatus 1 A film forming method using the film forming apparatus 1 according to the present embodiment will be described below with reference to FIGS. 1A, 1B, and 2A to 2C.

まず、図１Ａに示すように、第１成膜ユニット１０Ａの電解質膜１３Ａと第２成膜ユニット１０Ｂの電解質膜１３Ｂのそれぞれに対向するように、載置台５０に第１基材ＳＡおよび第２基材ＳＢを配置する。次に、図１Ｂに示すように、押圧部２４を用いて、連結部２１を載置台５０に向かって下降させる。 First, as shown in FIG. 1A, a first base material SA and a second base material SA are placed on a mounting table 50 so as to face the electrolyte membrane 13A of the first film forming unit 10A and the electrolyte membrane 13B of the second film forming unit 10B, respectively. A base material SB is placed. Next, as shown in FIG. 1B , the connecting portion 21 is lowered toward the mounting table 50 using the pressing portion 24 .

本実施形態では、図１Ａに示す状態では、電解質膜１３Ａと第１基材ＳＡとの距離はＤであり、電解質膜１３Ｂと第２基材ＳＢとの距離に比べて短く、その距離の差分はｄである。したがって、まず、連結部２１を降下させ、連結部２１が押圧方向に距離Ｄだけ変位すると、第１成膜ユニット１０Ａの電解質膜１３Ａが、第１基材ＳＡの表面に接触する。 In the present embodiment, in the state shown in FIG. 1A, the distance between the electrolyte membrane 13A and the first base material SA is D, which is shorter than the distance between the electrolyte membrane 13B and the second base material SB. is d. Therefore, first, when the connecting portion 21 is lowered and displaced by the distance D in the pressing direction, the electrolyte membrane 13A of the first film forming unit 10A comes into contact with the surface of the first base material SA.

さらに、連結部２１を載置台５０に向かってさらに下降させると、第１成膜ユニット１０Ａの第１弾性体３０Ａと第２弾性体１７Ａが押圧方向に弾性変形するとともに、連結部２１がピン２１ｃを中心に枢動する。これにより、図２Ａに示すように第１基材ＳＡの押圧力が増加する。 Further, when the connecting part 21 is further lowered toward the mounting table 50, the first elastic body 30A and the second elastic body 17A of the first film forming unit 10A are elastically deformed in the pressing direction, and the connecting part 21 moves toward the pin 21c. pivot around. This increases the pressing force of the first base material SA as shown in FIG. 2A.

連結部２１を載置台５０に向かってさらに下降させると、第２成膜ユニット１０Ｂの電解質膜１３Ｂが、第２基材ＳＢの表面に接触し、さらなる降下で、第２成膜ユニット１０Ｂの第１弾性体３０Ｂと第２弾性体１７Ｂが弾性変形する。この結果、第１および第２基材ＳＡ、ＳＢの押圧力が増加する。これに加えて、第１弾性体３０Ａ、３０Ｂの圧縮変形量に応じて、連結部２１が枢動する。 When the connecting part 21 is further lowered toward the mounting table 50, the electrolyte membrane 13B of the second film forming unit 10B comes into contact with the surface of the second base material SB, and further lowering causes the second film forming unit 10B to reach the second base material SB. The first elastic body 30B and the second elastic body 17B are elastically deformed. As a result, the pressing forces of the first and second base materials SA, SB are increased. In addition to this, the connecting portion 21 pivots according to the amount of compression deformation of the first elastic bodies 30A and 30B.

このようにして、第１および第２成膜ユニット１０Ａ、１０Ｂの第１弾性体３０Ａ、３０Ｂは、個別に弾性変形（圧縮変形）する。これにより、１つの連結部２１に対して、第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂを、押圧方向に独立して変位させることができる。 In this manner, the first elastic bodies 30A and 30B of the first and second film forming units 10A and 10B are individually elastically deformed (compressively deformed). Thereby, the electrolyte membranes 13A and 13B of the first and second film forming units 10A and 10B can be independently displaced in the pressing direction with respect to one connecting portion 21 .

このような結果、電解質膜１３Ａと第１基材ＳＡとの距離と、電解質膜１３Ｂと第２基材ＳＢとの距離との差分ｄを、各第１弾性体３０Ａ、３０Ｂの弾性変形により吸収することができる。さらに、第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂで、第１および第２基材ＳＡ、ＳＢの表面を均一に押圧することができる。 As a result, the difference d between the distance between the electrolyte membrane 13A and the first base material SA and the distance between the electrolyte membrane 13B and the second base material SB is absorbed by the elastic deformation of the first elastic bodies 30A and 30B. can do. Further, the electrolyte membranes 13A, 13B of the first and second film forming units 10A, 10B can uniformly press the surfaces of the first and second substrates SA, SB.

一方、図２Ｃに示す比較例に係る成膜装置の如く、第１弾性体３０Ａ、３０Ｂを設けない場合には、第１および第２成膜ユニット１０Ａ、１０Ｂは、シール材である第２弾性体１７Ａ、１７Ｂのみの圧縮変形により、その差分ｄが吸収される。したがって、図２Ｃに示すグラフのように、第２基材ＳＢに作用する押圧力が目標圧力に到達した際には、第１基材ＳＡに作用する押圧力は、図２Ａに示す本実施形態のものよりも高くなってしまう。 On the other hand, when the first elastic bodies 30A and 30B are not provided as in the film forming apparatus according to the comparative example shown in FIG. The difference d is absorbed by compressive deformation of only the bodies 17A and 17B. Therefore, as shown in the graph of FIG. 2C, when the pressing force acting on the second base material SB reaches the target pressure, the pressing force acting on the first base material SA is equal to the pressure of this embodiment shown in FIG. 2A. It will be higher than that of

したがって、図１Ａおよび図２Ａに示す成膜装置１とは異なり、図２Ｂに示すように、連結部が押圧部に枢着されていない変形例に係る成膜装置１であっても、成膜装置１に第１弾性体３０Ａ、３０Ｂを備えているので、成膜時において、第１基材ＳＡに作用する押圧力を第２基材ＳＡの目標圧力に近づけることができる。 Therefore, unlike the film forming apparatus 1 shown in FIGS. 1A and 2A, even in the film forming apparatus 1 according to the modification in which the connecting portion is not pivotally attached to the pressing portion as shown in FIG. Since the device 1 is provided with the first elastic bodies 30A and 30B, the pressing force acting on the first base material SA can be brought close to the target pressure of the second base material SA during film formation.

これに加えて、図１Ａおよび図２Ａに示す本実施形態では、連結部２１が押圧部２４に枢着されているので、上述した距離の差分ｄに応じて、連結部２１が枢動することにより、各第１弾性体３０Ａ、３０Ｂの圧縮変形量をより近づけることができる。この結果、第１および第２成膜ユニット１０Ａ、１０Ｂの電解質膜１３Ａ、１３Ｂで押圧する押圧力をより均一にすることができる。 In addition, in the embodiment shown in FIGS. 1A and 2A, the connecting portion 21 is pivotally attached to the pressing portion 24, so that the connecting portion 21 pivots according to the above-described distance difference d. Therefore, the amounts of compressive deformation of the first elastic bodies 30A and 30B can be made closer to each other. As a result, the pressure applied by the electrolyte membranes 13A and 13B of the first and second film forming units 10A and 10B can be made more uniform.

そして、このような押圧状態を維持しながら、第１成膜ユニット１０Ａの電源部１６Ａで陽極１１Ａと第１基材ＳＡとの間に電圧を印加し、第２成膜ユニット１０Ｂの電源部１６Ｂで陽極１１Ｂと第２基材ＳＢとの間に電圧を印加する。電解質膜１３Ａ、１３Ｂは、金属溶液ＬＡ、ＬＢに接触しているので、電解質膜１３Ａ、１３Ｂに金属イオンが含有されており、この含有した金属イオンが、第１および第２基材ＳＡ、ＳＢの表面で、還元される。これにより、第１および第２基材ＳＡ、ＳＢの表面に均一な金属皮膜ＦＡ、ＦＢを成膜することができる。 Then, while maintaining such a pressing state, a voltage is applied between the anode 11A and the first substrate SA by the power source section 16A of the first film forming unit 10A, and the power source section 16B of the second film forming unit 10B is applied. , a voltage is applied between the anode 11B and the second base material SB. Since the electrolyte membranes 13A and 13B are in contact with the metal solutions LA and LB, the electrolyte membranes 13A and 13B contain metal ions. is reduced on the surface of Thereby, uniform metal films FA and FB can be formed on the surfaces of the first and second substrates SA and SB.

以下に、図３Ａ～図３Ｄを参照し、図２Ｂに示す成膜装置１の第１および第２成膜ユニット１０Ａ、１０Ｂの圧縮変形量Δｘｒ１、Δｘｒ２と、液収容部１５Ａ、１５Ｂ内の金属溶液ＬＡ、ＬＢの液圧ｐ１、ｐ２を算出する。 3A to 3D, compressive deformation amounts Δxr1 and Δxr2 of the first and second film forming units 10A and 10B of the film forming apparatus 1 shown in FIG. Hydraulic pressures p1 and p2 of solutions LA and LB are calculated.

ここで、第１成膜ユニット１０Ａの電解質膜１３Ａから第１基材ＳＡまでの距離がＤであり、第２成膜ユニット１０Ｂの電解質膜１３Ｂから第２基材ＳＢまでの距離がＤ＋ｄであるとき、連結部２１の押圧方向の変位ｘを０とする。以下、変位ｘを「押圧方向の変位」という。 Here, the distance from the electrolyte membrane 13A of the first film forming unit 10A to the first substrate SA is D, and the distance from the electrolyte membrane 13B of the second film forming unit 10B to the second substrate SB is D+d. , the displacement x of the connecting portion 21 in the pressing direction is set to zero. Hereinafter, the displacement x will be referred to as "displacement in the pressing direction".

（Ａ）押圧方向の変位ｘ≦距離Ｄのとき
このときには、図３Ａおよび図３Ｂに示すように、成膜装置１の第１および第２成膜ユニット１０Ａ、１０Ｂのいずれも、第１および第２基材ＳＡ、ＳＢを押圧していない。したがって、このときは、成膜装置１には、第１および第２基材ＳＡ、ＳＢからの反力は作用していない。 (A) When the displacement in the pressing direction x≦distance D At this time, as shown in FIGS. 2 The substrates SA and SB are not pressed. Therefore, at this time, the reaction force from the first and second substrates SA and SB is not acting on the film forming apparatus 1 .

（Ｂ）距離Ｄ＜押圧方向の変位ｘ≦距離Ｄ＋ｄのとき
このときには、第１成膜ユニット１０Ａが第１基材ＳＡを押圧し、第２成膜ユニット１０Ｂが第２基材ＳＢに接触しこれを押圧していない状態（図３Ｂから図３Ｃまでの状態）である。第１成膜ユニット１０Ａの第２弾性体１７Ａのばね定数をｋｅ１とし、金属溶液ＬＡのばね定数をｋｗ１としたときに、これらを並列ばねとみなすことができる。これらの合成ばねのばね定数ｋａ１を以下の式（１）のように示すことができる。なお、第２弾性体１７Ａは、その素材の圧縮弾性率から算出した値である。 (B) When distance D<displacement x≦distance D+d in the pressing direction At this time, the first film forming unit 10A presses the first substrate SA, and the second film forming unit 10B contacts the second substrate SB. This is the state in which it is not pressed (the state from FIG. 3B to FIG. 3C). When the spring constant of the second elastic body 17A of the first film forming unit 10A is ke1 and the spring constant of the metal solution LA is kw1, these can be regarded as parallel springs. A spring constant ka1 of these combined springs can be expressed as in the following equation (1). The value of the second elastic body 17A is calculated from the compression elastic modulus of the material.

Figure 0007176468000001
Figure 0007176468000001

さらに、第１弾性体３０Ａと上記合成ばねとは直列ばねとみなすことができる。第１弾性体３０Ａのばね定数をｋｓ１としたときに、第１弾性体３０Ａと上記合成ばねとの合成ばねのばね定数ｋｂ１を以下の式（２）のように示すことができる。 Furthermore, the first elastic body 30A and the composite spring can be regarded as a series spring. When the spring constant of the first elastic body 30A is ks1, the spring constant kb1 of the composite spring of the first elastic body 30A and the composite spring can be expressed by the following equation (2).

Figure 0007176468000002
Figure 0007176468000002

この時、第１成膜ユニット１０Ａの電解質膜１３Ａが第１基材ＳＡに接触した時点からの連結部２１の押圧方向の変位量をｘとすると、押圧部２４による押圧荷重Ｆと、第１基材ＳＡから電解質膜１３Ａに作用する反力Ｒ１と、を以下の式（３）で表すことができる。 At this time, assuming that the amount of displacement of the connecting portion 21 in the pressing direction from the time when the electrolyte membrane 13A of the first film forming unit 10A contacts the first base material SA is x, the pressing load F by the pressing portion 24 and the first A reaction force R1 acting on the electrolyte membrane 13A from the substrate SA can be expressed by the following equation (3).

Figure 0007176468000003
Figure 0007176468000003

以上の結果から、液収容部１５Ａの開口部の面積をＡｒとし、液収容部１５Ａの金属溶液ＬＡの体積をＶｒとし、金属溶液ＬＡの体積弾性係数をＫＷとすると、第１成膜ユニット１０Ａの圧縮変形量Δｘｒ１と、液収容部１５Ａの金属溶液ＬＡの液圧ｐ１とを以下の式（４）および式（５）で表すことができる。 From the above results, if the area of the opening of the liquid containing portion 15A is Ar, the volume of the metal solution LA in the liquid containing portion 15A is Vr, and the bulk elastic modulus of the metal solution LA is KW, then the first film forming unit 10A and the liquid pressure p1 of the metal solution LA in the liquid containing portion 15A can be expressed by the following formulas (4) and (5).

Figure 0007176468000004
Figure 0007176468000004

（Ｃ）押圧方向の変位ｘ＞距離Ｄ＋ｄのとき
このときには、第１成膜ユニット１０Ａが第１基材ＳＡを押圧し、第２成膜ユニット１０Ｂが第２基材ＳＢを押圧している状態（図３Ｄの状態）である。第１基材ＳＡから電解質膜１３Ａに作用する反力Ｒ１と第２基材ＳＢから電解質膜１３Ｂに作用する反力Ｒ２とから、押圧部２４による押圧荷重Ｆを以下の式（６）で表すことができる。 (C) When displacement x>distance D+d in the pressing direction At this time, the first film forming unit 10A presses the first substrate SA, and the second film forming unit 10B presses the second substrate SB. (state of FIG. 3D). The pressing load F by the pressing portion 24 is expressed by the following equation (6) from the reaction force R1 acting on the electrolyte membrane 13A from the first base material SA and the reaction force R2 acting on the electrolyte membrane 13B from the second base material SB. be able to.

Figure 0007176468000005
Figure 0007176468000005

さらに、式（３）に示す右辺の式から、第２成膜ユニット１０Ｂが接触した以降に発生した反力Ｒ１’が加味されるので、第１基材ＳＡから電解質膜１３Ａに作用する反力Ｒ１を、以下の式（７）のように表すことができる。 Furthermore, the reaction force R1′ generated after the contact of the second film forming unit 10B is taken into account from the right-hand side of the expression (3), so the reaction force acting on the electrolyte membrane 13A from the first substrate SA R1 can be expressed as in the following formula (7).

Figure 0007176468000006
Figure 0007176468000006

同様に、第２成膜ユニット１０Ｂの第２弾性体１７Ｂのばね係数をｋｅ２とし、金属溶液ＬＢのばね係数をｋｗ２としたときに、これらを並列ばねとみなすことができる。これらの合成ばねのばね定数ｋａ２を、以下の式（８）のように示すことができる。 Similarly, when the spring coefficient of the second elastic body 17B of the second film forming unit 10B is ke2 and the spring coefficient of the metal solution LB is kw2, these can be regarded as parallel springs. The spring constant ka2 of these combined springs can be expressed as in Equation (8) below.

Figure 0007176468000007
Figure 0007176468000007

さらに、第２成膜ユニット１０Ｂの第１弾性体３０Ｂと上記合成ばねとは直列ばねとみなすことができる。第１弾性体３０Ｂのばね係数をｋｓ２とし、第１弾性体３０Ｂと上記合成ばねとの合成ばねのばね定数ｋｂ２を以下の式（９）のように示すことができる。 Furthermore, the first elastic body 30B of the second film forming unit 10B and the composite spring can be regarded as a series spring. Letting the spring coefficient of the first elastic body 30B be ks2, the spring constant kb2 of the composite spring of the first elastic body 30B and the composite spring can be expressed by the following equation (9).

Figure 0007176468000008
Figure 0007176468000008

これらの式から、第１基材ＳＡから電解質膜１３Ａに作用する反力Ｒ１と、第２基材ＳＢから電解質膜１３Ｂに作用する反力Ｒ２とを、以下の式（１０）および式（１１）のように示すことができる。 From these equations, the reaction force R1 acting on the electrolyte membrane 13A from the first substrate SA and the reaction force R2 acting on the electrolyte membrane 13B from the second substrate SB are expressed by the following equations (10) and (11). ).

Figure 0007176468000009
Figure 0007176468000009

式（１０）および式（１１）で算出したＲ１、Ｒ２と、上述したｋｓ１、ｋａ１、ｋｓ２、ｋａ２から、第１および第２成膜ユニット１０Ａ、１０Ｂの圧縮変形量Δｘｒ１、Δｘｒ２と、液収容部１５Ａ、１５Ｂ内の金属溶液Ｌ１、Ｌ２の液圧ｐ１、ｐ２を以下の式（１２）～式（１５）で表すことができる。なお、式（１２）と式（４）は同じであり、式（１３）と式（５）は同じであるが、これらの式に代入されるＲ１の値が異なる。 Compressive deformation amounts Δxr1 and Δxr2 of the first and second film forming units 10A and 10B and liquid storage Hydraulic pressures p1 and p2 of the metal solutions L1 and L2 in the portions 15A and 15B can be expressed by the following equations (12) to (15). Although formulas (12) and (4) are the same, and formulas (13) and (5) are the same, the value of R1 substituted in these formulas is different.

Figure 0007176468000010
Figure 0007176468000010

ここで、式（１０）～式（１５）を用いて、第１弾性体３０Ａ、３０Ｂのばね係数を変化させ、上述した距離の差分ｄを変化させた際の第１および第２成膜ユニット１０Ａ、１０Ｂの液圧の差圧（圧力差）を算出した。さらに、そのばね定数に応じたばねの変位も算出した。この結果を図４に示す。第１弾性体３０Ａ、３０Ｂの弾性係数に同じ値を用い、第１成膜ユニット１０Ａおよび第２成膜ユニット１０Ｂの第２弾性体１７Ａ、１７Ｂの弾性係数に同じ値を用い、金属溶液ＬＡ、ＬＢの弾性係数に同じ値を用いた。 Here, using equations (10) to (15), the spring coefficients of the first elastic bodies 30A and 30B are changed, and the first and second film forming units when the difference d in the distance described above is changed. A differential pressure (pressure difference) between the hydraulic pressures of 10A and 10B was calculated. Furthermore, the displacement of the spring according to the spring constant was also calculated. The results are shown in FIG. Using the same value for the elastic modulus of the first elastic bodies 30A and 30B, using the same value for the elastic modulus of the second elastic bodies 17A and 17B of the first film forming unit 10A and the second film forming unit 10B, the metal solution LA, The same value was used for the elastic modulus of LB.

図４に示すように、差分ｄが１ｍｍある場合では、第１弾性体のばね定数を１．０×１０４Ｎ／ｍ以下とすることで、圧力差を０．１ＭＰａ（圧力差のバラツキを１０％程度）にすることができることがわかった。しかしながら、ばね定数をさらに小さくすると、ばねの変位が０．１ｍを超えるため、好ましいとは言い難い。以上の結果から、距離の差分ｄが１ｍｍ以下である場合、第１弾性体のばね定数を１．０×１０４Ｎ／ｍ程度にすることが好ましいといえる。 As shown in FIG. 4, when the difference d is 1 mm, by setting the spring constant of the first elastic body to 1.0×10 4 N/m or less, the pressure difference is 0.1 MPa (variation in the pressure difference is about 10%). However, if the spring constant is further reduced, the displacement of the spring exceeds 0.1 m, which is not preferable. From the above results, it can be said that it is preferable to set the spring constant of the first elastic body to about 1.0×10 4 N/m when the distance difference d is 1 mm or less.

以上、本発明の実施の形態を詳述してきたが、具体的な構成はこの実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲における設計変更があっても、それらは本発明に含まれるものである。 Although the embodiment of the present invention has been described in detail above, the specific configuration is not limited to this embodiment. It is included in the invention.

本実施形態では、成膜する基材の数に応じて成膜ユニットを設けた。具体的には、本実施形態では、２つの基材を同時に成膜する際に、成膜ユニットとして、２つの成膜ユニットを、それぞれ第１弾性体を介して連結部に連結した。しかしながら、３つ以上の基材を同時に成膜する際、または、１つの基材に３カ所以上同時に成膜する際に、これらの数に応じた３以上の成膜ユニットを、それぞれ第１弾性体を介して連結部に連結してもよい。 In this embodiment, film forming units are provided according to the number of substrates on which films are to be formed. Specifically, in the present embodiment, when forming films on two substrates at the same time, two film forming units are connected to the connecting portion via the first elastic bodies, respectively, as the film forming units. However, when simultaneously forming films on three or more substrates, or when simultaneously forming films on three or more locations on one substrate, three or more film forming units corresponding to the number of these film forming units are each set to the first elastic You may connect with a connection part through a body.

１：成膜装置、１０Ａ：第１成膜ユニット（成膜ユニット）、１０Ｂ：第２成膜ユニット（成膜ユニット）、１１Ａ，１１Ｂ：陽極、１３Ａ，１３Ｂ：電解質膜、１５Ａ，１５Ｂ：液収容部、１７Ａ，１７Ｂ：第２弾性体、２０：押圧装置、２１：連結部、２４：押圧部、１６Ａ，１６Ｂ：電源部、３０Ａ，３０Ｂ：第１弾性体、ＬＡ，ＬＢ：金属溶液、ＳＡ：第１基材、ＳＢ：第２基材 1: film forming apparatus, 10A: first film forming unit (film forming unit), 10B: second film forming unit (film forming unit), 11A, 11B: anode, 13A, 13B: electrolyte membrane, 15A, 15B: liquid Housing portion 17A, 17B: second elastic body 20: pressing device 21: connecting portion 24: pressing portion 16A, 16B: power supply portion 30A, 30B: first elastic body LA, LB: metal solution, SA: first base material, SB: second base material

Claims (2)

金属イオンを還元することで基材の表面に金属皮膜を成膜する成膜装置であって、
前記成膜装置は、
陽極と、前記陽極と前記基材との間に配置される電解質膜と、前記電解質膜が取付けられ、前記金属イオンを含む金属溶液が前記電解質膜に接触するように、前記金属溶液が密封された状態で収容された液収容部とを有した複数の成膜ユニットと、
前記各成膜ユニットを連結する連結部と、前記連結部を介して前記各成膜ユニットの前記電解質膜で前記基材を押圧する押圧部とを有した押圧装置と、
前記各成膜ユニットの前記電解質膜が前記基材に接触した状態で、前記電解質膜に含浸された前記金属イオン由来の金属が前記基材の表面に析出するように、前記陽極と前記基材との間に電圧を印加する電源部と、を備えており、
前記成膜ユニットは、前記成膜ユニットごとに、前記押圧部の押圧方向に弾性変形する第１弾性体を介して、前記連結部に連結されており、
前記押圧部の押圧により前記各第１弾性体が弾性変形した際に、前記連結部が枢動するように、前記連結部は、前記押圧部に枢着されていることを特徴とする金属皮膜の成膜装置。 A film forming apparatus for forming a metal film on the surface of a substrate by reducing metal ions,
The film forming apparatus is
an anode, an electrolyte membrane disposed between the anode and the substrate, the electrolyte membrane attached and the metal solution sealed such that the metal solution containing the metal ions is in contact with the electrolyte membrane. a plurality of film forming units each having a liquid containing portion accommodated in a folded state;
a pressing device having a connecting portion that connects the film forming units; and a pressing portion that presses the substrate with the electrolyte membrane of each film forming unit via the connecting portion;
The anode and the substrate are arranged such that the metal derived from the metal ion impregnated in the electrolyte membrane is deposited on the surface of the substrate while the electrolyte membrane of each film forming unit is in contact with the substrate. and a power supply that applies a voltage between
The film forming unit is connected to the connecting portion via a first elastic body that elastically deforms in the pressing direction of the pressing portion for each film forming unit ,
The metal film , wherein the connecting portion is pivotally attached to the pressing portion so that the connecting portion pivots when each of the first elastic bodies is elastically deformed by pressing of the pressing portion. deposition equipment. 前記電解質膜は、前記押圧方向に対して弾性変形する第２弾性体を介して前記液収容部に取付けられており、
前記第１弾性体の前記押圧方向のばね定数は、前記第２弾性体の前記押圧方向のばね定数よりも小さいことを特徴とする請求項１に記載の金属皮膜の成膜装置。 The electrolyte membrane is attached to the liquid container via a second elastic body that elastically deforms in the pressing direction,
2. The apparatus for forming a metal film according to claim 1, wherein a spring constant of said first elastic body in said pressing direction is smaller than a spring constant of said second elastic body in said pressing direction.
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