JP2005163085A - めっき装置及びめっき方法 - Google Patents
めっき装置及びめっき方法 Download PDFInfo
- Publication number
- JP2005163085A JP2005163085A JP2003402006A JP2003402006A JP2005163085A JP 2005163085 A JP2005163085 A JP 2005163085A JP 2003402006 A JP2003402006 A JP 2003402006A JP 2003402006 A JP2003402006 A JP 2003402006A JP 2005163085 A JP2005163085 A JP 2005163085A
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- Prior art keywords
- substrate
- plating
- porous body
- plated
- anode
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- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
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- FGHSTPNOXKDLKU-UHFFFAOYSA-N nitric acid;hydrate Chemical compound O.O[N+]([O-])=O FGHSTPNOXKDLKU-UHFFFAOYSA-N 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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Images
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- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003402006A JP2005163085A (ja) | 2003-12-01 | 2003-12-01 | めっき装置及びめっき方法 |
| US10/932,126 US20050051437A1 (en) | 2003-09-04 | 2004-09-02 | Plating apparatus and plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003402006A JP2005163085A (ja) | 2003-12-01 | 2003-12-01 | めっき装置及びめっき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005163085A true JP2005163085A (ja) | 2005-06-23 |
| JP2005163085A5 JP2005163085A5 (enrdf_load_stackoverflow) | 2007-01-18 |
Family
ID=34725747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003402006A Pending JP2005163085A (ja) | 2003-09-04 | 2003-12-01 | めっき装置及びめっき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005163085A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007051362A (ja) * | 2005-07-19 | 2007-03-01 | Ebara Corp | めっき装置及びめっき液の管理方法 |
| TWI549177B (zh) * | 2011-03-22 | 2016-09-11 | 斯克林集團公司 | 基板處理裝置 |
| JP2020180352A (ja) * | 2019-04-26 | 2020-11-05 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| JP2021070844A (ja) * | 2019-10-30 | 2021-05-06 | 株式会社荏原製作所 | アノード組立体 |
| CN118969669A (zh) * | 2024-07-29 | 2024-11-15 | 锐杰微科技(郑州)有限公司 | 一种用于集成电路芯片封装覆膜的装置及方法 |
-
2003
- 2003-12-01 JP JP2003402006A patent/JP2005163085A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007051362A (ja) * | 2005-07-19 | 2007-03-01 | Ebara Corp | めっき装置及びめっき液の管理方法 |
| TWI549177B (zh) * | 2011-03-22 | 2016-09-11 | 斯克林集團公司 | 基板處理裝置 |
| JP2020180352A (ja) * | 2019-04-26 | 2020-11-05 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| US11459667B2 (en) | 2019-04-26 | 2022-10-04 | Toyota Jidosha Kabushiki Kaisha | Film forming apparatus for forming metal film |
| JP7176468B2 (ja) | 2019-04-26 | 2022-11-22 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| JP2021070844A (ja) * | 2019-10-30 | 2021-05-06 | 株式会社荏原製作所 | アノード組立体 |
| JP7316908B2 (ja) | 2019-10-30 | 2023-07-28 | 株式会社荏原製作所 | アノード組立体 |
| CN118969669A (zh) * | 2024-07-29 | 2024-11-15 | 锐杰微科技(郑州)有限公司 | 一种用于集成电路芯片封装覆膜的装置及方法 |
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