JP2005136437A - 半導体製造システム及びクリーンルーム - Google Patents

半導体製造システム及びクリーンルーム Download PDF

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Publication number
JP2005136437A
JP2005136437A JP2005000288A JP2005000288A JP2005136437A JP 2005136437 A JP2005136437 A JP 2005136437A JP 2005000288 A JP2005000288 A JP 2005000288A JP 2005000288 A JP2005000288 A JP 2005000288A JP 2005136437 A JP2005136437 A JP 2005136437A
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Japan
Prior art keywords
cleaning
manufacturing system
semiconductor manufacturing
semiconductor
container
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JP2005000288A
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Japanese (ja)
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JP2005136437A5 (enExample
Inventor
Tadahiro Omi
忠弘 大見
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UCT Corp
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UCT Corp
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Priority to JP2005000288A priority Critical patent/JP2005136437A/ja
Publication of JP2005136437A publication Critical patent/JP2005136437A/ja
Publication of JP2005136437A5 publication Critical patent/JP2005136437A5/ja
Pending legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)
JP2005000288A 2005-01-04 2005-01-04 半導体製造システム及びクリーンルーム Pending JP2005136437A (ja)

Priority Applications (1)

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JP2005000288A JP2005136437A (ja) 2005-01-04 2005-01-04 半導体製造システム及びクリーンルーム

Applications Claiming Priority (1)

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JP2005000288A JP2005136437A (ja) 2005-01-04 2005-01-04 半導体製造システム及びクリーンルーム

Related Parent Applications (1)

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JP22079395A Division JP3923103B2 (ja) 1995-08-29 1995-08-29 半導体製造システム及びクリーンルーム

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JP2005136437A true JP2005136437A (ja) 2005-05-26
JP2005136437A5 JP2005136437A5 (enExample) 2007-01-18

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JP2005000288A Pending JP2005136437A (ja) 2005-01-04 2005-01-04 半導体製造システム及びクリーンルーム

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034534A1 (ja) * 2005-09-20 2007-03-29 Tadahiro Ohmi 半導体装置の製造方法及び半導体製造装置
JP2007187436A (ja) * 2005-12-13 2007-07-26 Hokkaido Univ クリーンユニット、連結クリーンユニット、クリーンユニットの運転方法およびクリーン作業室
JP2009044042A (ja) * 2007-08-10 2009-02-26 Kurita Water Ind Ltd 被処理物の浸漬型処理装置及び被処理物の処理方法
JP2009131841A (ja) * 2007-11-09 2009-06-18 Kurabo Ind Ltd 洗浄方法および洗浄装置
JP2010153424A (ja) * 2008-12-24 2010-07-08 Tohoku Univ 電子装置製造装置
JP2011228406A (ja) * 2010-04-16 2011-11-10 Kurita Water Ind Ltd オゾン水供給システム及びシリコンウエハの湿式酸化処理システム
JP2022185450A (ja) * 2021-06-02 2022-12-14 キヤノン株式会社 処理装置および物品製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034534A1 (ja) * 2005-09-20 2007-03-29 Tadahiro Ohmi 半導体装置の製造方法及び半導体製造装置
US8030182B2 (en) 2005-09-20 2011-10-04 Tadahiro Ohmi Semiconductor device manufacturing method and semiconductor manufacturing apparatus
JP2007187436A (ja) * 2005-12-13 2007-07-26 Hokkaido Univ クリーンユニット、連結クリーンユニット、クリーンユニットの運転方法およびクリーン作業室
JP2009044042A (ja) * 2007-08-10 2009-02-26 Kurita Water Ind Ltd 被処理物の浸漬型処理装置及び被処理物の処理方法
JP2009131841A (ja) * 2007-11-09 2009-06-18 Kurabo Ind Ltd 洗浄方法および洗浄装置
JP2010153424A (ja) * 2008-12-24 2010-07-08 Tohoku Univ 電子装置製造装置
JP2011228406A (ja) * 2010-04-16 2011-11-10 Kurita Water Ind Ltd オゾン水供給システム及びシリコンウエハの湿式酸化処理システム
JP2022185450A (ja) * 2021-06-02 2022-12-14 キヤノン株式会社 処理装置および物品製造方法

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