JP2005136219A - 遊技機用制御基板の自動半田付け装置 - Google Patents
遊技機用制御基板の自動半田付け装置 Download PDFInfo
- Publication number
- JP2005136219A JP2005136219A JP2003371016A JP2003371016A JP2005136219A JP 2005136219 A JP2005136219 A JP 2005136219A JP 2003371016 A JP2003371016 A JP 2003371016A JP 2003371016 A JP2003371016 A JP 2003371016A JP 2005136219 A JP2005136219 A JP 2005136219A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- substrate
- transport
- mounting area
- automatic soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 claims abstract description 166
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000007598 dipping method Methods 0.000 abstract description 34
- 238000012546 transfer Methods 0.000 description 25
- 230000004907 flux Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000007921 spray Substances 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 101700004678 SLIT3 Proteins 0.000 description 1
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Landscapes
- Pinball Game Machines (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003371016A JP2005136219A (ja) | 2003-10-30 | 2003-10-30 | 遊技機用制御基板の自動半田付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003371016A JP2005136219A (ja) | 2003-10-30 | 2003-10-30 | 遊技機用制御基板の自動半田付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005136219A true JP2005136219A (ja) | 2005-05-26 |
| JP2005136219A5 JP2005136219A5 (enExample) | 2006-12-07 |
Family
ID=34647842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003371016A Withdrawn JP2005136219A (ja) | 2003-10-30 | 2003-10-30 | 遊技機用制御基板の自動半田付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005136219A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020017A (ja) * | 2016-08-05 | 2018-02-08 | 株式会社三洋物産 | 遊技機 |
| JP2018121679A (ja) * | 2017-01-30 | 2018-08-09 | 株式会社三洋物産 | 遊技機 |
| JP2021100683A (ja) * | 2018-07-18 | 2021-07-08 | 株式会社三洋物産 | 遊技機 |
-
2003
- 2003-10-30 JP JP2003371016A patent/JP2005136219A/ja not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020017A (ja) * | 2016-08-05 | 2018-02-08 | 株式会社三洋物産 | 遊技機 |
| JP2018121679A (ja) * | 2017-01-30 | 2018-08-09 | 株式会社三洋物産 | 遊技機 |
| JP2021142446A (ja) * | 2017-01-30 | 2021-09-24 | 株式会社三洋物産 | 遊技機 |
| JP2021100683A (ja) * | 2018-07-18 | 2021-07-08 | 株式会社三洋物産 | 遊技機 |
| JP2022189976A (ja) * | 2018-07-18 | 2022-12-22 | 株式会社三洋物産 | 遊技機 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061019 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061019 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080829 |