JP2005136129A - Circuit board including multiple electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board including multiple electronic device which enables centralized and simultaneous manufacture of many good electronic devices with higher efficiency by surely preventing that electronic components are not mounted into a defective circuit board region. <P>SOLUTION: In the circuit board 1 including multiple electronic device, a plurality of circuit board regions 2 having formed mounting portion 2a of the electronic component on the upper surface of the insulated base material 1a are arranged in both vertical and horizontal directions. Each circuit board region 2 is provided with a first mark 5 and a second mark 6 formed surrounding the periphery of the first mark 5. Moreover, a third mark 7 which is different in the color tone from the first and second marks 5, 6 and is larger than the first mark 5 and is smaller than the second mark 6 is formed to cover the first mark 5 on the upper surface of the first mark 5 when the circuit board region 2 is defective. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multi-cavity wiring board in which a large number of wiring board regions, which are wiring boards for mounting electronic components such as semiconductor elements and piezoelectric vibrators, are arrayed vertically and horizontally in a wide-area insulating substrate.

  Conventionally, a wiring board for mounting electronic components such as semiconductor elements and piezoelectric vibrators is, for example, a rectangular flat plate-like insulating base made of ceramics having a mounting portion on which an electronic component is mounted at the center of the upper surface. A plurality of metallized wiring conductors led out from the upper surface to the lower surface are arranged. The electronic component is mounted and fixed on the mounting portion of the insulating base, and each electrode of the electronic component is electrically connected to the metallized wiring conductor via a metal bump or a bonding wire, and then the electronic component is covered on the upper surface. In this manner, the electronic component is hermetically sealed by fixing the sealing resin and the lid, thereby obtaining an electronic device as a product.

  Such a wiring board has become extremely small with a size of about several square mm in accordance with the recent demand for miniaturization of electronic devices. In order to facilitate the handling and increase the manufacturing efficiency of such a miniaturized wiring board, a large number of small wiring boards are separated from a single large-area insulating substrate (mother board). It is manufactured in the form of a so-called multi-cavity wiring board that can be obtained simultaneously.

  As shown in the plan view of FIG. 5 and the cross-sectional view of FIG. 6, the multi-piece wiring board 11 has a large number of wiring board regions 12 each of which is a small-sized wiring board in a large area insulating base 11a. Each of the wiring board regions 12 is formed with a mounting portion 12 a and a metallized wiring conductor 14, each of which is divided by dividing lines 13 and integrally formed vertically and horizontally. The electronic component is mounted and fixed on the mounting portion 12a of each wiring board region 12 so that each electrode thereof is electrically connected to the metallized wiring conductor 14, and each wiring board region 12 is covered so as to cover the electronic component. A sealing resin or lid is fixed to the upper surface of the substrate, and then the insulating substrate 11a is divided along the dividing line 13, whereby a large number of electronic devices are manufactured simultaneously and collectively.

  In such a multi-piece wiring board 11, in order to position and mount electronic components on the mounting portion 12a of each wiring board region 12, an automatic machine equipped with an image recognition device is generally used. An alignment mark 15 made of metallization serving as a reference for aligning the electronic component is provided on the upper surface of each wiring board region 12 at the same time as the metallized wiring conductor 14, and the alignment mark 15 is image-recognized. A method is adopted in which the device recognizes it and automatically mounts it based on the information.

  However, according to such a multi-cavity wiring board 11, due to manufacturing variations, problems, etc., some of the many wiring board regions 12 arranged in the insulating base 11a are required. A defective wiring board region 12D that does not satisfy the performance may be included. If such a defective wiring board region 12D is included, a mark 17 is marked on the upper surface of the defective wiring board region 12D with, for example, oil-based ink, and the mark 17 is recognized by the image recognition device. When an electronic component is mounted on each wiring board area 12 by an automatic machine, the wiring board area 12 marked with this mark 17 is determined to be defective, and the defective wiring board area 12D is programmed not to mount an electronic component. It was done.

  In addition to this, there is also known a method in which a mark 15 is formed on the wiring board region 12 and a mark is formed on the upper surface of the defective wiring board region 12 by removing the mark 15 by laser processing. ing.

Then, after mounting electronic components on the wiring substrate region 12 that is a good product of the insulating substrate 11a, the insulating substrate 11a is cut along the dividing line 13 by a diamond cutter or a laser cutter, and divided into individual wiring substrate regions 12. Thus, an electronic device is formed.
JP 2001-127399 A

  However, according to the conventional multi-cavity wiring board 11, if the amount of ink on the upper surface of the defective wiring board region 12D is too small or too large, these marks 17 can be reliably recognized by the image recognition device. The defective wiring board area 12D is mistaken as the normal wiring board area 12, and an electronic component is mounted on the defective wiring board area 12D by an automatic machine. As a result, a defective electronic device is manufactured. Had a point.

  Therefore, the present invention has been devised in view of such conventional problems, and its purpose is to efficiently mount only non-defective electronic devices by preventing electronic components from being reliably mounted on defective wiring board regions. It is an object of the present invention to provide a multi-piece wiring board that can be manufactured in a collective manner simultaneously.

  A multi-cavity wiring board according to the present invention is a multi-cavity wiring board in which a plurality of wiring board regions in which electronic component mounting portions are formed on an upper surface of an insulating base are arranged vertically and horizontally, and each of the wiring boards described above. The region includes a first mark and a second mark formed so as to surround the periphery of the first mark. When the wiring board region is defective, the region is formed on the upper surface of the first mark. A third mark that is larger than one mark and smaller than the second mark and has a color tone different from the first and second marks is formed to cover the first mark.

  The multi-piece wiring board of the present invention is preferably characterized in that the first to third marks are formed on the mounting portion.

  According to the multi-cavity wiring board of the present invention, each wiring board region includes the first mark and the second mark formed so as to surround the periphery, and the wiring board region is defective. Sometimes, a third mark, which is larger than the first mark and smaller than the second mark and having a color tone different from that of the first mark and the second mark, is formed on the upper surface of the first mark so as to cover the first mark. Therefore, the first mark or the third mark having a different color tone can be recognized on the basis of the second mark, and the determination can be made more reliably without erroneously recognizing the quality of the wiring board region. . That is, in the case of a conventional method of changing the color tone of a mark in a defective wiring board area using only one mark, it is difficult to recognize the position of the mark by changing the color tone of the mark. While the device was easy to mistakenly recognize the metalized wiring conductor as a mark by mistake, the position could be accurately recognized by the second mark, and the first or third mark inside it could be recognized and misrecognized. It can be prevented very effectively.

  Further, when the third mark is formed, the second mark can prevent the third mark 7 from flowing out, and the third mark can be reliably formed in an appropriate size. The third mark can be effectively recognized by the image recognition device. As a result, electronic components can be mounted only on non-defective wiring board regions.

  In addition, since the first to third marks are formed on the mounting portion, the mounting portion serves as both the first mark and the second mark, so that a mark for recognition is separately formed. It is not necessary to secure a space, the wiring board region can be reduced in size, and the bonding property between the electronic component and the insulating base can be improved.

  In addition, since the area recognized by the image recognition apparatus can be increased, the quality of the wiring board area can be accurately recognized.

  The multi-piece wiring board of the present invention will be described below.

  FIG. 1 is a plan view showing an example of an embodiment of a multi-piece wiring board according to the present invention. FIG. 2 is a sectional view. In these figures, 1a is an insulating substrate, 2 is a wiring board region, and 3 is a dividing line. Reference numeral 4 denotes a metallized wiring conductor, which mainly constitutes a multi-piece wiring board 1.

  The insulating substrate 1a of the present invention is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, or a glass-ceramic. In the central part, a large number of wiring board regions 2 each of which is a small wiring board are partitioned by dividing lines 3 indicated by imaginary lines and integrally arranged vertically and horizontally. .

  Each wiring board region 2 arranged and formed on the insulating base 1a has a mounting portion 2a on which an electronic component such as a semiconductor element or a piezoelectric vibrator (not shown) is mounted at the center of the upper surface thereof, and the mounting portion 2a. It has a plurality of metallized wiring conductors 4 made of metal powder metallized such as tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag), etc. led from the upper surface to the lower surface of the insulating substrate 1a. An electronic component is mounted and fixed on the mounting portion 2a, and each electrode of the electronic component is electrically connected to the metallized wiring conductor 4 through electrical connection means such as a solder bump.

  Such an insulating substrate 1a is formed by, for example, appropriately punching a ceramic green sheet that is an aluminum oxide sintered body, and printing and applying a W paste that becomes a metallized wiring conductor 4 in a predetermined pattern by a screen printing method. After that, it is manufactured by firing at a temperature of about 1600 ° C. in a reducing atmosphere. The ceramic green sheet, which is an aluminum oxide sintered body, is made into a slurry by adding and mixing an appropriate organic binder and solvent to the raw material powder of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, etc. It is obtained by forming a sheet by employing a well-known doctor blade method. Further, the W paste or the like that becomes the metallized wiring conductor 4 can be obtained by adding and mixing an appropriate organic binder and solvent to the W powder or the like to adjust the viscosity to an appropriate level.

  The metallized wiring conductor 4 functions as a conductive path for electrically connecting each electrode of the electronic component to the wiring conductor of the external electric circuit, and the exposed surface is made of nickel (Ni), gold (Au), or the like. It is preferable to deposit a metal having excellent corrosion resistance with a thickness of about 1 to 20 μm, and it is possible to effectively prevent the metallized wiring conductor 4 from being oxidized and corroded, and each of the metallized wiring conductor 4 and the electronic component. Bonding between the metallized wiring conductor 4 led to the lower surface of the insulating base 1a and the wiring conductor of the external electric circuit can be made strong by soldering with the electrode. Therefore, more preferably, on the exposed surface of the metallized wiring conductor 4, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method or an electroless plating method. It is good that it is sequentially applied.

  A plurality of wiring board regions 2 are arranged vertically and horizontally in the central portion of the upper surface of the insulating base 1a, and a disposal margin region 8 for facilitating handling of the insulating base 1a is formed in the outer peripheral portion.

  The multi-piece wiring board 1 of the present invention includes a first mark 5 and a second mark made of a metallized layer of metal powder such as W, Mo, Cu, and Ag on each wiring board 2 of the insulating base 1a. 6 is deposited.

  The first mark 5 and the second mark 6 are formed into a predetermined pattern simultaneously with the same W paste or the like when the W paste or the like that becomes the metallized wiring conductor 4 is printed on the ceramic green sheet that becomes the insulating base 1a. By printing and applying, the insulating substrate 1a is deposited on a predetermined position of the wiring board region 2.

  In FIG. 1, the first mark 5 and the second mark 6 are circular. However, the first mark 5 and the second mark 6 are not limited to a circular shape, and may have other shapes such as a square shape or a cross shape. The mark 6 may have a different shape.

  In addition, when the Ni plating layer and the Au plating layer are deposited on the exposed surfaces of the metallized wiring conductor 4 on the exposed surfaces of the first mark 5 and the second mark 6, the same Ni plating layer and gold are simultaneously applied. It is good to deposit a plating layer. Thereby, the color tone difference with the insulating base 1a is increased, and the first mark 5 and the second mark 6 are easily recognized by the image recognition apparatus.

  Each wiring board region 2 includes a first mark 5 and a second mark 6 formed so as to surround the first mark 5, and when the wiring board region 2 is defective. On the upper surface of the first mark 5 in the defective wiring board region 2D, the first and second marks 5 and 6, which are larger than the first mark 5 and smaller than the second mark 6, are different in color tone. The third mark 7 is formed so as to cover the first mark 5. Accordingly, the first mark 5 or the third mark 7 having a different color tone can be recognized with the second mark 6 as a reference, and the quality of the wiring board region 2 can be determined more reliably without erroneous recognition. Can do. That is, in the conventional method of changing the color tone of the mark of the defective wiring board region 2 using only one mark, the position of the mark becomes difficult to recognize by changing the color tone of the mark. While the recognition device was easy to erroneously recognize the metallized wiring conductor 4 or the like as a mark by mistake, the position can be accurately recognized by the second mark 6 and the first mark 5 or the third mark 7 inside thereof can be recognized. Can be recognized to prevent misrecognition very effectively.

  Further, when the third mark 7 is formed, the second mark 6 can prevent the third mark 7 from flowing out, and the third mark 7 can be reliably formed in an appropriate size. Therefore, the third mark 7 can be effectively recognized by the image recognition device. As a result, electronic components can be mounted only on the non-defective wiring board region 2.

  For example, when a gold plating layer is applied to the first mark 5 and the second mark 6, the third mark 7 made of dark ink is used to cover the first mark 5. As a result, only the second mark 6 is recognized by the image recognition device, and the quality of the wiring board region 2 can be reliably recognized.

  The third mark 7 may be a dark-colored resin paste, a metal paste, or the like, and the color tone is closer to the insulating substrate 1a than the first mark 5 and the second mark 6. Preferably, when the third mark 7 is formed, only the second mark can be more reliably recognized by the insulating base 1a. The third mark 7 is preferably formed of a resin paste or metal paste that is difficult to wet with respect to the second mark 6. Thereby, even if the third mark 7 flows out, the second mark 6 can effectively prevent the outflow.

  Moreover, it is preferable that the 1st mark 5, the 2nd mark 6, and the 3rd mark 7 are formed in the mounting part 2a in which an electronic component is mounted. As a result, the mounting portion 2a serves as both the first mark 5 and the second mark 6, and it is not necessary to secure a space for separately forming a mark for recognition, and the wiring board region 2 is reduced in size. In addition, it is possible to improve the bondability between the electronic component and the insulating base 1a.

  In addition, since the area recognized by the image recognition apparatus can be increased, the quality of the wiring board area 2 can be accurately recognized.

  Further, a groove or a protrusion may be formed on the surface of the insulating base 1 a between the first mark 5 and the second mark 6, and when the first mark 5 is covered with the third mark 7. In addition, it is possible to prevent the third mark 7 from flowing out and adhering to the surface of the second mark 6.

  Note that the cause of the defective wiring board region 2D is disconnection, short circuit, blurring, spreading, unevenness, adhesion of foreign matter, spots, dirt, plating layer blistering, discoloration, chipping, voids, etc. It is done.

  Then, after electronic components are mounted on all normal wiring board regions 2, a sealing resin or lid is fixed on the upper surface of each wiring board region 2 on which the electronic components are mounted so as to cover the electronic components. Thereafter, if the insulating substrate 1a is divided along the dividing line 3, only a large number of non-defective electronic devices are manufactured simultaneously and collectively.

  Further, in order to divide the insulating substrate 1a, a method of cutting the insulating substrate 1a along the dividing line 3 with a diamond cutter or a laser cutter is employed.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the first mark 5 and the second mark 6 are separated, but a plating layer is attached to the first marker 5 and the second marker 6 by an electrolytic plating method or the like. In this case, when the wiring board region 2 is defective, it may be formed so as to cover the third marker 5 on the first marker 5 excluding the connecting portion.

It is a top view which shows an example of embodiment of the multi-piece wiring board of this invention. FIG. 2 is a cross-sectional view of the multi-cavity wiring board of FIG. 1. It is a top view which shows another example of embodiment of the multi-piece wiring board of this invention. FIG. 4 is a cross-sectional view of the multi-piece wiring board of FIG. 3. It is a top view which shows the conventional multi-piece wiring board. FIG. 6 is a cross-sectional view of the multi-piece wiring board of FIG. 5.

Explanation of symbols

1: Multi-cavity wiring board 1a: Insulating substrate 2: Wiring board region 2a: Mounting portion 3: Dividing line 4: Metallized wiring conductor 5: First mark 6: Second mark 7: Third mark 8: Discard Territory

Claims (2)

A multi-piece wiring board in which a plurality of wiring board areas in which electronic component mounting portions are formed on an upper surface of an insulating substrate are arranged in a vertical and horizontal direction, each wiring board area having a first mark and its surroundings When the wiring board region is defective, the second mark is formed on the upper surface of the first mark so as to be larger than the first mark. A multi-piece wiring board, wherein a third mark having a color tone smaller than that of the first and second marks is formed so as to cover the first mark. 2. The multi-piece wiring board according to claim 1, wherein the first to third marks are formed on the mounting portion.

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