JP2004327631A - Multiple patterning wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board which can efficiently and inexpensively manufacture many electronic devices of proper articles only simultaneously and aggregatedly by surely avoiding mounting of electronic parts on an improper wiring board region. <P>SOLUTION: A plurality of wiring board regions 2 are arranged in longitudinal and lateral arrays on the central part of the upper surface of an insulating base 1. Waste margin regions 6 are formed on the outer periphery. Recognition patterns 5 corresponding to the plurality of the wiring board regions 2 are formed at the ends of the respective arrays at the ends of the longitudinal or lateral arrays of the wiring board regions 2 of the waste margin region 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a multi-cavity wiring board formed by arranging a large number of wiring board regions, which are wiring boards for mounting electronic components such as a semiconductor element and a piezoelectric vibrator, on a wide-area insulating substrate in a matrix.
[0002]
[Prior art]
Conventionally, a wiring board for mounting electronic components such as a semiconductor element and a piezoelectric vibrator is, for example, a rectangular flat plate-shaped insulating base made of ceramics having a mounting portion on which electronic components are mounted in the center of the upper surface. A plurality of metallized wiring conductors extending from the upper surface to the lower surface are provided. Then, the electronic component is mounted and fixed on the mounting portion of the insulating base, and each electrode of the electronic component is electrically connected to the metallized wiring conductor via a metal bump or a bonding wire, and thereafter, the electronic component is covered on the upper surface thereof. An electronic device as a product is obtained by hermetically sealing the electronic component by fixing the sealing resin and the lid in this manner.
[0003]
With the recent demand for miniaturization of electronic devices, such wiring boards have become extremely small, having a size of several mm square. In order to facilitate the handling and increase the production efficiency of such a miniaturized wiring board, a large number of small wiring boards are separated from a single large-area insulating base (mother substrate). It is manufactured in the form of a so-called multi-cavity wiring board so as to obtain simultaneously.
[0004]
Such a multi-cavity wiring board is formed by forming a large number of wiring board areas, each of which is a small wiring board, in a large-area insulating base, and each of the areas is divided by dividing lines and arranged integrally vertically and horizontally, A mounting portion and a metallized wiring conductor are formed in each wiring board region. Then, the electronic component is mounted and fixed on the mounting portion of each wiring board area so that each electrode thereof is electrically connected to the metallized wiring conductor, and is sealed on the upper surface of each wiring board area so as to cover the electronic component. A plurality of electronic devices are simultaneously and intensively manufactured by fixing a resin for stopping and a lid and then dividing the insulating base along the dividing line.
[0005]
In such a multi-cavity wiring board, an automatic machine equipped with an image recognition device is generally used to align and mount electronic components on a mounting portion of each wiring board area. An alignment mark composed of a metallization as a reference for aligning an electronic component on the upper surface of each wiring board region is provided at the same time as the metallized wiring conductor, and the alignment mark is recognized by an image recognition device, and the information is stored. Based on this, a method of automatic mounting is adopted.
[0006]
However, such a multi-cavity wiring board satisfies the required performance in some of the multiple wiring board regions arranged and formed in the insulating base due to manufacturing variations and defects. In some cases, a defective wiring board area that is not included is included. When such a defective wiring board area is included, a mark is made on the upper surface of the defective wiring board area with, for example, oil-based ink, and this mark is recognized by an image recognition device. When mounting an electronic component by an automatic machine, a wiring board area marked with this mark is determined to be defective, and the defective wiring board area is programmed so as not to mount the electronic component.
[0007]
However, if a mark is made on the upper surface of the defective wiring board area with oil-based ink, the mark cannot be reliably recognized by the image recognition device due to shading or blurring of the ink. There is a problem that the electronic component is mounted on the defective wiring board area by an automatic machine by being erroneously recognized as a defective wiring board area, and as a result, a defective electronic device is manufactured.
[0008]
In view of this, the applicant of the present application has disclosed in Patent Document 1 below a central portion of the upper surface of each wiring board region 12 arranged and formed on the insulating base 11 as shown in a plan view in FIG. 3 and a sectional view in FIG. And a mounting portion 12a on which an electronic component (not shown) is mounted. The positioning mark 15 is used as a reference for aligning the electronic component with the mounting portion 12a. In the case where there is a plurality of metallized wiring conductors 14 and there is a defective wiring board area 12D in each wiring board area 12, the alignment mark 15 of the defective wiring board area 12D is removed by laser processing. A multi-cavity wiring board was proposed.
[0009]
According to this multi-cavity wiring board, since the alignment mark 15 of the defective wiring board area 12D is removed by laser processing, the electronic component is mounted on the mounting portion 12a of each wiring board area 12 by an automatic machine. In this case, the quality of the wiring board area 12 can be reliably determined by recognizing whether or not the positioning mark 15 of each wiring board area 12 has been removed by the image recognition device, and as a result, the defective wiring board area 12D can be determined. No electronic components are mounted.
[0010]
In order to remove the alignment mark 15 of the defective wiring board area 12D by laser processing, for example, after determining the defective wiring board area 12D by an automatic inspection device, the alignment mark 15 of the defective wiring board area 12D is determined. Is irradiated with a laser beam to scatter and remove the alignment mark 15. In order to divide the insulating substrate 11, a method of cutting the insulating substrate 11 along a dividing line 13 with a diamond cutter or a laser cutter to divide the insulating substrate 11 is adopted.
[0011]
[Patent Document 1]
JP 2001-127399 A
[Problems to be solved by the invention]
However, according to the multi-cavity wiring board of Patent Document 1 described above, when an electronic component is mounted on the mounting portion 12a of each wiring board area 12 by an automatic machine, the position of the positioning mark 15 of each wiring board area 12 is determined by an image recognition device. By recognizing the presence / absence of the removal, it is possible to reliably determine the quality of the wiring board area 12, but removing the alignment mark 15 by laser processing requires more time and a higher cost than marking with ink. It is costly, and since it is necessary to recognize the presence or absence of the removal of the positioning mark 15 for each wiring board region 12 each time, it takes a lot of time to recognize the positioning mark 15 by the image recognition device. As a result, there has been a problem that electronic components cannot be efficiently mounted by an automatic machine.
[0013]
Accordingly, the present invention has been devised in view of such a conventional problem, and an object of the present invention is to prevent electronic components from being reliably mounted on a defective wiring board area, and to efficiently use only good electronic devices. It is an object of the present invention to provide a multi-piece wiring board that can be manufactured in a large number, simultaneously and intensively at low cost.
[0014]
[Means for Solving the Problems]
The multi-cavity wiring board of the present invention is a multi-cavity wiring board in which a plurality of wiring board regions are arranged vertically and horizontally at a central portion of an upper surface of an insulating base and a disposal margin region is formed at an outer peripheral portion. A recognition pattern corresponding to each of the plurality of wiring board regions in the row is formed at an end of each of the vertical and horizontal rows of the wiring board area in the discarding allowance area. It is.
[0015]
The multi-cavity wiring board according to the present invention comprises a plurality of wiring board regions arranged vertically and horizontally at a central portion of an upper surface of an insulating base, and a disposal margin region formed at an outer peripheral portion. Since the recognition pattern corresponding to each of the plurality of wiring board regions in the row is formed at the end of each of the vertical and horizontal rows of the wiring board area in the discarding allowance area, the A plurality of recognition patterns respectively corresponding to the plurality of wiring board regions formed in the image recognition device can be recognized at a time by the image recognition device, whereby the quality of the plurality of wiring board regions can be reliably determined in a short time. And electronic parts can be efficiently mounted by an automatic machine.
[0016]
In the multi-cavity wiring board according to the present invention, preferably, the surface of the recognition pattern is colored when the corresponding wiring board area is defective.
[0017]
In the multi-cavity wiring board of the present invention, the recognition pattern is preferably colored when the corresponding wiring board area is defective, so that the sensitivity of recognition of the recognition pattern by the image recognition device is increased, and The quality of the wiring board area can be reliably determined. Further, a defective wiring board area can be reliably specified in a short time.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
The multi-cavity wiring board of the present invention will be described below.
[0019]
FIG. 1 is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 2 is a cross-sectional view. In these figures, 1 is an insulating base, 2 is a wiring board region, and 3 is a dividing line. Reference numerals 4 denote metallized wiring conductors, which mainly constitute a multi-cavity wiring board.
[0020]
The insulating substrate 1 of the present invention is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and a glass-ceramic. A large number of wiring board regions 2, each of which is a small wiring board, are partitioned by dividing lines 3 indicated by imaginary lines, and are integrally arranged vertically and horizontally at a central portion thereof. .
[0021]
Each wiring board region 2 arranged and formed on the insulating base 1 has a mounting portion 2a for mounting an electronic component such as a semiconductor element or a piezoelectric vibrator (not shown) at the center of the upper surface thereof. It has a plurality of metallized wiring conductors 4 made of metal powder such as tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag) and the like led out from the upper surface to the lower surface of the insulating base 2. Then, an electronic component is mounted and fixed on the mounting portion 2a, and each electrode of the electronic component is electrically connected to the metallized wiring conductor 4 through an electrical connection means such as a solder bump.
[0022]
Such an insulating substrate 1 is formed, for example, by subjecting a ceramic green sheet to be an aluminum oxide sintered body to an appropriate punching process, and printing and applying a W paste or the like to be a metallized wiring conductor 4 in a predetermined pattern by a screen printing method. Thereafter, it is manufactured by firing at a temperature of about 1600 ° C. in a reducing atmosphere. The ceramic green sheet to be an aluminum oxide-based sintered body is formed into a slurry by adding and mixing an appropriate organic binder and a solvent to raw material powders such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide. It is obtained by forming a sheet by employing a well-known doctor blade method. The W paste or the like to be the metallized wiring conductor 4 is obtained by adding and mixing an appropriate organic binder and a solvent to W powder or the like and adjusting the viscosity to an appropriate viscosity.
[0023]
Note that the metallized wiring conductor 4 functions as a conductive path for electrically connecting each electrode of the electronic component to the wiring conductor of the external electric circuit, and the exposed surface is made of nickel (Ni) or gold (Au). A metal having excellent corrosion resistance is preferably applied in a thickness of about 1 to 20 μm, which can effectively prevent the metallized wiring conductor 4 from being oxidized and corroded. Bonding by soldering to the electrodes and bonding between the metallized wiring conductor 4 led to the lower surface of the insulating base 1 and the wiring conductor of the external electric circuit can be made strong. Therefore, more preferably, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the exposed surface of the metallized wiring conductor 4 by electrolytic plating or electroless plating. It is good that they are sequentially applied.
[0024]
In the multi-cavity wiring board of the present invention, a plurality of wiring board areas 2 are arranged vertically and horizontally at the center of the upper surface of the insulating base 1 and a throwaway area 6 is formed at the outer periphery. Metallized layers of metal powder such as W, Mo, Cu, Ag, etc., corresponding to each of the plurality of wiring board regions 2 in the row, at the end of each of the vertical and horizontal rows of the wiring board region 2 in the abandonment allowance region 6. And the like, and a recognition pattern 5 is formed. The recognition pattern 5 is a pattern that is used as a reference for judging pass / fail of a plurality of wiring board regions 2 arranged when mounting electronic components on the mounting portion 2a of each wiring board region 2. Recognition is performed by a recognition device, and based on the information, an electronic component is mounted on a predetermined position of each mounting portion 2a by an automatic machine.
[0025]
Note that the recognition pattern 5 is insulated by printing and applying a W paste or the like to be the metallized wiring conductor 4 on a ceramic green sheet to be the insulating base 1 and simultaneously printing and applying a predetermined pattern with the same W paste or the like. It is formed on the outer periphery of the base body 1 in the disposal margin area 6. Further, in this example, the recognition pattern 5 is circular, but is not limited to a circle, and may be another shape such as a square or a cross.
[0026]
Further, the group of recognition patterns 5 formed at the end of each vertical or horizontal row of the wiring board area 2 in the discarding allowance area 6 may have a different shape for each corresponding wiring board area 2. For example, in the case of FIG. 1, a group of four recognition patterns 5 may be a circle, a square, a cross, or a triangle from the top. In this case, the recognition of the recognition pattern 5 by the image recognition device is further facilitated.
[0027]
Furthermore, the group of recognition patterns 5 formed at the end of each vertical or horizontal row of the wiring board area 2 in the discarding allowance area 6 may be different in size for each corresponding wiring board area 2. For example, in the case of FIG. 1, the group of four recognition patterns 5 may be all circular and formed so that the diameter gradually decreases from the top.
[0028]
When the Ni plating layer and the Au plating layer are deposited on the exposed surface of the metallized wiring conductor 4 on the exposed surface of the recognition pattern 5, the same Ni plating layer and Au plating layer may be simultaneously deposited on the exposed surface of the metallized wiring conductor 4. preferable.
[0029]
Further, the surface of the recognition pattern 5 of the present invention is preferably colored by irradiating a laser beam when the corresponding wiring board region 2 is defective. Thereby, the sensitivity of recognition of the recognition pattern 5 by the image recognition device is enhanced, and the quality of the plurality of wiring board regions 2 can be reliably determined. That is, when there is a defective wiring board area 2D among the wiring board areas 2 arranged and formed on the insulating base 1, the recognition pattern 5a corresponding to the defective wiring board area 2D is irradiated with the laser light. When the electronic component is mounted on the mounting portion 2a of each wiring board area 2, the wiring board area is colored by the image recognition device because it is colored surely and is not colored like ink. By recognizing the coloring of the second recognition pattern 5, it is possible to reliably determine the quality of the wiring board area 2 and thus no electronic component is mounted on the defective wiring board area 2D.
[0030]
In order to color the recognition pattern 5 corresponding to the defective wiring board area 2D by laser processing, for example, after determining the defective wiring board area 2D using an image recognition device of an automatic machine, the recognition pattern 5 corresponding to the defective wiring board area 2D is determined. A method of exposing the W metallized layer by irradiating a laser beam to the recognition pattern 5 to be scattered to remove the Au plating layer and the Ni plating layer adhered to the surface of the recognition pattern 5 and so on is adopted.
[0031]
The coloring of the recognition pattern 5 may be adjusted by irradiating the laser beam onto the recognition pattern 5 corresponding to the defective wiring board region 2D if the image recognition device can recognize the recognition pattern 5 with high sensitivity. Only the Au plating layer may be scattered and removed to expose the Ni plating layer, or the surface of the Au plating layer may be colored using oil-based ink.
[0032]
Causes of the defective wiring board area 2D include disconnection, short-circuit, bleeding, spreading, unevenness, adhesion of foreign matter, stains, dirt, plating layer blistering, discoloration, chipping, voids, etc. of the metallized wiring conductor 4. Can be
[0033]
After the electronic components are mounted on all of the normal wiring board regions 2, a sealing resin or a lid is fixed on the upper surface of each wiring board region 2 on which the electronic components are mounted so as to cover the electronic components. Thereafter, if the insulating substrate 1 is divided along the dividing line 3, only a large number of non-defective electronic devices are manufactured simultaneously and intensively.
[0034]
In order to divide the insulating substrate 1, a method of cutting the insulating substrate 1 along a dividing line 3 using a diamond cutter or a laser cutter to divide the insulating substrate 1 is adopted.
[0035]
Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the recognition patterns 5 are formed in a line in the discard allowance area 6, but if the quality of the image recognition device can be determined, the arrangement of the recognition patterns 5 is changed. Is also good.
[0036]
【The invention's effect】
The multi-piece wiring board according to the present invention comprises a plurality of wiring board regions arranged vertically and horizontally at a central portion of an upper surface of an insulating base, and a disposal margin region formed at an outer peripheral portion. Since the recognition pattern corresponding to each of the plurality of wiring board areas in the row is formed at the end of each of the vertical or horizontal row of the wiring board area of the area, it is formed so as to gather in a predetermined area. In addition, a plurality of recognition patterns respectively corresponding to a plurality of wiring board regions can be recognized at a time by the image recognition device, so that the quality of the plurality of wiring board regions can be reliably determined in a short time. And electronic parts can be efficiently mounted by an automatic machine.
[0037]
In the multi-cavity wiring board of the present invention, the recognition pattern is preferably colored when the corresponding wiring board area is defective, so that the sensitivity of recognition of the recognition pattern by the image recognition device is increased, and The quality of the wiring board area can be reliably determined. Further, a defective wiring board area can be reliably specified in a short time.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention.
FIG. 2 is a sectional view of the multi-piece wiring board of FIG. 1;
FIG. 3 is a plan view showing a conventional multi-cavity wiring board.
FIG. 4 is a cross-sectional view of the multi-cavity wiring board of FIG. 3;
[Explanation of symbols]
1: Insulating base 2: Wiring board area 2a: Mounting part 3: Dividing line 4: Metallized wiring conductor 5: Recognition pattern 6: Discard allowance area

Claims (2)

A multi-piece wiring board in which a plurality of wiring board regions are vertically and horizontally arranged in a central portion of an upper surface of an insulating base, and a disposal margin region is formed in an outer peripheral portion, wherein the wiring substrate in the disposal margin region A multi-piece wiring board, wherein a recognition pattern corresponding to each of the plurality of wiring board areas in the row is formed at an end of each of the vertical or horizontal rows of the area. 2. The multi-cavity wiring board according to claim 1, wherein the surface of the recognition pattern is colored when the corresponding wiring board area is defective.

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