JP2005123303A - Component mounting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting head that can efficiently and highly accurately make moving actions and can improve the productivity of component mounting. <P>SOLUTION: A component holding member and an elevating/lowering device 50 are positioned so that the positional relation between their supporting centers S and T in a direction roughly along the surface of a substrate may become such a relation that the distance L1 between the fixed center J of a supporting member 40 to a moving device, and the supporting center T of the elevating/lowering device 50 becomes shorter than the distance L2 between the fixed center J of the supporting member 40 and the supporting center S of the component holding member. Therefore, the moment generated as a thrust is generated can be reduced by disposing the elevating/lowering device 50 which generates a large thrust when the component mounting head is driven nearer to the fixed center of the supporting member 40. Consequently, the operating characteristics of the component mounting head can be improved when the head makes the moving actions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting head that holds a component and mounts the held component on a substrate.

  Conventionally, various types of component mounting heads have been known (see, for example, Patent Document 1). For example, as an example of such a conventional component mounting head, a schematic perspective view of a head unit 500 is shown in FIG.

  As shown in FIG. 7, the head unit 500 includes a spline shaft 514 that is arranged in the vertical direction Z and has a suction nozzle 512 provided coaxially at the lower end thereof. The spline shaft 514 includes a first rib 528 that is integrally provided at the lower end of the vertical bracket 526 and a second rib 530 that is integrally provided in the vicinity of the middle. Can be moved up and down, and supported so as to be rotatable about its axis.

  Further, the second rib 530 that supports the Z-axis motor 516 provided near the upper side of the first rib 528 in the figure by the lower surface is integrated with the bracket 526, and the second rib 530 is formed by the spline shaft 514. Through-holes and an output-shaft through-hole of the Z-axis motor 516.

  The output shaft of the Z-axis motor 516 is connected to the lower end of the feed screw shaft 536 arranged in the vertical direction via the Z-axis coupling 534, and the upper end of the feed screw shaft 536 is connected to the upper end of the bracket 526. The upper end rib 546 provided integrally is rotatably supported. The feed screw shaft 536 is screwed with a ball screw nut 544 fixed to a Z-axis power transmission member 518 formed in a substantially oval shape. On the other hand, the upper end portion of the spline shaft 514 arranged in parallel with the feed screw shaft 536 is rotatably supported by the Z-axis power transmission member 518 and is engaged in the vertical direction.

  Further, a hollow θ-axis encoder 524 through which the spline shaft 514 passes is disposed below the second rib 30, and its input shaft is joined to the lower surface of the spline nut 522, The rotation angle of the spline shaft 514 is detected.

  Further, the head unit 500 is supported and fixed to an XY robot or the like that is a moving device that moves the head unit 500 in a direction substantially along the surface of the board on which the component is mounted. The head unit 500 is supported and fixed on the back surface of the bracket 526 shown in FIG. 7 (that is, the surface opposite to the installation surface of the feed screw shaft 536 and the spline shaft 514). Further, in the case where the head unit 500 is provided with a plurality of suction nozzles 512, the respective suction nozzles 512 are provided so as to be arranged in a line, for example, along the X-axis direction in the drawing, and the respective suction nozzles 512 are provided. Each spline shaft 514 and feed screw shaft 536 are installed so as to individually correspond to the suction nozzle 512. Each spline shaft 514 and feed screw shaft 536 are supported by a bracket 526 (including an upper end rib 546, a first rib 528, and a second rib 530).

  FIG. 8 is a schematic perspective view showing a schematic configuration of the head unit 600 as a component mounting head according to another conventional example (see, for example, Patent Document 2).

  As shown in FIG. 8, the head unit 600 performs a suction movement of the suction nozzle 615 for sucking and holding the component 617, a shaft 614 equipped with the suction nozzle 615 at the lower end thereof, and a rotational movement around the axis of the shaft 614. As a result, a head unit 620 having a motor 616 for driving the rotational movement of the suction nozzle 615, a ball screw shaft 612a, a nut screw 612b fixed to the head unit 620, and a ball screw are screwed into the ball screw shaft 612a. And an elevating unit 630 including a motor 613 for driving the rotational movement around the axis of the shaft 612a. The elevating operation of the entire head unit 620 is performed by elevating the nut portion 612b in the elevating unit 630. By doing so, the suction nozzle 615 can be moved up and down. The nut portion 612b and the head unit 620 are connected via a bracket 611.

  Further, the bracket 611 is supported by the lifting frame 609 of the lifting unit 630 so as to be lifted and lowered, and the head unit 620 and the lifting unit 630 are mechanical interface members that are flat members via the lifting frame 609. 608 is supported. Further, the head unit 600 can be attached to a moving device (not shown) that horizontally moves the head unit 600 via a mechanical interface member. The mechanical interface member 608, the lifting unit 630, and the head unit 620 are arranged such that the lifting unit 630 is disposed between the mechanical interface 608 and the head unit 620.

JP 2000-294991 A JP 2000-294988 A

  However, in the head portion 500 having the above-described structure, the Z-axis motor 516, the feed screw shaft 536, and the ball screw nut 544 that constitute a driving device that drives the lifting / lowering operation of the spline shaft 514, that is, the lifting / lowering operation of the suction nozzle 512, are It is located at a position farthest in the horizontal direction from the back surface of the bracket 526 which is a support and fixing position of the head unit 500 to the XY robot. Such a drive device is a device that generates thrust, and further, because the drive device is located at a position farthest from the support fixing position, a moment generated with the generation of the thrust becomes large. There is a problem in that the operating characteristics of the moving operation of the head unit 500 by the XY robot deteriorate due to the influence of the moment. In such a case, there may occur a case where the head unit 500 cannot be moved with high accuracy by the XY robot, so that high-precision component mounting cannot be performed and productivity in component mounting is reduced. There is a problem of inviting.

  As shown in FIG. 7, in the head unit 500, a spline shaft 514 equipped with a suction nozzle 512 is disposed between the illustrated front surface of the bracket 526 and the driving device such as the feed screw shaft 536. However, in such an arrangement, the workability to the suction nozzle 512, the θ-axis motor encoder 548, the spline shaft 514, and the spline nut 522, which is more frequently maintained than the drive device, is improved by the bracket 526 and the drive device. Depending on the shape and size, it may be greatly hindered. In such a case, the maintainability in the head unit 500 is reduced, and there is a problem that stable and accurate component mounting cannot be performed continuously, leading to a reduction in productivity. .

  Further, in such a head unit 500, a component recognition camera (not shown) that captures and recognizes an image of the supply position of the component is provided in order to reliably suck and hold the supplied component by the suction nozzle 512. There are many cases where it is said. Providing such a component recognition camera in the head unit 500 can contribute to the realization of highly accurate component mounting. However, from the viewpoint of maintainability of the head unit 500, the head unit 500 can be provided from the outside. The access route to the suction nozzle 512 or the like is limited, which may be a factor that further reduces the maintainability of the suction nozzle 512 or the like. At the same time, the actual movement range of the head unit 500 by the XY robot is increased in order to secure the movement range of the suction nozzle 512 in a direction substantially along the surface of the substrate for component mounting. In the case where the moving range of the head unit 500 is increased, the component mounting apparatus is increased in size. On the other hand, the size of the apparatus is disliked, and the surface of the board for mounting components is approximately along the surface. In the case where the moving range of the suction nozzle 512 in the direction is narrowed, the efficiency of component mounting is reduced, and in any case, there is a problem that the productivity in component mounting is decreased.

  On the other hand, in the head unit 600, the lifting unit 630, which is a device that generates thrust, is disposed in the vicinity of the mechanical interface member 608. Therefore, depending on the arrangement, the operating characteristics of the movement of the head unit 600 are degraded. Although this is not done, the distance from the mechanical interface member 608 to the head unit 620 is increased by adopting such an arrangement. When the distance to the head unit 620 is increased in this way, the vibration accompanying the movement of the head unit 600 is transmitted to the suction nozzle 615 as a large vibration, which reduces the component mounting accuracy and decreases productivity. There is a problem that there is.

  Further, in the arrangement in which the distance from the mechanical interface member 608 to the head unit 620 is large, the bracket 611 that supports the head unit 620 also needs to be a large rigid member, which hinders downsizing and weight reduction of the head unit 600. Will be. In such an arrangement, the center of the mechanical interface member 608, which is a member for supporting the head unit 600 on the moving device, and the center of gravity of the head unit 600 are greatly different. As a result, the operating characteristics of the moving operation of the head unit 600 are deteriorated.

  From the standpoint of maintainability, the elevating unit 630 is disposed between the head unit 620 and the mechanical interface member 608, so that the maintainability of the suction nozzle 615 in the head unit 620 is good. However, since the ball screw shaft 612 is disposed so as to be exposed, there is a problem that dust is likely to adhere to the oil supply portion on the screw surface, and the overall maintainability cannot always be improved.

  Accordingly, an object of the present invention is to solve the above-described problems, and to provide a component mounting head that can perform an efficient and highly accurate moving operation and can improve productivity in component mounting. There is.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the component to be supplied is held and raised by the component holding member, and the component holding member is moved in a direction substantially along the surface of the substrate to mount the component on the substrate. In the component mounting head for mounting the component on the substrate by positioning the held component above the position and lowering the component holding member,
The component holding member for releasably holding the component;
An elevating drive device for elevating and lowering the component holding member;
A member that supports the component holding member so as to be movable up and down and supports the lift driving device, the support member being fixed to a moving device that performs the movement of the component mounting head in a direction substantially along the surface of the substrate; With
The distance between the fixed center of the support member to the moving device and the support center of the lift drive device by the support member in a direction substantially along the surface of the substrate is the component holding by the support member in the direction. The respective support centers are arranged so as to be smaller than the distance between the support center of the member and the fixed center, and the support center of the elevating drive device and the support center of the component holding member There is provided a component mounting head in which at least a part of the support member is disposed therebetween, and the lift driving device and the component holding member are supported by at least a part of the support member.

According to the second aspect of the present invention, the component to be supplied is held and raised by the component holding member, and the component holding member is moved in a direction substantially along the surface of the substrate to mount the component on the substrate. In the component mounting head for mounting the component on the substrate by positioning the held component above the position and lowering the component holding member,
The component holding member for releasably holding the component;
An elevating drive device for elevating and lowering the component holding member;
A member that supports the component holding member so as to be movable up and down and supports the lift driving device, the support member being fixed to a moving device that performs the movement of the component mounting head in a direction substantially along the surface of the substrate; With
At least a part of the support member is disposed between the support center of the lift drive device and the support center of the component holding member, and the lift drive device and the component holding member are supported by at least a part of the support member. A component mounting head is provided.

  According to a third aspect of the present invention, there is provided the component mounting head according to the first aspect, wherein the fixing center of the support member and the center of gravity of the component mounting head substantially coincide with each other in a direction substantially along the surface of the substrate. .

According to a fourth aspect of the present invention, the lifting drive is
A ball screw shaft rotatably supported by the support member;
A nut portion screwed into the ball screw shaft portion;
A drive motor that is supported by the support member and rotates the ball screw shaft portion in either the forward or reverse direction around its axis;
A connecting member for connecting the nut portion and the component holding member;
By rotating the ball screw shaft portion in either the forward or reverse direction by the drive motor, the nut portion is raised or lowered along the axial center of the ball screw shaft portion, and the nut portion and the nut portion are connected via the connecting member. There is provided the component mounting head according to the first aspect or the third aspect in which the connected component holding member is raised or lowered.

  According to the fifth aspect of the present invention, the support center of the lifting drive device substantially coincides with the shaft center of the ball screw shaft portion, and the support center of the component holding member is the lifting operation shaft of the component holding member. A component mounting head according to a fourth aspect that substantially matches is provided.

  According to the sixth aspect of the present invention, from the first aspect, the support member accommodates and supports the elevating drive device therein and supports the component holding member in an exposed state outside the support member. A component mounting head according to any one of the fifth aspects is provided.

  According to the seventh aspect of the present invention, a plurality of the component holding members arranged in a row and the arrangement corresponding to the respective component holding members and arranged in a row substantially parallel to the arrangement direction of the respective component holding members. A component mounting head according to any one of the first to sixth aspects, comprising a plurality of the above-described lifting drive devices.

According to an eighth aspect of the present invention, the apparatus further includes a component recognition device that recognizes the supply position of the component in a direction substantially along the surface of the substrate by capturing an image at the supply position of the supplied component.
The component recognition device is in a direction substantially along the surface of the substrate with respect to the support center of the component holding member of any one of the component holding members, and the component holding members A component mounting head according to a seventh aspect is provided that is disposed in a direction substantially orthogonal to the arrangement direction.

  According to a ninth aspect of the present invention, the component recognition device includes the component mounting head according to the eighth aspect, which is disposed to face any one of the elevating drive devices via any one of the component holding members. provide.

  According to a tenth aspect of the present invention, any one of the component holding members is the component holding member arranged at an end of each of the component holding members arranged in the example. A component mounting head according to 9th aspect is provided.

According to an eleventh aspect of the present invention, the component mounting head according to any one of the first to tenth aspects;
The mobile device;
A component supply unit for accommodating each of the components in a manner capable of being supplied to the component holding member;
A substrate holding part for holding the substrate,
There is provided a component mounting apparatus in which the component supplied from the component supply unit is mounted by the component mounting head on a mounting position of the substrate held by the substrate holding unit.

  According to each of the above aspects of the present invention, the positional relationship between the support centers of the component holding member and the lifting drive device in the direction substantially along the surface of the substrate in the component mounting head is the fixed center of the support member to the moving device. The respective support centers are arranged so that the distance between the support center of the lifting drive device and the support center of the lifting drive device is smaller than the distance between the fixed center of the support member and the support center of the component holding member. Therefore, in the component mounting head, the elevating drive device having the feature that a large thrust is generated when driving the component mounting head is disposed closer to the fixing center of the support member, so that the thrust is reduced. The moment generated with the generation can be reduced. As a result, the operation characteristics of the moving operation of the component mounting head by the moving device can be improved, and a component mounting head capable of realizing an efficient and highly accurate moving operation can be provided. Productivity can be improved.

  In addition, at least a part of the support member is disposed between a support center of the lift drive device and a support center of the component holding member, and the lift drive device and the component holding member are arranged by at least a part of the support member. Is supported as described above, that is, the distance between the fixed center of the support member and the support center of the elevating drive device is such that the fixed center of the support member and the component holding member Even when an arrangement that is smaller than the distance between the support center is adopted, the support center of the elevating drive device and the support center of the component holding member are not affected by the mutual arrangement. Further, it can be arranged close to a part of the support member. Accordingly, the lifting drive device and the component holding member can be reliably supported by the support member with a smaller member, the component mounting head can be reduced in size and weight, and productivity in component mounting can be improved. Can contribute.

  Further, in order to realize such a positional relationship between the respective support centers, the elevating drive device configured by a ball screw shaft portion or the like is disposed inside the support member, and the component is disposed on the outer side surface of the support member. Since the holding member is exposed and arranged, the workability such as replacement and adjustment of the component holding member in the component holding member, which is frequently maintained in the component mounting head, can be improved. Maintainability of the mounting head can be improved. Therefore, it is possible to perform component mounting with improved productivity.

  On the other hand, with the arrangement of the component holding member on the outer side surface of the support member, the lift drive device housed and arranged in the support member generally requires only maintenance to the extent of grease injection. Therefore, as long as only the access route for the grease injection operation is secured, the maintainability is not deteriorated even by the arrangement.

  Further, the effect of each of the above aspects is that the component mounting head includes the plurality of component holding members and the plurality of lifting drive devices arranged in parallel with each other in a row, thereby more effectively each of the above. This reduces the moment generated by the drive of the lifting / lowering drive device and improves the operational characteristics of the component mounting head while improving the maintainability of the component mounting head. Can be increased.

  In the component mounting head, the direction is substantially along the surface of the substrate with respect to the support center of the component holding member of any one of the component holding members arranged in a row, and The component recognition devices that take an image of the component at the supply position of the component to be supplied are arranged in a direction substantially perpendicular to the arrangement direction of the component holding members. The width dimension in the arrangement direction of the component mounting heads including the respective component holding members can be reduced. That is, it is possible to reduce the size of the component mounting head in the arrangement direction compared to the case where the component recognition devices are arranged in the arrangement direction of the respective component holding members. Such downsizing can reduce the range of movement of the component mounting head in the arrangement direction by the moving device, and the component mounting device including such a component mounting head can be reduced in size, Productivity can be increased.

  Moreover, even if the said component recognition apparatus is arrange | positioned by the said component holding member being the said component holding member arrange | positioned at the edge part of each component holding member arranged in the said line, It is possible to maintain a good state without deteriorating the maintainability with respect to each of the component holding members and the lift drive devices.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 shows a schematic plan view of a component mounting apparatus 101 including a head portion which is an example of a component mounting head according to an embodiment of the present invention, and FIG. 2 shows a front view thereof.

  The component mounting apparatus 101 holds and takes out a component supplied from a component supply unit so that it can be taken out, and mounts the held component on the component mounting position on the substrate held at the substrate holding position. It is a device that performs a component mounting operation. Specifically, as shown in FIG. 1 and FIG. 2, the component mounting apparatus 101 includes two component supply units, two substrate holding positions, and two head units provided corresponding to each. In addition, the component mounting apparatus 101 includes a mounting work region R1 in which a component mounting operation is performed by the head unit 10, and a mounting work region R2 in which a component mounting operation is performed by the head unit 20. Is provided.

  As shown in FIGS. 1 and 2, in the mounting work area R1 of the component mounting apparatus 101, a plurality of components 1 are removably stored, and the stored components 1 are positioned at the component supply position 6a. In addition, a cassette component supply device 8 that is an example of a component supply unit including a plurality of component supply cassettes 6 that are supplied by the head unit 10 so as to be held and removable is provided. The mounting work area R2 is provided with a tray component supply device 18 which is an example of a component supply unit having a component supply tray 16 on which a plurality of components 1 can be taken out. An example of a component supplied from the cassette component supply device 8 is a chip-type electronic component. An example of a component supplied from the tray component supply device 18 is a built-in semiconductor device typified by an IC component. There are parts. The parts may include mechanical parts and optical parts in addition to electronic parts.

  In the component mounting apparatus 101, the mounting work areas R1 and R2 are disposed adjacent to each other, and the board transfer apparatus 12 that transfers the board 3 so as to cross the mounting work areas R1 and R2. (Which is an example of a substrate holding unit) is provided. In addition, a substrate holding position P1 for releasably holding the substrate 3 transported to the mounting work area R1 is disposed on the substrate transport device 12 near the center of the mounting work area R1. In addition, a substrate holding position P2 for releasably holding the substrate 3 transported to the mounting work area R2 is disposed on the substrate transport device 12 near the center of the mounting work area R2. Such substrates include resin substrates, paper-phenol substrates, ceramic substrates, glass / epoxy (glass epoxy) substrates, circuit substrates such as film substrates, circuit substrates such as single-layer substrates or multilayer substrates, components, and housings. Or an object on which a circuit is formed, such as a frame.

  Further, as shown in FIG. 2, a rigid body is integrally formed above the base 22 on which the board conveying device 12, the cassette component supply device 8, and the tray component supply device 18 are arranged in the component mounting apparatus 101. A frame 23 is provided. The frame 23 supports a head unit 10 in the mounting work region R1 and is a moving device that moves the head unit 10 in the X-axis direction or the Y-axis direction shown in FIG. An XY robot 4 that is an example and an XY robot 14 that is an example of a moving device that supports the head unit 20 and moves the head unit 20 in the illustrated X-axis direction or Y-axis direction in the mounting work region R2. , Supported and equipped. The X-axis direction and the Y-axis direction shown in the figure are orthogonal to each other.

  The configuration of the head units 10 and 20 in the component mounting apparatus 101 having such a configuration will be described in detail below. Since the head units 10 and 20 have the same configuration, the description of the head unit 10 will be representative in the following description. FIG. 3 shows a schematic perspective view of the head unit 10.

  As shown in FIG. 3, the head unit 10 includes a plurality of, for example, three head units 30 including suction nozzles 11 which are examples of component holding members that releasably suck and hold components. That is, the head unit 10 is provided with three suction nozzles 11. In addition, the head unit 10 includes a main frame 40 (an example of a support member) that is a housing that supports each head unit 30, and an attachment unit 40 a provided on the upper surface of the main frame 40, The head unit 10 can be detachably attached to the XY robot 4. Further, as shown in FIG. 3, the main frame 40 has a hollow and substantially prismatic shape, and each suction nozzle is disposed on the front side in the drawing (that is, on the right side in the Y-axis direction in the drawing) of the outer peripheral side surfaces. Each head unit 30 is arranged so that 11 are arranged in a line along the X-axis direction in the figure with a constant pitch.

  Here, FIG. 4 shows a cross-sectional view (partial cross-sectional view) orthogonal to the illustrated X-axis direction in the head portion 10 of FIG. As shown in FIGS. 3 and 4, each head unit 30 includes a suction nozzle 11 that removably sucks and holds the component 1 at its lower tip, and a shaft that is detachably mounted on the lower tip of the suction nozzle 11. A plurality of bearing portions 32 that rotatably support the shaft portion 31 around the axis 31 of the shaft portion 31 and the shaft portion 31 arranged in a substantially vertical direction, and the respective bearing portions 32 are fixed. A head frame 33 that supports the shaft portion 31 via the bearing portion 32, and a rotation drive motor 34 that is connected to the upper end of the shaft portion 31 and drives the rotational movement around the axis S of the shaft portion 31; It is configured as an integral and independent device. Since each head unit 30 has such a configuration, the rotational drive motor 34 rotates the shaft 31 around the axis S in either the forward or reverse direction while the drive amount is controlled. In this way, the suction nozzle 11 can be rotated around the axis S in a forward or reverse direction by a predetermined angle. Such rotational movement of the suction nozzle 11 is performed when there is a misalignment between the suction holding posture of the component sucked and held by the suction nozzle 11 and the mounting posture of the component on the substrate. This is performed as an operation for correcting the deviation. Note that the axis S of the shaft portion 31 substantially coincides with the axis of the suction nozzle 11.

  Further, as shown in FIGS. 3 and 4, an LM rail 35 is arranged and fixed on the front surface of the main frame 40 in the vertical direction in the drawing, and two LM blocks 36 are provided on the LM rail 35. The LM rail 35 is engaged so as to be movable along the LM rail 35 (that is, in the vertical direction). Further, each LM block 36 is fixed to the head frame 33, so that the head frame 33 is supported by the main frame 40 so as to be movable in the vertical direction as the arrangement direction of the LM rail 35. That is, the entire head unit 30 is supported by the main frame 40 so as to be movable in the vertical direction (that is, capable of moving up and down). Each head unit 30 can be raised and lowered independently of each other.

  As shown in FIG. 4, inside the main frame 40, three elevating units 50, which are examples of elevating driving devices that perform the elevating operation of the head unit 30, that is, the elevating operation of the suction nozzle 11, are respectively provided. The head unit 30 is supported and provided so as to correspond individually. Each elevating unit 50 is arranged in a substantially vertical direction, and is screwed to the ball screw shaft portion 51 and a ball screw shaft portion 51 supported by the main frame 40 so as to be rotatable around a rotation center that is an axis T thereof. And a lifting drive motor 53 that is an example of a drive motor that is connected to the upper end of the ball screw shaft 51 and drives the ball screw shaft 51 to rotate in either the forward or reverse direction about the axis T. It has. Further, a connecting bar 54, which is an example of a connecting member having a substantially L shape, is fixed to the nut portion 52, and the connecting bar 54 is fixed to the head frame 33 in the corresponding head unit 30. As a result, the head frame 33 and the nut portion 52 are connected to each other via the connection bar 54. Each head unit 30 is supported by the front member, which is at least part of the main frame 40, and each lifting unit 50 is supported inside the member of the main frame 40. That is, the head unit 30 and the elevating unit 50 are arranged and supported by the members on the front side of the main frame 40. FIG. 5 is a perspective view of the head unit 10 in a state where the main frame 40 is transmitted through the head unit 10 shown in FIG. As shown in FIG. 5, similarly to the arrangement of the head units 30, the lifting units 50 are also arranged in a row at a predetermined interval pitch (the same interval pitch as that of the head unit 30) along the X-axis direction in the drawing. Is arranged.

  Since the elevating unit 50 and the head unit 30 are configured as described above, the elevating drive motor 53 of the elevating unit 50 drives the ball screw shaft 51 to rotate, so that the nut portion 52 is connected to the axis of the ball screw shaft 51. The head frame 33 that is raised or lowered along the center T and is connected to the nut portion 52 via the connecting bar 54 is guided by the LM rail 35 and the LM block 36 to the axis S of the shaft portion 31. It can be raised or lowered along. The entire head unit 30 can be lifted and lowered integrally by the lifting and lowering operation of the head frame 33. Specifically, by lowering the head unit 30, the suction nozzle 11 in a state of being positioned above the component supply position 6a of the cassette component supply device 8 is moved down, and is positioned at the component supply position 6a. The lower end of the suction nozzle 11 can be brought into contact with the component being held, and the component can be held by suction. Further, by raising the head unit 30, the suction nozzle 11 in a state in which the parts are sucked and held can be lifted, and the parts can be held and taken out from the parts supply position 6a. Further, by moving the suction nozzle 11 up and down, the component held by suction can be mounted at the component mounting position on the substrate 3. In addition, since the lifting / lowering operation of the head frame 33 is performed as a lifting / lowering operation for sucking and removing parts by the suction nozzle 11, the above operations can be performed within the range of the lifting / lowering operation. There is a limit on the degree (that is, an upper limit position and a lower limit position for raising and lowering are provided). Further, the axis S of the shaft portion 31 is also a lifting operation axis of the suction nozzle 11.

  In addition, a through window portion 41 that is an opening through which a part of the head frame 33 connected to the connection bar 54 passes is formed on the front surface of the main frame 40. It is formed in such a size that does not obstruct the above-mentioned lifting / lowering operation 33. In other words, the shape and size of the through window portion 41 are determined so that the head frame 33 located at any position in the lifting operation range does not interfere with the peripheral portion of the through window portion 41.

  Here, FIG. 6 shows a cross-sectional view of the head unit 10 in a cross-section corresponding to FIG. 4 in a state where the head unit 10 having such a configuration is mounted on the XY robot 4. As shown in FIG. 6, the head unit 10 can be detachably mounted on the XY robot 4 at an attachment part 40 a that is an upper part of the main frame 40. Further, the center position of the mounting portion 40a in the Y-axis direction shown in the figure is the support center J (fixed center) of the main frame 40 by the XY robot 4. In addition, the support center in the Y-axis direction in the support of each lifting unit 50 to the main frame 40 substantially coincides with the arrangement position of the axis T of the ball screw shaft portion 51 (referred to as the support center T). The support center in the Y-axis direction shown in the support of each head unit 30 to the frame 40 substantially coincides with the arrangement position of the shaft center S of the shaft portion 31 (referred to as the support center S). The positional relationship between the respective support centers in the Y-axis direction is such that the distance dimension L1 between the support center J of the main frame 40 and the support center T of the lifting unit 50 by the XY robot 4 is the support center J of the main frame 40. Each support center is arranged so as to be smaller than the distance dimension L2 between the head unit 30 and the support center S of the head unit 30.

  In addition, the center of gravity of the head unit 10 in the Y-axis direction shown in the figure substantially coincides with the support center J of the main frame 40 for the XY robot 4 or is disposed in the vicinity of the support center J. In other words, the distance dimension between the gravity center position of the head unit 10 and the support center T of the lifting unit 50 is the distance dimension between the gravity center position and the support center S of the head unit 30. It can also be said that the respective support centers are arranged so as to be smaller.

  By having such an arrangement relationship, the head unit 10 brings the lifting unit 50 having a feature of generating a large thrust when driving the head unit 10 closer to the support center J of the main frame 40. It can arrange | position and the magnitude | size of the moment which arises with generation | occurrence | production of the said thrust can be reduced.

  Further, as shown in FIG. 6, on the left side of the support center J in the main frame 40 of the head unit 10, the operation of each head unit 30 and the operation of each lifting unit 50 in the head unit 10 are controlled with each other. A control device 45 that performs overall control while associating is provided.

  As shown in FIGS. 3 and 6, in the head unit 10, an image of a component arranged so as to be able to be taken out at each component supply position 6 a of the component supply unit, for example, the cassette component supply device 8 is taken. Accordingly, a component imaging camera 60 that is an example of a component recognition device that recognizes the position of the component in the X-axis direction or the Y-axis direction is provided. As shown in FIG. 6, the component imaging cameras 60 are arranged on the right side in the Y-axis direction of the head unit 30. Specifically, as shown in FIG. 1, they are arranged in a line along the X-axis direction. For example, the head unit 30 positioned at the end of the three head units 30 is positioned adjacent to the head unit 30 positioned at the right end in the X-axis direction in the figure. That is, the support center S of the head unit 30 located at the end, the support center T of the lifting unit 50 corresponding to the head unit 30, and the imaging center K of the component imaging camera 60 are along the Y-axis direction. Are arranged in a row.

  As shown in FIGS. 1, 3, and 6, the component imaging camera 60 is supported by the main frame 40 of the head unit 10 via a camera support frame 61. Further, as shown in FIG. 3, in consideration of maintainability of each head unit 30 from the right side in the Y-axis direction in the drawing, the camera support frame 61 is located on the side of the head unit 30 at the end (in the X-axis direction in the drawing). (Right direction).

  The mounting height of the component imaging camera 60 to the main frame 40 is the case where any of the suction nozzles 11 of the head unit 10 is positioned above the respective component supply positions 6a of the cassette component supply device 8. In addition, the lower end of the component imaging camera 60 is set to a height position so as not to interfere with the cassette component supply device 8.

  In addition, the image data of the component imaged by the component imaging camera 60 is output to the control device 45 of the head unit 10, and the control device 45 performs recognition processing of the image. Based on the recognition processing result, The position of the component is recognized, and the movement position of the head unit 10 can be corrected by the XY robot 4 (that is, the suction nozzle 11 is reliably positioned above the component). The controller 45 can control the imaging operation of the component imaging camera 60.

  Next, as a component mounting method in the component mounting apparatus 101 including the head unit 10 having the above-described configuration, for example, a component supplied from the cassette component supply device 8 in the mounting work area R1 is attracted by the head unit 10. A specific operation of taking out and mounting on the substrate 3 held at the substrate holding position P1 will be described.

  First, in FIG. 1, the component imaging camera 60 of the head unit 10 is moved by the XY robot 4 so as to be positioned above the component supply position 6 a where the component removal in the cassette component supply device 8 is performed. At this time, in the head unit 10, the component imaging camera 60 is attached to the main frame 40 at a height position where interference with the cassette component supply device 8 is prevented, and thus the interference occurs. There is no. Thereafter, the component imaging camera 60 captures an image of the component positioned at the component supply position 6a. The captured image data is input to the control device 45 and image recognition processing is performed, and the position where the component is actually positioned is recognized.

  Based on the recognition processing result, the XY robot 4 moves the head unit 10 in the X-axis direction or the Y-axis direction, and the suction nozzle 11 that first performs suction pickup is positioned above the component. Thereafter, the ball screw shaft 51 is rotationally driven in either the forward or reverse direction by the lift drive motor 53 in the lift unit 50 corresponding to the suction nozzle 11, and the downward movement of the nut portion 52 is started. Thereby, the downward movement of the head frame 33 connected to the nut portion 52 via the connection bar 54 is started, and the downward movement of the suction nozzle 11 is started when the entire head unit 30 is lowered.

  Eventually, when the lower end of the suction nozzle 11 comes into contact with the component, the drive of the lift drive motor 53 is stopped and the lowering of the suction nozzle 11 is stopped. At the same time, the component is sucked and held by the suction nozzle 11. After this suction holding, the ball screw shaft 51 is rotationally driven in the direction opposite to that in the lowering operation by the elevating drive motor 53, and the suction nozzle 11 in the state where the parts are sucked and held is raised, and the parts are supplied. The part is picked up and taken out from the position 6a. It should be noted that the above-described operations are repeated for the other suction nozzles 11 provided in the head unit 10, and the respective parts are suctioned and taken out by the respective suction nozzles 11.

  Thereafter, the XY robot 4 moves the head unit 10 toward the upper side of the substrate 3 held at the substrate holding position P1. In the course of the movement, images of the suction holding posture of the parts sucked and held by the respective suction nozzles 11 are picked up, and based on the recognition result of the picked up images, the amount of displacement is determined by the rotational drive motor. The correction may be made by the rotational movement of the suction nozzle 11 by 34.

  When the head unit 10 reaches above the substrate 3, the suction nozzle 11 on which component mounting is first performed and the component mounting position on the substrate 3 are aligned. As a result, the ball screw shaft 51 is rotationally driven in either the forward or reverse direction, and the lowering of the suction nozzle 11 is started. While the component is in contact with and pressed against the component mounting position on the substrate 3, the lowering operation is stopped, and the suction holding of the component by the suction nozzle 11 is released. Thereafter, the suction nozzle 11 is raised so that the component is mounted on the substrate 3. Each operation is repeated for each suction nozzle 11, and each component is mounted on the substrate 3.

  In the above description, the operation of the head unit 10 in the mounting work region R1 of the component mounting apparatus 101 has been described. However, since the head unit 20 has the same configuration as the head unit 10, the supply form of each component is also described. Except for the differences, the operation of the head unit 20 in the mounting work area R2 is similar.

  Further, the width of the mounting work area R1 shown in FIG. 1 in the illustrated X-axis direction is such that each suction nozzle 11 provided in the head unit 10 picks up and picks up components from any component supply position 6a of the cassette component supply device 8. It is set so that it can be done. That is, the suction nozzle 11 positioned at the left end of the head unit 10 in the drawing can be positioned above the component supply position 6a positioned at the right end of the drawing, and the suction nozzle positioned at the right end of the head unit 10 in the drawing. The minimum required width of the mounting work area R1 is determined so that 11 can be positioned above the component supply position 6a positioned at the left end in the figure. The width of the mounting work area R2 is also set in the same way as the mounting work area R1.

  According to the above embodiment, the following various effects can be obtained.

  The positional relationship between the respective support centers in the Y-axis direction in the head unit 10 is such that the distance dimension L1 between the support center J of the main frame 40 by the XY robot 4 and the support center T of each lifting unit 50 is the main frame 40. Since the respective support centers are arranged so as to be smaller than the distance dimension L2 between the support center J of the head unit 30 and the support center S of each head unit 30, the head unit 10 is driven at the time of driving. Each lifting and lowering unit 50 having the feature of generating a large thrust can be disposed closer to the support center J of the main frame 40, and the magnitude of the moment generated with the generation of the thrust can be reduced. it can. As a result, it is possible to improve the operation characteristics of the moving operation of the head unit 10 by the XY robot 4, to realize the efficient and highly accurate moving operation of the head unit 10, and to improve the productivity in component mounting. be able to.

  Further, in order to realize such a positional relationship between the respective support centers, an elevating unit 50 constituted by a ball screw shaft portion 51 and the like is disposed inside the main frame 40, and the suction nozzle 11 is disposed on the outer side surface of the main frame 40. By arranging the head unit 30 provided with the above, it is possible to improve the workability with respect to the head unit 30 having a relatively high maintenance frequency, such as replacement and adjustment of the suction nozzle 11 and adjustment of the shaft portion 31. Maintenance in the head unit 10 can be improved. Specifically, the suction nozzle 11 is removed from the head unit 30 because fine taping debris is attached when the component is picked up by the suction nozzle 11 or solder is attached when the component is mounted. Maintenance performance such as all ultrasonic cleaning work and periodic replacement work of the filter built in the suction nozzle 11 can be improved. Therefore, it is possible to perform component mounting with improved productivity.

  On the other hand, with the arrangement of the head unit 30 on the outer side surface of the main frame 40, the lifting unit 50 arranged in the main frame 40 is generally only maintained to the extent that grease is injected into the bearing portion or the like. Therefore, as long as the access route for the grease injection work is secured, the maintainability is not lowered. In addition, since each lifting unit 50 is arranged inside the main frame 40, adhesion of dust or the like to the grease injection portion or the like is suppressed, and the overall maintainability of the head portion 10 is improved. There is also an effect.

  Further, in the above-described side surface member that is a part of the main frame 40, the respective head units 30 are disposed outside and supported by the respective elevating units 50 disposed therein, so that the side surfaces of the main frame 40 are supported. The distance from the member to the support center T of each lifting unit 50 and the distance from the support center S of each head unit 30 can be set to the minimum required dimensions. As a result, it is possible to reduce the size of the members that support the elevating unit 50 and the head unit 30, to reduce the size and weight of the head unit 10, and to generate vibrations accompanying the movement of the head unit 10. The amount of transmission to the head unit 30 can be reduced.

  Further, the lifting unit 50 having a lower maintenance frequency than the head unit 30 is disposed in a vacant space inside the main frame 40 formed in a substantially box shape in order to realize both high rigidity and light weight. Thus, the vacant space can be used effectively, and the head portion 10 can be reduced in size and weight.

  Further, in the head unit 10, a component imaging camera 60 that captures an image of a component to be suctioned and removed is disposed on the cassette component supply device 8 side with respect to the suction nozzles 11 arranged in a line. The width dimension in the arrangement direction (that is, the X-axis direction) of the head unit 10 including the three suction nozzles 11 arranged in a line can be made compact. That is, the above-described downsizing of the head unit 10 can be achieved as compared with the case where the component imaging cameras 60 are arranged in the arrangement direction of the respective suction nozzles 11. Thus, by reducing the width dimension of the head unit 10 in the X-axis direction, the movement range of the head unit 10 in the X-axis direction by the XY robot 4 can be reduced, and component mounting including such a head unit 10 is possible. It is possible to reduce the size of the apparatus 101 and increase the productivity in component mounting. In addition, although the length dimension of the Y-axis direction in the head unit 10 is increased by the amount that the component imaging camera 60 is arranged on the cassette component supply apparatus 8 side, such an increase in the length dimension of the Y-axis direction is as follows. The interference between the cassette component supply device 8 and the component imaging camera 60 can be eliminated by avoiding the positional relationship in the height direction.

  Further, in the head unit 10, the component imaging cameras 60 are arranged on the cassette component supply device 8 side of the suction nozzle 11 located at the end of the suction nozzles 11 arranged in a line, so that each suction nozzle is arranged. 11 and the head unit 30 can be maintained in a good state without impeding maintenance.

  In the above embodiment, as shown in FIG. 6, the case where one head unit 30 is arranged between the lifting unit 50 and the component imaging camera 60 has been described. Instead, the arrangement of the component imaging camera 60 may be determined such that another row of the head units 30 is arranged between the head unit 30 and the component imaging camera 60. . In such a case, the user can determine the number of columns in which the head unit 30 is mounted, can flexibly cope with the diversity in component mounting, and can improve productivity. In addition, when selection of the number of columns of the head unit 30 is not required as described above, it is desirable that the component imaging camera 60 be arranged as close to the main frame 40 as possible. This is because the vibration generated in the component imaging camera 60 due to the movement of the head unit 10 can be reduced.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a typical top view of the component mounting apparatus concerning one Embodiment of this invention. It is a typical front view of the component mounting apparatus of FIG. It is a perspective view of the head part with which the component mounting apparatus of FIG. 1 is provided. FIG. 4 is a partial cross-sectional view of the head portion of FIG. 3. FIG. 4 is a perspective view of a state in which a main frame is transmitted in the perspective view of the head portion of FIG. 3. FIG. 5 is a cross-sectional view of a state in which the head unit of FIG. 4 is mounted on an XY robot. It is a perspective view of the conventional head part. It is a perspective view of the head part concerning another conventional example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component 3 Board | substrate 4, 14 XY robot 6 Component supply cassette 8 Cassette component supply apparatus 10 and 20 Head part 11 Suction nozzle 12 Substrate conveyance apparatus 16 Component supply tray 18 Tray part supply apparatus 22 Base 30 Head unit 31 Shaft part 32 Bearing Part 33 Head frame 34 Rotation drive motor 35 LM rail 36 LM block 40 Main frame 41 Through window part 50 Lifting unit 51 Ball screw shaft part 52 Nut part 53 Lifting drive motor 54 Connecting bar 60 Component imaging camera 61 Camera support frame S Axis center T Axis

Claims (2)

The component (1) to be supplied is held and raised by the component holding member (11), and the component holding member is moved in a direction substantially along the surface of the substrate (3), so that the mounting position of the component on the substrate is reached. In the component mounting head (10, 20) for mounting the component on the substrate by positioning the held component above the component and lowering the component holding member,
The component holding member for releasably holding the component;
An elevating drive device (50) for elevating and lowering the component holding member;
A member that supports the component holding member so as to be movable up and down and is also a member that supports the lift driving device, and is fixed to a moving device (4, 14) that moves the component mounting head in a direction substantially along the surface of the substrate. A support member (40) to be provided,
The distance dimension (L1) between the fixed center (J) of the support member to the moving device and the support center (T) of the lifting / lowering drive device by the support member in a direction substantially along the surface of the substrate is The respective support centers are arranged so as to be smaller than the distance dimension (L2) between the support center (S) of the component holding member by the support member in the direction and the fixed center, and the elevation At least a part of the support member is disposed between the support center of the driving device and the support center of the component holding member, and the lifting drive device and the component holding member are supported by at least a part of the support member. A component mounting head characterized by that. The component (1) to be supplied is held and raised by the component holding member (11), and the component holding member is moved in a direction substantially along the surface of the substrate (3), so that the mounting position of the component on the substrate is reached. In the component mounting head (10, 20) for mounting the component on the substrate by positioning the held component above the component and lowering the component holding member,
The component holding member for releasably holding the component;
An elevating drive device (50) for elevating and lowering the component holding member;
A member that supports the component holding member so as to be movable up and down and is also a member that supports the lift driving device, and is fixed to a moving device (4, 14) that moves the component mounting head in a direction substantially along the surface of the substrate. A support member (40) to be provided,
At least a part of the support member is disposed between a support center (T) of the lift drive device and a support center (S) of the component holding member, and the lift drive device and the support member are arranged by at least a part of the support member. A component mounting head, wherein the component holding member is supported.

Images