JP4783689B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus that mounts components on a substrate, and more particularly, to a component mounting apparatus that can mount components on a substrate by turning the components upside down.

  In the component mounting apparatus, there is an operation (hereinafter referred to as a mounting operation) of mounting an electronic component (hereinafter simply referred to as a component) supplied from a component supply unit on a substrate while being held by a mounting head unit that is movable in a plane direction. Done iteratively. There are various parts supplied from the part supply part. For example, as shown in FIG. 1, a part P on which bumps (projecting electrodes) B as connection terminals such as a flip chip are formed, as shown in FIG. Generally, the component B is supplied from the component supply unit 10 in a posture in which the formation surface of the bump B is on the upper surface side.

  Such a component P is moved in the plane direction after confirming the suction position of the component P from above by the camera 12A fixed to the reversing pickup head unit 12 as disclosed in, for example, Patent Document 1 and Patent Document 2. The component P is picked up by the suction nozzle 12 </ b> B of the possible reverse pickup head unit 12 and is taken out from the component supply unit 10. After taking out the component P, as shown in FIG. 2, the reverse pick-up head part 12 was turned over so that the bump B of the component P was in the lower surface side, and turned upside down as shown in FIG. The component P is delivered to the mounting head unit 14. After the delivery is completed, in order to correct the mounting position on the substrate, mark recognition is performed by another camera 16, and then the mounting head unit 14 is moved to the mounting position on the substrate to mount the component P.

Japanese Patent Publication No. 7-60841 Japanese Patent No. 3636153

  However, in the conventional component mounting apparatus in which the components are reversed and mounted on the substrate, the reversing pickup head unit 12 includes (1) a dedicated positioning unit necessary for movement in the plane direction and components in addition to the reversing mechanism. Since a suction nozzle 12B for picking up, a dedicated camera 12A necessary for recognizing the suction position of the component, and a mechanism for supplying negative pressure to the suction nozzle 12B to be reversed are necessary, (2) Since the components are reversed while adsorbed, centrifugal force works. Particularly, in the case of large-sized components, a strong negative pressure is required, which complicates the entire component mounting apparatus and increases the cost.

  In addition, there are various parts supply forms such as wafers, trays, tape feeders, etc., and many conventional component mounting apparatuses that have a function of reversing the front and back of the parts are dedicated apparatuses according to the part supply form. Lack of flexibility in the supply form of parts.

  Further, when replacing the suction nozzle depending on the type of component, it is necessary to replace the suction nozzle 12B of the reversing pickup head unit 12 in addition to the suction nozzle of the mounting head unit 14, resulting in a reduction in work efficiency.

  In addition, there is a component mounting apparatus provided with a plurality of mounting heads to improve work efficiency. However, the addition of the positioning part of the reversing pickup head 12 makes it easy to cause interference in the movement of these heads. There was also a problem that caused difficulty.

  In addition, since the suction nozzle 12B is opened upward after the parts are transferred to the mounting head portion, dust is easily sucked in, which may cause the suction nozzle 12B to be clogged, and there may be a problem in terms of maintenance.

  The present invention has been made to solve the above-mentioned conventional problems, and with a simple configuration, the supplied parts can be reversed and mounted on the board, and the flexibility of the supply form of the parts is high, and the work efficiency is high. It is an object of the present invention to realize a component mounting apparatus capable of improving the above.

The present invention provides a component mounting apparatus in which a component supplied from a component supply unit is held by a mounting head unit and mounted on a substrate, and a component storage unit that is open on both sides and an open unit on both sides of the component storage unit are provided. A component reversing device having a reversing mechanism for reversing the component storage unit together with the components in a state in which the opening and closing doors that can be opened and closed independently from each other are closed . The above- described problems are solved by a component mounting apparatus provided at the lower end of the mounting head .

  According to the present invention, since a dedicated positioning unit, the suction nozzle 12B and the camera 12A shown in FIG. 1 are not required, the component reversing device can be configured simply, and this component reversing device can be mounted on the conventional component mounting. By providing the apparatus, it is possible to easily change to a component mounting apparatus that can pick up the components to be supplied and mount them by turning them upside down.

  Moreover, the component reversing apparatus can be used as it is even if the supply form such as wafer supply or tray supply changes. That is, the component can be carried to the component reversing device by the mounting head unit, the component can be reversed here, and the component can be mounted again on the board by the mounting head unit, and the replacement of the dedicated suction nozzle is not required. It is flexible and can improve work efficiency.

  In addition, since a dedicated positioning unit is not required, it has versatility applicable to a component mounting apparatus having a plurality of mounting head units.

  In particular, by providing the component reversing device at the lower end of the mounting head portion, the front and back reversing operation of the component reversing device can be performed while the mounting head portion is moving, so that the production tact can be further shortened.

Hereinafter, reference embodiments and embodiments of the present invention will be described with reference to the drawings.

( Reference form)
FIG. 4 is a plan view showing a configuration of a reference form of the component mounting apparatus according to the present invention. The component mounting apparatus 20 is disposed on the front surface thereof, and a component supply unit 22 that supplies components to be mounted on a circuit board (hereinafter referred to as a substrate) S by a tape feeder, and a mounting head unit 24 that mounts the components on the substrate S. A component reversing device 30 that reverses the front and back of the component supplied from the component supply unit 22 by the mounting head unit 24, an X-axis positioning unit 40 that positions the mounting head unit 24 in the X-axis direction, and the mounting head unit A Y-axis positioning unit 42 for positioning 24 in the Y-axis direction, an image recognition device unit 44 for recognizing components held by the mounting head unit 24 from below (from the back to the front in the figure) with high accuracy, and transport of the substrate S And a transport unit 46 for performing the above.

  The mounting head unit 24 includes an image recognition camera 26 for recognizing marks M and components on the substrate S, and suction nozzles N (for example, four suction nozzles N1, N2, N3, and N4) for holding the components. And a nozzle positioning portion (not shown) for positioning each suction nozzle in the vertical direction (Z-axis direction) and the rotation direction.

  Each of the nozzles N1, N2, N3, and N4 is mounted in parallel on the mounting head portion 24, for example, at equal intervals, and the tip of the suction nozzle faces downward (in the rear direction in the figure).

  The image recognition camera 26 is disposed in the mounting head unit 24 and faces downward so that the mark M on the substrate S and the components placed on the component supply unit 22 can be imaged from above.

  The component reversing device 30 inverts the component from the component supplying unit 22 and recognizes the image between the component supplying unit 22 and the substrate S so that it can be efficiently mounted on the substrate S after being recognized by the image recognizing device unit 44. It is disposed near the device unit 44.

Next, the component reverse apparatus 30 according to this reference embodiment will be described with reference to FIG.

  The component reversing device 30 includes a component storage portion 32, a first opening / closing door 34, a second opening / closing door 36, and a reversing mechanism 38.

  The component housing portion 32 has through holes 32A that are arranged in parallel in the X-axis direction at intervals corresponding to the intervals between the suction nozzles N1, N2, N3, and N4 and open on both sides (upper and lower sides in the drawing). . The open portion 32B of each through-hole 32A has a size that allows the component P held by the suction nozzle N to enter and exit. The first open / close door 34 and the second open / close door 36 have mechanisms (not shown) that can be opened and closed independently of each other in the Y-axis direction for closing the open portions 32B of the through holes 32A.

  The reversing mechanism 38 has a motor (not shown) that reverses the component housing portion 32, the first opening / closing door 34, and the second opening / closing door 36 around the shaft 32 </ b> C of the component housing portion 32.

  Next, the operation of the component reversing device 30 will be described with reference to FIGS.

  First, in order to recognize the suction position of the component P, the image recognition camera 26 recognizes the component P on the component supply unit 22 and corrects the suction position so that the center of the component on the bump forming surface side is sucked. The part 24 is sucked and held by the part 24.

  After holding the component P, the mounting head unit 24 is moved above the component reversing device 30 by the X-axis positioning unit 40 and the Y-axis positioning unit 42.

  As shown in FIG. 5, when the first opening / closing door 34 slides in the Y-axis direction and opens, one open portion 32 </ b> B of the component housing portion 32 is exposed. Thereafter, the nozzle N is lowered by the nozzle positioning portion, and the component P is accommodated in the component accommodating portion 32. At this time, the second open / close door 36 is closed, and acts as a bottom surface by closing the other open portion of the through hole 32A of the component housing portion 32, and the component P is placed thereon.

  After the component P is placed and the suction nozzle N is raised, the first opening / closing door 34 is slid in the Y-axis direction and closed as shown in FIG.

  After the first door 34 is closed, as shown in FIG. 7, the reversing mechanism 38 rotates the component storage portion 32 together with the component P around the shaft 32 </ b> C with both the doors 34 and 36 closed.

  As shown in FIG. 8, after the reversal, when the second opening / closing door 36 slides and opens in the Y-axis direction, the other open portion 32 </ b> D of the component housing portion 32 is exposed, and the component P can be sucked.

  Next, after picking up the image by the image recognition camera 26, the suction position is corrected so as to suck the component center on the non-bump forming surface side of the component P accommodated in the component reversing device 30. The component P is sucked and held by the suction nozzle N.

  When the next part P is reversed, the part P can be accommodated from the second opening / closing door 36 side, and therefore, it is not necessary to reverse it.

  After the component P on the component reversing device 30 is sucked by the mounting head portion 24 in this way, the position of the bump B of the component P is recognized from the lower surface by the image recognition device portion 44, and the mounting posture is corrected and placed on the substrate S. Perform mounting operation.

In this reference embodiment, since there are a plurality of through holes 32A for accommodating the parts P, the plurality of parts P can be reversed at the same time.

  In addition, by exchanging the component housing portions 32 having different sizes of the through holes 32A, the sizes of the components can be easily accommodated.

(Implementation form)
Next, with reference to FIGS. 9 and 10, it will be described implementation form of the present invention.

As shown in FIG. 9, the mounting head unit 25 according to the implementation form, a nozzle shaft 25A having a suction nozzle N to the tip, the nozzle axis driving unit 25B for moving the nozzle axis 25A in the Z axis direction, the nozzle A θ-axis drive unit 25C that rotates the shaft 25A around the axis, and a guide 25D for sliding the component reversing device 30 in the Y-axis direction, and includes a nozzle shaft drive unit 25B, a θ-axis drive unit 25C, and a guide 25D is supported by a base 25E.

  The component reversing device 30 slides along the guide 25D from the position just below the base 25E (standby position of the component reversing device 30) to the position just below the suction nozzle N (reversing position of the component reversing device 30) via the support 25F. It is provided at the lower end of the mounting head 25.

  Next, based on FIG.9 and FIG.10, operation | movement of the mounting head part 25 in which the component inversion apparatus 30 was provided in the lower end part is demonstrated.

Similarly to the reference embodiment, first, as shown in FIG. 9, the component P on the component supply unit 22 is held by the mounting head unit 25 in a state where the component reversing device 30 is in the standby position.

  The following operation is performed until the mounting head unit 25 moves to the image recognition unit 44 after holding the component P with the bump B forming surface on the upper surface side on the component supply unit 22.

After holding the component P, as shown in FIG. 9, the component reversing device 30 moves in the Y-axis direction along the guide 25D, and as shown in FIG. 10, after moving to the reversing position of the component reversing device 30, As in the reference embodiment, the first opening / closing door 34 is opened, the component P is accommodated, the component reversing device 30 is reversed, the second opening / closing door 36 is opened, and the mounting head portion 25 is reversed by the suction nozzle N. The part P is adsorbed.

  After the mounting head portion 25 holds the component P, as shown in FIG. 10, the suction nozzle N that holds the component P is pulled up by the nozzle shaft driving portion 25B, and the component reversing device 30 moves to the standby position along the guide 25D. To return.

As described above, after the operations so far, as in the reference embodiment, the position of the bump B of the component P is recognized from the lower surface by the image recognition unit 44, and the mounting posture is corrected by the θ-axis drive unit 25C and the like on the substrate S. The mounting operation is performed.

When the mounting head portion 25 moves to the image recognition device portion 44, the front and back reversing operation of the component reversing device 30 is performed, so that the production tact can be improved as compared with the case where the component reversing device 30 is fixed on the component mounting device 20 as in the reference embodiment. Can be further shortened.

  The component supply unit 22 is not limited to this embodiment, and components may be supplied from a wafer, a tray, or the like.

Side view schematically showing a state of sucking a pumped part in a conventional part reversing device Side view schematically showing a state in which the parts are turned upside down The side view which shows typically the state which adsorb | sucked the said components reversed by the mounting head part. The top view which shows the structure of the reference form of the component mounting apparatus which concerns on this invention The perspective view which shows the state which the opening / closing door of the component inversion apparatus in a reference form is open The perspective view which shows the state in which the opening / closing door of the said component inversion apparatus is closed. The perspective view which shows the state in which the components accommodated in the said component inversion apparatus invert the front and back The perspective view which shows a mode that the components reverse | inverted front and back are taken out from the said component inversion apparatus. Side view showing the configuration of the component reverse apparatus with the mounting head unit in the implementation form of the component mounting apparatus according to the present invention The side view which shows the state in which the component inversion apparatus of the mounting head part with said component inversion apparatus exists in an inversion position.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 ... Component mounting apparatus 22 ... Component supply part 24 ... Mounting head part 30 ... Component inversion apparatus 32 ... Component storage part 32A ... Through-hole 32B, 32D ... Opening part 34 ... 1st opening / closing door (opening / closing door)
36 ... Second door (open / close door)
38 ... Reversing mechanism P ... Parts S ... Board

Claims (1)

In the component mounting apparatus that holds the component supplied from the component supply unit by the mounting head unit and mounts it on the substrate,
Parts storage part open on both sides;
An openable / closable door that can be opened and closed independently of each other for closing the open parts on both sides of the component housing part;
A reversing mechanism for reversing the component storage portion together with the components in a state in which the door is closed;
Comprising a component reverse apparatus having,
The component mounting device , wherein the component reversing device is provided at a lower end portion of the mounting head portion .

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