JP2005123246A - Electronic component, piezoelectric oscillator, recognition method of built-in electronic component and recognition method of piezoelectric vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which identifies a built-in electronic component mounted in a mold material from the outside of the mold material, a piezoelectric oscillator, a recognition method of the built-in electronic component, and the recognition method of a piezoelectric vibrator. <P>SOLUTION: The electronic component 30 has the built-in electronic component 10, and a molding part covering the built-in electronic component 10 by the mold material 46. The surface of the built-in electronic component 10 is coated with an X-ray absorption material, and an indicator for identifying the built-in electronic is formed. By irradiating such an electronic component 30 with an X-ray, the indicator formed in the built-in electronic component 10 is recognized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component, a piezoelectric oscillator, a method for recognizing a built-in electronic component, and a method for recognizing a piezoelectric vibrator, and in particular, an electronic component suitable for recognizing a built-in electronic component or a piezoelectric vibrator mounted in a mold material. The present invention relates to a piezoelectric oscillator, a method for recognizing a built-in electronic component, and a method for recognizing a piezoelectric vibrator.

  On the outer surface of the built-in electronic component, a sign indicating the accuracy of the built-in electronic component, information on manufacturing, or the like is attached. For example, when the built-in electronic component is a piezoelectric vibrator, a sign indicating the oscillation frequency, manufacturing location, date of manufacture, etc. of the piezoelectric vibrating piece is attached to the outer surface of the package in which the piezoelectric vibrating piece is mounted. FIG. 4 is an explanatory diagram of the sign. The sign 110 is composed of letters, numbers, and the like, and indicates information on accuracy and manufacturing by combining them. The marker 110 is formed by applying ink to the surface of the package 112 or by irradiating a laser beam from a laser marking device to mechanically damage the package 112. Such a marker 110 is provided to identify the piezoelectric vibrator 114.

  FIG. 5 is an explanatory diagram of the piezoelectric oscillator. In the case where the oscillation circuit 116 is connected to the piezoelectric vibrator 114 described above to form the piezoelectric oscillator 118, the oscillation circuit 116 is mounted on the die pad 121 constituting the multilayer lead frame 120, and the lead 122 is arranged on the oscillation circuit 116. There is a configuration in which the piezoelectric vibrator 114 is mounted on the lead 122. Then, a resin-sealed package 124 structure is formed in which the oscillation circuit 116 and the piezoelectric vibrator 114 are collectively molded with a molding material such as resin. In the case of this structure, since the marker 110 attached to the piezoelectric vibrator 114 cannot be confirmed from the outside, the piezoelectric vibrator is coated with ink or irradiated with laser light on the surface of the resin-sealed package 124. The same sign as the sign 110 attached to 114 is attached.

  In addition, it is unknown about a document disclosed that a surface is attached to the surface of an electronic component such as a piezoelectric oscillator in order to identify a built-in electronic component such as a piezoelectric vibrator mounted inside the package.

  By the way, in the configuration in which the periphery of the piezoelectric vibrator is molded with resin, markers for identifying the piezoelectric vibrator must be formed at two locations on the outer surface of the piezoelectric vibrator package and the outer surface of the resin-sealed package. There is a problem that the manufacturing cost increases because of many work processes.

  In addition, in the process before forming the label on the resin-sealed package, the piezoelectric vibrator mounted on the resin-sealed package could not be identified. For this reason, the outer shape of the resin-sealed package is the same, but if piezoelectric oscillators of different types of piezoelectric vibrators are mixed, the piezoelectric vibrator cannot be identified from the outside, and therefore a different label is attached to the resin-sealed package. There was a possibility of shipping the wrong piezoelectric oscillator.

  The present invention has been made to solve the above problems, and recognizes a built-in electronic component or a piezoelectric vibrator covered with a molding material such as a resin from the outside of the molding material, so that the built-in electronic component or piezoelectric device is recognized. An object is to provide an electronic component for identifying a vibrator, a piezoelectric oscillator, a recognition method for a built-in electronic component, and a recognition method for a piezoelectric vibrator.

  In order to achieve the above object, an electronic component according to the present invention is an electronic component having a built-in electronic component and a mold part that covers the built-in electronic component, and identifies the built-in electronic component in the built-in electronic component. It is characterized in that the sign is formed of an X-ray absorber. The X-ray absorber is preferably lead, a lead alloy, gold, tungsten, a tungsten-titanium alloy, or tantalum. In the present invention, a sign is formed only on the built-in electronic component, and no sign is formed on the electronic component in which the built-in electronic component is mounted. For this reason, the built-in electronic component cannot be identified from the outside. However, since the mark attached to the built-in electronic component is formed of an X-ray absorber, the mark portion can absorb X-rays when the electronic component is irradiated with X-rays. That is, when the electronic component is irradiated with X-rays and the electronic component is imaged, it is possible to obtain images having different densities in the marked portion and the portion other than the marked portion. Therefore, even if it is the structure by which the internal electronic component was mounted in the inside of an electronic component, the electronic component which can confirm the label | marker attached | subjected to the internal electronic component from the outside can be formed.

  The piezoelectric oscillator according to the present invention is a piezoelectric oscillator in which a piezoelectric vibrator and an oscillation circuit conducted to the piezoelectric vibrator are sealed with a molding material, and an X-ray absorbing material is applied to the surface of the piezoelectric vibrator. Thus, it is characterized in that a label for identifying the piezoelectric vibrator is formed. In this case, the X-ray absorbing material forms a label indicating either or both of the oscillation frequency of the piezoelectric vibrator and information relating to manufacture. The X-ray absorber is preferably lead, a lead alloy, gold, tungsten, a tungsten-titanium alloy, or tantalum. Since the piezoelectric vibrator is mounted inside the piezoelectric oscillator, the piezoelectric vibrator cannot be visually recognized from the outside of the mold material. However, since the marker is formed on the piezoelectric vibrator by the X-ray absorbing material, the marker part absorbs X-rays. Therefore, by irradiating the piezoelectric oscillator with X-rays, it is possible to form a piezoelectric oscillator capable of recognizing the label attached to the piezoelectric vibrator from the outside of the mold material, that is, the oscillation frequency of the piezoelectric vibrator and information relating to the manufacture.

  The built-in electronic component identification method according to the present invention is characterized in that the above-described electronic component is irradiated with X-rays to recognize a sign. In this case, it is preferable to recognize the X-ray absorber by an X-ray image recognition device. When the electronic component is irradiated with X-rays, the marked portion absorbs X-rays and the other portion transmits X-rays. For this reason, when X-rays transmitted through the electronic component are imaged, the captured images are expressed as different densities in the portion that has absorbed X-rays and the portion that has transmitted X-rays. And if the part which absorbed the X-ray was recognized, the marker formed in the built-in electronic component can be recognized. Therefore, it is possible to identify the built-in electronic component without destroying the electronic component. In addition, since it is not necessary to form the same label as the built-in electronic component on the surface of the electronic component, the manufacturing process of the electronic component can be reduced.

  The piezoelectric vibrator identification method according to the present invention is characterized in that the above-described piezoelectric oscillator is irradiated with X-rays and the characteristics of the piezoelectric vibrator are recognized based on a label formed on the piezoelectric vibrator. . As a result, even if it is configured to be mounted inside the piezoelectric oscillator and the sign formed on the piezoelectric vibrator cannot be seen from the outside, it can be easily attached to the piezoelectric vibrator by irradiating the piezoelectric oscillator with X-rays. Can be recognized. That is, it is possible to recognize the oscillation frequency of the piezoelectric vibrator and the information characteristics relating to the manufacture from the outside of the piezoelectric oscillator. Therefore, the characteristics of the piezoelectric vibrator can be identified by irradiating the X-rays even if the piezoelectric oscillator has the same shape and size, but different information regarding the oscillation frequency and manufacturing of the piezoelectric vibrator. Further, if the marker is formed on the oscillation circuit with the X-ray absorber instead of forming the marker on the piezoelectric vibrator with the X-ray absorber, the oscillation circuit can be identified from the outside.

  Preferred embodiments of an electronic component, a piezoelectric oscillator, a built-in electronic component recognition method, and a piezoelectric vibrator recognition method according to the present invention will be described below. In this embodiment, a mode in which a piezoelectric oscillator is used as an electronic component and a piezoelectric vibrator is used as a built-in electronic component will be described.

  FIG. 1 is an explanatory diagram of a piezoelectric oscillator. The piezoelectric vibrator 10 serving as the built-in electronic component 10 has a piezoelectric vibrating piece 17 mounted on the inner bottom surface of a bowl-shaped package base 16 composed of a bottom surface 12 and a side portion 14 rising from the side of the bottom surface 12. This is a structure in which the upper surface is sealed with a lid 18. An external electrode 20 that is electrically connected to the piezoelectric vibrating piece 17 is formed on the lower surface of the package base 16. Since the piezoelectric vibrating piece 17 is an element that oscillates various frequencies depending on its shape and dimensions, a label indicating the oscillation frequency is formed on the surface of the package 22. In addition, on the surface of the package 22, a sign indicating information related to manufacturing such as a manufacturing lot, a manufacturing location, and a manufacturing date is formed. These signs are made up of letters and numbers. In recent years, since the piezoelectric vibrator 10 has been reduced in size and thickness, it may be difficult to form a sign using letters and numbers. For this reason, it is good also as a label | marker which shows an oscillation frequency etc. combining a dot "*" and a symbol instead of a character and a number. These labels are preferably formed on the surface of the lid 18 having a large area. The sign is formed of an X-ray absorber. The X-ray absorber may be a material having a high X-ray absorption rate, that is, a high density. For example, lead, lead alloy, gold, tungsten, tungsten-titanium alloy, or tantalum is used.

  For example, the label is formed by applying lead to the entire surface of the lid 18 and then irradiating the surface of the lid 18 with a laser beam from a laser marking device to scrape the lead. Alternatively, lead may be included in the ink, and the lead-containing ink may be printed on the surface of the lid 18 to form a marker. It is also possible to mix lead in the paste material and apply the lead-containing paste material to the surface of the lid 18 to form a mark. Alternatively, a mask for forming a mark may be provided on the surface of the lid 18, and a metal such as gold may be formed by a film forming method such as sputtering, and then the mark may be formed by removing the mask. In addition, what is necessary is just to select suitably the film thickness of lead and a metal film, and the lead content when making an ink or a paste material contain lead in consideration of the amount of X-ray permeation.

  The piezoelectric vibrator 10 is mounted on a laminated lead frame 34 together with a semiconductor integrated circuit (IC) chip 32 constituting an oscillation circuit. The laminated lead frame 34 includes a die pad 36, an upper lead 38 and a lower lead 40. An IC chip 32 is mounted on the die pad 36 via an adhesive. Further, the upper leads 38 are respectively provided at four corners corresponding to the outer shape of the piezoelectric vibrator 10, and the piezoelectric vibrator 10 is mounted via a conductive adhesive. The upper lead 38 is connected to the external electrode 20 of the piezoelectric vibrator 10, a connection terminal 42 is formed from the connection terminal 42, and a wire bonding pad (not shown) is connected to the IC chip 32. It is composed of A plurality of lower leads 40 are provided on the lower side of the die pad 36, and are formed so as to rise from the mounting terminals 44 when the piezoelectric oscillator 30 is mounted on a mounting substrate (not shown), and from the mounting terminals 44. It is composed of a wire bonding pad (not shown) that is electrically connected to the IC chip 32. The wire bonding pad of the upper lead 38 and the wire bonding pad of the lower lead 40 are formed in the same plane, and the die pad 36 is provided in this plane.

  The entire periphery of the piezoelectric vibrator 10 and the IC chip 32 mounted on the laminated lead frame 34 is sealed with a molding material 46 such as a resin to constitute a resin sealed package 48. At this time, the lower surface of the mounting terminal 44 is exposed from the molding material 46. This configuration is the piezoelectric oscillator 30 in which the piezoelectric vibrator 10 and the oscillation circuit are mounted inside the resin-sealed package 48. That is, the electronic component 30 in which the built-in electronic component 10 is mounted inside the molding material 46 is obtained.

  In such a piezoelectric oscillator 30, since the piezoelectric vibrator 10 is mounted inside the resin-sealed package 48, the sign formed on the surface of the piezoelectric vibrator 10 cannot be directly visually recognized. However, when the piezoelectric oscillator 30 is irradiated with X-rays, the X-rays pass through the piezoelectric oscillator 30 and the inside can be confirmed. At this time, since the marker formed on the piezoelectric vibrator 10 is formed of a material that absorbs X-rays, when the piezoelectric oscillator 30 is irradiated with X-rays, it is possible to distinguish between a portion that transmits X-rays and a portion that does not transmit X-rays. it can. The sign can be recognized by reading the portion that does not transmit X-rays. Next, an X-ray recognition apparatus that recognizes the marker of the piezoelectric vibrator 10 by irradiating the piezoelectric oscillator 30 with X-rays will be described.

  FIG. 2 is an explanatory diagram of the X-ray recognition apparatus. The X-ray recognition apparatus 60 includes a work table moving unit 62 that moves in the horizontal direction, and a work table 64 is provided on the work table moving unit 62. The work table moving unit 62 and the work table 64 are made of a material that transmits X-rays, and a plurality of piezoelectric oscillators 30 are placed on the work table 64. An X-ray generation unit 66 is provided below the work table moving unit 62 and is arranged so that X-rays are emitted from the X-ray generation unit 66 toward the piezoelectric oscillator 30. An X-ray imaging unit 68 is provided on the opposite side of the X-ray generation unit 66 with respect to the work table moving unit 62. The X-ray imaging unit 68 is disposed with the light receiving unit facing the piezoelectric oscillator 30 so as to receive the X-rays transmitted through the piezoelectric oscillator 30.

  The X-ray imaging unit 68 is connected to the image recognition unit 70, converts the X-ray received by the X-ray imaging unit 68 into an electrical signal, and outputs the electrical signal to the image recognition unit 70 as image information. The image recognition unit 70 is connected to the control unit 72. The image recognition unit 70 is configured to recognize a marker attached to the piezoelectric vibrator 10 from the image information based on a recognition command input from the control unit 72. And it is the structure which outputs the recognized result to the control part 72 as recognition information. The control unit 72 is connected to the work table moving unit 62 and outputs movement control information for instructing movement of the work table moving unit 62 from the control unit 72 to the work table moving unit 62. Further, the control unit 72 is connected to a display unit (not shown) provided outside the X-ray recognition apparatus 60 and outputs the recognition information input from the image recognition unit 70 to the display unit.

  Next, the operation of recognizing the marker attached to the piezoelectric vibrator 10 by the X-ray recognition device 60 will be described. FIG. 3 shows a flow for performing recognition. First, the plurality of piezoelectric oscillators 30 are placed on the work table 64. At this time, if the piezoelectric oscillators 30 are placed in a matrix, the efficiency of the recognition work is improved. When the recognition operation is started, the work table moving unit 62 moves so that the piezoelectric oscillator 30 is positioned on the line formed by the X-ray generation unit 66 and the X-ray imaging unit 68 (S100). In this movement, the piezoelectric oscillator 30 is placed at a predetermined position, and the position of the piezoelectric oscillator 30 is set in the work table moving unit 62. When the recognition work is started, the work table 64 is moved based on the setting. What is necessary is just to comprise so that it may move. When the piezoelectric oscillator 30 comes to a predetermined position and the work table moving unit 62 stops, the piezoelectric oscillator 30 is irradiated with X-rays (S110). At this time, the piezoelectric oscillator 30 is continuously imaged by the X-ray imaging unit 68 provided on the top of the piezoelectric oscillator 30 (S120). The X-ray imaging unit 68 converts the image of the piezoelectric oscillator 30 into an electrical signal, and continuously outputs it as image information to the image recognition unit 70. Further, the control unit 72 outputs a recognition command instructing the image recognition unit 70 to perform image recognition. The image recognition unit 70 acquires image information that is continuously input based on the recognition command. By the way, when the piezoelectric oscillator 30 is imaged with X-rays, the inside of the piezoelectric oscillator 30 is recorded. For this reason, the label portion formed of the X-ray absorbing material absorbs X-rays, and the other portions transmit X-rays. Therefore, the label portion and other portions are recorded at different concentrations. At this time, when the X-ray transmission amount is large, when the density is displayed light (dark), the sign portion is displayed dark (light). At this time, the recognition of the label first specifies (specific range) the range in which the label is predicted to be formed. When the piezoelectric oscillator 30 is placed at a predetermined position of the work table 64, the work table moving unit 62 also moves in accordance with the position of the piezoelectric oscillator 30, so that the marker provided on the piezoelectric vibrator 10 is always displayed. It falls within a specific range. Then, within the specific range, a portion where the density of the recorded image is darker (lighter) than a preset threshold is extracted, and the extracted portion is recognized (S130). The character recognition result is output to the control unit 72 as recognition information. The control unit 72 outputs the recognition information to the display unit and displays the recognition result on the display unit (S140). Further, the control unit 72 outputs movement control information for moving the piezoelectric oscillator 30 to the work table moving unit 62 in order to perform the next recognition operation of the piezoelectric oscillator 30. When the work table moving unit 62 moves based on the movement control information (S100), the operations of S110 to S140 described above are repeated to recognize the piezoelectric oscillator 30. When the recognition of all the piezoelectric oscillators 30 placed on the work table 64 is completed, the recognition work is finished.

  In this way, a marker is formed on the surface of the piezoelectric vibrator 10 with a material that absorbs X-rays, and this piezoelectric vibrator 10 is mounted inside the resin-sealed package 48. The marker attached to the piezoelectric vibrator 10 can be easily recognized from the outside of the resin-sealed package 48 simply by irradiating with X-rays. Then, since information on the piezoelectric vibrator 10 is obtained by recognizing the sign, the piezoelectric vibrator 10 can be identified without destroying the piezoelectric oscillator 30.

  In the prior art, a sign is formed on the surface of the piezoelectric vibrator 10 and the same sign as the piezoelectric vibrator 10 is formed on the surface of the piezoelectric oscillator 30 on which the piezoelectric vibrator 10 is mounted. In the embodiment, it is not necessary to form a mark on the surface of the piezoelectric oscillator 30. For this reason, the process of manufacturing the piezoelectric oscillator 30 can be shortened, and also the manufacturing cost can be reduced.

It is explanatory drawing of the piezoelectric oscillator which concerns on this Embodiment. It is explanatory drawing of the X-ray recognition apparatus which concerns on this Embodiment. It is a flow of recognition work concerning this embodiment. It is explanatory drawing of a label | marker. It is explanatory drawing of a piezoelectric oscillator.

Explanation of symbols

10 ......... Piezoelectric vibrator (built-in electronic component), 17 ......... Piezoelectric vibrating piece, 18 ......... Lid, 20 ......... External electrode, 30 ......... Piezoelectric oscillator (electronic component), 32 ......... Semiconductor Integrated circuit (IC) chip 34... Laminated lead frame 36... Die pad 42... Connection terminal 44... Mounting terminal 48. Recognition device 62... Work table moving unit 66 66 X-ray generation unit 68 68 X-ray imaging unit 70 70 Image recognition unit 72 72 Control unit

Claims (7)

  An electronic component having a built-in electronic component and a mold part that covers the built-in electronic component, wherein an indicator for identifying the built-in electronic component is formed on the built-in electronic component with an X-ray absorber. .   The electronic component according to claim 1, wherein the X-ray absorbing material is lead, a lead alloy, gold, tungsten, a tungsten-titanium alloy, or tantalum.   In a piezoelectric oscillator in which a piezoelectric vibrator and an oscillation circuit connected to the piezoelectric vibrator are sealed with a molding material, an X-ray absorbing material is applied to the surface of the piezoelectric vibrator, and a label for identifying the piezoelectric vibrator is provided. A piezoelectric oscillator characterized by being formed.   4. The piezoelectric oscillator according to claim 3, wherein a label indicating either or both of an oscillation frequency of the piezoelectric vibrator and manufacturing information is formed by the X-ray absorbing material.   A method for recognizing a built-in electronic component, wherein the electronic component according to claim 1 or 2 is irradiated with X-rays to recognize a sign.   6. The method for recognizing a built-in electronic component according to claim 5, wherein the X-ray absorber is recognized by an X-ray image recognition device. A method for recognizing a piezoelectric vibrator, comprising irradiating the piezoelectric oscillator according to claim 3 or 4 with X-rays and recognizing characteristics of the piezoelectric vibrator based on a marker formed on the piezoelectric vibrator.

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