JP2005352790A - Individual memory card and printing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printing method of an individual memory card, capable of identifying a manufacturing date, a manufacturing line, etc. in the event that the resin case is removed and the board assembly is isolated when a problem occurs and the card is disassembled for a check on its contents. <P>SOLUTION: The printing method of an individual memory card prints a character, a mark, or a number with a laser light L on a surface of a resin case 2 of the individual memory card 1 where components such as a semiconductor device 3a sealed by resin are stored inside the resin case 2, and, at the same time, prints all or a part of an identical character, an identical mark, and an identical number on the resin surface of the component 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an individual memory card printing method for printing management information of characters, symbols, or numbers on an individual memory card.

  Individual memory cards such as memory sticks (trademarks of Sony Corporation) and PC cards have a resin-encapsulated semiconductor device (IC) and passive elements mounted on one shell of a resin case that is divided into two. An electronic circuit board (hereinafter simply abbreviated as “substrate assembly”) is housed, and the other shell is covered from above with an ultrasonic wave.

  Management information such as letters, symbols, or numbers (hereinafter simply referred to as “management information”) is printed on the surface of the resin case, and usually on the surface of the sealing resin of one semiconductor device, Unique management information different from the management information printed on the resin case is printed.

  There may be problems with the individual memory card, which may require disassembly and review. In such a case, it is necessary to disassemble the resin case and take out the substrate assembly. Since the resin case is usually welded as described above, the decomposition is almost a destructive operation. For this reason, the printed shell is often missing, or it may not be possible to have a one-to-one correspondence with the substrate assembly.

  The present invention is intended to solve such a problem, and when a problem occurs and the contents are to be disassembled and examined, even if the resin case is removed and the substrate assembly is made alone, the manufacturing date and It is an object of the present invention to obtain a printing method for an individual memory card that can specify a production line.

  Therefore, the solid memory card of the present invention has the same letter, symbol, or number at the same position on the surface of the resin case and the surface of a component such as a semiconductor device sealed with resin inside the resin case. It is printed by melting.

  In addition, the solid memory card printing method of the present invention is characterized in that a laser beam is used to characterize the surface of the resin case of the individual memory card in which a resin-sealed part such as a semiconductor device is housed in the resin case. By printing a symbol or a number, all or a part of the same character, symbol, or number is simultaneously printed on the resin surface of the component.

  Therefore, according to the solid memory card printing method of the present invention, the same management information is simultaneously printed on the surface of the resin case and the sealing resin of a component such as a semiconductor device housed in the resin case. Can do.

Therefore, according to the present invention,
1. The manufacturing date and manufacturing line can be specified even when the resin case is removed and the board assembly is made alone. The effect that the resin case and the substrate assembly can be printed in one step is obtained.

  The present invention irradiates the surface of the resin case of a solid memory card containing a semiconductor device or the like sealed with resin inside the resin case with laser light, and manages information by the thermal energy. Print. At that time, the laser beam passes through the resin case, and all or a part of the same management information can be simultaneously printed on the resin surface of the component.

  Hereinafter, the individual memory card and the printing method thereof according to the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a state in which management information is printed on the front surface of a memory stick using a laser beam by the printing method of the individual memory card of the present invention, and FIG. 2 is a view showing the same management information printed. FIG. 5 is an exploded view showing a resin case and a substrate assembly.

  The figure shows a memory stick as an individual memory card. As shown in FIG. 2, the memory stick 1 includes a resin case 2, semiconductor devices 3a and 3b, an electronic circuit board 4 on which components such as passive elements (not shown) are soldered, and the electronic circuit board. 4 and a substrate assembly 6 composed of a plurality of electrode terminals 5 and the like formed at the front end portion.

  The resin case 2 is composed of a main body shell 2a and a lid shell 2b. A substrate assembly 6 is accommodated inside the main body shell 2, and the lid shell 2b is fitted from above and welded by ultrasonic waves. . A plurality of slits 3c are formed corresponding to the electrode terminals 5 of the lid shell 2b.

  The resin of the resin case 2 is a polycarbonate resin, and the sealing resin of the semiconductor devices 3a and 3b is an epoxy resin whose main raw material is mixed with carbon and filler.

  By irradiating the surface of the memory stick 1 with the laser beam L from the lid shell 2b side, the management information A, B, C consisting of required characters, symbols, or numbers is printed. Then, the thermal energy passes through the lid shell 2b, reaches the sealing resin of the semiconductor device 3a existing under the lid shell 2b, and also on the surface of the sealing resin as described above. Management information A, B, and C are printed.

  Therefore, it is possible to perform printing in which the management information of the lid shell 2b and the board assembly 6 coincides, and management becomes easy. In the case of this example, since the position of the semiconductor device 3a coincides with the printed portion of the lid shell 2b, the same management information A, B, C is shown in the printed state. If the position of 3a is shifted, only a part of the management information A, B, and C is printed. Even if there is such a misalignment, management is easy if the main information portion is printed.

  Printing with laser light was performed using SL475K manufactured by NEC Corporation, with the current value set to 16.5 A, the character writing speed set to 130 mm / sec, and the laser frequency set to 1.5 kHz.

  In the above embodiment, a memory stick is used as the individual memory card. However, it should be noted that the present invention can be applied to an SD card, a compact flash (registered trademark), and the like.

It is the perspective view seen from the back surface side which shows the state which is printing the management information on the surface of a memory stick using the laser beam by the printing method of the solid memory card of this invention. FIG. 2 is an exploded view showing a resin case and a substrate assembly printed with the same management information.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Memory stick, 2 ... Resin case, 2a ... Main body shell, 2b ... Cover body shell, 3a, 3b ... Semiconductor device, 4 ... Electronic circuit board, 5 ... Electrode terminal, 6 ... Board assembly, L ... Laser beam

Claims (4)

  The same character, symbol, or number is printed by melting at the same position on the surface of the resin case and the surface of a component such as a semiconductor device sealed with resin inside the resin case. Solid memory card.   A letter, a symbol, or a number is printed with a laser beam on the surface of the resin case of a solid memory card containing a semiconductor device or the like sealed with resin inside the resin case. A method for printing an individual memory card, wherein all or part of similar characters, symbols, or numbers are printed on a resin surface.   2. The solid memory card printing method according to claim 1, wherein the component is the semiconductor device. 2. The solid memory card printing method according to claim 1, wherein the resin of the resin case is a polycarbonate resin, and the sealing resin is mainly an epoxy resin.

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