JP2005117123A - Image sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image sensor module capable of properly suppressing electromagnetic noise exerted on a fitting object member while simplifying the entire structure and reducing the cost more than prior arts. <P>SOLUTION: The image sensor module A1 is provided with: a substrate 1 having a front side 10a and a rear side 10b; an image sensor chip 2 mounted on the front side 10a of the substrate 1; and a wire member 4 connected to the substrate 1. The wire member 4 is provided with an electromagnetic shield layer, and the electromagnetic shield layer is provided on the rear side 10b of the substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an image sensor module used as a component of a mobile phone with a camera function.

  As an example of a conventional image sensor module, an image sensor chip and a lens unit for linking a subject image on the image sensor chip are mounted on a rectangular plate-shaped substrate, and the substrate is flexible. There is one to which a wiring board is connected (see, for example, Patent Document 1). Power supply to the image sensor chip and signal input / output are performed through the flexible wiring board. The image sensor module having such a configuration is mounted, for example, on a mother board in a casing of a mobile phone, whereby the mobile phone has a camera function.

  The image sensor module may generate electromagnetic noise from the image sensor chip. For this reason, it is desirable to prevent the electronic components on the mother board from being adversely affected by the electromagnetic noise.

  Therefore, conventionally, each of the substrate of the image sensor module and the flexible wiring board is provided with an electromagnetic shielding function. As a means for providing the substrate with an electromagnetic shielding function, for example, the substrate is made of a laminated structure in which a plurality of plate-like members are bonded, and a metal layer that exhibits the electromagnetic shielding function is provided between the plurality of plate-like members. It was. Moreover, about the flexible wiring board, the structure which affixes metal foil, for example on the substantially whole surface of this flexible wiring board was employ | adopted.

Conventionally, means for providing an electromagnetic shield function on the mother board side has been adopted instead of the above means.
JP 2003-244508 A

  However, as described above, in the means for providing each of the substrate of the conventional image sensor module and the flexible wiring board with an electromagnetic shielding function, it is necessary to form the substrate in a multi-layer structure. The structure becomes complicated and the manufacturing cost becomes high. Further, in the means for providing an electromagnetic shield function on the mother board side of the above prior art, it is necessary to cover a wide area of electronic components and wiring portions on the mother board side with an electromagnetic shield layer, and the cost for that is further increased.

  The present invention has been conceived under the circumstances described above, and it is possible to appropriately apply electromagnetic noise to a member to be attached while simplifying the overall structure and reducing the cost as compared with the prior art. An object of the present invention is to provide an image sensor module that can be suppressed.

  In order to solve the above problems, the present invention takes the following technical means.

  An image sensor module provided by the present invention includes a substrate having a front surface and a back surface, an image sensor chip mounted on the surface of the substrate, and a wiring member connected to the substrate. In the module, the wiring member includes an electromagnetic shield layer, and the electromagnetic shield layer is arranged on the back side of the substrate.

  In the present invention, the wiring member is a flexible wiring board having a resin film on which a wiring pattern is formed, and the electromagnetic shielding layer is formed by laminating the resin film and is grounded. It can be set as the structure which is a film | membrane.

  According to the present invention, the electromagnetic shielding layer of the wiring member can prevent the generation of electromagnetic noise from the wiring member or prevent the wiring in the wiring member from receiving external noise. In addition, the effect of blocking electromagnetic noise that has progressed from the image sensor chip to the back side of the substrate is also exhibited. Therefore, unlike the prior art, it is not necessary to provide the substrate itself with an electromagnetic shielding function, and the configuration of the substrate can be simplified correspondingly. As a means for arranging the electromagnetic shielding layer on the back side of the substrate, it is only necessary to arrange the wiring member itself on the back side of the substrate, and there is no problem of increasing the number of components. Therefore, the overall manufacturing cost can be reduced. Of course, it is not necessary to provide a large electromagnetic shielding function on the member to which the image sensor module according to the present invention is attached.

  In a preferred embodiment of the present invention, the wiring member has one end connected to the substrate, and the region near the other end protrudes from the back side of the substrate to one side. It is said that. According to such a configuration, the protruding portion of the wiring member is provided with flexibility, and the operation of electrically connecting the wiring member to a desired portion can be easily performed.

  In a preferred embodiment of the present invention, one end of the wiring member is connected to the front surface of the substrate, and a folded portion is provided in part so that the wiring member wraps around the back side of the substrate. According to such a configuration, the electromagnetic shielding layer can be easily arranged on the back surface side of the substrate by causing the wiring member to go around the back surface side of the substrate. Since one end of the wiring member is configured to be connected to the surface of the substrate, a wiring pattern for an image sensor chip may be formed on the surface of the substrate, and a wiring pattern is formed on the back surface of the substrate. do not have to.

  In a preferred embodiment of the present invention, one end of the wiring member is connected to the back surface of the substrate. According to such a configuration, it is not necessary to provide a folded portion on the wiring member. Since the folded portion protrudes from the substrate, if this portion is eliminated, the entire size can be reduced accordingly.

  In a preferred embodiment of the present invention, the back surface of the substrate and the wiring member are bonded. According to such a configuration, the image sensor module can be attached to the desired attachment object by a simple operation, for example, by bonding the wiring member to the desired attachment object.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  1 to 3 show an embodiment of an image sensor module according to the present invention. As clearly shown in FIG. 1, the image sensor module A <b> 1 of the present embodiment has the image sensor chip 2 and the lens unit 3 mounted on the surface 10 a of the substrate 1, and the flexible wiring board 4 is mounted on the substrate 1. Are connected.

  The substrate 1 has a rectangular plate shape, and is, for example, an insulating substrate made of ceramic or glass epoxy resin. A wiring pattern (not shown) for supplying power to the image sensor chip 2 and inputting / outputting signals is formed on the surface 10 a of the substrate 1. The image sensor chip 2 is, for example, an area CCD chip or a C-MOS area image sensor chip. On the upper surface of the image sensor chip 2, a light receiving region 20 in which a plurality of dot-shaped light receiving portions are arranged in a matrix is provided. (See FIG. 2). In the image sensor chip 2, when each light receiving unit receives light, an image signal having an output level corresponding to the amount of received light can be output in a predetermined order.

  The lens unit 3 has a configuration in which an imaging lens 31 is held on a frame 30. The frame 30 is fixedly attached to the substrate 1 so as to surround the periphery of the image sensor chip 2. The lens 31 is a combination lens in which two single lenses 31 a and 31 b are combined, for example, and focuses the light traveling from the subject to form an image of the subject on the light receiving region 20 of the image sensor chip 2. Play a role. The lens 31 is fixed to the frame 30 by being pressed by a pressing plate 32 having a hole 32a. An optical filter 33 supported by the frame 30 is provided between the lens 31 and the image sensor chip 2. The optical filter 33 exhibits a function of blocking light in a specific band, and is useful for capturing a clear subject image.

  The flexible wiring board 4 has a flat band shape, and one end portion 40a in the longitudinal direction thereof is connected to a terminal portion to be described later on the surface 10a of the substrate 1. Near the one end portion 40a of the flexible wiring board 4, there is provided a substantially U-shaped folded portion 40c obtained by folding the flexible wiring board 4 in the direction of the arrow N1 from a state where the flexible wiring board 4 is extended as indicated by a virtual line in FIG. ing. Thus, the other part of the flexible wiring board 4 wraps around the back surface 10 b side of the substrate 1, that is, behind the substrate 1.

  As shown in FIG. 3, the flexible wiring board 4 is entirely flexible, and is a conductor as a wiring portion patterned between a synthetic resin base film 41a and a coverlay film 41b. The layer 42 is sandwiched between the base film 41a and the coverlay film 41b, and an electromagnetic shield layer 43 and an outer layer cover film 44 covering the layer 42 are laminated on the outer surface side. doing. One end of the conductor layer 42 is conductively connected to the terminal portion 11 of the wiring pattern formed on the surface 10a of the substrate 1 through, for example, solder H. The electromagnetic shield layer 43 is formed by, for example, forming a vapor deposition film of a metal such as silver over substantially the entire area of one side of the outer layer cover film 44. The electromagnetic shield layer 43 and the outer cover film 44 are bonded to the base film 41a or the coverlay film 41b by, for example, thermocompression bonding. Although not shown in the drawing, through holes are provided in the flexible wiring board 4 and the electromagnetic shield layer 43 and the wiring portion for ground connection of the conductor layer 42 are electrically connected. As a result, the electromagnetic shield layer 43 is set to the ground potential and exhibits a suitable electromagnetic shielding effect.

  As shown in FIGS. 1 and 2, a socket-type or plug-type connector 5 is connected to the other end portion 40 b in the longitudinal direction of the flexible wiring board 4. Electrical connection of the flexible wiring board 4 to a predetermined device can be performed using this connector 5. A region S having an appropriate length near the other end 40 b in the longitudinal direction of the flexible wiring board 4 protrudes to the side of the substrate 1. Therefore, the flexible wiring board 4 exhibits flexibility in the protruding area S, and the connector 5 can be easily connected to a counterpart connector to be connected. The width of the portion of the flexible wiring board 4 that overlaps the substrate 1 is substantially equal to the width of the substrate 1. The width of the electromagnetic shield layer 43 is substantially the same as those, and the electromagnetic shield layer 43 is overlapped with substantially the entire back surface 10b side of the substrate 1. Moreover, in this embodiment, the back surface 10b of the board | substrate 1 and the flexible wiring board 4 are adhere | attached with the adhesive agent or the thermocompression-bonding means. However, this invention is not limited to this, The board | substrate 1 and the flexible wiring board 4 can also be set as the structure which has not adhere | attached.

  Next, the operation of the image sensor module A1 described above will be described.

  First, the image sensor module A1 is used by being incorporated in a casing of a mobile phone. In this case, as shown in FIG. 1, the flexible wiring board 4 is brought into contact with the mother board 6 of the mobile phone so as to be mounted. The mother board 6 is mounted with various electronic components such as a CPU for controlling each part of the mobile phone and a memory attached to the CPU. When mounting the image sensor module A1, the flexible wiring board 4 may be bonded to the mother board 6 by using an adhesive or the like. As described above, since the region S near the other end portion 40b of the flexible wiring board 4 exhibits flexibility, it is difficult to connect the connector 5 to a predetermined location even if the above-described bonding is performed. There is no such trouble.

  Next, when the image sensor chip 2 is driven, electromagnetic noise may be generated from the image sensor chip 2. On the other hand, the electromagnetic shield layer 43 of the flexible wiring board 4 is located behind the substrate 1. Therefore, the electromagnetic noise that tends to travel from the image sensor chip 2 to the back of the substrate 1 is appropriately shielded by the electromagnetic shield layer 43, and the mother board 6 can be prevented from being adversely affected by the electromagnetic noise. The flexible wiring board 4 may emit noise from the wiring portion, but this noise is also shielded by the electromagnetic shield layer 43. Further, since the wiring portion of the flexible wiring board 4 is sandwiched between the two electromagnetic shield layers 43, the wiring portion is also prevented from picking up external noise.

  As described above, the electromagnetic shield layer 43 of the flexible wiring board 4 is used to prevent electromagnetic noise from reaching the mother board 6. Therefore, the image sensor module A 1 needs to provide an electromagnetic shield layer on the substrate 1. Absent. Therefore, it is possible to simplify the configuration of the substrate 1 and reduce the overall cost. In the present embodiment, since the electromagnetic shield layer 43 overlaps substantially the entire back surface 10b of the substrate 1, the electromagnetic shield effect is more excellent. Further, in this image sensor module A1, a folded portion 40c is provided on the flexible wiring board 4 as means for disposing the flexible wiring board 4 behind the substrate 1, and a terminal part electrically connected to the flexible wiring board 4 is provided. 11 is provided on the surface 10 a of the substrate 1. Therefore, although the flexible wiring board 4 is disposed on the back surface 10b of the substrate 1, it is not necessary to provide the terminal portion 11 on the back surface 10b of the substrate 1, and the wiring pattern can be easily formed on the substrate 1. .

  FIG. 4 shows another embodiment of the image sensor module according to the present invention. However, in the same figure, the same code | symbol as the said embodiment is attached | subjected to the element which is the same as that of the said embodiment, or similar.

  In the image sensor module A2 of the present embodiment, the terminal portion 11 is provided on the back surface 10b of the substrate 1, and the wiring pattern of the flexible wiring board 4 is conductively connected to the terminal portion 11. Of course, the flexible wiring board 4 is disposed on the back surface 10b side of the substrate 1 and includes an electromagnetic shield layer (not shown). Although not shown in the drawing, as means for providing the terminal portion 11 on the back surface 10b of the substrate 1, for example, means for forming a through hole in the substrate 1, or a wiring pattern formed on the surface 10a of the substrate 1 is used. 1 is used so as to reach the back surface 10b via one side surface.

  In this embodiment, since the electromagnetic shield layer of the flexible wiring board 4 is arranged on the back surface 10b side of the substrate 1, in addition to obtaining the same electromagnetic shielding effect as in the above embodiment, the flexible wiring board 4 Since it is not necessary to provide a substantially U-shaped folded portion, there is no protruding portion for folding the flexible wiring board 4 on one side of the substrate 1. Therefore, the overall size can be reduced. Also in the present embodiment, the portion of the flexible wiring board 4 that overlaps the substrate 1 may be either a configuration that adheres to the substrate 1 or a configuration that does not adhere.

  The present invention is not limited to the embodiment described above. The specific configuration of each part of the image sensor module according to the present invention can be varied in design in various ways.

  For example, the electromagnetic shielding layer of the wiring member can be formed in one layer instead of two layers. The electromagnetic shield layer is preferably formed to a size covering substantially the entire back surface of the substrate, but is not limited to this, and may be formed to a size smaller than the substrate. The specific means for providing the electromagnetic shielding layer on the wiring member is not particularly limited. In addition, the image sensor module according to the present invention is optimal for use in a cellular phone, but it does not ask the specific application.

It is sectional drawing which shows one Embodiment of the image sensor module which concerns on this invention. FIG. 2 is a partially exploded schematic perspective view of the image sensor module shown in FIG. 1. It is a principal part expanded sectional view of the image sensor module shown in FIG. It is sectional drawing which shows other embodiment of the image sensor module which concerns on this invention.

Explanation of symbols

A1, A2 Image sensor module 1 Substrate 2 Image sensor chip 4 Flexible wiring board 10a Surface (of substrate)
10b Back side (on board)
43 Electromagnetic shield layer

Claims (6)

An image sensor module comprising a substrate having a front surface and a back surface, an image sensor chip mounted on the surface of the substrate, and a wiring member connected to the substrate,
The image sensor module according to claim 1, wherein the wiring member includes an electromagnetic shield layer, and the electromagnetic shield layer is disposed on the back side of the substrate.   The wiring member is a flexible wiring board having a resin film on which a wiring pattern is formed, and the electromagnetic shielding layer is a metal film formed by being laminated on the resin film and connected to the ground. Item 6. The image sensor module according to Item 1.   3. The wiring member according to claim 2, wherein one end portion of the wiring member is connected to the substrate, and a region near the other end portion protrudes from the back surface side of the substrate to one side thereof. Image sensor module.   4. The wiring member according to claim 1, wherein one end portion of the wiring member is connected to the front surface of the substrate and a part of the wiring member is provided with a folded portion so that the wiring member wraps around the back surface side of the substrate. Image sensor module.   The image sensor module according to claim 1, wherein one end portion of the wiring member is connected to a back surface of the substrate.   The image sensor module according to claim 1, wherein the back surface of the substrate and the wiring member are bonded to each other.

Images