JP4671324B2 - SMD type side mount parts - Google Patents

SMD type side mount parts Download PDF

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JP4671324B2
JP4671324B2 JP2004210888A JP2004210888A JP4671324B2 JP 4671324 B2 JP4671324 B2 JP 4671324B2 JP 2004210888 A JP2004210888 A JP 2004210888A JP 2004210888 A JP2004210888 A JP 2004210888A JP 4671324 B2 JP4671324 B2 JP 4671324B2
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mounting
circuit board
electrode
smd type
type side
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JP2006032741A (en
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剛 三浦
正樹 奥脇
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

本発明は、携帯電話など民生用電子機器向けのＳＭＤ型側面実装部品に係わり、詳しくは、ＳＭＤ型側面実装部品の端子構造に関する。   The present invention relates to an SMD type side mounting component for consumer electronic equipment such as a mobile phone, and more particularly to a terminal structure of an SMD type side mounting component.

従来、パソコン、携帯電話などの民生用電子機器向けのＳＭＤ型側面実装部品として、ガラスエポキシ樹脂などよりなり表面に導電パターンを有する回路基板と、該回路基板上に実装された発光素子および受光素子などよりなる光素子と、前記回路基板上に実装されると共に、前記光素子に接続される回路部と、前記回路基板の側端部に形成され、前記光素子および回路部に導電パターンを介して接続される複数個の実装用電極と、前記光素子および回路部を封止する透光性樹脂と、前記光素子に対応する位置に透孔部を有し、且つ実装用電極が形成されている面に対応する部分に開口部を有し、前記光素子および回路部を覆うシールドカバーを具備したＳＭＤ型側面実装部品の構造が提案されている。（例えば、特許文献１参照）
特開平１０−４１５４０号（第２〜３頁、図１〜図６） Conventionally, as an SMD type side mounting component for consumer electronic devices such as personal computers and mobile phones, a circuit board made of glass epoxy resin and having a conductive pattern on the surface, and a light emitting element and a light receiving element mounted on the circuit board And an optical element mounted on the circuit board, connected to the optical element, and formed on a side end of the circuit board, with a conductive pattern interposed between the optical element and the circuit part. A plurality of mounting electrodes connected to each other, a translucent resin that seals the optical element and the circuit portion, a through hole portion at a position corresponding to the optical element, and a mounting electrode is formed. There has been proposed a structure of an SMD type side surface mounting component having an opening in a portion corresponding to a surface on which a shield cover is provided to cover the optical element and the circuit portion. (For example, see Patent Document 1)
Japanese Patent Laid-Open No. 10-41540 (pages 2 and 3, FIGS. 1 to 6)

上記した特許文献１に開示されている赤外線送受信モジュールの構造は、図６〜図９に示すように、ガラスエポキシ樹脂、ＢＴレジンなどの耐熱性および絶縁性を有する回路基板２０は、その表面に導電パターン（図示せず）が印刷、蒸着などで形成されている。２１は、高速赤外ＬＥＤからなる発光素子であり、２２はフォトダイオードからなる受光素子である。この発光素子２１と受光素子２２は、それぞれ回路基板２０上に実装されており、導電パターンのダイボンドおよびワイヤボンドされて接続されている。２３はアンプ、ドライブ回路などが組み込まれているＩＣからなる回路部であり、回路基板２０上に実装されると共に、その導電パターンを介して発光素子２１と受光素子２２に接続されている。   As shown in FIGS. 6 to 9, the structure of the infrared transmission / reception module disclosed in Patent Document 1 described above is such that a circuit board 20 having heat resistance and insulation properties such as glass epoxy resin and BT resin is formed on the surface thereof. A conductive pattern (not shown) is formed by printing, vapor deposition, or the like. Reference numeral 21 denotes a light emitting element made of a high-speed infrared LED, and reference numeral 22 denotes a light receiving element made of a photodiode. The light emitting element 21 and the light receiving element 22 are respectively mounted on the circuit board 20, and are connected by die bonding and wire bonding of a conductive pattern. Reference numeral 23 denotes a circuit unit including an IC in which an amplifier, a drive circuit, and the like are incorporated. The circuit unit 23 is mounted on the circuit board 20 and is connected to the light emitting element 21 and the light receiving element 22 through the conductive pattern.

２４は、前記回路基板２０の側端部に形成された複数の実装用電極であり、実装する際に底面および側面となる基板の２つの面にかけて印刷、蒸着などにより形成されており、該実装用電極２４はスルーホール電極となっている。２５は、前記発光素子２１、受光素子２２および回路部２３を封止する可視光カット剤入りエポキシ系樹脂などの透光性樹脂である。前記発光素子２１、受光素子２２および回路部２３を保護すると共に、レンズ状に形成されて光の照射およぶ集光する機能を有するものである。２６は、略箱状をした金属製のシールドカバーである。該シールドカバー２６は、透光性樹脂２５で封止された発光素子２１、受光素子２２および回路部２３と回路基板２０を、光を受発光する方向から覆うものであり、発光素子２１と受光素子２２に対応する位置に発光・受光を妨げないようにするための透光部２６ａ、２６ｂが設けられている。また、シールドカバー２６には、電磁波のノイズ防止機能を有すると共に、回路基板２０の実装用電極２４が形成されている方向に開口部２６ｃ、２６ｄを有し、前記実装用電極２４が隠れないように構成せれている。さらにシールドカバー２６には、実装用電極２４が形成されている回路基板２０の２つの面に対して面一になるように突出した第１および第２のダミー電極２６ｅ、２６ｆが配設されていて、該ダミー電極２６ｅ、２６ｆを前記実装用電極２４と共に、半田などにより外部プリント基板２７に固着することにより、安定した状態で実装することができる。   Reference numeral 24 denotes a plurality of mounting electrodes formed on the side end portion of the circuit board 20, which is formed by printing, vapor deposition, or the like over the two surfaces of the substrate which are the bottom surface and the side surface when mounting. The electrode 24 is a through-hole electrode. Reference numeral 25 denotes a translucent resin such as an epoxy resin containing a visible light cut agent that seals the light emitting element 21, the light receiving element 22, and the circuit unit 23. While protecting the said light emitting element 21, the light receiving element 22, and the circuit part 23, it is formed in a lens shape and has a function which irradiates and condenses light. Reference numeral 26 denotes a metal shield cover having a substantially box shape. The shield cover 26 covers the light emitting element 21, the light receiving element 22, the circuit unit 23, and the circuit board 20 sealed with the translucent resin 25 from the direction of receiving and emitting light. Translucent portions 26 a and 26 b are provided at positions corresponding to the elements 22 so as not to prevent light emission and light reception. Further, the shield cover 26 has a function of preventing electromagnetic noise and has openings 26c and 26d in the direction in which the mounting electrode 24 of the circuit board 20 is formed so that the mounting electrode 24 is not hidden. It is configured. Further, the shield cover 26 is provided with first and second dummy electrodes 26e and 26f that protrude so as to be flush with the two surfaces of the circuit board 20 on which the mounting electrode 24 is formed. Then, the dummy electrodes 26e and 26f are fixed together with the mounting electrode 24 to the external printed circuit board 27 with solder or the like, so that it can be mounted in a stable state.

解決しようとする問題点は、上記した特許文献１に開示した赤外線送受信モジュールの構造において、特に最近は、携帯電話など機器の薄型化、多機能化に伴う部品実装スペースの縮小化により、外部プリント基板は、ＳＵＳ板を付けたフレキシブルプリント基板よりなり、その上にＳＭＤ型側面実装部品が実装される場合が多い。ＳＵＳ板は、例えば、厚さが、約０．０５ｍｍと薄く、曲がり易く、また、その形状を維持する。しかしながら、製品にベンディングが掛かる場合があると、特に両サイドの実装用電極が剥がれ易いと言う問題がある。また、製品側の端子強度を強化しても、ベンディング時に外部プリント基板側の電極が剥離してしまう。などの問題があった。   The problem to be solved is that the structure of the infrared transmission / reception module disclosed in the above-mentioned Patent Document 1, particularly recently, has been reduced due to the reduction in component mounting space due to the thinning of the equipment such as mobile phones and the increase in functionality. The substrate is made of a flexible printed circuit board with a SUS plate, and an SMD type side surface mounting component is often mounted thereon. The SUS plate has a thin thickness of, for example, about 0.05 mm, is easy to bend, and maintains its shape. However, when the product is bent, there is a problem that the mounting electrodes on both sides are particularly easily peeled off. Further, even if the terminal strength on the product side is increased, the electrode on the external printed circuit board side is peeled off during bending. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、製品を外部プリント基板に実装した状態で、ベンディングが掛かっても、端子電極が剥離し難いＳＭＤ型側面実装部品を提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its object is to provide an SMD type side-mounted component in which the terminal electrode is difficult to peel off even if bending is applied in a state where the product is mounted on an external printed circuit board. is there.

上記目的を達成するために、本発明におけるＳＭＤ型側面実装部品は、ガラスエポキシ樹脂などよりなり表面に導電パターンを有する回路基板と、該回路基板上に実装される発光素子および受光素子などよりなる光素子と、前記回路基板上に実装され前記光素子に接続される回路部と、前記回路基板の側面から前記光素子の実装面の裏面にかけて形成されると共に前記光素子および前記回路部に前記導電パターンを介して接続される複数個の実装用電極と、前記光素子および前記回路部を封止する透光性樹脂と、前記光素子に対応する位置に透孔部を有し且つ前記実装用電極が形成されている面に対応する部分に開口部を形成すると共に前記光素子および前記回路部を覆うシールドカバーを具備したＳＭＤ型側面実装部品において、前記実装用電極は前記光素子の配列方向である前記回路基板の列方向に複数個の電極パターンを備え、該電極パターンは両サイドの電極パターンと（ｘ）の幅を有する内側の電極パターンよりなり、前記両サイドの電極パターンは幅を（ｘ＋α）として拡大幅（α）の分を前記内側の電極パターンの幅よりも拡大すると共に、前記拡大幅（α）の部分をレジストにて押さえ込むことを特徴とするものである。
To achieve the above object, SMD type side mounting component in the present invention includes a circuit board having a conductive pattern on a surface made of a glass epoxy resin, formed of such light emitting element and a light receiving element are mounted on the circuit substrate and the optical element, and a circuit portion connected to the optical element is mounted on the circuit board, the said optical element and the circuit section from the side surface of the circuit board while being formed over the rear surface of the mounting surface of the optical element a plurality of mounting electrodes are connected to the conducting pattern, and the translucent resin sealing the optical element and the circuit portion, chromatic and and the mounting through hole at a position corresponding to the optical element in SMD type side mounted components provided with the shield cover covering the light element and the circuit portion with use electrodes to form an opening in a portion corresponding to the surface being formed, the mounting Electrode comprises a plurality of electrode patterns in the column direction of the circuit board is an array direction of the optical element, the electrode pattern is made of the inside of the electrode pattern with a width of the electrode patterns on both sides (x), wherein The electrode patterns on both sides are characterized in that the width is (x + α) and the enlarged width (α) is enlarged more than the width of the inner electrode pattern, and the portion of the enlarged width (α) is pressed with a resist. To do.

また、列方向に直交する前記電極パターンの高さを（ｙ）とする時、（ｙ＋β）／ｘ≧１の関係が成り立つように拡大高さ（β）を設け、該拡大高さ（β）部分をレジストにて押さえ込むことを特徴とするものである。 Further, when the height of the electrode pattern that is orthogonal to the column direction (y), (y + β ) / x ≧ 1 relationship holds as expanded height (beta) is provided, the enlarged height (beta) The portion is pressed by a resist .

また、前記シールドカバーは、前記回路基板の側面に形成されている実装用電極の面に対して面一となるように、外部プリント基板に半田付けするためのケース端子を両サイドに形成したことを特徴とするものである。
In addition, the shield cover is formed on both sides with case terminals for soldering to an external printed circuit board so as to be flush with the surface of the mounting electrode formed on the side surface of the circuit board. It is characterized by.

本発明のＳＭＤ型側面実装部品は、薄いＳＵＳ板を付けた外部プリント基板上にＳＭＤ型側面実装部品を実装しても、実装用電極を拡大して、且つレジストで電極パターン部の周辺を極力広い範囲で押さえ込む剥離対策により、回路基板からの実装用電極の剥離を防止することが可能である。また、シールドカバーの両サイドに形成されたケース端子を、外部プリント基板側に半田付けするベンディング防止対策と、上記したレジストで拡大電極パターン部を押さえ込む剥離対策と協同して、基板ベースのＳＭＤ型側面実装部品の全てにおいて、高実装強度を実現できる、信頼性に優れたＳＭＤ型側面実装部品を提供することができる。   The SMD type side mounting component of the present invention expands the mounting electrode and uses the resist as much as possible around the electrode pattern portion even if the SMD type side mounting component is mounted on an external printed circuit board with a thin SUS board. Due to the peeling countermeasure that holds down in a wide range, it is possible to prevent peeling of the mounting electrode from the circuit board. In addition, in cooperation with anti-bending measures for soldering the case terminals formed on both sides of the shield cover to the external printed circuit board side and anti-exfoliation measures for pressing the enlarged electrode pattern portion with the resist, the substrate-based SMD type It is possible to provide a highly reliable SMD type side surface mounting component capable of realizing high mounting strength in all the side surface mounting components.

本発明のＳＭＤ型側面実装部品について、図面に基づいて説明する。   The SMD type side surface mounting component of the present invention will be described with reference to the drawings.

図１〜図４は、本発明の実施例１に係わり、図１は、ＳＭＤ型側面実装部品の正面図、図２は、図１に示すＳＭＤ型側面実装部品の側面図、図３は、図１に示すＳＭＤ型側面実装部品の背面図、図４は、図３の実装用電極の形状を示す説明図である。   1 to 4 relate to the first embodiment of the present invention, FIG. 1 is a front view of an SMD type side surface mounting component, FIG. 2 is a side view of the SMD type side surface mounting component shown in FIG. FIG. 4 is a rear view of the SMD type side surface mounting component shown in FIG. 1, and FIG. 4 is an explanatory view showing the shape of the mounting electrode in FIG.

図１〜図４において、従来例と同様に、ガラスエポキシ樹脂、ＢＴレジンなどの耐熱性および絶縁性を有する回路基板１は、その表面に導電パターン（図示せず）が印刷、蒸着などで形成されている。高速赤外ＬＥＤからなる発光素子（図示せず）とフォトダイオードからなる受光素子（図示せず）は、それぞれ回路基板１上に実装されており、導電パターンのダイボンドおよびワイヤボンドされて接続されている。アンプ、ドライブ回路などが組み込まれているＩＣからなる回路部（図示せず）、回路基板１上に実装されると共に、その導電パターンを介して発光素子と受光素子に接続されている。   1 to 4, similar to the conventional example, the circuit board 1 having heat resistance and insulation, such as glass epoxy resin and BT resin, has a conductive pattern (not shown) formed on the surface thereof by printing, vapor deposition, or the like. Has been. A light emitting element (not shown) made of a high-speed infrared LED and a light receiving element (not shown) made of a photodiode are respectively mounted on the circuit board 1 and connected by die bonding and wire bonding of a conductive pattern. Yes. A circuit unit (not shown) composed of an IC in which an amplifier, a drive circuit and the like are incorporated is mounted on the circuit board 1 and is connected to the light emitting element and the light receiving element through the conductive pattern.

図２〜図４に示すように、前記回路基板１の側面から前記光素子の実装面の裏面にかけて列方向に複数個の実装用電極２が印刷、蒸着などにより形成されており、該実装用電極２はスルーホール電極となっている。本実施例における実装用電極２の電極パターンは可能な限り大きく設定するが、列方向には限度がある。そこで、図４に示すように、その列方向の実装用電極２の幅（ｘ）と、列方向に直交する高さ（ｙ）を拡大し、
ｙ＋β（βは拡大分）／ｘ≧１の関係があるように、実装用電極２のパターンの形状を拡大する。 As shown in FIGS. 2 to 4, a plurality of mounting electrodes 2 are formed in the column direction from the side surface of the circuit board 1 to the back surface of the mounting surface of the optical element by printing, vapor deposition, etc. The electrode 2 is a through-hole electrode. The electrode pattern of the mounting electrode 2 in this embodiment is set as large as possible, but there is a limit in the column direction. Therefore, as shown in FIG. 4, the width (x) of the mounting electrodes 2 in the column direction and the height (y) orthogonal to the column direction are enlarged,
The shape of the pattern of the mounting electrode 2 is enlarged so that there is a relationship of y + β (β is an enlarged portion) / x ≧ 1.

さらに、前記複数個の実装用電極２のパターン部が回路基板１の側面から前記光素子の実装面の裏面にかけて列状に形成された実装用電極２のパターンの内、両サイドの電極パターンの幅は、ｘ＋α（αは拡張分）であるように拡大する。   Further, among the patterns of the mounting electrodes 2 in which the pattern portions of the plurality of mounting electrodes 2 are formed in a line from the side surface of the circuit board 1 to the back surface of the mounting surface of the optical element, The width is expanded to be x + α (α is an extension).

図３に示すように、前記実装用電極２の電極パターン部の外周を、本来の絶縁機能を有するレジスト３で押さえる。図３（ｂ）に示すように、レジスト３と実装用電極２との重なる部分が電極押え部３ａである。複数個ある実装用電極２の内で、少なくとも、ベンディング時に最も剥がれ易い両サイドの電極パターンの幅ｘを、上記したように、ｘ＋αのように、大きくしてレジスト３で押さえ込むことがベンディング時の剥離対策として有効である。   As shown in FIG. 3, the outer periphery of the electrode pattern portion of the mounting electrode 2 is pressed with a resist 3 having an original insulating function. As shown in FIG. 3B, an overlapping portion between the resist 3 and the mounting electrode 2 is an electrode pressing portion 3a. Among the plurality of mounting electrodes 2, at least the width x of the electrode pattern on both sides that is most likely to be peeled off during bending is increased as x + α as described above and pressed by the resist 3 during bending. It is effective as a measure against peeling.

４は、従来例と同様に、前記発光素子、受光素子および回路部等の電子部品を封止する可視光カット剤入りエポキシ系樹脂などの透光性樹脂である。前記電子部品を保護すると共に、レンズ状に形成されて光の照射およぶ集光する機能を有するものである。５は、略箱状をした金属製のシールドカバーである。該シールドカバー５は、透光性樹脂４で封止された電子部品を、光を受発光する方向から覆うものであり、発光素子と受光素子に対応する位置に発光・受光を妨げないようにするための透光部５ａ、５ｂが設けられている。また、シールドカバー５には、電磁波のノイズ防止機能を有すると共に、回路基板１の実装用電極２が形成されている方向に開口部５ｃ、５ｄを有し、前記実装用電極２が隠れないように構成せれている。さらにシールドカバー５には、実装用電極２が形成されている回路基板１の面に対して面一になるように突出したケース端子５ｅが配設されていて、該ケース端子５ｅを前記実装用電極２と共に、半田６などにより外部プリント基板７に固着することにより、安定した状態で実装することができる。   4 is a translucent resin such as an epoxy resin containing a visible light cut agent that seals the electronic components such as the light emitting element, the light receiving element, and the circuit unit, as in the conventional example. While protecting the said electronic component, it is formed in a lens shape and has the function to irradiate and condense light. Reference numeral 5 denotes a metal shield cover having a substantially box shape. The shield cover 5 covers the electronic component sealed with the translucent resin 4 from the direction of receiving and emitting light so that light emission and light reception are not hindered at positions corresponding to the light emitting element and the light receiving element. Translucent portions 5a and 5b are provided. The shield cover 5 has an electromagnetic wave noise prevention function and has openings 5c and 5d in the direction in which the mounting electrode 2 of the circuit board 1 is formed so that the mounting electrode 2 is not hidden. It is configured. Further, the shield cover 5 is provided with a case terminal 5e protruding so as to be flush with the surface of the circuit board 1 on which the mounting electrode 2 is formed. The case terminal 5e is used for the mounting. By being fixed to the external printed circuit board 7 together with the electrode 2 by the solder 6 or the like, it can be mounted in a stable state.

図５は、本発明の実施例２に係わるＳＭＤ型側面実装部品の背面図である。以上述べた構成のＳＭＤ型側面実装部品の作用・効果について説明する。前述した実施例１において、前記複数個の実装用電極２が回路基板の側面から前記光素子の実装面の裏面にかけて列状に形成され、その実装用電極の内、いずれか一つの電極、例えばＧＮＤ電極を、他の電極に接近させ列方向に連続的に広くした拡大領域（γ）を設ける。前記拡大領域（γ）を形成することにより、基板自体がより一層ベンディング強度をアップする。   FIG. 5 is a rear view of the SMD type side surface mounting component according to the second embodiment of the present invention. The operation and effect of the SMD type side surface mounting component having the above-described configuration will be described. In the first embodiment, the plurality of mounting electrodes 2 are formed in a line from the side surface of the circuit board to the back surface of the mounting surface of the optical element, and any one of the mounting electrodes, for example, An enlarged region (γ) is provided in which the GND electrode is brought close to other electrodes and continuously widened in the column direction. By forming the enlarged region (γ), the substrate itself further increases the bending strength.

以上述べたように、本発明のＳＭＤ型側面実装部品は、外部プリント基板７に半田付けされて状態で、ベンディングがＳＭＤ型側面実装部品に掛かったときに、シールドカバー５の両サイドのケース端子５ｅがベンディングストレスを吸収する。製品の実装用電極２および外部プリント基板７の端子部にストレスが掛かるのを防ぐ。仮に、実装用電極２にベンディングが掛かっても、実装電極が拡大され、且つその周辺を広い範囲にわたり上からレジスト３で押さえているので、電極パターン部の剥離防止に機能する。   As described above, the SMD type side mount component of the present invention is soldered to the external printed circuit board 7 and the bending is applied to the SMD type side mount component when the case terminals on both sides of the shield cover 5 are placed. 5e absorbs bending stress. This prevents stress from being applied to the mounting electrodes 2 of the product and the terminal portions of the external printed circuit board 7. Even if the mounting electrode 2 is bent, the mounting electrode is enlarged, and the periphery of the mounting electrode 2 is pressed by the resist 3 over a wide range, so that it functions to prevent peeling of the electrode pattern portion.

本発明のＳＭＤ型側面実装部品は、ＳＵＳ板を付けたフレキシブル基板のような外部プリント基板などに特に有効であり、基板ベースのＳＭＤ型側面実装部品の全てにおいて、高実装強度を実現することができる。信頼性に優れたＳＭＤ型側面実装部品を提供することが可能である。   The SMD type side surface mounting component of the present invention is particularly effective for an external printed circuit board such as a flexible substrate with a SUS plate, and can realize high mounting strength in all the substrate-based SMD type side surface mounting components. it can. It is possible to provide an SMD type side surface mounting component with excellent reliability.

本発明の実施例１に係わるＳＭＤ型側面実装部品を外部プリント基板に実装した状態の正面図である。It is a front view of the state which mounted the SMD type side surface mounting component concerning Example 1 of this invention in the external printed circuit board. 図１のＳＭＤ型側面実装部品の側面図である。It is a side view of the SMD type side surface mounting component of FIG. 図３（ａ）は、図１のＳＭＤ型側面実装部品の背面図、図３（ｂ）は図３（ａ）の電極パターン部の部分拡大図である。FIG. 3A is a rear view of the SMD type side surface mounting component of FIG. 1, and FIG. 3B is a partially enlarged view of the electrode pattern portion of FIG. 図３の実装用電極の形状を示す説明図である。It is explanatory drawing which shows the shape of the electrode for mounting of FIG. 本発明の実施例２に係わるＳＭＤ型側面実装部品の背面図である。It is a rear view of the SMD type side surface mounting component concerning Example 2 of this invention. 従来の赤外線送受信モジュールの斜視図である。It is a perspective view of the conventional infrared transmission / reception module. 図６の赤外線送受信モジュールの背面図である。It is a rear view of the infrared transmission / reception module of FIG. 図６のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 図６の赤外線送受信モジュールの側面図である。It is a side view of the infrared transmission / reception module of FIG.

符号の説明Explanation of symbols

１ 回路基板
２ 実装用電極
３ レジスト
３ａ 電極押え部
４ 透光性樹脂
５ シールドカバー
５ｅ ケース端子
６ 半田
７ 外部プリント基板
ｘ 実装用電極の幅
ｙ 実装用電極の高さ
α ｘの拡大分
β ｙの拡大分
γ 実装用電極の連続的拡大分

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Mounting electrode 3 Resist 3a Electrode holding part 4 Translucent resin 5 Shield cover 5e Case terminal 6 Solder 7 External printed circuit board x Width of mounting electrode y Height of mounting electrode α x enlargement β y Of γ Continuous expansion of mounting electrodes

Claims (3)

ガラスエポキシ樹脂などよりなり表面に導電パターンを有する回路基板と、該回路基板上に実装される発光素子および受光素子などよりなる光素子と、前記回路基板上に実装され前記光素子に接続される回路部と、前記回路基板の側面から前記光素子の実装面の裏面にかけて形成されると共に前記光素子および前記回路部に前記導電パターンを介して接続される複数個の実装用電極と、前記光素子および前記回路部を封止する透光性樹脂と、前記光素子に対応する位置に透孔部を有し且つ前記実装用電極が形成されている面に対応する部分に開口部を形成すると共に前記光素子および前記回路部を覆うシールドカバーを具備したＳＭＤ型側面実装部品において、
前記実装用電極は前記光素子の配列方向である前記回路基板の列方向に複数個の電極パターンを備え、該電極パターンは両サイドの電極パターンと（ｘ）の幅を有する内側の電極パターンよりなり、前記両サイドの電極パターンは幅を（ｘ＋α）として拡大幅（α）の分を前記内側の電極パターンの幅よりも拡大すると共に、前記拡大幅（α）の部分をレジストにて押さえ込むことを特徴とするＳＭＤ型側面実装部品。 A circuit board having a conductive pattern on from it a surface such as glass epoxy resin, is connected to the optical device including, for example, the light emitting element and a light receiving element are mounted on the circuit substrate, the optical element is mounted on the circuit board a circuit unit, a plurality of mounting electrodes connected via the conductive pattern to the optical element and the circuit portion while being formed from a side surface of the circuit board toward the back side of the mounting surface of the optical element, the light forming a translucent resin that seals the element and the circuit portion, an opening in a portion corresponding to the surface perforated by and the mounting electrode through hole portion formed at a location corresponding to said optical element in SMD type side mounted components provided with the shield cover covering the light element and the circuit portion with,
The mounting electrode includes a plurality of electrode patterns in the row direction of the circuit board, which is the arrangement direction of the optical elements, and the electrode pattern is formed by an electrode pattern on both sides and an inner electrode pattern having a width of (x). The width of the electrode pattern on both sides is (x + α) and the expanded width (α) is expanded more than the width of the inner electrode pattern , and the expanded width (α) portion is pressed with a resist. SMD type side-mounted component characterized by 列方向に直交する前記電極パターンの高さを（ｙ）とする時、（ｙ＋β）／ｘ≧１の関係が成り立つように拡大高さ（β）を設け、該拡大高さ（β）部分をレジストにて押さえ込むことを特徴とする請求項１記載のＳＭＤ型側面実装部品。 When the height of the electrode pattern that is orthogonal to the column direction (y), the provided, the enlarged height (beta) part (y + β) / x ≧ 1 relationship holds as expanded height (beta) 2. The SMD type side surface mounting component according to claim 1, wherein the SMD type side surface mounting component is pressed by a resist . 前記シールドカバーは、前記回路基板の側面に形成されている実装用電極の面に対して面一となるように、外部プリント基板に半田付けするためのケース端子を両サイドに形成したことを特徴とする請求項１または２記載のＳＭＤ型側面実装部品。
The shield cover is characterized in that case terminals for soldering to an external printed circuit board are formed on both sides so as to be flush with the surface of the mounting electrode formed on the side surface of the circuit board. The SMD type side surface mounting component according to claim 1 or 2.
JP2004210888A 2004-07-20 2004-07-20 SMD type side mount parts Expired - Fee Related JP4671324B2 (en)

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JP2009058768A (en) * 2007-08-31 2009-03-19 Showa Denko Kk Display, and light emitting device
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012773A (en) * 1998-04-23 2000-01-14 Sharp Corp Semiconductor device and its manufacture
JP2000041540A (en) * 1998-07-30 2000-02-15 Ryobi Ltd Reel seat
JP2002261299A (en) * 2000-12-25 2002-09-13 Sharp Corp Infrared data communication module
JP2003008066A (en) * 2001-06-26 2003-01-10 Rohm Co Ltd Infrared data communication module and its mounting method
JP2004031475A (en) * 2002-06-24 2004-01-29 Sharp Corp Infrared data communication module and electronic equipment mounted therewith

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012773A (en) * 1998-04-23 2000-01-14 Sharp Corp Semiconductor device and its manufacture
JP2000041540A (en) * 1998-07-30 2000-02-15 Ryobi Ltd Reel seat
JP2002261299A (en) * 2000-12-25 2002-09-13 Sharp Corp Infrared data communication module
JP2003008066A (en) * 2001-06-26 2003-01-10 Rohm Co Ltd Infrared data communication module and its mounting method
JP2004031475A (en) * 2002-06-24 2004-01-29 Sharp Corp Infrared data communication module and electronic equipment mounted therewith

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