JP2005109505A - 回路基板製造方法及びその回路基板を有するスマートラベル - Google Patents
回路基板製造方法及びその回路基板を有するスマートラベル Download PDFInfo
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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Abstract
【解決手段】 本発明に係るスマートラベルは、絶縁基板400に取り付けられた集積回路チップ414と、絶縁基板400に陰刻でループ状に形成され、その両端部に絶縁基板400を貫通して形成された第1端子402及び第2端子406を有し、所定の部分で集積回路チップ414と接続されたアンテナパターン404と、アンテナパターン404と集積回路チップ414とを電気的に接続すべく、アンテナパターン404に充填された導電性材料と、導電性材料が充填された第1端子402と第2端子406とを電気的に接続する接続部412とを備えている。
【選択図】 図5
Description
402 第1端子
404 アンテナ
406 第2端子
408 注入口
410 支持部材
412 端子接続部
414 チップ
Claims (23)
- (a)絶縁材料から成る基板の少なくとも1つの面に、所定の深さ及びパターンを有する溝を形成する段階と、
(b)前記溝に導電性材料を充填する段階と、
(c)前記溝に充填された導電性材料を硬化させて回路パターンを形成する段階と
を含むことを特徴とする回路基板製造方法。 - 前記基板は、前記基板の上面に形成された上部絶縁層と、前記上部絶縁層の下側に形成された少なくとも一層の下部絶縁層とを含み、
前記(a)段階では、前記上部絶縁層の露出面に、所定の深さ及びパターンを有する溝を形成することを特徴とする請求項1に記載の回路基板製造方法。 - 前記(a)段階では、前記基板を形成している絶縁材料を所定温度に加熱しつつ、前記基板に金型を押圧することにより、所定のパターンの溝を形成することを特徴とする請求項1に記載の回路基板製造方法。
- 前記基板を形成している絶縁材料の所定温度への加熱は、
前記金型を加熱し、その加熱された金型を前記絶縁材料に押圧することにより行うことを特徴とする請求項3に記載の回路基板製造方法。 - 前記金型は、回路パターンが形成されているローラであることを特徴とする請求項3に記載の回路基板製造方法。
- 前記溝に充填された導電性材料が硬化して形成されたパターンは、無線通信用のアンテナであることを特徴とする請求項1に記載の回路基板製造方法。
- 前記絶縁材料から成る基板の表面に形成された溝の形状は、半円型、逆台形又は逆三角形であることを特徴とする請求項1に記載の回路基板製造方法。
- 前記(b)段階では、スキーズを使用して前記溝に導電性材料を充填することを特徴とする請求項1に記載の回路基板製造方法。
- 前記基板の両面に回路パターンを形成する場合は、
前記両面に形成した回路パターンの少なくとも一部の回路を相互接続することを特徴とする請求項1に記載の回路基板製造方法。 - 前記(a)段階では、
前記回路基板の表面に回路パターンとして形成された前記溝の少なくとも一部を前記基板の両面を貫通して形成し、
前記回路パターンの上面から前記貫通して形成された溝に導電性材料を注入することにより、前記基板の両面に導電性材料を充填することを特徴とする請求項1に記載の回路基板製造方法。 - 前記回路基板の一方の面に形成された回路パターンの少なくとも2つの部分を、前記貫通して形成された溝を通じて前記基板の他方の面に注入された導電性材料により電気的に接続することを特徴とする請求項10に記載の回路基板製造方法。
- 前記基板における少なくとも1つの回路パターンが形成されていない部分にスルーホールを形成し、前記スルーホールを通じて前記導電性材料を注入することを特徴とする請求項11に記載の回路基板製造方法。
- 前記回路パターンの形成時に前記基板の表面に加わる圧縮応力を吸収するべく、前記基板における回路パターンが形成されていない部分に所定のホールを予め形成することを特徴とする請求項1に記載の回路基板製造方法。
- 前記基板に用いられる絶縁材料は、ポリイミド、ポリエチレン・テレフタレート、及び紙材質板材から成る群より選択される少なくとも1つの金属であることを特徴とする請求項1に記載の回路基板製造方法。
- 前記(c)段階の後に、硬化した導電性材料上に、銅、アルミニウム、錫、及びニッケルから成る群より選択される少なくとも1つの金属を含む金属めっき層を形成する段階をさらに含むことを特徴とする請求項1に記載の回路基板製造方法。
- 絶縁基板に取り付けられた集積回路チップと、
前記絶縁基板に陰刻でループ状に形成され、その両端部に前記絶縁基板を貫通して形成された第1端子及び第2端子を有し、所定の部分で前記集積回路チップと接続されたアンテナパターンと、
前記アンテナパターンと前記集積回路チップとを電気的に接続すべく、前記アンテナパターンに充填された導電性材料と、
導電性材料が充填された前記第1端子と前記第2端子とを電気的に接続する接続部と
を備えていることを特徴とするスマートラベル。 - 前記接続部は、導電性テープであることを特徴とする請求項16に記載のスマートラベル。
- 前記接続部は、前記基板下面上に形成された導電性材料から成る薄膜であることを特徴とする請求項16に記載のスマートラベル。
- 前記接続部は、前記基板下部に陰刻で形成された前記第1端子と前記第2端子とを接続する通路を構成する接続パターンを含み、前記接続パターンには導電性材料が充填されることを特徴とする請求項16に記載のスマートラベル。
- 前記基板上面から前記接続パターンへ導電性材料を充填するべく、前記基板上面と前記接続パターンとを貫通して形成された少なくとも1つの注入口をさらに備えていることを特徴とする請求項19に記載のスマートラベル。
- 前記接続部に導電性材料を充填するための空洞を形成すべく、前記基板下面に形成された前記接続パターンを覆う支持部材をさらに備えていることを特徴とする請求項19に記載のスマートラベル。
- 前記導電性材料上に、銅、アルミニウム、錫、及びニッケルから成る群より選択される少なくとも1つの金属を含む金属めっき層が形成されていることを特徴とする請求項16に記載のスマートラベル。
- 上面に形成された上部絶縁層及び前記上部絶縁層の下側に形成された少なくとも一層の下部絶縁層を含む基板と、
前記基板に取り付けられた集積回路チップと、
前記上部絶縁層の外面に陰刻で形成され、所定の部分が前記集積回路チップと接続されるアンテナパターンと、
前記アンテナパターンと前記集積回路チップとを電気的に接続すべく、前記アンテナパターンに充填される導電性材料と
を備えていることを特徴とするスマートラベル。
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KR1020030068333A KR100998039B1 (ko) | 2003-10-01 | 2003-10-01 | 기판 제조 방법 및 이를 이용하여 제조된 스마트 라벨 |
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Cited By (4)
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JP2006332553A (ja) * | 2005-05-30 | 2006-12-07 | Fujifilm Holdings Corp | 配線基板製造方法及び吐出ヘッド並びに画像形成装置 |
WO2011162088A1 (ja) | 2010-06-25 | 2011-12-29 | 東洋アルミニウム株式会社 | Icカード・タグ用アンテナ回路構成体とその製造方法 |
JP2012524358A (ja) * | 2009-04-20 | 2012-10-11 | フレクストロニクス エイピー エルエルシー | 小型rfidタグ |
WO2015129766A1 (ja) * | 2014-02-28 | 2015-09-03 | シャープ株式会社 | アンテナ装置および携帯端末装置 |
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FR2884681B1 (fr) * | 2005-04-15 | 2007-06-22 | St Microelectronics Sa | Antenne pour etiquette electronique |
US7522121B2 (en) * | 2005-05-19 | 2009-04-21 | General Electric Company | Method for fabricating an antenna |
EP1897971A4 (en) * | 2005-06-29 | 2015-03-18 | Harima Chemicals Inc | METHOD FOR FORMING ELECTRICALLY CONDUCTIVE SWITCHING |
GB0605239D0 (en) * | 2006-03-16 | 2006-04-26 | Uvasol Ltd | Improvements in the application of conductive tracks to substrates |
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KR20130098183A (ko) | 2010-06-25 | 2013-09-04 | 도요 알루미늄 가부시키가이샤 | Ic카드ㆍ태그용 안테나 회로 구성체와 그 제조 방법 |
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Also Published As
Publication number | Publication date |
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KR20050032300A (ko) | 2005-04-07 |
US20050072595A1 (en) | 2005-04-07 |
CN100562223C (zh) | 2009-11-18 |
CN1620227A (zh) | 2005-05-25 |
KR100998039B1 (ko) | 2010-12-03 |
US7345645B2 (en) | 2008-03-18 |
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