JP2005092137A - Aligner and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aligner capable of smoothly performing exposure processing while maintaining high exposure accuracy by suppressing the upsizing of the device in spite of the upsizing of a substrate which is an object for exposure processing. <P>SOLUTION: The exposing device EX is equipped with a first exposure station ST 1 and a second exposure station ST 2 capable of exposing a photosensitive substrate P and a control system CONT for controlling the exposure in such a manner that after the first exposure is performed in the first exposure station ST 1, the photosensitive substrate P undergoing the first exposure is continuously subjected to second exposure at the second exposure station ST 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus and an exposure method for exposing a pattern to a substrate.

Liquid crystal display devices and semiconductor devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process illuminates a mask with exposure light and transfers a mask pattern onto a substrate via a projection optical system. In this type of exposure apparatus, improvement in productivity is required in order to reduce the cost of the device to be manufactured. Conventionally, in order to improve productivity, for example, a mask stage that supports a mask or a substrate stage that supports a substrate is driven at a higher speed, or the amount of exposure light is increased to improve throughput. Yes. Further, in Patent Document 1 below, in order to improve productivity, first and second holding means for holding a mask and a substrate are provided, and the pattern of the mask held by the first holding means is used as the substrate. A technique for aligning the mask and the substrate held by the second holding means during the transfer to the substrate is disclosed.
JP-A-9-251952

  When manufacturing a liquid crystal display device, the further enlargement of the glass substrate used as a base material is requested | required from the viewpoint of productivity improvement and the request | requirement of the enlargement of a display area. For example, when mass-producing a 40-inch liquid crystal display device, if an attempt is made to form 6 screens on a single glass substrate, a glass substrate of about 1800 × 2000 mm is required. On the other hand, since the size of the projection area of the projection optical system is limited, when exposing a large glass substrate, the mask pattern is continuously moved while scanning the substrate relative to the projection area of the projection optical system. A scanning exposure apparatus that transfers onto a substrate is mainly used.

  FIG. 18 is a schematic diagram showing an example of a process for manufacturing a liquid crystal display device (shot region) for four screens on a glass substrate P by a conventional scanning exposure apparatus. In FIG. 18, the projection area AR of the projection optical system is set in a slit shape extending in the Y-axis direction. A moving area B indicated by a broken line indicates a moving range of the substrate P supported by the substrate stage. FIG. 18A shows the positions of the projection area AR and the substrate P (first shot area SH1) at the start of scanning exposure when scanning exposure is performed on the first shot area SH1 set at the upper left in the drawing of the substrate P. It is a figure which shows a relationship. From the state shown in FIG. 18A, the first shot region SH1 is exposed by scanning and moving the substrate P in the −X direction with respect to the projection region AR. FIG. 18B shows the positional relationship between the projection area AR and the substrate P at the end of scanning exposure for the first shot area SH1. FIG. 18C is a diagram showing the positional relationship between the projection area AR and the substrate P at the start of scanning exposure when the second shot area SH2 set at the upper right in the drawing of the substrate P is subjected to scanning exposure. Then, from the state shown in FIG. 18C, the second shot area SH2 is exposed by scanning and moving the substrate P in the −X direction with respect to the projection area AR, and at the end of the scanning exposure, FIG. It will be in the state shown in FIG. 18E is a diagram showing a state at the start of scanning exposure when scanning exposure is performed on the third shot region SH3 set at the lower left in the drawing of the substrate P, and FIG. It is a figure which shows the state at the time of completion | finish of scanning exposure when the shot area | region SH3 is scanned and exposed. Further, although not shown, the fourth shot region SH4 is subjected to scanning exposure by continuing the above operation.

By the way, the above-described prior art has the following problems.
For example, consider a case where four liquid crystal display devices (shot regions) are manufactured on a large glass substrate P of about 1800 × 2000 mm. In this case, one shot area has a size of about 900 × 1000 mm. Assuming that the center of the projection area AR is the coordinate origin, the range in which the end face of the substrate P moves with respect to the origin is at least −1800 mm to +1800 mm in the X axis direction and −1500 mm to +1500 mm in the Y axis direction. That is, the substrate P (substrate stage) moves within a range of 3.6 m × 3.0 m. Accordingly, the substrate stage that supports the substrate P, the projection optical system, or the column that supports the mask stage that moves in synchronization with the substrate stage is naturally larger than the movement range of the substrate P. For example, if the column thickness of this column is 0.5 m × 0.5 m, the occupied area of the column is at least 4.6 m × 4.0 m, which is very large. It is very difficult to form such a large exposure apparatus integrally. Further, by increasing the size of the exposure apparatus, the position of the center of gravity changes when the substrate stage or the mask stage is moved, and the column is likely to be bent, so that the desired exposure accuracy may not be maintained. In particular, when the projection optical system is an erecting equal-magnification system, the mask stage and the substrate stage move in the same direction, so the change in the center of gravity position is significant. On the other hand, if the rigidity is increased, each member including the column will be further increased in size and weight. Further, when the exposure apparatus is enlarged, transportation becomes very difficult. If you try to transport it by land, there are many restrictions on physical distribution, such as being forced to transport at night or requiring special permission. For example, an exposure apparatus manufactured at an exposure apparatus manufacturing factory is a liquid crystal device manufacturer. It is difficult to smoothly transport to users such as. It is conceivable that an exposure apparatus manufactured at an exposure apparatus manufacturing plant is once divided into a plurality of elements, transported for each element, and assembled at the user's site. However, in order to maintain high exposure accuracy, the apparatus has high rigidity. It is difficult to maintain the rigidity and stability by simply combining a plurality of elements by bolt fastening or the like. Even if a plurality of elements are combined, even if the desired exposure accuracy can be maintained, division work into a plurality of elements at the exposure apparatus manufacturing factory and assembly work at the user's site are required. However, it takes a long time before the exposure apparatus can be used.

  The present invention has been made in view of such circumstances, and an exposure apparatus and an exposure apparatus that can smoothly perform exposure processing while suppressing high size of the apparatus and maintaining high exposure accuracy even when a substrate to be exposed is enlarged. It aims to provide a method.

In order to solve the above-described problems, the present invention employs the following configuration corresponding to FIGS. 1 to 17 shown in the embodiment.
The exposure apparatus (EX) of the present invention is a first exposure station (ST1) and a second exposure station (ST2) capable of exposing the substrate (P) in the exposure apparatus that exposes the pattern to the substrate (P), and the first exposure station (ST2). After the first exposure (SA2) is performed at the exposure station (ST1), the second exposure (SA4) is continuously performed at the second exposure station (ST2) with respect to the substrate (P) on which the first exposure has been performed. And a control system (CONT) for performing control as described above.
The exposure method of the present invention is an exposure method for exposing a pattern onto a substrate (P). In the first exposure station (ST1) capable of exposing the substrate (P), the first region (SH1, SH2) of the substrate (P). A first step (SA2) for exposing the second region (SH3, SH4) of the substrate (P) exposed in the first step, and a second step (ST2) for continuously exposing the second region (SH3, SH4). SA4).

According to the present invention, at least two exposure stations capable of exposing the substrate are provided, and after the first exposure is performed on the substrate at the first exposure station, the first exposure is performed on the substrate subjected to the first exposure. By continuously performing the second exposure at the two exposure stations, it is possible to suppress the enlargement of the apparatus and the range of movement of the stage. Therefore, it is possible to perform exposure processing with high accuracy while suppressing the occurrence of bending of the apparatus (column) due to the change in the position of the center of gravity accompanying the movement of the stage.
For example, consider a case where the first to fourth shot regions SH1 to SH4 of the substrate P shown in FIG. 18 are exposed. Assuming that the first and second shot areas SH1 and SH2 are exposed at the first exposure station and the third and fourth shot areas SH3 and SH4 are exposed at the second exposure station, the first and second exposure stations respectively. The range in which the substrate moves is 3.6 m in the X-axis direction and 2.0 m in the Y-axis direction. In this case, the size of the device (column) and the stage movement range are reduced in size in the Y-axis direction.

  Further, according to the present invention, it is possible to reduce the cost and running cost of the exposure apparatus. For example, as shown in FIG. 18, when four shot areas on one substrate are exposed, assuming that the processing time per one substrate (so-called tact) is set to 60 seconds, for example, one exposure is conventionally performed. Although the apparatus had to expose four shot areas in 60 seconds, in the present invention, for example, the first and second shot areas are exposed in 60 seconds and the second exposure is performed in the first exposure station. Even if the third and fourth shot areas are exposed in the station in 60 seconds, a tact time of 60 seconds can be realized as a whole. Therefore, there is a margin in the processing of each exposure station, the desired tact can be realized without giving high performance to the mechanism or apparatus that affects the tact in each exposure station, the cost of the exposure apparatus itself can be reduced, In addition, running costs can be reduced. For example, since exposure processing can take time, even if exposure is performed by reducing the scanning speed of a mask or a substrate (stage) in a state where the output of a light source that emits exposure light is lowered, The desired dose (exposure amount) can be obtained within the set time. Therefore, the lifetime of the light source can be extended, an inexpensive small output light source can be used, and the cost can be reduced. Further, since the moving speed (acceleration) of the stage can be reduced, a driving device for driving the stage can be configured at low cost, and the rigidity of the device can be reduced, thereby reducing the cost. And even if it is a short tact which was difficult to realize with one exposure apparatus, a desired tact can be realized relatively easily by providing two or more exposure stations.

  According to the present invention, at least two exposure stations capable of exposing the substrate are provided, and after the first exposure is performed on the substrate at the first exposure station, the first exposure is performed on the substrate subjected to the first exposure. By continuously performing the second exposure at the second exposure station, it is possible to suppress the enlargement of the apparatus and the range of movement of the stage, which is caused by the change in the position of the center of gravity accompanying the movement of the stage. It is possible to perform exposure processing with high accuracy while suppressing the occurrence of bending of the apparatus (column). Further, the cost of the exposure apparatus and the running cost can be reduced.

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a front view showing an embodiment of an exposure apparatus of the present invention, and FIG. 2 is a schematic perspective view. 1 and 2, the exposure apparatus EX includes a first exposure station ST1 and a second exposure station ST2 that can expose a pattern of a mask M onto a photosensitive substrate P, which is a photosensitive substrate, and these first and second exposure stations. And a control system CONT that controls the exposure operation of the stations ST1 and ST2. The first exposure station ST1 and the second exposure station ST2 are provided side by side in the Y-axis direction and have substantially the same configuration, and the control system CONT performs the exposure operations of the first and second exposure stations ST1 and ST2. Are individually controllable.

Hereinafter, the first exposure station ST1 will be described.
The first exposure station ST1 illuminates the mask stage MST that supports the mask M on which the pattern is formed, the substrate stage PST that supports the photosensitive substrate P, and the mask M supported by the mask stage MST with the exposure light EL. An optical system IL, a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the photosensitive substrate P supported by the substrate stage PST, and the projection optical system PL via the surface plate 1 And a supporting column 100. The column 100 has an upper plate portion 100A and leg portions 100B extending downward from the four corners of the upper plate portion 100A, and is installed on a base plate 110 placed horizontally on the floor surface. . In the present embodiment, the projection optical system PL has a plurality (seven) of projection optical modules PLa to PLg, and the illumination optical system IL has a plurality (seven) corresponding to the number and arrangement of the projection optical modules. The illumination optical module is provided. The photosensitive substrate P is obtained by applying a photosensitive agent (photoresist) to a glass substrate.

  Here, the exposure apparatus EX according to the present embodiment is a scanning exposure apparatus that performs scanning exposure by synchronously moving the mask M and the photosensitive substrate P with respect to the projection optical system PL, and is a so-called multi-lens scanning exposure apparatus. Is configured. In the following description, the synchronous movement direction of the mask M and the photosensitive substrate P is the X-axis direction (scanning direction), the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis direction, and the Y-axis. The direction orthogonal to the direction is taken as the Z-axis direction. The directions around the X, Y, and Z axes are the θX, θY, and θZ directions.

  Although not shown, the illumination optical system IL includes a plurality of light sources, a light guide that once collects the light beams emitted from the plurality of light sources, and distributes and emits them uniformly, and a uniform illuminance distribution of the light beams from the light guide An optical integrator for converting the light into a light beam (exposure light), a blind part having an opening for shaping the exposure light from the optical integrator into a slit shape, and the exposure light that has passed through the blind part is imaged on the mask M And a condenser lens. The exposure light from the condenser lens illuminates the mask M with a plurality of slit-shaped illumination areas. A mercury lamp is used as a light source in the present embodiment, and as exposure light, a g-line (436 nm), h-line (405 nm), and i-line (365 nm), which are wavelengths necessary for exposure, by a wavelength selection filter (not shown). Etc. are used.

  Mask stage MST is movable in the X-axis, Y-axis, and θZ directions by a drive device such as a linear motor while supporting mask M. The linear motor may be a so-called moving magnet type linear motor in which the stator is constituted by a coil unit (armature unit) and the mover is constituted by a magnet unit, or the stator is constituted by a magnet unit and the mover is constituted by a coil unit. A so-called moving coil linear motor may be used. Then, the mask stage MST moves as the mover is driven by electromagnetic interaction with the stator. The mask stage MST is provided with a chuck mechanism having a vacuum suction hole, and the mask stage MST holds the mask M via the chuck mechanism. In addition, an opening 3 (see FIG. 2) through which the exposure light EL transmitted through the mask M can pass is provided at the center of the mask stage MST.

  A movable mirror 70 is provided at each of the + X side edge and the −Y side edge of the mask stage MST, and a laser interferometer 71 is provided at a position facing the movable mirror 70. The laser interferometer 71 is installed on the upper plate portion 100A of the column 100. The two-dimensional position and rotation angle of the mask M on the mask stage MST are measured in real time by the laser interferometer 71, and the measurement result is output to the control system CONT. The control system CONT positions the mask M supported by the mask stage MST by driving the mask stage driving device based on the measurement result of the laser interferometer 71.

  The projection optical system PL has a plurality (seven) of projection optical modules PLa to PLg, and the plurality of projection optical modules PLa to PLg are supported by one surface plate 1. Among the plurality of projection optical modules PLa to PLg, the projection optical modules PLa, PLc, PLe, and PLg are arranged side by side in the Y-axis direction, and the projection optical modules PLb, PLd, and PLf are arranged side by side in the Y-axis direction. Further, the projection optical modules PLa, PLc, PLe, and PLg arranged in the Y-axis direction and the projection optical modules PLb, PLd, and PLf arranged in the Y-axis direction are arranged so as to face each other in the X-axis direction. It is arranged in a staggered pattern. That is, each of the projection optical modules PLa to PLg arranged in a staggered manner is arranged by displacing adjacent projection optical modules (for example, projection optical modules PLa and PLb, PLb and PLc) by a predetermined amount in the Y-axis direction. ing.

  Each of the projection optical modules PLa to PLg is composed of a plurality of optical elements, and includes a field stop for setting a projection area, an imaging characteristic adjusting device, and the like. The imaging characteristic adjustment device adjusts the imaging characteristics of a pattern image by driving a specific optical element among a plurality of optical elements, and includes image shift, scaling, rotation, and image plane position (image plane). (Tilt) etc. can be adjusted. In addition, optical elements (lenses) constituting each of the projection optical modules PLa to PLg are arranged inside the lens barrel. The imaging characteristic adjusting device may be a mechanism that adjusts the internal pressure by sealing between some optical elements (lenses).

  The surface plate 1 is kinematically supported by the upper plate portion 100 </ b> A of the column 100 via the support portion 2. Here, an opening 100C is provided in the central portion of the upper plate portion 100A, and the surface plate 1 is supported on the peripheral portion of the opening 100C in the upper plate portion 100A. And the lower part of projection optical module PLa-PLg is arrange | positioned at the opening part 100C. Further, an opening is formed in the center of the surface plate 1, and the optical path of the exposure light EL of each of the projection optical modules PLa to PLg is secured by this opening. The surface plate 1 is made of, for example, a metal matrix composite material (MMC: Metal Matrix Composites). The metal matrix composite material is a composite material in which a metal is used as a matrix material and a ceramic reinforcing material is composited therein. Here, a material containing aluminum as a metal is used. In FIG. 1, a step portion is formed on the peripheral portion of the opening 100 </ b> C and the support portion 2 is provided on the step portion, but the upper plate portion 100 </ b> A may be a flat surface.

  The substrate stage PST is provided on the base plate 110 and can be moved in the X-axis, Y-axis, and θZ directions by a driving device such as a linear motor while supporting the photosensitive substrate P. Furthermore, the substrate stage PST is also movable in the Z-axis direction and the θX and θY directions. The linear motor may be a moving magnet type linear motor or a moving coil type linear motor. Then, the substrate stage PST moves when the mover is driven by electromagnetic interaction with the stator. The substrate stage PST is provided with a chuck mechanism having a vacuum suction hole, and the substrate stage PST holds the photosensitive substrate P via the chuck mechanism.

  A movable mirror 80 is provided at each of the + X side edge and the −Y side edge of the substrate stage PST, and a laser interferometer 81 is provided at a position facing the movable mirror 80. The laser interferometer 81 is attached to the lower portion of the upper plate portion 100A of the column 100. The two-dimensional position and rotation angle of the photosensitive substrate P on the substrate stage PST are measured in real time by the laser interferometer 81, and the measurement result is output to the control system CONT. The control system CONT positions the photosensitive substrate P supported by the substrate stage PST by driving the substrate stage driving device based on the measurement result of the laser interferometer 81.

  Although not shown, for example, between the −X side projection optical modules PLa, PLc, PLe, and PLg and the + X side projection optical modules PLb, PLd, and PLf, the pattern forming surface of the mask M and the photosensitive film are exposed. An autofocus detection system for detecting the position of the exposed surface of the substrate P in the Z-axis direction is provided. Based on the detection result of the autofocus detection system, the substrate stage PST is driven so that the image plane of the projection optical system PL and the exposed surface (front surface) of the photosensitive substrate P coincide.

  The first exposure station ST1 has been described above. Since the second exposure station ST2 has substantially the same configuration as the first exposure station ST1, description thereof is omitted.

  Here, as shown in FIG. 1, a part of the alignment system 60 for adjusting the position of the photosensitive substrate P is formed above the photosensitive substrate P supported by the substrate stage PST in the first exposure station ST1. A mark forming device 61 is provided. The mark forming device 61 is attached to the lower part of the upper plate portion 100A of the column 100 of the first exposure station ST1, and is used for aligning the photosensitive substrate P with a predetermined position on the photosensitive substrate P. Form. In the present embodiment, two mark forming apparatuses 61 are provided. On the other hand, the second exposure station ST2 is provided with a mark detection device 62 for detecting a mark formed on the photosensitive substrate P by the mark forming device 61 provided in the first exposure station ST1. The mark detection device 62 is attached to the lower part of the upper plate portion 100A of the column 100 of the second exposure station ST2, and is exposed at the first exposure station ST1 by detecting a mark formed on the photosensitive substrate P. The position of the shot area on the photosensitive substrate P can be detected. In the present embodiment, two mark detection devices 62 are provided corresponding to the mark forming device 61.

  As shown in FIG. 2, the exposure apparatus EX includes a transport system (loader system) 90 that transports the photosensitive substrate P. The transport system 90 includes a hand unit 91 that can hold the photosensitive substrate P, a first drive unit 92 that drives the hand unit 91, and a second drive unit 93 that moves the hand unit 91 together with the first drive unit 92. ing. The second drive unit 93 moves the hand unit 91 in the Y-axis direction together with the first drive unit 92 along the guide unit 93A extending in the Y-axis direction. The transport system (loader system) 90 can carry the unprocessed photosensitive substrate P transported from a coater apparatus (not shown) onto one of the first and second exposure stations ST1 and ST2. In addition, the photosensitive substrate P can be transported between the substrate stage PST of the first exposure station ST1 and the substrate stage PST of the second exposure station ST2. That is, the transport system 90 unloads the photosensitive substrate P exposed at the first exposure station ST1 (or the second exposure station ST2) from the substrate stage PST, and the second exposure station ST2 (or the first exposure station ST1). Can be loaded onto the substrate stage PST.

  In FIG. 2, one transport system 90 (hand unit 91) is illustrated, but the exposure apparatus EX includes a plurality of transport systems 90. For example, a plurality of photosensitive substrates P can be simultaneously loaded or unloaded to the substrate stages PST of the first and second exposure stations ST1 and ST2 by the plurality of transport systems 90, for example.

  Next, an embodiment of an exposure method using the above-described exposure apparatus EX will be described with reference to FIGS. FIG. 3 is a flowchart showing the exposure method of the present embodiment, and FIG. 4 is a schematic diagram showing the exposure operation in the first and second exposure stations ST1 and ST2. Hereinafter, as shown in FIG. 4, a case where the pattern of the mask M is scanned and exposed to each of four shot areas (exposure areas) SH1 to SH4 set in advance on the photosensitive substrate P will be described.

Here, FIG. 4A shows a state in which the first and second shot regions SH1 and SH2 on the photosensitive substrate P are exposed in the first exposure station ST1, and FIG. The state in which the third and fourth shot areas SH3 and SH4 on the photosensitive substrate P are exposed in the second exposure station ST2 is shown. Then, as shown in FIG. 4A, the photosensitive substrate P scans and moves in the X-axis direction with respect to the projection area AR1 of the projection optical system PL of the first exposure station ST1, so that the control system CONT Of the plurality of preset shot areas SH1 to SH4 on P, the first and second shot areas SH1 and SH2, which are part of the shot areas, are exposed at the first exposure station ST1, and FIG. As shown, the photosensitive substrate P scans and moves in the X-axis direction with respect to the projection area AR2 of the projection optical system PL of the second exposure station ST2, so that the remaining (other part) shot area is the third shot area. The fourth shot areas SH3 and SH4 are exposed at the second exposure station ST2.
The projection areas of the projection optical modules PLa to PLg are, for example, trapezoidal and are actually arranged in a staggered pattern on the photosensitive substrate P, but in FIG. The projection areas AR (AR1, AR2) will be described by combining the projection areas and having the longitudinal direction in the Y-axis direction.

  A photosensitive substrate (first photosensitive substrate) P that has been transported from a coater (not shown) before exposure processing is loaded (carried in) onto the substrate stage PST of the first exposure station ST1 by the transport system 90 (step SA1).

  In the first exposure station ST1, the control system CONT scans the substrate stage PST supporting the first photosensitive substrate P and the mask stage MST supporting the mask M in the X-axis direction in synchronization with the illumination optical system IL. The mask M is illuminated with the exposure light EL, and the pattern of the mask M is exposed to the first photosensitive substrate P. Here, the control system CONT exposes the first shot area SH1 and the second shot area SH2 as the first area on the photosensitive substrate P (first exposure) (step SA2: first process).

  In the first exposure station ST1, after the exposure of the first and second shot areas SH1 and SH2 of the first photosensitive substrate P is performed, the control system CONT uses the transport system 90 to transfer the first photosensitive substrate P. Unload (unload) from the substrate stage PST of the first exposure station ST1. Then, the control system CONT loads (loads) the first photosensitive substrate P onto the substrate stage PST of the second exposure station ST2 (Step SA3).

Then, the control system CONT continuously exposes (second exposure) the first photosensitive substrate P exposed at the first exposure station ST1 (first exposure) at the second exposure station ST2 (step SA4: Second step).
At this time, in the second exposure station ST2, the control system CONT differs from the first and second shot areas SH1 and SH2 in the third shot area SH3 and the fourth shot area as second areas on the photosensitive substrate P. SH4 is exposed. Then, the control system CONT carries out the photosensitive substrate P exposed from the first to fourth shot areas SH1 to SH4 from the second exposure station ST2, and carries it to, for example, a developer apparatus.

In parallel with the exposure processing for the third and fourth shot areas SH3 and SH4 of the first photosensitive substrate P in the second exposure station ST2, the photosensitive substrate (second photosensitive substrate) P before the exposure processing is transferred to the transport system 90. Is loaded (carried in) on the substrate stage PST of the first exposure station ST1 (step SA5).
Then, the control system CONT exposes (first exposure) the first shot area SH1 and the second shot area SH2 as the first area on the second photosensitive substrate P in the first exposure station ST1 (step exposure). SA6).
That is, the control system CONT performs control so that the exposure process (step SA6) in the first exposure station ST1 and the exposure process (step SA4) in the second exposure station ST2 are performed simultaneously, and the first photosensitive substrate and the second photosensitive substrate. The photosensitive substrate is exposed in parallel.

In the first exposure station ST1, after the exposure of the first and second shot areas SH1 and SH2 of the second photosensitive substrate P is performed, the control system CONT uses the transport system 90 to transfer the second photosensitive substrate P. Unloading is performed from the substrate stage PST of the first exposure station ST1, and loading (carrying in) is performed on the substrate stage PST of the second exposure station ST2 (step SA7).
Then, the control system CONT performs exposure on the third and fourth shot areas SH3 and SH4 of the second photosensitive substrate P exposed at the first exposure station ST1 in the second exposure station ST2 (step SA8).

  Thereafter, in the same procedure, a plurality of photosensitive substrates (third photosensitive substrate, fourth photosensitive substrate,...) Are sequentially exposed using the first and second exposure stations ST1 and ST2.

  In the first exposure station ST1, the photosensitive substrate P (substrate stage PST) moves in a movement area B1 indicated by a broken line in FIG. 4A, and in the second exposure station ST2, movement indicated by a broken line in FIG. 4B. Move in area B2. At this time, in each of the first and second exposure stations ST1 and ST2, the photosensitive substrate P (substrate stage PST) is configured not to perform step movement in the Y-axis direction, so that the movement regions B1 and B2 are kept small. Can do. For example, when the size of the photosensitive substrate P is 1800 mm × 2000 mm, the moving regions B1 and B2 can be suppressed to about 3.6 m × 2.0 m, compared with the case where exposure is performed with one conventional exposure apparatus. The moving area of the stage can be reduced.

By the way, when the pattern of the mask M is exposed to the first and second shot areas SH1 and SH2 on the photosensitive substrate P at the first exposure station ST1, the control system CONT is mounted on the substrate stage PST of the first exposure station ST1. A mark for alignment is formed using a mark forming device 61 at a predetermined position on the placed photosensitive substrate P.
FIG. 5A is a schematic diagram showing a state in which a mark is formed at a predetermined position on the photosensitive substrate P using the mark forming apparatus 61 provided in the first exposure station ST1. As shown in FIG. 5A, the control system CONT forms a mark 63 at a position other than the shot area on the photosensitive substrate P by using the mark forming device 61. In the present embodiment, marks 63 are formed on both ends of the photosensitive substrate P in the X-axis direction. In FIG. 5, the marks 63 are formed at two locations, but can be formed at any three or more locations. In the present embodiment, the mark forming device 61 is configured by an irradiation device that irradiates a photosensitive agent (photoresist) on the photosensitive substrate P with a light beam. The control system CONT applies a spot-like light beam such as a laser beam from the mark forming device 61 to the photoresist on the photosensitive substrate P before or after performing exposure to the first and second shot regions SH1 and SH2 set in advance. The mark 63 is formed by irradiating and removing the photoresist at the irradiation position. At this time, the control system CONT uses the mark forming device 61 to form the mark 63 with a predetermined positional relationship with respect to the shot area.

  FIG. 5B shows a state in which the mark 63 formed on the photosensitive substrate P is detected in the first exposure station ST1 by using the mark detection device 62 provided in the second exposure station ST2. It is a schematic diagram. The control system CONT optically detects the mark 63 formed on the photosensitive substrate P using the mark detection device 62 before performing exposure to the preset third and fourth shot areas SH3 and SH4. To do. Here, the mark detection device 62 is arranged according to the mark forming device 61 (mark 63), and can detect a plurality of marks 63 arranged on the photosensitive substrate P substantially at the same time. The detection result of the mark detection device 62 is output to the control system CONT, and the control system CONT obtains the position information of the mark 63 based on the detection result of the mark detection device 62. Here, since the mark 63 is formed in a predetermined positional relationship with respect to the first and second shot areas SH1 and SH2, the control system CONT performs exposure at the first exposure station ST1 based on the position information of the mark 63. Position information of the first and second shot areas SH1 and SH2 of the photosensitive substrate P thus obtained can be obtained.

  Based on the obtained positional information of the first and second shot areas SH1 and SH2, the control system CONT applies the first and second shot areas SH1 and SH2 on the photosensitive substrate P exposed at the first exposure station ST1. On the other hand, the positions of the third and fourth shot areas SH3 and SH4 exposed at the second exposure station ST2 are adjusted by driving the substrate stage PST, for example. After adjusting the positions of the third and fourth shot regions SH3 and SH4 to be exposed, that is, the position of the photosensitive substrate P, the control system CONT applies the mask M to the third and fourth shot regions SH3 and SH4. Expose the pattern. Thereby, the first to fourth shot regions SH1 to SH4 can be arranged in a desired state (positional relationship) on the photosensitive substrate P.

  As described above, one photosensitive substrate P is not subjected to any process other than the exposure process such as the development process between the exposure at the first exposure station ST1 and the exposure at the second exposure station ST2. On the other hand, since the exposure is continuously performed at the second exposure station ST2 after the exposure at the first exposure station ST1, the enlargement of the apparatus can be suppressed and the moving range of the stage can be suppressed. Therefore, it is possible to perform exposure processing with high accuracy while suppressing the occurrence of bending of the apparatus (column) due to the change in the position of the center of gravity accompanying the movement of the stage.

  Even if the size of the photosensitive substrate P is increased, each exposure station can share a shot area to be exposed, so that each exposure station can be made relatively small, and the exposure apparatus itself can be easily manufactured. It is possible to carry out transportation smoothly. Further, by sharing the transport system 90 between the first and second exposure stations ST1 and ST2, the processing efficiency when the photosensitive substrate P is continuously exposed at the first and second exposure stations ST1 and ST2 is improved. can do.

  In the present embodiment, the substrate stage PST of each of the first and second exposure stations ST1 and ST2 is configured to scan and move in the X-axis direction but not in the Y-axis direction. Installation of the drive device for moving in the Y-axis direction can be omitted, and the device configuration can be simplified.

  Even when the plurality of shot areas SH1 to SH4 are exposed across the first and second exposure stations ST1 and ST2 by providing the alignment system 60 including the mark forming device 61 and the mark detecting device 62, The shot areas SH1 to SH4 can be arranged in a desired state. When sequentially laminating a plurality of patterns on the photosensitive substrate P, when forming the second and subsequent patterns, for example, the alignment mark formed on the mask M is exposed on the photosensitive substrate P and developed. An alignment mark is formed on the photosensitive substrate P, and the next pattern can be accurately formed at a desired position using the alignment mark previously formed on the photosensitive substrate P. When exposure is performed on the photosensitive substrate P, there is no alignment mark on the photosensitive substrate P. Therefore, when a plurality of shot areas are exposed across a plurality of exposure stations, an arrangement error may occur in the shot areas. When forming the pattern of the first layer, an outer shape measurement (potential measurement) is performed by mechanically measuring the position of the photosensitive substrate P by applying, for example, a pin member to the edge of the photosensitive substrate P, and an arrangement (position) of shot areas. However, the measurement error may increase due to an edge shape error (manufacturing error) of the photosensitive substrate P or the like. However, the first exposure is performed by irradiating the photoresist on the photosensitive substrate P with a light beam, removing a part of the photoresist to form a mark 63, and optically detecting the mark 63 with the mark detection device 62. Even when exposure is performed across the station ST1 and the second exposure station ST2, the shot areas SH1 and SH2 on the photosensitive substrate P exposed at the first exposure station ST1 are exposed at the second exposure station ST2. The shot areas SH3 and SH4 can be adjusted to desired positions.

  For example, in order to manufacture a liquid crystal display device, each shot region SH1 to SH4 is provided with a switching element such as a thin film transistor, and then includes the photosensitive substrate P and another element such as a color filter manufactured in another process. In some cases, the substrate is overlapped and divided into a predetermined size. However, the color filter and the switching element are accurately overlapped by arranging the shot areas on the photosensitive substrate P in a desired state. Can do. Thus, the post process can be smoothly performed by arranging the shot regions in a desired state.

  In the case of forming the second and subsequent patterns on the photosensitive substrate P, as described above, for example, the alignment mark formed by transferring the alignment mark formed on the mask M onto the photosensitive substrate P. Can be aligned with high accuracy. Of course, it is also possible to perform alignment when forming the second and subsequent patterns using the marks 63 formed by the mark forming device 61.

  In the above-described embodiment, the control system CONT uses the first and second shot areas SH1 and SH2, which are some of the shot areas SH1 to SH4 set in advance on the photosensitive substrate P, as the first shot areas. The exposure is performed at the exposure station ST1, and the third and fourth shot areas SH3 and SH4, which are other partial shot areas, are exposed at the second exposure station SH2. The same shot area (exposure area) may be exposed in the exposure at the two exposure station ST2. That is, the pattern transferred onto the photosensitive substrate P at the first exposure station ST1 may be overlaid with the next pattern on the pattern transferred at the first exposure station ST1 at the second exposure station ST2. . Further, when the patterns are overlaid at the second exposure station ST2, the exposure may be performed so that the whole pattern is transferred onto the photosensitive substrate P at the first exposure station ST1, or a part thereof is overlaid. May be exposed (joint exposure).

  In the present embodiment, the mark forming device 61 forms a mark 63 by irradiating the photoresist of the photosensitive substrate P with a light beam, and the mark 63 is detected. Without detecting the position of the pattern (shot area) exposed in the first exposure station ST1, the second exposure station ST2 detects the position of the shot area exposed in the second exposure station ST2 based on the detection result. You may make it adjust. That is, when a pattern is exposed on the photosensitive substrate P, a latent image is formed on the photoresist. When the exposure light EL is ultraviolet light, the reflection characteristics of the photoresist in the once exposed area with respect to the ultraviolet light have different characteristics with respect to the areas other than the exposed area. Therefore, the position of the pattern (first and second shot areas SH1, SH2) exposed at the first exposure station ST1 by irradiating the photosensitive substrate P with ultraviolet light at the second exposure station ST2 and detecting the reflected light. Can be requested. If the light intensity (illuminance) of ultraviolet light for detecting the position of the pattern is set to a value sufficiently lower than the exposure light EL for exposing the pattern and the irradiation time is shortened, the influence on the pattern (photoresist) Can be suppressed. Thus, when the position of the pattern exposed at the first exposure station ST1 is detected at the second exposure station ST2, the reflected light when the photosensitive substrate P is irradiated with irradiation light having substantially the same wavelength as the exposure light EL. The position of the pattern exposed at the first exposure station ST1 can be obtained based on the light reception result of.

  In the present embodiment, the control system CONT exposes the first and second shot areas SH1 and SH2 in the first exposure station ST1, and then performs the third and fourth shot areas SH3 and SH4 in the second exposure station ST2. As described above, of course, after the third and fourth shot areas SH3 and SH4 are exposed in the first exposure station ST1, the first and second shot areas SH1 and SH2 are exposed in the second exposure station ST2. You may do it.

  Alternatively, the control system CONT may expose the photosensitive substrate P at the first exposure station ST1 after exposing the photosensitive substrate P at the second exposure station ST2. In this case, a mark forming device 61 is provided at the second exposure station ST2, and a mark detection device 62 is provided at the first exposure station ST1.

  In the first embodiment, the case where four shot areas (exposure areas) SH1 to SH4 are set on the photosensitive substrate P has been described. Of course, an arbitrary number of shot areas can be set and exposed. .

  By the way, when four shot areas SH1 to SH4 are set and exposed on the photosensitive substrate P, it is assumed that the processing time (tact, set time) per one photosensitive substrate P is set to 60 seconds, for example. The tact of the exposure apparatus EX can be set according to the processing time (tact) of the coater apparatus or developer apparatus connected to the exposure apparatus EX. Then, the processing time for exposing the first and second shot areas SH1 and SH2 in the first exposure station ST1 may be 60 seconds. Similarly, the third and fourth shot areas SH3 in the second exposure station ST2 are used. The processing time for exposing SH4 may be 60 seconds. Further, for example, when two shot areas SH1 and SH2 are set on the photosensitive substrate P, the first shot area SH1 is exposed at the first exposure station ST1, and the second shot area SH2 is exposed at the second exposure station ST2. Can take 60 seconds to expose one shot area SH1 (SH2). In this way, there is a margin in the processing of each exposure station ST1, ST2, and for example, it is possible to take time for the exposure processing. Even if the scanning speed is reduced, a desired dose amount (exposure amount) can be obtained within a preset tact (set time). Therefore, the lifetime of the light source can be extended, an inexpensive small output light source can be used, and the cost can be reduced. In addition, since the moving speed (acceleration) of the substrate stage PST and the mask stage MST can be reduced, the drive device for driving the stage can be configured at low cost, the rigidity of the device can be reduced, and the cost can be reduced.

  As described above, when the plurality of photosensitive substrates P are sequentially exposed using the first and second exposure stations ST1 and ST2, the control system CONT irradiates the exposure light of each of the first and second exposure stations ST1 and ST2. By controlling the exposure operation including the conditions (light source output) and the stage moving conditions (stage moving speed) based on a preset tact (set time), the cost and running cost of the exposure apparatus can be reduced.

  In the present embodiment, the pattern of the mask M used for the exposure at the first exposure station ST1 and the pattern of the mask M used for the exposure at the second exposure station ST2 may be the same pattern or different patterns. By making the pattern of the mask M placed on the mask stage MST of each of the first and second exposure stations ST1 and ST2 the same, it is the same as each of the first to fourth shot areas SH1 to SH4 on the photosensitive substrate P. The pattern can be exposed. On the other hand, the first and second shot areas SH1 and SH2 (first areas) are obtained by making the patterns of the masks M placed on the mask stages MST of the first and second exposure stations ST1 and ST2 different from each other. Different patterns can be exposed on the photosensitive substrate P by the exposure on the third and fourth shot regions SH3 and SH4 (second region).

  FIG. 6 is a schematic diagram showing a state in which different patterns Pa and Pb are exposed on the photosensitive substrate P by the exposure at the first exposure station ST1 and the exposure at the second exposure station ST2. As shown in FIG. 6A, a mask M having a pattern Pa is supported on the mask stage MST of the first exposure station ST1, and the control system CONT uses the pattern Pa as the first and second shot areas of the photosensitive substrate P. Exposure to SH1 and SH2. Further, as shown in FIG. 6B, a mask M having a pattern Pb is supported on the mask stage MST of the second exposure station ST2, and the control system CONT uses the pattern Pb as the third and fourth patterns of the photosensitive substrate P. The shot areas SH3 and SH4 are exposed. Thus, different devices having patterns Pa and Pb, respectively, are manufactured on one photosensitive substrate P.

  In FIG. 6, two different types of devices are manufactured on the photosensitive substrate P. Of course, any plural types of devices of three or more types can be manufactured on one photosensitive substrate P.

  In FIG. 6, the pattern Pa and the pattern Pb on the photosensitive substrate P are shown to have almost the same size, but they may have different sizes. For example, when manufacturing a liquid crystal display device (display) on the photosensitive substrate P, a predetermined number of first patterns having the first size are formed on the photosensitive substrate P, and the second smaller than the first size. By forming the second pattern having the size of 2 in the region other than the region where the first pattern is formed on the photosensitive substrate P, the region where the pattern is not formed can be reduced and the photosensitive substrate P can be effectively used.

  In the example shown in FIG. 7A, one pattern Pa is formed on the first photosensitive substrate P1 at a predetermined position by the first exposure station ST1, and the pattern Pb has a size (shape) different from the pattern Pa. Are formed by the second exposure station ST2. On the other hand, in the example shown in FIG. 7B, the pattern Pc is formed at a predetermined position by the first exposure station ST1 on the second photosensitive substrate P2 having a size (shape) different from that of the first photosensitive substrate P1. Are formed, and three patterns Pd having a size (shape) different from the pattern Pc are formed by the second exposure station ST2. As described above, the control system CONT can change the exposure area of each of the first and second exposure stations ST1 and ST2 in accordance with the photosensitive substrate P for manufacturing the device.

When a plurality of types of different devices (two types in FIG. 6) are provided on the photosensitive substrate P, the control system CONT exposes each of the first and second exposure stations ST1 and ST2 with respect to the plurality of shot regions SH1 to SH4. The operation may be individually controlled and changed according to the photosensitive substrate P for manufacturing the device. For example, when the pattern transfer accuracy required for each of the patterns (devices) Pa and Pb is different from each other, and when the pattern Pa is exposed, a higher pattern transfer accuracy is required than when the pattern Pb is exposed, The alignment processing time for exposing Pa is set longer than the alignment processing time for exposing pattern Pb (specifically, the number of alignment marks to be detected is increased), and each of patterns Pa and Pb is exposed. The exposure operation at the first exposure station ST1 and the exposure operation at the second exposure station ST2 are different from each other, such as setting the scanning speed of the photosensitive substrate P to be different from each other. The control system CONT can be controlled.
In this case, the control system CONT controls the exposure operations of the first and second exposure stations ST1 and ST2 based on a preset tact (set time), and the tact is set to a predetermined time (for example, 60 seconds). In the tact, the processing time for exposing the pattern Pa is set longer than the processing time for exposing the pattern Pb, and each of the patterns Pa and Pb is set in the first and second exposure stations ST1 and ST2. Each is exposed.

  In the above embodiment, an example in which two exposure stations are provided has been described. Of course, a configuration in which three or more exposure stations are provided may be used.

  In the embodiment described above, the substrate stage PST is moved with respect to the projection optical system PL. However, the projection optical system PL (and the mask stage MST) may be moved. This also makes it possible to reduce the movement range of the substrate stage PST. In order to move the projection optical system PL, for example, a column 100 (100A) is provided with a guide portion for guiding the movement of the projection optical system PL and moved using a driving device such as a linear motor, or a surface plate. 1 can move together. If the projection optical system PL is movable, for example, during scanning exposure, the substrate stage PST is scanned and moved in the X-axis direction with the position of the projection optical system PL fixed, and one scanning exposure is performed. After the completion, the projection optical system PL may be moved stepwise in the Y-axis direction. When the projection optical system PL moves stepwise, the substrate stage PST does not need to move in the Y-axis direction (or only finely moves).

  Note that the movable mirror 70 attached to the mask stage MST of each of the first and second exposure stations ST1 and ST2 is configured to perform position measurement using a corner cube if a one-dimensional scanning operation is acceptable. Also good.

Next, a second embodiment of the present invention will be described. Here, in the following description, the same or equivalent components as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified or omitted.
FIG. 8 is a schematic diagram showing a state in which each of the six shot areas SH1 to SH6 set on the photosensitive substrate P is exposed.
As shown in FIG. 8A, in the first exposure station ST1, the control system CONT exposes the first to fourth shot areas SH1 to SH4 on the photosensitive substrate P. Next, as shown in FIG. 8B, in the second exposure station ST2, the control system CONT exposes the fifth and sixth shot regions SH5 and SH6 on the photosensitive substrate P. For example, when the size of the photosensitive substrate P is 2000 mm × 1800 mm and one shot area is set to 1.0 m × 0.6 m, the photosensitive substrate P (substrate stage PST) in the first exposure station ST1 is set. Since the step moving distance in the Y-axis direction may be about 0.6 m, the moving area B1 may be about 4.0 m × 2.4 m. On the other hand, it is not necessary for the photosensitive substrate P (substrate stage PST) to move stepwise in the Y-axis direction at the second exposure station ST2, and the fifth and sixth shot regions SH5 and SH6 can be exposed by simply moving in the X-axis direction. .

  By the way, when sequentially exposing a plurality of photosensitive substrates P, after the first to fourth shot areas SH1 to SH4 are exposed at the first exposure station ST1, the fifth and sixth shot areas SH5 and SH6 are exposed at the second exposure station ST2. Since the number of shot areas exposed in the first exposure station ST1 is larger than the number of shot areas exposed in the second exposure station ST2, the exposure processing stop time (waiting time) is long in the second exposure station. Thus, productivity is reduced.

  Therefore, as shown in FIG. 9, the control system CONT loads the first photosensitive substrate P before the exposure processing onto the substrate stage PST of the first exposure station ST1 by using the transport system 90 (step SB1). In the exposure station ST1, the first to fourth shot areas SH1 to HS4 of the first photosensitive substrate P are exposed (step SB2). Next, the control system CONT unloads the first photosensitive substrate P exposed at the first exposure station ST1 from the substrate stage PST of the first exposure station ST1 using the transport system 90, and the substrate of the second exposure station ST2. Load to the stage PST (step SB3). In the second exposure station ST2, the control system CONT exposes the fifth and sixth shot areas SH5 and SH6 of the first photosensitive substrate P (step SB4).

  Here, in parallel with Step SB3 and Step SB4, the control system CONT loads the second photosensitive substrate P before exposure processing onto the substrate stage PST of the first exposure station ST1 using the transport system 90 (Step SB5). ) In the first exposure station ST1, the fifth and sixth shot areas SH5 and SH6 of the second photosensitive substrate P are exposed (step SB6). Then, after exposing the second photosensitive substrate P at the first exposure station ST1, the control system CONT unloads the second photosensitive substrate P from the substrate stage PST of the first exposure station ST1 using the transport system 90, The substrate is loaded onto the substrate stage PST of the second exposure station ST2 (Step SB7). At this time, the first photosensitive substrate P that has been exposed in the second exposure station ST2 is unloaded by the transport system 90. Then, the control system CONT exposes the first to fourth shot areas SH1 to SH4 of the second photosensitive substrate P at the second exposure station ST2 (step SB8).

  In parallel with Step SB7 and Step SB8, the control system CONT loads the third photosensitive substrate P before exposure processing onto the substrate stage PST of the first exposure station ST1 using the transport system 90 (Step SB9). In the first exposure station ST1, the first to fourth shot areas SH1 to SH4 of the third photosensitive substrate P are exposed (step SB10). Next, the control system CONT loads the third photosensitive substrate P onto the substrate stage PST of the second exposure station ST2 using the transport system 90 (step SB11). At this time, the exposure of the second photosensitive substrate P in the second exposure station ST2 has been completed, and the second photosensitive substrate P has been unloaded. Then, the control system CONT exposes the fifth and sixth shot areas SH5 and SH6 of the third photosensitive substrate P (step SB12).

  Further, in parallel with Step SB11 and Step SB12, the control system CONT loads the fourth photosensitive substrate P before exposure processing onto the substrate stage PST of the first exposure station ST1 using the transport system 90 (Step SB13). In the first exposure station ST1, the fifth and sixth shot areas SH5 and SH6 of the fourth photosensitive substrate P are exposed (step SB14). Next, the control system CONT loads the fourth photosensitive substrate P onto the substrate stage PST of the second exposure station ST2 using the transport system 90 (step SB15), and the first to fourth shot areas of the fourth photosensitive substrate P. SH1 to SH4 are exposed (step SB16).

  Thereafter, a plurality of photosensitive substrates P are sequentially exposed using the first and second exposure stations ST1 and ST2 in the same procedure.

  As described above, when the plurality of photosensitive substrates P are sequentially exposed using the first exposure station ST1 and the second exposure station ST2, the control system CONT exposes each of the first and second exposure stations ST1 and ST2. The region (shot region) can be changed according to the photosensitive substrate P. Then, the control system CONT performs an exposure operation for performing exposure in each of the first and second exposure stations ST1 and ST2 out of a plurality of shot areas (exposure areas) SH1 to SH6 set in advance on the photosensitive substrate P. Then, the movement operation of the photosensitive substrate P when the first to fourth shot regions SH1 to SH4 are exposed and when the fifth and sixth shot regions SH5 and SH6 are exposed depends on the loaded photosensitive substrate P. Thus, the waiting time for the exposure process can be shortened or eliminated, and the exposure process can be performed efficiently.

  In the case of the embodiment described with reference to FIG. 9, the photosensitive substrate P (substrate stage PST) moves stepwise in the Y-axis direction during the exposure processing of the first and second exposure stations ST1 and ST2. However, as will be described later with reference to FIG. 16, for example, the first to fourth shot regions SH1 to SH4 of the first photosensitive substrate P are exposed to the first stage STST when the first exposure station ST1 exposes the first stage STST. The mounting state of the second photosensitive substrate P is different from the mounting state of the second photosensitive substrate P with respect to the substrate stage PST when the fifth and sixth shot regions SH5 and SH6 of the second photosensitive substrate P are exposed. As a result, the moving region of the photosensitive substrate P (substrate stage PST) can be suppressed.

  The control system CONT can arbitrarily set a combination of shot areas to be exposed in each of the first and second exposure stations ST1 and ST2. For example, the control system CONT exposes the first to third shot areas SH1 to SH3 on the photosensitive substrate P at the first exposure station ST1, and exposes the fourth to sixth shot areas SH4 to SH6 at the second exposure station ST2. You may make it do. In this case, since the exposure processing time at the first exposure station ST1 and the exposure processing time at the second exposure station ST2 are substantially the same, the waiting time of either one of the first and second exposure stations is eliminated. Or it can be shortened.

Next, a third embodiment of the present invention will be described with reference to FIG.
The control system CONT loads the first photosensitive substrate P before the exposure processing onto the substrate stage PST of the first exposure station ST1 using the transport system (loader system) 90 (step SC1).
Then, the control system CONT exposes the first to fourth shot areas SH1 to HS4 of the first photosensitive substrate P in the first exposure station ST1 (step SC2).

Here, while the exposure process for the first photosensitive substrate P is performed at the first exposure station ST1, the photosensitive substrate P is not placed on the substrate stage PST of the second exposure station ST2, and the exposure stopped state. It has become. That is, the first exposure station ST1 is operating and the second exposure station ST2 is stopped. Therefore, the control system CONT selects an exposure station for loading (carrying in) the photosensitive substrate P out of the first and second exposure stations ST1 and ST2 according to the operation status of the first and second exposure stations ST1 and ST2. Based on the selection result, the transport system (loader system) 90 is controlled. Specifically, the control system CONT selects the second exposure station ST2 in the exposure stop state from the first and second exposure stations ST1 and ST2, and uses the transport system 90 to perform the second exposure process before the exposure process. The photosensitive substrate P is loaded onto the substrate stage PST of the second exposure station ST2 (step SC3).
Since the control system CONT can individually control the exposure operations of the first and second exposure stations ST1 and ST2 with respect to a plurality of shot areas on the photosensitive substrate P, the second photosensitive substrate in the second exposure station ST2. The P first to fourth shot areas SH1 to HS4 are exposed (step SC4).

  Eventually, the exposure process for the first to fourth shot areas SH1 to SH4 of the first photosensitive substrate P at the first exposure station ST1 is completed. At this time, the exposure process for the first to fourth shot areas SH1 to SH4 of the second photosensitive substrate P at the second exposure station ST2 is continued. That is, the first exposure station ST1 stops its exposure operation, and the second exposure station ST2 is in operation. The control system CONT determines the operating status of the first and second exposure stations ST1 and ST2, controls the transport system 90, and unloads the first photosensitive substrate P from the substrate stage PST of the first exposure station ST1. .

  During the operation in which the transport system 90 is unloading the first photosensitive substrate P, the exposure process for the first to fourth shot regions SH1 to SH4 of the second photosensitive substrate P at the second exposure station ST2 is completed. . The control system CONT determines the operating status of the second exposure stations ST1 and ST2, controls the transport system 90, and unloads the second photosensitive substrate P from the substrate stage PST of the second exposure station ST2. As described above, a plurality of transport systems 90 are provided, and the transport system 90 for unloading the second photosensitive substrate P from the substrate stage PST of the second exposure station ST2 is the substrate stage of the first exposure station ST1. This is a transport system 90 different from the transport system 90 that unloads and holds the first photosensitive substrate P from the PST.

Next, the control system CONT loads the first photosensitive substrate P exposed and unloaded at the first exposure station ST1 onto the substrate stage PST of the second exposure station ST2 (step SC5). In the second exposure station ST2, the control system CONT exposes the fifth and sixth shot areas SH5 and SH6 of the first photosensitive substrate P (step SC6).
Further, the control system CONT loads the second photosensitive substrate P exposed and unloaded at the second exposure station ST2 onto the substrate stage PST of the first exposure station ST1 (step SC7). In the first exposure station ST1, the control system CONT exposes the fifth and sixth shot areas SH5 and SH6 of the second photosensitive substrate P (step SC8).

When the exposure of the second photosensitive substrate P at the first exposure station ST1 is completed, the control system CONT unloads the second photosensitive substrate P using the transport system 90. At this time, the exposure on the first photosensitive substrate P is continued in the second exposure station ST2. The control system CONT determines the operating status of the first and second exposure stations ST1 and ST2, and loads the third photosensitive substrate P before the exposure processing onto the substrate stage PST of the first exposure station ST1 (step SC9). In the first exposure station ST1, the control system CONT exposes the first to fourth shot areas SH1 to SH4 of the third photosensitive substrate P (step SC10).
Eventually, the exposure of the first photosensitive substrate P in the second exposure station ST2 is completed. The control system CONT uses the transport system 90 to unload the first photosensitive substrate P. Then, the control system CONT loads the fourth photosensitive substrate P before the exposure processing onto the substrate stage PST of the second exposure station ST2 (Step SC11). In the second exposure station ST2, the control system CONT exposes the first to fourth shot areas SH1 to SH4 of the fourth photosensitive substrate P (step SC12).

Eventually, the exposure process for the first to fourth shot areas SH1 to SH4 of the second photosensitive substrate P at the first exposure station ST1 is completed. The control system CONT determines the operating status of the first and second exposure stations ST1 and ST2, controls the transport system 90, and unloads the third photosensitive substrate P from the substrate stage PST of the first exposure station ST1. . Further, the control system CONT controls the transport system 90 after the exposure processing for the first to fourth shot regions SH1 to SH4 of the fourth photosensitive substrate P at the second exposure station ST2 is completed, and performs the second exposure. The fourth photosensitive substrate P is unloaded from the substrate stage PST of the station ST2. Then, the control system CONT loads the third photosensitive substrate P unloaded from the substrate stage PST of the first exposure station ST1 onto the substrate stage PST of the second exposure station ST2 (Step SC13), and the second exposure station ST2. , The fifth and sixth shot regions SH5 and SH6 of the third photosensitive substrate P are exposed (step SC14).
Further, the control system CONT loads the fourth photosensitive substrate P exposed and unloaded at the second exposure station ST2 onto the substrate stage PST of the first exposure station ST1 (step SC15), and in the first exposure station ST1. Then, the fifth and sixth shot regions SH5 and SH6 of the fourth photosensitive substrate P are exposed (step SC16).

  As described above, the control system CONT selects the exposure station to load the photosensitive substrate P according to the operating status of the first and second exposure stations ST1 and ST2, and sets the transport system 90 based on the selection result. Can be controlled. For example, when both the first and second exposure stations ST1 and ST2 are in operation (exposure processing is in progress), the control system CONT causes the transport system 90 to stand by, and the first and second exposure stations ST1 and ST2. When both are stopped, it is possible to control the loading of the photosensitive substrate P before the exposure processing to each of the first and second exposure stations ST1 and ST2 using the transport system 90. Alternatively, when one of the exposure stations performs, for example, alignment processing or exposure processing for a long time, or is inoperable due to a failure and cannot receive the photosensitive substrate P, the control system CONT can transfer the transport system 90. It is also possible to control such that only the other exposure station is loaded with the photosensitive substrate P.

In addition, when the plurality of photosensitive substrates P are sequentially exposed using the first and second exposure stations ST1 and ST2, the control system CONT performs the exposure operations of the first and second exposure stations ST1 and ST2, respectively. It can be controlled according to the operating status of the second exposure stations ST1, ST2.
For example, as described with reference to FIG. 7A, when the first exposure station ST1 exposes one pattern Pa and the second exposure station ST2 exposes four patterns Pb, the second exposure station Consider a case where the processing time in ST2 is longer than the processing time in the first exposure station ST1. Here, the processing time includes an exposure processing time and an alignment processing time. In this case, even if the exposure process of the pattern Pa in the first exposure station ST1 is completed, the exposure process of the pattern Pb in the second exposure station ST2 is continuing, so the control system CONT uses the transport system 90 to The photosensitive substrate P cannot be transferred from the first exposure station ST1 to the second exposure station ST2. Therefore, the control system CONT at the first exposure station ST1 until the processing at the second station ST2 is completed (until the photosensitive substrate P can be transported from the first exposure station ST1 to the second exposure station ST2). An exposure operation for the photosensitive substrate P is controlled. Specifically, for example, the alignment process time for the photosensitive substrate P in the first exposure station ST1 can be set longer, or the exposure process time can be set longer. By setting the alignment processing time longer, the pattern exposed on the photosensitive substrate P can be accurately positioned at a predetermined position, and by setting the exposure processing time longer, the light source output of the exposure light EL can be reduced and the stage moving speed can be reduced. Can be reduced.

For example, when a first device is manufactured by superimposing five layers on the first shot region SH1, and a second device is manufactured by superimposing seven layers on the second shot region SH2, as shown in FIG. As shown in the schematic diagram, the control system CONT exposes the first shot area SH1 in the first exposure station ST1, exposes the second shot area SH2 in the second exposure station ST2, and performs the first and second shot areas SH1. , SH2 is formed up to the fifth layer.
Next, as shown in FIG. 11B, the control system CONT includes one of the plurality of photosensitive substrates P on which patterns are formed up to the fifth layer in each of the first and second shot regions SH1 and SH2. The photosensitive substrate P is loaded onto the first exposure station ST1 using the transport system 90, and another photosensitive substrate P is loaded onto the second exposure station ST2. Then, the control system CONT exposes the sixth and seventh layer patterns on the second shot region SH2 of the photosensitive substrate P in each of the first and second exposure stations ST1 and ST2. At this time, the control system CONT can simultaneously perform the exposure operations of the sixth and seventh layer patterns on the second shot region SH2 of the photosensitive substrate P in the first and second exposure stations ST1 and ST2. A mask M having a pattern for forming the sixth and seventh layers is placed on the mask stage MST of both the first and second exposure stations ST1 and ST2. Further, in the first exposure station ST1, the transport system 90 loads the photosensitive substrate P onto the substrate stage PST so that the second shot region SH2 is disposed below the projection optical system PL. Further, the control system CONT uses the first device to adjust the light source output, the stage moving speed, or the imaging characteristics of the projection optical system PL, for example, in order to manufacture the second device at the first exposure station ST1. The exposure condition for manufacturing is changed to the optimal exposure condition (exposure operation) for manufacturing the second device.

Next, as a fourth embodiment of the present invention, the exposure operation in the first and second exposure stations ST1 and ST2 when manufacturing various sizes of devices (liquid crystal display devices) from one photosensitive substrate P is described. A specific example will be described with reference to FIGS. Hereinafter, a case where a liquid crystal display device (display) having an aspect ratio of 16: 9 is manufactured from a 1800 mm × 2000 mm photosensitive substrate (glass substrate) P will be described.
FIG. 12A is a diagram showing an example of a device (display) layout set on the photosensitive substrate P when a 21-inch display is manufactured. In this case, a 24-side display D can be manufactured from the photosensitive substrate P. FIG. 12B is a diagram showing an example of a device layout set on the photosensitive substrate P when a 24-inch display is manufactured, and an 18-side display D can be manufactured. Similarly, FIGS. 12C to 12F show examples of device layouts for manufacturing 26-inch, 28-inch, 37-inch, and 43-inch displays. 12-sided, 8-sided, and 6-sided displays D can be manufactured. In the case of manufacturing a display having a size of 43 inches or more, three screens can be manufactured.

  The exposure operation of the first and second exposure stations ST1 and S2 when manufacturing the display D based on the device layout shown in FIG. 12 will be described. When the tact of the entire exposure apparatus EX is set to 60 seconds, for example, one exposure station may perform processing on the photosensitive substrate P in 60 seconds. The tact of the exposure apparatus EX is set according to the tact of the coater apparatus or developer apparatus connected to the exposure apparatus EX as described above. If the number of shots at one exposure station (the number of scanning exposures) is large, the tact is reduced. Therefore, in order for the exposure apparatus EX to achieve a 60-second tact, it is necessary to limit the number of shots exposed at one exposure station to some extent. There is.

FIG. 13 shows an exposure operation when the number of shots in at least one of the first and second exposure stations ST1 and ST2 is set to 4 or less when a device is manufactured based on the device layout shown in FIG. It is a schematic diagram which shows an example. In FIG. 13, the area surrounded by the broken line L1 is a shot area exposed by one scanning exposure in the first exposure station ST1, and the area surrounded by the solid line L2 is one scanning exposure in the second exposure station ST2. This is a shot area to be exposed.
For example, in the case of manufacturing a 21-inch display, as shown in FIG. 13A, the first exposure station ST1 exposes three devices arranged in the X-axis direction in one scanning exposure (one shot). In the second exposure station ST2, three devices arranged in the X-axis direction are exposed in one scanning exposure (one shot), and this is performed four times. At this time, three device forming patterns are formed side by side in the X-axis direction on the mask M.
Similarly, when manufacturing a 24-inch display, as shown in FIG. 13B, the first exposure station ST1 exposes two devices in one scanning exposure (one shot), and this is performed five times. In the second exposure station ST2, two devices are exposed by one scanning exposure (one shot), and this is performed four times.
When manufacturing a 26-inch display, as shown in FIG. 13 (c), the first exposure station ST1 exposes two (or one) devices in one shot, and this is performed five times. In ST2, two (or one) devices are exposed in one shot, and this is performed four times.
In the case of manufacturing a 28-inch display, as shown in FIG. 13 (d), the first exposure station ST1 exposes two devices arranged in the Y-axis direction in one shot, and performs this three times. In ST2, two devices arranged in the Y-axis direction are exposed in one shot, and this is performed three times. At this time, two mask forming patterns are formed side by side in the Y-axis direction.
In the case of manufacturing a 37-inch display, as shown in FIG. 13 (e), one device is exposed in one shot at the first exposure station ST1, this is performed four times, and one shot is performed at the second exposure station ST2. One device is exposed and this is done four times. In the case of manufacturing a 43-inch display, as shown in FIG. 13 (f), the first exposure station ST1 exposes one device in one shot and performs this three times, and the second exposure station ST2 performs one shot in one shot. One device is exposed and this is done three times.
When exposing 21-inch, 26-inch, and 37-inch displays, as shown in FIG. 13, the photosensitive substrate P is placed on the substrate stage PST so that the longitudinal direction of the photosensitive substrate P is parallel to the Y-axis direction. When exposing 24 inch, 28 inch, and 43 inch displays, the photosensitive substrate P is placed on the substrate stage PST so that the longitudinal direction of the photosensitive substrate P is parallel to the X-axis direction.

  As described above, even when devices of various sizes are manufactured, the movement range of the photosensitive substrate P (substrate stage PST) in the first and second exposure stations ST1 and ST2 can be suppressed.

Incidentally, as described with reference to FIG. 13, a plurality of device formation patterns are formed side by side on the mask M, and the illumination area of the exposure light EL on the mask M and the projection of the projection optical system PL on the photosensitive substrate P are projected. By exposing while adjusting the region, a plurality of devices can be formed on the photosensitive substrate P by one scanning exposure (one shot). The adjustment of the illumination area with respect to the mask M or the adjustment of the projection area with respect to the photosensitive substrate P is provided, for example, around a blind portion (illumination area setting device) provided in the illumination optical system IL or around the pattern formation area of the mask M. It can be adjusted by the shading band.
Then, the control system CONT, based on the projection area of the projection optical system PL and the shot area (exposure area) that is a device formation area set in advance on the photosensitive substrate P, the first and second exposure stations ST1, The movement of the photosensitive substrate P in ST2 can be controlled.

  For example, when the length of the photosensitive substrate P in the Y-axis direction is L and two shot areas are set side by side in the Y-axis direction, one shot area is exposed in the first exposure station ST1, and the second exposure station ST2 If the other shot area is exposed, the substrate stage PST of each of the first and second exposure stations ST1 and ST2 does not have to move stepwise in the Y-axis direction.

FIG. 14A is a schematic diagram showing a state in which three shot regions SH1 to SH3 arranged in the Y-axis direction on the photosensitive substrate P are set and exposed. In this case, in the first exposure station ST1, the control system CONT sets the size of the projection area of the projection optical system PL on the photosensitive substrate P in the Y-axis direction to L / 3, and exposes the first shot area SH1. After (one line exposure), the photosensitive substrate P is moved by L / 3 steps in the Y-axis direction to expose the second shot region SH2 (one line exposure). Next, the control system CONT transports the photosensitive substrate P to the second exposure station ST2 using the transport system 90, and the projection area of the projection optical system PL on the photosensitive substrate P is set to L / L at the second exposure station ST2. 3, the third shot area SH3 is exposed (one-line exposure). As described above, by providing two exposure stations, the photosensitive substrate P only needs to be stepped by L / 3 in the first exposure station ST1, and the photosensitive substrate P is not stepped in the second exposure station ST2. Good. In this case, if there is one exposure station, it is necessary to move the photosensitive substrate P by 2L / 3 steps.
FIG. 14B is a schematic diagram showing a state in which four shot regions SH1 to SH4 arranged in the Y-axis direction on the photosensitive substrate P are set and exposed. In this case, the control system CONT sets the projection area of the projection optical system PL on the photosensitive substrate P to L / 4 at the first exposure station ST1, and exposes the first shot area SH1 (one-line exposure). Then, the photosensitive substrate P is moved by L / 4 steps in the Y-axis direction to expose the second shot region SH2 (one-line exposure). Next, the control system CONT transports the photosensitive substrate P to the second exposure station ST2 using the transport system 90, and the projection area of the projection optical system PL on the photosensitive substrate P is set to L / L at the second exposure station ST2. 4, the third shot region SH3 is exposed (single row exposure), and then the photosensitive substrate P is moved by L / 4 steps in the Y-axis direction to expose the fourth shot region SH4 (single row exposure). As described above, when there is one exposure station, it is necessary to move the photosensitive substrate P by 3L / 4 steps. By providing two exposure stations, the photosensitive substrate P has the first and second exposure stations. It is only necessary to move the step by L / 4 in each of the exposure stations ST1 and ST2.
FIG. 14C is a schematic diagram showing a state in which five shot areas SH1 to SH5 arranged in the Y-axis direction are set on the photosensitive substrate P and exposed. In this case, the control system CONT sets the projection area of the projection optical system PL on the photosensitive substrate P to L / 5 in the first exposure station ST1, and exposes the first shot area SH1 (one line exposure). Then, the photosensitive substrate P is moved by L / 5 steps in the Y-axis direction to expose the second shot region SH2 (one-line exposure). Thereafter, the control system CONT moves the photosensitive substrate P by L / 5 steps in the Y-axis direction to expose the third shot region SH3 (one line exposure). Next, the control system CONT transports the photosensitive substrate P to the second exposure station ST2 using the transport system 90, and the projection area of the projection optical system PL on the photosensitive substrate P is set to L / L at the second exposure station ST2. Then, the fourth shot area SH4 is exposed (one line exposure), and then the photosensitive substrate P is moved by L / 5 steps in the Y-axis direction to expose the fifth shot area SH5 (one line exposure). Thus, the photosensitive substrate P may be moved stepwise by 2L / 5 at the first exposure station ST1, and the photosensitive substrate P may be moved stepwise by L / 5 at the second exposure station ST2.
Further, the control system CONT adjusts the projection area of the projection optical system PL and simultaneously exposes a plurality of shot areas arranged in the Y-axis direction, thereby further reducing the step movement distance of the photosensitive substrate P.
For example, in FIG. 14C, the control system CONT sets the projection area of the projection optical system PL on the photosensitive substrate P to 2L / 5 at the first exposure station ST1, and the first and second shot areas SH1. , SH2 is exposed at the same time (two-row exposure), then the photosensitive substrate P is moved by L / 5 steps in the Y-axis direction, the projection area is set to L / 5, and the third shot area SH3 is exposed (single-line exposure). ) Next, the control system CONT transports the photosensitive substrate P to the second exposure station ST2 using the transport system 90, and the projection area of the projection optical system PL on the photosensitive substrate P is set to L / L at the second exposure station ST2. Then, the fourth shot area SH4 is exposed (one line exposure), and then the photosensitive substrate P is moved by L / 5 steps in the Y-axis direction to expose the fifth shot area SH5 (one line exposure). In this way, by adjusting the size of the projection area of the projection optical system PL, the photosensitive substrate P may be moved stepwise by L / 5 at each of the first and second exposure stations ST1 and ST2.
FIG. 14D is a schematic diagram showing a state in which six shot areas SH1 to SH6 arranged in the Y-axis direction on the photosensitive substrate P are set and exposed. The control system CONT adjusts the size of the projection area of the projection optical system PL in accordance with the shot areas SH1 to SH6 preset on the photosensitive substrate P in each of the first and second exposure stations ST1 and ST2. By performing the exposure, the step movement distance of the photosensitive substrate P in the Y-axis direction at each of the first and second exposure stations ST1 and ST2 can be adjusted in the same manner as the above-described procedure. In the example shown in FIG. 14D, the photosensitive substrate P may be moved stepwise by L / 3 in the Y-axis direction by performing one-row exposure (or two-row exposure). Similarly, as shown in FIG. 14E, when exposing seven shot areas SH1 to SH7 arranged in the Y-axis direction, the control system CONT sets the shot area SH1 set in advance on the photosensitive substrate P. Depending on .about.SH7, exposure is performed while adjusting the size of the projection area of the projection optical system PL in the first and second exposure stations ST1 and ST2. 7 and the step moving distance can be 2L / 7 when two lines are exposed.

Table 1 shows the number (number of rows) of the shot area preset on the photosensitive substrate P in the Y-axis direction when there is one exposure station (conventional) and two (in the present invention). The relationship between the number of shot areas exposed in one scanning exposure (one projection area) and the minimum distance of step movement of the photosensitive substrate P in the Y-axis direction is shown.
In addition, since a tact falls significantly when there are many steps, it is practically preferable that the number of steps is 3 or less. Therefore, when performing one-line exposure, the number (number of lines) of the shot area set in advance in the Y-axis direction is preferably 3 or less, and when performing two-line exposure, the number of lines is 6 or less. Preferably, the number of rows is preferably 9 or less when performing three-row exposure.

  As described above, according to the size of the projection area of the projection optical system PL and the shot area preset on the photosensitive substrate P, each of the first and second exposure stations ST1 and ST2 including the movement of the stage is performed. The exposure operation can be adjusted.

  FIGS. 15A and 15B are schematic views showing an example of a state where the photosensitive substrate P is supported on the substrate stage PST of each of the first and second exposure stations ST1 and ST2. In FIG. 15, the lengths in the Y-axis direction of the projection areas AR1 and AR2 of the projection optical systems PL of the first and second exposure stations ST1 and ST2 are set to L / 3. In addition, each of the substrate stages PST of the first and second exposure stations ST1 and ST2 can move in moving areas Bs1 and Bs2 indicated by broken lines. The control system CONT can expose the first and second shot areas SH1 and SH2 on the photosensitive substrate P at the first exposure station ST1 (that is, 2L / 3 area on the + X side of the photosensitive substrate P). The second and third shot areas SH2 and SH3 (that is, the 2L / 3 area on the -X side of the photosensitive substrate P) can be exposed at the two exposure station ST2.

In the example shown in FIG. 15, the mounting state of the photosensitive substrate P on the substrate stage PST in the first and second exposure stations ST1 and ST2 is different from each other. That is, the substrate stage PST of the first exposure station ST1 favorably supports only the regions corresponding to the first and second shot regions SH1 and SH2 of the photosensitive substrate P. In other words, of the substrate stage PST of the first exposure station ST1, only the regions corresponding to the first and second shot regions SH1 and SH2 of the photosensitive substrate P are substrate support surfaces (for example, high-precision flat surfaces). Yes. Similarly, the substrate stage PST of the second exposure station ST2 favorably supports only the regions corresponding to the second and third shot regions SH2 and SH3 of the photosensitive substrate P. In this way, by changing the exposure area of the photosensitive substrate P in each of the first and second exposure stations ST1 and ST2, the entire upper surface of the substrate stage PST (substrate holder) is not finished to a high-precision flat surface, for example. However, the substrate stage PST (substrate holder) may be manufactured so that only the back surface of the photosensitive substrate P corresponding to the shot area can be favorably supported. Thereby, the manufacturing time and cost at the time of manufacturing the substrate stage PST can be reduced.
In FIG. 15, a part of the photosensitive substrate P is shown not to be supported by the substrate stage, but the substrate stage is manufactured to a size that can support the entire surface of the photosensitive substrate P. Of this substrate stage, an area corresponding to an unexposed area of the photosensitive substrate P (an area corresponding to the third shot area SH3 in the first exposure station, an area corresponding to the first shot area SH1 in the second exposure station) is flat, for example. By not performing the conversion process, it is possible to reduce the manufacturing time and cost when manufacturing the substrate stage.

  By the way, in the embodiment described with reference to FIG. 9 and FIG. 10, when sequentially exposing a plurality of photosensitive substrates P loaded on the substrate stage PST, exposure to the first to fourth shot regions SH1 to SH4 is performed. The fifth and sixth shot regions SH5 and SH6 are alternately repeated, and the substrate stage PST needs to be moved stepwise in the Y-axis direction. As shown in FIG. By changing the mounting state of the photosensitive substrate P with respect to the substrate stage PST depending on whether the fourth shot regions SH1 to SH4 are exposed or the fifth and sixth shot regions SH5 and SH6 are exposed. The moving area of PST can be suppressed. For example, in the first exposure station ST1, when the first to fourth shot areas SH1 to SH4 of the first photosensitive substrate P are exposed (that is, when step SB2 of FIG. 9 is performed), as shown in FIG. In addition, an area corresponding to the first to fourth shot areas SH1 to SH4 of the first photosensitive substrate P is supported on the support surface of the substrate stage PST, and the first to fourth shot areas SH1 to SH4 are projected onto the projection optical system PL. The photosensitive substrate P is placed on the substrate stage PST so as to be disposed below the substrate stage PST. On the other hand, in the first exposure station ST1, when the fifth and sixth shot regions SH5 and SH6 of the second photosensitive substrate P are exposed (that is, when step SB6 in FIG. 9 is performed), as shown in FIG. In addition, the regions corresponding to the fifth and sixth shot regions SH5 and SH6 of the second photosensitive substrate P are supported on the support surface of the substrate stage PST, and the fifth and sixth shot regions SH5 and SH6 are provided in the projection optical system PL. The photosensitive substrate P is placed on the substrate stage PST so as to be disposed below the substrate stage PST. By doing so, the moving region B of the substrate stage PST can be kept small.

  The exposure apparatus EX of the present embodiment is a multi-lens scan type exposure apparatus having a plurality of projection optical systems (projection optical modules) arranged in a row, but may be a scanning type exposure apparatus having one projection optical system. Alternatively, the present invention can also be applied to a step-and-repeat type exposure apparatus in which the pattern of the mask M is exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.

  The application of the exposure apparatus EX in the present embodiment is not limited to a liquid crystal exposure apparatus that exposes a liquid crystal display element pattern on a square glass plate. For example, an exposure apparatus for semiconductor manufacturing or a thin film magnetic head The present invention can also be widely applied to an exposure apparatus for manufacturing.

The light source of the exposure apparatus EX of this embodiment is not only g-line (436 nm), h-line (405 nm), i-line (365 nm), but also KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser ( 157 nm) can be used.

The magnification of the projection optical system PL is not limited to an equal magnification system, and may be either a reduction system or an enlargement system. Further, as the projection optical system PL, when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and when using an F ₂ laser, a catadioptric system or a refractive system is used. Use an optical system.

  When a linear motor is used for the substrate stage PST and the mask stage MST, either an air levitation type using an air bearing or a magnetic levitation type using a Lorentz force or a reactance force may be used. The stage may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  When a planar motor is used as the stage drive device, either the magnet unit or the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is provided on the moving surface side (base) of the stage. Good.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. The present invention can also be applied to an exposure apparatus having such a structure.

  The reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224. The present invention can also be applied to an exposure apparatus having such a structure.

  The exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 17, the semiconductor device has a step 201 for designing the function / performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a substrate (wafer, glass plate) serving as a substrate of the device. ), A wafer processing step 204 for exposing the reticle pattern onto the wafer by the exposure apparatus of the above-described embodiment, a device assembly step (including a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a schematic perspective view of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the exposure method which concerns on 1st Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 1st Embodiment of this invention. It is a schematic diagram for demonstrating operation | movement of the alignment system containing a mark formation apparatus and a mark detection apparatus. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 1st Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 1st Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 2nd Embodiment of this invention. It is a flowchart figure which shows an example of the exposure method which concerns on 2nd Embodiment of this invention. It is a flowchart figure which shows an example of the exposure method which concerns on 3rd Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 3rd Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 4th Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 4th Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 4th Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 4th Embodiment of this invention. It is a schematic diagram for demonstrating an example of the exposure method which concerns on 4th Embodiment of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device. It is a figure for demonstrating a prior art.

Explanation of symbols

60 ... alignment system, 61 ... mark forming device, 62 ... mark detection device (detection device),
63 ... mark, 90 ... transport system (loader system), AR (AR1, AR2) ... projection area,
CONT ... control system, EX ... exposure device, P ... photosensitive substrate (substrate), PL ... projection optical system,
SH1 to SH6 ... shot area (exposure area), ST1 ... first exposure station,
ST2 ... Second exposure station

Claims (17)

In an exposure apparatus that exposes a pattern onto a substrate,
A first exposure station and a second exposure station capable of exposing the substrate;
A control system for performing control such that after the first exposure is performed at the first exposure station, the second exposure station continuously performs the second exposure on the substrate subjected to the first exposure; An exposure apparatus comprising the exposure apparatus.   The control system exposes a first region on the substrate in the first exposure, and exposes a second region on the substrate different from the first region in the second exposure. 2. The exposure apparatus according to claim 1, wherein the exposure apparatus is controlled.   3. The exposure apparatus according to claim 1, wherein the control system controls to perform exposure at the first exposure station and exposure at the second exposure station simultaneously.   The exposure apparatus according to claim 1, further comprising a transport system that transports the substrate between the first exposure station and the second exposure station.   5. The control system according to claim 1, wherein the control system individually controls an exposure operation of each of the first and second exposure stations for a plurality of preset exposure areas on the substrate. An exposure apparatus according to claim 1.   2. The control system according to claim 1, wherein a part of the plurality of exposure areas is exposed by the first exposure station, and the other part of the exposure area is exposed by the second exposure station. 5. The exposure apparatus according to 5.   When sequentially exposing a plurality of substrates using the first and second exposure stations, the control system changes an exposure area of each of the first and second exposure stations according to the substrate. An exposure apparatus according to any one of claims 1 to 6. Each of the plurality of substrates is preset with a plurality of exposure areas,
8. The exposure apparatus according to claim 7, wherein the control system changes an exposure operation of performing exposure at each of the first and second exposure stations among the plurality of exposure areas according to the substrate.   When sequentially exposing a plurality of substrates using the first and second exposure stations, the control system controls the exposure operation of each of the first and second exposure stations based on a preset set time. An exposure apparatus according to any one of claims 1 to 6, wherein:   When sequentially exposing a plurality of substrates using the first and second exposure stations, the control system changes the exposure operation of each of the first and second exposure stations to the operating status of the first and second exposure stations. The exposure apparatus according to claim 1, wherein the exposure apparatus is controlled accordingly. A loader system for carrying the substrate before the exposure process into one of the first and second exposure stations;
When sequentially exposing a plurality of substrates using the first and second exposure stations, the control system may include the first and second exposure stations according to operating conditions of the first and second exposure stations. The exposure apparatus according to claim 1, wherein an exposure station that carries a substrate is selected, and the loader system is controlled based on the selection result.   12. The alignment system according to claim 1, further comprising an alignment system that adjusts a position of an exposure area exposed in the second exposure station with respect to an exposure area on the substrate exposed in the first exposure station. The exposure apparatus according to one item.   13. The exposure apparatus according to claim 12, wherein the alignment system includes a detection device that detects a position of an exposure area on the substrate exposed at the first exposure station.   13. The alignment system according to claim 12, further comprising: a mark forming device that is provided in the first exposure station and forms a mark used when aligning the substrate with a predetermined position on the substrate. 14. The exposure apparatus according to 13. The first and second exposure stations each have a projection optical system and expose the pattern to the substrate through the projection optical system while relatively moving the substrate and the projection optical system,
The control system controls the movement in each of the first and second exposure stations based on a projection area of the projection optical system and an exposure area preset on the substrate. The exposure apparatus according to any one of 1 to 14. In an exposure method for exposing a pattern to a substrate,
A first step of exposing a first region of the substrate at a first exposure station capable of exposing the substrate;
And a second step of continuously exposing the second region of the substrate exposed in the first step at a second exposure station. 17. The exposure method according to claim 16, wherein different patterns are exposed on the substrate in the exposure for the first region and the exposure for the second region.

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