JP2005085605A - Deposition device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a deposition device for manufacturing organic EL elements efficiently. <P>SOLUTION: In the deposition device 1, a first buffer section 52 is provided between the movement start position 51 and a deposition section 53. Each moving speed of conveyance objects 4b-4f which are moved by a conveyance mechanism 31 is mutually variable. When it takes a long time to align a mask 40a with a substrate 11a, for example, the distance between the conveyance object 4c and the conveyance object 4d moving before it can be narrowed, before the conveyance object 4c reaches the deposition section 53, if each moving speed of the conveyance objects 4b, 4c which move in the first section 52 is made faster than that of the conveyance objects 4d, 4e which pass through the deposition section 53. Accordingly, in this deposition arrangement 1, intervals of the conveyance objects 4d, 4e can be narrowed, without changing each moving speed of the conveyance objects 4d, 4e which pass through the deposition section 53, steam generated by unit organic evaporation sources 41a-41e is not wasted, and each depletion efficiency of organic deposition materials 43a-43e become high. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a film forming apparatus, and more particularly to a film forming apparatus for forming a light emitter of an organic EL element.

  Conventionally, a vacuum deposition apparatus has been used to manufacture an organic EL element. As a vacuum deposition apparatus used for manufacturing an organic EL element, for example, there is a film forming apparatus described in JP-A-2003-157793.

  This film forming apparatus has a plurality of film forming chambers. Organic vapor deposition materials having different fluorescent dyes are arranged in the respective film forming chambers. When the substrates are sequentially sent to the film forming chambers, organic thin films of a plurality of colors are formed on the surface of the substrate.

However, when organic thin films of different colors are formed in different film forming chambers, the interface of the organic thin film is contaminated while being sent from one film forming chamber to the next film forming chamber, and the device characteristics of the organic EL element deteriorate. There is a case.
JP2003-157773

  The present invention was created to solve the disadvantages of the prior art described above, and an object thereof is to provide a film forming apparatus capable of efficiently manufacturing an organic EL element without contaminating the organic thin film interface. It is.

The present invention is configured as described above, and the invention according to claim 1 includes an organic film forming chamber, a carry-in system for carrying a substrate into the organic film forming chamber, and a transport body having the substrate and a mask. A transfer mechanism that moves from a movement start position to a movement end position in the organic film formation chamber, and a movement in which the substrate moves between the movement start position and the movement end position in the film formation chamber A plurality of unit organic vapor deposition sources arranged in a direction, and an unloading system for unloading the substrate from the organic film forming chamber, and when the transfer body is moved by the transfer mechanism, A film forming apparatus configured to sequentially pass over each unit organic vapor deposition source and form a film-like light emitter on the surface of the substrate while moving to a movement end position. The carrier placed at the position and the carrier The length of the buffer section to the unit organic vapor deposition source passing through is larger than the length of the transport body in the moving direction, and the transport mechanism determines the moving speed at which the transport body moves through the buffer section. It is a film forming apparatus configured to be variable with respect to the moving speed on the evaporation source.
Invention of Claim 2 is the film-forming apparatus of Claim 1, Comprising: The said board | substrate arrange | positioned inside the said organic film-forming chamber from the said carrying-in system | strain has an alignment mechanism, The film forming apparatus is configured to be arranged on the mask at the movement start position after being aligned with respect to the mask by the alignment mechanism.
A third aspect of the present invention is the film forming apparatus according to the first or second aspect, wherein the film forming apparatus includes a separation mechanism, and the substrate is moved to the movement end position by the separation mechanism. It is the film-forming apparatus comprised so that it might isolate | separate from the said conveyance body.
A fourth aspect of the present invention is the film forming apparatus according to the third aspect, wherein a mask transport mechanism is arranged inside the organic film forming chamber, and the mask after the substrate is separated is the mask transport mechanism. Thus, the film forming apparatus is configured to return from the movement end position to the movement start position through a path different from the path along which the carrier moves.
Invention of Claim 5 is the film-forming apparatus of any one of Claim 1 thru | or 4, Comprising: The said carrying-out system | strain has an electrode film-forming chamber, The said carrying-out system | strain is carried out from the said organic film-forming chamber. The substrate unloaded to the electrode is carried into the electrode film forming chamber, and is a film forming apparatus configured to form an electrode film on the light emitter.

  The present invention is configured as described above, and by disposing different organic vapor deposition materials in the unit organic vapor deposition source and moving the carrier while releasing the vapor of the organic vapor deposition material from each unit organic vapor deposition source, Layers of different types of organic vapor deposition materials are stacked on the substrate surface after passing over the unit organic vapor deposition source. Since the layers are formed in the same organic film forming chamber, the layers of the organic thin film are hardly contaminated.

  In the film forming apparatus of the present invention, the transport mechanism is capable of transporting a plurality of transport bodies simultaneously, and the transport bodies sequentially pass through the film forming section where the unit organic vapor deposition source is arranged.

  Before moving the transport body to the film formation section, it is necessary to align the mask and the substrate constituting the transport body. However, if it takes time to align the distance between the transport bodies to be sent to the film formation section, It spreads and the vapor of the organic vapor deposition material is wasted.

  As in the above cited reference (Japanese Patent Laid-Open No. 2003-157793), in the case where the mask is aligned for each light emitting layer and the light emitting layer for each color is formed at a separate position on the substrate, a high-definition mask is used. The accuracy required for the alignment is usually as high as 5 μm. However, when multiple layers of complementary colors are stacked at the same position to form a white light emitter that generates white light, When the light emitting layer for generating monochromatic light is formed separately, the accuracy required for mask alignment is as low as 100 μm. Therefore, the time required for alignment is also shorter than when a high-definition mask is used. Even if it is short, it takes some time to align the position, so that the interval between the transport members is increased, and the steam is wasted.

  If the speed when passing through the film formation section is slowed, the interval between the carriers can be narrowed even if it takes a long time for alignment. Since it is determined by the thickness of the thin film and the film formation speed, it is difficult to change the speed when passing the film formation speed.

  In the film forming apparatus of the present invention, when two or more transport bodies are transported simultaneously by the transport mechanism, the moving speeds of the transport bodies are mutually variable. If it takes a long time to align the substrate and the mask, the carrier can reach the film forming section if the speed at which the transport body moves through the buffer section is faster than the speed at which the transport section moves through the film forming section. Sometimes, the distance between the carrier moving in front of it can be reduced.

  In addition to the buffer section (first buffer section) between the movement start position and the film formation section, if a second buffer section is provided between the film formation section and the movement end position, the movement is completed. Even if it takes time to separate the substrate of the transported body transported to the position from the mask, the transported body can be temporarily stored in the second buffer section, so that the transport body stagnates at the outlet of the film forming section. Instead, the film forming section can be passed at a predetermined speed.

  According to the present invention, even if it takes time to align the substrate and the mask, the transfer speed of the transfer body moved to the buffer section is made faster than the speed when passing the film formation section. Even if the speed at which the carrier passes through the film section is not slowed, it is possible to reduce the interval between the carriers sent to the film forming section. If the interval between the transport bodies passing through the film forming section is narrowed, the amount of vapor that is not reached and is wasted is reduced, and the consumption efficiency of the organic vapor deposition material is high.

Embodiments of the present invention will be described below with reference to the drawings. Reference numeral 1 in FIG. 1 shows an example of a film forming apparatus of the present invention.
The film forming apparatus 1 has an organic film forming chamber 3. The organic film forming chamber 3 has a carry-in system 2 for loading the substrate 11 into the organic film forming chamber 3, and the substrate 11 is moved from the organic film forming chamber 3. An unloading system 7 to be unloaded is connected.

  FIG. 4A shows the substrate 11 immediately before being carried into the organic film forming chamber 3. The substrate 11 is composed of a transparent glass substrate, and a red filter 12R, a green filter 12G, and a blue filter 12B are arranged on one side, and ITO (indium) is placed on each filter 12R, 12G, 12B. A transparent electrode film 13 made of a tin oxide film is formed.

  A plurality of masks 40 and a plurality of transfer units 33 are arranged in advance in the organic film formation chamber 3, and the substrate 11 a carried into the organic film formation chamber 3 from the carry-in system 2 will be described later. After alignment with the mask 40a by the alignment mechanism 60, the transport unit 33a at the movement start position 51 in a state where the surface on which the transparent electrode film 13 is formed by the pins 46 of the alignment mechanism 60 is in close contact with the mask 40a. It is put on.

  Reference numeral 4 in FIG. 3 shows an example of the transport body in a state where the substrate 11 is placed on the transport unit 33. Here, the mask 40 and the substrate 11 each have a rectangular plate shape, and the edge portion of the mask 40 is placed on a frame constituting the transport unit 33.

  The mask 40 is provided with one or more openings 39, the mask 40 is exposed on the bottom surface of the window portion 34 constituted by the region surrounded by the frame, and the transparent surface described above is formed on the bottom surface of the opening 39. The electrode film surface is exposed.

  A plurality of cylindrical rolls 32 are arranged at the same height inside the organic film forming chamber 3, and a transport mechanism 31 is constituted by these rolls 32. A transport unit, a mask placed on the transport unit, The transport body composed of the substrate in close contact with the mask is placed on the roll 32 with the frame of the transport unit in contact with the roll 32, and the mask and the substrate are not in contact with the roll 32, and moved by the rotation of the roll 32. Move from the start position to the end position. Reference numerals 4 b to 4 g in FIG. 1 indicate transport bodies that are being moved by the transport mechanism 31.

  A plurality of unit organic vapor deposition sources 41 a to 41 e are arranged on the bottom wall inside the organic film forming chamber 3. Here, five unit organic vapor deposition sources 41a to 41e are arranged in a line, and when these unit organic vapor deposition sources 41a to 41e are the first to fifth unit organic vapor deposition sources 41a to 41e, conveyance in the middle of movement is performed. The bodies 4b to 4g pass through the first to fifth unit organic vapor deposition sources 41a to 41e in order.

  Reference numerals 4d and 4e in FIG. 1 denote transport bodies that are passing through the film forming section 53 in which unit organic vapor deposition sources 41a to 41e are arranged. The first to fifth unit organic vapor deposition sources 41a to 41e have containers 42a to 42e for accommodating the organic vapor deposition materials 43a to 43e, and the containers 42a to 42e have different types of organic vapor deposition materials 43a to 43e, respectively. Is arranged.

  Here, a first organic vapor deposition material 43a to which a hole transport agent is added is disposed in the first unit organic vapor deposition source 41a, and an electron transport agent and the second to fourth unit organic vapor deposition sources 41b to 41d are disposed. Second to fourth organic vapor deposition materials 43b to 43d to which a fluorescent agent is added are arranged, and a fifth organic vapor deposition material 43e to which an electron transport material is added is arranged to the fifth unit organic vapor deposition source 41e. ing.

  Therefore, when the first to fifth organic vapor deposition materials 43a to 43e are heated and the vapors of the first to fifth organic vapor deposition materials 43a to 43e are released upward, the vapor is in the process of passing through the film forming section 53. Passes through the window 34 and the opening 39 of the carriers 4d and 4e to reach the exposed portion of the surface of the transparent electrode film 13 on the bottom surface of the opening 39, as shown in FIG. Hole transport layer 14 made of organic vapor deposition material 43a, first to third light emitting layers 16a to 16c made of second to fourth organic vapor deposition materials 43b to 43d, and electrons made of fifth organic vapor deposition material 43e. The transport layer 17 is laminated in that order, and the organic thin film 15 is formed. Reference numeral 9 in FIG. 4B denotes a light emitter composed of the first to third light emitting layers 16a to 16c.

  A plurality of rolls 62 different from the transport mechanism 31 are arranged inside the organic film forming chamber 3, and a mask transport mechanism 61 is configured by these rolls 62. The substrate 11h of the transport body carried to the movement end position is separated from the mask 40h by a separation mechanism to be described later, and then unloaded from the organic film forming chamber by the unloading system 7, and the remaining transport unit 33h and the transport unit 33h The mask 40h is placed on the roll 62 of the mask transport mechanism 61, and is sent from the movement end position 55 toward the movement start position 51 by the rotation of the roll 62.

  Reference numerals 40 i to 40 l and reference numerals 33 i to 33 l in FIG. 1 indicate masks and transport units that are being sent to the movement start position 51. A cleaning device such as a plasma irradiation device or a laser irradiation device is connected to the organic film forming chamber 3 in the vicinity of the mask transfer mechanism 61, and the masks 40 i to 40 l and the transfer units 33 i to 33 l start moving from the movement end position 55. While returning to the position 51, plasma or laser is irradiated from the cleaning device, and the organic vapor deposition material attached when passing through the unit organic vapor deposition sources 41a to 41e is decomposed and removed.

  Next, the process of transporting the substrate 11 from the movement start position 51 to the movement end position 55 will be described in detail. FIG. 2 shows a cross-sectional view of the portion of the organic film forming chamber 3 where the substrate 11 moves.

  A pin 46 of the alignment mechanism 45 is arranged at the movement start position 51, and the substrate 11 carried into the organic film forming chamber 3 from the carry-in system 2 is stopped above the roll 32 at the movement start position 51, Transferred to pin 46.

  The pin 46 can be rotated, translated, and moved up and down in a horizontal plane. While observing with the CCD camera 65 disposed at the movement start position 51, the pin 46 is provided on the substrate 11 and the mask 40 (not shown). After the pins 46 are rotated or translated in a horizontal plane so that the alignment marks coincide with each other, the positions of the pins 46 are lowered, and when the pins 46 are lowered, the substrate 11a comes into close contact with the mask 40a at the correct position, and the transfer unit 33 It is put on.

  The transport body in a state where the substrate 11 a is placed on the transport unit 33 a is sent from the movement start position 51 toward the movement end position 55 as described above by the rotation of the roll 32.

  There is a first buffer section 52 between the movement start position 51 and the film formation section 53, and there is a second buffer section 54 between the film formation section 53 and the movement end position 55. Reference numerals 4b and 4c in FIGS. 1 and 2 indicate transport bodies that move in the first buffer section 52, reference numerals 4d and 4e indicate transport bodies that pass over the unit organic vapor deposition sources 41a to 41e, and reference numerals 4f and 4g respectively. The conveyance body which moves the 2nd buffering section 54 is shown.

  The distance in the horizontal direction between the transport body at the movement start position 51 and the first unit organic vapor deposition source 41a in the film formation section 53 is larger than the distance in the travel direction of the transport bodies 4b to 4g. The length of the first buffer section 52 in the moving direction of the transport bodies 4b and 4c is longer than the length of the transport bodies 4b and 4c in the moving direction.

  The rolls 32 are individually connected to a motor (not shown), and the rotation speed of each roll 32 can be individually controlled. When the transport mechanisms 31 move the transport bodies 4b to 4g, the transport bodies 4b The moving speed of ~ 4g can be changed.

  For example, even if it takes time to align the substrate 11a and the mask 40a, if the moving speed when the transport body 4b is sent from the movement start position 51 to the first buffer section 52 is increased, the transport bodies 4b and 4c. Since the distance between them becomes narrow while moving in the first buffer section 52, the distance between the transport bodies 4d and 4e passing through the film forming section 53 is formed, and the vapor of the organic vapor deposition material is not wasted.

  Further, the pin 49 of the separation mechanism 48 described above is disposed at the movement end position 55, and once the transport body is sent to the movement end position 55, it is stopped, and the substrate 11h is lifted by the pin 49 and separated from the mask 40h. Is done.

  The distance in the horizontal direction between the transport body at the movement end position 55 and the last unit organic vapor deposition source 41e in the film formation section 53 is larger than the distance in the travel direction of the transport bodies 4b to 4g. The distance in the moving direction of the transport bodies 4b to 4g in the buffer section 54 is larger than the distance in the moving direction of the transport bodies 4b to 4g.

  If the speed at which the transport body 4e is sent from the film forming section 53 to the second buffer section 54 is made faster than the speed at which the film forming section 53 is moved, the interval between the transport bodies 4f and 4g is set to the second buffer. It increases until it passes through the section 54. For example, when it takes time to separate the substrate 11h from the mask 40h, if the speed of the transport body 4g is reduced before reaching the movement end position 55, the next distance between the transport bodies 4g and 4f increases. Since it takes time for the transport body 4f to reach the movement end position 55, the transport bodies 4f and 4g do not stagnate at the exit of the film forming section 53. Therefore, film formation can be performed without changing the moving speed when the transport body 4e passes through the film formation section 53.

  The carry-in system 2 has first and second transfer chambers 20 and 27, and an unprocessed substrate 11 arranged outside the film forming apparatus 1 is a carry-in chamber connected to the first transfer chamber 20. First, it is carried into 21a and 21b, and after moisture is removed by heating inside the carry-in chambers 21a and 21b, it is transported to the cooling chamber 23 via the first transport chamber 20 and cooled to a predetermined temperature.

  Between the first transfer chamber 20 and the second transfer chamber 27, a UV cleaning chamber 25 and a loading chamber 26 are arranged, and the substrate 11 after being cooled passes through the first transfer chamber 20. After being sent to the UV cleaning chamber 25 and the organic matter adhering to the substrate 11 is decomposed and removed by UV light irradiation, it is temporarily stored in the loading chamber 26.

  The substrate 11 stored in the loading chamber 26 is taken out to the second transfer chamber 27 and is sent to a pretreatment chamber 28 such as an oxygen plasma generation chamber as necessary. It is carried into the organic film forming chamber 3 through the chamber 27.

  The unloading system 7 includes a buffer layer film forming chamber 71, an electrode film forming chamber 75, and a sealing mechanism 79, and the substrate 11 unloaded to the unloading system 7 is first transferred to the buffer layer film forming chamber 71. After the buffer layer containing an electron injection material such as LiF (lithium fluoride) is formed on the organic thin film, the buffer layer is sent to the electrode film forming chamber 75, and the upper portion made of a conductive material such as aluminum on the buffer layer. An electrode film is formed.

  4C shows an organic EL element in which a buffer layer 18 and an upper electrode film 19 are formed on the electron transport layer 17, and the organic thin film 15 includes the upper electrode film 19 and a transparent electrode film. 13 is sandwiched between the two.

  The transparent electrode film 13 and the upper electrode film 19 are patterned into a predetermined shape, and a portion sandwiched between the transparent electrode film 13 and the upper electrode film 19 of the organic thin film 15 is arranged on the matrix as a pixel, and the pixel is selected. When a voltage is applied between the transparent electrode film 13 and the upper electrode film 19, the first to third light emitting layers 16a to 16c in the selected pixel emit light.

  The fluorescent agents added to the first to third light emitting layers 16a to 16c are complementary to each other such as red, green and blue, and the first to third light emitting layers 16a to 16c are laminated at the same place. Therefore, the light generated in the first to third light emitting layers 16a to 16c is mixed and becomes white light. Accordingly, white light is emitted from the light emitter 9 including the first to third light emitting layers 16a to 16c.

  Since one color filter 12R, 12G, and 12B is disposed in one pixel, only one of red, green, and blue light is transmitted through one pixel, and the substrate 11 It is emitted to the outside of the organic EL element 10 through.

  Therefore, if a pixel corresponding to a desired color is selected to emit light, characters, drawings, and the like can be displayed. Therefore, the organic EL element 10 can be used in a display device.

  The organic EL element 10 in a state where the upper electrode film 19 is formed is further sent to the sealing mechanism 79 of the carry-out system 7, and the portion where the organic thin film is formed is sealed with a sealing cap such as a glass cap. The element is sealed and protected from the external atmosphere.

  Although the case where the organic EL element 10 formed by the film forming apparatus 1 of the present invention is used for a display device has been described above, the present invention is not limited to this. For example, if the wide area of the organic thin film 15 is sandwiched between the transparent electrode film 13 and the upper electrode film 19 and the wide area of the organic thin film 15 is caused to emit light without providing the filters 12R, 12G, and 12B, the outside of the organic EL element White light can be emitted over a wide area, and such an organic EL element can be used for a light-emitting device of a lighting fixture.

The case where five unit organic vapor deposition sources 41a to 41e are provided in the film formation section 53 has been described above. However, the present invention is not limited to this, and the number of unit organic vapor deposition sources 41a to 41e is the number of organic layers to be formed. It can be changed depending on the type of thin film. Moreover, although the above demonstrated the case where different organic vapor deposition material 43a-43e is arrange | positioned to unit organic vapor deposition source 41a-41e, this invention is not limited to this, Two or more unit organic vapor deposition sources 41a- The same kind of organic vapor deposition materials 43a to 43e can be arranged on 41e.
The speed at which the carrier passes through the film forming section 53 may be constant, or the moving speed may be changed on each unit organic vapor deposition source.

  Although the above has described the case where the organic thin film 15 includes the hole transport layer 14, the light emitting layers 16a to 16c, and the electron transport layer 17, the present invention is not limited to this. For example, in order to obtain the organic EL element 10 that emits white light, it is only necessary to have at least two light emitting layers having a complementary color relationship, and in addition to the hole transport layer 14 and the electron transport layer 17 described above. Alternatively, a hole injection layer, a hole block layer, an electron injection layer, or the like can be provided.

  The above describes the case where the fluorescent agent is added to the organic vapor deposition material together with the electron transport agent, but the present invention is not limited to this, and the fluorescent agent may be added to the organic vapor deposition material together with the hole transport agent. it can. The color of the fluorescent agent is not particularly limited as long as it has a complementary color relationship. In addition to the combination of red, green, and blue described above, for example, blue and yellow fluorescent agents are separately added to the organic vapor deposition material, and 2 A color light-emitting layer can also be formed.

  Moreover, although the above demonstrated the case where the fluorescent agent of each color was added to separate organic vapor deposition material, this invention is not limited to this, Add the fluorescent agent of 2 colors or more in a complementary color relationship to the same organic vapor deposition material. Film formation may be performed to form a light emitter with a single light emitting layer.

  The above is a case where two or more colors of fluorescent agents having complementary colors are added to an organic vapor deposition material to form an organic thin film that generates white light. However, the present invention is not limited to this, A phosphor that emits monochromatic light may be formed by using only a fluorescent agent that emits light. For example, when a phosphor that generates red light as a fluorescent agent is used to form a light emitter that generates monochromatic light, red light is emitted from the organic EL element.

The top view explaining the film-forming apparatus of this invention Cross section of organic deposition chamber Sectional drawing for demonstrating a conveyance body (A)-(c): Sectional drawing explaining the process of manufacturing an organic EL element

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Film-forming apparatus 2 ... Loading system 3 ... Organic film-forming chamber 4, 4b-4g ... Conveyance body 7 ... Unloading system 9 ... Light-emitting body 10 ... Organic EL element 11a-11l ... Substrate 15 ... Organic thin film 31 ... Conveying mechanism 40a to 40l ... Mask 41a to 41e ... Unit organic vapor deposition source 43a to 43e ... Organic vapor deposition material 45 ... Positioning mechanism 48 ... Separation mechanism 51 ... Movement start position 55 ...... Moving end position

Claims (5)

An organic film forming chamber; and a loading system for loading the substrate into the organic film forming chamber;
A transfer mechanism that moves the transfer body having the substrate and the mask from the movement start position to the movement end position in the organic film formation chamber, and between the movement start position and the movement end position in the film formation chamber A plurality of unit organic vapor deposition sources arranged in a moving direction in which the substrate moves, and a carry-out system for carrying the substrate out of the organic film forming chamber,
When the transport body is moved by the transport mechanism, while moving from the movement start position to the movement end position, each unit organic vapor deposition source passes in order, and a film-like light emitter is formed on the substrate surface. A film forming apparatus configured to be formed,
The transport body placed at the movement start position, and the length of the buffer section to the unit organic vapor deposition source through which the transport body first passes are larger than the length of the transport body in the moving direction,
The film forming apparatus, wherein the transport mechanism is configured such that a moving speed at which the transport body moves in the buffer section is variable with respect to a speed at which the transport body moves on the unit organic vapor deposition source. The transfer body has an alignment mechanism, and the transfer body is positioned at the movement start position after the substrate disposed in the organic film forming chamber from the carry-in system is aligned with the mask by the alignment mechanism. The film forming apparatus according to claim 1, wherein the film forming apparatus is arranged on the mask. 3. The film forming apparatus according to claim 1, further comprising a separation mechanism, wherein the substrate is separated from the transport body moved to the movement end position by the separation mechanism. . A mask transport mechanism is disposed inside the organic film forming chamber, and the mask after the substrate is separated passes through a path different from the path along which the transport body moves by the mask transport mechanism. The film forming apparatus according to claim 3, wherein the film forming apparatus is configured to be returned to the movement start position. The unloading system has an electrode film forming chamber, and the substrate unloaded from the organic film forming chamber to the unloading system is loaded into the electrode film forming chamber so that an electrode film is formed on the light emitter. The film forming apparatus according to claim 1, which is configured.

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