JP2015129326A - Manufacturing apparatus for organic el device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of measuring an arrangement of a processed body and a mask, arranged oppositely to each other, with high precision that secures measurement precision and prevents the degree of vacuum from decreasing at a low cost even when an organic EL device becomes large-sized, and also prevents maintainability from decreasing in a manufacturing apparatus for an organic EL device.SOLUTION: There is provided an apparatus 10 which manufactures an organic EL device by passage through a plurality of zones Z2 arranged in a film deposition chamber S provided between a processing chamber A for a process as a precedent stage and a processing chamber B for a process as a following stage and having a single pressure-reducible internal space S1. The manufacturing device for an organic EL device is provided with measurement means C10 and C20 of measuring relative positions of a processed body W and a mask M at vapor-deposition positions respectively, and has adjustment means XY of adjusting the relative positions on the basis of measurement results.

Description

  The present invention relates to a technique suitable for use in an organic EL device manufacturing apparatus.

  A manufacturing process of an organic EL device or the like may include a process of forming a predetermined thin film on the surface of a film or substrate that is an object to be processed. In this film forming process, a predetermined pattern is formed on the substrate or the like. In some cases, the film forming range is limited (restricted) to a specific region, such as the film forming process. A case where a film is formed in a predetermined pattern on a substrate by vacuum deposition will be described as an example. An evaporation source and a substrate are arranged in a processing chamber, and a predetermined material is evaporated from the evaporation source under vacuum. At this time, a mask for limiting the film formation range is disposed on the evaporation source side of the substrate, and film formation is performed only over a specific region by forming the film over the mask. Here, in order to form a film on a specific region of the substrate with high accuracy, it is necessary to accurately measure the arrangement of the substrate and the mask that are arranged to face each other in the processing chamber.

  As shown in Patent Document 1, the substrate and the mask are kept in a vacuum atmosphere in the processing chamber, whereas the camera, the illumination means, and the like that are sensors are arranged outside the chamber that is outside the vacuum, Measurements are taken from the windows on the wall.

JP 2013-001947 A

  However, with the increase in size of organic EL devices, the substrate transfer position in the chamber remains almost unchanged, despite the fact that the substrate to be processed has increased in size and the capacity of the chamber has increased. A problem has arisen in that the distance between the sensor located on the substrate and the substrate is separated and accurate measurement cannot be performed with the required accuracy. In particular, the distance between the substrate and the mask and the camera as the measurement means is also referred to as WD (Working distance), and it is necessary to set these distances very strictly in order to maintain the required accuracy.

Furthermore, since many measuring devices such as sensors are not compatible with vacuum specifications, it can be considered that the position of the sensor can be measured by deforming the chamber wall to the required shape, As the substrate becomes larger, the chamber wall becomes a complicated uneven shape. In such a case, there is a possibility that the maintenance workability of the vapor deposition apparatus is lowered, and there is a complicated uneven shape. This may cause problems such as leakage from the chamber wall and a decrease in the degree of vacuum.
Furthermore, there has been a demand to cope with low costs when solving these problems.

The present invention has been made in view of the above circumstances, and intends to achieve the following object.
1. Ensure measurement accuracy for workpieces and masks.
2. Preventing the occurrence of leaks and a decrease in vacuum in the processing atmosphere at low cost.
3. Preventing deterioration of maintainability at low cost.

The organic EL device manufacturing apparatus of the present invention includes a film forming chamber having a single internal space that can be decompressed, provided between a processing chamber A that performs a preceding process and a processing chamber B that performs a subsequent process. The object to be processed carried into the film forming chamber from the processing chamber A passes through a plurality of zones arranged in the internal space of the film forming chamber, and is then transferred to the processing chamber B to be organic. An apparatus for manufacturing an EL device,
As the plurality of zones,
A first zone for holding the back surface of the object to be processed using a holding means;
A second zone for forming a deposited film on the surface of the object to be processed held by the holding means;
A third zone for releasing the holding of the object to be processed from the holding means;
Are arranged in order,
In the second zone, the relative position between the object to be processed and the mask is measured before a desired mask is provided between the vapor deposition source and the surface side of the object to be processed. A measuring unit; and an adjusting unit that adjusts a relative position between the object to be processed and the mask based on a measurement result of the measuring unit, and the measuring unit is incorporated in a position adjusting mechanism. Solved the problem.
In the present invention, it is preferable that the position adjusting mechanism is hermetically sealed in the internal space, and the measurement unit has a measurement window part that transmits and measures a relative position between the object to be processed and the mask.
The position adjusting mechanism of the present invention preferably includes an irradiating means for illuminating the measurement target.
The position adjustment mechanism of the present invention may be provided with a substrate imaging device that measures the object to be processed and a mask imaging device that measures the mask.

The organic EL device manufacturing apparatus of the present invention has a film forming chamber (single chamber having a reduced internal space provided between a processing chamber A for performing a preceding process and a processing chamber B for performing a subsequent process. A chamber) S, and a (planar) object to be processed carried into the film forming chamber S from the processing chamber A passes through a plurality of zones arranged in the internal space of the film forming chamber S. An apparatus for producing an organic EL device by being carried out to the processing chamber B,
As the plurality of zones,
A first zone for holding the back surface (one surface) of the object to be processed using a holding means (substrate chuck);
A second zone for depositing a deposited film on the surface (other surface) of the object to be processed held by the holding means;
A third zone for releasing the holding of the object to be processed from the holding means;
Are arranged in order,
In the second zone, the relative position between the object to be processed and the mask is measured before a desired mask is provided between the vapor deposition source and the surface side of the object to be processed. Measuring means (optical system camera) and adjustment means (XY stage or the like) for adjusting the relative position between the object to be processed and the mask based on the measurement result of the measuring means, the measuring means being positioned The built-in adjustment mechanism (atmosphere box) allows the measurement means (optical) to cope with the increase in the substrate size without causing a decrease in the degree of vacuum or leakage in the film formation chamber. It is possible to set the WD (Working distance) in the system camera) within a predetermined range and to accurately measure the object to be processed (substrate) and the mask at low cost. Thereby, it becomes possible to make a to-be-processed object (board | substrate) and a mask into a desired positional relationship, to prevent the maintenance workability from falling, and to prevent the increase in product cost.

  In the present invention, the position adjustment mechanism is sealed in the internal space, and the measurement unit has a measurement window portion that measures the relative position between the object to be processed and the mask. Even if the distance between the measuring means housed in the position adjustment mechanism located at the position and the object to be processed and the mask is set within a predetermined range, the measuring device is not in the operation specification inside the vacuum, etc. The measuring means operates well and can measure accurately.

  The position adjusting mechanism of the present invention is equipped with an irradiating means for illuminating the measurement target, so that the irradiating means not operating in the vacuum operates well and irradiates the necessary light quantity with high accuracy. It becomes possible to measure.

  The position adjusting mechanism of the present invention is provided with a substrate imaging device that measures the object to be processed and a mask imaging device that measures the mask, so that the object to be processed (substrate) and the mask can be accurately each Images can be taken and measured accurately.

  According to the present invention, it is possible to cope with the increase in the substrate size, and to set the WD (Working distance) in the measuring means within a predetermined range without causing a decrease in the degree of vacuum or leakage in the film forming chamber. (Board) and mask can be measured with high accuracy and at low cost, the target object (substrate) and mask can be placed in the desired positional relationship, and maintenance workability can be prevented from being lowered, resulting in increased product costs. The effect that it becomes possible to prevent can be show | played.

It is a schematic front view which shows one Embodiment of the manufacturing apparatus of the organic EL device which concerns on this invention. It is a schematic cross section which shows the manufacturing process of an organic EL device. It is a schematic plan view which shows the position adjustment mechanism in one Embodiment of the manufacturing apparatus of the organic EL device which concerns on this invention. It is a model regular front view which shows the position adjustment mechanism in one Embodiment of the manufacturing apparatus of the organic EL device which concerns on this invention.

Hereinafter, an embodiment of an organic EL device manufacturing apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic front view showing an organic EL device manufacturing apparatus according to the present embodiment. In the figure, reference numeral 10 denotes an organic EL device manufacturing apparatus.

  As shown in FIG. 1, the organic EL device manufacturing apparatus 10 according to the present embodiment includes partition valves A <b> 1 and B <b> 1 between a processing chamber A that performs a preceding process and a processing chamber B that performs a subsequent process. A plate-shaped workpiece W carried into the film formation chamber S from the process chamber A is provided with a film formation chamber (chamber) S having a single internal space S1 that can be decompressed. It is an apparatus for manufacturing an organic EL device by passing through a plurality of zones Z1 to Z3 arranged in the internal space S1 of the film chamber S and being carried out to the processing chamber B.

  The organic EL device manufactured by the organic EL device manufacturing apparatus 10 according to the present embodiment is an ITO that functions as an anode on a transparent substrate W made of glass or a flexible material, as shown in FIG. The first conductive film V1 is formed, the hole transport layer V2 is formed on the first conductive film V1, the light emitting layer V3 is formed on the hole transport layer V2, and the electrons are formed on the light emitting layer V3. A transport layer V4 is formed, and a second conductive film V5 functioning as a cathode is formed on the electron transport layer V4.

  In the organic EL device manufacturing apparatus 10, as shown in FIG. 1, the back surface (one surface) of the workpiece W is held in the chamber S as the plurality of zones Z <b> 1 to Z <b> 3 using a holding means (substrate chuck) T. A first conductive film V1 such as ITO that functions as an anode is formed on the surface (other surface) of the workpiece W held by the holding means T, and the first conductive film V1 is formed on the first conductive film V1. A hole transport layer V2 is formed, a light emitting layer V3 is formed on the hole transport layer V2, an electron transport layer V4 is formed on the light emitting layer V3, and functions as a cathode on the electron transport layer V4. A second zone Z2 for forming the second conductive film V5, and a third zone for releasing the holding of the workpiece W from the holding means T at a position downstream of the second zone Z2 in the moving direction of the workpiece W (inspection) Zone) Z3, arranged in order It has been. In addition, each vapor deposition source E etc. in these 2nd zones Z2 is typically shown, provided corresponding to each vapor deposition film V1-V5 etc., and heats a vapor deposition source. The heating means, temperature measuring means, film thickness control shutter, etc. are not shown. Also, the atmospheric gas control means in the organic EL device manufacturing apparatus 10 is not shown.

  In the organic EL device manufacturing apparatus 10, as shown in FIG. 1, as a substrate transport unit (transport means) L <b> 1 that transports the substrate chuck T that adsorbs the substrate W across the first zone Z <b> 1 to the third zone Z <b> 3, A large number of rollers La having an axis perpendicular to the moving direction of the substrate chuck T are arranged in parallel in the horizontal direction, and the substrate chuck T is conveyed in the conveying direction H by driving means (not shown).

  In the second zone, the organic EL device manufacturing apparatus 10 provides a desired mask M between the vapor deposition source E and the surface side of the object to be processed (substrate) W before performing predetermined film formation. Measurement means (optical system camera) C10 that measures the position of M, measurement means (optical system camera) C20 that measures the relative position between the substrate W and the mask M, and measurement results of the measurement means C10 and C20. Adjustment means (XY stage) XY for adjusting the relative position between the workpiece W and the mask M. As these optical system cameras, it is preferable to employ a camera that generates little heat, such as a CCD camera or a CMOS camera. Measuring means C10 and C20 are built in the position adjustment mechanism (atmosphere box) BO, and the position adjustment mechanism (atmosphere box) BO is mounted on the base.

  The measuring means (optical system camera) C10 is provided so as to be positioned above the substrate transport portion L1 at each vapor deposition position in the second zone Z2, and below the substrate transport portion L1 at each vapor deposition position in the second zone Z2. At the position, measuring means (optical system camera) C20 for measuring the relative position between the workpiece W and the mask M is fixed.

  As the measurement means C10 and the measurement means C20, the measurement means C11 and the measurement means C21 are provided at the first vapor deposition position, and the measurement means C12 and the measurement means C21 are provided at the second vapor deposition position so that measurement is possible at the respective vapor deposition positions. Measuring means C22 is provided, and measuring means C13 and measuring means C23 are provided at the third deposition position. These measuring means C11, measuring means C12, and measuring means C13 are all configured substantially the same, and similarly, the measuring means C21, measuring means C22, and measuring means C23 are all configured approximately the same.

As the measurement means C10, an imaging device (camera) C10a that focuses on the mask M and measures its position and an irradiation means LED that illuminates the measurement target are mounted.
As the measurement means C20, an imaging device (camera) C20a that focuses on the object to be processed (substrate) W and the mask M and measures the position thereof, and an irradiation means LED that illuminates the measurement target are mounted.

  In the measuring means C10, as shown in FIGS. 3 and 4, the lens C10b of the camera C10a corresponding to each of the cameras C11, C12, and C13 is located at a position that can be measured through the measurement window Bb provided in the atmospheric box BO. Provided. Similarly, in each of the cameras C21, C12, and C13 serving as the measurement unit C10, the irradiation unit LED is located at a position spaced apart from the lens C10b and the substrate W in the traveling direction corresponding to the measurement window Bc provided in the atmospheric box BO. Is provided.

3 and 4, only the measuring means C10 is shown, but the measuring means C20 has a substantially equivalent configuration. Further, in the measuring means C20, the camera C20a that focuses on the substrate W and the mask M and measures the position thereof is the same imaging device, and the measurement is performed by imaging the substrate W and the mask M while switching the imaging symmetry. Also, as the imaging device C20a, the imaging device that focuses on the substrate W and measures the position thereof and the imaging device that focuses on the mask M and measures the position thereof in the same atmospheric box BO as different cameras. As an imaging device C20a, the imaging device C20a focuses on the substrate W and measures its position, and the imaging device that focuses on the mask M and measures its position as different cameras, separate atmospheric boxes BO It can also be set as the structure accommodated in.
3 and 4, the imaging device C10a of the measuring unit C10 is shown as a representative, but the imaging device C20a is arranged upside down as substantially the same configuration as the imaging device C10a. The imaging apparatus C10a can be an imaging apparatus that focuses on the substrate W and the mask M from the opposite side of the mask M and measures the position thereof.

  In the measuring means C10 or the measuring means C20, as shown as the measuring means C10 in FIG. 4, the mask M that is the measurement object from the measurement window Bb to the atmospheric pressure distance Da from the lens (imaging device) C10b to the measurement window Bb. Alternatively, by setting the sum of the vacuum distances Dv to the object to be processed (substrate) W within a predetermined range, the WD (Working distance) values in the imaging devices C10a and C20a are set within the predetermined range. Highly accurate measurement can be ensured.

The atmospheric box BO can be set as a condition that no distortion occurs even if the inside on the storage side is atmospheric pressure and the outside is a high vacuum of about 1 × 10 ⁻⁵ Pa, for example, as the vacuum performance.
An optical antireflection film may be provided on the measurement window Bb.

  Next, an organic EL device manufacturing operation in the organic EL device manufacturing apparatus 10 of the present embodiment will be described.

In the present embodiment, the previous process is performed in the processing chamber A, and the substrate W after the preprocessing is transferred into the chamber S via the partition valve A1 by a transfer means (not shown).
Next, in the first zone Z1, the back surface (one surface) of the substrate (object to be processed) W is held using the substrate chuck (holding means) T.

Next, at the first vapor deposition position in the second zone Z2, the mask M is imaged by the imaging device C10a while irradiating the mask M to be measured by the irradiation means LED of the optical system camera (measurement means) C11. The position of the mask M is set to a desired state by measuring the position of M to confirm that it is at the desired position or based on the measurement result of the measuring means C11.
Thereafter, the substrate chuck T is moved to the first vapor deposition position in the second zone Z2 by the substrate transport unit L1, and the substrate W is stopped at the first vapor deposition position. While the substrate W and the mask M to be measured are irradiated by the irradiation unit LED of the measuring unit C21, the imaging device C21a images the substrate W and measures its position, and images the mask M and measures its position.
If necessary, the relative position between the substrate W and the mask M is adjusted using an XY stage (adjustment means) XY if necessary based on the measurement result of the measurement means C21, and then at the first deposition position in the second zone Z2. A first conductive film V1 such as ITO functioning as an anode is formed on the surface (lower surface) of the substrate W held by the substrate chuck T.

Next, at the second vapor deposition position in the second zone Z2, the mask M is imaged by the imaging device C10a while irradiating the mask M to be measured by the irradiation means LED of the optical system camera (measurement means) C12. The position of the mask M is set to a desired state by measuring the position of M and confirming that it is at the desired position or based on the measurement result of the measuring means C12.
Thereafter, the substrate chuck T is moved to the second vapor deposition position in the second zone Z2 by the substrate transport unit L1, and the substrate W is stopped at the second vapor deposition position. The substrate W and the mask M to be measured are irradiated by the irradiation unit LED of the measuring unit C22, the substrate W is imaged by the imaging device C22a, the position thereof is measured, the mask M is imaged, and the position is measured.
If necessary, the relative position between the substrate W and the mask M is adjusted using the XY stage (adjustment means) XY based on the measurement result of the measurement means C22, and then at the second deposition position in the second zone Z2. Then, the hole transport layer V2 corresponding to the pattern Ma of the mask M is formed on the first conductive film V1.

Next, at the third vapor deposition position in the second zone Z2, the mask M is imaged by the imaging device C10a while irradiating the mask M to be measured by the irradiation means LED of the optical system camera (measurement means) C13, whereby the mask The position of the mask M is set to a desired state by measuring the position of M and confirming that it is at the desired position or based on the measurement result of the measuring means C13.
Thereafter, the substrate chuck T is moved to the third vapor deposition position in the second zone Z2 by the substrate transport portion L1, and the substrate W is stopped at the third vapor deposition position. The substrate W and the mask M to be measured are irradiated by the irradiation unit LED of the measuring unit C23, the substrate W is imaged by the imaging device C23a, the position thereof is measured, the mask M is imaged, and the position is measured.
If necessary, the relative position between the substrate W and the mask M is adjusted using an XY stage (adjustment means) XY based on the measurement result of the measurement means C23, and then the hole transport is performed at this third vapor deposition position. A light emitting layer V3 corresponding to the pattern Ma of the mask M is formed on the layer V2.

  Similarly, the electron transport layer V4 corresponding to the pattern Ma of the mask M is formed on the light emitting layer V3 at the fourth vapor deposition position, and the pattern Ma of the mask M on the electron transport layer V4 at the fifth vapor deposition position. A second conductive film V5 corresponding to the above is formed.

  Next, the substrate chuck T is moved to the third zone Z3 by the substrate transfer unit L1, and the holding of the substrate W by the substrate chuck T is released, and the substrate W that has been processed in the chamber S is transferred by a transfer means (not shown). It is transferred to a subsequent process in the processing chamber B via the partition valve B1.

  According to the organic EL device manufacturing apparatus 10 of the present embodiment, the optical system camera (measuring means) C10 and the optical system camera (measurement) are performed in the vapor deposition process sequentially performed in the zones Z2 arranged in parallel in the continuous internal space S1. Means) The WD (Working distance) at C20 can be set within a desired range, and the measurement of the substrate W and the mask M can be performed with high accuracy. Further, since the measuring means C10 and C10 are housed inside the position adjusting mechanism (atmosphere box) BO, it is possible to perform measurement at low cost and with high accuracy even when using a measuring device whose normal operation is not reliable in vacuum. In addition, since the inner wall shape of the chamber S does not need to be a complicated uneven shape for this measurement, maintenance is ensured, and the possibility of occurrence of leakage is reduced, and at the same time, an increase in product cost is prevented. It becomes possible to

DESCRIPTION OF SYMBOLS 10 ... Manufacturing apparatus C10 of organic EL device ... Measuring means Z1-Z3 ... Zone L1 ... Substrate conveyance part (conveyance means)
L2: Measuring means conveying section (conveying means)
BO ... Atmosphere box (position adjustment mechanism)
Bb ... Measurement window H ... Conveying direction (traveling direction)
M ... Mask E ... Evaporation source W ... Substrate (object to be processed)
T ... Substrate chuck (holding means)
S ... Chamber (deposition chamber)
S1 ... Internal space XY ... XY stage (adjustment means)
LED ... Irradiation means A1, B1 ... Partition valve

Claims (4)

A film formation chamber having a single internal space that can be decompressed is provided between a process chamber A that performs a preceding process and a process chamber B that performs a subsequent process. An object for manufacturing an organic EL device by passing an object to be processed to a processing chamber B through a plurality of zones arranged in the internal space of the film forming chamber,
As the plurality of zones,
A first zone for holding the back surface of the object to be processed using a holding means;
A second zone for forming a deposited film on the surface of the object to be processed held by the holding means;
A third zone for releasing the holding of the object to be processed from the holding means;
Are arranged in order,
In the second zone, the relative position between the object to be processed and the mask is measured before a desired mask is provided between the vapor deposition source and the surface side of the object to be processed. A measuring unit; and an adjusting unit that adjusts a relative position between the object to be processed and the mask based on a measurement result of the measuring unit, and the measuring unit is built in a position adjusting mechanism. An organic EL device manufacturing apparatus.   The said position adjustment mechanism is sealed in the said interior space, The said measurement means has a measurement window part which permeate | transmits and measures the relative position of the said to-be-processed object and the said mask. Organic EL device manufacturing equipment.   The organic EL device manufacturing apparatus according to claim 1, wherein the position adjusting mechanism includes an irradiating unit that illuminates a measurement target.   4. The organic EL device according to claim 1, wherein the position adjusting mechanism includes a substrate imaging device that measures the object to be processed and a mask imaging device that measures the mask. 5. manufacturing device.

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