JP2005235568A - Deposition device and manufacturing device of organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a deposition device preventing a material evaporated from a deposition source from adhering to a mask or an inside wall of a chamber, further facilitating maintenance, and sufficiently reducing waste of the material used as the deposition source, and also to provide a manufacturing method of an organic EL device reducing a cost by forming a function layer by using it to eliminate waste of a function layer formation material. <P>SOLUTION: This deposition device 1 is used for forming a film of a predetermined pattern by using a physical mask 5 having an opening pattern on a processing object 4. This deposition device is provided with the, chamber 2 having the deposition source, and a pressure reducing means 3 for reducing pressure in the chamber 2. An isolation chamber 7 for isolating a space between the deposition source and the physical mask 5 from other spaces in the chamber 2 is formed in the the chamber 2, and heating means 8 and 9 are mounted on the isolation chamber 7 and the physical mask 5, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an evaporation apparatus configured to evaporate (sublimate) an evaporation source in a vacuum atmosphere and form a film on an object to be processed, and a method for manufacturing an organic EL device using the evaporation apparatus.

  In the vacuum evaporation apparatus, an evaporation source and an object to be processed are arranged in a vacuum chamber, and after the inside of the vacuum chamber is set to a reduced pressure atmosphere (vacuum atmosphere), the evaporation source is heated to melt and evaporate the evaporation source, or By evaporating the evaporation source, the evaporation source is evaporated and deposited on the surface of the object to be processed for vapor deposition.

  Such a vacuum evaporation apparatus can form a film having a desired pattern shape by using, for example, a physical mask having an opening pattern (see, for example, Patent Document 1). For example, in recent years, organic EL elements have been developed as self-luminous elements, and full-color display organic EL devices including red, green, and blue light emitting elements have also been developed. And provided to some.

  An organic EL device (organic electroluminescence device) has a structure in which a functional layer is sandwiched between a pair of electrodes, and the functional layer usually has a laminated structure including a light emitting layer made of an organic material. A typical example of the laminated structure is a laminated structure of “hole transport layer / light emitting layer / electron transport layer”. This structure is known as having very high luminous efficiency. In addition, the hole injection layer / hole transport layer / light emitting layer / electron transport layer or hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer are laminated in this order on the anode. Structures that do this are also known.

As such a functional layer, all the layers may be formed of a low molecular organic material, or part or all of the functional layer may be formed of a high molecular organic material. The layer or the like may be formed of an inorganic material.
Here, the material for forming the light emitting layer is roughly classified into a low molecular weight (monomer based) organic material and a high molecular weight (polymer based) organic material. In general, a vapor deposition method using a physical mask by a vacuum vapor deposition apparatus as described above is employed as the formation method. This is because the light-emitting layer forming material is very easily deteriorated and easily oxidized and deteriorated due to the presence of oxygen or water. Therefore, the photolithography process cannot be performed after the film formation. Therefore, in order to form a pattern, it is necessary to perform the patterning simultaneously with the film formation using a physical mask having an opening pattern.

However, in the vapor deposition method using the physical mask by such a vacuum vapor deposition apparatus, most of the film forming material, that is, the material sublimated from the vapor deposition source and evaporated, adheres to the inner wall of the chamber and the physical mask.
When deposition of the film forming material occurs in this way, for example, when the type of the light emitting layer forming material is changed in accordance with the light emission color, the newly deposited material is contaminated by the deposit, and the resulting film (light emission) The properties of the layer will be degraded. Therefore, conventionally, in order to prevent such characteristic deterioration, it has been necessary to replace the physical mask with a new one and also clean the inside of the chamber.

However, in such a method, the physical mask is frequently replaced, and the maintenance in the chamber is complicated, for example, the chamber is frequently cleaned. Therefore, the productivity is extremely poor.
From such a background, conventionally, a heating means is provided on the mask, and after vapor deposition, the mask is heated by the heating means, so that the material adhering to the mask is sublimated again, and the adhering material is removed from the mask for cleaning. There has been provided a technique that can perform the above (see, for example, Patent Document 2).
JP-A-8-227276 JP 2003-313654 A

However, as described above, for example, a technique for removing the deposits from the mask by providing a heating means on the mask and heating the mask after vapor deposition, the maintenance is easy and the productivity is improved. The fundamental problem of material transpiration from the source has not been solved.
That is, as long as adhesion occurs, a minimum maintenance is required to remove the adhesion, and a considerable decrease in productivity is left.
In addition, when adhesion occurs in this way, it is a matter of course that the adhered material cannot be reused, and therefore this portion is wasted material. However, since the material for forming the light emitting layer is an extremely expensive material, a slight waste is a factor that increases the cost.

  The present invention has been made in view of the above circumstances, and the object of the present invention is to prevent the material evaporated from the evaporation source from adhering to the inner wall of the mask or the chamber, to facilitate maintenance, and In addition to providing a vapor deposition device that can sufficiently reduce the waste of the material used as the vapor deposition source, and forming a functional layer using this, it was possible to reduce the cost by eliminating the waste of the functional layer forming material. The object is to provide a method of manufacturing an organic EL device.

In order to achieve the above object, a vapor deposition apparatus of the present invention is a vapor deposition apparatus for forming a predetermined pattern on an object to be processed using a physical mask having an opening pattern, comprising: a chamber having a vapor deposition source; And a decompression means for decompressing the inside of the chamber, and an isolation room for isolating a space between the vapor deposition source and the physical mask from other spaces in the chamber is provided in the chamber, and the isolation room and the Each of the physical masks is provided with heating means.
According to this vapor deposition apparatus, since the heating unit is provided in each of the isolation chamber and the physical mask, if the film is formed while heating the isolation chamber and the physical mask by the heating unit, respectively, It is possible to prevent the material evaporated from the vapor deposition source from adhering to the physical mask, and to prevent such adhesion. Therefore, maintenance is facilitated, and the waste of the material serving as the vapor deposition source is sufficiently reduced.

The method for producing an organic EL device according to the present invention includes a method for producing an organic EL device comprising: opposing electrodes; and a functional layer having an organic layer made of an organic material provided between the electrodes. Using the vapor deposition apparatus and using at least the organic layer forming material as the vapor deposition source, heating the inside of the isolation chamber and the physical mask by the heating means, respectively, sublimating the organic layer forming material, and the physical mask Thus, the organic layer forming material is selectively provided for each dot region on the substrate to be processed, and an organic layer is formed for each dot region.
In addition, it is preferable that the said organic layer is a light emitting layer.
According to this method for manufacturing an organic EL device, the organic layer is formed using the above-described vapor deposition device, so that the material evaporated from the vapor deposition source is prevented from adhering to the isolation chamber of the vapor deposition device or the physical mask. Such adhesion can be prevented. Therefore, it is possible to prevent the expensive organic layer forming material from being wasted due to adhesion, thereby reducing costs and facilitating maintenance. In particular, since the material for forming the light emitting layer is expensive, the cost can be reduced more effectively by forming the light emitting layer with the vapor deposition apparatus.

Further, in the method for manufacturing the organic EL device, the heating unit heats the inside of the isolation chamber and the physical mask so that each temperature is equal to or higher than the sublimation temperature under the processing atmosphere pressure of the organic layer forming material. Is preferred.
In this way, the temperature in the isolation chamber and the physical mass is equal to or higher than the sublimation temperature under the processing atmosphere pressure of the organic layer forming material, so that the organic layer forming material adheres to the isolation chamber and the physical mask. Therefore, the cost can be reduced and the maintenance can be facilitated.

Further, in the method of manufacturing the organic EL device, the heating unit heats the inside of the isolation chamber and the physical mask so that the temperature is lower than the decomposition temperature under the processing atmosphere pressure of the organic layer forming material. Is preferred.
In this way, it is possible to prevent the material from being wasted by decomposing the organic layer forming material.

In the method for manufacturing the organic EL device, the physical mask is preferably designed so that the opening pattern thereof substantially matches the predetermined pattern to be formed at the heating temperature when forming the organic layer.
In this way, the organic layer can be patterned and formed with higher accuracy.

Further, in the method for manufacturing the organic EL device, it is preferable that the inside of the chamber is previously set in a vacuum atmosphere of 1.333 × 10 ⁻⁴ Pa or less by the decompression unit prior to the formation of the organic layer.
In this way, deterioration of the functional layer due to moisture and oxygen can be prevented.

Hereinafter, the present invention will be described in detail based on the embodiments.
First, the vapor deposition apparatus of this invention is demonstrated. FIG. 1 is a view showing an embodiment of a vapor deposition apparatus of the present invention, and reference numeral 1 in FIG. 1 is a vapor deposition apparatus. The vapor deposition apparatus 1 includes a chamber 2 and a vacuum pump (pressure reducing means) connected to the chamber 2 and capable of reducing the pressure inside the chamber 2 to a vacuum atmosphere with a high degree of vacuum (1.333 × 10 ⁻⁴ Pa or less). ) 3, and a physical mask 5 for forming a predetermined pattern on the substrate 4 to be processed.

In the chamber 2, a container-like vapor deposition source holding unit 6 for holding the vapor deposition source is provided, and an isolation chamber 7 is provided in communication with the vapor deposition source holding unit 6. The vapor deposition source holding unit 6 is provided with a heating means (not shown) such as a heater for heating and sublimating the vapor deposition source held in the vapor deposition source holding unit 6.
The isolation chamber 7 has a cylindrical shape made of metal or the like provided between the vapor deposition source holding unit 6 and the physical mask 5 and communicates with the vapor deposition source holding unit 6 on the bottom side, and on the upper side. Thus, it is configured to communicate with the physical mask 5. Under such a configuration, the isolation chamber 7 is configured such that the space between the vapor deposition source holding unit 6 and the physical mask 5 is isolated from other spaces in the chamber 2. As a result, when the vapor deposition source is sublimated and evaporated by heating, the isolation chamber 7 guides the material to the physical mask 5 side without causing the evaporated material to flow out (diffuse) to the outside. Yes. Here, the isolation room 7 is provided with a heating means 8. In this embodiment, the heating means 8 is formed by a sheathed heater wound around the outer periphery of the isolation room 7, and is configured to control the isolation room 7 to a desired temperature. However, as for this heating means 8, it is needless to say that a known heating means can be adopted in addition to the sheathed heater.

  As described above, the physical mask 5 can form a predetermined pattern on the substrate 4, and has an opening pattern (not shown) corresponding to the predetermined pattern to be formed. . The physical mask 5 is provided with heating means 9. In the present embodiment, the heating means 9 is based on resistance heating, and is constituted by a power source 9a for supplying a current to the physical mask 5 and the physical mask 5 itself that generates heat when a current flows through the power source 9a. It is. That is, the physical mask 5 is made of a metal such as tungsten or molybdenum that has high heat resistance and is not easily deformed by heat (having a low coefficient of thermal expansion) or an alloy thereof, and generates heat well when an electric current is applied. It is like that. The physical mask 5 is provided with a temperature sensor (not shown), whereby the temperature (heating temperature) of the physical mask 5 can be adjusted by the power source 9a.

  The opening pattern of the physical mask 5 is designed and formed in advance so as to substantially match a predetermined pattern to be formed at a heating temperature at the time of forming a desired pattern using the opening pattern. That is, since the physical mask 5 expands when heated, the opening pattern thereof becomes larger than that at normal temperature as the heat expands. Therefore, if the opening pattern at room temperature is formed so as to match the desired pattern, the opening pattern becomes larger when actually forming a film, and the resulting film pattern becomes larger than the desired pattern. Because it ends up.

  In the present embodiment, the heating means 9 is composed of the power source 9a and the physical mask 5 by adopting the resistance heating method as described above. However, such a physical mask 5 is heated. As a means, for example, a method of heating the physical mask 5 by irradiating infrared rays, a method of heating the physical mask 5 by contacting a heat block, or the like can be adopted.

  The substrate 4 to be processed is positioned and set on the physical mask 5. The substrate 4 and the physical mask 5 are provided with a transfer mechanism (not shown) for moving the substrate 4 and the physical mask 5 in the chamber 2. This transfer mechanism is configured to be able to move the substrate 4 and the physical mask 5 separately and to move them together (simultaneously).

  In such a vapor deposition apparatus 1, heating means 8 and 9 are provided in the isolation chamber 7 and the physical mask 5, respectively. Therefore, the isolation chamber 7 and the physical mask 5 are heated by the heating means 8 and 9, respectively. On the other hand, if film formation is performed, it is possible to prevent the material evaporated from the vapor deposition source from adhering to the isolation chamber 7 and the physical mask 5, and to prevent such adhesion.

Next, based on the example which applied the vapor deposition apparatus 1 which consists of such a structure to formation of the functional layer of an organic EL apparatus, one Embodiment of the manufacturing method of the organic EL apparatus of this invention is described.
First, a schematic configuration of the organic EL device will be described with reference to FIGS.
As shown in FIG. 2, the organic EL device 10 according to the present embodiment has dots that emit R (red), G (green), and B (blue) in the actual display area 4, thereby providing full color. It is a display.

  The organic EL device 10 is configured to take out light emitted from the substrate 20 side, that is, a bottom emission type, as shown in FIG. 2 which is a part of a cross section taken along line AB in FIG. . Accordingly, a transparent or translucent substrate is used as the substrate 20, and specifically, glass, quartz, resin (plastic, plastic film) or the like is used. In the case where the organic EL device is a so-called top emission type, since the light emitted from the sealing substrate (not shown) side opposite to the substrate 20 is extracted, the substrate 20 is a transparent substrate and Any opaque substrate can be used.

  A circuit unit 11 including a driving TFT 123 for driving the pixel electrode 23 and the like is formed on the substrate 20, and an organic EL element is provided thereon. The organic EL element includes a pixel electrode 23 functioning as an anode, a hole injection / transport layer 70 formed on the pixel electrode 23, a light emitting layer 60 formed on the hole injection / transport layer 70, The electron injection / transport layer 65 is formed on the light emitting layer 60 and the cathode 50 is formed on the electron injection / transport layer 65. That is, in this embodiment, the hole injection / transport layer 70, the light emitting layer 60, and the electron injection / transport layer 65 constitute a functional layer. However, the present invention is not limited to this, and the functional layer only needs to have at least the light emitting layer 60. Further, the hole injection / transport layer 70 and the electron injection / transport layer 65 may not have a single layer structure but may have a stacked structure of an injection layer and a transport layer.

  The hole injection / transport layer 70 is for injecting / transporting holes from the pixel electrode 23 to the light emitting layer 60 side, and the electron injection / transport layer 65 is for injecting / transporting electrons from the cathode 50 to the light emitting layer 60 side. To be transported. Under such a configuration, the light emitting element emits light by combining holes transported from the pixel electrode 23 side and electrons transported from the cathode 50 side in the light emitting layer 60. Yes.

  Here, the functional layer is an organic layer in which at least the light emitting layer 60 is formed of an organic material. As a material for forming the light emitting layer 60, a low molecular (monomer) organic material or a high molecular (polymer) organic material is used. In the present embodiment, vapor deposition is performed using the vapor deposition apparatus 1 described above. It is assumed that the light emitting layer 60 is formed by a method, and therefore a low molecular organic material is used. Specific examples of low molecular weight organic materials include naphthalene derivatives, anthracene derivatives, perylene derivatives, polymethine-based, xanthene-based, coumarin-based, cyanine-based pigments, 8-hydroquinoline and its metal complexes, aromatic Known amines, tetraphenylcyclopentadiene derivatives, and the like described in JP-A-57-51781 and JP-A-59-194393 can be used.

Also, the hole injection / transport layer 70 and the electron injection / transport layer 65 may be organic layers made of organic materials, and in that case, a low molecular weight material may be used. When such a low molecular weight material is used, the hole injection / transport layer 70 and the electron injection / transport layer 65 can be formed by the vapor deposition method using the vapor deposition apparatus 1 described above.
As described above, regarding the functional layer, all the layers may be organic layers made of organic materials, and in this case, all of these organic layers may be formed of low molecular weight organic materials, and a part of them may be high. It may be formed of a molecular organic material. Further, for example, the electron injection / transport layer may be formed of an inorganic material. When the hole injection / transport layer 70 and the electron injection / transport layer 65 have a laminated structure of an injection layer and a transport layer, only one of them is an organic material and the other is an inorganic material. Alternatively, when both are made of an organic material, either one may be a low molecular weight material and the other may be a high molecular weight material.

The pixel electrode 23 functioning as an anode is formed of a transparent conductive material because it is a bottom emission type in this example. ITO is suitable as the transparent conductive material. In addition, for example, an indium oxide / zinc oxide amorphous transparent conductive film (Indium Zinc Oxide: IZO / registered trademark)) (Idemitsu Kosan) Etc.) can be used. In the present embodiment, ITO is used.
The cathode 50 is formed so as to cover the electron injection / transport layer 65 and the organic bank layer 221, and has a laminated structure of LiF and Al, a laminated structure of magnesium and silver, and a laminated structure of calcium and aluminum. Various conventionally known ones can be used. Since the present embodiment is a bottom emission type, the cathode 50 does not have to be particularly light transmissive.

The surface of the interlayer insulating layer 284 on which the pixel electrode 23 is formed has a pixel electrode 23, a lyophilic control layer 25 mainly composed of a lyophilic material such as SiO _2, and an organic bank layer made of acrylic or polyimide. 221. In the pixel electrode 23, the hole injection layer 70 and the light emitting layer 60 are formed in the opening 25 a provided in the lyophilic control layer 25 and the opening 221 a provided in the organic bank 221. They are stacked in this order from the electrode 23 side. In addition, “lyophilic” of the lyophilic control layer 25 in this embodiment means that the lyophilic property is higher than at least materials such as acrylic and polyimide constituting the organic bank layer 221. .
The layers from the substrate 20 to the interlayer insulating layer 284 described above constitute the circuit unit 11.

  In the organic EL device 10 of the present embodiment, each light emitting layer 60 is formed so that the light emission wavelength bands correspond to the three primary colors of light in order to perform color display as described above. For example, as the light emitting layer 60, a red light emitting layer 60 whose light emission wavelength band corresponds to red, a green light emitting layer 60 corresponding to green, and a blue organic EL layer 60 corresponding to blue, respectively, are displayed. , G, and B constitute one pixel that performs color display with these display regions R, G, and B. In addition, a BM (black matrix) (not shown) in which metallic chromium is formed by sputtering or the like is positioned between the organic bank layer 221 and the lyophilic control layer 25 at the boundary of each color display region. Has been.

A method for manufacturing such an organic EL device 10 will be described with reference to FIGS. 4 (a) to 4 (c) and FIGS. 5 (a) to 5 (c). Each of the cross-sectional views shown in FIGS. 4 and 5 corresponds to a part of the cross section taken along line AB in FIG.
First, up to the circuit portion 11 shown in FIG. 3 is formed on the surface of the substrate 20 by a known method, and then a conductive film to be the pixel electrode 23 is formed so as to cover the entire surface of the substrate 20. Then, by patterning this transparent conductive film, a pixel electrode 23 is formed as shown in FIG.

  Next, as shown in FIG. 4B, a lyophilic control layer 25 that is an insulating layer is formed on the pixel electrode 23 and the interlayer insulating film 284. Subsequently, in the lyophilic control layer 25, a BM (not shown) is formed in a concave portion formed between two different pixel electrodes 23. Specifically, a film is formed on the concave portion of the lyophilic control layer 25 by sputtering using metallic chromium.

Next, as shown in FIG. 4C, an organic bank layer 221 is formed so as to cover a predetermined position of the lyophilic control layer 25, specifically, the BM. As a specific method for forming the organic bank layer, for example, an organic layer is formed by applying a resist in which a resist such as an acrylic resin or a polyimide resin is dissolved in a solvent by various coating methods such as a spin coating method or a dip coating method. .
Subsequently, the organic layer is patterned using a photolithography technique and an etching technique, and a bank opening 221a is formed in the organic layer, thereby forming an organic bank layer 221 having a wall surface in the opening 221a.

  Next, the hole injection / transport layer 70, the light emitting layer 60, and the electron injection / transport layer 65 are formed in this order to form a functional layer. In the present embodiment, each of these layers is made of a low molecular organic material, and therefore the film is formed using the vapor deposition apparatus 1 shown in FIG. Note that when an organic layer is formed using a low molecular weight organic material, these organic materials (particularly, the light emitting layer forming material) are easily oxidized and deteriorated by the presence of oxygen and water. Therefore, the lithography method cannot be employed, and therefore, a vapor deposition method using a physical mask by a vacuum vapor deposition apparatus is employed.

  First, the physical mask 5 is set on the isolation chamber 7 in the chamber 2, and the substrate 20 formed up to the opening 221a is further formed on the film forming side, that is, the side on which the opening 221a is formed. Position and set toward the physical mask 5. As the physical mask 5, a mask having an opening pattern corresponding to the opening 221a is used. As described above, when the desired pattern (here, the hole injection / transport layer 70) is formed using this opening pattern, the opening pattern is preliminarily matched with the predetermined pattern to be formed at the heating temperature at the time of formation. It shall be designed.

After placing the substrate 20 In this way, by operating the vacuum pump 3, the inside of the chamber 2 the desired degree of vacuum, for example, 1.333 × ¹⁰ -4 Pa or less, in particular 1.333 × ¹⁰ -4 Pa to The pressure is reduced to about 1.333 × 10 ⁻⁵ Pa (10 ⁻⁶ Torr to 10 ⁻⁷ Torr). Also. Separately from this, the heating means 8 in the isolation chamber 7 and the heating means 9 for the physical mask 5 are operated to heat the inside of the isolation chamber 7 and the physical mask 5 to a predetermined temperature, respectively, and maintain that temperature. .

The heating temperature for the inside of the isolation chamber 7 and the physical mask 5 is a temperature higher than the sublimation temperature of the forming material (low molecular weight organic material) of the pattern to be formed (hole injection / transport layer 70) under the film forming treatment atmospheric pressure ( It is desirable to heat by the heating means 8 and 9 so that the temperature is usually 200 to 400 ° C. In this case, the inside of the isolation chamber 7 and the physical mass 5 are at a temperature equal to or higher than the sublimation temperature under the processing atmosphere pressure of the forming material, so that the forming material adheres to the isolation chamber 7 and the physical mask 5. Therefore, the cost can be reduced and the maintenance can be facilitated.
Further, it is desirable that the heating means 8 and 9 respectively heat the forming material so as to be lower than the decomposition temperature of the forming material under the film forming treatment atmospheric pressure. By doing so, it is possible to prevent the formation material from being decomposed and the material from being wasted as a result.

  If the inside of the isolation room 7 and the physical mask 5 are heated to such a temperature range by the heating means 8 and 9, the vapor deposition source holding | maintenance part 6 will be heated by the heating means (not shown). The heating temperature of the vapor deposition source holding unit 6 is also reduced in the film forming treatment atmosphere pressure of the forming material (low molecular organic material) serving as the vapor deposition source, similarly to the heating temperature of the isolation chamber 7 and the physical mask 5. The temperature is equal to or higher than the sublimation temperature and lower than the decomposition temperature.

  When the vapor deposition source holding part 6 is heated in this way, the vapor deposition source provided therein, that is, the forming material is sublimated and evaporated. As described above, since the isolated chamber 7 is heated to a temperature higher than the sublimation temperature as described above, the evaporated material is not cooled and attached to the inner wall of the isolated chamber 7, The ascending room 7 is moved up to the physical mask 5 side. At this time, since the physical mask 5 is also heated, the evaporated material does not cool and adhere to the physical mask 5 even if it comes into contact with the physical mask 5.

  Accordingly, the evaporated material reaches the physical mask 5, passes through the opening pattern, reaches the opening 221 a of the substrate 20, and comes into contact therewith. Then, the material is cooled and solidified (sublimated) here, and is formed into a hole injection / transport layer 70 in the opening 221a as shown in FIG. 4C.

When the hole injection / transport layer 70 is formed in this way, heating to the vapor deposition source holding unit 6 is stopped, and film formation by vapor deposition is completed. Then, if necessary, the physical mask 5 is changed for forming the light emitting layer, and the evaporation source is changed to the organic material for forming the light emitting layer together with the evaporation source holding unit 6.
Then, in the same manner as in the case of the hole injection / transport layer 70, the light emitting layer 60 is formed while being heated to a temperature corresponding to the forming material, and the light emitting layer 60 is formed as shown in FIG. . For the light emitting layer 60, a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light are formed respectively. At this time, since the organic material does not adhere to the physical mask 5 as described above, when the color is changed, the physical mechanism 5 is shifted by the pitch (sub-pixel pitch) corresponding to the light emitting layer of each color by the transfer mechanism, and remains as it is. It can move to the next vapor deposition process.
Thereafter, in the same manner as in the case of the hole injecting / transporting layer 70 and the light emitting layer 60, the electron injecting / transporting layer 65 is formed while being heated to a temperature corresponding to the forming material, as shown in FIG. Thus, the light emitting layer 60 is formed.

Next, a cathode material is formed by vapor deposition or sputtering, and the cathode 50 is formed. Also in this cathode layer forming step, the vapor deposition apparatus 1 shown in FIG. 1 can be used when the vapor deposition method is employed.
Then, as shown in FIG.5 (c), the sealing substrate 30 is formed by a sealing process. In this sealing step, in order to prevent water and oxygen from entering the produced organic EL element, for example, a desiccant 45 is adhered to the inside of the sealing substrate 30 while the sealing substrate 30 and the substrate 20 Is sealed with a sealing resin (not shown). As the sealing resin, a thermosetting resin or an ultraviolet curable resin is used. In addition, it is preferable to perform this sealing process in inert gas atmosphere, such as nitrogen, argon, and helium.

In such a manufacturing method of the organic EL device 10, the organic layer in the functional layer, that is, each of the hole injection / transport layer 70, the light emitting layer 60, and the electron injection / transport layer 65 is formed by the vapor deposition device 1. Since it forms, it can prevent that each formation material adheres in the isolation | separation room 7 of the vapor deposition apparatus 1, or the physical mask 5. FIG. Therefore, it is possible to prevent the expensive forming material from being wasted due to the adhesion, thereby reducing the cost and facilitating maintenance. In particular, since the material for forming the light emitting layer is expensive, the cost can be reduced more effectively by forming the light emitting layer with the vapor deposition apparatus 1.
For example, when forming the light emitting layer, the red light emitting layer, the green light emitting layer, and the blue light emitting layer can be formed using the same material without changing the physical mask 5 as described above. The operation becomes easy and the maintenance becomes easy, so that the throughput of the film formation can be improved.

Moreover, in the said vapor deposition apparatus 1 used for such a manufacturing method, it can prevent that the material evaporated from the vapor deposition source adheres to the isolation room 7 or the physical mask 5 as mentioned above. In addition to facilitating maintenance, it is possible to reduce the waste by sufficiently reducing the material used as the evaporation source.
Furthermore, since it is possible to prevent the material from adhering to the physical mask 5, the lifetime of the physical mask 5 can be lengthened. Therefore, the cost can be further reduced.

In the embodiment, each of the hole injection / transport layer 70, the light emitting layer 60, and the electron injection / transport layer 65 is formed by the vapor deposition apparatus 1, but the present invention is not limited thereto, At least one of the layers may be an organic layer made of a low molecular material, and this may be formed and patterned using the vapor deposition apparatus 1.
Moreover, although it is not an organic layer, the said vapor deposition apparatus 1 can be used for the formation also about the anode (pixel electrode 23) and the cathode 50. FIG.
In the above-described embodiment, the case where the method for manufacturing an organic EL device of the present invention is applied to a method for manufacturing an active matrix organic EL device has been described. However, the present invention is not limited to this, and for example, simple It can also be applied to a method for manufacturing a matrix type organic EL device.

  The organic EL device 10 obtained by the present invention can be used as a display unit or the like in various electronic devices. Specifically, the present invention can be applied to a display unit of a mobile phone, a display unit of a portable information processing device such as a word processor or a personal computer, a display unit of a wristwatch type electronic device, and a flat panel display (for example, a television).

It is a schematic block diagram of one Embodiment of the vapor deposition apparatus of this invention. It is a top view which shows typically the structure of the organic electroluminescent apparatus of this invention. It is a principal part expanded sectional view in the AB line of FIG. It is sectional drawing explaining the manufacturing method of an organic electroluminescent apparatus in order of a process. FIG. 5 is a cross-sectional view for explaining a step following the step in FIG. 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Deposition apparatus, 2 ... Chamber, 3 ... Vacuum pump (pressure reduction means),
4 ... Substrate (object to be processed), 6 ... Deposition holder, 7 ... Isolation chamber, 8 ... Heating means,
9 ... heating means,
DESCRIPTION OF SYMBOLS 10 ... Organic EL device, 23 ... Pixel electrode (anode), 50 ... Cathode, 60 ... Light emitting layer,
65 ... Electron injection / transport layer, 70 ... Hole injection / transport layer

Claims (7)

A vapor deposition apparatus for forming a predetermined pattern on a workpiece using a physical mask having an opening pattern,
A chamber having a deposition source, and a decompression means for decompressing the inside of the chamber,
In the chamber, an isolation room for isolating a space between the deposition source and the physical mask from other spaces in the chamber is provided.
A vapor deposition apparatus, wherein the isolation chamber and the physical mask are each provided with heating means. In a method for manufacturing an organic EL device comprising: an opposing electrode; and a functional layer having an organic layer made of an organic material provided between the electrodes.
2. The vapor deposition apparatus according to claim 1, wherein at least the organic layer forming material is used as the vapor deposition source, and the organic layer forming material is sublimated while heating the inside of the isolation chamber and the physical mask by the heating means. An organic EL device characterized in that the organic layer forming material is selectively arranged for each dot region on the substrate to be processed by the physical mask, and an organic layer is formed for each dot region. Manufacturing method.   3. The method of manufacturing an organic EL device according to claim 2, wherein the organic layer is a light emitting layer.   4. The organic material according to claim 2, wherein the inside of the isolation chamber and the physical mask are heated by the heating means so as to have a temperature equal to or higher than a sublimation temperature under a processing atmosphere pressure of the organic layer forming material. Manufacturing method of EL device.   5. The heating means is used to heat the inside of the isolation chamber and the physical mask so that the temperature becomes lower than the decomposition temperature of the organic layer forming material under the processing atmosphere pressure. A method for producing an organic EL device according to one item.   The said physical mask is designed so that the opening pattern may substantially correspond to the predetermined pattern to form at the heating temperature at the time of organic layer formation. Manufacturing method of the organic EL device. The inside of the chamber is previously set to a vacuum atmosphere of 1.333 × 10 ⁻⁴ Pa or less by the decompression unit prior to the formation of the organic layer. Manufacturing method of the organic EL device.

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