CN104152847A - Method for improving temperature stability of metal mask in OLED evaporation process - Google Patents
Method for improving temperature stability of metal mask in OLED evaporation process Download PDFInfo
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- CN104152847A CN104152847A CN201410338518.6A CN201410338518A CN104152847A CN 104152847 A CN104152847 A CN 104152847A CN 201410338518 A CN201410338518 A CN 201410338518A CN 104152847 A CN104152847 A CN 104152847A
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Abstract
The invention discloses a method for improving temperature stability of a metal mask in an OLED evaporation process. The method comprises the following steps: providing an evaporation chamber and a glass substrate, and heating the glass substrate located in the evaporation chamber until the temperature of the glass substrate reaches an equilibrium temperature; providing a metal mask and preheating the metal mask until the temperature of the metal mask reaches the equilibrium temperature; and conveying the preheated metal mask onto the glass substrate in the evaporation chamber for evaporation. The method is characterized in that the metal mask is preheated before being conveyed into the evaporation chamber, and therefore, the temperature of the metal mask reaches the equilibrium temperature which is required in the continuous evaporation manufacturing process before the metal mask is conveyed into the evaporation chamber. As a result, the metal mask can be prevented from being changed in dimension due to the temperature change at the very start when the metal mask is conveyed into the evaporation chamber, and the metal mask and the glass substrate are protected against deformation due to thermal expansion, and furthermore, the stability of the manufacturing process is ensured.
Description
Technical field
The present invention, about a kind of OLED evaporation process, refers in particular to the method for metal mask temperature stability in a kind of OLED of improvement evaporation process.
Background technology
Tradition OLED evaporating coating; utilize metal mask or FMM (high-precision metal mask plate) definition coating film area, the dimensional change of metal mask can affect plated film precision, if dimensional change is excessive; can affect coating quality, cause colour mixture that product yield is reduced.One of them factor that affects metal mask dimensional change is thermal expansion; because organic materials adopts the mode of evaporation; heat can see through heated organic materials or the heat of evaporation source is delivered on metal mask or glass substrate in thermal-radiating mode, causes metal mask and glass substrate to cause being out of shape because of thermal expansion.This distortion impacts for the stable of OLED processing procedure, especially, for the high plated film precision of current high-resolution product requirement, affects larger.
The method of tradition OLED evaporating coating, as shown in Figure 1, by mechanical arm 90 by metal mask 91 by picking and placeing to the evaporation cavity 93 of relatively-high temperature in the temporary cavity 92 of room temperature.The general pipeline adopting at the reserved water coolant of evaporation inside cavity, reaches the object of controlling metal mask and glass substrate temperature at present.The schematic internal view of evaporation cavity 93 as shown in Figure 2, in evaporation cavity 93, comprise an evaporation source 94, evaporation source 94 tops are disposed with microscope carrier 95, metal mask 91, glass substrate 96, pressing plate 97 and water temperature regulater 98, between microscope carrier 95, pressing plate 97 and water temperature regulater 98, be connected with cooling water pipeline 99, the temperature by cooling water control metal mask 91 with glass substrate 96.
This method can make the temperature of metal mask and glass substrate through after a period of time really, tends towards stability.But in the time that metal mask imports evaporation cavity at the beginning into, be under room temperature state, rise gradually along with continuous evaporation processing procedure can make the temperature of metal mask, finally just can be in stable.In the process of this section of temperature rise, the size of metal mask still can be along with changing, and causes metal mask and glass because thermal expansion causes distortion, causes the unstable of evaporation processing procedure.
Therefore how to continue the more stable metal mask of maintenance and the temperature of glass substrate in the process of evaporation, do not make it cause in time variation, be this area important topic urgently to be resolved hurrily.
Summary of the invention
In view of the problems referred to above, the invention provides the method for metal mask temperature stability in a kind of OLED of improvement evaporation process, comprise the following steps:
Evaporation cavity and glass substrate are provided, the glass substrate that is positioned at described evaporation cavity is heated to an equilibrium temperature;
Metal mask is provided, described metal mask is preheated to described equilibrium temperature;
Be conveyed on the described glass substrate in described evaporation cavity and carry out evaporation completing pre-warmed described metal mask.
The present invention, by importing into before evaporation cavity at metal mask, preheats metal mask, makes metal mask importing into before evaporation cavity, while just having reached continuous evaporating-plating processing procedure by the equilibrium temperature reaching.So, in the time that metal mask imports evaporation cavity at the beginning into, just can keep size not to be subject to temperature variation and to produce variation, avoid metal mask and glass substrate to cause distortion because of thermal expansion, and then reached the stable of processing procedure.
Further improvement of the present invention is, temporary cavity is provided, and described metal mask is positioned in described temporary cavity and is preheated to described equilibrium temperature.
Further improvement of the present invention is, by resistance-type type of heating, described metal mask is preheated.
Further improvement of the present invention is, in described temporary cavity, be provided with the carrying platform for placing described metal mask, in the cavity surrounding of described temporary cavity or described carrying platform, bury resistance-type heater wire underground, by described resistance-type heater wire, described metal mask is preheated.
Further improvement of the present invention is, by water temp. heating mode, described metal mask is preheated.
Further improvement of the present invention is, in described temporary cavity, be provided with the carrying platform for placing described metal mask, in the cavity surrounding of described temporary cavity or described carrying platform, bury water pipe underground, by a water temperature regulater, the water in described water pipe is heated, and then described metal mask is preheated.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing OLED evaporation process.
Fig. 2 is the schematic internal view of evaporation cavity in existing OLED evaporation process.
Fig. 3 is the first embodiment schematic diagram of the method for metal mask temperature stability in the OLED of improvement evaporation process of the present invention.
Fig. 4 is the second embodiment schematic diagram of the method for metal mask temperature stability in the OLED of improvement evaporation process of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The method of metal mask temperature-stable while improving OLED evaporating coating of the present invention, comprises the following steps:
Evaporation cavity and glass substrate are provided, the glass substrate that is positioned at described evaporation cavity is heated to an equilibrium temperature;
Metal mask and temporary cavity are provided, described metal mask is positioned in described temporary cavity and is preheated to described equilibrium temperature;
Be conveyed on the described glass substrate in described evaporation cavity and carry out evaporation completing pre-warmed described metal mask.
Below that the present invention carries out pre-warmed two kinds of embodiments to metal mask:
Embodiment 1:
Coordinate referring to shown in Fig. 3, before metal mask 20 imports evaporation cavity 40 into, deposit in temporary cavity 30 interior under room temperature, before importing metal mask 20 into evaporation cavity 40 again, first metal mask 20 is preheated temporary cavity 30 is interior, make metal mask 20 importing into before evaporation cavity 40, while just having reached continuous evaporating-plating processing procedure by the equilibrium temperature reaching, ensure that metal mask 20 imports into after evaporation cavity 40, size is not subject to temperature variation and produces variation, avoid glass substrate in metal mask 20 and evaporation cavity 40 to cause distortion because of thermal expansion, and then reach the stable of processing procedure.
Wherein, the cavity surrounding of temporary cavity 30 is embedded with resistance-type heater wire 210 or water pipe 220, by resistance-type heater wire 210 being heated or by a water temperature regulater, the water in water pipe 220 being heated, realize the heating to temporary cavity 30 inside cavity, and then metal mask 20 is preheated.Heating temperature can be set to and make metal mask 20 leave temporary cavity 30 in when interior, can heat up to reach and import in the rear evaporation processing procedure of evaporation cavity 40 equilibrium temperature reaching.
Further, can also impose process of cooling to the water in water pipe 220 by water temperature regulater, water temperature be reduced, to coordinate the requirement of the evaporation processing procedure that need to reach different equilibrium temperatures.
Embodiment 2:
Coordinate referring to shown in Fig. 4, before metal mask 20 imports evaporation cavity 40 into, deposit in temporary cavity 30 interior under room temperature, before importing metal mask 20 into evaporation cavity 40, first metal mask 20 is preheated temporary cavity 30 is interior, make metal mask 20 importing into before evaporation cavity 40, while just having reached continuous evaporating-plating processing procedure by the equilibrium temperature reaching, ensure that metal mask 20 imports into after evaporation cavity 40, size is not subject to temperature variation and produces variation, avoid glass substrate in metal mask 20 and evaporation cavity 40 to cause distortion because of thermal expansion, and then reach the stable of processing procedure.
Wherein, in temporary cavity 30, be provided with the carrying platform 230 for placing described metal mask 20, in described carrying platform 230, be embedded with resistance-type heater wire 210 or water pipe 220, by resistance-type heater wire 210 being heated or by a water temperature regulater, the water in water pipe 220 being heated, realize the heating to carrying platform 230, and then described metal mask 20 is preheated.Heating temperature can be set to and make metal mask 20 leave temporary cavity 30 in when interior, can heat up to reach and import in the rear evaporation processing procedure of evaporation cavity 40 equilibrium temperature reaching.
Further, can also impose process of cooling to the water in water pipe 220 by water temperature regulater, water temperature be reduced, to coordinate the requirement of the evaporation processing procedure that need to reach different equilibrium temperatures.
The above is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, not departing from the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (6)
1. improve a method for metal mask temperature stability in OLED evaporation process, it is characterized in that comprising the following steps:
Evaporation cavity and glass substrate are provided, the glass substrate that is positioned at described evaporation cavity is heated to an equilibrium temperature;
Metal mask is provided, described metal mask is preheated to described equilibrium temperature;
Be conveyed on the described glass substrate in described evaporation cavity and carry out evaporation completing pre-warmed described metal mask.
2. the method for claim 1, is characterized in that:
Temporary cavity is provided;
Described metal mask is positioned in described temporary cavity and is preheated to described equilibrium temperature.
3. method as claimed in claim 2, is characterized in that by resistance-type type of heating, described metal mask being preheated.
4. method as claimed in claim 3, it is characterized in that being provided with the carrying platform for placing described metal mask in described temporary cavity, in the cavity surrounding of described temporary cavity or described carrying platform, bury resistance-type heater wire underground, by described resistance-type heater wire, described metal mask is preheated.
5. method as claimed in claim 2, is characterized in that by water temp. heating mode, described metal mask being preheated.
6. method as claimed in claim 5, it is characterized in that being provided with the carrying platform for placing described metal mask in described temporary cavity, in the cavity surrounding of described temporary cavity or described carrying platform, bury water pipe underground, by a water temperature regulater, the water in described water pipe is heated, and then described metal mask is preheated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410338518.6A CN104152847A (en) | 2014-07-16 | 2014-07-16 | Method for improving temperature stability of metal mask in OLED evaporation process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410338518.6A CN104152847A (en) | 2014-07-16 | 2014-07-16 | Method for improving temperature stability of metal mask in OLED evaporation process |
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| CN104152847A true CN104152847A (en) | 2014-11-19 |
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| CN201410338518.6A Pending CN104152847A (en) | 2014-07-16 | 2014-07-16 | Method for improving temperature stability of metal mask in OLED evaporation process |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104611669A (en) * | 2015-03-04 | 2015-05-13 | 信利（惠州）智能显示有限公司 | Manufacturing method of masks |
| CN106256925A (en) * | 2015-06-18 | 2016-12-28 | 佳能特机株式会社 | Vacuum deposition apparatus, the manufacture method of evaporation film and the manufacture method of organic electronic device |
| CN109097728A (en) * | 2018-09-26 | 2018-12-28 | 京东方科技集团股份有限公司 | A kind of mask plate and its method of throwing the net, device of throwing the net |
| CN109161855A (en) * | 2018-11-06 | 2019-01-08 | 京东方科技集团股份有限公司 | A kind of evaporation coating device and evaporation coating method |
| CN111556665A (en) * | 2019-02-12 | 2020-08-18 | 千住金属工业株式会社 | Welding method and welding device |
| CN111948907A (en) * | 2019-05-16 | 2020-11-17 | 上海微电子装备（集团）股份有限公司 | Mask plate temperature control device and mask exposure device |
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| JP2003129218A (en) * | 2001-10-22 | 2003-05-08 | Toyota Motor Corp | Mask for film formation and process for forming thin film using the same |
| JP2005235568A (en) * | 2004-02-19 | 2005-09-02 | Seiko Epson Corp | Deposition device and manufacturing device of organic el device |
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2014
- 2014-07-16 CN CN201410338518.6A patent/CN104152847A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129218A (en) * | 2001-10-22 | 2003-05-08 | Toyota Motor Corp | Mask for film formation and process for forming thin film using the same |
| JP2005235568A (en) * | 2004-02-19 | 2005-09-02 | Seiko Epson Corp | Deposition device and manufacturing device of organic el device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104611669A (en) * | 2015-03-04 | 2015-05-13 | 信利（惠州）智能显示有限公司 | Manufacturing method of masks |
| CN106256925A (en) * | 2015-06-18 | 2016-12-28 | 佳能特机株式会社 | Vacuum deposition apparatus, the manufacture method of evaporation film and the manufacture method of organic electronic device |
| CN106256925B (en) * | 2015-06-18 | 2020-10-02 | 佳能特机株式会社 | Vacuum evaporation apparatus, method for manufacturing evaporated film, and method for manufacturing organic electronic device |
| CN109097728A (en) * | 2018-09-26 | 2018-12-28 | 京东方科技集团股份有限公司 | A kind of mask plate and its method of throwing the net, device of throwing the net |
| CN109097728B (en) * | 2018-09-26 | 2021-11-02 | 京东方科技集团股份有限公司 | Mask plate, screen stretching method thereof and screen stretching device |
| CN109161855A (en) * | 2018-11-06 | 2019-01-08 | 京东方科技集团股份有限公司 | A kind of evaporation coating device and evaporation coating method |
| CN111556665A (en) * | 2019-02-12 | 2020-08-18 | 千住金属工业株式会社 | Welding method and welding device |
| CN111948907A (en) * | 2019-05-16 | 2020-11-17 | 上海微电子装备（集团）股份有限公司 | Mask plate temperature control device and mask exposure device |
| CN111948907B (en) * | 2019-05-16 | 2022-01-28 | 上海微电子装备（集团）股份有限公司 | Mask plate temperature control device and mask exposure device |
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Application publication date: 20141119 |