CN101328575B - Bearing device for sputtering - Google Patents
Bearing device for sputtering Download PDFInfo
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- CN101328575B CN101328575B CN200710200846XA CN200710200846A CN101328575B CN 101328575 B CN101328575 B CN 101328575B CN 200710200846X A CN200710200846X A CN 200710200846XA CN 200710200846 A CN200710200846 A CN 200710200846A CN 101328575 B CN101328575 B CN 101328575B
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- sputtering
- bearing device
- metal tray
- spination
- heat conduction
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Abstract
The invention provides a carrying device used for sputtering. The carrying device comprises a carrying tool and a metal tray used to carry the carrying tool, wherein the carrying tool has a bottom surface, while the metal tray has a carrying surface; one of the bottom surface and the carrying surface is formed into a plurality of saw tooth-shaped bulges, while the other one is formed into a plurality of grooves corresponding to the saw tooth-shaped bulges; and the carrying tool and the metal tray are formed into thermocontact and are relatively fixed through the bulges and the grooves. The carrying device ensures that the carrying tool and the metal tray have bigger thermocontact surfaces through the arrangement of the matched tooth-shaped bulges and grooves; thus, the heat on a plated object placed on the carrying tool can be effectively transmitted to the metal tray so as to be dispersed, thereby effectively preventing the deformation of the plated object due to too high temperature.
Description
Technical field
The present invention relates to the vacuum splashing and plating field, relate in particular to a kind of bearing device for sputtering.
Background technology
Sputter is a kind of thin film physics gas phase deposition technology, wherein to have speed fast for continous way sputter (In-line Sputtering) coating process, the output height, coating quality is good, advantages such as film adhesion is strong, a large amount of making of various metals and nonmetal rete in the industry have been widely used in, can be referring to people such as E.Schulthei β at document IEEE Transactions OnMagnetics, Vol.24, No.6, Effects of Target Structure Onthe Properties of MO Recording Media Produced in a Large-Scale Vertical In-LineSputtering system one literary composition among the 2772-2774 (1988).
In the continous way film sputtering and coating technology; the energetic plasma that utilizes glow discharge or ionic fluid to produce continuously under vacuum environment can produce a large amount of heats when clashing into target; thereby can make the temperature in the whole sputtering apparatus raise; and when plated film; in order to shorten the time of plated film; usually also can adopt the method that improves power, can make also that thus the temperature in the whole sputtering apparatus further raises, and then cause by the also corresponding rising of the temperature of plating object.But existing continous way sputtering apparatus is placed when plated film can not quick heat radiating by the plummer of plating object, and therefore, along with the temperature in the sputtering apparatus raises, the heat that is absorbed by the plating object can't in time be left.When the temperature in the continous way sputtering apparatus is higher than the heat-drawn wire for the treatment of plating object itself, treat that the plating object just deformation can take place, make and treat that the size of plating object exceeds code requirement, cause plated film object afterwards can't satisfy the needs of subsequent production.
Summary of the invention
In view of this, be necessary to provide a kind of bearing device for sputtering, effectively to dispel the heat when the sputter, preventing to be heated by the plating object deforms.
A kind of bearing device for sputtering, it comprises: a carrier and is used to carry the metal tray of described carrier; Described carrier has a bottom surface, and described metal tray has a loading end; The person is formed with a plurality of spination projectioies on it one of in described bottom surface and the loading end, and another person is formed with and the corresponding a plurality of grooves of described a plurality of spination projectioies on it; Described carrier matches with a plurality of grooves via described a plurality of projectioies with metal tray and forms thermo-contact and relative fixed.
With respect to prior art, described bearing device for sputtering makes carrier and metal tray have bigger thermo-contact surface via a plurality of spination projection and grooves that match are set, make to be placed on can be passed to metal tray quickly and efficiently by the heat on the plating object and loose and remove on the carrier, thereby can effectively avoid too high and produce distortion by plating object Yin Wendu.And, described a plurality of spination projection that matches and the setting of groove can effectively be avoided because of carrier and metal tray produce being biased to outside the sputter scope of target by the plating object that relative displacement causes, thus can be on by the plating object the preferable coating layer of formation homogeneity.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION synoptic diagram of a kind of bearing device for sputtering of providing of the embodiment of the invention.
Fig. 2 is the textural association synoptic diagram of bearing device for sputtering shown in Figure 1.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
See also Fig. 1 and Fig. 2, a kind of bearing device for sputtering 100 that the embodiment of the invention provides, it comprises: a carrier 120 and is used to carry the metal tray 140 of described carrier.
Described carrier 120 has a platy structure, and it comprises a bottom surface 122 and an end face 124 relative with bottom surface 122.Described end face 124 is used for carrying by the plating object, for example, and plastic cement lens etc.Described bottom surface 122 is formed with a plurality of grooves 123, and described a plurality of grooves 123 are the continuous distribution state.The surface-area of the bottom surface that is arranged so that described carrier 120 122 of described groove 123 increases.Described a plurality of groove 123 is integrated with carrier 120, and it makes described carrier 120 can have lower manufacturing cost.
Described metal tray (Metallic Tray) 140 has a loading end 142, and described carrier 120 can be installed on the loading end 142, and with loading end 142 relative fixed.The area of described loading end 142 is greater than the area of the bottom surface 122 of carrier 120, and it is beneficial to heat radiation.Form a plurality of and above-mentioned groove 123 corresponding a plurality of spination projectioies 143 on the described loading end 142, described a plurality of spination projectioies 143 are the continuous distribution state.Described a plurality of spination projection 143 is integrated with metal tray 140, and it makes described metal tray 140 can have lower manufacturing cost.In the present embodiment, as shown in Figure 1, described a plurality of spination projectioies 143 are a long strip shape structure; Described a plurality of spination 143 is arranged on (scheming not show 0 central part over against setting, and then be beneficial to even plated film with target of metal tray 140.
Described carrier 120 matches to realize good thermo-contact via a plurality of grooves 123 and a plurality of spination projection 143 that are provided with separately with described metal tray 140.Therefore, in the sputter process, the groove 123 that will be formed thermo-contacts via a plurality of and described spination projection 143 on the carrier 120 by the heat on the plating object that is loaded on the end face 124 of carrier 120 effectively be passed to metal tray 140, loose via the bigger metal tray 140 of area again and remove, thereby can effectively prevent by plating object Yin Wendu too high and produce distortion.
Preferably, for realizing continous way film sputtering and coating technology, described bearing device for sputtering 100 also comprises a heat conduction travelling belt 160 and a plurality of roller 180.Described a plurality of roller 180 and described heat conduction travelling belt 160 mechanical coupling are in order to drive described heat conduction travelling belt 160 motions.Described metal tray 140 is arranged on the heat conduction travelling belt 160, and can be synchronized with the movement with described heat conduction travelling belt 160.Described metal tray 140 form thermo-contacts with loading end 142 facing surfaces and heat conduction travelling belt 160.Because described metal tray 140 forms thermo-contacts with heat conduction travelling belt 160 and heat conduction travelling belt 160 is heat conduction, therefore the heat that is passed to metal tray 140 by the plating object can further pass to heat conduction travelling belt 160 again and loose and remove.The bearing of trend of described a plurality of spination projectioies 143 is vertical substantially with the direction of motion shown in arrow among Fig. 1 and Fig. 2 of described heat conduction travelling belt 160, it can effectively be avoided because of carrier 120 and being biased to outside the sputter scope of target by the plating object that the horizontal relative displacement of metal tray 140 generations causes, thereby can form the preferable coating layer of homogeneity on by the plating object.
In addition, it will be appreciated by persons skilled in the art that a plurality of grooves 123 of described carrier 120 also can be for discontinuously arranged, corresponding, a plurality of spination projectioies 143 of described metal tray 140 are discontinuously arranged.Further, also can on the bottom surface 122 of carrier 120, form a plurality of continuous distribution or discontinuously arranged spination projection, corresponding, at formation on the loading end 142 of metal tray 140 and the protruding corresponding a plurality of grooves of a plurality of spinations on the bottom surface 122.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (9)
1. bearing device for sputtering is characterized in that it comprises:
One carrier, it has a bottom surface, and
One is used to carry the metal tray of described carrier, and it has a loading end; The person is formed with a plurality of spination projectioies on it one of in described bottom surface and the loading end, another person is formed with on it and the corresponding a plurality of grooves of described a plurality of spination projectioies, and described carrier and metal tray are via described a plurality of projectioies match with a plurality of grooves formation thermo-contact and relative fixed.
2. bearing device for sputtering as claimed in claim 1 is characterized in that described a plurality of groove is the continuous distribution state.
3. bearing device for sputtering as claimed in claim 2 is characterized in that described a plurality of spination projection is the continuous distribution state.
4. bearing device for sputtering as claimed in claim 3 is characterized in that described a plurality of spination projection is a long strip shape structure.
5. bearing device for sputtering as claimed in claim 1, it is characterized in that described a plurality of groove and a plurality of spination projection respectively with described carrier and metal tray in corresponding person be integrated.
6. bearing device for sputtering as claimed in claim 1 is characterized in that the area of the area of described loading end greater than the bottom surface of described carrier.
7. bearing device for sputtering as claimed in claim 1 is characterized in that the described central part that a plurality of spinations projection on the loading end or a plurality of grooves are positioned at described loading end that is formed on.
8. as any described bearing device for sputtering of claim 1 to 7, it is characterized in that described bearing device for sputtering also comprises the roller of a heat conduction travelling belt and a plurality of and described heat conduction travelling belt mechanical coupling, described a plurality of rollers are used to drive described heat conduction conveyer belt; Described metal tray is arranged on the described heat conduction travelling belt, described metal tray form thermo-contact with its loading end facing surfaces and described heat conduction travelling belt.
9. bearing device for sputtering as claimed in claim 8 is characterized in that the bearing of trend of described a plurality of spination projectioies is vertical with the direction of motion of described heat conduction travelling belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710200846XA CN101328575B (en) | 2007-06-20 | 2007-06-20 | Bearing device for sputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710200846XA CN101328575B (en) | 2007-06-20 | 2007-06-20 | Bearing device for sputtering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101328575A CN101328575A (en) | 2008-12-24 |
| CN101328575B true CN101328575B (en) | 2011-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710200846XA Expired - Fee Related CN101328575B (en) | 2007-06-20 | 2007-06-20 | Bearing device for sputtering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101328575B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109912228A (en) * | 2017-12-12 | 2019-06-21 | 湘潭宏大真空技术股份有限公司 | Transmission device for large-area glass magnetron sputtering film production line |
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2007
- 2007-06-20 CN CN200710200846XA patent/CN101328575B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101328575A (en) | 2008-12-24 |
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Granted publication date: 20110824 Termination date: 20150620 |
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