JP5709540B2 - Manufacturing method of organic EL element - Google Patents

Description

  The present invention relates to a method for manufacturing a large-area organic EL element suitable for illumination.

  The organic light emitting device emits light from an organic light emitting layer sandwiched between a first electrode and a second electrode by applying a voltage between the first electrode and the second electrode. As an organic light emitting element, an organic EL (electroluminescence) element has already been used for a flat panel display represented by a liquid crystal display. Since a flat panel display has a large number of pixels, one pixel is fine. Similarly, a display using an organic EL element has fine pixels, and the organic EL element is patterned using a fine vapor deposition mask. In recent years, organic EL elements are being used for solid-state lighting.

Solid-state lighting is a product that requires higher brightness than a display. For example, the luminance required for the display is about 1,000 cd / m ² , whereas the solid-state lighting requires a luminance of about 3,000 to 5,000 cd / m ² . Therefore, it is necessary to flow a large current value per unit area to each electrode.
In a display using an organic EL element, the size of one light emitting element is less than 1 mm square. On the other hand, solid state illumination using organic EL elements requires a larger luminous flux than the display, and therefore one light emitting element is required to have a size of 100 mm square or more.

  In the organic EL element, a transparent conductive film is required for either the first electrode or the second electrode in order to extract light. Generally, the first electrode is a transparent conductive film. As a material for the transparent conductive film, indium tin oxide (ITO) or the like is used. ITO has the smallest volume resistivity among the materials of the transparent conductive film, but the volume resistivity of ITO is significantly higher than that of metal.

When an organic EL element having a transparent conductive film is formed in a single large area and a large current is passed, a phenomenon (brightness unevenness) occurs in which the periphery of the element becomes bright and the central part becomes dark. This is because the resistance value of the transparent conductive film is high and a voltage drop occurs due to a large current.
In order to reduce the voltage drop and improve the brightness uniformly, it is preferable to increase the film thickness of the transparent conductive film to about 100 to 500 nm to reduce the sheet resistance value. By doing so, luminance unevenness can be suppressed.

  However, the material of the transparent conductive film is expensive, and if the transparent conductive film is thick, there is a problem that the material cost increases. Therefore, a method of reducing the current flowing through each electrode by dividing the light emitting element into small light emitting elements inside a large element panel and connecting the divided elements in series has been studied (see Patent Documents 1 to 7). ). By doing so, since the voltage of the whole panel can be increased, the resistance of the transparent conductive film can be reduced and the voltage drop can be reduced. Therefore, even in a large light-emitting panel, the internal luminance distribution can be reduced. Patent Documents 1 to 7 disclose a method of forming a plurality of light emitting elements by patterning using photolithography and a method of forming a plurality of light emitting elements by forming separation grooves in each layer of the light emitting elements by laser processing. ing.

JP 2000-29404 A JP 2008-227326 A Special table 2010-510626 gazette JP 2010-21050 A Japanese Patent Laid-Open No. 5-3076 JP-A-8-222371 JP 2007-157659 A

  Patent Document 1 discloses an organic EL element in which a light emitting element is formed by photolithography. FIG. 4 is a schematic cross-sectional view showing the configuration of the organic EL element described in Patent Document 1. In FIG. 4, light emitting elements composed of a first electrode 2 / organic light emitting layer 3 / second electrode 4 are arranged side by side on a substrate 1, and each first electrode 2 of adjacent light emitting elements is electrically insulated by an insulating film 5. Have been separated. Adjacent light emitting elements form organic EL elements that are electrically connected in series by bringing the first electrode 2 of one light emitting element into contact with the second electrode 4 of the other light emitting element.

  In Patent Document 1, the first electrode is formed on the substrate by patterning using photolithography or the like. On the 1st electrode formed on the board | substrate, an organic light emitting layer is formed by vacuum evaporation using the vapor deposition mask which has an opening part. A second electrode is formed on the organic light emitting layer by vacuum deposition using a deposition mask having another opening.

  Since the end portion of the first electrode formed by the patterning process has a steep cross section, a step is generated between the first electrode and the substrate. When an organic light emitting layer is laminated on the step portion around the patterning, the organic light emitting layer overlapping the step portion is thinned, and defects are likely to occur. As a result, problems such as leakage current and short circuit are likely to occur.

  In order to prevent the above problem, an insulating film is formed by photolithography at the step portion around the patterning. In Patent Document 1, a photoresist is applied to the entire surface of the substrate on which the first electrode has been patterned, the photoresist is dried, an exposure mask is applied to the pattern to be processed, and ultraviolet rays are irradiated to prebake and etch. High-precision insulating film is patterned through cleaning, post-baking.

Photolithography is a high-precision processing technique generally used in semiconductors and flat panel displays, but requires large-scale and expensive manufacturing equipment. Furthermore, the cost for the consumable member of the photoresist, the etching solution and the cleaning solution and the large running cost are required for the waste solution treatment.
Further, vacuum deposition using a deposition mask can be directly patterned on a substrate. However, when the substrate becomes large, the accuracy of the high-definition deposition mask cannot be maintained, so that it is not suitable as a method for inexpensively manufacturing with a large substrate such as illumination.

In Patent Document 2, in order to perform electrode separation and series connection, a conductive protrusion-shaped connection terminal, an insulating film using photolithography, and a separation partition wall by reverse taper are formed. Although a method for performing connection is disclosed, since a formation process is complicated and a fine structure is necessary, patterning processing using photolithography must be performed.
Patent Documents 5 to 7 disclose organic EL elements in which a plurality of light emitting elements are connected in series by laser processing.

  In the organic EL device, the organic light emitting layer is usually an organic multilayer film in which a hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer are laminated. A hole transporting material is included on the first electrode side of the organic light emitting layer, and an electron transporting material having a property opposite to that of the hole transporting material is included on the second electrode side. The organic EL element is manufactured by vacuum consistent film formation of a first electrode / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / second electrode. In particular, the interface between the first electrode and the hole injection layer and the interface between the electron injection layer and the second electrode are very sensitive to the surface state and the environment, and the state of the interface greatly affects the device characteristics.

  When the organic light emitting layer / second electrode is irradiated with a laser in a vacuum or an inert gas environment, the organic light emitting layer / second electrode is removed by vaporization by thermal evaporation or ablation. At that time, evaporated or vaporized organic light emitting layer / second electrode fine particles are scattered and adhere to the side surface of the organic light emitting layer. Since the organic light emitting layer is very thin, if the fine particles of the second electrode adhere to the side surface of the organic light emitting layer, it causes a leak current or a short circuit with the first electrode.

  The present invention has been made in view of the above problems, and an organic EL element manufacturing method for manufacturing an organic EL element suitable for illumination that is unlikely to cause a leakage current or a short circuit by laser processing without using expensive photolithography. The purpose is to provide.

  In order to solve the above-described problems, the present invention includes a plurality of light-emitting elements each including a first electrode, an organic light-emitting layer, and a second electrode on a substrate. A method of manufacturing an organic EL element that is electrically connected in series by contacting one electrode and a second electrode of the other light emitting element, wherein the first electrode is divided and formed on a substrate ( A) and after the step (A), an insulating film is formed adjacent to at least the first electrode corresponding to the edge of the first electrode and the portion in contact with the second electrode of the adjacent light emitting element. And after the step (B), the organic light emitting layer laminated on the first electrode corresponding to the portion in contact with the second electrode of the adjacent light emitting element is removed by laser processing, Forming a first dividing groove for dividing the organic light emitting layer into a plurality of organic light emitting layers ( And after the step (C), the step (D) of filling the first dividing groove and covering the plurality of organic light emitting layers so as to cover the plurality of organic light emitting layers, and the step (D) The organic light emitting layer / second electrode laminated on the insulating film is removed by laser processing, and the organic light emitting layer / second electrode is divided into a plurality of organic light emitting layers / second electrodes, and the bottom surface is the insulating And a step (E) of forming a second divided groove to be a film.

  According to the above invention, the first divided groove serves as a groove for electrically connecting adjacent light emitting elements in series, and the second divided groove serves as a groove for electrically separating adjacent power generating elements. Since the bottom surface of the second dividing groove is an insulating film, the substance contained in the second electrode removed in the step (E) is attached to the very thin organic light emitting layer at the end surface of the laser processed portion or the laser processed portion. Even if it exists, generation | occurrence | production of the leakage current and short circuit by it can be prevented.

  1 aspect of the said invention WHEREIN: The said predetermined part of the board | substrate with which the said process (B) arrange | positions a single nozzle at intervals with respect to the said 1st electrode, and the said 1st electrode was formed from the said single nozzle It is preferable that the method includes intermittently discharging the insulating material toward the surface, and relatively moving the substrate or the single nozzle to form a continuous insulating film on the predetermined portion.

  According to one embodiment of the present invention, an insulating film can be formed without requiring expensive manufacturing equipment. Even if the element size is changed, the setup can be changed instantaneously.

In one embodiment of the present invention, the step (C) is preferably performed while the inside of the container is evacuated in a container having a vacuum or an inert gas environment.
By doing so, since the substance removed by the laser processing is discharged out of the container, contamination of the organic light emitting layer can be suppressed.

In one aspect of the invention, the step of (E), inside in the container as a vacuum or inert gas environment, intends row while exhausting the inside of the container.
By doing so, since the substance removed by laser processing is discharged out of the container, it is possible to suppress the removed fine particles of the second electrode from adhering to the thin organic light emitting layer cross section of the laser processed part. Thereby, it is possible to suppress the occurrence of leakage current and short circuit.

In one aspect of the invention, includes the second electrode is a conductive metal, in the step (E), the line intends at said laser processing by mixing oxygen gas into a vacuum or inert gas environment environment.
By laser processing in an environment containing oxygen, the metal fine particles of the second electrode scattered by the laser processing can be oxidized to form an insulator. Thereby, even if the scattered metal fine particles of the second electrode adhere to the side surface of the organic light emitting layer, it is possible to prevent the occurrence of leakage current and short circuit.

In one embodiment of the above invention, the laser beam passage path may be surrounded by a cylindrical member, a suction path may be connected to the laser beam outlet side of the cylindrical member, and laser processing may be performed while suctioning through the suction path. .
By sucking in the vicinity of the laser beam exit, that is, in the vicinity of the laser irradiation position, the organic light emitting layer removed by the laser processing and the fine particles of the second electrode are scattered and reconstituted near the processing portion. Can be reduced. As a result, it is possible to suppress the occurrence of leakage current and short circuit.

  According to the present invention, the second divided grooves are formed on the insulating film formed on the first electrode by laser processing, so that the fine particles derived from the second electrode are thin at the end surfaces of the laser processed portion and the laser processed portions. It can prevent adhering to the side surface of the organic light emitting layer. Accordingly, an organic EL element suitable for illumination that can prevent the occurrence of leakage current and short circuit without using expensive photolithography can be manufactured.

It is a schematic plan view of the organic EL element manufactured with the manufacturing method of the organic EL element which concerns on one Embodiment of this invention. It is sectional drawing explaining an example of the manufacturing method of the organic EL element which concerns on one Embodiment of this invention. It is a block diagram of the laser processing which concerns on one Embodiment of this invention. It is a schematic sectional drawing which shows the structure of the conventional organic EL element.

Below, one Embodiment of the manufacturing method of the organic EL element concerning this invention is described with reference to drawings.
In FIG. 1, the schematic plan view of the organic EL element manufactured with the manufacturing method which concerns on this embodiment is shown. The organic EL element manufactured by the method for manufacturing an organic EL element according to this embodiment includes a light emitting element in which a first electrode 2, an organic light emitting layer 3, and a second electrode 4 are sequentially stacked on a substrate 1. A plurality of light emitting elements are arranged side by side on the substrate 1, and the adjacent light emitting elements are electrically connected to each other when the first electrode 2 of one light emitting element and the second electrode 4 of the other light emitting element are in contact with each other. They are connected in series. An insulating film 5 is provided on the edge of the first electrode 2 of each light emitting element, and the adjacent first electrodes 2 are electrically separated from each other. The insulating film 5 is formed on the first electrode so that the first electrode 2 of one light-emitting element when the organic EL element is used is adjacent to a portion where the second electrode 4 of another light-emitting element located adjacent to the first electrode 2 contacts. Is also provided. The second electrode 4 a is an extraction electrode for extracting electricity from the first electrode 2. When the first electrode 2 of the light emitting element located on the outermost side of the plurality of light emitting elements arranged side by side is used as the extraction electrode, the second electrode 4a may be omitted.

The substrate 1 is a translucent substrate. For example, a glass substrate of 300 mm × 300 mm × thickness 0.7 mm is used.
The first electrode 2 is a transparent film having conductivity. For example, a metal oxide film such as indium tin oxide (ITO), tin oxide (SnO ₂ ), or zinc oxide (ZnO) can be used. The thickness of the first electrode 2 is about 100 nm to 500 nm.
The organic light emitting layer 3 is an organic multilayer film made of an organic light emitting material. For example, the structure of the organic multilayer film is a hole injection layer / a hole transport layer / a light emitting layer / an electron transport layer / an electron injection layer. The total thickness of the organic light emitting layer 3 is about 100 nm to 300 nm.

  The second electrode 4 is made of a conductive film. For example, the second electrode 4 is a metal film such as aluminum (Al) or silver (Ag). The thickness of the second electrode 4 is not less than 10 nm and not more than 500 nm. Further, the material of the second electrode 4 may be a mixture or lamination with an alkali metal such as lithium (Li) or magnesium (Mg), or other oxides.

  The insulating film 5 is an electrically insulating film. For example, a positive resist, a negative resist, or other curable resin can be used. The thickness of the insulating film 5 is sufficient if it has a withstand voltage against the applied voltage between the first electrode 2 and the second electrode 4, but the thickness of the first electrode 2 or more is desirable, and the range of 100 nm to 10 μm is desirable. good. The width of the insulating film 5 is required to be very narrow in the case of a display, but is not required to be narrow in organic EL lighting of 100 mm square size or more, and accuracy is not required. preferable.

Next, a method for manufacturing the organic EL element according to this embodiment will be described. FIG. 2 is a cross-sectional view for explaining an example of the method for manufacturing the organic EL element according to this embodiment.
(1) FIG. 2 (a)
The first electrode 2 is patterned on the substrate 1.

(2) FIG. 2 (b)
The surface of the substrate 1 on which the first electrode 2 is formed is cleaned. Thereafter, an insulating material is applied to a predetermined portion on the substrate 1 on which the first electrode 2 is formed and cured. The predetermined portion is an edge portion where the first electrodes formed by division face each other and the vicinity thereof. The predetermined portion is a position adjacent to the portion where the second electrode 4 of one light emitting element contacts the first electrode 2 of the other adjacent light emitting element on the inner side in the surface direction of the first electrode when an organic EL element is used. It is said.

  The insulating material is applied in a non-contact manner. As a method for applying the insulating film 5 in a non-contact manner, a dot discharge type dispenser is optimal. As the dot discharge type dispenser, for example, JET MASTER (registered trademark) 2 manufactured by Asymtec Corporation can be used. The insulating material is applied by using a single nozzle 6 for one light emitting element. The size of the discharge port of the nozzle 6 is appropriately set according to the type of insulating material to be used and the size of the target light emitting element.

When a dot discharge type dispenser is used, first, the tip of the single nozzle 6 is directed toward the substrate 1 on which the first electrode 2 is formed, and the single nozzle 6 is spaced so that the tip does not contact the first electrode 2. Place. For example, the single nozzle 6 may be arranged at an interval of 0.1 to 1.0 mm from the surface of the first electrode 2 with respect to the edge portion (patterning step portion) of the first electrode 2.
Next, the insulating material is intermittently discharged from the single nozzle 6 toward a predetermined portion on the substrate 1 on which the first electrode 2 is formed. Further, while discharging the insulating material, the substrate 1 or the single nozzle 6 is relatively moved to form a linear insulating film 5 continuous in a predetermined portion. The discharge amount of the insulating material and the moving speed of the substrate 1 or the single nozzle 6 are determined so that the insulating film 5 has a desired thickness and width in consideration of the wettability of the surface to be coated, the type and viscosity of the insulating material. Set as appropriate.

  For example, under the conditions where the discharge amount is 5 nL, the discharge particle diameter is about 0.2 mm, the discharge repetition rate is 200 dots / sec, and the moving speed is 100 mm / sec, the discharge particles are applied onto the substrate at intervals of 0.5 mm. After the applied insulating material has landed on the base material, it becomes the insulating film 5 having a thickness of 5 μm and a width of 2.0 mm. This width is sufficiently acceptable for an organic EL element for illumination of 100 mm square or more, but it is easy to change the width by changing the discharge amount and the interval.

  The method for curing the applied insulating material is appropriately selected according to the insulating material to be used. The insulating material is preferably an organic material, and when a positive resist is used as the insulating material, it can be cured only by heating (post-baking) after coating. Since the insulating material is applied only to a predetermined portion, the pre-baking, exposure, and development steps necessary for forming an insulating film by conventional photolithography are not required. Therefore, it is possible to reduce the amount of the insulating material used as compared with the photolithography technique conventionally used for forming the insulating film, and only use a conventional baking furnace and no new equipment is required.

(3) FIG.2 (c): Organic light emitting layer formation process The board | substrate 1 formed to the insulating film 5 above is carried in in a vacuum evaporation system. In the actual vacuum deposition chamber, the film-forming surface of the substrate faces downward, but is described upward for easy understanding of the explanation.
An organic vapor deposition mask 7 having an opening is disposed on the substrate 1, and an organic material is laminated and deposited to form the organic light emitting layer 3. For example, a hole injection layer / hole transport layer / light emission layer / electron transport layer / electron injection layer is deposited as a 120 nm thick layer as the organic light emitting layer 3 on the substrate 1 on which 120 nm of ITO is formed as the first electrode. Other vapor deposition conditions for the organic material are arbitrary.

(4) FIG. 2D: First Dividing Groove Formation Step After forming the second electrode 4, the organic light emitting layer 3 laminated on the first electrode 2 is irradiated with the laser beam 9, and the organic light emitting layer 3 A part of the first dividing groove 8 is formed by removing a part of the first dividing groove 8. The laser processing conditions are appropriately set according to the material and thickness of the organic light emitting layer 3. For example, a femtosecond laser is used as the laser and is processed under the conditions of a wavelength of 810 nm, a pulse width of 150 fs, a laser output of 100 mJ / cm ² , a repetition frequency of 200 kHz, and a laser beam diameter of 20 μm. The first dividing groove 8 is preferably formed so as to be adjacent to the insulating film 5 between the insulating film 5 provided on the first electrode 2 and the edge portion.

(5) FIG. 2 (e): Second electrode forming step After forming the first divided grooves 8, the substrate 1 is carried into another vacuum deposition apparatus. A second electrode deposition mask 10 having an opening is disposed on the substrate 1 (on the side where the organic light emitting layer 3 is formed), and a second electrode 4 is formed by laminating and depositing a conductive material. The second electrode vapor deposition mask 10 is disposed so that the opening overlaps the first electrode 2 and the organic light emitting layer 3 formed earlier. The second electrode 4 is formed so as to fill the first dividing groove 8. For example, 100 nm of aluminum is deposited as the upper second electrode 4. The other deposition conditions for the conductive material are arbitrary.

(6) FIG. 2 (f): Second division groove forming step After forming the second electrode 4, the second electrode is formed on the organic light emitting layer 3 / second electrode 4 c laminated on the first electrode 2 / insulating film 5. The laser beam 9 is irradiated from the 4 side, and a part of the organic light emitting layer 3 / second electrode 4 is removed by laser processing to form the second divided groove 11. The laser processing conditions are appropriately set according to the material and thickness of the organic light emitting layer 3 and the second electrode 4. For example, the laser is a femtosecond laser as described above, and is processed under the conditions of a wavelength of 1045 nm, a pulse width of 500 fs, a laser output of 200 mJ / cm ² , a repetition frequency of 200 kHz, and a laser beam diameter of 20 μm. After the second divided groove forming step, a sealing member is appropriately formed (not shown).

  In addition, in this embodiment, although the 2nd electrode 4 was formed into a film by vacuum evaporation, it is not limited to this, You may form into a film by sputtering method.

Next, a laser processing method will be described.
Laser processing for forming the first divided grooves 8 and the second divided grooves 11 may be performed in a vacuum or an inert gas environment. For example, laser processing may be performed in a container that can be in a vacuum or an inert gas environment. In this embodiment, laser processing is performed in a container that can be an inert gas environment. FIG. 3 shows a configuration diagram of laser processing according to the present embodiment.

The container 20 includes a gas introduction port 21, a laser beam introduction window 22, and a drive stage (not shown). The drive stage can hold the workpiece 23 and can move in the horizontal direction (arrow X and arrow Y directions).
The container 20 preferably includes a cylindrical member 24 surrounding the laser beam path inside the container of the laser beam introduction window 22. The cylindrical member 24 is connected to a suction path 25 communicating with the inside of the cylindrical member 24 near the exit side of the laser beam 9. The other end of the suction path 25 is disposed outside the container 20.

  The workpiece 23 to be laser processed is carried into the container 20 and placed on the drive stage with the processing surface facing the laser beam introduction window 22 and held. Thereafter, a high-purity inert gas having a low moisture concentration is introduced into the container 20 from the gas inlet 21 to fill the container 20 with the inert gas. Nitrogen gas or argon gas is suitable as the inert gas. The purity of the inert gas is desirably 99.99% or more, and the moisture concentration of the inert gas is desirably 1 ppm or less.

  Next, suction is performed via the suction path 25, and the gas in the vicinity of the exit of the laser beam of the cylindrical member 24 is discharged out of the container 20. When sucking, a high-purity inert gas is introduced from the gas inlet 21 to keep the pressure in the container 20 constant. The workpiece 23 is irradiated with the laser beam 9 through the laser beam introduction window 22. The driving stage is appropriately moved horizontally to form a division groove in a predetermined portion.

When the organic light emitting layer 3 or the second electrode 4 is irradiated with a laser, substances contained in the organic light emitting layer 3 are vaporized by evaporation due to heat and decomposition due to ablation, and diffused and disappeared.
According to the present embodiment, by introducing an inert gas into the container 20 while exhausting the inside of the container 20, the substance removed by the laser processing is discharged out of the container while maintaining the inside of the container 20 at a constant pressure. Therefore, contamination of the organic light emitting layer 3 with the removed substance can be suppressed. As a result, the light emission characteristics can be stabilized.

Further, in the laser processing in the step of forming the second separation groove 11, oxygen may be mixed with an inert gas and introduced into the container 20. The oxygen concentration is preferably 0.1% by volume or more and 20% by volume or less (oxygen partial pressure in the atmosphere or less).
The material removed by laser processing may include those that are not complete gases. For this reason, the vaporized substance, not a complete gas, may be scattered near the processing part irradiated with the laser and reattached. This is generally called debris and causes contamination of the processing peripheral portion. When oxygen is mixed with an inert gas and introduced into the container, the metal fine particles derived from the second electrode contained in the substance that is not a complete gas are oxidized to form an insulator. Thereby, even when the material scattered by the laser processing is reattached to the laser processing end face or the processed portion, it is possible to prevent the occurrence of leakage current. The method of mixing oxygen is particularly effective when aluminum is used as the second electrode.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 1st electrode 3 Organic light emitting layer 4 2nd electrode 4a 2nd electrode (electrode for extraction)
5 Insulating Film 6 Nozzle 7 Organic Deposition Mask 8 First Divided Groove 9 Laser Beam 10 Second Electrode Deposition Mask 11 Second Divided Groove 20 Container 21 Gas Inlet 22 Laser Beam Introducing Window 23 Workpiece Object 24 Cylindrical Member 25 Suction route

Claims (4)

A plurality of light-emitting elements each including a first electrode, an organic light-emitting layer, and a second electrode are provided on a substrate, the second electrode includes a conductive metal, and the adjacent light-emitting elements are the first of the light-emitting elements. A method of manufacturing an organic EL element electrically connected in series by contacting an electrode and a second electrode of the other light emitting element,
A step (A) of dividing and forming a first electrode on a substrate;
After the step (A), a step of forming an insulating film so as to be adjacent to at least the edge of the first electrode and the first electrode corresponding to the portion in contact with the second electrode of the adjacent light emitting element (B )When,
After the step (B), the organic light emitting layer stacked on the first electrode corresponding to the portion in contact with the second electrode of the adjacent light emitting element is removed by laser processing, and the organic light emitting layer is removed from the plurality of organic light emitting layers. Forming a first dividing groove to be divided into the light emitting layer (C);
After the step (C), a step (D) of forming a second electrode so as to fill the first dividing groove and cover the plurality of organic light emitting layers;
After the step (D), the organic light emitting layer / second electrode laminated on the insulating film while exhausting the inside of the container in a container having a vacuum or an inert gas environment , the insulating film And removing the organic light emitting layer / second electrode into a plurality of organic light emitting layers / second electrodes, and forming a second divided groove having a bottom surface serving as the insulating film; ,
Equipped with a,
A method for manufacturing an organic EL element, wherein the laser processing in the step (E) is performed in an environment in which oxygen gas is introduced into the container in the step (E) and oxygen gas is mixed in a vacuum or an inert gas environment . The step (B)
A step of intermittently ejecting insulation material towards a single nozzle to said at intervals are arranged with respect to the first electrode, at a constant portion of the substrate where the first electrode is formed from the single nozzle ,
Relatively moving the substrate or the single nozzle to form a continuous insulating film on the predetermined portion;
The manufacturing method of the organic EL element of Claim 1 containing this. The step of (C), inside in the container as a vacuum or inert gas environment, a method of manufacturing an organic EL element according to claim 1 or claim 2 carried out while evacuating the vessel. It surrounds the passage path of the laser beam at the tubular member, and connected to a suction path of the laser beam exit side of the cylindrical member, one of the claims 1 to 3 perform laser processing while sucking through the suction passage The manufacturing method of the organic EL element of crab.

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