JP2015049962A - Method for manufacturing top-emission type organic electroluminescent display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic EL display device capable of improving productivity by efficiently removing an organic layer on an auxiliary electrode by a pulse laser.SOLUTION: A method for manufacturing a top-emission type organic EL display device 10 including a substrate 2, a pixel electrode 3, an auxiliary electrode 4, a spacer part 5, an organic EL layer 6, a contact part 9 which is an opening of the organic layer formed on the auxiliary electrode, and a transparent electrode layer 7 comprises the steps of: preparing an organic EL layer side substrate in which at least one organic layer 6 is formed on the whole surface of the auxiliary electrode (organic EL layer side substrate preparing step); sealing a space V between the organic EL layer side substrate and a lid part 8 under a first pressure (pressure reducing and sealing step); bringing the organic EL layer side substrate and the lid part into close contact by adjusting the spaces in the outer peripheries of the organic EL layer side substrate and the lid part to a second pressure (close contacting step); and forming a contact part by removing the organic layer on the auxiliary electrode by irradiating it with a laser beam P once via the lid part (contact part forming step).

Description

  The present invention relates to a method for manufacturing a top-emission organic electroluminescence display device with high productivity.

  The organic electroluminescence element has high visibility due to self-coloring, is an all-solid-state display unlike a liquid crystal display device, has excellent impact resistance, has a fast response speed, is less affected by temperature changes, and Advantages such as a wide viewing angle are attracting attention. Hereinafter, organic electroluminescence may be abbreviated as organic EL.

  The configuration of the organic EL element is based on a laminated structure in which an organic EL layer is sandwiched between an anode and a cathode. There are passive matrix driving and active matrix driving as a driving method of an organic EL display device having such an organic EL element. However, when manufacturing a large display, it is active from the viewpoint that driving with a low voltage is possible. Matrix driving is advantageous. Note that active matrix driving refers to a system in which a circuit such as a TFT is formed on a substrate on which an organic EL element is formed and the circuit is driven by the circuit such as the TFT.

  Such organic EL display devices include a bottom emission type in which light is extracted from the substrate side on which the organic EL element is formed, and a top emission type in which light is extracted from the side opposite to the substrate on which the organic EL element is formed. . Here, in the case of an organic EL display device driven by an active matrix, in the bottom emission type, the aperture ratio is limited by a circuit such as a TFT formed on a substrate which is a light extraction surface, and the light extraction efficiency is reduced. There's a problem. On the other hand, in the top emission type, since light is extracted from the surface opposite to the substrate, light extraction efficiency superior to that of the bottom emission type is obtained. In the case of the top emission type, a transparent electrode layer is used as the electrode layer on the side that becomes the light extraction surface.

  Here, a general transparent electrode layer has a larger resistance than an electrode layer made of a metal such as Al or Cu. Therefore, in an organic EL display device having a transparent electrode layer, a voltage drop occurs due to the resistance of the transparent electrode layer, and as a result, the occurrence of so-called luminance unevenness in which the luminance uniformity of the organic EL layer is lowered is a problem. . In addition, since the resistance increases as the area of the transparent electrode layer increases, the above-described problem of luminance unevenness becomes prominent when a large display is manufactured.

  In order to solve the above problem, a method is known in which a voltage drop is suppressed by forming an auxiliary electrode having a low resistance value and electrically connecting the auxiliary electrode to a transparent electrode layer. Here, the auxiliary electrode is usually formed in a pattern by performing a wet process etching after forming a metal layer. Therefore, in the top emission type organic EL display device, when the auxiliary electrode is formed after forming the organic EL layer, the organic EL layer and the transparent electrode layer are affected by the etching solution used when forming the auxiliary electrode. There was a problem. Therefore, as described in Patent Documents 1 to 4, a method of forming an auxiliary electrode on a substrate on which a circuit such as a TFT is formed is known.

  However, if the auxiliary electrode is formed before the organic EL layer is formed, the organic EL layer is formed on the entire surface when the organic EL layer is formed on the entire surface or when at least one organic layer constituting the organic EL layer is formed on the entire surface. An organic EL layer and at least one organic layer are formed. Therefore, there has been a problem that the electrical connection between the auxiliary electrode and the transparent electrode layer is hindered by the organic EL layer or the organic layer on the auxiliary electrode.

Patent No. 4959119 Special Table 2007-103098 Special table 2010-538440 gazette Japanese Patent No. 4340982

  In Patent Document 1, as shown in FIG. 10A, the pixel electrode 30 and the auxiliary electrode 40 are formed on the substrate 20, and the partition wall 50 is formed between the pixel electrode 30 and the auxiliary electrode 40. As shown in FIG. 10B, the organic EL layer 60 is formed. Next, as shown in FIG. 10C, the organic EL layer 60 on the auxiliary electrode 40 is removed by the laser light L, and then a transparent electrode layer 70 is formed as shown in FIG. A method of manufacturing the organic EL display device 100 in which the auxiliary electrode 40 and the transparent electrode layer 70 are electrically connected is described. However, in this case, there is a problem that the organic EL layer removed by the laser light is scattered, the pixel region in the organic EL display device is contaminated, and the display characteristics are deteriorated. Patent Document 2 also describes a method of removing the organic EL layer on the auxiliary electrode with a laser beam or an electron beam. However, similarly to Patent Document 1, the removed organic EL layer is scattered and the pixel region is removed. There is a problem that the display characteristics of the organic EL display device are deteriorated due to contamination.

  Further, as a method for solving the above problem, for example, as described in Patent Document 3, before the organic EL layer is removed by laser light, the entire surface of the auxiliary electrode covered with the organic EL layer is translucent. There has been proposed a method in which a first electrode having a first electrode is formed, an organic EL layer is removed by laser light through the first electrode, and a second electrode is finally formed. However, in this case, although the above-described deterioration in display characteristics can be suppressed, the first electrode and the second electrode are formed as the transparent electrode layer, so that there is a problem that the manufacturing process increases.

  Furthermore, for example, Patent Document 4 discloses the following method for manufacturing an organic EL display device. That is, as shown in FIG. 11A, the pixel electrode 30 and the auxiliary electrode 40 are formed on the substrate 20, and the partition wall 50 is formed between the pixel electrode 30 and the auxiliary electrode 40. As shown in b), the organic EL layer 60 is formed and the organic EL layer side substrate 80 is formed. Next, as shown in FIG. 11 (c), the cover 90 made of glass or resin film is opposed to the organic EL layer side substrate 80 so that the cover 90 contacts the top of the partition wall 50. The space V between the organic EL layer side substrate 80 and the lid 90 is sealed under reduced pressure. Thereafter, the lid 90 is brought into close contact with the organic EL layer side substrate 80 by pressurizing the outer peripheral space of the organic EL layer side substrate 80 and the lid portion 90. Next, the organic EL layer 60 on the auxiliary electrode 40 is removed by the laser light L, and the lid 90 is peeled off as shown in FIG. Finally, as shown in FIG. 11E, an organic EL display device in which the auxiliary electrode 40 and the transparent electrode layer 70 are electrically connected by forming the transparent electrode layer 70 on the organic EL layer side substrate. A method of making 100 is described. However, since the wavelength of the laser beam used in the above method is in the infrared region, there is a concern that the energy utilization efficiency is poor and the auxiliary electrode is damaged due to thermal influence. Furthermore, since a semiconductor continuous wave (CW) laser is used, when irradiating the laser to the substrate, either the laser irradiation unit or the organic EL layer side substrate must be stopped once, resulting in productivity. There is a problem that is bad.

  The present invention has been made in view of the above circumstances, and provides a method for manufacturing a top emission type organic EL display device in which productivity is improved by using a pulse laser for removing an organic layer on an auxiliary electrode. The main purpose.

  In order to achieve the above object, the present invention provides a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and a spacer portion formed on the substrate. And an organic EL layer which is formed on the pixel electrode and is composed of a plurality of organic layers and has at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and the auxiliary electrode A contact portion which is an opening portion of the organic layer formed on the surface, a transparent electrode layer formed on the organic EL layer and the contact portion, and the spacer portion includes the contact portion and the contact portion. A top emission type that produces a top emission type organic EL display device that is formed between the pixel electrodes adjacent to each other and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. Organic A method for manufacturing an L display device, comprising the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. The organic EL layer side substrate preparing step for preparing the organic EL layer side substrate and the organic EL layer side substrate obtained in the organic EL layer side substrate preparing step are opposed to the organic EL layer side substrate under a first pressure, A vacuum sealing step of placing the lid portion in contact with the top of the spacer portion via the organic layer, and sealing the space between the organic EL layer side substrate and the lid portion; and the vacuum sealing step An adhesion step in which the space around the organic EL layer side substrate and the lid portion sealed in step 2 is adjusted to a second pressure to bring the organic EL layer side substrate and the lid portion into close contact with each other; and a laser is provided through the lid portion. Irradiate light on the auxiliary electrode A contact part forming step of forming the contact part by removing the formed organic layer, and the laser irradiation part for irradiating the laser beam and the organic EL layer side substrate move relatively. And the number of times of irradiation of the laser light forming the contact portion is one per contact portion, and the pulse width of the laser light is such that the organic layer on the auxiliary electrode can be removed by one irradiation. A method of manufacturing a top emission type organic EL display device, characterized in that the wavelength of the laser beam is a wavelength in the ultraviolet region.

  According to the present invention, by setting the pulse width of the laser light used for removing the organic layer on the auxiliary electrode to a range in which the target organic layer can be removed by one laser irradiation, It becomes possible to shorten the laser irradiation time. Therefore, it is possible to remove the organic layer at high speed and with high accuracy by laser irradiation while relatively moving the organic EL layer side substrate and the laser irradiation unit, and the top emission type organic EL display device with high productivity can be obtained. Provision is possible.

  In this invention, there exists an effect that the productivity of a top emission type organic electroluminescent display apparatus can be improved.

It is process drawing which shows an example of the manufacturing method of the top emission type organic electroluminescence display of this invention. It is a schematic diagram explaining the spacer part in this invention. It is the schematic which shows an example of the spacer part formation process and insulating layer formation process in this invention. It is the schematic which shows an example of the formation aspect of the spacer part in this invention. It is the schematic which shows the other example of the formation aspect of the spacer part in this invention. It is the schematic which shows the other example of the formation aspect of the spacer part in this invention. It is a schematic diagram explaining the spacer part in this invention. It is a schematic diagram explaining the contact part in this invention. It is the schematic which shows an example of the manufacturing apparatus of the organic electroluminescence display in this invention. It is process drawing which shows an example of the manufacturing method of the conventional top emission type organic electroluminescence display. It is process drawing which shows the other example of the manufacturing method of the conventional top emission type organic electroluminescence display.

  Hereinafter, the manufacturing method of the top emission type organic EL display device and the top emission type organic EL display device of the present invention will be described in detail. Hereinafter, the top emission type organic EL display device may be abbreviated as an organic EL display device.

A. Manufacturing method of organic EL display device The manufacturing method of the organic EL display device of the present invention includes a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and the substrate. The spacer portion formed above, the organic EL layer formed on the pixel electrode and composed of a plurality of organic layers, having at least a light emitting layer, and at least one layer of the above-described auxiliary electrode An organic layer, a contact portion that is an opening of the organic layer formed on the auxiliary electrode, a transparent electrode layer formed on the organic EL layer and the contact portion, and the spacer portion includes: An organic EL display device is formed between the contact portion and the pixel electrode adjacent to the contact portion, and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. Organic EL display A method of manufacturing an organic material comprising the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic EL layer side substrate preparation step for preparing an EL layer side substrate, and a first pressure, the lid portion is opposed to the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step, and the spacer portion The lid portion is arranged so as to be in contact with the top of the organic layer through the organic layer, and is sealed in the vacuum sealing step for sealing the space between the organic EL layer side substrate and the lid portion, and in the vacuum sealing step. In addition, the space around the organic EL layer side substrate and the lid portion is adjusted to a second pressure to bring the organic EL layer side substrate and the lid portion into close contact with each other, and laser light is irradiated through the lid portion. Formed on the auxiliary electrode A contact part forming step of forming the contact part by removing the organic layer, the laser irradiation part for irradiating the laser beam and the organic EL layer side substrate relatively moving, The number of times of irradiation of the laser beam for forming the contact portion is one per contact portion, and the pulse width of the laser beam is a pulse width that allows the organic layer on the auxiliary electrode to be removed by one irradiation. The wavelength of the laser light is a wavelength in the ultraviolet region.

  Here, the “first pressure” and the “second pressure” are not particularly limited as long as the first pressure is lower than the second pressure. Further, the pressure of the space between the organic EL layer side substrate and the lid when the lid is arranged on the surface of the organic EL layer side substrate is adjusted to a first pressure, and further the organic EL layer side substrate and the above The difference between the pressure between the organic EL layer side substrate and the lid and the pressure at the outer periphery of the organic EL layer side substrate and the lid when the pressure in the outer space of the lid is adjusted to the second pressure The pressure is not particularly limited as long as the organic EL layer side substrate and the lid can be brought into close contact with each other. Normally, the “first pressure” is lower than the normal pressure, and the “second pressure” is higher than the “first pressure”. Further, the specific “first pressure” and “second pressure” will be described in “2. Depressurization sealing step” and “3. Adhesion step”, which will be described later.

  1A to 1F are process diagrams showing an example of a method for manufacturing an organic EL display device of the present invention. First, as illustrated in FIG. 1A, a pixel electrode and auxiliary electrode forming step for forming the pixel electrode 3 on the substrate 2 and the auxiliary electrode 4 between the pixel electrodes 3 is performed. Next, as illustrated in FIG. 1B, a spacer part forming step for forming the spacer part 5 on the substrate 2 is performed. Thereafter, as illustrated in FIG. 1C, an organic EL layer forming step is performed in which an organic EL layer 6 including a plurality of organic layers and having at least a light emitting layer is formed on the entire surface. In this way, an organic EL layer side substrate preparation step for preparing the organic EL layer side substrate 1 is performed. Next, as illustrated in FIG. 1D, the lid portion 8 is opposed to the organic EL layer side substrate under the first pressure, and the lid portion 8 is placed on the top of the spacer portion 5 via the organic layer. It arrange | positions so that it may contact, and the pressure reduction sealing process which seals the space V between the said organic electroluminescent layer side board | substrate and the said cover part 8 is performed. Then, the adhesion process which adjusts the space of the perimeter of the above-mentioned organic EL layer side substrate sealed by the decompression sealing process and the above-mentioned lid part 8 to the 2nd pressure, and makes the above-mentioned organic EL layer side board and the above-mentioned lid part 8 contact closely is performed. . Next, the organic EL layer 6 formed on the auxiliary electrode 4 is irradiated once with the pulse laser P from the lid 8 side, and the organic EL layer 6 on the auxiliary electrode 4 is removed. As illustrated in (e), a contact part forming step of exposing the auxiliary electrode 4 to form the contact part 9 is performed. Finally, as illustrated in FIG. 1 (f), a transparent electrode layer forming step of forming the transparent electrode layer 7 on the organic EL layer side substrate so as to be electrically connected to the auxiliary electrode 4 at the contact portion 9. I do. Thereby, the organic EL display device 10 according to the present invention is obtained.

As described above, in the present invention, in the contact portion forming step, by using a pulse laser to remove the organic layer on the auxiliary electrode, the auxiliary electrode is not damaged, and the target organic layer is irradiated with a single laser beam irradiation. Can be removed. Therefore, in the present invention, the organic layer on the auxiliary electrode can be removed in a short time, and a method for manufacturing an organic EL display device with high productivity can be provided.
Further, in the present invention, by providing the spacer, the pixel electrode is formed of the organic layer dust or the like even when the organic layer dust or the like removed by the pulse laser is scattered in the contact portion forming step. It is possible to provide a method for manufacturing an organic EL display device that can prevent scattering to the pixel region and suppress deterioration in display characteristics.

  In the present invention, “at least one organic layer is formed on the entire surface of the auxiliary electrode” means all layers constituting the organic EL layer 6 as exemplified in FIG. 1C, for example. Indicates a mode in which the pixel electrode 3 is formed on the entire surface so as to cover the pixel region p in which the pixel electrode 3 is formed and the auxiliary electrode 4. In addition, in the case where the organic EL layer is composed of four layers of a hole injection layer, a hole transport layer, a light emitting layer, and an electron injection layer, three of the four layers are pixels. A pattern is formed in the region, and the remaining one layer is formed on the entire surface so as to cover the pixel region and the auxiliary electrode, or two of the four layers are formed in a pattern in the pixel region. A mode in which the remaining two layers are formed on the entire surface so as to cover the pixel region and the auxiliary electrode, and further, one of the four layers is formed in a pattern in the pixel region, and the remaining three layers are It includes a mode in which the entire surface is formed so as to cover the pixel region and the auxiliary electrode.

  Further, in the present invention, the “top portion of the spacer portion” refers to the upper bottom surface H of the spacer portion 5 when the spacer portion 5 is trapezoidal as illustrated in FIG. In addition, when the spacer part has a shape other than the trapezoid, it indicates the uppermost part of the spacer part, and when the organic EL layer side substrate and the lid part are brought into contact and sealed, the lid part is first in the spacer part. Refers to the contact part.

  Hereinafter, each process in the manufacturing method of the organic EL display device of the present invention will be described.

1. Organic EL layer side substrate preparation step In the present invention, first, a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and the substrate were formed. A spacer part, an organic EL layer formed on the pixel electrode and composed of a plurality of organic layers, having at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and A contact portion that is an opening portion of the organic layer formed on the auxiliary electrode; and a transparent electrode layer formed on the organic EL layer and the contact portion. The spacer portion includes the contact portion and the contact portion. The organic EL display device is formed between the pixel electrodes adjacent to the contact portion, and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. The substrate and the pixel electrode Preparation of organic EL layer side substrate for preparing an organic EL layer side substrate having the auxiliary electrode, the spacer portion, and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode Perform the process.
Hereinafter, the formation process of each member formed in this process will be described.

(1) Pixel electrode and auxiliary electrode formation process This process is a process of forming a pixel electrode and an auxiliary electrode on a substrate.
Hereinafter, each member used in this step, and specific pixel electrode and auxiliary electrode forming steps will be described.

(A) Substrate The substrate in this step supports a pixel electrode, an auxiliary electrode, a spacer portion, an organic EL layer, and a transparent electrode layer, which will be described later.

  Since the organic EL display device manufactured in the present invention is a top emission type, the substrate may or may not have light transmittance.

  The substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device. Examples of such a substrate material include glass and resin. A gas barrier layer may be formed on the surface of the substrate.

  The thickness of the substrate is appropriately selected depending on the material of the substrate and the use of the organic EL display device, and is specifically about 0.005 mm to 5 mm.

(B) Pixel electrode The pixel electrode in this step is formed in a pattern on the substrate.
The pixel electrode may or may not have optical transparency, but the organic EL display device manufactured according to the present invention is a top emission type and takes out light from the transparent electrode layer side. Usually, it does not have optical transparency.

The pixel electrode may be either an anode or a cathode.
When the pixel electrode is an anode, it is preferable that the resistance is small, and generally a metal material that is a conductive material is used, but an organic compound or an inorganic compound may be used.
For the anode, a conductive material having a large work function is preferably used so that holes can be easily injected. Examples thereof include metals such as Au, Cr, and Mo; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. It is done. These conductive materials may be used alone or in combination of two or more. When two or more types are used, layers made of each material may be stacked.

When the pixel electrode is a cathode, a metal material that is a conductive material is generally used, but an organic compound or an inorganic compound may be used.
For the cathode, it is preferable to use a conductive material having a low work function so that electrons can be easily injected. Examples thereof include magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, and alloys of alkali metals and alkaline earth metals such as Li, Cs, Ba, Sr, and Ca.

  The thickness of the pixel electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the pixel electrode, and can be set to, for example, about 10 nm to 1000 nm, and preferably about 20 nm to 500 nm. Note that the thickness of the pixel electrode may be the same as or different from the thickness of the auxiliary electrode described later. Note that when the pixel electrode is formed together with an auxiliary electrode described later, the pixel electrode and the auxiliary electrode have the same thickness.

(C) Auxiliary electrode The auxiliary electrode in this process is formed in a pattern on a substrate.
The auxiliary electrode may or may not have optical transparency.

A metal material that is a conductive material is generally used for the auxiliary electrode. Note that the material used for the auxiliary electrode can be the same as the material used for the pixel electrode, and thus the description thereof is omitted here.
The material used for the auxiliary electrode may be the same as or different from the material used for the pixel electrode. Among these, the pixel electrode and the auxiliary electrode are preferably made of the same material. This is because the pixel electrode and the auxiliary electrode can be formed collectively, and the manufacturing process can be simplified.

  The thickness of the auxiliary electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the auxiliary electrode, and is preferably in the range of 10 nm to 1000 nm, for example, in particular in the range of 20 nm to 500 nm. Is preferred. Note that when the auxiliary electrode is formed together with the above-described pixel electrode, the pixel electrode and the auxiliary electrode have the same thickness.

  The shape when such an auxiliary electrode is observed in the thickness direction of the auxiliary electrode, that is, a planar shape, is a shape that can exhibit the function of the auxiliary electrode to suppress a voltage drop due to the resistance of the transparent electrode layer. The shape is not particularly limited, but is preferably a shape that does not reduce the light extraction efficiency of the organic EL display device. For example, a stripe shape or a lattice shape can be used.

(D) Pixel Electrode and Auxiliary Electrode The distance between the adjacent pixel electrode and auxiliary electrode is not particularly limited as long as a spacer portion described later can be formed. Specifically, it is preferably in the range of 1 μm to 50 μm, and more preferably in the range of 2 μm to 30 μm. Note that the interval between adjacent pixel electrodes and auxiliary electrodes refers to the distance d shown in FIG.

(E) Pixel Electrode and Auxiliary Electrode Forming Step The pixel electrode and auxiliary electrode forming step in the present invention includes a step of first forming a pixel electrode on a substrate. The method for forming the pixel electrode is not particularly limited as long as the pixel electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. For example, the vapor deposition method using a mask, the photolithographic method, etc. are mentioned. Examples of the vapor deposition method include a sputtering method and a vacuum vapor deposition method.

  Next, this step includes a step of forming an auxiliary electrode between the pixel electrodes. The method for forming the auxiliary electrode is not particularly limited as long as the auxiliary electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. A specific method for forming the auxiliary electrode can be the same as the method for forming the pixel electrode, and thus description thereof is omitted here. In this step, it is preferable to form the auxiliary electrode together with the pixel electrode. This is because the manufacturing process can be simplified.

(2) Spacer part formation process This process is a process of forming a spacer part on the substrate.
Hereinafter, the spacer part formed in this process and the concrete spacer part formation process are demonstrated.

(A) Spacer portion The spacer portion formed in this step is formed between a contact portion described later and a pixel electrode adjacent to the contact portion, and is removed by a laser beam in the contact portion forming step described later. In addition, the organic layer has a function of a spacer portion for preventing the organic layer from scattering. In addition, when the spacer portion is in contact with the pixel electrode, the spacer portion functions as an insulating layer.

  When the spacer portion has a function as an insulating layer, an insulating layer forming step performed in a conventional organic EL display device can be performed together with this step to form the spacer portion and the insulating layer in a lump. it can. Thereby, the improvement of manufacturing efficiency can be aimed at. FIGS. 3A to 3B are schematic process diagrams showing an example in which an insulating layer forming process is performed simultaneously with the present process to form a spacer portion and an insulating layer in a lump. FIG. It is AA sectional view taken on the line of 3 (b). First, as illustrated in FIG. 3A, the pixel electrode 3 and the auxiliary electrode 4 are formed in a frame shape on the substrate 2. Next, as illustrated in FIGS. 3B and 3C, the spacer portion 5 and the insulating layer 13 are collectively arranged so that the pixel electrode 3 and the auxiliary electrode 4 forming the contact portion 9 are exposed. Form. In this way, when the spacer portion and the insulating layer are collectively formed, the spacer portion and the insulating layer are made of the same material, and as illustrated in FIG. 3B, the spacer portion 5 and the insulating layer 13 may be formed continuously.

In this step, the number of spacer portions formed between a contact portion described later and the pixel electrode adjacent to the contact portion is determined by separating the pixel region where the pixel electrode is formed from the contact portion. If the function of a part can fully be exhibited, it will not specifically limit, One may be sufficient and two or more may be sufficient.
Here, the number of spacer portions formed between the pixel electrode and a contact portion to be described later is that a stripe-shaped spacer portion is formed in the longitudinal direction between the adjacent pixel electrode and the contact portion. Sometimes refers to the number of stripes formed between the pixel electrode and the contact portion. Therefore, for example, the number of the spacer portions 5 illustrated in FIGS. 4A and 4B is one. FIG. 4 is a schematic view showing an example of the spacer portion formed in this step. FIG. 4A is a schematic plan view when the spacer portion is formed between the pixel electrode and the auxiliary electrode, and FIG. 4B is a cross-sectional view taken along the line BB in FIG. is there. Since the reference numerals not described in FIG. 4 are the same as those in FIG. 1, the description thereof is omitted here.

  The planar shape of the spacer portion formed in this step is not particularly limited as long as it is formed so as to separate the pixel electrode from a contact portion described later. For example, as shown in FIG. As illustrated, the spacer portion 5 may be formed in a stripe shape between the pixel electrode 3 and the contact portion 9 in the auxiliary electrode 4, and as illustrated in FIG. 5A, the contact in the auxiliary electrode 4. The spacer portion 5 may be formed in a frame shape so as to surround the portion 9, or, as illustrated in FIG. 6A, the spacer so as to surround the pixel electrode 3 adjacent to the contact portion 9 in the auxiliary electrode 4. The part 5 may be formed in a frame shape. 5 and 6 are schematic views showing other examples of the spacer portion formed in this step. FIG. 5A and FIG. 6A are schematic plan views when a spacer portion is formed between the pixel region where the pixel electrode is formed and the contact portion of the auxiliary electrode, and FIG. ) Is a cross-sectional view taken along the line CC in FIG. 5A, and FIG. 6B is a cross-sectional view taken along the line DD in FIG. 6A. Since the reference numerals not described in FIGS. 5 and 6 are the same as those in FIG. 1, the description thereof is omitted here.

  In addition, the vertical cross-sectional shape of the spacer portion formed in this step is not particularly limited as long as the function of the spacer portion described above can be exhibited. For example, a forward taper shape, a reverse taper shape, a rectangle and the like can be mentioned, and among them, a forward taper shape is preferable. As illustrated in FIG. 5A and FIG. 6A, a transparent electrode layer described later is uniformly formed on the entire surface even when the spacer portion is formed so as to surround the pixel electrode or the auxiliary electrode. This is because sufficient conduction can be obtained.

The height of the spacer portion formed in this step is such that when the organic EL layer side substrate and the lid portion are opposed to each other in the vacuum sealing step described later, the top portion of the spacer portion and the lid portion are interposed via the organic layer. Although it will not specifically limit if it can arrange | position so that it may contact, Specifically, it is preferable to exist in the range of 0.1 micrometer-10 micrometers, and it is in the range of 0.5 micrometer-5 micrometers among these. It is preferable that it is in the range of 1 micrometer-3 micrometers especially. Since the space between the organic EL layer side substrate and the lid portion formed when the organic EL layer side substrate and the lid portion are opposed to each other can be increased, a slight gas has entered the space. However, it is because it can suppress that the vacuum degree of the said space falls rapidly.
The specific height of the spacer portion is preferably in the range of 0.1 μm to 10 μm, more preferably in the range of 0.5 μm to 5 μm, and particularly in the range of 1 μm to 3 μm. Is preferred. When the height of the spacer portion is within the above range, as described above, it is possible to suppress a rapid decrease in the degree of vacuum in the space between the organic EL layer side substrate and the lid portion. Further, when the lid is opposed to the organic EL layer side substrate and sealed in the vacuum sealing process described later, the lid is bent and comes into contact with the organic EL layer formed on the pixel electrode, thereby displaying the display of the organic EL display device. The problem of adversely affecting the characteristics can be prevented.
The height of the spacer portion refers to a height h from the bottom surface of the spacer portion 5 to the top portion H as shown in FIG.

  The material used for such a spacer portion is not particularly limited as long as it does not adversely affect the characteristics of the organic EL display device obtained by the present invention. For example, the spacer portion is a pixel electrode. In the case of contact, an insulating material is preferably used as the material of the spacer portion. Problems due to leakage current from the edge portion of the pixel electrode can be prevented. Specific examples of the material include photo-curable resins such as photosensitive polyimide resins and acrylic resins, thermosetting resins, and inorganic materials.

  Furthermore, the spacer part formed in this process may be comprised from the base part and the contact | adherence part formed on the base part. Specifically, as illustrated in FIG. 7, the base part 11 formed on the substrate 2 and the contact part 12 formed on the base part 11 may be included.

  Since the spacer portion is composed of the pedestal portion and the close contact portion, the height of the spacer portion can be easily adjusted. For example, when a certain wiring layer is formed on the substrate and an insulating layer is formed on the wiring layer, the height of the insulating layer is increased by an amount corresponding to the thickness of the wiring layer. In such a case, the insulating layer is used as a pedestal portion, and a close contact portion is formed on the insulating layer as the pedestal portion, and this is used as a spacer portion, thereby increasing the height of the insulating layer formed on the wiring layer. In addition, it is possible to easily increase the height of the spacer portion constituted by the insulating layer as the pedestal portion and the close contact portion formed on the insulating layer. In addition, when the lid portion is opposed to the organic EL layer side substrate in the vacuum sealing step described later, the spacer portion and the lid portion can be selectively brought into contact with each other. Thereby, it is possible to sufficiently exhibit the above-described function as the spacer portion.

  When the spacer portion is composed of a pedestal portion and a close contact portion, the size of the pedestal portion is the size between the pixel region and the contact portion, the size and number of close contact portions formed on the pedestal portion. Is appropriately adjusted according to the above. For example, the height of the pedestal is preferably in the range of 0.1 μm to 5 μm, more preferably in the range of 0.5 μm to 3 μm, and particularly in the range of 1 μm to 2 μm. preferable. When the height of the pedestal portion is within the above range, the above-described effect by forming the pedestal portion can be obtained.

  In addition, the vertical cross-sectional shape of the pedestal portion is not particularly limited as long as the contact portion can be formed on the pedestal portion. For example, a forward taper shape, a reverse taper shape, a rectangle and the like can be mentioned, and among them, a forward taper shape is preferable. Even when the pedestal portion and the close contact portion are formed so as to surround the pixel electrode or the auxiliary electrode, the transparent electrode layer described later can be uniformly formed on the entire surface, and sufficient conduction can be obtained. It is.

  Furthermore, the material used for the pedestal portion is the same as the material for the spacer portion described above, so description thereof is omitted here.

  On the other hand, the material used for the contact portion can be the same as the material for the spacer portion described above, but in addition, when the pedestal portion is formed of an insulating material, A conductive material can be used.

  About the magnitude | size and number of contact parts, since it can be made to be the same as that of the spacer part mentioned above, description is abbreviate | omitted here.

(B) Spacer part formation process The spacer part formation process in this invention has the process of forming a spacer part between the pixel area | region in which the pixel electrode was formed, and the contact part mentioned later. As a method for forming the spacer portion, a general method such as a lamination method, a photolithography method, or a printing method can be used. Another example is a method in which a spacer portion is separately formed using a mold or the like, and is bonded using an adhesive or the like between the pixel region and the contact portion.

  Further, when the spacer portion is composed of a pedestal portion and a close contact portion, the spacer portion forming step in the present invention forms a pedestal portion between a pixel region where the pixel electrode is formed and a contact portion described later, Forming a contact portion on the pedestal portion; Since the method for forming the pedestal portion and the close contact portion can be the same as the method for forming the spacer portion described above, description thereof is omitted here. In addition, when a base part and a contact | adherence part are comprised from the same material, you may form a base part and a contact | adherence part collectively.

(3) Organic EL layer forming step This step is a step of forming an organic EL layer including a plurality of organic layers and having at least a light emitting layer on the pixel electrode. In this step, at least one organic layer is formed on the entire surface of the auxiliary electrode in the organic EL layer side substrate.
Hereinafter, the organic EL layer formed in this step and a specific organic EL layer forming step will be described.

(A) Organic EL layer As an organic layer which comprises an organic EL layer, a positive hole injection layer, a positive hole transport layer, an electron injection layer, an electron transport layer, etc. other than a light emitting layer are mentioned.
Hereinafter, each organic layer constituting the organic EL layer will be described.

(I) Light-Emitting Layer The light-emitting layer formed in this step may be a monochromatic light-emitting layer or a multi-color light-emitting layer, and is appropriately selected according to the use of the organic EL device. When the organic EL device is a display device, a plurality of color light emitting layers are usually formed.

  The light emitting material used for the light emitting layer may be any material that emits fluorescence or phosphorescence, and examples thereof include dye materials, metal complex materials, and polymer materials. Note that specific pigment materials, metal complex materials, and polymer materials can be the same as those generally used, and thus description thereof is omitted here.

  The thickness of the light-emitting layer is not particularly limited as long as it can provide a function of emitting light by providing a recombination field of electrons and holes, and may be, for example, about 10 nm to 500 nm. it can.

(Ii) Hole Injecting and Transporting Layer As the organic EL layer formed in this step, a hole injecting and transporting layer may be formed between the light emitting layer and the anode.
The hole injection transport layer may be a hole injection layer having a hole injection function, or a hole transport layer having a hole transport function, and the hole injection layer and the hole transport layer are laminated. And may have both a hole injection function and a hole transport function.

  The material used for the hole injecting and transporting layer is not particularly limited as long as it can stabilize the injection and transportation of holes to the light emitting layer, and a general material can be used. .

  The thickness of the hole injecting and transporting layer is not particularly limited as long as the hole injecting function and the hole transporting function are sufficiently exhibited. Specifically, the thickness is in the range of 0.5 nm to 1000 nm, particularly 10 nm to It is preferable to be in the range of 500 nm.

(Iii) Electron Injecting and Transporting Layer As the organic EL layer formed in this step, an electron injecting and transporting layer may be formed between the light emitting layer and the cathode.
The electron injection / transport layer may be an electron injection layer having an electron injection function, may be an electron transport layer having an electron transport function, or may be a laminate of an electron injection layer and an electron transport layer. It may have both an electron injection function and an electron transport function.

The material used for the electron injection layer is not particularly limited as long as it can stabilize the injection of electrons into the light emitting layer, and the material used for the electron transport layer is from the cathode. The material is not particularly limited as long as the injected electrons can be transported to the light emitting layer.
A general material can be used as a specific material used for the electron injection layer and the electron transport layer.

  The thickness of the electron injection / transport layer is not particularly limited as long as the electron injection function and the electron transport function are sufficiently exhibited.

(B) Organic EL layer formation process The organic EL layer formation process in this invention has the process of forming the organic EL layer mentioned above on a pixel electrode. Here, a case where the organic EL layer is laminated in the order of the hole injection transport layer, the light emitting layer, and the electron injection transport layer will be described.
The method for forming the hole injecting and transporting layer is not particularly limited as long as it can be formed on at least the pixel electrode, and is appropriately selected according to the kind of material. For example, a wet process in which a coating solution for forming a hole injection transport layer in which a material or the like is dissolved or dispersed in a solvent is applied, a dry process such as a vacuum deposition method, or the like can be given.
Next, the method for forming the light emitting layer is not particularly limited as long as it can be formed on the hole injecting and transporting layer. For example, a light emitting material or the like is dissolved or dispersed in a solvent. Examples thereof include a wet process for applying a light emitting layer forming coating solution and a dry process such as a vacuum deposition method. Among these, a dry process is preferable because of the influence on the light emission efficiency and life of the organic EL display device.
Next, the method for forming the electron injecting and transporting layer is not particularly limited as long as it can be formed on the light emitting layer, and is appropriately selected according to the type of material. For example, a wet process in which a coating solution for forming an electron injecting and transporting layer in which a material or the like is dissolved or dispersed in a solvent is applied, and a dry process such as a vacuum deposition method is used.

  In the organic EL layer forming step, the organic EL layer is formed, and at least one organic layer constituting the organic EL layer is formed so as to cover the auxiliary electrode. For example, when a light emitting layer is separately applied to each pixel of an organic EL display device, a hole injection transport layer and an electron injection transport layer are formed on the pixel electrode and the auxiliary electrode, and the light emitting layer is patterned on the pixel electrode. Formed. In the case where the organic layer is formed on the pixel electrode and the auxiliary electrode, the organic layer is generally formed continuously on the pixel electrode and the auxiliary electrode.

2. In the present invention, under the first pressure, the lid is opposed to the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step, and the lid is placed on the top of the spacer portion. It arrange | positions so that it may contact through a layer, and the pressure reduction sealing process which seals the space between the said organic electroluminescent layer side board | substrate and the said cover part is performed.

  The lid used in this step is not particularly limited as long as it can face the organic EL layer side substrate and seal the space between the organic EL layer side substrate and the lid. For example, the material etc. which have translucency, such as a glass film, COP, PP, PC, PET, etc. are mentioned. Of these, glass film and COP are preferable.

  The thickness of the lid is not particularly limited as long as it is a thickness that allows the space between the organic EL layer side substrate and the lid to be sealed so as to face the organic EL layer side substrate. For example, it is preferably within the range of 10 μm to 1000 μm, more preferably within the range of 20 μm to 200 μm, and particularly preferably within the range of 30 μm to 100 μm.

  Further, the light transmittance of the lid is not particularly limited as long as the laser beam irradiated in the contact portion forming step described later can pass through the lid and remove the organic layer on the auxiliary electrode. However, the light transmittance at a wavelength of 355 nm is preferably 80% or more.

  In this step, under the first pressure, the above-described lid portion is opposed to the organic EL layer side substrate, and the lid portion is disposed on the top of the spacer portion so as to be in contact with the organic layer. This is a step of sealing the space between the organic EL layer side substrate and the lid. Specific examples of a method for performing such a process include the following methods. That is, first, in a vacuum chamber set to a predetermined degree of vacuum that is the first pressure, the organic EL layer side substrate on which the sealing agent is formed on the outer peripheral portion and the lid portion are arranged to face each other, and the organic EL layer In a method of sealing the space between the side substrate and the lid, or in a vacuum chamber set to the first pressure, the space between the organic EL layer side substrate and the lid is sealed using a jig or the like. A method is mentioned.

The space between the organic EL layer side substrate and the lid portion sealed under reduced pressure by such a process has a predetermined degree of vacuum as the first pressure. Specifically, the space between the organic EL layer side substrate and the lid portion and the organic EL layer side are adjusted by adjusting the outer peripheral space of the organic EL layer side substrate and the lid portion to the second pressure in the adhesion step described later. A differential pressure is generated between the substrate and the outer peripheral space of the lid, and the organic EL layer side substrate and the lid can be sufficiently adhered to each other, and are removed by a laser beam in a contact portion forming step described later. It is not particularly limited as long as it can prevent the dust of the organic layer from scattering into the pixel area, but the vacuum degree is as large as possible, that is, between the organic EL layer side substrate and the lid. It is preferable that the value of the pressure in the space be as small as possible. Especially, in this process, it is preferable that the space between the organic EL layer side substrate and the lid is a vacuum space. The specific degree of vacuum is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ⁴ Pa, and more preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ³ Pa. In particular, it is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ² Pa.

3. Adhering Step In the present invention, the organic EL layer side substrate and the lid portion sealed in the reduced pressure sealing step are adjusted to a second pressure so that the organic EL layer side substrate and the lid portion are in close contact with each other. An adhesion process is performed.
Hereinafter, a specific adhesion process will be described.

  In this step, the organic EL layer side substrate and the lid portion of the organic EL layer side substrate and the lid portion are adjusted to the second pressure by adjusting the space around the outer periphery of the organic EL layer side substrate and the lid portion sealed under the first pressure. In this step, a differential pressure is generated between the space between the substrate and the outer peripheral space of the organic EL layer side substrate and the lid, and the organic EL layer side substrate and the lid are brought into close contact with each other.

  The second pressure in this step is preferably 100 Pa or higher, particularly preferably 1000 Pa or higher, and particularly preferably 10,000 Pa or higher compared to the first pressure described above. When the second pressure is in the above-described range, the organic EL layer side substrate and the lid can be reliably adhered, and the dust of the organic layer that is removed by the laser beam in the contact portion forming step described later is the pixel region. It is possible to prevent scattering.

  As a method of adjusting the outer peripheral space of the organic EL layer side substrate and the lid to the second pressure, the space between the organic EL layer side substrate and the lid and the outer periphery of the organic EL layer side substrate and the lid are Although it will not specifically limit if it is a method which produces a differential pressure between them and can make an organic EL layer side board | substrate and a cover part closely_contact | adhere, For example, the following methods are mentioned. That is, by exposing the organic EL layer side substrate and the lid portion sealed in the vacuum chamber to a normal pressure space, the outer peripheral space of the organic EL layer side substrate and the lid portion is returned to normal pressure, And a method of adjusting the pressure by flowing a gas into the vacuum chamber after sealing the space between the organic EL layer side substrate and the lid. The normal pressure space described above is preferably a space in which the oxygen concentration and the water concentration are controlled to at least 1 ppm or less and filled with an inert gas such as nitrogen or argon. This is because deterioration of the organic EL element can be suppressed.

4). Contact part formation process In this invention, the contact part formation process which irradiates a laser beam through a cover part, removes the organic layer formed on the auxiliary electrode, and forms a contact part is performed.

When the second pressure is adjusted by injecting gas into the vacuum chamber in the adhesion step described above, the laser beam irradiation in this step is performed by transmitting a laser beam composed of a light-transmitting substrate such as glass in the vacuum chamber. This can be done through a window or the like.
Hereinafter, the laser beam used in this process and the contact part formed in this process will be described.

(1) Laser light The laser light in the present invention is irradiated from the lid portion side onto the organic EL layer side substrate with the lid portion facing from a laser irradiation portion described later, and removes the organic layer covering the auxiliary electrode. The contact portion is formed by exposing the auxiliary electrode.
Hereinafter, the laser irradiation part and laser beam in this invention are demonstrated.

(A) Laser irradiation part Generally, a laser irradiation part is installed in the upper part of the organic electroluminescent layer side board | substrate with which the cover part was made to oppose. The laser irradiation part and the organic EL layer side substrate move relatively, and only the organic EL layer side substrate moves and receives laser light, or only the laser irradiation part The case where the organic EL layer side substrate is moved and irradiated with laser light, the case where both the organic EL layer side substrate and the laser irradiation unit are moved, and laser light irradiation is performed, can be considered.

  In the present invention, it is preferable that the organic EL layer side substrate continues to move in the uniaxial direction and is irradiated with laser light from the lid side. This is because if the laser irradiation is performed on the organic EL layer side substrate while moving the laser irradiation unit, the accuracy of the laser beam may be deteriorated. However, the laser irradiation unit may move in a direction perpendicular to the moving direction of the organic EL layer side substrate after the laser irradiation in the uniaxial direction to the organic EL layer side substrate is finished. More preferred. At this time, laser irradiation is not performed while the laser irradiation unit is moving. The laser irradiation unit moves in a direction perpendicular to the moving direction of the organic EL layer side substrate, thereby stabilizing the organic layer on the auxiliary electrode on the organic EL layer side substrate while maintaining a desired interval. Therefore, it is expected to produce a high-quality organic EL display device.

  The organic EL layer side substrate is held horizontally and stably on a stage that continues to move in one axial direction. At this time, the means for holding the organic EL layer side substrate on the stage is not particularly limited. For example, a method of holding the organic EL layer side substrate on the stage using an adhesive sheet, or on the stage And a method of holding the organic EL layer side substrate by vacuum adsorption or electrostatic adsorption.

  The moving speed of the stage is not particularly limited as long as it can irradiate the organic EL layer side substrate with laser light under the conditions described later. For example, the laser irradiation unit is fixed and the stage is fixed. The moving speed of the stage when only moving is preferably in the range of 30 mm / sec to 1000 mm / sec, more preferably in the range of 50 mm / sec to 500 mm / sec, especially 70 mm / sec. It is preferable to be within the range of sec to 250 mm / sec.

  The laser irradiation unit includes an observation light source used for adjusting the focus of the laser light and the irradiation start position of the laser light on the organic EL layer side substrate. As the observation light source, light having a wavelength of at least 400 nm or less, preferably 500 nm or less is not used. This is because when light having a wavelength shorter than the above-described wavelength is used as an observation light source, the organic EL layer side substrate may deteriorate to an organic layer that does not need to be removed.

(B) Laser light In the present invention, a pulse laser having the conditions in the present invention is used as the laser light for removing the organic layer covering the auxiliary electrode. In general, a pulse laser has a high peak value as compared with a semiconductor continuous wave laser. Therefore, in this step, the irradiation time required for removing the organic layer is shortened, and an efficient organic EL display device is obtained. Can be manufactured.

  In the present invention, the number of times of laser light irradiation is once per contact portion described later. By using the laser light in the present invention, the organic layer on the auxiliary electrode can be efficiently removed as compared with the case of using a general semiconductor continuous wave laser, and the organic EL display device has high productivity. Can be manufactured.

The pulse width of the laser beam used in the present invention is preferably a pulse width that allows the organic layer on the auxiliary electrode to be removed by one irradiation, and specifically, is in the range of at least 1 nsec to 500 nsec. In particular, it is preferably in the range of 2 nsec to 100 nsec, and more preferably in the range of 2 nsec to 50 nsec.
If the pulse width of the laser beam is smaller than the above range, the auxiliary electrode may be damaged. In addition, if the pulse width of the laser beam is larger than the above range, the organic layer on the auxiliary electrode may not be completely removed by one pulse laser irradiation, and pixels near the laser irradiation portion may be affected by heat. There is a concern of deterioration. Furthermore, when laser irradiation is continuously performed while moving the stage, if the pulse width of the laser light is larger than the above-described range, it may be difficult to form the contact portion in a desired size.

The wavelength of the laser beam used in the present invention is preferably in the ultraviolet region, and particularly preferably 400 nm or less. If the organic layer which permeate | transmits the cover part used in this invention and covers an auxiliary electrode can be removed, the kind of laser will not be specifically limited. Examples thereof include excimer lasers such as XeF, XeCl, KrF, KrCl, ArF, Xe ₂ , Kr ₂ , Ar ₂ , and F ₂ , lasers obtained by converting the wavelength of solid lasers such as YAG, YLF, YVO ₄ , and YAlO _3. It is done.

Preferably the energy density per pulse of the laser beam is in the range of at least ^{50mJ / cm 2 ~1000mJ / cm 2} , preferably in particular in the range of ^{100mJ / cm 2 ~800mJ / cm 2} , inter alia It is preferably within the range of 150 mJ / cm ^{2 to} 500 mJ / cm ² . If the energy density per pulse is larger than the above range, the auxiliary electrode may be damaged. If the energy density per pulse is smaller than the above range, the organic layer on the auxiliary electrode may not be completely removed.

  The repetition frequency of the laser beam is not particularly limited as long as the organic layer on the auxiliary electrode can be removed at a desired interval. Specifically, the repetition frequency is preferably 50 kHz or more. It is preferably 100 kHz or more, and more preferably 200 kHz or more. When the number of laser irradiations per second, that is, the repetition frequency is within the above range, a more efficient organic EL display device can be manufactured.

  The number of branches of the laser beam is not particularly limited as long as the organic layer covering the auxiliary electrode can be efficiently removed. Specifically, the number of branches of the laser beam is preferably branched into two or more. By branching the laser light into two or more, it becomes possible to improve the productivity of the organic EL display device.

(2) Contact part The contact part formed in this process is an area | region where the transparent electrode layer mentioned later and an auxiliary electrode contact.

  The planar shape of the contact portion formed in this step is not particularly limited as long as it is a planar shape capable of sufficiently sufficiently connecting a transparent electrode layer and an auxiliary electrode described later. , Rectangular and circular.

  In addition, the mode of the contact portion is not particularly limited as long as it can electrically connect a transparent electrode and an auxiliary electrode described later sufficiently. FIG. 8A to FIG. 8C are schematic views for explaining aspects of the contact portion formed in this step. A specific mode of the contact portion 9 is a mode in which at least one organic layer 6 formed on the auxiliary electrode 4 is removed in a stripe shape as shown in FIG. Alternatively, as shown in FIG. 8B, an embodiment in which an opening is provided in at least one organic layer 6 formed on the auxiliary electrode 4 may be used. As shown in FIG. 3, the organic layer 6 formed on the auxiliary electrode 4 may be provided with a plurality of openings.

5. Transparent electrode layer forming step In the present invention, a transparent electrode layer forming step of forming a transparent electrode layer on the organic EL layer and the contact portion is performed so as to be electrically connected to the auxiliary electrode at the contact portion. .
Hereinafter, the transparent electrode layer formed in this step and a specific transparent electrode layer forming step will be described.

(1) Transparent electrode layer The transparent electrode layer in this process is formed on the organic EL layer side substrate.

  The said transparent electrode layer should just have transparency and electroconductivity, for example, a metal oxide is mentioned. Specific examples of the metal oxide include indium tin oxide, indium oxide, indium zinc oxide, zinc oxide, and stannic oxide. Further, a metal material such as magnesium-silver alloy, aluminum, and calcium can also be used for forming a thin film so as to have light transmittance.

(2) Transparent electrode layer formation process The transparent electrode layer formation process in this invention peels the cover part closely_contact | adhered to the organic electroluminescent layer side board | substrate in the said contact | adherence process, and electrically uses the said auxiliary electrode and the said contact part. A step of forming a transparent electrode layer on the organic EL layer and the contact portion so as to be connected; As a method for forming the transparent electrode layer, a general electrode forming method can be used, for example, a PVD method such as a vacuum deposition method, a sputtering method, an EB deposition method, an ion plating method, or a CVD method. be able to.

6). Other Steps The present invention is not particularly limited as long as it has the steps described above, and may have other steps. As another process, the sealing process which seals an organic EL display device with a sealing substrate is mentioned, for example.
Hereinafter, the sealing substrate will be described.

Since the organic EL display device in the present invention is a top emission type, the sealing substrate has light transmittance. The light transmittance of the sealing substrate is not limited as long as it has transparency to the wavelength in the visible light region. Specifically, the light transmittance for the entire wavelength range in the visible light region is 80% or more. It is preferable that it is 85% or more, especially 90% or more.
Here, the light transmittance can be measured by, for example, an ultraviolet-visible light spectrophotometer UV-3600 manufactured by Shimadzu Corporation.

  Further, the sealing substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device.

The material of the sealing substrate is not particularly limited as long as a light-transmitting sealing substrate can be obtained. For example, inorganic materials such as quartz and glass, acrylic resin, and COP are used. Examples thereof include resins such as cycloolefin polymer, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyimide, polyamideimide, polyethersulfone, polyetherimide, and polyetheretherketone.
A gas barrier layer may be formed on the surface of the resin sealing substrate.

  The thickness of the sealing substrate is appropriately selected depending on the material of the sealing substrate and the use of the organic EL device. Specifically, the thickness of the sealing substrate is about 0.001 mm to 5 mm.

B. Manufacturing apparatus of organic EL display device As a manufacturing apparatus used in the manufacturing method of the organic EL display device described in the above-mentioned section “A. Manufacturing method of organic EL display device”, an organic EL layer side substrate preparation step, vacuum sealing It is not particularly limited as long as it is a manufacturing apparatus capable of performing the process, the adhesion process, the contact part forming process, and the transparent electrode layer forming process.

Here, especially in the contact part formation process of the manufacturing method of the organic EL display device of the present invention, the above-mentioned “A. Manufacturing method of organic EL display apparatus 4. Contact part formation process (1) Laser light (a) Laser irradiation” It is preferable to use the manufacturing apparatus having the laser irradiation part and the stage described in the section “Part”.
Hereinafter, the manufacturing apparatus used for the contact part formation process of the manufacturing method of the organic electroluminescence display of this invention is demonstrated, referring a figure.

  FIGS. 9A and 9B are schematic views showing an example of a manufacturing apparatus used in the contact portion forming step of the method for manufacturing an organic EL display device of the present invention. As illustrated in FIG. 9A, the pulse laser P irradiated from the laser irradiation unit 13 is irradiated through the lid portion 8 to the organic EL layer side substrate held on the stage 14. The stage 14 continues to move in the x-axis direction illustrated in FIG. 9A, and the laser irradiation unit 13 moves in the normal direction to the operation direction of the stage 14, that is, in the y-axis direction illustrated in FIG. 9A. , Move relative to the stage 14. Note that the moving speed of both the laser irradiation unit 13 and the stage 14 can be controlled to a predetermined speed. In these operations, the pulse laser P is intermittently irradiated toward the organic EL layer side substrate. Therefore, as illustrated in FIG. 9B, the organic EL layer side substrate is irradiated with the pulse laser P at a constant interval.

  The stage and the laser irradiation part are the same as those described in the above-mentioned section “A. Manufacturing method of organic EL display device 4. Contact part forming step (1) Laser light (a) Laser irradiation part”. Therefore, the description here is omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  The present invention will be described more specifically with reference to the following examples.

[Example]
(Pixel electrode and auxiliary electrode formation process)
A pixel electrode was formed by forming a chromium film with a thickness of 150 nm in a pattern on a substrate made of alkali-free glass with a thickness of 0.7 mm. Thereafter, a chromium film having a thickness of 150 nm was formed between the pixel electrodes in a stripe shape to form an auxiliary electrode.

(Spacer formation process)
Next, a spacer portion was formed by a photolithography method between the pixel electrode and the region where the contact portion is formed in the auxiliary electrode. The planar shape of the spacer portion was a frame shape, and the vertical cross-sectional shape was a forward tapered shape. The height of the spacer portion was 1.5 μm.

(Organic EL layer formation process)
Next, a 0.1 μm hole injection layer was formed on the pixel electrode, and then a 0.3 μm light emitting layer was formed on the hole injection layer. Thereafter, an electron transport layer having a thickness of 0.3 μm was formed on the light emitting layer to obtain an organic EL layer. The organic EL layer was formed on the pixel electrode and also on the auxiliary electrode.

  In this way, an organic EL layer side substrate was formed.

(Reduced pressure sealing process and adhesion process)
Subsequently, in a vacuum chamber set to a vacuum degree of 50 Pa as the first pressure, a lid portion using PET having a thickness of 100 μm is opposed to the organic EL layer side substrate on which a weak adhesive layer is previously formed on the outer periphery of the pattern. The lid was brought into contact with the surface of the organic EL layer side substrate, and the space between the organic EL layer side substrate and the lid was sealed. Thereafter, nitrogen gas was allowed to flow into the vacuum chamber, thereby returning the inside of the chamber to the normal pressure, which was the second pressure, and bringing the organic EL layer side substrate and the lid portion into close contact with each other.

(Contact part formation process)
Next, YAG laser light having an energy density of 500 mJ / cm ² , a spot diameter of 10 μmφ, a wavelength of 355 nm, and a pulse width of 5 nsec is irradiated through the lid to remove the organic layer covering the auxiliary electrode, and the auxiliary electrode is exposed. A contact portion was formed. In addition, the frequency | count of irradiation of a laser beam was 1 time per contact part formed.

(Electron injection layer and transparent electrode layer forming step)
Thereafter, the lid is peeled off, and lithium fluoride is deposited by vacuum deposition so as to have a thickness of 0.5 nm so as to be electrically connected to the auxiliary electrode exposed at the contact portion, and the electron injection layer is formed. Formed. Next, the film was formed by vacuum deposition so that the calcium film thickness was 10 nm and the aluminum film thickness was 5 nm to form a transparent electrode layer.

  In this way, an organic EL display device was produced.

(Evaluation)
The produced organic EL display device was evaluated for light emission. When the extraction electrode connected to the auxiliary electrode formed on the substrate on the organic EL layer side is connected to the minus terminal, the extraction electrode side connected to the pixel electrode is connected to the plus terminal, and a current is passed, the above organic EL The display device was confirmed to emit light. From the above, it was confirmed that in the organic EL display device, the contact portion that can electrically connect the auxiliary electrode and the transparent electrode can be formed by irradiating the laser beam under the irradiation conditions described above once.

DESCRIPTION OF SYMBOLS 1 ... Organic EL layer side substrate 2 ... Substrate 3 ... Pixel electrode 4 ... Auxiliary electrode 5 ... Spacer part 6 ... Organic EL layer 7 ... Transparent electrode layer 8 ... Lid part 9 ... Contact part 10 ... Top emission type organic EL display device 11 ... Adhering part 12 ... Pedestal part 13 ... Laser irradiation part 14 ... Stage P ... Pulse laser

Claims (1)

A substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, a spacer portion formed on the substrate, and a plurality of pixel electrodes formed on the pixel electrode, An organic electroluminescence layer composed of an organic layer and having at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and an opening of the organic layer formed on the auxiliary electrode A contact portion, and the organic electroluminescence layer and a transparent electrode layer formed on the contact portion, and the spacer portion is formed between the contact portion and the pixel electrode adjacent to the contact portion. In addition, the transparent electrode layer manufactures a top emission type organic electroluminescence display device that is electrically connected to the auxiliary electrode at the contact portion. Tsu A method of manufacturing a flop emission organic electroluminescent display device,
An organic electroluminescence layer side substrate having the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic electroluminescence layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic electroluminescence layer side substrate preparation step to be prepared;
Under a first pressure, a lid portion is opposed to the organic electroluminescence layer side substrate obtained in the organic electroluminescence layer side substrate preparation step, and the lid portion contacts the top portion of the spacer portion via the organic layer. A reduced pressure sealing step that seals a space between the organic electroluminescence layer side substrate and the lid,
An adhesion step of adjusting the space around the organic electroluminescence layer side substrate and the lid portion sealed in the reduced pressure sealing step to a second pressure to bring the organic electroluminescence layer side substrate and the lid portion into close contact with each other;
A contact part forming step of irradiating a laser beam through the lid part to remove the organic layer formed on the auxiliary electrode and forming the contact part;
The laser irradiation unit for irradiating the laser light and the organic electroluminescence layer side substrate relatively move,
The number of times of irradiation of the laser beam forming the contact portion is once per one contact portion,
The pulse width of the laser light is a pulse width that enables the organic layer on the auxiliary electrode to be removed by one irradiation,
The method of manufacturing a top emission type organic electroluminescence display device, wherein the wavelength of the laser beam is a wavelength in an ultraviolet region.

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