JP2015049982A - Method for manufacturing top-emission type organic electroluminescent display device and lid material for temporary sealing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a top-emission type organic EL display device capable of preventing an increase in manufacturing costs and a decrease in manufacturing efficiency by using a member such as a jig.SOLUTION: A method for manufacturing a top-emission type organic EL display device comprises the steps of: preparing an organic EL layer side substrate 1 which includes a substrate 2, a pixel electrode 3, an auxiliary electrode 4, a spacer part 5, and an organic EL layer and in which at least one organic layer 6 is formed on the whole surface of the auxiliary electrode 4 (organic EL layer side substrate preparing step); sealing a surface of the organic EL layer side substrate 1 with a lid material 8 for temporary sealing under a first pressure (pressure reducing and sealing step); bringing the organic EL layer side substrate 1 and the lid material 8 for temporary sealing into close contact by adjusting the spaces in the outer peripheries of the organic EL layer side substrate 1 and the lid material 8 for temporary sealing to a second pressure (close contacting step); and forming a contact part 9 by irradiating the organic layer with a laser beam via the lid material 8 for temporary sealing (contact part forming step).

Description

  The present invention relates to a method for manufacturing a top emission type organic electroluminescence display device having an auxiliary electrode.

  The organic electroluminescence element has high visibility due to self-coloring, is an all-solid-state display unlike a liquid crystal display device, has excellent impact resistance, has a fast response speed, is less affected by temperature changes, and Advantages such as a wide viewing angle are attracting attention. Hereinafter, organic electroluminescence may be abbreviated as organic EL.

  The configuration of the organic EL element is based on a laminated structure in which an organic EL layer is sandwiched between an anode and a cathode. There are passive matrix driving and active matrix driving as a driving method of an organic EL display device having such an organic EL element. However, when manufacturing a large display, it is active from the viewpoint that driving with a low voltage is possible. Matrix driving is advantageous. Note that active matrix driving refers to a system in which a circuit such as a TFT is formed on a substrate on which an organic EL element is formed and the circuit is driven by the circuit such as the TFT.

  Such organic EL display devices include a bottom emission type in which light is extracted from the substrate side on which the organic EL element is formed, and a top emission type in which light is extracted from the side opposite to the substrate on which the organic EL element is formed. . Here, in the case of an organic EL display device driven by an active matrix, in the bottom emission type, the aperture ratio is limited by a circuit such as a TFT formed on a substrate which is a light extraction surface, and the light extraction efficiency is reduced. There's a problem. On the other hand, in the top emission type, since light is extracted from the surface opposite to the substrate, light extraction efficiency superior to that of the bottom emission type is obtained. In the case of the top emission type, a transparent electrode layer is used as the electrode layer on the side that becomes the light extraction surface.

  By the way, a general transparent electrode layer has a larger resistance than an electrode layer made of a metal such as Al or Cu. Therefore, in an organic EL display device having a transparent electrode layer, a voltage drop occurs due to the resistance of the transparent electrode layer, and as a result, the occurrence of so-called luminance unevenness in which the luminance uniformity of the organic EL layer is lowered is a problem. . In addition, since the resistance increases as the area of the transparent electrode layer increases, the above-described problem of luminance unevenness becomes prominent when a large display is manufactured.

  In order to solve the above problem, a method is known in which a voltage drop is suppressed by forming an auxiliary electrode having a low resistance value and electrically connecting the auxiliary electrode to a transparent electrode layer. Here, the auxiliary electrode is usually formed in a pattern by performing a wet process etching after forming a metal layer. Therefore, for example, in the top emission type organic EL display device, when the auxiliary electrode is formed after the organic EL layer is formed, there is a problem that the organic EL layer is eroded by the etching solution used when the auxiliary electrode is formed. . Therefore, as described in Patent Documents 1 to 3, a method of forming an auxiliary electrode before forming an organic EL layer is known.

  However, usually, when the auxiliary electrode is formed before forming the organic EL layer, the auxiliary electrode is formed when the organic EL layer is formed on the entire surface or when at least one organic layer constituting the organic EL layer is formed on the entire surface. An organic EL layer and at least one organic layer are formed thereon. Therefore, there has been a problem that the electrical connection between the auxiliary electrode and the transparent electrode layer is hindered by the organic EL layer or the organic layer on the auxiliary electrode.

  With respect to such a problem, Patent Document 1 discloses a method of manufacturing an organic EL display device in which an organic EL layer on an auxiliary electrode is removed by laser light and the auxiliary electrode and the transparent electrode layer are electrically connected. Proposed. However, in this case, there is a problem that the organic EL layer removed by the laser light is scattered, the pixel region in the organic EL display device is contaminated, and the display characteristics are deteriorated.

  As a method for solving the above problem, for example, in Patent Document 2, before the organic EL layer is removed by laser light, the first electrode having translucency is applied to the entire surface of the auxiliary electrode covered with the organic EL layer. A method is proposed in which the organic EL layer is removed by laser light through the first electrode and then the second electrode is formed. In this case, although the deterioration of the display characteristics of the organic EL display device as described above can be suppressed, the manufacturing process increases by forming the first electrode and the second electrode as the transparent electrode layer. There is a problem.

Patent No. 4959119 Special table 2010-538440 gazette Japanese Patent No. 4340982

  By the way, Patent Document 3 discloses the following method. That is, as shown in FIG. 16A, the pixel electrode 30 and the auxiliary electrode 40 are formed on the substrate 20, and the insulating layer 50 is formed between the pixel electrode 30 and the auxiliary electrode 40. The organic EL layer side substrate on which the organic layer 60 is formed so as to cover the cover member 80 'is opposed to the chamber C in a vacuum atmosphere. Next, as shown in FIG. 16B, the overlapping substrate 10 ′, in which the organic EL layer side substrate and the lid member 80 ′ are opposed to each other, is taken out from the chamber C to the atmosphere, and the organic EL layer The lid member 80 'is brought into close contact with the side substrate. Thereafter, the organic EL layer 60 on the auxiliary electrode 40 is removed by irradiating a laser beam L from the lid 80 'side of the overlapping substrate 10'. In the method shown in FIGS. 16A to 16B, the difference between the pressure in the space between the organic EL layer side substrate and the lid member 80 ′ and the pressure in the outer space of the overlapping substrate 10 ′, that is, both Due to the differential pressure in the space, the adhesion between the organic EL layer side substrate and the lid member 80 ′ can be improved, and in this state, the organic layer can be removed by laser light. However, in the case of the method shown in FIGS. 16A to 16B, the lid is transported when transporting the overlapping substrate 10 ′ in which the space between the organic EL layer side substrate and the lid member 80 ′ is evacuated. There is a problem that the part 80 ′ is easily peeled off from the organic EL layer side substrate, and it is difficult to maintain the vacuum state of the space between the organic EL layer side substrate and the lid member 80 ′. Further, in the method shown in FIGS. 16A to 16B, although the space V between the organic EL layer side substrate and the lid member 80 ′ can be evacuated, the overlapping substrate 10 ′ is placed in the chamber. Since the space N at both ends of the overlapped substrate 10 ′ communicates with the external space when taken out from the inside of C, it is necessary to ensure sufficient adhesion between the organic EL layer side substrate and the lid member 80 ′. There is a problem that it becomes difficult.

  Furthermore, Patent Document 3 discloses the following method as another method. That is, as shown in FIG. 17A, in the chamber C, the overlapping substrate 10 ′ is disposed on the jig main body 81 ′, and the lid member 80 ′ on the jig main body 81 ′ and the overlapping substrate 10 ′. A hermetic seal 82 'is affixed to and sealed with a jig lid 83'. Next, the overlapping substrate 10 ′ is taken out from the chamber C into the atmosphere, and the lid member 80 ′ is adhered to the organic EL layer side substrate. Thereafter, a method is disclosed in which the organic EL layer 60 on the auxiliary electrode 40 is removed by irradiating laser light L from the lid 80 'side of the overlapping substrate 10'. Thus, in the case of the method shown in FIGS. 17A to 17B, unlike the method shown in FIGS. 16A to 16B, the space between the organic EL layer side substrate and the lid member 80 ′ is different. The entire space can be evacuated. However, in the method shown in FIGS. 17A to 17B, in addition to the organic EL layer side substrate and the lid member, the jig body 81 ′, the jig lid body 83 ′, etc. are used in the vacuum sealing step. When the number of members increases, there is a problem that the manufacturing cost increases and the manufacturing efficiency decreases.

  This invention is made | formed in view of the said situation, and when irradiating a laser beam and removing the organic layer on an auxiliary electrode, the space between the organic electroluminescent layer side board | substrate and the lid material for temporary sealing is made. Then, the organic EL layer side substrate and the cover material are adjusted to adjust the pressure around the organic EL layer side substrate and the cover material so that the organic EL layer side substrate and the cover material adhere to each other. Prevents layers from scattering into the pixel area and suppresses deterioration in display characteristics. Further, as in the past, using a member such as a jig prevents an increase in manufacturing cost and a decrease in manufacturing efficiency. The main object of the present invention is to provide a method for manufacturing a top emission type organic EL display device that can be used.

  In order to achieve the above object, the present invention provides a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and a spacer portion formed on the substrate. And an organic EL layer which is formed on the pixel electrode and is composed of a plurality of organic layers and has at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and the auxiliary electrode A contact portion which is an opening portion of the organic layer formed on the surface, a transparent electrode layer formed on the organic EL layer and the contact portion, and the spacer portion includes the contact portion and the contact portion. A top emission type that produces a top emission type organic EL display device that is formed between the pixel electrodes adjacent to each other and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. Organic A method for manufacturing an L display device, comprising the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic EL layer side substrate preparing step for preparing the organic EL layer side substrate, and a temporary sealing lid material on the organic EL layer side substrate obtained in the organic EL layer side substrate preparing step under a first pressure Are arranged so that the lid for temporary sealing is in contact with the top of the spacer portion via the organic layer, and a space between the organic EL layer side substrate and the lid for temporary sealing is formed. A reduced pressure sealing step of sealing and sealing the surface of the organic EL layer side substrate with the temporary sealing lid material, and the organic EL layer side substrate and the temporary sealing lid material sealed in the reduced pressure sealing step Adjust the outer space to the second pressure to adjust the organic EL layer side substrate and the top An adhesion process for closely attaching the temporary sealing lid material, and irradiating laser light through the temporary sealing lid material to remove the organic layer formed on the auxiliary electrode to form the contact portion. A top emission type organic EL, wherein the lid for temporary sealing includes a lid substrate and a temporary sealing member formed in a frame shape on the lid substrate. A method for manufacturing a display device is provided.

  According to the present invention, the temporary sealing lid material used in the vacuum sealing step is composed of the lid substrate and the temporary sealing member, so that the organic EL layer side substrate and the temporary sealing are temporarily sealed in the vacuum sealing step. The space between the lid member can be sufficiently sealed. Thereby, it is possible to prevent the organic layer on the auxiliary electrode removed by the laser light from being scattered in the pixel region, and to suppress deterioration in display characteristics. In addition, according to the present invention, the temporary sealing lid member and the organic EL layer side substrate are directly bonded to each other by the temporary sealing member formed in a frame shape on the lid substrate. It is not necessary to use this member, and an increase in manufacturing cost and a decrease in manufacturing efficiency can be prevented.

  In the present invention, the temporary sealing lid material has the frame-shaped temporary sealing member formed on at least one surface of the lid substrate, and the temporary sealing member is made of a magnetic material. In the substrate, a metal plate is preferably disposed on the surface opposite to the side on which the pixel electrode and the auxiliary electrode are formed. The temporary sealing member is made of a magnetic material, and the metal plate is disposed on the surface of the substrate opposite to the side where the pixel electrode and the auxiliary electrode are formed, so that the organic EL layer side substrate is interposed therebetween. The temporary sealing member and the metal plate are brought into close contact with each other by magnetic force, and the space between the organic EL layer side substrate and the temporary sealing lid member can be sufficiently sealed. Thereby, it is possible to prevent the organic layer on the auxiliary electrode removed by the laser light from being scattered in the pixel region, and to suppress deterioration in display characteristics. In addition, since the temporary sealing member made of a magnetic material and the metal plate are in close contact with each other by magnetic force, it is easy to peel the temporary sealing lid from the organic EL layer side substrate after the contact portion forming step. Become. Therefore, it is possible to prevent a decrease in manufacturing efficiency due to peeling of the temporary sealing lid.

  Further, in the present invention, the lid for temporary sealing has the frame-shaped temporary sealing member formed on at least one surface of the lid substrate, and the temporary sealing member is made of a metal material. It is preferable that a magnetic plate is disposed on one surface of the substrate. The temporary sealing member is made of a metal material, and the magnetic plate is disposed on the surface of the substrate opposite to the side where the pixel electrode and the auxiliary electrode are formed, so that the organic EL layer side substrate is interposed therebetween. The temporary sealing member and the magnetic plate are brought into close contact with each other by magnetic force, and the space between the organic EL layer side substrate and the temporary sealing lid member can be sufficiently sealed. Thereby, it is possible to prevent the organic layer on the auxiliary electrode removed by the laser light from being scattered in the pixel region, and to suppress deterioration in display characteristics. In addition, since the temporary sealing member made of a metal material and the magnetic plate are in close contact with each other by magnetic force, it is easy to peel the temporary sealing lid from the organic EL layer side substrate after the contact portion forming step. Become. Therefore, it is possible to prevent a decrease in manufacturing efficiency due to peeling of the temporary sealing lid.

  In the present invention, the temporary sealing lid material has the frame-shaped temporary sealing member formed on the surface of the lid substrate facing the organic EL layer side substrate, and the temporary sealing member However, it is preferable that it is comprised from the adhesive material. Since the temporary sealing member is made of an adhesive material, the temporary sealing member is brought into close contact with the organic EL layer side substrate, and the space between the organic EL layer side substrate and the temporary sealing lid is sufficiently sealed. can do. Thereby, it is possible to prevent the organic layer on the auxiliary electrode removed by the laser light from being scattered in the pixel region, and to suppress deterioration in display characteristics.

  The present invention has a lid substrate and a frame-like temporary sealing member formed on at least one surface of the lid substrate, and the temporary sealing member is made of a magnetic material. A temporary sealing lid material is provided.

  The present invention also includes a lid substrate and a frame-like temporary sealing member formed on at least one surface of the lid substrate, and the temporary sealing member is made of a metal material. A temporary sealing lid member is provided.

  Furthermore, the present invention has a lid substrate and a frame-like temporary sealing member formed on one surface of the lid substrate, and the temporary sealing member is made of an adhesive material. A temporary sealing lid material is provided.

  Since the temporary sealing lid material of the present invention can be used in the above-described method for manufacturing the top emission organic EL display device, it is possible to suppress a decrease in display characteristics, and further increase in manufacturing cost and manufacturing efficiency. It is possible to obtain a top emission type organic EL display device capable of preventing the deterioration of the above.

  In the present invention, when the organic layer on the auxiliary electrode is removed by irradiating the laser beam, the space between the organic EL layer side substrate and the temporary sealing lid is sufficiently sealed under reduced pressure, so that the laser beam It is possible to prevent the organic layer on the auxiliary electrode removed by the scattering from scattering into the pixel region and suppress the deterioration of the display characteristics, and furthermore, the manufacturing cost can be reduced by using a member such as a jig as in the past. There is an effect that a top emission type organic EL display device capable of preventing an increase and a decrease in manufacturing efficiency can be obtained.

It is process drawing which shows an example of the manufacturing method of the top emission type organic electroluminescence display of this invention. It is process drawing which shows the other example of the manufacturing method of the top emission type organic electroluminescence display of this invention. It is a schematic diagram explaining the lid | cover material for temporary sealing in this invention. It is a schematic diagram explaining the spacer part in this invention. It is the schematic which shows an example of the spacer part formation process and insulating layer formation process in this invention. It is a schematic diagram which shows an example of the top emission type organic EL display device of this invention. It is a schematic diagram which shows the other example of the top emission type organic electroluminescent display apparatus of this invention. It is a schematic diagram which shows the other example of the top emission type organic electroluminescent display apparatus of this invention. It is a schematic diagram explaining the spacer part in this invention. It is a schematic sectional drawing at the time of bonding the lid | cover for temporary sealing using the temporary sealing member of a 1st aspect on the surface of the organic electroluminescent layer side board | substrate. It is a schematic sectional drawing at the time of bonding the lid | cover material for temporary sealing using the temporary sealing member of a 2nd aspect on the surface of the organic electroluminescent layer side board | substrate. It is a schematic sectional drawing at the time of bonding the lid | cover material for temporary sealing using the temporary sealing member of a 2nd aspect on the surface of the organic electroluminescent layer side board | substrate. It is a schematic sectional drawing when the lid | cover for temporary sealing using the temporary sealing member of a 3rd aspect is bonded together on the surface of an organic electroluminescent layer side board | substrate. It is process drawing which shows an example of the contact part formation process in this invention. It is a block diagram which shows an example of the manufacturing apparatus used for the manufacturing method of the organic electroluminescence display of this invention. It is process drawing which shows an example of the pressure reduction sealing process in the manufacturing method of the conventional top emission type organic electroluminescence display. It is process drawing which shows the other example of the pressure reduction sealing process in the manufacturing method of the conventional top emission type organic electroluminescence display.

  Hereinafter, the manufacturing method of the top emission type organic EL display device of the present invention and the lid material for temporary sealing will be described in detail. Hereinafter, the top emission type organic EL display device may be abbreviated as an organic EL display device.

A. Manufacturing method of organic EL display device The manufacturing method of the organic EL display device of the present invention includes a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and the substrate. The spacer portion formed above, the organic EL layer formed on the pixel electrode and composed of a plurality of organic layers, having at least a light emitting layer, and at least one layer of the above-described auxiliary electrode An organic layer, a contact portion that is an opening of the organic layer formed on the auxiliary electrode, a transparent electrode layer formed on the organic EL layer and the contact portion, and the spacer portion includes: An organic EL display device is formed between the contact portion and the pixel electrode adjacent to the contact portion, and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. Organic EL display A method of manufacturing an organic material comprising the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic EL layer side substrate preparing step for preparing an EL layer side substrate, and a temporary sealing lid material facing the organic EL layer side substrate obtained in the organic EL layer side substrate preparing step under a first pressure The temporary sealing lid material is arranged to contact the top of the spacer portion via the organic layer, and the space between the organic EL layer side substrate and the temporary sealing lid material is sealed. A vacuum sealing step for sealing the surface of the organic EL layer side substrate with the temporary sealing lid material, and a space around the organic EL layer side substrate and the temporary sealing lid material sealed in the vacuum sealing step. The organic EL layer side substrate and the temporary sealing lid by adjusting the pressure to the second pressure And a contact part forming step of forming the contact part by removing the organic layer formed on the auxiliary electrode by irradiating a laser beam through the temporary sealing lid member. The temporary sealing lid member has a lid substrate and a temporary sealing member formed in a frame shape on the lid substrate.

  Here, the “first pressure” and the “second pressure” are not particularly limited as long as the first pressure is lower than the second pressure. Further, the pressure in the space between the organic EL layer side substrate and the temporary sealing lid member when the temporary sealing lid member is disposed on the surface of the organic EL layer side substrate is adjusted to a first pressure, When the pressure in the outer space of the organic EL layer side substrate and the temporary sealing lid member is adjusted to the second pressure, the pressure between the organic EL layer side substrate and the temporary sealing lid member and the above Especially if the pressure is such that the organic EL layer side substrate and the temporary sealing lid material can be brought into close contact with each other by the pressure difference between the organic EL layer side substrate and the outer peripheral pressure of the temporary sealing lid material. It is not limited. Normally, the “first pressure” is lower than the normal pressure, and the “second pressure” is higher than the “first pressure”. The specific “first pressure” and “second pressure” will be described in the sections of “2. Pressure reducing sealing step” and “3. Adhesion step”, which will be described later. To do.

  1A to 1F are process diagrams showing an example of a method for manufacturing an organic EL display device of the present invention. First, as illustrated in FIG. 1A, a pixel electrode and auxiliary electrode forming process for forming the pixel electrode 3 and the auxiliary electrode 4 between the pixel electrode 3 is performed on the substrate 2. Next, as illustrated in FIG. 1B, a spacer part forming step for forming the spacer part 5 on the substrate 2 is performed. Thereafter, as illustrated in FIG. 1C, an organic EL layer forming step is performed in which an organic EL layer 6 including a plurality of organic layers and having at least a light emitting layer is formed. In this way, an organic EL layer side substrate preparation step for preparing the organic EL layer side substrate 1 is performed. Next, as illustrated in FIG. 1D, the surface of the organic EL layer side substrate 1 is temporarily placed so that the lid substrate 83 is in contact with the top of the spacer portion 5 via the organic layer under the first pressure. The sealing lid 8 is disposed, and the organic EL layer side substrate 1 is sandwiched between the temporary sealing lid 8 and the metal plate 20. Thus, the space V between the organic EL layer side substrate 1 and the temporary sealing lid member 8 is sealed, and the surface of the organic EL layer side substrate 1 is sealed with the temporary sealing lid member 8 under reduced pressure. Perform the process. Since the temporary sealing member 80 here is a temporary sealing member 81 made of a magnetic material, the temporary sealing member 81 and the metal plate 20 are magnetically coupled via the organic EL layer side substrate 1. Adhere closely. Thereafter, the space on the outer periphery of the organic EL layer side substrate 1 and the temporary sealing lid 8 sealed in the reduced pressure sealing step is adjusted to a second pressure to adjust the organic EL layer side substrate 1 and the temporary sealing. An adhesion process for bringing the lid material 8 into close contact is performed. Next, the organic EL layer 6 formed on the auxiliary electrode 4 is irradiated with laser light L through the temporary sealing lid member 8 to remove the organic EL layer 6 on the auxiliary electrode 4. Thereafter, the temporary sealing lid 8 and the metal plate 20 are removed from the organic EL layer side substrate 1 to expose the auxiliary electrode 4 to form the contact portion 9 as illustrated in FIG. A formation process is performed. Finally, as illustrated in FIG. 1 (f), a transparent electrode layer forming step of forming the transparent electrode layer 7 on the organic EL layer side substrate so as to be electrically connected to the auxiliary electrode 4 at the contact portion 9. I do. Thereby, the organic EL display device 100 according to the present invention is obtained.

  2A to 2F are process diagrams illustrating another example of the method for manufacturing the organic EL display device of the present invention. 2A to 2C are the same as FIGS. 1A to 1C, and will be omitted. Next, as illustrated in FIG. 2D, under the first pressure, the surface of the organic EL layer side substrate 1 is placed so that the lid substrate 83 is in contact with the top of the spacer portion 5 via the organic layer. The temporary sealing lid member 8 is disposed, and the organic EL layer side substrate 1 is sandwiched between the temporary sealing lid member 8 and the metal plate 20. Thus, the space V between the organic EL layer side substrate 1 and the temporary sealing lid member 8 is sealed, and the surface of the organic EL layer side substrate 1 is sealed with the temporary sealing lid member 8 under reduced pressure. Perform the process. Since the temporary sealing member 80 here is a temporary sealing member 81 made of a magnetic material as in FIG. 1D, the temporary sealing member 81 and the metal plate 20 are organic EL. It adheres by the magnetic force through the layer side substrate 1. Thereafter, the space on the outer periphery of the organic EL layer side substrate 1 and the temporary sealing lid 8 sealed in the reduced pressure sealing step is adjusted to a second pressure to adjust the organic EL layer side substrate 1 and the temporary sealing. An adhesion process for bringing the lid material 8 into close contact is performed. Next, an organic EL layer formed on the auxiliary electrode 4 by irradiating the region where the auxiliary electrode 4 is formed through the mask M having an opening from the temporary sealing lid material 8 side. 6 is removed, and thereafter, the temporary sealing lid 8 and the metal plate 20 are removed from the organic EL layer side substrate 1, and the auxiliary electrode 4 is exposed to expose the contact portion 9 as illustrated in FIG. The contact part formation process to form is performed. Finally, as illustrated in FIG. 2 (f), a transparent electrode layer forming step of forming the transparent electrode layer 7 on the organic EL layer side substrate so as to be electrically connected to the auxiliary electrode 4 at the contact portion 9. I do. Thereby, the organic EL display device 100 according to the present invention is obtained.

According to the present invention, the temporary sealing lid material used in the vacuum sealing step is composed of the lid substrate and the temporary sealing member, so that the organic EL layer side substrate and the temporary sealing are temporarily sealed in the vacuum sealing step. The space between the lid and the cover material can be sufficiently sealed, and the organic layer on the auxiliary electrode removed by the laser beam in the contact formation process is prevented from scattering into the pixel area, thereby reducing the display characteristics. Can be suppressed.
About this reason, the following can be considered. That is, in the related art, as illustrated in FIG. 16B, the space N between the organic EL layer side substrate and the lid member 80 ′ at both ends of the overlapping substrate 10 ′ is set as the reduced pressure space by the reduced pressure sealing process. And the organic EL layer side substrate and the lid member 80 ′ can be sufficiently brought into close contact with each other when the outer peripheral space of the organic EL layer side substrate and the lid member 80 ′ is adjusted to the second pressure in the adhesion step. There was a problem that I couldn't. However, in the present invention, the temporary sealing lid member used in the vacuum sealing step is formed in a frame shape on the lid substrate 83 and the lid substrate 83 as shown in FIGS. Since the temporary sealing member 80 is included, for example, as illustrated in FIG. 1 (d), the temporary sealing lid member 8 is disposed to face the organic EL layer side substrate 1, and the organic EL layer By disposing the metal plate 20 on the substrate 2 side of the side substrate 1, the temporary sealing member 80 of the temporary sealing lid member 8 and the metal plate 20 facing each other through the organic EL layer side substrate 1 are in close contact with each other. Accordingly, the temporary sealing lid member 8 comes into contact with the surface of the organic EL layer side substrate 1 in a frame shape corresponding to the region where the temporary sealing member 80 is formed. Therefore, the space between the organic EL layer side substrate 1 and the temporary sealing lid 8 can be sealed under reduced pressure as a whole by the reduced pressure sealing step, and the organic EL layer side substrate 1 and the temporary sealing can be performed by the subsequent adhesion step. The stopper cover 8 can be sufficiently adhered. Therefore, in the present invention, it is possible to prevent the organic layer 6 on the auxiliary electrode 4 removed by the laser light L in the contact portion forming step from scattering into the pixel region 3 and to suppress deterioration in display characteristics. It is guessed.

  Further, according to the present invention, the temporary sealing lid member can be attached to the organic EL layer side substrate by the temporary sealing member formed on the lid substrate. Therefore, for example, when the lid substrate is bonded to the organic EL layer side substrate by using a jig or the like, the organic EL layer side substrate in a state where the lid substrate is bonded by the jig or the like is stage-scanned and conveyed. However, in the present invention, the organic EL layer side substrate with the temporary sealing lid attached thereto can be stage-scanned and transported. Accordingly, the manufacturing efficiency can be improved in the present invention.

  Furthermore, according to the present invention, as described above, the organic EL layer side substrate and the temporary sealing lid member are brought into contact with each other, and the space between the organic EL layer side substrate and the temporary sealing lid member is sealed under reduced pressure. In addition, since the organic EL layer side substrate and the temporary sealing lid member can be sufficiently adhered, there is no need to use a plurality of members such as a jig as in the conventional method illustrated in FIG. . Therefore, in the present invention, an increase in manufacturing cost and a decrease in manufacturing efficiency due to the use of a plurality of members such as jigs can be prevented.

  Here, in the present invention, “at least one organic layer is formed on the entire surface of the auxiliary electrode” means, for example, an organic EL layer as illustrated in FIG. 1 (c) and FIG. 2 (c). 6 is formed on the entire surface so as to cover the pixel region p in which the pixel electrode 3 is formed and the auxiliary electrode 4, and in addition to this, the organic EL layer is assumed to be a hole. In the case of four layers including an injection layer, a hole transport layer, a light emitting layer, and an electron injection layer, three of the four layers are formed in a pattern in the pixel region, and the remaining one layer is a pixel. A mode in which the entire surface is formed so as to cover the region and the auxiliary electrode, or two of the four layers are formed in a pattern in the pixel region, and the remaining two layers cover the pixel region and the auxiliary electrode Formed on the entire surface, and further, one of the above four layers. There are formed in a pattern in the pixel region, including the aspects remaining three layers are formed on the entire surface so as to cover the pixel region and the auxiliary electrode and the like.

  Further, in the present invention, the “top portion of the spacer portion” refers to the upper bottom surface H of the spacer portion 5 when the spacer portion 5 is trapezoidal as illustrated in FIG. 4, for example. When the spacer portion has a shape other than the trapezoid, it refers to the uppermost portion of the spacer portion, and when the organic EL layer side substrate and the temporary sealing lid material are brought into contact with each other and sealed under reduced pressure, The part which the lid | cover material for temporary sealing contacts previously is pointed out.

  Further, in the present invention, “the temporary sealing lid member has a lid substrate and a temporary sealing member formed in a frame shape on the lid substrate” means, for example, in FIGS. 3 (a) to 3 (c). As illustrated, the temporary sealing lid member 8 includes a lid substrate 83 and a temporary sealing member 80 formed on the lid substrate 83 so as to have an opening.

  Hereinafter, each process in the manufacturing method of the organic EL display device of this invention and the manufacturing apparatus used for the manufacturing method of the organic EL display device of this invention are demonstrated.

1. Organic EL layer side substrate preparation step In the present invention, first, a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and the substrate were formed. A spacer part, an organic EL layer formed on the pixel electrode and composed of a plurality of organic layers, having at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and A contact portion that is an opening portion of the organic layer formed on the auxiliary electrode; and a transparent electrode layer formed on the organic EL layer and the contact portion. The spacer portion includes the contact portion and the contact portion. It is formed between the pixel electrodes adjacent to the contact portion, and the transparent electrode layer is a method for manufacturing a top emission type organic EL display device electrically connected to the auxiliary electrode at the contact portion. Over there An organic EL layer side substrate having a substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic EL layer and having at least one organic layer formed on the entire surface of the auxiliary electrode is prepared. An organic EL layer side substrate preparation step is performed.
Hereinafter, the formation process of each member formed in this process will be described.

(1) Pixel electrode and auxiliary electrode formation process This process is a process of forming a pixel electrode and an auxiliary electrode on a substrate.
Hereinafter, each member used in this step, and specific pixel electrode and auxiliary electrode forming steps will be described.

(A) Substrate The substrate in this step supports a pixel electrode, an auxiliary electrode, a spacer portion, an organic EL layer, and a transparent electrode layer, which will be described later.

  Since the organic EL display device manufactured in the present invention is a top emission type, the substrate may or may not have light transmittance.

  The substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device. Examples of such a substrate material include glass and resin. A gas barrier layer may be formed on the surface of the substrate.

  The thickness of the substrate is appropriately selected depending on the material of the substrate and the use of the organic EL display device, and is specifically about 0.005 mm to 5 mm.

(B) Pixel electrode The pixel electrode in this step is formed in a pattern on the substrate.
The pixel electrode may or may not have optical transparency, but the organic EL display device manufactured according to the present invention is a top emission type and takes out light from the transparent electrode layer side. Usually, it does not have optical transparency.

The pixel electrode may be either an anode or a cathode.
When the pixel electrode is an anode, it is preferable that the resistance is small, and generally a metal material that is a conductive material is used, but an organic compound or an inorganic compound may be used.
For the anode, a conductive material having a large work function is preferably used so that holes can be easily injected. Examples thereof include metals such as Au, Cr, and Mo; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. It is done. These conductive materials may be used alone or in combination of two or more. When two or more types are used, layers made of each material may be stacked.

When the pixel electrode is a cathode, a metal material that is a conductive material is generally used, but an organic compound or an inorganic compound may be used.
For the cathode, it is preferable to use a conductive material having a low work function so that electrons can be easily injected. Examples thereof include magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, and alloys of alkali metals and alkaline earth metals such as Li, Cs, Ba, Sr, and Ca.

  The thickness of the pixel electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the pixel electrode, and can be set to, for example, about 10 nm to 1000 nm, and preferably about 20 nm to 500 nm. Note that the thickness of the pixel electrode may be the same as or different from the thickness of the auxiliary electrode described later. Note that when the pixel electrode is formed together with an auxiliary electrode described later, the pixel electrode and the auxiliary electrode have the same thickness.

(C) Auxiliary electrode The auxiliary electrode in this process is formed between pixel electrodes.
The auxiliary electrode may or may not have optical transparency.

A metal material that is a conductive material is generally used for the auxiliary electrode. Note that the material used for the auxiliary electrode can be the same as the material used for the pixel electrode, and thus the description thereof is omitted here.
The material used for the auxiliary electrode may be the same as or different from the material used for the pixel electrode. Among these, the pixel electrode and the auxiliary electrode are preferably made of the same material. This is because the pixel electrode and the auxiliary electrode can be formed collectively, and the manufacturing process can be simplified.

  The thickness of the auxiliary electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the auxiliary electrode, and is preferably in the range of 10 nm to 1000 nm, for example, in particular in the range of 20 nm to 500 nm. Is preferred. Note that when the auxiliary electrode is formed together with the above-described pixel electrode, the pixel electrode and the auxiliary electrode have the same thickness.

  The shape when such an auxiliary electrode is observed in the thickness direction of the auxiliary electrode, that is, a planar shape, is a shape that can exhibit the function of the auxiliary electrode to suppress a voltage drop due to the resistance of the transparent electrode layer. The shape is not particularly limited, but is preferably a shape that does not reduce the light extraction efficiency of the organic EL display device. For example, a stripe shape or a lattice shape can be used.

(D) Pixel Electrode and Auxiliary Electrode The distance between the adjacent pixel electrode and auxiliary electrode is not particularly limited as long as a spacer portion described later can be formed. Specifically, it is preferably in the range of 1 μm to 50 μm, and more preferably in the range of 2 μm to 30 μm. Note that the interval between adjacent pixel electrodes and auxiliary electrodes refers to the distance d shown in FIG.

(E) Pixel Electrode and Auxiliary Electrode Forming Step The pixel electrode and auxiliary electrode forming step in the present invention includes a step of first forming a pixel electrode on a substrate. The method for forming the pixel electrode is not particularly limited as long as the pixel electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. For example, the vapor deposition method using a mask, the photolithographic method, etc. are mentioned. Examples of the vapor deposition method include a sputtering method and a vacuum vapor deposition method.

  Next, this step includes a step of forming an auxiliary electrode between the pixel electrodes. The method for forming the auxiliary electrode is not particularly limited as long as the auxiliary electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. A specific method for forming the auxiliary electrode can be the same as the method for forming the pixel electrode, and thus description thereof is omitted here. In this step, it is preferable to form the auxiliary electrode together with the pixel electrode. This is because the manufacturing process can be simplified.

(2) Spacer part formation process This process is a process of forming a spacer part on the substrate.
Hereinafter, the spacer part formed in this process and the concrete spacer part formation process are demonstrated.

(A) Spacer portion The spacer portion formed in this step is formed between the pixel electrode and a contact portion described later, and the organic layer removed by the laser beam in the contact portion forming step described later is scattered. It has the function of the spacer part to prevent this. In addition, when the spacer portion is in contact with the pixel electrode, the spacer portion functions as an insulating layer.

  When the spacer portion has a function as an insulating layer, the insulating layer forming step for forming the insulating layer is simultaneously performed with the main step for forming the spacer portion, and the spacer portion and the insulating layer are collectively formed. Also good. By forming the spacer portion and the insulating layer together, the manufacturing efficiency can be improved. FIGS. 5A to 5B are schematic process diagrams showing an example in which an insulating layer forming process is performed simultaneously with the present process, and a spacer portion and an insulating layer are formed in a lump. FIG. FIG. 6 is a cross-sectional view taken along line AA in FIG. First, as illustrated in FIG. 5A, the pixel electrode 3 and the auxiliary electrode 4 are formed in a frame shape on the substrate 2. Next, as illustrated in FIGS. 5B and 5C, the spacer portion 5 and the insulating layer 13 are collectively arranged so that the pixel electrode 3 and the auxiliary electrode 4 forming the contact portion 9 are exposed. Form. When the spacer part and the insulating layer are formed in a lump, the spacer part and the insulating layer are made of the same material, and the spacer part 5 and the insulating layer 13 are continuous as illustrated in FIG. It may be formed.

In this step, as the number of spacer portions formed between the pixel electrode and a contact portion described later, the function of the spacer portion described above is sufficiently achieved by separating the pixel region where the pixel electrode is formed from the contact portion. If it can be exhibited, it will not be specifically limited, One may be sufficient and two or more may be sufficient.
Here, the number of spacer portions formed between the pixel electrode and a contact portion to be described later is that a stripe-shaped spacer portion is formed in the longitudinal direction between the adjacent pixel electrode and the contact portion. Sometimes refers to the number of stripes formed between the pixel electrode and the contact portion. Therefore, for example, the number of the spacer portions 5 illustrated in FIGS. 6A and 6B is one. FIG. 6 is a schematic view showing an example of the spacer portion formed in this step. FIG. 6A is a schematic plan view when a spacer portion is formed between the pixel electrode and the auxiliary electrode, and FIG. 6B is a cross-sectional view taken along the line BB in FIG. is there. Since the reference numerals not described in FIG. 6 are the same as those in FIG. 1, the description thereof is omitted here.

  The planar shape of the spacer portion formed in this step is not particularly limited as long as it is formed so as to separate the pixel electrode from a contact portion described later. For example, as shown in FIG. As illustrated, the spacer portion 5 may be formed in a stripe shape between the pixel electrode 3 and the contact portion 9 in the auxiliary electrode 4, and as illustrated in FIG. 7A, the contact in the auxiliary electrode 4. The spacer portion 5 may be formed in a frame shape so as to surround the portion 9, or, as illustrated in FIG. 8A, the spacer so as to surround the pixel electrode 3 adjacent to the contact portion 9 in the auxiliary electrode 4. The part 5 may be formed in a frame shape. 7 and 8 are schematic views showing other examples of the spacer portion formed in this step. FIGS. 7A and 8A are schematic plan views when a spacer portion is formed between the pixel region where the pixel electrode is formed and the contact portion of the auxiliary electrode, and FIG. ) Is a cross-sectional view taken along line CC in FIG. 7A, and FIG. 8B is a cross-sectional view taken along line DD in FIG. 8A. The reference numerals not described in FIGS. 7 and 8 are the same as those in FIG.

  In addition, the vertical cross-sectional shape of the spacer portion formed in this step is not particularly limited as long as the function of the spacer portion described above can be exhibited. For example, a forward taper shape, a reverse taper shape, a rectangle and the like can be mentioned, and among them, a forward taper shape is preferable. As illustrated in FIG. 7A and FIG. 8A, a transparent electrode layer described later is uniformly formed on the entire surface even when the spacer portion is formed so as to surround the pixel electrode or the auxiliary electrode. This is because sufficient conduction can be obtained.

As for the height of the spacer portion formed in this step, when the organic EL layer side substrate and the temporary sealing lid material are opposed to each other in the vacuum sealing step described later, the top portion of the spacer portion and the temporary sealing lid Although it will not specifically limit if it is a grade which can arrange | position so that a material may contact through an organic layer, Specifically, it is preferable to exist in the range of 0.1 micrometer-10 micrometers, It is preferably within a range of 0.5 μm to 5 μm, and particularly preferably within a range of 1 μm to 3 μm. When the height of the spacer portion is within the above range, the temporary sealing lid material is bent when the temporary sealing lid material is opposed to the organic EL layer side substrate and sealed under reduced pressure in the vacuum sealing process described later. Thus, it is possible to prevent the problem that the organic EL layer formed on the pixel electrode comes into contact with the organic EL display device and adversely affects the display characteristics of the organic EL display device.
The height of the spacer portion refers to a height h from the bottom surface of the spacer portion 5 to the top portion H as shown in FIG.

  The material used for such a spacer portion is not particularly limited as long as it does not adversely affect the characteristics of the organic EL display device obtained by the present invention. For example, the spacer portion is a pixel electrode. In the case of contact, an insulating material is preferably used as the material of the spacer portion. Problems due to leakage current from the edge portion of the pixel electrode can be prevented. Specific examples of the material include photo-curable resins such as photosensitive polyimide resins and acrylic resins, thermosetting resins, and inorganic materials.

  Furthermore, the spacer part formed in this process may be comprised from the base part and the contact | adherence part formed on the base part. Specifically, as illustrated in FIG. 9, the pedestal portion 11 formed on the substrate 2 and the contact portion 12 formed on the pedestal portion 11 may be configured.

  Since the spacer portion is composed of the pedestal portion and the close contact portion, the height of the spacer portion can be easily adjusted. For example, when a certain wiring layer is formed on the substrate and an insulating layer is formed on the wiring layer, the height of the insulating layer is increased by an amount corresponding to the thickness of the wiring layer. In such a case, the insulating layer is used as a pedestal portion, and a close contact portion is formed on the insulating layer as the pedestal portion, and this is used as a spacer portion, thereby increasing the height of the insulating layer formed on the wiring layer. In addition, it is possible to easily increase the height of the spacer portion constituted by the insulating layer as the pedestal portion and the close contact portion formed on the insulating layer. Further, when the temporary sealing lid member is made to face the organic EL layer side substrate in the vacuum sealing step described later, the spacer portion and the temporary sealing lid member can be brought into contact with each other through the organic layer. Thereby, it is possible to sufficiently exhibit the above-described function as the spacer portion.

When the spacer portion is composed of a pedestal portion and a close contact portion, the size of the pedestal portion is the size between the pixel region and the contact portion, the size and number of close contact portions formed on the pedestal portion. Is appropriately adjusted according to the above. For example, the height of the pedestal is preferably in the range of 0.1 μm to 5 μm, more preferably in the range of 0.5 μm to 3 μm, and particularly in the range of 1 μm to 2 μm. preferable. When the height of the pedestal portion is within the above range, the above-described effect by forming the pedestal portion can be obtained. Note that the height of the pedestal, as shown in FIG. 9 refers to the height h _d from the bottom surface of the base portion 11 to the top.

  In addition, the vertical cross-sectional shape of the pedestal portion is not particularly limited as long as the contact portion can be formed on the pedestal portion. For example, a forward taper shape, a reverse taper shape, a rectangle and the like can be mentioned, and among them, a forward taper shape is preferable. Even when the pedestal portion and the close contact portion are formed so as to surround the pixel electrode or the auxiliary electrode, the transparent electrode layer described later can be uniformly formed on the entire surface, and sufficient conduction can be obtained. It is.

  Furthermore, the material used for the pedestal portion is the same as the material for the spacer portion described above, so description thereof is omitted here.

  On the other hand, the material used for the contact portion can be the same as the material for the spacer portion described above, but in addition, when the pedestal portion is formed of an insulating material, A conductive material can be used.

  About the magnitude | size and number of contact parts, since it can be made to be the same as that of the spacer part mentioned above, description is abbreviate | omitted here.

(B) Spacer part formation process The spacer part formation process in this invention has the process of forming a spacer part between the pixel area | region in which the pixel electrode was formed, and the contact part mentioned later. As a method for forming the spacer portion, a general method such as a lamination method, a photolithography method, or a printing method can be used. Another example is a method in which a spacer portion is separately formed using a mold or the like, and is bonded using an adhesive or the like between the pixel region and the contact portion.

  Further, when the spacer portion is composed of a pedestal portion and a close contact portion, the spacer portion forming step in the present invention forms a pedestal portion between a pixel region where the pixel electrode is formed and a contact portion described later, Forming a contact portion on the pedestal portion; Since the method for forming the pedestal portion and the close contact portion can be the same as the method for forming the spacer portion described above, description thereof is omitted here. In addition, when a base part and a contact | adherence part are comprised from the same material, you may form a base part and a contact | adherence part collectively.

(3) Organic EL layer forming step This step is a step of forming an organic EL layer including a plurality of organic layers and having at least a light emitting layer on the pixel electrode. In this step, at least one organic layer is formed on the entire surface of the auxiliary electrode in the organic EL layer side substrate.
Hereinafter, the organic EL layer formed in this step and a specific organic EL layer forming step will be described.

(A) Organic EL layer As an organic layer which comprises an organic EL layer, a positive hole injection layer, a positive hole transport layer, an electron injection layer, an electron transport layer, etc. other than a light emitting layer are mentioned.
Hereinafter, each organic layer constituting the organic EL layer will be described.

(I) Light-Emitting Layer The light-emitting layer formed in this step may be a monochromatic light-emitting layer or a multi-color light-emitting layer, and is appropriately selected according to the use of the organic EL device. When the organic EL device is a display device, a plurality of color light emitting layers are usually formed.

  The light emitting material used for the light emitting layer may be any material that emits fluorescence or phosphorescence, and examples thereof include dye materials, metal complex materials, and polymer materials. Note that specific pigment materials, metal complex materials, and polymer materials can be the same as those generally used, and thus description thereof is omitted here.

  The thickness of the light-emitting layer is not particularly limited as long as it can provide a function of emitting light by providing a recombination field of electrons and holes, and may be, for example, about 10 nm to 500 nm. it can.

(Ii) Hole Injecting and Transporting Layer As the organic EL layer formed in this step, a hole injecting and transporting layer may be formed between the light emitting layer and the anode.
The hole injection transport layer may be a hole injection layer having a hole injection function, or a hole transport layer having a hole transport function, and the hole injection layer and the hole transport layer are laminated. And may have both a hole injection function and a hole transport function.

  The material used for the hole injecting and transporting layer is not particularly limited as long as it can stabilize the injection and transportation of holes to the light emitting layer, and a general material can be used. .

  The thickness of the hole injecting and transporting layer is not particularly limited as long as the hole injecting function and the hole transporting function are sufficiently exhibited. Specifically, the thickness is in the range of 0.5 nm to 1000 nm, particularly 10 nm to It is preferable to be in the range of 500 nm.

(Iii) Electron Injecting and Transporting Layer As the organic EL layer formed in this step, an electron injecting and transporting layer may be formed between the light emitting layer and the cathode.
The electron injection / transport layer may be an electron injection layer having an electron injection function, may be an electron transport layer having an electron transport function, or may be a laminate of an electron injection layer and an electron transport layer. It may have both an electron injection function and an electron transport function.

The material used for the electron injection layer is not particularly limited as long as it can stabilize the injection of electrons into the light emitting layer, and the material used for the electron transport layer is from the cathode. The material is not particularly limited as long as the injected electrons can be transported to the light emitting layer.
A general material can be used as a specific material used for the electron injection layer and the electron transport layer.

  The thickness of the electron injection / transport layer is not particularly limited as long as the electron injection function and the electron transport function are sufficiently exhibited.

(B) Organic EL layer formation process The organic EL layer formation process in this invention has the process of forming the organic EL layer mentioned above on a pixel electrode. Here, a case where the organic EL layer is laminated in the order of the hole injection transport layer, the light emitting layer, and the electron injection transport layer will be described.
The method for forming the hole injecting and transporting layer is not particularly limited as long as it can be formed on at least the pixel electrode, and is appropriately selected according to the kind of material. For example, a wet process in which a coating solution for forming a hole injection transport layer in which a material or the like is dissolved or dispersed in a solvent is applied, a dry process such as a vacuum deposition method, or the like can be given.
Next, the method for forming the light emitting layer is not particularly limited as long as it can be formed on the hole injecting and transporting layer. For example, a light emitting material or the like is dissolved or dispersed in a solvent. Examples thereof include a wet process for applying a light emitting layer forming coating solution and a dry process such as a vacuum deposition method. Among these, a dry process is preferable because of the influence on the light emission efficiency and life of the organic EL display device.
Next, the method for forming the electron injecting and transporting layer is not particularly limited as long as it can be formed on the light emitting layer, and is appropriately selected according to the type of material. For example, a wet process in which a coating solution for forming an electron injecting and transporting layer in which a material or the like is dissolved or dispersed in a solvent is applied, and a dry process such as a vacuum deposition method is used.

  In the organic EL layer forming step, the organic EL layer is formed, and at least one organic layer constituting the organic EL layer is formed so as to cover the auxiliary electrode. For example, when a light emitting layer is separately applied to each pixel of an organic EL display device, a hole injection transport layer and an electron injection transport layer are formed on the pixel electrode and the auxiliary electrode, and the light emitting layer is patterned on the pixel electrode. Formed. In the case where the organic layer is formed on the pixel electrode and the auxiliary electrode, the organic layer is generally formed continuously on the pixel electrode and the auxiliary electrode.

  In the present invention, for example, a hole injection transport layer, a light emitting layer, and an electron transport layer may be formed in this step, and then an electron injection layer may be formed after a vacuum sealing step and a contact portion formation step described later. . Even if the electron injection layer formed after the vacuum sealing step and the contact portion forming step is formed not only on the pixel electrode but also on the contact portion in the auxiliary electrode, the thickness of the electron injection layer is very thin. This is because the auxiliary electrode and the transparent electrode layer formed by the transparent electrode layer forming step described later can be electrically connected at the contact portion. As described above, when the electron injection layer is formed after the reduced pressure sealing step and the contact portion forming step, deterioration of the electron injection layer due to the reduced pressure sealing step and the contact portion forming step can be prevented, so that it is relatively unstable. It is possible to use a material such as lithium fluoride as a material for the electron injection layer.

2. In the present invention, under the first pressure, the temporary sealing lid material is opposed to the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step, and the top of the spacer portion is the first pressure. It arrange | positions so that the lid | cover material for temporary sealing may contact through the said organic layer, seals the space between the said organic EL layer side board | substrate and the said temporary sealing lid | cover material, and the said organic EL layer side board | substrate surface A reduced-pressure sealing step of sealing with the temporary sealing lid material is performed.
Hereinafter, the temporary sealing lid material used in this step and a specific reduced pressure sealing step will be described.

(1) Temporary sealing lid material The temporary sealing lid material used in this step has a lid substrate and a temporary sealing member formed in a frame shape on the lid substrate.
Hereinafter, description will be given with reference to the drawings.

  FIGS. 3A to 3C are schematic views for explaining a temporary sealing lid member used in this step. The temporary sealing lid member 8 used in this step has a lid substrate 83 and a temporary sealing member 80 formed in a frame shape on the lid substrate 83.

Here, in the above-mentioned temporary sealing lid material, the temporary sealing member formed in a frame shape on the lid substrate is a spacer portion in which the temporary sealing lid material is opposed to the organic EL layer side substrate in this step. The space between the organic EL layer side substrate and the temporary sealing lid material can be entirely sealed when the temporary sealing lid material is placed in contact with the top of the organic EL layer via the organic layer. As long as it is formed in a frame shape, it is not particularly limited. Specifically, as illustrated in FIG. 3A, for example, a temporary sealing member 80 having the same size as the outer periphery of the lid substrate 83 is formed in a frame shape along the edge of the lid substrate 83. As illustrated in FIG. 3B, a temporary sealing member 80 having a size smaller than the outer periphery of the lid substrate 83 is formed in a frame shape along the edge of the edge substrate 83. May be. In addition, when the organic EL layer side substrate is multifaceted, as illustrated in FIG. 3C, temporary sealing is performed in a lattice shape corresponding to the outer periphery of each of the multifaceted organic EL layer side substrates. The member 80 may be formed. In particular, as illustrated in FIG. 3A, it is preferable that the temporary sealing member 80 having the same size as the outer periphery of the lid substrate 83 is formed in a frame shape along the edge of the lid substrate 83. . Thus, by forming the temporary sealing member in a larger frame shape on the lid substrate, the area of the region corresponding to the frame of the temporary sealing member is expanded, and the temporary sealing lid material is temporarily sealed. When the area within the frame defined by the member increases, when the temporary sealing lid is brought into contact with the organic EL layer side substrate, the region where the organic EL element corresponding to the temporary sealing member is formed also increases. It will be.
Hereinafter, each member constituting the temporary sealing lid member will be described.

(A) Lid substrate The lid substrate used for the temporary sealing lid member may be any material that transmits laser light used in the contact portion forming step described later. This is because the organic layer on the auxiliary electrode in the organic EL layer side substrate can be removed by irradiating laser light through the temporary sealing lid member in the contact portion forming step. Further, the lid substrate may be flexible or may not be flexible. Specific examples of the lid substrate include glass film, cycloolefin polymer, polypropylene, polycarbonate, and polyethylene terephthalate. When the lid substrate has flexibility, it is possible to apply the temporary sealing lid material to a roll-to-roll manufacturing technique, which is preferable from the viewpoint of manufacturing efficiency.

The lid substrate used for the temporary sealing lid member preferably has a predetermined barrier property against gas. Since the lid substrate has a predetermined barrier property against the gas, the space between the temporary sealing lid material and the organic EL layer side substrate is sealed under reduced pressure in this step, and then an adhesion step described later and Until the contact portion forming step is performed, the space between the temporary sealing lid member and the organic EL layer side substrate can be maintained in a decompressed state. Therefore, even when the organic layer on the auxiliary electrode is removed by laser light in the contact portion forming step, the adhesion between the temporary sealing lid material and the organic EL layer side substrate can be sufficiently maintained and removed. This is because the organic layer can be prevented from scattering into the pixel region. The barrier property against the gas of the lid substrate is not particularly limited as long as the lid substrate has a barrier property that can exhibit the above-described effects. For example, the oxygen permeability of the lid substrate is It is preferably 100 cc / m ² · day or less, more preferably 30 cc / m ² · day or less, and particularly preferably 15 cc / m ² · day or less.

  As the thickness of the lid substrate, the vacuum state of the space between the organic EL layer side substrate and the temporary sealing lid material is obtained by bonding the organic EL layer side substrate and the temporary sealing lid material in the reduced pressure sealing step. The thickness is not particularly limited as long as the thickness can be maintained. For example, as illustrated in FIG. 1D, a temporary sealing lid member 8 having a temporary sealing member 80 formed on a surface opposite to the side facing the organic EL layer side substrate 1 is used as an organic EL. In the case of bonding to the layer side substrate 1, the thickness is such that the temporary sealing lid 8 can be brought into close contact with the surface of the organic EL layer side substrate 1 by the temporary sealing member 80 through the lid substrate 83. It is preferable. Specifically, it is preferably within the range of 10 μm to 1000 μm, more preferably within the range of 20 μm to 200 μm, and particularly preferably within the range of 30 μm to 100 μm.

(B) Temporary sealing member As a temporary sealing member used for the said lid | cover material for temporary sealing, it can divide into the following aspects according to material. That is, the first aspect in which the temporary sealing member is made of a magnetic material, the second aspect in which the temporary sealing member is made of a metal material, and the third aspect in which the temporary sealing member is made of an adhesive material. .
Hereinafter, the temporary sealing member will be described by dividing it into a first mode to a third mode.

(I) 1st aspect The temporary sealing lid | cover material of this aspect is comprised from a magnetic material. Moreover, when using the temporary sealing member of this aspect, the temporary sealing member is formed in a frame shape on at least one surface of the lid substrate described above. Furthermore, when the temporary sealing lid member having the temporary sealing member of this aspect is used, a metal is provided on the surface of the substrate on the organic EL layer side substrate opposite to the side on which the pixel electrode and the auxiliary electrode are formed. A board is placed.
A usage mode of the temporary sealing lid member using the temporary sealing member of this mode will be described with reference to the drawings.

  10A to 10C are schematic cross-sectional views when a temporary sealing lid member using the temporary sealing member of this embodiment is bonded to the surface of the organic EL layer side substrate. As illustrated in FIGS. 10A to 10C, a temporary sealing lid member 8 using the temporary sealing member 81 of this aspect is bonded to the surface of the organic EL layer side substrate 1 to form an organic EL layer. When the side substrate 1 and the temporary sealing lid 8 are brought into close contact with each other, the metal plate 20 is disposed on the surface of the substrate 2 opposite to the side on which the pixel electrode 3 and the auxiliary electrode 4 are formed. In this way, by disposing the metal plate 20 on the surface of the substrate 2 opposite to the side on which the pixel electrode 3 and the auxiliary electrode 4 are formed, the temporary sealing member 81 made of a magnetic material and the metal plate 20 are arranged. Are adhered by magnetic force through the organic EL layer side substrate 1, and as a result, the organic EL layer side substrate 1 and the temporary sealing lid material 8 can be sufficiently adhered. In addition, about the code | symbol which is not demonstrated in FIG. 10 (a)-(c), since it can be made the same as that of FIG. 1 mentioned above, description here is abbreviate | omitted. The metal plate will be described later in the section “(d) Metal plate”.

  In the case of the conventional vacuum sealing process, as shown in FIGS. 17A to 17B, the organic EL layer 60 on the auxiliary electrode 40 is removed by the laser light L and then the organic EL layer side substrate is covered with the lid. As a means for removing the material 80 ′, a method of cutting the jig body 81 ′ or the jig lid 83 ′ can be considered. However, it can not be said that the method of removing the temporary sealing lid from the organic EL layer side substrate by cutting the jig body, the jig lid, etc. is an advantageous method in terms of production efficiency. On the other hand, when using the temporary sealing lid member having the temporary sealing member of this aspect, the temporary sealing member and the metal plate are brought into close contact with each other by magnetic force through the organic EL layer side substrate. The layer side substrate and the temporary sealing lid material can be sufficiently adhered, and the temporary sealing lid material can be easily peeled from the organic EL layer side substrate.

When the temporary sealing lid member 8 having the temporary sealing member 81 of this aspect is used, the temporary sealing member 81 in the temporary sealing lid member 8 is used as illustrated in FIG. The surface opposite to the formed side may be disposed so as to face the organic EL layer side substrate 1, and temporarily sealed in the temporary sealing lid member 8 as illustrated in FIG. You may arrange | position so that the surface of the side in which the member 81 was formed may oppose the organic electroluminescent layer side board | substrate 1. FIG. In particular, as illustrated in FIG. 10A, the temporary sealing lid 8 is disposed such that the surface opposite to the side on which the temporary sealing member 81 is formed faces the organic EL layer side substrate 1. And preferably used. In the case illustrated in FIG. 10B, the temporary sealing member 81 is formed on the surface on the side facing the organic EL layer side substrate 1 in the temporary sealing lid member 8. Is thicker than the height from the bottom surface to the top surface of the surface of the organic EL layer side substrate 1 from the viewpoint of adhesion between the temporary sealing lid 8 and the organic EL layer side substrate 1. . On the other hand, in the case illustrated in FIG. 10A, the temporary sealing member 81 is formed on the surface opposite to the side facing the organic EL layer side substrate 1 in the temporary sealing lid member 8. Therefore, the temporary sealing member 81 can be formed thicker than the height from the lower bottom surface to the upper bottom surface of the surface of the organic EL layer side substrate 1. That is, the organic EL layer side substrate and the temporary sealing lid member can be brought into close contact with each other with a strong magnetic force corresponding to the thickness of the temporary sealing member. Note that the height of the upper bottom surface from the bottom surface of the organic EL layer side substrate surface refers to t ² shown in Fig. 10 (b), for example.

  Further, when the temporary sealing lid member 8 having the temporary sealing member 81 of this aspect is used, the temporary sealing member 81 is provided in the temporary sealing lid member 8 as illustrated in FIG. The convex member 85 may be provided on the surface opposite to the formed side, that is, the surface facing the organic EL layer side substrate 1. In the case where the temporary sealing lid member 8 has a convex member 85 and the height of the convex member 85 is approximately the same as the height from the lower bottom surface to the upper bottom surface of the surface of the organic EL layer side substrate 1, FIG. As in the case of (b), a glass film having no flexibility can be suitably used as the lid substrate 83. The convex member will be described in the section “(c) convex member” described later.

  Furthermore, the temporary sealing lid member 8 illustrated in FIGS. 10A to 10C has a temporary sealing member 81 formed on any one surface of the lid substrate 83. When the temporary sealing member of the aspect is used, although not illustrated, the temporary sealing member may be formed in a frame shape on both surfaces of the lid substrate. By forming the temporary sealing member in a frame shape on both sides of the lid substrate, the temporary sealing member and the metal plate can be brought into close contact with each other with a stronger magnetic force via the organic EL layer side substrate.

  The material used for the temporary sealing member of the present embodiment is not particularly limited as long as it is a magnetic material generally used as a permanent magnet. For example, a neodymium magnet, a ferrite magnet, a Samacoba magnet, an alnico magnet, Or resin etc. which these magnetic materials were kneaded are mentioned.

As the size of the temporary sealing member of this embodiment, the organic EL layer side substrate is in close contact with the metal plate, and as a result, the organic EL layer side substrate and the temporary sealing lid member can be sufficiently in close contact with each other. If it is a magnitude | size of a grade, it will not specifically limit. For example, the thickness of the temporary sealing member is appropriately adjusted according to the magnetic force of the magnetic material used for the temporary sealing member. For example, the temporary sealing member is formed in the temporary sealing lid material. In the case where it is disposed and used so that the surface on the side facing the organic EL layer side substrate, the thickness of the temporary sealing member and the height from the lower bottom surface to the upper bottom surface of the organic EL layer side substrate surface are approximately the same. It is preferable that Specifically, it is preferably in the range of 1 μm to 1000 μm, more preferably in the range of 10 μm to 700 μm, and particularly preferably in the range of 50 μm to 500 μm. Incidentally, refer to t ¹ shown in FIG. 3 (a) and the thickness of the temporary sealing members here. Further, as the width of the temporary sealing member, as with the thickness of the temporary sealing member, it is appropriately adjusted according to the magnetic force or the like of the magnetic material used for the temporary sealing member. It is preferably within a range of 0.1 mm to 300 mm, more preferably within a range of 5 mm to 100 mm, and particularly preferably within a range of 10 mm to 50 mm. Incidentally, refer to w ¹ shown in FIG. 3 (a) and the width of the temporary sealing members here.

  The method for forming the temporary sealing member of this aspect is not particularly limited as long as it is a method capable of forming the temporary sealing member in a frame shape on the lid substrate described above. For example, a laser patterning method is used. Photolithography method, screen printing method, flexographic printing method, ink jet printing method, offset printing method, gravure printing method, laminating method and the like.

  Further, when the temporary sealing member is formed in a frame shape on the lid substrate, an adhesive layer may be formed between the lid substrate and the temporary sealing member. In addition, about the said adhesion layer, since it can be set as the thing used generally, description here is abbreviate | omitted.

  In addition, the temporary sealing member of this aspect can be reused, after once being used for the lid | cover material for temporary sealing. A method of reusing the temporary sealing member of this aspect will be described in the section of “6. Manufacturing apparatus used for manufacturing method of organic EL display device” described later.

(Ii) Second Aspect The temporary sealing lid member of this aspect is composed of a metal material. Moreover, when using the temporary sealing member of this aspect, the temporary sealing member is formed in a frame shape on at least one surface of the lid substrate described above. Furthermore, when using the temporary sealing lid member having the temporary sealing member of this aspect, a magnetic plate is disposed on one surface of the substrate in the organic EL layer side substrate.
A usage mode of the temporary sealing lid member using the temporary sealing member of this mode will be described with reference to the drawings.

  11 (a) to 11 (c) and FIGS. 12 (a) to 12 (c), when a temporary sealing lid member using the temporary sealing member of this embodiment is bonded to the surface of the organic EL layer side substrate. FIG. The temporary sealing lid member 8 using the temporary sealing member 82 of this aspect is bonded to the surface of the organic EL layer side substrate 1 so that the organic EL layer side substrate 1 and the temporary sealing lid material 8 are adhered to each other. In this case, as illustrated in FIGS. 11A to 11C, the magnetic plate 21 may be disposed on the surface of the substrate 2 opposite to the side on which the pixel electrode 3 and the auxiliary electrode 4 are formed. Alternatively, as illustrated in FIGS. 12A to 12C, the magnetic plate 21 may be disposed on the surface of the substrate 2 on which the pixel electrode 3 and the auxiliary electrode 4 are formed. As described above, by disposing the magnetic plate 21 on one surface of the substrate 2, the temporary sealing member 82 made of a metal material and the magnetic plate 21 are magnetically transmitted through the organic EL layer side substrate 1. As a result, the organic EL layer side substrate 1 and the temporary sealing lid member 8 can be sufficiently adhered. In addition, about the code | symbol which is not demonstrated in FIG.11 (a)-(c), since it can be made the same as that of FIG. 1 mentioned above, description here is abbreviate | omitted. The magnetic plate will be described later in the section “(e) Magnetic plate”.

  Further, in the case of the conventional vacuum sealing step, as described in the section “(i) First aspect”, as a means for removing the temporary sealing lid from the organic EL layer side substrate, a jig body or Although a method of cutting the jig lid can be considered, the above method is disadvantageous in terms of manufacturing efficiency. On the other hand, when using the temporary sealing lid member having the temporary sealing member of this aspect, the temporary sealing member and the magnetic plate are brought into close contact by magnetic force through the organic EL layer side substrate. The layer side substrate and the temporary sealing lid material can be sufficiently adhered, and the temporary sealing lid material can be easily peeled from the organic EL layer side substrate.

  When the temporary sealing lid member 8 having the temporary sealing member 82 of this aspect is used, the temporary sealing member 82 in the temporary sealing lid member 8 is used as illustrated in FIG. The surface opposite to the formed side may be disposed so as to face the organic EL layer side substrate 1, and as illustrated in FIG. You may arrange | position so that the surface by which the member 82 was formed may oppose the organic electroluminescent layer side board | substrate 1. FIG. Among them, as illustrated in FIG. 11A, the temporary sealing lid member 8 is disposed so that the surface opposite to the side on which the temporary sealing member 82 is formed faces the organic EL layer side substrate 1. And preferably used. In addition, since it is the same as that of the content described in the above-mentioned "(i) 1st aspect" about a detailed reason, description here is abbreviate | omitted.

  Further, when the temporary sealing lid member 8 having the temporary sealing member 82 of this aspect is used, the temporary sealing member 82 is provided in the temporary sealing lid member 8 as illustrated in FIG. The convex member 85 may be provided on the surface opposite to the formed side, that is, the surface facing the organic EL layer side substrate 1. In the case where the temporary sealing lid member 8 has a convex member 85 and the height of the convex member 85 is approximately the same as the height from the lower bottom surface to the upper bottom surface of the surface of the organic EL layer side substrate 1, FIG. As in the case of (b), a glass film having no flexibility can be suitably used as the lid substrate 83.

  Furthermore, the temporary sealing lid member 8 illustrated in FIGS. 11A to 11C and FIGS. 12A to 12C are all provided on either side of the lid substrate 83 with the temporary sealing member 82. However, when using the temporary sealing member of this aspect, although not illustrated, the temporary sealing member may be formed in a frame shape on both surfaces of the lid substrate. By forming the temporary sealing member in a frame shape on both surfaces of the lid substrate, the temporary sealing member and the magnetic plate can be brought into close contact with each other with a stronger magnetic force via the organic EL layer side substrate.

  The material used for the temporary sealing member of this embodiment is not particularly limited as long as it is a metal material to which the magnetic material used for the magnetic plate adheres. For example, a general ferromagnetic material can be mentioned. Specifically, iron, an iron alloy, nickel, cobalt, etc. are mentioned.

  As the size of the temporary sealing member of this aspect, the organic EL layer side substrate is in close contact with the magnetic plate, and as a result, the organic EL layer side substrate and the temporary sealing lid member can be sufficiently in close contact with each other. If it is a magnitude | size of a grade, it will not specifically limit. The specific size is the same as the content described in the above-mentioned section “(i) First mode”, and thus the description thereof is omitted here.

  In addition, the method for forming the temporary sealing member of the present embodiment is not particularly limited as long as it is a method capable of forming the temporary sealing member in a frame shape on the lid substrate described above. Law. As a plating method, a commonly used plating method can be used, and specifically, an electrolytic plating method or an electroless plating method that is a wet plating method, a vacuum evaporation method that is a dry plating method, a sputtering method, or a metallicon method. Etc.

  In addition, the temporary sealing member of this aspect can be reused, after once being used for the lid | cover material for temporary sealing. A method of reusing the temporary sealing member of this aspect will be described in the section of “6. Manufacturing apparatus used for manufacturing method of organic EL display device” described later.

(Iii) Third Aspect The temporary sealing lid member of this aspect is composed of an adhesive material. When the temporary sealing member of this aspect is used, the temporary sealing member is formed in a frame shape on the surface of the lid substrate that faces the organic EL layer side substrate.
A usage mode of the temporary sealing lid member using the temporary sealing member of this mode will be described with reference to the drawings.

  FIGS. 13A to 13C are schematic cross-sectional views when a temporary sealing lid member using the temporary sealing member of this aspect is bonded to the surface of the organic EL layer side substrate. When the temporary sealing lid member 8 having the temporary sealing member 84 of this aspect is used, the temporary sealing member in the temporary sealing lid member 8 is exemplified as shown in FIGS. The surface on which 84 is formed is disposed so as to face the organic EL layer side substrate 1. In addition, about the code | symbol which is not demonstrated in FIG. 13 (a)-(c), since it can be made the same as that of FIG. 1 mentioned above, description here is abbreviate | omitted.

As illustrated in FIGS. 13B and 13C, the temporary sealing lid material of this aspect is a surface on the opposite side to the side facing the organic EL layer side substrate 1 in the temporary sealing lid material 8. That is, a magnetic member 86 made of a magnetic material or a metal member 87 made of a metal material may be formed on the surface opposite to the side on which the temporary sealing member 84 is formed. In the case where the temporary sealing lid member of the present aspect includes the magnetic member, adhesion between the temporary sealing lid material and the organic EL layer side substrate can be improved. Also, when removing the temporary sealing lid from the organic EL layer side substrate, a metal plate made of a metal material is brought close to the surface of the temporary sealing lid so that the magnetic properties of the metal plate and the temporary sealing lid By adhering to the member by magnetic force, the temporary sealing lid member can be easily detached from the organic EL layer side substrate. Furthermore, even when the temporary sealing lid member of the present aspect includes the metal member, adhesion between the temporary sealing lid material and the organic EL layer side substrate can be improved. Also, when removing the temporary sealing lid from the organic EL layer side substrate, a magnetic plate made of a magnetic material is brought close to the surface of the temporary sealing lid so that the metal member and magnetic force in the temporary sealing lid By adhering, the temporary sealing lid member can be easily removed from the organic EL layer side substrate.
Note that the material, size, formation method, and the like of the magnetic member used for the temporary sealing lid material of this aspect are the same as those of the temporary sealing member described in the section “(i) First aspect”. In addition, the material, size, formation method, and the like of the metal member used for the temporary sealing lid material according to this aspect can be used for temporary sealing described in the section “(ii) Second aspect”. Since it can be the same as that of a member, description here is abbreviate | omitted.

  As a material used for the temporary sealing member of this aspect, if it is an adhesive material which has adhesiveness of the grade which can carry out temporary sealing of the organic electroluminescent layer side board | substrate and the lid | cover for temporary sealing, it will specifically limit. It is not a thing. For example, a material having an adhesive force in the range of 0.01 N / 25 mm to 5 N / 25 mm is preferable, and in particular, a material having an adhesive force in the range of 0.1 N / 25 mm to 1.0 N / 25 mm. In particular, a material having an adhesive force in the range of 0.1 N / 25 mm to 0.5 N / 25 mm is preferable. Examples of the material having such adhesive strength include polycarbonate resins, polyolefin resins, acrylic resins, urethane resins, silicone resins, polyester resins, and epoxy resins.

As the size of the temporary sealing member of this aspect, the temporary sealing member can be brought into close contact with the organic EL layer side substrate, and as a result, the organic EL layer side substrate and the temporary sealing lid member are sufficiently brought into close contact with each other. The size is not particularly limited as long as the size can be adjusted. Specifically, the thickness of the temporary sealing member is preferably within a range of 0.5 μm to 100 μm, more preferably within a range of 1 μm to 50 μm, and particularly within a range of 2 μm to 20 μm. It is preferable. Incidentally, it refers to t ³ when shown in FIG. 13 (a) and the thickness of the temporary sealing members here. In addition, the width of the temporary sealing member is specifically preferably within a range of 0.1 mm to 300 mm, more preferably within a range of 5 mm to 100 mm, and particularly within a range of 10 mm to 50 mm. It is preferable that Incidentally, refer to w ² shown in FIG. 13 (a) and the width of the temporary sealing members here.

  In addition, the method for forming the temporary sealing member according to this aspect is not particularly limited as long as it is a method capable of forming the temporary sealing member in a frame shape on the lid substrate described above. Examples include a patterning method, a photolithography method, a screen printing method, a flexographic printing method, an ink jet printing method, an offset printing method, and a gravure printing method.

(C) Convex member The temporary sealing lid material used in this step is the temporary sealing member of the first aspect made of a magnetic material or the temporary sealing member of the second aspect made of a metal material. 10 (c) and 11 (c), a convex member 85 is formed in a frame shape on the surface of the lid substrate 83 opposite to the side on which the temporary sealing member 80 is formed. It may be.
Hereinafter, the convex member will be described.

  The material used for the convex member is not particularly limited as long as it can be formed in a frame shape on the lid substrate and does not adversely affect the adhesion between the organic EL layer side substrate and the temporary sealing lid material. It is not a thing. Examples thereof include a thermoplastic resin, a thermosetting resin, an elastomer, a copolymer, an ionomer, a photocurable resin such as an ultraviolet curable resin and an electron beam curable resin, and the like. In addition to the above-described resin, an adhesive material can be used as the material for the convex member. The specific pressure-sensitive adhesive material can be the same as the pressure-sensitive adhesive material used for the temporary sealing member described in the section “(iii) Third aspect”, and thus description thereof is omitted here.

The size of the convex member is not particularly limited as long as the organic EL layer side substrate and the temporary sealing lid material are sufficiently close to each other. For example, the thickness of the convex member is preferably about the same as the height from the lower bottom surface to the upper bottom surface of the organic EL layer side substrate surface, and specifically, within the range of 0.5 μm to 100 μm. In particular, it is preferably in the range of 1 μm to 50 μm, and particularly preferably in the range of 2 μm to 20 μm. Note that the thickness of the projecting member here refers to t ⁴ when shown in FIG. 10 (c), for example. Further, specifically, the width of the convex member is preferably within a range of 0.1 mm to 300 mm, more preferably within a range of 5 mm to 100 mm, and particularly within a range of 10 mm to 50 mm. It is preferable. Incidentally, refer to w ³ shown in FIG. 10 (c) the width of the projecting member here.

  The method for forming the convex member is not particularly limited as long as the convex member can be formed in a frame shape on the lid substrate. For example, a screen printing method, a gravure printing method, a flexographic printing method is used. And a printing method such as an inkjet method, a photolithography method, and a laser drawing method.

(D) Metal plate The temporary sealing lid member used in this step is exemplified in FIGS. 10A to 10C when the temporary sealing member of the first aspect made of a magnetic material is used. In addition, the metal plate 20 is disposed on the surface of the substrate 2 opposite to the side on which the pixel electrode 3 and the auxiliary electrode 4 are formed.
Hereinafter, the metal plate will be described.

  The material used for the metal plate is not particularly limited as long as it is a material that adheres to the temporary sealing member of the first aspect made of a magnetic material by a predetermined magnetic force. For example, a general ferromagnetic material Is mentioned. For example, iron, an iron alloy, nickel, cobalt, etc. are mentioned. In addition to the materials described above, a magnetic material or the like opposite to the magnetic material used for the temporary sealing member of the first aspect can also be used.

  The thickness of the metal plate is not particularly limited as long as the thickness is such that the metal plate is in close contact with the temporary sealing member of the first aspect made of a magnetic material by a predetermined magnetic force. For example, it is preferably in the range of 10 μm to 2000 μm, more preferably in the range of 20 μm to 1000 μm, and particularly preferably in the range of 50 μm to 700 μm.

  The metal plate may be formed on the entire surface of the substrate opposite to the side on which the pixel electrode and the auxiliary electrode are formed, or for temporary sealing facing the organic EL layer side substrate. The cover member may be formed in a frame shape or a pattern shape corresponding to the temporary sealing member formed in a frame shape.

  As a method for forming the metal plate, the metal plate may be formed on the surface of the organic EL layer side substrate, or may be formed separately from the organic EL layer side substrate. The method of forming the metal plate when forming the metal plate on the surface of the substrate in the organic EL layer side substrate is appropriately selected according to the material of the metal plate and the shape of the metal plate, and is not particularly limited. For example, there is a plating method. As a plating method, a commonly used plating method can be used, and specifically, an electrolytic plating method or an electroless plating method that is a wet plating method, a vacuum evaporation method that is a dry plating method, a sputtering method, or a metallicon method. Etc. In addition, as a method for forming a metal plate in the case where the metal plate is formed separately from the organic EL layer side substrate, the method is appropriately selected according to the material of the metal plate and the shape of the metal plate. The method can be used. For example, a metal plate may be formed by cutting a commercially available metal plate into a predetermined size or shape.

(E) Magnetic plate The temporary sealing lid material used in this step is shown in FIGS. 11 (a) to 11 (c) and FIG. 12 when the temporary sealing member of the second aspect made of a metal material is used. As illustrated, the magnetic plate 21 is disposed on one surface of the substrate 2. In addition, about the code | symbol which is not demonstrated in FIG. 12, since it can be the same as that of FIG. 1 mentioned above, description here is abbreviate | omitted.
Hereinafter, the magnetic plate will be described.

  The material used for the magnetic plate is not particularly limited as long as it is a material that is in close contact with the sealing member of the second aspect made of a metal material by a predetermined magnetic force. For example, a neodymium magnet, a ferrite magnet, Examples of the magnet include magnets, alnico magnets, and resins in which these magnetic materials are kneaded.

  Further, when a magnetic material having conductivity is used among the above materials used for the magnetic plate, the magnetic plate is the pixel electrode 3 and the auxiliary electrode 4 on the substrate 2 as illustrated in FIGS. 11A to 11C. It is arrange | positioned on the surface on the opposite side to the side in which was formed. Thereby, it is possible to prevent a short circuit from occurring between the pixel electrode and the auxiliary electrode due to the magnetic plate. On the other hand, when the material used for the magnetic plate is a magnetic material having no electrical conductivity, the pixel electrode 3 and the auxiliary electrode 4 are formed on the substrate 2 as illustrated in FIGS. It may be disposed on the surface opposite to the formed side, or may be disposed on the surface of the substrate 2 on which the pixel electrode 3 and the auxiliary electrode 4 are formed, as illustrated in FIG. Good.

  The thickness of the magnetic plate is not particularly limited as long as the magnetic plate can be bonded to the temporary sealing member of the second aspect made of a metal material by a predetermined magnetic force. In addition, about the specific thickness of a magnetic board, since it can be made to be the same as that of the metal plate mentioned above, description here is abbreviate | omitted.

  The magnetic plate may be formed on the entire surface of the substrate opposite to the side on which the pixel electrode and the auxiliary electrode are formed, or for temporary sealing facing the organic EL layer side substrate. The cover member may be formed in a frame shape or a pattern shape corresponding to the temporary sealing member formed in a frame shape.

  As a method for forming the magnetic plate, the magnetic plate may be formed on the surface of the organic EL layer side substrate, or may be formed separately from the organic EL layer side substrate. The method of forming the metal plate when forming the magnetic plate on the surface of the substrate in the organic EL layer side substrate is appropriately selected according to the material used for the magnetic plate and the shape of the magnetic plate. As a specific forming method, a method similar to the forming method of the metal plate can be used, and description thereof is omitted here.

(2) Depressurization sealing process The depressurization sealing process in this invention is the above-mentioned, with the first sealing member facing the organic EL layer side substrate obtained in the organic EL layer side substrate preparation process with the temporary sealing lid material facing. It arrange | positions so that the said lid | cover for temporary sealing may contact via the said organic layer on the top part of a spacer part, the space between the said organic EL layer side board | substrate and the said lid | cover for temporary sealing is sealed, and the said organic In this step, the surface of the EL layer side substrate is sealed with the temporary sealing lid material.

  Specific examples of a method for performing such a process include the following methods. That is, first, in a vacuum chamber set to a predetermined degree of vacuum that is the first pressure, an organic EL layer side substrate having a sealant formed on the outer peripheral portion and a temporary sealing lid member are arranged to face each other. A method of sealing the space between the organic EL layer side substrate and the temporary sealing lid member by bringing the organic EL layer side substrate and the temporary sealing lid member into contact with each other, or a vacuum set to the first pressure In the chamber, a method of sealing the space between the organic EL layer side substrate and the temporary sealing lid member using a jig or the like can be mentioned.

The space between the organic EL layer side substrate sealed under reduced pressure and the temporary sealing lid material in this step has a predetermined degree of vacuum that is the first pressure. Specifically, by adjusting the outer peripheral space of the organic EL layer side substrate and the temporary sealing lid material to the second pressure in the adhesion step described later, the organic EL layer side substrate and the temporary sealing lid material are adjusted. A pressure difference is generated between the space between the organic EL layer side substrate and the outer peripheral space of the temporary sealing lid material, and the organic EL layer side substrate and the temporary sealing lid material are sufficiently adhered to each other. Although it is not particularly limited as long as it can prevent the dust of the organic layer removed by the laser light in the contact portion forming step, which will be described later, from scattering into the pixel region, the value of the degree of vacuum is as large as possible That is, it is preferable that the pressure value of the space between the organic EL layer side substrate and the temporary sealing lid member is as small as possible. Especially, in this process, it is preferable that the space between the organic EL layer side substrate and the temporary sealing lid member is a vacuum space. The specific degree of vacuum is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ⁴ Pa, and more preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ³ Pa. In particular, it is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ² Pa.

3. Adhering Step In the present invention, the space on the outer periphery of the organic EL layer side substrate and the temporary sealing lid member sealed in the reduced pressure sealing step is adjusted to a second pressure to adjust the organic EL layer side substrate and the temporary substrate. An adhesion process is performed in which the sealing lid is adhered.
Hereinafter, a specific adhesion process will be described.

  In this step, the organic EL layer side substrate is adjusted by adjusting the space on the outer periphery of the organic EL layer side substrate and the temporary sealing lid member sealed under the first pressure to the second pressure in the above-described reduced pressure sealing step. And the organic EL layer side substrate and the temporary sealing lid material by generating a differential pressure between the space between the temporary sealing lid material and the outer space of the organic EL layer side substrate and the temporary sealing lid material. Is a step of closely adhering.

  As a method of adjusting the outer peripheral space of the organic EL layer side substrate and the temporary sealing lid material to the second pressure, the space between the organic EL layer side substrate and the temporary sealing lid material, the organic EL layer side substrate, Although it is not particularly limited as long as it is a method capable of generating a differential pressure between the space around the temporary sealing lid material and bringing the organic EL layer side substrate and the temporary sealing lid material into close contact with each other. For example, the following methods are mentioned. That is, by exposing the organic EL layer side substrate and the temporary sealing lid material sealed in the vacuum chamber to the normal pressure space, the outer peripheral space of the organic EL layer side substrate and the temporary sealing lid material is normal pressure. And a method of sealing the space between the organic EL layer side substrate and the temporary sealing lid member in the vacuum chamber and then injecting a gas into the vacuum chamber for pressurization. In addition, as said "normal pressure space" in the case of performing an adhesion process by exposing the organic EL layer side substrate and the temporary sealing lid material to a normal pressure space, from the viewpoint of suppressing deterioration of the organic EL display element, For example, the space is preferably a space filled with an inert gas such as nitrogen or argon having an oxygen concentration and a water concentration of at least 1 ppm or less.

  The “second pressure” is a pressure higher than the first pressure in the vacuum sealing step, and the temporary sealing lid material is brought into close contact with the organic EL layer side substrate by the differential pressure between the first pressure and the second pressure. For example, the second pressure is preferably 100 Pa or higher than the first pressure, more preferably 1000 Pa or higher, and particularly preferably 10,000 Pa or higher. preferable. When the differential pressure between the second pressure and the first pressure is greater than or equal to the above numerical value, the temporary sealing lid member can be sufficiently adhered to the organic EL layer side substrate.

4). Contact part forming step In the present invention, contact part formation for forming the contact part by removing the organic layer formed on the auxiliary electrode by irradiating laser light through the temporary sealing lid material. Perform the process.
Hereinafter, the contact part formed in this process and the specific contact part formation process are demonstrated.

(1) Contact part The contact part formed in this process is an area | region where an auxiliary electrode and the transparent electrode layer mentioned later contact.

  The planar shape of the contact portion formed in this step is not particularly limited as long as it is a planar shape capable of sufficiently sufficiently connecting a transparent electrode layer and an auxiliary electrode described later. , Rectangular and circular.

  Moreover, the aspect of the contact portion is not particularly limited as long as it can electrically connect a transparent electrode layer and an auxiliary electrode described later sufficiently. FIGS. 14A to 14C are schematic views for explaining an aspect of the contact portion formed in this step. A specific mode of the contact portion 9 is a mode in which at least one organic layer 6 formed on the auxiliary electrode 4 is removed in a stripe shape as shown in FIG. Alternatively, as shown in FIG. 14B, an embodiment in which an opening is provided in at least one organic layer 6 formed on the auxiliary electrode 4 may be used. As shown in FIG. 3, the organic layer 6 formed on the auxiliary electrode 4 may be provided with a plurality of openings.

(2) Contact part formation process The contact part formation process in this invention forms a contact part mentioned above by removing the organic layer which irradiates a laser beam via the cover material for temporary sealing, and covers an auxiliary electrode. Process. In addition, when using the method of making gas flow into a vacuum chamber and pressurizing as the contact | adherence process mentioned above, this process can be performed by the following methods, for example. That is, a contact portion is formed by irradiating a laser beam through a laser beam transmitting window or the like installed in a vacuum chamber composed of a transparent substrate such as glass and removing the organic layer covering the auxiliary electrode. Is the method.

As the laser beam used in this step, any laser light that can pass through the temporary sealing lid material and cover the auxiliary electrode when irradiated through the temporary sealing lid material can be used. There is no particular limitation, and laser light generally used in a method for removing an organic layer by laser light can be employed. Examples of the laser light include YAG, Ar ions, He—Ne, KrF, and a carbon laser (CO ₂ laser).

5. Transparent electrode layer forming step In the present invention, a transparent electrode layer forming step of forming a transparent electrode layer on the organic EL layer and the contact portion is performed so as to be electrically connected to the auxiliary electrode at the contact portion. .
Hereinafter, the transparent electrode layer formed in this step and a specific transparent electrode layer forming step will be described.

(1) Transparent electrode layer The transparent electrode layer in this process is formed on the organic EL layer side substrate.

  The said transparent electrode layer should just have transparency and electroconductivity, for example, a metal oxide is mentioned. Specific examples of the metal oxide include indium tin oxide, indium oxide, indium zinc oxide, zinc oxide, and stannic oxide. In addition, metal materials such as magnesium-silver alloy, aluminum, and calcium can also be used when forming a film thin enough to have light transmittance.

(2) Transparent electrode layer formation process The transparent electrode layer formation process in this invention peels off the temporary sealing lid | cover material closely_contact | adhered to the organic EL layer side board | substrate in the said contact | adherence process, and the said auxiliary electrode and the said contact part And forming a transparent electrode layer on the organic EL layer and the contact portion so as to be electrically connected.

  The method for peeling the temporary sealing lid material from the surface of the organic EL layer side substrate is appropriately selected according to the configuration of the temporary sealing lid material, and is not particularly limited. For example, when a temporary sealing member made of a magnetic material or a metal material is formed on the surface opposite to the surface facing the organic EL layer side substrate of the temporary sealing lid material, the temporary sealing lid material There is a method in which a metal plate or a magnetic plate is brought close to and the temporary sealing lid member is peeled off from the organic EL layer side substrate by magnetic force. In addition to this, there is a method of peeling the temporary sealing lid member from the organic EL layer side substrate by a physical method using a peeler or the like.

  As a method for forming the transparent electrode layer, a general electrode forming method can be used, for example, a PVD method such as a vacuum deposition method, a sputtering method, an EB deposition method, an ion plating method, or a CVD method. be able to.

6). Other Steps The present invention is not particularly limited as long as it has the steps described above, and may have other steps. As another process, the sealing process which seals an organic EL display device with a sealing substrate is mentioned, for example.
Hereinafter, the sealing substrate will be described.

Since the organic EL display device in the present invention is a top emission type, the sealing substrate has light transmittance. The light transmittance of the sealing substrate only needs to be transparent to the wavelength in the visible light region. Specifically, the light transmittance for the entire wavelength range in the visible light region is 80% or more. Of these, 85% or more, particularly 90% or more is preferable.
Here, the light transmittance can be measured by, for example, an ultraviolet-visible light spectrophotometer UV-3600 manufactured by Shimadzu Corporation.

  Further, the sealing substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device.

The material of the sealing substrate is not particularly limited as long as a light-transmitting sealing substrate can be obtained. For example, inorganic materials such as quartz and glass, acrylic resin, and COP are used. Examples thereof include resins such as cycloolefin polymer, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyimide, polyamideimide, polyethersulfone, polyetherimide, and polyetheretherketone.
A gas barrier layer may be formed on the surface of the resin sealing substrate.

  The thickness of the sealing substrate is appropriately selected depending on the material of the sealing substrate and the use of the organic EL device. Specifically, the thickness of the sealing substrate is about 0.001 mm to 5 mm.

7). Manufacturing device used for manufacturing method of organic EL display device As a manufacturing device used for the manufacturing method of the organic EL display device of the present invention, an organic EL layer side substrate preparing step, a vacuum sealing step, an adhesion step, and a contact portion forming step If it is a manufacturing apparatus which can perform, it will not specifically limit.
Hereinafter, a manufacturing apparatus used in the method for manufacturing an organic EL display device of the present invention will be described with reference to the drawings.

  FIG. 15 is a configuration diagram showing an example of a manufacturing apparatus used in the method for manufacturing an organic EL display device of the present invention. As illustrated in FIG. 15, the manufacturing apparatus used in the method for manufacturing an organic EL display device of the present invention has the following configuration. That is, first, an organic EL layer side substrate forming apparatus for forming an organic EL layer side substrate is provided. Next, a temporary sealing lid material forming apparatus for forming a temporary sealing lid material is provided, and the organic EL layer side substrate and the temporary sealing lid material are bonded together in this apparatus. The organic EL layer side substrate and the temporary sealing lid member are bonded together in a chamber. Then, it has the reduced pressure sealing device which carries out the pressure reduction sealing of the space between the organic EL layer side board | substrate and the lid | cover for temporary sealing. In this apparatus, the inside of the chamber in which the organic EL layer side substrate and the temporary sealing lid member are arranged is adjusted to the first pressure, and the space between the organic EL layer side substrate and the temporary sealing lid member is sealed. Is done. Next, it has a laser beam irradiation apparatus which irradiates a laser beam to the organic layer on the auxiliary electrode in the organic EL layer side substrate from the temporary sealing lid material side. In this apparatus, the organic EL layer side substrate sealed under reduced pressure by the temporary sealing lid member is taken out from the chamber, or the chamber is adjusted to a normal pressure atmosphere to thereby provide the organic EL layer side substrate and the temporary sealing. The outer space of the cover material is adjusted to the second pressure, and a difference is provided between the pressure of the space between the organic EL layer side substrate and the temporary sealing cover material and the pressure of the outer space. Finally, it has a transparent electrode layer forming apparatus that peels the temporary sealing lid from the organic EL layer side substrate and forms a transparent electrode layer on the surface of the organic EL layer side substrate. Thus, the manufacturing apparatus used for the manufacturing method of an organic EL display device has each structure in the order shown by the solid line arrow in FIG.

  Moreover, when the lid | cover for temporary sealing used for manufacture of an organic electroluminescence display is the temporary sealing member of the 1st aspect which consists of magnetic materials, or it is the temporary sealing member of the 2nd aspect which consists of metal materials. In such a case, the temporary sealing member can be reused. In this case, it further has the following configuration. That is, for example, as indicated by a broken line arrow in FIG. 15, when the organic EL layer side substrate is transported from the laser light irradiation device to the transparent electrode layer forming device, the temporary sealing lid peeled off from the organic EL layer side substrate A temporary sealing member collecting device for separating the material into a lid substrate and a temporary sealing member and collecting the temporary sealing member; The temporary sealing member recovered by this apparatus is transported to the temporary sealing lid member forming apparatus as indicated by the broken line arrow in FIG. 15, and is used again to form the temporary sealing lid member. It is done.

  Here, as a method of separating the temporary sealing lid material into the lid substrate and the temporary sealing member and recovering the temporary sealing member, for example, the lid substrate and the temporary sealing member are separated and temporarily sealed. Examples thereof include a method for collecting the member, a method for removing the lid substrate by washing, and a method for collecting the temporary sealing member.

B. Temporary sealing lid material The temporary sealing lid material of the present invention is used in the manufacturing method as described above.
Examples of such a temporary sealing lid member include the following fourth to sixth aspects.

  First, the temporary sealing lid member according to the fourth aspect includes a lid substrate and a frame-shaped temporary sealing member formed on at least one surface of the lid substrate. It is characterized by comprising a magnetic material. In addition, about the lid | cover for temporary sealing of a 4th aspect, the 1st aspect as described in the above-mentioned item of "A. Manufacturing method of an organic EL display device 2. Vacuum sealing step (1) Temporary sealing lid". Therefore, the description is omitted here.

  Next, the temporary sealing lid member according to the fifth aspect includes a lid substrate and a frame-shaped temporary sealing member formed on at least one surface of the lid substrate, and the temporary sealing member Is made of a metal material. In addition, about the lid | cover for temporary sealing of a 5th aspect, the 2nd aspect as described in the above-mentioned item of "A. Manufacturing method of an organic EL display device 2. Vacuum sealing step (1) Temporary sealing lid". Therefore, the description is omitted here.

  Furthermore, the lid material for temporary sealing of the sixth aspect includes a lid substrate and a frame-shaped temporary sealing member on one surface of the lid substrate, and the temporary sealing member is made of an adhesive material. It is characterized by being comprised. In addition, about the lid | cover material for temporary sealing of a 6th aspect, the 3rd aspect as described in the term of the said "A. Manufacturing method of an organic EL display device 2. Pressure reduction sealing process (1) Temporary sealing lid material". Therefore, the description is omitted here.

  Since the temporary sealing lid material of the present invention can be used in the above-described method for manufacturing an organic EL display device, it is possible to suppress a decrease in display characteristics, and further, an increase in manufacturing cost and a decrease in manufacturing efficiency. An organic EL display device that can be prevented can be obtained.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be specifically described with reference to examples.

(Pixel electrode and auxiliary electrode formation process)
A pixel electrode was formed by forming a chromium film with a thickness of 150 nm in a pattern on a substrate made of alkali-free glass with a thickness of 0.7 mm. Thereafter, a chromium film having a thickness of 150 nm was formed between the pixel electrodes in a stripe shape to form an auxiliary electrode.

(Spacer formation process)
Next, a spacer portion was formed by a photolithography method between the pixel electrode and the region where the contact portion is formed in the auxiliary electrode. The planar shape of the spacer portion was a frame shape, and the vertical cross-sectional shape was a forward tapered shape. The height of the spacer portion was 1.5 μm.

(Organic EL layer formation process)
Next, a 0.1 μm hole injection layer was formed on the pixel electrode. Next, a 0.3 μm light emitting layer was formed on the hole injection layer. Thereafter, an electron transport layer having a thickness of 0.3 μm was formed on the light emitting layer to obtain an organic EL layer. In this step, an organic EL layer was formed on the pixel electrode and also formed on the auxiliary electrode.

  In this way, an organic EL layer side substrate was formed.

(Reduced pressure sealing process and adhesion process)
Subsequently, the organic EL layer side substrate obtained by the above process is placed in a vacuum chamber having a degree of vacuum set to 50 Pa, and a temporary sealing lid is adhered to the surface of the organic EL layer side substrate. It was. The temporary sealing lid material used at this time satisfies the conditions shown in Table 1 below.

  As in Example 1 and Examples 3 to 9 shown in Table 1, when a temporary sealing lid member having a temporary sealing member made of a magnetic material is used, the thickness of the organic EL layer side substrate is on the substrate side. A metal plate made of a 50 μm Fe—Ni alloy was disposed. Further, when a temporary sealing lid member having a temporary sealing member made of a metal material is used as in Example 2 and Examples 10 to 16, neodymium having a magnetic force of 200 mT on the substrate side of the organic EL layer side substrate. A magnetic plate made of a magnet was disposed.

  Thus, after the organic EL layer side substrate and the temporary sealing lid material are sealed under reduced pressure in the vacuum chamber, nitrogen gas is allowed to flow into the vacuum chamber to bring the chamber into a normal pressure state. The layer side substrate and the lid for temporary sealing were adhered.

  In Table 1 above, an acrylic adhesive material was used for the member III in the temporary sealing lid member. Tensilon STA-1150 manufactured by Orientec was used for the adhesive strength of the adhesive material. The measurement was carried out by performing 90 ° peeling at a peeling speed of 300 mm / sec under the conditions of a temperature of 24 ° C. and a humidity of 35%.

(Contact part formation process)
Next, an organic EL layer that covers the auxiliary electrode by irradiating one shot of YAG laser light having an energy density of 500 mJ / cm ² , a spot diameter of 10 μmφ, a wavelength of 355 nm, and a pulse width of 5 nsec through a temporary sealing lid Then, the auxiliary electrode was exposed to form a contact portion.

(Electron injection layer forming process)
After forming the contact portion, the temporary sealing lid material is removed from the surface of the organic EL layer side substrate, and lithium fluoride is formed on the organic EL layer side substrate by a vacuum deposition method so as to have a film thickness of 0.5 nm. An electron injection layer was formed.

(Transparent electrode layer forming process)
Then, the lid for temporary sealing is peeled off, and calcium is formed to a thickness of 10 nm and aluminum is formed to a thickness of 5 nm so as to be electrically connected to the auxiliary electrode exposed through the electron injection layer at the contact portion. A film was formed by vacuum evaporation to form a transparent electrode layer.

  In this way, an organic EL display device was produced.

(Evaluation)
1. Adhesiveness It evaluated about what adhesiveness the temporary sealing lid | cover material closely_contact | adhered with the organic electroluminescent layer side board | substrate in the pressure reduction sealing process had in the contact part formation process. Specifically, when the organic EL layer side substrate with the temporary sealing lid material adhered to the surface is tilted, the temporary sealing lid material adheres without being displaced from the organic EL layer side substrate. A ”, when the temporary sealing lid material was displaced from the organic EL layer side substrate, it was evaluated as“ B ”.

2. Sealing property Next, how much sealing property the space between the organic EL layer side substrate sealed under reduced pressure in the reduced pressure sealing step and the temporary sealing lid material has in the contact portion forming step. Was evaluated. Specifically, when the organic layer removed by the laser beam in the contact portion forming step is prevented from scattering to the pixel region and the deterioration of display characteristics can be prevented, “A” is formed. If the organic layer removed by the laser beam in the process is slightly scattered in the pixel area, but the deterioration of the display characteristics can be prevented, “B”, the organic removed by the laser beam in the contact part forming step When the layer was scattered in the pixel area and the display characteristics deteriorated, it was evaluated as “C”.
The evaluation results are shown in Table 2.

  In Examples 1 to 23 in which the temporary sealing lid member used in the reduced pressure sealing step was constituted by the lid substrate and the temporary sealing member, the evaluation of adhesion was “A”. On the other hand, in the comparative example using the lid member having no temporary sealing member, the adhesion evaluation was “B”. From the above, by using the temporary sealing lid material composed of the lid substrate and the temporary sealing member, the adhesion between the organic EL layer side substrate and the temporary sealing lid material is improved, and the contact portion is formed. It was found that the space between the organic EL layer side substrate and the temporary sealing lid member can be sufficiently sealed under reduced pressure during the process.

Further, in Examples 1 to 23 in which the temporary sealing lid member was constituted by the lid substrate and the temporary sealing member, the evaluation of the sealing performance was “A” or “B”. On the other hand, in the comparative example using the lid member having no temporary sealing member, the evaluation of the sealing property was “C”. From the above, by using the temporary sealing lid material composed of the lid substrate and the temporary sealing member, the space between the organic EL layer side substrate and the temporary sealing lid material in the contact portion forming step. It has been found that the sealing properties can be improved, and deterioration of display characteristics due to scattering of the organic layer removed by the laser light to the pixel region can be prevented.
Furthermore, when Example 1 and Example 3 or Example 2 and Example 10 are compared, compared with the case where the lid | cover for temporary sealing has only the member II, the lid | cover for temporary sealing is the member II and member. It turned out that the case where it has all of III can improve the sealing performance of the space between the organic EL layer side board | substrate and the lid | cover for temporary sealing in a contact part formation process more. From the above, it has been found that in the present invention, it is more preferable to use a temporary sealing lid member composed of a lid substrate, a temporary sealing member, and a convex member.
Furthermore, when the temporary sealing lid member has the member III made of an adhesive material, the adhesive material has an adhesive force of 0.1 N or more compared to Example 17 in which the adhesive force of the adhesive material is 0.01 N. In Examples 18 to 23, the sealing property of the space between the organic EL layer side substrate and the temporary sealing lid member in the contact portion forming step could be improved. From the above, when the temporary sealing lid member has a temporary sealing member made of an adhesive material, an organic EL layer in the contact portion forming step can be obtained by using an adhesive material that uses a predetermined adhesive force. It has been found that the sealing property between the side substrate and the temporary sealing lid material can be improved, and the display characteristics can be prevented from being deteriorated due to the organic layer removed by the laser light scattered in the pixel region.

DESCRIPTION OF SYMBOLS 1 ... Organic EL layer side board | substrate 2 ... Board | substrate 3 ... Pixel electrode 4 ... Auxiliary electrode 5 ... Spacer part 6 ... Organic layer 7 ... Transparent electrode layer 8 ... Temporary sealing lid | cover material 80 ... Temporary sealing member 83 ... Cover substrate 9 ... Contact part 100 ... Top emission type organic EL display device

Claims (7)

A substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, a spacer portion formed on the substrate, and a plurality of pixel electrodes formed on the pixel electrode, An organic electroluminescence layer composed of an organic layer and having at least a light emitting layer, at least one organic layer formed on the auxiliary electrode, and an opening of the organic layer formed on the auxiliary electrode A contact portion, and the organic electroluminescence layer and a transparent electrode layer formed on the contact portion, and the spacer portion is formed between the contact portion and the pixel electrode adjacent to the contact portion. In addition, the transparent electrode layer manufactures a top emission type organic electroluminescence display device that is electrically connected to the auxiliary electrode at the contact portion. Tsu A method of manufacturing a flop emission organic electroluminescent display device,
An organic electroluminescence layer side substrate having the substrate, the pixel electrode, the auxiliary electrode, the spacer portion, and the organic electroluminescence layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic electroluminescence layer side substrate preparation step to be prepared;
Under the first pressure, the temporary sealing lid is placed on the top of the spacer portion with the temporary sealing lid facing the organic electroluminescence layer side substrate obtained in the organic electroluminescence layer side substrate preparation step. Is arranged so as to be in contact with each other through the organic layer, and the space between the organic electroluminescence layer side substrate and the temporary sealing lid member is sealed, and the surface of the organic electroluminescence layer side substrate is temporarily sealed. A reduced-pressure sealing process for sealing with a cover material;
The organic electroluminescence layer side substrate and the temporary sealing lid material are adjusted by adjusting the space around the organic electroluminescence layer side substrate and the temporary sealing lid material sealed in the reduced pressure sealing step to a second pressure. An adhesion process for adhering
A contact part forming step of forming the contact part by irradiating a laser beam through the temporary sealing lid member, removing the organic layer formed on the auxiliary electrode, and
The method of manufacturing a top emission type organic electroluminescence display device, wherein the temporary sealing lid member includes a lid substrate and a temporary sealing member formed in a frame shape on the lid substrate. The temporary sealing lid material has the frame-shaped temporary sealing member formed on at least one surface of the lid substrate,
The temporary sealing member is made of a magnetic material,
2. The top emission organic electroluminescence display device according to claim 1, wherein a metal plate is disposed on a surface of the substrate opposite to the side on which the pixel electrode and the auxiliary electrode are formed. 3. Method. The temporary sealing lid material has the frame-shaped temporary sealing member formed on at least one surface of the lid substrate,
The temporary sealing member is made of a metal material,
2. The method of manufacturing a top emission type organic electroluminescence display device according to claim 1, wherein a magnetic plate is disposed on any one surface of the substrate. The temporary sealing lid material has a frame-shaped temporary sealing member formed on the surface of the lid substrate on the side facing the organic electroluminescence layer side substrate,
The method of manufacturing a top emission type organic electroluminescence display device according to claim 1, wherein the temporary sealing member is made of an adhesive material. A lid substrate;
A frame-like temporary sealing member formed on at least one surface of the lid substrate;
The temporary sealing member is made of a magnetic material. A lid substrate;
A frame-like temporary sealing member formed on at least one surface of the lid substrate;
The said temporary sealing member is comprised from the metal material, The lid | cover material for temporary sealing characterized by the above-mentioned. A lid substrate;
A frame-like temporary sealing member formed on any one surface of the lid substrate;
The temporary sealing member is made of a pressure-sensitive adhesive material.

Images