JP4780983B2 - Organic EL device manufacturing method - Google Patents

Organic EL device manufacturing method Download PDF

Info

Publication number
JP4780983B2
JP4780983B2 JP2005076760A JP2005076760A JP4780983B2 JP 4780983 B2 JP4780983 B2 JP 4780983B2 JP 2005076760 A JP2005076760 A JP 2005076760A JP 2005076760 A JP2005076760 A JP 2005076760A JP 4780983 B2 JP4780983 B2 JP 4780983B2
Authority
JP
Japan
Prior art keywords
substrate
chamber
cooling
organic
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005076760A
Other languages
Japanese (ja)
Other versions
JP2006260939A (en
Inventor
功二 羽根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2005076760A priority Critical patent/JP4780983B2/en
Priority to TW095107065A priority patent/TWI406442B/en
Priority to KR1020060024554A priority patent/KR101229595B1/en
Priority to CNA2006100596744A priority patent/CN1835258A/en
Publication of JP2006260939A publication Critical patent/JP2006260939A/en
Application granted granted Critical
Publication of JP4780983B2 publication Critical patent/JP4780983B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01F—PROCESSING OF HARVESTED PRODUCE; HAY OR STRAW PRESSES; DEVICES FOR STORING AGRICULTURAL OR HORTICULTURAL PRODUCE
    • A01F25/00—Storing agricultural or horticultural produce; Hanging-up harvested fruit
    • A01F25/16—Arrangements in forage silos
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23B—PRESERVING, e.g. BY CANNING, MEAT, FISH, EGGS, FRUIT, VEGETABLES, EDIBLE SEEDS; CHEMICAL RIPENING OF FRUIT OR VEGETABLES; THE PRESERVED, RIPENED, OR CANNED PRODUCTS
    • A23B9/00—Preservation of edible seeds, e.g. cereals
    • A23B9/08—Drying; Subsequent reconstitution
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E04B1/7608—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only comprising a prefabricated insulating layer, disposed between two other layers or panels
    • E04B1/7612—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only comprising a prefabricated insulating layer, disposed between two other layers or panels in combination with an air space

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Architecture (AREA)
  • Physics & Mathematics (AREA)
  • Zoology (AREA)
  • Chemical & Material Sciences (AREA)
  • Food Science & Technology (AREA)
  • Polymers & Plastics (AREA)
  • Wood Science & Technology (AREA)
  • Acoustics & Sound (AREA)
  • Environmental Sciences (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Description

本発明は、真空中で有機ＥＬ素子を製造する技術に関し、特に成膜対象物である基板と成膜用のマスクを位置合わせする技術に関する。   The present invention relates to a technique for manufacturing an organic EL element in a vacuum, and more particularly to a technique for aligning a substrate that is a film formation target and a film formation mask.

一般に、有機ＥＬ素子を製造する際には、有機ＥＬ素子の発光輝度の低下を防止するため、透明電極付き基板に対し、加熱冷却処理及びプラズマ処理による前処理を行っている。   Generally, when manufacturing an organic EL element, in order to prevent a decrease in light emission luminance of the organic EL element, pretreatment by heating and cooling treatment and plasma treatment is performed on the substrate with a transparent electrode.

しかし、従来技術にあっては、大気圧中で基板の加熱及び冷却を行っているため、基板を真空中に配置したときに基板が汚染された状態になっているという問題があった。   However, in the prior art, since the substrate is heated and cooled at atmospheric pressure, there is a problem that the substrate is contaminated when the substrate is placed in a vacuum.

また、従来技術では、加熱処理及びプラズマ処理の際に基板が熱膨張するため、基板とマスクとの正確な位置合わせが困難であり、特に精細な有機発光層の形成に問題が生じていた。
特開２００３−１４２２６１公報 Further, in the prior art, since the substrate is thermally expanded during the heat treatment and the plasma treatment, it is difficult to accurately align the substrate and the mask, and there has been a problem in forming a fine organic light emitting layer.
JP 2003-142261 A

本発明は、このような従来の技術の課題を解決するためになされたもので、その目的とするところは、前処理工程における基板の汚染の問題がなく、しかも基板とマスクとの正確な位置合わせを行って精細な有機発光層を形成することが可能な有機ＥＬ素子製造技術を提供することにある。   The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to prevent the problem of contamination of the substrate in the pretreatment process and to accurately position the substrate and the mask. An object of the present invention is to provide an organic EL element manufacturing technique capable of forming a fine organic light emitting layer by combining them.

上記目的を達成するためになされた請求項１記載の発明は、真空排気系に接続された基板搬送室の周囲に、基板仕込室、基板加熱室、マルチ冷却プレートが設けられた冷却室、及び前処理室を有する前処理部において、真空中で基板を搬送し、かつ、当該基板に対する前処理工程を行う有機ＥＬ素子製造方法であって、前記前処理工程は、前記基板加熱室内において真空中で前記基板を加熱する加熱工程と、前記加熱工程の後、当該基板を真空中で冷却プレートにより冷却する第一冷却工程と、前記第一冷却工程の後、前記前処理室内において真空中で当該基板をプラズマ処理する真空プラズマ処理工程と、前記真空プラズマ処理工程後、前記冷却室内において真空中で当該基板を冷却プレートにより冷却する第二冷却工程と、を有し、前記第二冷却工程の終了後、真空中で当該基板に対して成膜用マスクの位置合わせを行い、さらに、真空中で前記成膜用マスクを介して有機層の形成を行う工程を有するものである。
請求項２記載の発明は、請求項１記載の発明において、前記有機層の形成を行う工程は、当該基板上にホール輸送層を形成する工程と、少なくとも１色の有機発光層の形成を行う工程を有するものである。
請求項３記載の発明は、請求項１又は２のいずれか１項記載の発明において、前記第一冷却工程と前記第二冷却工程は同じ冷却室において行うものである。
The invention according to claim 1, which has been made to achieve the above object, includes a substrate preparation chamber, a substrate heating chamber, a cooling chamber provided with a multi-cooling plate around a substrate transfer chamber connected to an evacuation system , and An organic EL element manufacturing method for transporting a substrate in a vacuum and performing a pretreatment step on the substrate in a pretreatment section having a pretreatment chamber , wherein the pretreatment step is performed in a vacuum in the substrate heating chamber. In the heating step of heating the substrate in step 1, after the heating step, the first cooling step of cooling the substrate by a cooling plate in vacuum, and after the first cooling step, in the pretreatment chamber in vacuum A vacuum plasma processing step of plasma processing the substrate; and a second cooling step of cooling the substrate with a cooling plate in a vacuum in the cooling chamber after the vacuum plasma processing step, After completion of the second cooling step, it aligns the film formation mask with respect to the substrate in a vacuum, further comprising a step for forming the organic layer through the film mask in a vacuum .
According to a second aspect of the present invention, in the first aspect of the invention, the step of forming the organic layer includes forming a hole transport layer on the substrate and forming an organic light emitting layer of at least one color. It has a process.
The invention according to claim 3 is the invention according to claim 1 or 2, wherein the first cooling step and the second cooling step are performed in the same cooling chamber.

本発明にあっては、前処理工程の際に真空中で基板を冷却することから、基板の汚染の問題は発生せず、しかも短時間で冷却処理を行うことができる。   In the present invention, since the substrate is cooled in a vacuum during the pretreatment process, the problem of contamination of the substrate does not occur, and the cooling process can be performed in a short time.

また、本発明によれば、冷却工程の終了後、当該基板に対して成膜用マスクの位置合わせを行い、さらに、前記成膜用マスクを介して有機層（例えばホール輸送層及び少なくとも１色の有機発光層）の形成を行うことから、前処理工程後における基板の熱膨張を阻止することができ、これにより基板と成膜用マスクとの正確な位置合わせを行って精細な有機発光層を形成することが可能になる。   In addition, according to the present invention, after the cooling step is completed, the film formation mask is aligned with respect to the substrate, and the organic layer (for example, the hole transport layer and at least one color is interposed through the film formation mask) The organic light-emitting layer) can prevent thermal expansion of the substrate after the pretreatment step, thereby accurately aligning the substrate and the film-forming mask, thereby providing a fine organic light-emitting layer. Can be formed.

さらに、本発明においては、前処理工程の際に第一冷却工程と第二冷却工程を行うことから、基板の温度を常に一定に保持することができるので、基板と成膜用マスクとの位置合わせをより正確に行うことができる。 Further, in the present invention, since the performing first cooling step and a second cooling step during the pretreatment step, it is possible to maintain the temperature of the substrate constant at all times, the position of the substrate and the deposition mask Matching can be performed more accurately.

そして、本発明によれば、有機層形成の前に基板と成膜用マスクとの正確な位置合わせを行って精細な有機発光層を効率良く形成可能な有機ＥＬ素子製造装置を提供することができる。 Then, according to this onset bright, to provide an efficient formable organic EL device manufacturing apparatus a fine organic light-emitting layer by performing a precise alignment between the substrate and the deposition mask in front of the organic layer formation Can do.

本発明によれば、有機層形成の前に基板と成膜用マスクとの正確な位置合わせを行って精細な有機発光層を形成することができる。   According to the present invention, a precise organic light-emitting layer can be formed by accurately aligning the substrate and the deposition mask before forming the organic layer.

以下、本発明の好ましい実施の形態を図面を参照して詳細に説明する。
図１は、本発明に係る有機ＥＬ素子製造装置の第１の実施の形態を示す要部概略構成図、図２（ａ）（ｂ）は、同実施の形態における前処理部の処理手順を示す概略構成図である。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a main part showing a first embodiment of an organic EL element manufacturing apparatus according to the present invention, and FIGS. 2A and 2B show a processing procedure of a preprocessing unit in the same embodiment. It is a schematic block diagram shown.

図１に示すように、本実施の形態の有機ＥＬ素子製造装置１は、基板１０に対して前処理を行う前処理部２と、基板１０上に有機発光層を蒸着形成する有機発光層形成部３とを有している。 As shown in FIG. 1, the organic EL element manufacturing apparatus 1 of the present embodiment includes a pretreatment unit 2 that performs pretreatment on a substrate 10, and an organic light emitting layer formation that deposits an organic light emitting layer on the substrate 10. Part 3 .

これら前処理部２及び有機発光層形成部３の後述する各室は、図示しない真空排気系に接続され、真空雰囲気下で図示しない搬送ロボットを用いて基板１０の受け渡しを行うように構成されている。   The chambers to be described later of the pretreatment unit 2 and the organic light emitting layer forming unit 3 are connected to a vacuum exhaust system (not shown) and configured to deliver the substrate 10 using a transfer robot (not shown) in a vacuum atmosphere. Yes.

本実施の形態の前処理部２は、基板搬送室２０の周囲に、基板仕込室２１、ベーク室２２、冷却室２３、前処理室２４が配設されて構成されている。 The pretreatment unit 2 of the present embodiment is configured such that a substrate preparation chamber 21, a bake chamber 22, a cooling chamber 23, and a pretreatment chamber 24 are disposed around the substrate transfer chamber 20.

ここで、ベーク室２２内には、図示しないマルチホットプレートが設けられ、このマルチホットプレートによって基板１０に対して短時間で安定して加熱を行うようになっている。   Here, a multi-hot plate (not shown) is provided in the bake chamber 22, and the multi-hot plate heats the substrate 10 stably in a short time.

一方、冷却室２３内には、図示しないマルチ冷却プレートが設けられ、このマルチ冷却プレートによって基板１０に対して短時間で安定して冷却を行うようになっている。   On the other hand, a multi-cooling plate (not shown) is provided in the cooling chamber 23, and the multi-cooling plate cools the substrate 10 stably in a short time.

また、前処理室２４は、例えば、ラジカルソースにより発生させた酸素（Ｏ2）プラズマを用いて基板１０の表面のコンディショニングを行うように構成されている。
そして、基板搬送室２０の後段には、基板受け渡し室２５を介して第１の微調室２６が設けられている。 The pretreatment chamber 24 is configured to condition the surface of the substrate 10 using, for example, oxygen (O 2 ) plasma generated by a radical source.
A first fine-tuning chamber 26 is provided downstream of the substrate transfer chamber 20 via a substrate transfer chamber 25.

この第１の微調室２６は、マスク供給室２７から基板受け渡し室２５を介して供給された成膜用マスク（以下「マスク」という。）１１に対し、図示しないアライメント機構を用いて基板１０を位置合わせして組み付けるように構成されている。   The first fine-tuning chamber 26 uses the alignment mechanism (not shown) to deposit the substrate 10 on the film-forming mask (hereinafter referred to as “mask”) 11 supplied from the mask supply chamber 27 via the substrate delivery chamber 25. It is configured to be aligned and assembled.

本実施の形態の有機発光層形成部３は、上記第１の微調室２６の後段に設けられた第１の有機蒸着室３０Ｒを有している。   The organic light emitting layer forming unit 3 of the present embodiment has a first organic vapor deposition chamber 30 </ b> R provided at the subsequent stage of the first fine tuning chamber 26.

そして、第１の有機蒸着室３０Ｒは、第１の搬送室３１から受け渡されたマスク付き基板１２を搬送しつつ、ホール輸送層用の有機材料と、例えば光の３原色のうち赤色発光用の第１の有機材料を基板１０上に連続的に蒸着するように構成されている。   The first organic vapor deposition chamber 30 </ b> R transports the masked substrate 12 delivered from the first transport chamber 31, and emits red light among the organic materials for the hole transport layer and, for example, the three primary colors of light. The first organic material is continuously deposited on the substrate 10.

第１の有機蒸着室３０Ｒの後段には、第２の搬送室３２と第２の微調室３２ａが隣接して設けられている。
この第２の微調室３２ａは、第２の第２の搬送室３２から受け渡されたマスク付き基板１２に対し、マスク１１の位置を、次に行う有機材料の蒸着位置に対応してずらす機能を有している。 A second transfer chamber 32 and a second fine adjustment chamber 32a are provided adjacent to each other at the subsequent stage of the first organic vapor deposition chamber 30R.
The second fine adjustment chamber 32a has a function of shifting the position of the mask 11 with respect to the substrate 12 with the mask delivered from the second second transfer chamber 32 in accordance with the next deposition position of the organic material. have.

そして、第２の搬送室３２の後段には、第２の有機蒸着室３０Ｇが設けられている。   A second organic vapor deposition chamber 30 </ b> G is provided downstream of the second transfer chamber 32.

この第２の有機蒸着室３０Ｇは、第２の搬送室３２から受け渡されたマスク付き基板１２を搬送しつつ、例えば緑色発光用の第２の有機材料を基板１０上に連続的に蒸着するように構成されている。   The second organic deposition chamber 30G continuously deposits, for example, a second organic material for green light emission on the substrate 10 while transporting the masked substrate 12 delivered from the second transport chamber 32. It is configured as follows.

第２の有機蒸着室３０Ｇの後段には、第３の搬送室３３と第３の微調室３３ａが隣接して設けられている。
この第３の微調室３３ａは、第３の搬送室３３から受け渡されたマスク付き基板１０に対し、マスク１１の位置を、次に行う有機材料の蒸着位置に対応してずらす機能を有している。 A third transfer chamber 33 and a third fine tuning chamber 33a are provided adjacent to each other at the subsequent stage of the second organic vapor deposition chamber 30G.
The third of the fine chamber 33a, compared third masked substrate 10 passed from transportable Okushitsu 33, have a position, then function of shifting in response to the deposition position of the organic materials to carry out the mask 11 is doing.

そして、第３の搬送室３３の後段には、第３の有機蒸着室３０Ｂが設けられている。
この第３の有機蒸着室３０Ｂは、第３の搬送室３３から受け渡されたマスク付き基板１２を搬送しつつ、例えば青色発光用の第３の有機材料を基板１０上に連続的に蒸着するように構成されている。 A third organic vapor deposition chamber 30 </ b> B is provided at the subsequent stage of the third transfer chamber 33.
The third organic deposition chamber 30B continuously deposits, for example, a third organic material for blue light emission on the substrate 10 while transporting the masked substrate 12 delivered from the third transport chamber 33. It is configured as follows.

そして、第３の有機蒸着室３０Ｂの後段には、第４の搬送室３４が設けられ、さらに、この第４の搬送室３４の後段には、マスク取り外し室３５とマスク搬出室３６が隣接して設けられている。
また、マスク取り外し室３５の後段には、図示しない後処理工程部に基板１０を搬送するための基板搬送室３７が設けられている。 A fourth transfer chamber 34 is provided downstream of the third organic vapor deposition chamber 30 </ b> B, and a mask removal chamber 35 and a mask carry-out chamber 36 are adjacent to the subsequent stage of the fourth transfer chamber 34. Is provided.
Further, a substrate transfer chamber 37 for transferring the substrate 10 to a post-processing step section (not shown) is provided at the subsequent stage of the mask removal chamber 35.

このような構成を有する本実施の形態において基板１０上に有機層を形成する際には、まず、図２（ａ）に示すように、基板仕込室２１を介して基板搬送室２０内に搬入された基板１０を、ベーク室２２に搬入して真空中で加熱を行った後、冷却室２３において真空中で基板１０を冷却する。   When the organic layer is formed on the substrate 10 in the present embodiment having such a configuration, first, as shown in FIG. 2A, the organic layer is carried into the substrate transfer chamber 20 via the substrate preparation chamber 21. The carried substrate 10 is carried into the baking chamber 22 and heated in a vacuum, and then the substrate 10 is cooled in the cooling chamber 23 in a vacuum.

そして、前処理室２４において基板１０に対して真空プラズマ処理を行い、さらに、図２（ｂ）に示すように、このプラズマ処理によって加熱された基板１０を再び冷却室２３に搬入して真空中で冷却する。
さらに、この基板１０とマスク１１を第１の微調室２６に移送し、これら基板１０とマスク１１を位置合わせをして組み付ける。 Then, a vacuum plasma treatment is performed on the substrate 10 in the pretreatment chamber 24. Further, as shown in FIG. 2B, the substrate 10 heated by the plasma treatment is again carried into the cooling chamber 23 to be in a vacuum. Cool with.
Further, the substrate 10 and the mask 11 are transferred to the first fine adjustment chamber 26, and the substrate 10 and the mask 11 are aligned and assembled.

そして、第１の有機層蒸着室３０Ｒにおいて、基板１０上にホール輸送層及び第１の有機材料層を形成した後、図１に示すように、順次、マスク付き基板１２を第２〜第３の有機層蒸着室３０Ｇ、３０Ｂに移送し、マスク１１の位置をずらしながら各色の有機材料の蒸着を行う。   Then, after forming the hole transport layer and the first organic material layer on the substrate 10 in the first organic layer deposition chamber 30R, as shown in FIG. The organic layer deposition chambers 30 </ b> G and 30 </ b> B are transported to deposit the organic material of each color while shifting the position of the mask 11.

以上述べたように本実施の形態にあっては、前処理工程の際に真空中で基板１０を冷却することから、基板１０の汚染の問題は発生せず、しかも短時間で冷却処理を行うことができる。   As described above, in the present embodiment, since the substrate 10 is cooled in a vacuum during the pretreatment process, the problem of contamination of the substrate 10 does not occur and the cooling process is performed in a short time. be able to.

また、冷却工程の終了後、基板１０に対してマスク１１の位置合わせを行い、さらに、このマスク１１を介してホール輸送層及び有機発光層の形成を行うことから、前処理工程後における基板１０の熱膨張を阻止することができ、これにより基板１０とマスク１１との正確な位置合わせを行って精細な有機発光層を形成することが可能になる。   In addition, after the cooling process is completed, the mask 11 is aligned with the substrate 10, and further, the hole transport layer and the organic light emitting layer are formed through the mask 11, so that the substrate 10 after the pretreatment process is formed. Thus, it is possible to form a fine organic light emitting layer by accurately aligning the substrate 10 and the mask 11.

さらに、本実施の形態では、加熱工程及び真空プラズマ処理工程の後にそれぞれ基板１０を冷却することから、基板１０の温度を常に一定に保持することができ、これにより基板１０とマスク１１との位置合わせをより正確に行うことができる。   Furthermore, in this embodiment, since the substrate 10 is cooled after the heating step and the vacuum plasma processing step, respectively, the temperature of the substrate 10 can be kept constant, whereby the position of the substrate 10 and the mask 11 can be maintained. Matching can be performed more accurately.

そして、本実施の形態の有機ＥＬ素子製造装置１によれば、有機層形成の前に基板１０とマスク１１との正確な位置合わせを行って精細な有機発光層を効率良く形成可能な有機ＥＬ素子製造装置を提供することができる。   And according to the organic EL element manufacturing apparatus 1 of this Embodiment, the organic EL which can form a fine organic light emitting layer efficiently by performing exact alignment with the board | substrate 10 and the mask 11 before organic layer formation. An element manufacturing apparatus can be provided.

図３は、本発明に係る有機ＥＬ素子製造装置の第２の実施の形態を示す概略構成図である。   FIG. 3 is a schematic configuration diagram showing a second embodiment of the organic EL element manufacturing apparatus according to the present invention.

図３に示すように、本実施の形態の有機ＥＬ素子製造装置１００は、第１〜第４の基板搬送室１００、１１０、１２０、１３０が、それぞれ受け渡し室１４０、１５０、１６０を介して連結され、順次、基板２００に対して所定の処理を行い搬送するように構成されている。   As shown in FIG. 3, in the organic EL element manufacturing apparatus 100 of the present embodiment, the first to fourth substrate transfer chambers 100, 110, 120, and 130 are connected via transfer chambers 140, 150, and 160, respectively. Then, the substrate 200 is sequentially subjected to a predetermined process and conveyed.

ここで、第１〜第３の基板搬送室１００、１１０、１２０の周囲に設けられた後述する各室は、図示しない真空排気系に接続され、真空雰囲気下で図示しない搬送ロボットを用いて基板２００の受け渡しを行うように構成されている。   Here, each chamber, which will be described later, provided around the first to third substrate transfer chambers 100, 110, 120 is connected to a vacuum exhaust system (not shown), and a substrate is used in a vacuum atmosphere using a transfer robot (not shown). It is configured to perform 200 delivery.

第１の基板搬送室１００の周囲には、上記実施の形態と同様の処理を行う基板仕込室１０２、第１及び第２のベーク室１０３，１０４、冷却室１０５と、紫外線照射によってクリーニング処理を行うＵＶクリーニング室１０６が配設されている。   Around the first substrate transfer chamber 100, a substrate preparation chamber 102 for performing the same processing as in the above embodiment, first and second baking chambers 103 and 104, a cooling chamber 105, and a cleaning process by ultraviolet irradiation. A UV cleaning chamber 106 is provided.

第２の基板搬送室１１０の周囲には、上記実施の形態と同様の処理を行う冷却室１１１、前処理室１１２、ホール層蒸着室１１３、第１及び第２の有機層蒸着室１１４、１１５と、マスク２０１をストックしておくマスクストック室１１６が配設されている。   Around the second substrate transfer chamber 110, a cooling chamber 111, a pretreatment chamber 112, a hole layer deposition chamber 113, and first and second organic layer deposition chambers 114 and 115 that perform the same processing as in the above embodiment. A mask stock chamber 116 for stocking the mask 201 is provided.

第３の基板搬送室１２０の周囲には、上記実施の形態と同様の処理を行う第３の有機層蒸着室１２１、電極形成室１２２〜１２４と、マスク２０１をストックしておくマスクストック室１２５が配設されている。   Around the third substrate transfer chamber 120, a third organic layer deposition chamber 121, electrode formation chambers 122 to 124 that perform the same processing as in the above embodiment, and a mask stock chamber 125 in which the mask 201 is stocked. Is arranged.

本実施の形態の場合は、ホール層蒸着室１１３、第１〜第３の有機層蒸着室１１４、１１５、１２１に、基板２００とマスク２０１を位置合わせするためのアライメント機構（図示せず）が設けられ、位置合わせ室を兼用するようになっている。 In the case of the present embodiment, an alignment mechanism (not shown) for aligning the substrate 200 and the mask 201 is provided in the hole layer deposition chamber 113 and the first to third organic layer deposition chambers 114 , 115, 121. It is provided and serves as an alignment chamber.

第４の基板搬送室１３０の周囲には、封止工程を行うための各処理室、すなわち、レジン塗布室１３１、乾燥剤貼り付け室１３２、封止ガラスＵＶクリーニング室１３３、貼り合わせ室１３４と、デバイスを取り出すデバイス取出室１３５が配設されている。   Around the fourth substrate transfer chamber 130, there are processing chambers for performing a sealing process, that is, a resin coating chamber 131, a desiccant pasting chamber 132, a sealing glass UV cleaning chamber 133, and a bonding chamber 134. A device take-out chamber 135 for taking out the device is provided.

このような構成を有する本実施の形態において基板２００上に有機層を形成する際には、上記実施の形態と同様に、まず基板仕込室１０２を介して基板搬送室１００内に搬入された基板２００を、第１及び第２のベーク室１０３，１０４に搬入して真空中で加熱を行った後、冷却室１０５において真空中で基板２００を冷却する。   When the organic layer is formed on the substrate 200 in the present embodiment having such a configuration, the substrate first loaded into the substrate transfer chamber 100 via the substrate preparation chamber 102 as in the above embodiment. 200 is carried into the first and second baking chambers 103 and 104 and heated in vacuum, and then the substrate 200 is cooled in vacuum in the cooling chamber 105.

次に、基板２００をＵＶクリーニング室１０６に搬送してＵＶクリーニングを行い、このＵＶクリーニングによって加熱された基板２００を冷却室１０５に搬入して冷却を行う。   Next, the substrate 200 is transported to the UV cleaning chamber 106 to perform UV cleaning, and the substrate 200 heated by this UV cleaning is carried into the cooling chamber 105 to be cooled.

そして、基板２００を前処理室１１１に搬送して基板２００に対して真空プラズマ処理を行い、さらに、このプラズマ処理によって加熱された基板２００を冷却室１１２に搬入して真空中で冷却する。   Then, the substrate 200 is transported to the pretreatment chamber 111 and vacuum plasma treatment is performed on the substrate 200. Further, the substrate 200 heated by the plasma treatment is carried into the cooling chamber 112 and cooled in vacuum.

さらに、ホール層蒸着室１１３において基板２００とマスク２０１の位置合わせをし、基板２００上にホール輸送層を形成する。   Further, the substrate 200 and the mask 201 are aligned in the hole layer deposition chamber 113, and a hole transport layer is formed on the substrate 200.

その後、順次、第１〜第３の有機層蒸着室１１４、１１５、１２１に移送し、マスク２０１の位置をずらしながら各色の有機材料の蒸着を行う。   After that, the materials are sequentially transferred to the first to third organic layer deposition chambers 114, 115, and 121, and the organic material of each color is deposited while shifting the position of the mask 201.

以上述べたように本実施の形態においても、前処理工程の際に真空中で基板２００を冷却することから、基板２００の汚染の問題は発生せず、しかも短時間で冷却処理を行うことができる。   As described above, also in this embodiment, since the substrate 200 is cooled in a vacuum during the pretreatment process, the problem of contamination of the substrate 200 does not occur, and the cooling process can be performed in a short time. it can.

また、冷却工程の終了後、基板２００に対してマスク２０１の位置合わせを行い、さらに、このマスク２０１を介してホール輸送層及び有機発光層の形成を行うことから、前処理工程後における基板２００の膨張を阻止することができ、これにより基板２００とマスク２０１との正確な位置合わせを行って精細な有機発光層を形成することが可能になる。   In addition, after the cooling process is completed, the mask 201 is aligned with the substrate 200, and further, the hole transport layer and the organic light emitting layer are formed through the mask 201. Therefore, the substrate 200 after the pretreatment process is formed. Thus, it is possible to form a fine organic light emitting layer by accurately aligning the substrate 200 and the mask 201.

さらに、本実施の形態においても、加熱工程及び真空プラズマ処理工程の後にそれぞれ基板２００を冷却することから、基板２００の温度を常に一定に保持することができ、これにより基板２００とマスク２０１との位置合わせをより正確に行うことができる。   Furthermore, also in this embodiment, since the substrate 200 is cooled after the heating step and the vacuum plasma processing step, the temperature of the substrate 200 can be kept constant, whereby the substrate 200 and the mask 201 can be kept constant. The alignment can be performed more accurately.

そして、本実施の形態の有機ＥＬ素子製造装置１００によれば、有機層形成の前に基板２００とマスク２０１との正確な位置合わせを行って精細な有機発光層を効率良く形成可能な有機ＥＬ素子製造装置を提供することができる。   And according to the organic EL element manufacturing apparatus 100 of this Embodiment, the organic EL which can form a precise | minute organic light emitting layer efficiently by performing exact alignment with the board | substrate 200 and the mask 201 before organic layer formation. An element manufacturing apparatus can be provided.

なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。
例えば、上述の実施の形態においては、基板上に光の３原色の有機層を形成する場合を例にとって説明したが、本発明はこれに限られず、例えば単色の有機層を形成する場合に適用することも可能である。 The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the case where the organic layers of the three primary colors of light are formed on the substrate has been described as an example. However, the present invention is not limited to this, and is applied to the case where, for example, a monochromatic organic layer is formed. It is also possible to do.

本発明に係る有機ＥＬ素子製造装置の第１の実施の形態を示す概略構成図1 is a schematic configuration diagram showing a first embodiment of an organic EL element manufacturing apparatus according to the present invention. （ａ）：同実施の形態における前処理部の処理手順を示す概略構成図（その１） （ｂ）：同実施の形態における前処理部の処理手順を示す概略構成図（その２）(A): Schematic configuration diagram showing the processing procedure of the preprocessing unit in the embodiment (part 1) (b): Schematic configuration diagram showing the processing procedure of the preprocessing unit in the embodiment (part 2) 本発明に係る有機ＥＬ素子製造装置の第２の実施の形態を示す概略構成図The schematic block diagram which shows 2nd Embodiment of the organic EL element manufacturing apparatus which concerns on this invention

符号の説明Explanation of symbols

１…有機ＥＬ素子製造装置 ２…前処理部 ３…有機発光層形成部 １０…基板 １１…成膜用マスク １２…マスク付き基板 ２２…ベーク室 ２３…冷却室 ２４…前処理室 ２６…第１の微調室
DESCRIPTION OF SYMBOLS 1 ... Organic EL element manufacturing apparatus 2 ... Pre-processing part 3 ... Organic light emitting layer formation part 10 ... Substrate 11 ... Mask for film-forming 12 ... Substrate with mask 22 ... Baking chamber 23 ... Cooling chamber 24 ... Pre-processing chamber 26 ... 1st The fine tuning room

Claims (3)

真空排気系に接続された基板搬送室の周囲に、基板仕込室、基板加熱室、マルチ冷却プレートが設けられた冷却室、及び前処理室を有する前処理部において、真空中で基板を搬送し、かつ、当該基板に対する前処理工程を行う有機ＥＬ素子製造方法であって、
前記前処理工程は、
前記基板加熱室内において真空中で前記基板を加熱する加熱工程と、
前記加熱工程の後、当該基板を真空中で冷却プレートにより冷却する第一冷却工程と、
前記第一冷却工程の後、前記前処理室内において真空中で当該基板をプラズマ処理する真空プラズマ処理工程と、
前記真空プラズマ処理工程後、前記冷却室内において真空中で当該基板を冷却プレートにより冷却する第二冷却工程と、を有し、
前記第二冷却工程の終了後、真空中で当該基板に対して成膜用マスクの位置合わせを行い、さらに、真空中で前記成膜用マスクを介して有機層の形成を行う工程を有する有機ＥＬ素子製造方法。 Around the substrate transfer chamber connected to the vacuum exhaust system , the substrate preparation chamber, the substrate heating chamber, the cooling chamber provided with the multi-cooling plate, and the pretreatment section having the pretreatment chamber are used to transfer the substrate in vacuum. And the organic EL element manufacturing method which performs the pre-processing process with respect to the said board | substrate,
The pretreatment step includes
A heating step of heating the substrate in a vacuum in the substrate heating chamber;
After the heating step, a first cooling step of cooling the substrate with a cooling plate in vacuum,
After the first cooling step, a vacuum plasma processing step of plasma processing the substrate in a vacuum in the pretreatment chamber;
A second cooling step of cooling the substrate with a cooling plate in a vacuum in the cooling chamber after the vacuum plasma treatment step,
After completion of the second cooling step, the organic film has a step of aligning the film formation mask with respect to the substrate in vacuum , and further forming an organic layer through the film formation mask in vacuum EL element manufacturing method. 前記有機層の形成を行う工程は、当該基板上にホール輸送層を形成する工程と、少なくとも１色の有機発光層の形成を行う工程を有する請求項１記載の有機ＥＬ素子製造方法。   The organic EL device manufacturing method according to claim 1, wherein the step of forming the organic layer includes a step of forming a hole transport layer on the substrate and a step of forming an organic light emitting layer of at least one color. 前記第一冷却工程と前記第二冷却工程は同じ冷却室において行う請求項１又は２のいずれか１項記載の有機ＥＬ素子製造方法。   The organic EL element manufacturing method according to claim 1, wherein the first cooling step and the second cooling step are performed in the same cooling chamber.
JP2005076760A 2005-03-17 2005-03-17 Organic EL device manufacturing method Active JP4780983B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005076760A JP4780983B2 (en) 2005-03-17 2005-03-17 Organic EL device manufacturing method
TW095107065A TWI406442B (en) 2005-03-17 2006-03-02 Method for manufacturing organic el device and organic el device manufacturing apparatus
KR1020060024554A KR101229595B1 (en) 2005-03-17 2006-03-16 Method for manufacturing organic el device and organic el device manufacturing apparatus
CNA2006100596744A CN1835258A (en) 2005-03-17 2006-03-17 Manufacturing method and device of organic electroluminescent device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005076760A JP4780983B2 (en) 2005-03-17 2005-03-17 Organic EL device manufacturing method

Publications (2)

Publication Number Publication Date
JP2006260939A JP2006260939A (en) 2006-09-28
JP4780983B2 true JP4780983B2 (en) 2011-09-28

Family

ID=37002930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005076760A Active JP4780983B2 (en) 2005-03-17 2005-03-17 Organic EL device manufacturing method

Country Status (4)

Country Link
JP (1) JP4780983B2 (en)
KR (1) KR101229595B1 (en)
CN (1) CN1835258A (en)
TW (1) TWI406442B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081516B2 (en) 2007-07-12 2012-11-28 株式会社ジャパンディスプレイイースト Vapor deposition method and vapor deposition apparatus
CN102439195B (en) * 2010-04-27 2014-09-03 株式会社新柯隆 Process for production of semiconductor light-emitting element substrate
JP5771372B2 (en) * 2010-08-02 2015-08-26 株式会社アルバック Plasma processing apparatus and pretreatment method
WO2012050081A1 (en) * 2010-10-12 2012-04-19 株式会社カネカ Manufacturing device for organic el elements
CN102054910B (en) * 2010-11-19 2013-07-31 理想能源设备(上海)有限公司 LED chip process integration system and treating method thereof
KR101970449B1 (en) * 2013-12-26 2019-04-18 카티바, 인크. Apparatus and techniques for thermal treatment of electronic devices
KR102300039B1 (en) 2014-08-04 2021-09-10 삼성디스플레이 주식회사 Apparatus for manufacturing display apparatus and method of manufacturing display apparatus
JP6605657B1 (en) * 2018-05-24 2019-11-13 キヤノントッキ株式会社 Film forming apparatus, film forming method, and electronic device manufacturing method
KR20210080776A (en) * 2019-12-23 2021-07-01 캐논 톡키 가부시키가이샤 Film-forming system and substrate conveying system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264387C (en) * 2000-03-22 2006-07-12 出光兴产株式会社 Apparatus for manufacturing organic EL display device and method for manufacturing organic EL display device using the same
JP2003208977A (en) * 2002-01-11 2003-07-25 Seiko Epson Corp Manufacturing method of organic el device and its equipment, electrooptic equipment, and electronic device
JP4368633B2 (en) * 2002-08-01 2009-11-18 株式会社半導体エネルギー研究所 Manufacturing equipment
JP2004171862A (en) * 2002-11-19 2004-06-17 Seiko Epson Corp Manufacturing device of organic el device, manufacturing method of organic el device, organic el device and electronic equipment
JPWO2004064453A1 (en) * 2003-01-10 2006-05-18 株式会社半導体エネルギー研究所 Light emitting device and manufacturing method thereof

Also Published As

Publication number Publication date
KR20060101324A (en) 2006-09-22
JP2006260939A (en) 2006-09-28
TW200644312A (en) 2006-12-16
KR101229595B1 (en) 2013-02-04
TWI406442B (en) 2013-08-21
CN1835258A (en) 2006-09-20

Similar Documents

Publication Publication Date Title
JP4780983B2 (en) Organic EL device manufacturing method
JP5043394B2 (en) Vapor deposition apparatus and operation method thereof
US7964037B2 (en) Deposition apparatus
US20100170439A1 (en) Vapor deposition apparatus
KR102106414B1 (en) Depositing chamber, depositing system comprising the same and method for manufacturing organic light emitting diode display
KR101230997B1 (en) Substrate processing system
JP5173175B2 (en) Vapor deposition equipment
JP4538650B2 (en) Vapor deposition equipment
JP2006330684A (en) Mask cleaning apparatus, mask cleaning method, method of forming vapor-deposited film, device for manufacturing el display device, and method of manufacturing el display device
JP2006309994A (en) Base plate for transfer, transfer method, and manufacturing method of display device
JP5634522B2 (en) Vacuum processing apparatus and organic thin film forming method
KR101110076B1 (en) Substrate processing system
JP2003332052A (en) Device and method for manufacturing organic electroluminescent display element
JP4450589B2 (en) Deposition equipment
JP7296204B2 (en) Film forming apparatus, organic device manufacturing apparatus, and organic device manufacturing method
JP2008038224A (en) Film deposition apparatus, film deposition system, and film deposition method
KR101088828B1 (en) Deposition apparatus for organic el and evaporating apparatus
JP4327544B2 (en) Deposition equipment
JP2008285698A (en) Film deposition apparatus
KR20150081951A (en) Apparatus of deposition and method of deposition using the same
JP2021106260A (en) Deposition apparatus, deposition method, and method for manufacturing electronic device
JP5511767B2 (en) Vapor deposition equipment
WO2013180204A1 (en) Method and device for fabricating protective film for light emitting element
JP2008260072A (en) Method for specifying cause of defect and substrate processing device
JP2006147488A (en) Manufacturing apparatus for organic el element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071217

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100517

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100601

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100728

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20100728

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20101227

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110322

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20110427

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110705

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110705

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140715

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4780983

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250