JP2005082649A5 - - Google Patents

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Publication number
JP2005082649A5
JP2005082649A5 JP2003313842A JP2003313842A JP2005082649A5 JP 2005082649 A5 JP2005082649 A5 JP 2005082649A5 JP 2003313842 A JP2003313842 A JP 2003313842A JP 2003313842 A JP2003313842 A JP 2003313842A JP 2005082649 A5 JP2005082649 A5 JP 2005082649A5
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JP
Japan
Prior art keywords
polishing slurry
compound
concentration
weight
colloidal silica
Prior art date
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Application number
JP2003313842A
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English (en)
Japanese (ja)
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JP4251395B2 (ja
JP2005082649A (ja
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Priority to JP2003313842A priority Critical patent/JP4251395B2/ja
Priority claimed from JP2003313842A external-priority patent/JP4251395B2/ja
Publication of JP2005082649A publication Critical patent/JP2005082649A/ja
Publication of JP2005082649A5 publication Critical patent/JP2005082649A5/ja
Application granted granted Critical
Publication of JP4251395B2 publication Critical patent/JP4251395B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003313842A 2003-09-05 2003-09-05 研磨用スラリー Expired - Lifetime JP4251395B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003313842A JP4251395B2 (ja) 2003-09-05 2003-09-05 研磨用スラリー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003313842A JP4251395B2 (ja) 2003-09-05 2003-09-05 研磨用スラリー

Publications (3)

Publication Number Publication Date
JP2005082649A JP2005082649A (ja) 2005-03-31
JP2005082649A5 true JP2005082649A5 (https=) 2006-10-19
JP4251395B2 JP4251395B2 (ja) 2009-04-08

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ID=34414648

Family Applications (1)

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JP2003313842A Expired - Lifetime JP4251395B2 (ja) 2003-09-05 2003-09-05 研磨用スラリー

Country Status (1)

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JP (1) JP4251395B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635694B2 (ja) * 2005-04-15 2011-02-23 日立化成工業株式会社 磁性金属膜と絶縁材料膜とを含む複合膜を研磨するための研磨材および研磨方法
JP4708911B2 (ja) * 2005-08-09 2011-06-22 ニッタ・ハース株式会社 研磨用組成物
JP2007073548A (ja) * 2005-09-02 2007-03-22 Fujimi Inc 研磨方法
JP2007194593A (ja) * 2005-12-20 2007-08-02 Fujifilm Corp 金属用研磨液及びそれを用いた研磨方法
JPWO2008117593A1 (ja) * 2007-03-26 2010-07-15 Jsr株式会社 化学機械研磨用水系分散体および半導体装置の化学機械研磨方法
EP2437285A2 (en) * 2007-03-26 2012-04-04 JSR Corporation Chemical mechanical polishing method for semiconductor device using an aqueous dispersion
JP5327430B2 (ja) * 2008-06-24 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨用水系分散体の製造方法および化学機械研磨方法
JP5360357B2 (ja) * 2008-06-24 2013-12-04 Ｊｓｒ株式会社 表示装置用基板に設けられたバリアメタル層を研磨するための化学機械研磨用水系分散体、化学機械研磨用水系分散体の製造方法および化学機械研磨方法
US10995238B2 (en) * 2018-07-03 2021-05-04 Rohm And Haas Electronic Materials Cmp Holdings Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten

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