JP2005081555A5 - - Google Patents

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Publication number
JP2005081555A5
JP2005081555A5 JP2003312634A JP2003312634A JP2005081555A5 JP 2005081555 A5 JP2005081555 A5 JP 2005081555A5 JP 2003312634 A JP2003312634 A JP 2003312634A JP 2003312634 A JP2003312634 A JP 2003312634A JP 2005081555 A5 JP2005081555 A5 JP 2005081555A5
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JP
Japan
Prior art keywords
electrode wiring
circuit board
manufacturing
forming
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003312634A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005081555A (ja
JP4497869B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003312634A priority Critical patent/JP4497869B2/ja
Priority claimed from JP2003312634A external-priority patent/JP4497869B2/ja
Priority to CN2004100644363A priority patent/CN1592547B/zh
Priority to US10/929,492 priority patent/US7309657B2/en
Publication of JP2005081555A publication Critical patent/JP2005081555A/ja
Publication of JP2005081555A5 publication Critical patent/JP2005081555A5/ja
Application granted granted Critical
Publication of JP4497869B2 publication Critical patent/JP4497869B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003312634A 2003-09-04 2003-09-04 回路基板の製造方法 Expired - Fee Related JP4497869B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003312634A JP4497869B2 (ja) 2003-09-04 2003-09-04 回路基板の製造方法
CN2004100644363A CN1592547B (zh) 2003-09-04 2004-08-26 电路基板、液体排出装置和电路基板的制造方法
US10/929,492 US7309657B2 (en) 2003-09-04 2004-08-31 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003312634A JP4497869B2 (ja) 2003-09-04 2003-09-04 回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2005081555A JP2005081555A (ja) 2005-03-31
JP2005081555A5 true JP2005081555A5 (enExample) 2006-10-19
JP4497869B2 JP4497869B2 (ja) 2010-07-07

Family

ID=34225112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003312634A Expired - Fee Related JP4497869B2 (ja) 2003-09-04 2003-09-04 回路基板の製造方法

Country Status (3)

Country Link
US (1) US7309657B2 (enExample)
JP (1) JP4497869B2 (enExample)
CN (1) CN1592547B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120171356A1 (en) * 2010-12-27 2012-07-05 Camtek Ltd. System for digital deposition of pad / interconnects coatings
CN103862870B (zh) * 2014-03-27 2016-06-15 苏州锐发打印技术有限公司 延长喷墨头加热器寿命的方法及喷墨头加热器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241060B2 (ja) * 1991-04-20 2001-12-25 キヤノン株式会社 インクジェット記録ヘッド用基体、インクジェット記録ヘッドおよびインクジェット記録装置
JP3143549B2 (ja) * 1993-09-08 2001-03-07 キヤノン株式会社 熱記録ヘッド用基体、該基体を用いたインクジェット記録ヘッド、インクジェットカートリッジ、インクジェット記録装置、及び記録ヘッドの駆動方法
JP3382424B2 (ja) * 1994-08-26 2003-03-04 キヤノン株式会社 インクジェットヘッド用基板、インクジェットヘッド及びインクジェット装置の製造方法並びにインクジェットヘッド用基板、インクジェットヘッド及びインクジェット装置
JPH0911468A (ja) * 1995-06-29 1997-01-14 Canon Inc インクジェット記録ヘッド用基体、インクジェット記録ヘッド、インクジェット記録装置および情報処理システム
JP2711091B2 (ja) * 1996-10-21 1998-02-10 キヤノン株式会社 インクジェット記録ヘッド用基板の作製方法
US5710070A (en) * 1996-11-08 1998-01-20 Chartered Semiconductor Manufacturing Pte Ltd. Application of titanium nitride and tungsten nitride thin film resistor for thermal ink jet technology
US6209991B1 (en) * 1997-03-04 2001-04-03 Hewlett-Packard Company Transition metal carbide films for applications in ink jet printheads
JP2001270120A (ja) * 2000-03-24 2001-10-02 Casio Comput Co Ltd サーマルインクジェットプリンタヘッド
US6774397B2 (en) * 2000-05-12 2004-08-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7053538B1 (en) * 2002-02-20 2006-05-30 Cdream Corporation Sectioned resistor layer for a carbon nanotube electron-emitting device
KR100425328B1 (ko) * 2002-06-20 2004-03-30 삼성전자주식회사 잉크 젯 프린트 헤드 및 그 제조방법

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