JP2005072361A - Partitioning method of field attachment substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed substrate, solving a hindrance to miniaturization due to the increase of an area occupying rate on a printed wiring substrate for an adjusting a test pad or a trouble of designe consideration for insulation treatment. <P>SOLUTION: An attachment substrate is provided on an attachment substrate frame by a method wherein one or a plurality of printed wiring substrates with circuits formed thereon are arrayed in the frame of attachment substrate by a bridge, by mounting an electronic component on a wiring pattern formed by printing or etching, and a test pad for confirming characteristics of a specified part of the circuit is connected by a wiring pattern from the circuit passed above the bridge. In such a partitioning method, when the printed wiring substrate is partitioned by cutting the bridge of the attachment substrate, the wiring pattern for the test pad is cut inside the print wiring substrate, and thereafter, the bridge is cut off. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to a method for dividing a printed wiring board in connection with the reduction in the number of test pads, which realizes space saving of the printed wiring board due to the test pads required in the characteristic confirmation and adjustment process of the printed wiring board on which electronic components are mounted.

In the ubiquitous industry, which is expected to grow rapidly in the future, for example, miniaturization of the module itself that realizes its wireless function is indispensable, and integration of functions (LSIization) and miniaturization of parts are also progressing rapidly. Yes. However, on the printed circuit boards that make up these modules, the space required for the test pads for signal monitoring used in the characteristic confirmation / adjustment process at the manufacturing stage can be reduced due to restrictions such as the shape of the probe to be connected. It is a limit, and the area occupation ratio on the printed wiring board is larger than before. When multiple printed wiring boards are mounted on the same sheet, the signal is wired to the bridge at the time of imposition, and the test pad is provided on the imposition board frame, so that the imposition is adjusted. It is possible to make a structure in which the test pad itself is not provided on the necessary printed wiring board by dividing the board after adjustment is completed, but in such a case, the signal line that is cut by dividing the board Is exposed on the end face of the printed wiring board, and these also require design considerations so that other conductors and adjacent patterns do not come into contact with each other. In addition, it is possible to place test pads on the non-component mounting surface on single-sided mounting boards, but after adjustment, a structure such as attaching an insulating sheet so that these test pads do not contact other conductors Design considerations were necessary.
Japanese Patent Laid-Open No. 09-130279

The present invention solves the problem of miniaturization due to an increase in the area occupancy rate of the test pad for adjustment of the prior art on the printed wiring board and the troublesomeness of design considerations for the insulation treatment, and makes the test pad for adjustment easier. An object of the present invention is to provide a reduction in size of a printed circuit board by realizing a dividing method that is provided on an attached board frame and prevents a signal line from being exposed on the end face of the printed wiring board during division.

In order to solve the above problems, the present invention provides a printed wiring board on which a circuit is formed by mounting electronic components on a wiring pattern formed by printing or etching via a bridge in an imposition board frame. Dividing the imposition board provided on the imposition board frame by connecting one or more test pads for confirming the characteristics of a specific part of the circuit with a wiring pattern from the circuit passing over the bridge In the method, when the printed circuit board is divided by cutting the bridge of the imposition board, the bridge is cut after the wiring pattern to the test pad is cut inside the printed circuit board.

By practicing the present invention, the adjustment test pad is solved by preventing the downsizing due to the increase in the area occupancy of the adjustment test pad on the printed wiring board and the troublesome design consideration of the insulation process. By realizing a dividing method that is provided on the imposition board frame and prevents the signal line from being exposed on the end face of the board during the division, the printed wiring board can be reduced in size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a configuration diagram of an imposition board according to the present invention. In FIG. 1, a printed wiring board 3 that is actually used as a product and mounts components on an imposition board frame 2 for imposition is an imposition board 1 that is plurally imposed by a bridge portion 4. , Mounted components 5 such as ICs, LSIs and analog electronic components mounted on the printed circuit board 3, test pads 6 used for characteristic confirmation / adjustment for use as products, the mounted components 5 and the bridge portion 4 The pattern 7 is connected to the test pad 6.

In this way, by providing a test pad that is used only during production on the imposition board frame, it is possible to place only mounting components on the printed wiring board part that is actually used as a product, and the size of the board can be reduced. Become.

In realizing the present invention, the characteristic confirmation / adjustment process is based on the premise that the characteristic confirmation and adjustment are performed with the printed circuit board impositioned.

Next, FIG. 2 shows a cross-sectional view of the imposition substrate in the present invention, and FIG. 3 shows a configuration diagram of the imposing substrate dividing means 1 in the present invention. In FIG. 2, 1 is an imposition board, 2 is an imposition board frame, 3 is a printed wiring board that is actually used as a product, and 4 is a bridge portion that connects the imposition board frame 2 and the printed wiring board 3 that is actually used. 5 is a mounting component such as an IC, LSI, or analog electronic component that is mounted on a printed wiring board 3 that is actually used as a product, 5a is a signal terminal of the mounting component 5, and 6 is a characteristic confirmation for enabling use as a product. A test pad used for adjustment, 7 is a pattern for connecting the mounting component 5 and the test pad 6 via the bridge portion 4, 8 is a solder resist, and 9 is a soldering pad for mounting the signal terminal 5a of the mounting component 5. . The solder resist 8 realizes a means for preventing the pattern 7 connected to the test pad 6 via the bridge portion 4 from being exposed to the end face of the printed wiring board 3 after the division in the dividing means for the imposition board 1 described later. In order to make it easy, it is provided only from the bridge part 4 to the inside of an arbitrary dimension.

Next, the means for dividing the imposition substrate shown in FIG. 3 will be described. In FIG. 3, 10 is a pedestal on which the imposition substrate 1 is placed, 10a is a groove provided in the pedestal 10 for escaping the blade 13 for cutting the bridge portion 4, and 11 is a stopper for fixing the imposition substrate 1. 11a is the cutting blade 13, the mounting component 5 and its signal terminal 5a, a groove for escaping the mounting pad 9, and 11b is a test pad provided on the imposition board frame 2 via the bridge portion 4 as in 10a. 6 is a projection provided on the stopper 11 for cutting the pattern 7 connected to 6, 12 is a support for changing the height of the stopper 11 by a spring, 13 is a blade for cutting the bridge, 13a is for fixing the cutting blade 13 Reference numeral 14 denotes a support column for changing the height of a plate 13 a for fixing the cutting blade 13 by a spring, and reference numeral 15 denotes a plate for fixing the support columns 12 and 14. The protrusion 11b of the stopper 11 is a sharp protrusion having a height of several tens to several hundreds of microns in order to cut only the pattern 7 wired on the printed wiring board 3. The height is arbitrarily determined depending on conditions such as the material used for the stopper 11, the pressing strength of the stopper 11, and the thickness of the pattern 7. Further, the protrusions 11b are arranged so that the pattern 7 can be cut inside the printed wiring board 3 by an arbitrary dimension than the bridge portion 4. Arbitrary dimensions to be arranged are calculated from the distance at which the cut pattern is desired to be separated from the end face of the substrate and the tensile strength of the pattern 7.

Next, a process for dividing the imposition substrate will be described with reference to FIGS. First, as shown in FIG. 4, the imposition substrate 1 is fixed to the base 10, and then the stopper 11 is pressed against the imposition substrate 1. Thereby, the pattern 7 connected to the test pad 6 arranged on the imposition board frame 2 through the bridge portion 4 from the mounting component 5 mounted on the printed wiring board 3 actually used as the product of the imposition board 1. Is disconnected. Next, as shown in FIG. 4b, the bridge 4 portion is cut by lowering the plate 13a to which the blade 13 for cutting the bridge portion 4 is fixed. At this time, the bridge cutting blade 13 is slightly thinner than the bridge portion 4 and the tip is not sharp. By doing so, when the bridge portion 4 is cut and pushed out toward the groove 10 a provided in the base 10, the pattern 7 cut by the protrusion 11 b provided in the stopper 11 is also brought together with the bridge portion 4. It will be pushed out. By not providing the solder resist 8 on the outside of the pattern 7 cut by the protrusions 11b, the pattern 7 can be easily pushed together when the bridge portion 4 is pushed down. Accordingly, an arbitrary dimension in which the solder resist 8 is not provided needs to be the same as or slightly inward of the arrangement dimension of the protrusion 11b provided in the stopper 11. As described above, the signal pattern 7 used for characteristic confirmation / adjustment is not exposed on the end face of the printed wiring board 3 after the division, so that it is not necessary to spend time on design considerations such as prevention of contact with the conductor, and Since the test pad 6 is not provided on the printed wiring board 3, the printed wiring board itself can be downsized.

Next, FIG. 6 shows another configuration of the imposing substrate dividing means in the present invention. In the figure, the test pad 6 arranged on the imposition board frame 2 in FIG. 2 is arranged as 6a on the rear surface of the imposition board frame 2, and the pattern 7 connected to the pad 9 for connecting the signal terminal 5a of the mounting component 5 is shown. The pattern 7b is connected to the test pad 6a by connecting to the back surface 7b of the printed wiring board 3 through the through hole 7a. Reference numeral 8 a denotes a solder resist provided on the back surface of the imposition substrate 1. Further, 10b in the dividing means is a projection for cutting the pattern 7b provided on the pedestal 10, and the projection 11b provided on the stopper 11 in FIG. 2 is deleted. The solder resist 8a that covers the pattern 7b provided on the back surface of the imposition substrate 1 is also provided on the pedestal 10 so as to be provided only from the bridge part 4 to an inner side by an arbitrary dimension, similarly to the configuration plan described first. Similarly, the protrusions 10b are arranged so as to be the same as or slightly outside the solder resist 8a. By fixing the imposition substrate 1 to the pedestal 10 and pressing the stopper 11 against the imposition substrate 1, the pattern 7b is cut by the protrusions 10b. Next, the outside of the pattern 7b cut together with the bridge portion 4 is pushed down by pressing the plate 13a to which the blade 13 for cutting the bridge portion 4 is fixed against the imposition substrate 1. As a result, the pattern 7b connected to the test pad 6a used in the characteristic confirmation / adjustment process is not exposed on the end face of the printed wiring board 3 that is actually used as a product, and contact with the conductor is prevented. Since it is not necessary to spend time for design consideration and the test pad 6a is not provided on the printed wiring board 3, it is possible to reduce the size of the board itself.

Configuration diagram of imposition board in the present invention Sectional view of imposition board in the present invention FIG. 1 is a block diagram of the imposing substrate dividing means 1 according to the present invention. Dividing process 1 of imposing substrate dividing means 1 in the present invention Dividing process 2 of the imposing substrate dividing means 1 in the present invention Arrangement substrate 2 dividing means 2 configuration diagram in the present invention

Explanation of symbols

1: imposition substrate,
2: Imposition board frame,
3: Printed circuit board,
4: Bridge part
5: Mounting parts,
5a: signal terminal,
6, 6a: test pad,
7, 7b: pattern connected to the test pad 6;
7a: a through hole of a pattern connected to the test pad 6,
8, 8a: Solder resist,
9: Soldering pad,
10: A pedestal on which the imposition substrate is placed,
10a: groove of the base for escaping the blade 13 for cutting the bridge part,
10b: a protrusion provided on the base 10;
11: A stopper for fixing the imposition substrate,
11a: a groove for escaping a stopper mounting component for fixing the imposition substrate,
11b: a protrusion provided on the stopper 11,
12: A support for changing the height of the stopper 11 by a spring,
13: Blade for cutting the bridge part,
13a: a plate for fixing the cutting blade 13;
14: A column for changing the height of the plate 13a for fixing the cutting blade 13 with a spring,
15: a plate for fixing the columns 12 and 14;

Claims (1)

A printed wiring board on which a circuit is formed by mounting an electronic component on a wiring pattern formed by printing or etching is arranged in an imposition board frame via a bridge, and one or more of the specific parts of the circuit are arranged. A test pad for confirming characteristics is connected with a wiring pattern from the circuit passing over a bridge, and is a method for dividing an imposition substrate provided on the imposition substrate frame,
When the printed circuit board is divided by cutting the bridge of the imposition board, the bridge is cut after the wiring pattern to the test pad is cut inside the printed circuit board. A method for dividing an imposition substrate.

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