JP2005056880A - Method of manufacturing laminated ceramic electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To apply enough bonding power to peripheral edges of ceramic green sheets when the ceramic green sheets where internal electrodes are formed are laminated and bonded by pressure to obtain a laminated ceramic electronic component which hardly delaminates and whose ceramic sheets hardly slip out of a place and to obtain a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the laminated ceramic electronic part comprises a first process of forming a prescribed internal electrode 2 on ceramic green sheets 1a and 1b and forming dummy electrodes 4a and 4b on the peripheral edges of the sheets 1a and 1b, respectively, and a second process of successively laminating the sheets 1a and 1b and bonding them by pressure. The dummy electrodes 4a and 4b are larger in film thicknesses than the internal electrode 2, and the dummy electrodes adjacent to each other in the direction of lamination are so arranged so as not to overlap with each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a multilayer ceramic electronic component, and in particular, a plurality of multilayer ceramic electronic components are taken out by dividing an aggregate electronic component composed of a laminate of ceramic sheets incorporating internal electrodes along a predetermined dividing line. The present invention relates to a method for manufacturing a laminated ceramic electronic component.
[0002]
[Prior art]
[Patent Document 1]
JP 2002-334814 A
In general, in the manufacture of multilayer ceramic electronic components such as multilayer capacitors and various multilayer LC filters, internal electrodes are formed on a ceramic green sheet in a predetermined pattern by screen printing or gravure printing, and these ceramic green sheets are 1 The process of sequentially laminating and pressing the sheets one by one was repeated, and finally the process of final pressing with the necessary pressure was employed.
[0004]
Conventionally, in the process of pressing the ceramic green sheets with the internal electrodes one by one, the sheets are heated and the adhesion between the sheets is obtained by high pressure and long-time pressure, but the adhesion is insufficient. If there is, sheet misalignment may occur. In particular, since no internal electrode is formed on the outer peripheral edge portion of the sheet, the action of pressure is inevitably weakened, causing a problem that the sheet is peeled off from this portion. Further, pressurization for a long time at a high pressure has a problem that it is necessary to increase the capacity of the equipment, and the production capacity is lowered.
[0005]
Therefore, as described in Patent Document 1, it has been proposed to form electrodes on the outer peripheral edge of the ceramic green sheet and to apply sufficient pressure to the outer peripheral edge.
[0006]
[Problems to be solved by the invention]
However, in the manufacturing method described in Patent Document 1, although the crimping force between the sheet and the electrode is increased at the outer peripheral edge of the ceramic green sheet, the crimping force between the sheets is not always sufficient, It is difficult to reliably prevent the stacking deviation.
[0007]
Accordingly, an object of the present invention is to laminate a ceramic green sheet on which internal electrodes are formed by laminating without causing peeling or stacking deviation by applying a sufficient crimping force to the outer peripheral edge of the sheet when laminating and crimping. An object of the present invention is to provide a method for manufacturing a ceramic electronic component.
[0008]
[Means and Actions for Solving the Problems]
In order to achieve the above object, the present invention takes out a plurality of multilayer ceramic electronic components by dividing an assembled electronic component made of a laminate of ceramic sheets with internal electrodes therein along a predetermined dividing line. In the method for producing a laminated ceramic electronic component, a predetermined internal electrode is formed on the ceramic green sheet, a dummy electrode is formed on the outer peripheral edge of the ceramic green sheet, and the ceramic green sheet is sequentially laminated. A step of crimping, wherein the dummy electrode has a larger film thickness than the internal electrode, and the dummy electrodes adjacent in the stacking direction are formed at positions where they do not overlap each other.
[0009]
In the manufacturing method according to the present invention, since the dummy electrode formed on the outer peripheral edge of the ceramic green sheet is thicker than the internal electrode, the pressure applied when the sheets are laminated is also applied to the outer peripheral edge of the sheet. The dummy electrodes that operate sufficiently and do not overlap with each other in the stacking direction increase the adhesion between the sheets, effectively preventing peeling at the outer periphery of the sheet and misalignment of the sheets. Will be.
[0010]
In the manufacturing method according to the present invention, the film thickness of the dummy electrode can be set to about 1.5 to 2 times the film thickness of the internal electrode, or may be twice or more.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a method for manufacturing a multilayer ceramic electronic component according to the present invention will be described below with reference to the accompanying drawings.
[0012]
(Refer to the first embodiment, FIG. 1 and FIG. 2)
In the first embodiment of the manufacturing method according to the present invention, as shown in FIGS. 1 and 2, a plurality of ceramic green sheets 1a, 1b, 1a, 1b... The mother assembly electronic parts are bonded by heating and heating. The collective electronic component is divided along a predetermined dividing line to take out a plurality of multilayer ceramic electronic components. In FIG. 2, 21 is a base plate and 22 is a press plate for pressurization.
[0013]
FIG. 1 (A) shows ceramic green sheets 1a stacked on the odd-numbered sheets from the bottom, and FIG. 1 (B) shows ceramic green sheets 1b stacked on the even-numbered sheets from the bottom. In these sheets 1a and 1b, internal electrodes (not shown) are formed in a predetermined pattern in a region 3 surrounded by a two-dot chain line on the surface by screen printing or gravure printing. Further, dummy electrodes 4a and 4b which are not used as products are formed in a row with the same or different type of conductive paste as the internal electrodes 2 on the outer peripheral edge portions of the sheets 1a and 1b.
[0014]
In the first embodiment, the dummy electrodes 4a and 4b have a film thickness exceeding twice the film thickness of the internal electrode 2. The dummy electrodes 4a formed on the odd-numbered sheets 1a and the dummy electrodes 4b formed on the even-numbered sheets 1b are formed at positions that do not overlap each other in the stacking direction.
[0015]
The ceramic green sheets 1a and 1b on which the internal electrode 2 and the dummy electrodes 4a and 4b are formed are sequentially stacked, and are temporarily pressure-bonded while being heated to a necessary temperature. When the required number of sheets 1a and 1b are stacked, the sheet is fired after further press-bonding by applying a necessary pressure. As a result, a collective electronic component including a plurality of elements is obtained. The collective electronic component is appropriately cut along a predetermined dividing line by a cutting blade, by a dicer or a laser beam, or by a break. Divide by method.
[0016]
In the first embodiment, since the dummy electrodes 4a and 4b formed on the outer peripheral edge portions of the ceramic green sheets 1a and 1b are twice or more thicker than the internal electrodes 2, the sheets 1a and 1b The pressure applied when laminating... Acts sufficiently on the outer periphery of the sheets 1a, 1b. Further, since the dummy electrodes 4a and 4b adjacent in the stacking direction are staggered and do not overlap each other, sufficient adhesion force is generated between the sheets 1a, 1b. Therefore, there is no possibility that the sheets 1a, 1b,... Will be misaligned or that the sheets 1a, 1b,.
[0017]
(Refer to the second embodiment, FIGS. 3 and 4)
In the second embodiment of the manufacturing method according to the present invention, as shown in FIGS. 3 and 4, an internal electrode (not shown) is provided in a region 13 surrounded by a two-dot chain line on the surface of the ceramic green sheets 11 a and 11 b. While forming in a predetermined pattern, two rows of dummy electrodes 14a and 14b are formed on the outer peripheral edge.
[0018]
In the second embodiment, the dummy electrodes 14a and 14b are 1.5 to 2 times as thick as the internal electrode 12. The dummy electrodes 14a formed on the odd-numbered sheets 11a and the dummy electrodes 14b formed on the even-numbered sheets 11b are formed at positions that do not overlap each other in the stacking direction.
[0019]
The ceramic green sheets 11a and 11b on which the internal electrode 12 and the dummy electrodes 14a and 14b are formed are laminated / compressed in the same procedure as in the first embodiment, fired, and then divided for each unit of electronic component. In addition, in this 2nd Embodiment, another structure and manufacturing method are the same as that of the said 1st Embodiment, The duplicate description is abbreviate | omitted.
[0020]
Even in the second embodiment, since the dummy electrodes 14a and 14b formed on the outer peripheral edges of the ceramic green sheets 11a and 11b are 1.5 to 2 times thicker than the internal electrode 12, the sheets The pressure applied when laminating 11a, 11b... Acts sufficiently on the outer periphery of the sheets 11a, 11b. Further, since the dummy electrodes 14a and 14b adjacent in the stacking direction do not overlap each other, a sufficient adhesion force is generated between the sheets 11a, 11b. Therefore, there is no possibility that the sheets 11a, 11b,... Will be misaligned or that the sheets 11a, 11b,.
(Other embodiments)
In addition, the manufacturing method of the multilayer ceramic electronic component which concerns on this invention is not limited to the said embodiment, It can change variously within the range of the summary.
[0021]
In particular, the formation pattern of the internal electrode and the dummy electrode is arbitrary. In the above embodiment, the odd-numbered and even-numbered dummy electrode patterns may be reversed, or the first, fourth, second, fifth, and third layers from the bottom in the stacking order. The eyes and the sixth sheet may be repeated in the same pattern. In short, it suffices if dummy electrodes adjacent in the stacking direction are formed at positions that do not overlap each other.
[0022]
In addition, multilayer ceramic electronic components obtained by the manufacturing method according to the present invention include multilayer capacitors, multilayer LC filters, and various composite electronic components.
[0023]
【The invention's effect】
As is clear from the above description, according to the manufacturing method according to the present invention, the dummy electrode formed on the outer peripheral edge of the ceramic green sheet has a larger film thickness than the internal electrode. The applied pressure acts sufficiently on the outer peripheral edge of the sheet, and the dummy electrodes adjacent to each other in the stacking direction do not overlap with each other, so the adhesion between the sheets is also strong, peeling off at the outer periphery of the sheet and stacking of the sheets It is possible to effectively prevent the shift.
[Brief description of the drawings]
FIGS. 1A and 1B are plan views of a ceramic green sheet according to a first embodiment of the present invention, where FIG. 1A shows an odd number and FIG. 1B shows an even number.
FIG. 2 is a cross-sectional view corresponding to XX in FIG. 1 (A), showing the ceramic green sheet laminated / crimped in the first embodiment.
FIGS. 3A and 3B are plan views of a ceramic green sheet according to a second embodiment of the present invention, where FIG. 3A shows an odd number and FIG. 3B shows an even number.
4A and 4B show the lamination / crimping of the ceramic green sheets in the second embodiment, wherein FIG. 4A is a cross-sectional view corresponding to Y1-Y1 in FIG. 3A, and FIG. It is sectional drawing equivalent to Y2-Y2.
[Explanation of symbols]
1a, 1b, 11a, 11b ... ceramic green sheets 2,12 ... internal electrodes 3,13 ... internal electrode forming regions 4a, 4b, 14a, 14b ... dummy electrodes 21 ... base plate 22 ... press plate for pressurization

Claims (3)

In the method of manufacturing a multilayer ceramic electronic component in which a plurality of multilayer ceramic electronic components are taken out by dividing an assembly electronic component composed of a laminate of ceramic sheets containing internal electrodes along a predetermined dividing line,
Forming a predetermined internal electrode on the ceramic green sheet and forming a dummy electrode on the outer peripheral edge of the ceramic green sheet;
A step of sequentially laminating and pressure-bonding the ceramic green sheets,
The dummy electrode is thicker than the internal electrode, and the dummy electrodes adjacent in the stacking direction are formed at positions that do not overlap each other,
A method for producing a multilayer ceramic electronic component characterized by the above. 2. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the thickness of the dummy electrode is 1.5 to 2 times the thickness of the internal electrode. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the film thickness of the dummy electrode is twice or more the film thickness of the internal electrode.

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