JP4872991B2 - Manufacturing method of multilayer ceramic electronic component and collective electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component and a collective electronic component from which a plurality of multilayer ceramic electronic components can be taken out, and in particular, an improvement for reducing misalignment in the lamination and crimping steps of ceramic green sheets. It is about.

  FIG. 11 is a cross-sectional view schematically showing a multilayer ceramic substrate 1 as an example of a multilayer ceramic electronic component of interest to the present invention.

  The multilayer ceramic substrate 1 has a laminated structure including a plurality of ceramic layers 2. In connection with the ceramic layer 2, various wiring conductors are provided. FIG. 11 shows a typical wiring conductor.

  As the wiring conductor, internal conductor films 3 and 4 formed along a specific interface between the ceramic layers 2, via-hole conductors 5, 6 and 7 provided so as to penetrate the specific ceramic layer 2, and the ceramic layer 2 There are, for example, land grid array type external terminal electrodes 8 and 9 formed on the outer surface of the laminate.

  In the multilayer ceramic substrate 1 shown in FIG. 11, the via-hole conductor 5 electrically connects the chip component 10 mounted on the multilayer ceramic substrate 1 and the external terminal electrode 8, and the via-hole conductor 6 The conductor films 3 and 4 are electrically connected, and the via-hole conductor 7 electrically connects the internal conductor film 4 and the external terminal electrode 9.

  The internal conductor films 3 and 4 and the via-hole conductors 5 to 7 as described above not only provide necessary wiring in the multilayer ceramic substrate 1 but also constitute, for example, passive elements such as capacitors and inductors.

  The internal conductor films 3 and 4, the via-hole conductors 5 to 7, and the external terminal electrodes 8 and 9 are usually composed of a sintered body of a conductive paste containing conductive metal powder, and are connected to the external terminal electrodes 8 and 9. In addition, a plating process is further performed as necessary.

  The multilayer ceramic substrate 1 as described above is often prepared in a state of a collective electronic component 11 as shown in FIG. 12 in order to improve the production efficiency, and the collective electronic component 11 is formed on a predetermined dividing line 12. A plurality of multilayer ceramic substrates 1 are taken out by dividing along the same. In this case, in order to make it possible to efficiently advance the division in a chocolate break mode, usually, on at least one main surface of the collective electronic component 11, along the dividing line 12, for example, having a V-shaped cross section. Break grooves are formed.

  The peripheral portion of the collective electronic component 11 is an unnecessary portion 13 that does not become the multilayer ceramic substrate 1, and the unnecessary portion 13 is removed when the plurality of multilayer ceramic substrates 1 are taken out.

  The collective electronic component 11 is prepared with a plurality of ceramic green sheets provided with wiring conductors such as the internal conductor films 3 and 4, the via-hole conductors 5 to 7 and the external terminal electrodes 8 and 9 necessary for the multilayer ceramic substrate 1. The plurality of ceramic green sheets are laminated and pressure-bonded in the laminating direction, thereby producing a raw assembly electronic component 11 and firing it.

  In the manufacture of the collective electronic component 11 described above, it is important to prevent misalignment between the ceramic green sheets when a plurality of ceramic green sheets are stacked and pressed in the stacking direction. However, for example, when the thicknesses of the inner conductor films 3 and 4 are relatively large, or when via-hole conductors 5 to 7 extending so as to penetrate through the plurality of ceramic layers are provided, the above-described misalignment occurs. Easy (see, for example, Patent Document 1).

  In particular, when the situation described below with reference to FIG. 13 is brought about, misalignment is more likely to occur due to the via-hole conductors 5 to 7. FIG. 13 shows steps from the formation of the via-hole conductor to the lamination of the ceramic green sheets.

  First, as shown in FIG. 13 (1), the ceramic green sheet 16 backed by the carrier film 15 is provided with a through-hole 17 so as to penetrate the carrier film 15 by laser or punching.

  Next, as shown in FIG. 13 (1), the conductive paste 18 is filled into the through-hole 17 from the carrier film 15 side.

  Next, as shown in FIG. 13B, the conductive paste 18 is dried. This reduces the volume of the conductive paste 18 somewhat.

  Next, as shown in FIG. 13 (3), the carrier film 15 is peeled off from the ceramic green sheet 16. At this time, a part of the conductive paste 18 located on the carrier film 15 side is removed along with the carrier film 15, but a part thereof may remain on the ceramic green sheet 16 side. As a result, a protrusion 19 made of the conductive paste 18 is formed on the ceramic green sheet 16.

  Next, as shown in FIG. 13 (4), a plurality of ceramic green sheets 16 are laminated. At this time, a gap 20 may be formed between adjacent ceramic green sheets 16 due to the presence of the protrusions 19 due to the conductive paste 18.

  The gap 20 due to the above-described protrusion 19 first causes a positional shift in the lamination process of the ceramic green sheets 16.

  Next, the plurality of laminated ceramic green sheets 16 are pressed in the stacking direction. As a result, misalignment as shown in FIG. 14 or 15 may be caused.

  That is, the crimping process is performed in a state in which a laminated body of a plurality of ceramic green sheets 16 is sandwiched from above and below by a mold, so that the misalignment occurs in the ceramic green sheets 16 respectively positioned above and below the laminated body. Hateful. On the other hand, in the ceramic green sheet 16 located in the middle part of the laminated body, the restraint force from the mold does not work so much, so that the positional deviation is likely to occur.

  Under the above-described situation, as shown in FIG. 13 (4), when the protrusion 19 is formed by the conductive paste 18, the material of the conductive paste 18 is harder than the material of the ceramic green sheet 16. Therefore, when pressure for pressure bonding is applied, the conductive paste 18 provided on each ceramic green sheet 16 abuts on each other due to the contact of the conductive paste 18 with each other, as shown in FIG. As shown in FIG. 15, it bends or curves.

  As a result, in FIG. 14, the ceramic green sheet 16 is displaced as indicated by arrows 21 and 22. In FIG. 15, the ceramic green sheet 16 is indicated by arrows 23, 24 and 25. In addition, misalignment occurs.

  In addition, as a method of pressure bonding, a method of performing pressure bonding every time the ceramic green sheets 16 are laminated (sequential pressure bonding method), and a method of pressure bonding in a lump after finishing the lamination of all the ceramic green sheets 16 (batch batch). 14 or 15 is likely to occur particularly when the latter batch crimping method is employed.

Further, the positional shift shown in FIG. 14 or FIG. 15 increases as the number of conductive pastes 18 increases, that is, for example, the number of stacked ceramic layers 2 penetrating like the via-hole conductor 5 shown in FIG. The more it is, the more likely it is to occur.
Japanese Patent Laid-Open No. 11-31881

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component and a collective electronic component from which a plurality of multilayer ceramic electronic components can be taken out, in which the problem of displacement as described above is unlikely to occur. .

  The present invention includes a step of producing an aggregate electronic component from which a plurality of multilayer ceramic electronic components can be taken out by dividing along a predetermined dividing line, and dividing the assembled electronic component along the dividing line, thereby First, the present invention is directed to a method for manufacturing a multilayer ceramic electronic component, which includes a step of removing a plurality of multilayer ceramic electronic components and removing unnecessary portions that do not become multilayer ceramic electronic components.

  The process of manufacturing the above-described collective electronic component includes the steps of preparing a plurality of ceramic green sheets each provided with wiring conductors necessary for the multilayer ceramic electronic component, and laminating the plurality of ceramic green sheets and pressing them in the stacking direction. Thereby, a process of producing a collective electronic component in a raw state and a process of firing the collective electronic component in a raw state are provided.

  In the present invention, in order to solve the technical problem described above, in the step of preparing the ceramic green sheets, the adjacent ceramic green sheets do not overlap each other in the stacking direction but are arranged in the main surface direction of the ceramic green sheets. The conductive paste body thus aligned is provided in a region corresponding to an unnecessary portion in the ceramic green sheet, and the conductive paste body is arranged in the stacking direction of the ceramic green sheets. On the cross section, the conductive paste bodies provided on the other adjacent ceramic green sheet are positioned so that the conductive paste bodies provided on the other adjacent ceramic green sheet are positioned in the space between the plurality of conductive paste bodies provided on the adjacent one ceramic green sheet. It is characterized by that.

  The conductive paste described above acts so as to make it difficult for the ceramic green sheet to be misaligned when the ceramic green sheet is laminated and pressed.

  The conductive paste body is provided so as to penetrate the ceramic green sheet, for example, like a via-hole conductor. In this case, it is more preferable that the conductive paste bodies are aligned so that the ceramic green sheets adjacent to each other are partially engaged with each other.

  The conductive paste body may be provided by a thick film provided on the ceramic green sheet.

  Preferably, the conductive paste bodies are arranged in a zigzag manner along the main surface direction of the ceramic green sheet, and are adjacent to the space between the conductive paste bodies provided on one adjacent ceramic green sheet. It aligns so that the electrically conductive paste body provided in the other ceramic green sheet to fit may be located.

  The unnecessary portion provided with such a conductive paste body may be provided in the peripheral region of the ceramic green sheet or may be provided in a band-like region having a predetermined width across the central portion of the ceramic green sheet.

  Wiring necessary for the multilayer ceramic electronic component described above includes, for example, a via hole conductor extending so as to penetrate a plurality of ceramic green sheets, and the present invention is particularly advantageously applied when such a via hole conductor is provided. The

  The present invention is also directed to a collective electronic component having a multilayer structure composed of a plurality of ceramic layers and capable of taking out a plurality of multilayer ceramic electronic components by dividing along a predetermined dividing line. It is done.

The collective electronic component according to the present invention is an electrically conductive paste that is not overlapped with each other in the stacking direction between adjacent ceramic layers, but is aligned in the main surface direction of the ceramic layer, on unnecessary portions that do not become a multilayer ceramic electronic component together with and being provided conductor made of a sintered body, the conductor, on the cross section along the stacking direction of the ceramic layers, a plurality of vignetting set on one of the ceramic layers adjacent conductor spacing the portion, conductor kicked set in ceramic layer adjacent the other is characterized in that it is aligned to be located.

  The above-described conductor is provided so as to penetrate the ceramic layer, for example. In this case, it is more preferable that the conductors are aligned such that parts of the conductors engage with each other between adjacent ceramic layers.

  The conductor may have a thick film shape provided along the interface between the ceramic layers.

Preferably, the conductor is arranged so as to be aligned respectively along the main surface direction of the ceramic layers in a zigzag fashion, the spacing portion of the eclipse set on one of the ceramic layers adjacent conductors, set the adjacent other ceramic layer The aligned conductors are aligned.

  In addition, the unnecessary portion where the conductor is provided is located in the peripheral region of the ceramic layer or in a belt-like region having a predetermined width across the central portion of the ceramic layer. May be.

  According to the present invention, in the raw state of the assembled electronic component produced for manufacturing the multilayer ceramic electronic component, the adjacent ceramic green sheets do not overlap each other in the stacking direction, but the main part of the ceramic green sheet In the process of laminating a plurality of ceramic green sheets and pressing them in the laminating direction, since the conductive paste bodies aligned so as to be aligned in the plane direction are provided in a region corresponding to an unnecessary portion in the ceramic green sheets. Further, it is possible to make the positional deviation of the ceramic green sheet difficult to occur. Therefore, according to the collective electronic component obtained according to the present invention, a multilayer ceramic electronic component can be manufactured with a high yield.

  Further, according to the present invention, the conductive paste body is adjacent to the interval between the plurality of conductive paste bodies provided on one adjacent ceramic green sheet on the cross section along the stacking direction of the ceramic green sheets. Since the conductive paste body provided on the other ceramic green sheet is aligned so as to be positioned, it is possible to enhance the effect of preventing misalignment by the conductive paste body.

  In addition, the conductive paste body can be formed at the same time as the step of forming the wiring conductor while using the same conductive paste as the conductive paste for forming the wiring conductor necessary for the multilayer ceramic electronic component. Therefore, no special process is required to provide the conductive paste body. The conductive paste body can be sintered simultaneously with the firing process of the ceramic green sheet. For this reason, the productivity of the multilayer ceramic electronic component is not reduced by providing the conductive paste body.

  In this invention, the conductive paste bodies are arranged so as to be arranged in a zigzag shape along the main surface direction of the ceramic green sheets, respectively, and in the interval part of the conductive paste bodies provided in one adjacent ceramic green sheet, When the conductive paste body is aligned so that the conductive paste body provided on the other adjacent ceramic green sheet is positioned, the effect of preventing the displacement by the conductive paste body can be further enhanced.

  In addition, when a via-hole conductor extending so as to penetrate through a plurality of ceramic green sheets is provided as a wiring conductor necessary for the multilayer ceramic electronic component, misalignment is more likely to occur, and thus the effect of the present invention is more remarkable. Is done.

  1 to 3 are for explaining a first embodiment of the present invention. Here, FIG. 1 is a plan view showing the collective electronic component 31 first.

  The collective electronic component 31 is configured so that a plurality of multilayer ceramic electronic components 33 such as the multilayer ceramic substrate 1 shown in FIG. 11 can be taken out by being divided along a predetermined dividing line 32. . Therefore, when the collective electronic component 31 is divided along the dividing line 32, a plurality of multilayer ceramic electronic components 33 can be taken out. Further, for example, a peripheral region of the collective electronic component 31 is an unnecessary portion 34 that does not become the multilayer ceramic electronic component 33, and the unnecessary portion 34 is removed.

  In addition, in order to make it possible to efficiently advance the above-described division in a chocolate break mode, on at least one main surface of the collective electronic component 31, for example, for a break having a V-shaped cross section along the division line 32 A groove is preferably formed.

  In producing the collective electronic component 31, for example, wiring conductors necessary for the multilayer ceramic electronic component 33 such as the internal conductor films 3 and 4, the via-hole conductors 5 to 7 and the external terminal electrodes 8 and 9 shown in FIG. A plurality of provided ceramic green sheets are prepared. Representative of these ceramic green sheets are the ceramic green sheets 35 and 36 shown in FIGS.

  Next, a plurality of ceramic green sheets including the ceramic green sheets 35 and 36 are stacked and pressed in the stacking direction. As a result, a raw state of the collective electronic component 31 is obtained, and by firing this, the collective electronic component 31 as shown in FIG. 1 is obtained.

  In such a method of manufacturing the collective electronic component 31, as a characteristic process of the present invention, a ceramic green sheet is prepared as follows.

  FIG. 2 is a plan view showing a part of each of the adjacent ceramic green sheets 35 and 36. Conductive paste bodies 37 and 38 made of a conductive paste containing a conductive metal powder are provided in regions corresponding to the aforementioned unnecessary portions 34 in the ceramic green sheets 35 and 36, respectively.

  These conductive paste bodies 37 and 38 are aligned so that adjacent ceramic green sheets 35 and 36 do not overlap each other in the stacking direction but are aligned in the main surface direction of the ceramic green sheets 35 and 36. In this embodiment, the conductive paste bodies 37 and 38 are arranged in a zigzag manner along the main surface direction of the ceramic green sheets 35 and 36, respectively, and are provided on one adjacent ceramic green sheet 35. The conductive paste bodies 38 provided on the other adjacent ceramic green sheet 36 are positioned so as to be positioned in the space between the conductive paste bodies 37.

  FIG. 3 is a sectional view showing a state in which a plurality of ceramic green sheets 35 and 36 are laminated.

  In this embodiment, as well shown in FIG. 3, the conductive paste bodies 37 and 38 are provided so as to penetrate the ceramic green sheets 35 and 36, respectively. That is, conductive paste bodies 37 and 38 are provided in the same manner as the via-hole conductor.

  The conductive paste bodies 37 and 38 can be formed simultaneously with a via-hole conductor necessary for the multilayer ceramic electronic component 33 such as the via-hole conductors 5 to 7 shown in FIG. Therefore, the conductive paste can be formed using the same conductive paste as that for forming a wiring conductor necessary for the semiconductor device. Therefore, it can be fired simultaneously with the ceramic green sheets 35 and 36 in the firing step described later.

  When such ceramic green sheets 35 and 36 are laminated, as shown in FIG. 3, the conductive paste bodies 37 and 38 are adjacent to each other on the cross section along the lamination direction of the ceramic green sheets 35 and 36. The conductive paste bodies 38 provided on the other adjacent ceramic green sheet 36 are positioned so as to be positioned at intervals between the plurality of conductive paste bodies 37 provided on the ceramic green sheet 35.

  By realizing such a structure, when a plurality of ceramic green sheets 35 and 36 are laminated, the positional deviation is less likely to occur, and even when the ceramic green sheets 35 and 36 are laminated in the laminating direction, the positional deviation is less likely to occur. it can.

  In particular, in this embodiment, as shown in FIG. 3, the conductive paste bodies 37 and 38 are aligned so that the ceramic green sheets 35 and 36 adjacent to each other are partially engaged with each other. As a result, the effect of preventing the above-described displacement is further enhanced.

  The state in which each part of the conductive paste bodies 37 and 38 is engaged with each other is realized particularly after the crimping process. That is, the conductive paste bodies 37 and 38 are harder than the ceramic green sheets 35 and 36, and therefore, are less likely to be crushed than the ceramic green sheets 35 and 36 during pressure bonding. Therefore, the thickness direction dimensions of the conductive paste bodies 37 and 38 are larger than the thickness direction dimensions of the ceramic green sheets 35 and 36, and the engagement state as described above is obtained.

  Similarly to the case of the conductive paste 18 described with reference to FIG. 13 described above, when the conductive paste bodies 37 and 38 are provided on the ceramic green sheets 35 and 36, the same protrusions as the protrusions 19 are formed. This also contributes to the engagement being brought about.

  Thus, after the thing of the raw state of the collective electronic component 31 is obtained, a baking process is implemented, and thereby the collective electronic component 31 as shown in FIG. 1 is obtained. In the collective electronic component 31, the conductive paste bodies 37 and 38 described above become conductors 39 made of a sintered body of the conductive paste while maintaining the position and form, and the ceramic green sheets 35 and 36 are sintered. It becomes a bonded ceramic layer. The conductor 39 is located in the peripheral region of the ceramic layer corresponding to the unnecessary portion 34. Therefore, the conductor 39 has no influence on the taken out multilayer ceramic electronic component 33.

  The unnecessary portion 34 described above is given to the peripheral region of the ceramic layer included in the collective electronic component 31, that is, the peripheral region of the ceramic green sheets 35 and 36 prepared for manufacturing the collective electronic component 31. As shown by, an unnecessary portion 34a may be provided in a band-shaped region having a predetermined width that crosses the central portion of the ceramic layer, that is, the ceramic green sheet. The unnecessary portion 34a extends, for example, in a “+” shape.

  In which region these unnecessary portions 34 or 34a are provided, it may be arbitrarily selected according to the design of the collective electronic component 31, and both unnecessary portions 34 and 34a may be provided.

  4 and 5 are for explaining a second embodiment of the present invention. 4 is a diagram corresponding to FIG. 2, and FIG. 5 is a diagram corresponding to FIG. 4 and 5, elements corresponding to those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description is omitted.

  Also in the second embodiment, the conductive paste bodies 41 and 42 provided in the regions corresponding to the unnecessary portions 34 of the adjacent ceramic green sheets 35 and 36 are respectively connected to the ceramic green sheets 35 and 36. It is provided so that it may penetrate.

  Further, between the adjacent ceramic green sheets 35 and 36, the conductive paste bodies 41 and 42 do not overlap each other in the stacking direction, but are aligned so as to be aligned in the main surface direction of the ceramic green sheets 35 and 36, As shown in FIG. 5, the conductive paste bodies 41 and 42 include a plurality of conductive paste bodies 41 provided on one adjacent ceramic green sheet 35 on a cross section along the stacking direction of the ceramic green sheets 35 and 36. The conductive paste bodies 42 provided on the other adjacent ceramic green sheet 36 are positioned so as to be positioned in the gap portion.

  The difference from the case of the first embodiment described above is that the interval between the conductive paste bodies 41 and 42 is widened, so that the conductive paste bodies 41 and 42 are adjacent to each other as shown in FIG. The ceramic green sheets 35 and 36 that fit each other are not engaged with each other.

  The conductive paste bodies 41 and 42 have a circular cross section, but this is not an essential feature, and the rectangular cross section is the same as in the case of the conductive paste bodies 37 and 38 in the first embodiment. It may be said.

  According to the second embodiment, as shown in FIG. 5, when the ceramic green sheets 35 and 36 are stacked and pressed in the stacking direction, the ceramic green sheets 35 and 36 contact the conductive paste bodies 41 and 42, respectively. It can be curved while in contact with the ceramic green sheets 35 and 36.

  6 and 7 are for explaining a third embodiment of the present invention. Here, FIG. 6 is a diagram corresponding to FIG. 2 described above, and FIG. 7 is a diagram corresponding to FIG. 3 described above. 6 and 7, elements corresponding to those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the third embodiment, the conductive paste bodies 44 and 45 are provided by thick films provided on the ceramic green sheets 35 and 36, respectively. In the illustrated example, the conductive paste bodies 44 and 45 have a circular planar shape. However, this is not an essential feature and may be changed to, for example, a rectangular planar shape.

  The conductive paste bodies 44 and 45 can be formed simultaneously with a conductor film necessary for a multilayer ceramic electronic component such as the inner conductor films 3 and 4 shown in FIG. 11, and for the multilayer ceramic electronic component. The conductive paste can be formed using the same conductive paste as that for forming a necessary wiring conductor. Therefore, in the firing step, the ceramic green sheets 35 and 36 can be fired simultaneously.

  Also in the third embodiment, the conductive paste bodies 44 and 45 do not overlap each other in the stacking direction between the adjacent ceramic green sheets 35 and 36, but are arranged in the main surface direction of the ceramic green sheets 35 and 36. Aligned.

  In addition, the conductive paste bodies 44 and 45 are arranged so as to be arranged in a zigzag shape along the main surface direction of the ceramic green sheets 35 and 36, respectively, and the conductive paste bodies provided on one adjacent ceramic green sheet 35 The conductive paste body 45 provided on the other adjacent ceramic green sheet 36 is positioned so as to be positioned in the interval portion 44.

  Furthermore, the conductive paste bodies 44 and 45 are arranged at intervals between the plurality of conductive paste bodies 44 provided on one adjacent ceramic green sheet 35 on the cross section along the stacking direction of the ceramic green sheets 35 and 36. The conductive paste body 45 provided on the other adjacent ceramic green sheet 36 is positioned so as to be positioned.

  Also according to the third embodiment, when the plurality of ceramic green sheets 35 and 36 are laminated and pressed in the lamination direction, the ceramic green sheets are present due to the presence of the conductive paste bodies 44 and 45 as shown in FIG. 35 and 36 are curved, which can make it difficult for the ceramic green sheets 35 and 36 to be displaced.

  By performing the firing step, the conductive paste bodies 44 and 45 become thick film conductors made of a sintered body of the conductive paste while maintaining the position and form thereof, and the ceramic green sheets 35 and 36 becomes a sintered ceramic layer. The thick film conductor is positioned along the interface of the ceramic layer.

  FIG. 8 is a diagram for explaining a fourth embodiment of the present invention and corresponds to FIG. 2 described above. In FIG. 8, elements corresponding to those shown in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

  In the fourth embodiment, the conductive paste bodies 47 and 48 are provided by thick films provided on the ceramic green sheets 35 and 36, respectively, but are characterized by their planar shapes. That is, the conductive paste bodies 47 and 48 are provided so as to extend in a band shape in a region corresponding to the unnecessary portion 34.

  Also in this embodiment, the conductive paste bodies 47 and 48 are aligned so that the adjacent ceramic green sheets 35 and 35 do not overlap each other in the stacking direction but are aligned in the main surface direction of the ceramic green sheets 35 and 36. Is done. The conductive paste bodies 47 and 48 are not shown in the drawing, but on the cross section along the stacking direction of the ceramic green sheets 35 and 36, the two conductive paste bodies 47 provided on one adjacent ceramic green sheet 35 are provided. The conductive paste body 48 provided on the other adjacent ceramic green sheet 36 is positioned so as to be positioned in the gap portion.

  FIG. 9 is for explaining a reference example of interest to the present invention. FIG. 9 is a view corresponding to FIG. 3 described above, but illustrates opposite ends of the ceramic green sheets 35 and 36. In FIG. 9, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  This reference example is intended to show that the conductive paste bodies 37 and 38 located at both ends cooperate to make it difficult for the ceramic green sheets 35 and 36 to be displaced. That is, only the conductive paste bodies 37 and 38 provided on one end side of the ceramic green sheets 35 and 36 can only effectively prevent the positional deviation in one direction, but the position in the other direction. For the displacement, the conductive paste bodies 37 and 38 provided on the other end side work effectively.

  Therefore, it can be understood that each of the conductive paste bodies 37 and 38 may be simply provided in one row along one side of each of the ceramic green sheets 35 and 36. It is preferable that the number of rows of the conductive paste body is increased, such as 2 rows or more, and further 3 rows or more.

  FIG. 10 is a view corresponding to FIG. 3 described above for explaining the fifth embodiment of the present invention. 10, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  The fifth embodiment is intended to show that there may be a portion where the ceramic green sheets 36 provided with the conductive paste bodies 38 are laminated so as to be adjacent to each other, for example.

  As can be seen from the fifth embodiment, the conductive paste bodies 37 and 38 and the like for making it difficult for positional deviation to occur do not need to be provided on all the ceramic green sheets to be laminated. For example, a via-hole conductor is provided, so that the conductive paste body may be provided only on a ceramic green sheet that is likely to be displaced.

  As described above, the present invention has been described with reference to the illustrated embodiment, but various modifications can be made within the scope of the present invention, for example, regarding the arrangement of the conductive paste bodies. More specifically, even if the conductive paste body is provided only at the four corners of the ceramic green sheet, it is not provided so as to be distributed from end to end of the ceramic green sheet, but is interrupted in the middle. In this case, the number of distribution points can be arbitrarily selected.

  In addition, the present invention is not limited to a multilayer ceramic substrate as a multilayer ceramic electronic component, but can be applied to the manufacture of multilayer ceramic electronic components such as multilayer ceramic capacitors, multilayer inductors, and multilayer composite electronic components. be able to.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a collective electronic component 31 for explaining a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a part of each of adjacent ceramic green sheets 35 and 36 for explaining a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view illustrating a part of a plurality of laminated ceramic green sheets 35 and 36 for explaining a first embodiment of the present invention. It is a figure corresponding to FIG. 2 for demonstrating the 2nd Embodiment of this invention. It is a figure corresponding to FIG. 3 for demonstrating 2nd Embodiment of this invention. It is a figure corresponding to FIG. 2 for demonstrating the 3rd Embodiment of this invention. It is a figure corresponding to FIG. 3 for demonstrating the 3rd Embodiment of this invention. It is a figure corresponding to FIG. 2 for demonstrating the 4th Embodiment of this invention. It is a figure corresponding to FIG. 3 for demonstrating the reference example interesting for this invention. It is a figure corresponding to FIG. 3 for demonstrating the 5th Embodiment of this invention. 1 is a cross-sectional view schematically showing a multilayer ceramic substrate 1 as an example of a multilayer ceramic electronic component of interest to the present invention. It is a top view which shows the conventional collective electronic component 11 prepared in order to obtain the multilayer ceramic substrate 1 shown in FIG. FIG. 13 is a cross-sectional view illustrating a process from filling of a conductive paste 18 to a lamination process of a ceramic green sheet 16 which are performed to manufacture the collective electronic component 11 illustrated in FIG. 12. It is sectional drawing which shows the lamination | stacking state of the several ceramic green sheet 16 in which the positional slip which may arise in the crimping | compression-bonding process implemented after the lamination process shown in FIG.13 (4) was brought about. FIG. 15 is a cross-sectional view similar to FIG. 14, illustrating a stacked state of a plurality of ceramic green sheets 16 in which misalignment of another aspect is caused.

Explanation of symbols

31 Collective electronic component 32 Dividing line 33 Multilayer ceramic electronic component 34, 34a Unnecessary portion 35, 36 Ceramic green sheet 37, 38, 41, 42, 44, 45, 47, 48 Conductive paste body 39 Conductor

Claims (9)

Producing a collective electronic component from which a plurality of laminated ceramic electronic components can be taken out by dividing along a predetermined dividing line;
Dividing the collective electronic component along the dividing line, thereby removing a plurality of the multilayer ceramic electronic components and removing unnecessary portions that do not become the multilayer ceramic electronic components;
The step of producing the collective electronic component includes a step of preparing a plurality of ceramic green sheets each provided with wiring conductors necessary for the multilayer ceramic electronic component, a step of laminating the plurality of ceramic green sheets, and pressing in the stacking direction. And thereby producing a raw collective electronic component, and firing the raw collective electronic component,
In the step of preparing the ceramic green sheet, between the adjacent ceramic green sheets, the conductive paste bodies that do not overlap with each other in the stacking direction but are aligned in the main surface direction of the ceramic green sheet, A step of providing in a region corresponding to the unnecessary portion in the ceramic green sheet,
The conductive paste body is adjacent to the other ceramic adjacent to a space between the plurality of conductive paste bodies provided on the adjacent ceramic green sheet on a cross section along the stacking direction of the ceramic green sheets. Aligned so that the conductive paste body provided on the green sheet is located,
Manufacturing method of multilayer ceramic electronic component.   The conductive paste bodies are arranged in a zigzag manner along the principal surface direction of the ceramic green sheets, and in the space between the conductive paste bodies provided on one of the adjacent ceramic green sheets, The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the conductive paste bodies provided on the other adjacent ceramic green sheet are positioned so as to be positioned.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the unnecessary portion provided with the conductive paste body is provided in a peripheral region of the ceramic green sheet.   4. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the unnecessary portion on which the conductive paste body is provided is provided in a band-shaped region having a predetermined width across a central portion of the ceramic green sheet. .   5. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the wiring conductor necessary for the multilayer ceramic electronic component includes a via-hole conductor extending so as to penetrate the plurality of ceramic green sheets in the stacking direction. . A collective electronic component having a multilayer structure constituted by a plurality of ceramic layers and capable of taking out a plurality of multilayer ceramic electronic components by dividing along a predetermined dividing line,
An unnecessary portion that does not become the multilayer ceramic electronic component is formed of a sintered body of conductive paste that is adjacent to the ceramic layer but does not overlap with each other in the stacking direction but is aligned in the main surface direction of the ceramic layer. A conductor is provided,
Said conductor, on the cross section along the stacking direction of the ceramic layers, the spacing portion of the plurality of the conductors kicked set to one adjacent the ceramic layer, the which kicked set on the ceramic layer adjacent the other Aligned so that the conductor is located,
Collective electronic components. Said conductor, said are arranged to be along the main surface direction of the ceramic layers arranged respectively in a zigzag shape, the spacing portion of said eclipse set to one the ceramic layer of the adjacent conductor, adjacent the other of said ceramic layer the conductor eclipsed set in are aligned so as to be positioned, a set electronic component according to claim 6.   The collective electronic component according to claim 6, wherein the unnecessary portion provided with the conductor is located in a peripheral region of the ceramic layer.   The collective electronic component according to any one of claims 6 to 8, wherein the unnecessary portion provided with the conductor is located in a belt-like region having a predetermined width across a central portion of the ceramic layer.

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