JP2005045122A - Plate-like body unloading device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plate-like body unloading device which can deliver a plate-like body stored in lamination in a housing container to a plate-like body supply place in its stable state restraining breakage of the plate-like body. <P>SOLUTION: Using a plate-like body transferring means 3 in the plate-like body unloading device, a plate-like body 7 is held with holding action on an upward rear surface 7b of the plate-like body 7 stored in lamination inside a housing container 6 placed upside down in a delivery position B with a bottom 9 opened. The held plate-like body 7 is moved to be unloaded from the housing container 6 and inverted to turn a surface 7a upward. The plate-like body 7 in a position to turn the surface 7a upward is delivered to the plate-like body supply place E. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a plate-shaped body take-out device for taking out a plate-shaped body stored in a stacked state in a storage container.

Such a plate-like body taking-out device is used for taking out a plate-like body such as a semiconductor wafer or a glass substrate for liquid crystal from a storage container. In other words, in the factory where the pre-process is performed, processing is performed to form a circuit or the like at the center of the surface of a plate-like body such as a semiconductor wafer or a glass substrate for liquid crystal, and the processed plate-like body is adjacent. The interposer is stored in a stacked state in such a manner that an interposer is loaded between the objects, and the surface side on which a circuit or the like is formed faces the lid part side, and the storage container storing the plate-like body is subjected to a post-process. In a factory that transports to a factory and performs a post-process, a plate-shaped body such as a transport container for transporting the plate-shaped body in the factory that performs the post-process by taking out the plate-shaped body from the storage container with a plate-shaped body take-out device. It was handed over to the supply point.
Conventionally, the lid of the storage container placed in the upright position is artificially opened, and the plate is stored in a stacked state in the storage container placed in the upright position and with the lid open. The plate-like body is taken out from the storage container and transferred to the plate-like body supply location by the plate-like body transfer means provided in the plate-like body take-out device, and the plate-like body transfer means faces upward. Holding the plate-like body by adsorbing with the suction pad against the surface, moving the held plate-like body so that it can be taken out of the storage container, and keeping the surface facing upward, the plate-like body is plate-like It was configured to be delivered to the body supply location. Further, the plate-like body transfer means holds and holds the inclusions by sucking and holding the inclusions with the suction pad, and takes out the held inclusions from the storage container and delivers them to the inclusion collection point. (For example, refer patent document 1).

JP 2001-294292 A

  In the conventional plate-shaped body take-out device, the plate-shaped body transfer means is configured to hold the surface of the plate-shaped body and deliver it to the plate-shaped body supply location. When taking out a semiconductor wafer or a glass substrate for liquid crystal as a body, a circuit or the like is formed at the center of the surface of the plate-like body, so that the plate-like body transfer means in the plate-like body The range that can be held is limited to the peripheral portion excluding the central portion where the circuit or the like is formed. Therefore, when the plate-shaped body transfer means transfers the plate-shaped body stored in a stacked state in the storage container to the plate-shaped body supply location, the central portion where the holding portion is shifted and the circuit or the like is formed is shifted. The circuit of the plate-like body etc. may be held by deforming and damaging the plate-like body by applying a large stress to the plate-like body in an attempt to hold the plate-like body only at the peripheral edge. There was a risk of damage.

  The present invention has been made in view of the above circumstances, and its purpose is to provide a plate when the plate-like body stored in a storage container in a stacked state is delivered to the plate-like body supply location by the plate-like body transfer means. It is in the point which provides the plate-shaped body taking-out apparatus which can suppress damage to the circuit etc. of a shaped body.

  According to claim 1, in the plate-shaped body take-out device for taking out the plate-shaped bodies stored in a stacked state in the storage container, the storage container placed in the receiving place in the inverted state and with the bottom opened. Holds the plate-like body by holding it against the back side of the plate-like body stored in a stacked state and moves the held plate-like body so as to be taken out of the storage container, and the surface faces upward It is characterized in that plate-like body transfer means is provided for transferring the plate-like body with the surface facing upward to the plate-like body supply location.

  That is, the plate-like body transfer means holds the plate-like body from the storage container placed in the receiving place with the top and bottom inverted and with the bottom open, against the back surface facing upward of the plate-like body. Holding, moving the held plate-like body so as to be taken out of the storage container, turning the surface upside down, and transferring the plate-like body in a posture in which the surface faces up to the plate-like body supply location Become. And, the back side of the plate-like body on which the plate-like body transfer means holds and acts on the plate-like body is, for example, that the circuit is not formed on the back side of the semiconductor wafer. When holding the plate-like body, the entire back surface thereof can be used to hold the plate-like body, and when holding the plate-like body, a large range of the entire back surface of the plate-like body is used. Thus, the plate-like body can be held so that a large stress is not locally applied, and the circuit or the like can be prevented from being damaged due to deformation damage of the plate-like body. Moreover, as a matter of course, the circuit or the like is not formed on the back surface of the plate-like body, and the circuit or the like may be damaged without holding the central portion of the surface on which the circuit or the like is formed. There is no.

  Accordingly, the plate-like body transfer means can suppress the breakage of the plate-like body circuit and the like when the plate-like body stored in a stacked state in the storage container is delivered to the plate-like body supply location. It came to be able to provide a body extraction apparatus.

  According to a second aspect of the present invention, the plate-like body is stored in the storage container in a stacked state in such a manner that an interposition is loaded between adjacent ones, and the interposition is held and taken out from the storage container. In this way, there is provided an intermediary transfer means for delivering to the intermediary body collection point.

  That is, the intermediary transfer means for holding the interposer and taking it out of the storage container and delivering it to the intermediary body collection point holds the plate-like body and takes it out from the storage container and delivers it to the plate-like body supply location Since it is provided separately from the transfer means, the plate-like body is held and taken out from the storage container and transferred to the plate-like body supply location, and the interposer is held and taken out from the storage container to the inclusion collection location. You can share the work of delivery.

  Accordingly, while the plate-like body is held by the plate-like body transfer means and taken out from the storage container and transferred to the plate-like body supply location, the inclusion body is held and stored by the intermediate body transfer means. Since it can be taken out from the container and delivered to the inclusion collection point, and the work time can be shortened, a plate-like body take-out device with high work efficiency can be provided.

  According to claim 3, the plate-like body transfer means is composed of a pre-conveying processing unit and a post-conveying processing unit, and the pre-conveying processing unit is in an upside down state with the bottom opened. Holding the plate-like body by holding the plate-like body facing the upper side of the plate-like body stored in a stacked state in the storage container placed at the receiving location, and storing the held plate-like body It is configured to be moved so as to be removed from the container and to be transferred so that the surface is turned upside down so that the temporary placement unit is transferred, and the temporary placement unit is placed in a posture in which the surface is directed upward in the pre-conveying processing unit. The space for operation is formed below the plate-like body to be removed, and the post-conveying processing unit is placed on the temporary placement unit in a posture in which the surface faces upward in the pre-conveying processing unit. Holds the plate-like body by holding the downward-facing back surface of the plate-like body And it is characterized in that the surface of the plate-shaped body is configured to pass to the plate-like member supply portion while the posture of upward.

  That is, the plate-like member is held on the back surface of the plate-like body that is stored in a stacked state in the storage container placed in the receiving place with the bottom inverted and the bottom open. A plate-like shape in which the body is held, moved so that the held plate-like body is taken out from the storage container, and inverted so that the surface is directed upward, in the pre-conveying processing unit, and the surface is directed upward The transfer of the body to the plate-shaped body supply location is performed by the post-conveying processing unit, and the work performed by the plate-shaped body transfer means is divided between the pre-conveying processing unit and the post-conveying processing unit Since it can carry out, the structure of each conveyance processing part can be simplified.

  And, the holding of the back surface of the plate-like body by the post-conveying processing unit is to hold the plate-like body while supporting the plate-like body in the post-conveying processing portion because the back surface of the plate-like body is facing downward. Since the holding force is sufficient to prevent the plate-like body from being displaced, the holding force for the plate-like member may be smaller than that holding the back surface facing upward of the plate-like body. Since it is easy to configure the thickness of the portion to be held while supporting the back surface of the plate-like body in the post-conveying processing unit, in particular, the plate-like body is supplied to the conveyance container as the plate-like body supply point. Even in the case where the plates are stored in a stacked state at relatively narrow intervals, the possibility that the previously transferred plate-shaped body and the plate-shaped body transfer means interfere with each other can be reduced. The storage container includes support portions arranged in a relatively narrow interval in the vertical direction, and is configured to support the peripheral portion of the plate-like body by the support portions.

  According to a fourth aspect of the present invention, there is provided storage container top-and-bottom reversing means for reversing the storage container received in a top-and-bottom state at the preliminary receiving position and supplying the storage container to the receiving position.

  That is, even if the storage container is received in the upright position, the storage container can be automatically reversed upside down by the storage container upside down means, so there is no need to artificially reverse the storage container upside down. Can improve the problem.

  According to a fifth aspect of the present invention, there is provided a storage container opening operation means for opening a bottom portion of the storage container placed in an upside-down state at the receiving location.

  In other words, since the bottom of the storage container placed in an upside-down state at the receiving location can be automatically opened by the storage container opening operation means, it is not necessary to manually open the bottom of the storage container, which is complicated and troublesome. The problem can be improved.

  Hereinafter, the case where the plate-like body extraction device according to the present invention is applied to a wafer extraction device that takes out a semiconductor wafer as a plate-like body stored in a stacked state in a storage container will be described with reference to the drawings.

  As shown in FIG. 1, the wafer take-out apparatus S includes a storage container top / bottom reversing means 1 for reversing the storage container 6 received in the top / bottom position at the preliminary receiving position A and supplying the storage container 6 to the receiving position B, and the receiving position B. The storage container opening operation means 2 for opening the bottom 9 of the storage container 6 placed in the upside down state, and the storage container 6 placed in the receiving position B in the upside down state and with the bottom 9 opened. The wafer 7 is held by acting on the back surface 7b facing upward of the wafer 7 stored in a stacked state therein, and the held wafer 7 is moved so as to be taken out from the storage container 6 and the front surface 7a. Wafer transfer means 3 serving as a plate-like body transfer means for delivering a wafer having a posture in which the surface 7a faces upward into a transfer container E serving as a plate-like body supply location, and a storage container. 6 is housed Is constituted by the interposer transfer means 4 for holding the inner 8 and the cushioning material 12 as an intervening member is taken out from the container 6 passes the interposer collection point C.

  As shown in FIGS. 2 and 3, the storage container 6 includes a bottom portion 9 and a lid portion 10. The bottom portion 9 includes a bottom plate peripheral wall portion 9b that stands from the substantially square plate-like bottom plate 9a around the storage portion 11, and a pair of engaging portions 9c that stand from two opposite corner portions of the bottom plate 9a. And are provided. Further, the lid portion 10 is engaged with the top plate peripheral wall portion 10b erected around the storage portion 11 from the substantially square plate-like top plate 10a and the two opposing corners of the top plate 10a. A pair of engaged portions 10c that engage with the portion 9c are provided.

  Then, as shown in FIG. 3, the storage container 6 is configured such that the engaging portion 9 c of the bottom portion 9 is engaged with the engaged portion 10 c of the lid portion 10 and the bottom portion 9 is assembled to the lid portion 10, thereby 11 can be in a state of being covered in a substantially sealed state by the bottom plate 9a and the bottom plate peripheral wall portion 9b of the bottom portion 9, and the top plate 10a and the top plate peripheral wall portion 10b of the lid portion 10. As shown in FIG. 2, the storage portion 11 of the storage container 6 is stacked in a form in which an inner 8 is loaded between adjacent wafers 7, and the wafer 7 in the stacked state is further stacked. In a state where the upper and lower sides are sandwiched between the buffer materials 12, the wafer 7 is stored so that the front surface 7a faces the top plate 10a and the back surface 7b of the wafer 7 faces the bottom plate 9a.

  As shown in FIGS. 4 and 5, the storage container top-and-bottom reversing means 1 includes a swing frame 15 that swings around the horizontal axis by driving a reversing motor 13, and a tip of the swing frame 15. It comprises a pair of gripping arms 16 that are slidably supported. The gripping arm 16 is configured to be changeable between an open state in which the gripping arm 15 is separated from each other and a closed state in which the gripping arm 15 is close to each other by driving of the gripping drive device 14 provided in the swing frame 15. Yes.

As shown in FIGS. 6 and 7, the storage container opening means 2 acts on the clamping mechanism 18 that holds the storage container 6 supplied to the receiving location B with the work table 5 and the engaging portion 9c from below. Then, the unlocking mechanism 19 for releasing the locking of the locking portion 9c from the locked portion 10c and the bottom portion 9 is sucked and held by the bottom suction pad 20, and the lifting main body attached with the bottom suction pad 20 is attached. A bottom lifting mechanism 21 that moves the portion 25 up and down and horizontally moves the lid 10 to the lateral side of the work table 5 is provided.
The lock release mechanism 19 will be described in detail. The lock release mechanism 19 includes a pair of release arms provided with a release body 23 that moves up and down by driving a motor (not shown) and an action portion 22a that acts on the lock portion 9c. The base end sides of the respective 22 are provided so as to be slidable laterally. A release motor 24 that slides the release arm 22 is provided inside the release body 23.

  Next, the wafer transfer means 3 will be described. As shown in FIG. 1, the wafer transfer means 3 is composed of a pre-transfer processing unit 3A and a post-transfer processing unit 3B, and the pre-transfer processing unit 3A opens the bottom 9 in the upside down state. The wafer 7 is held by acting on the back surface 7b facing the upper side of the wafer 7 stored in a stacked state in the storage container 6 placed in the receiving place B in the state. It moves so that it may take out from the said storage container 6, and it is comprised so that it may be reversed so that the surface 7a may become upwards, and it may transfer to the temporary placement part D, and the said temporary placement part D is the said front conveyance process part 3A. The operation space 26 is formed below the wafer 7 placed in a posture in which the surface 7a faces upward, and the rear transfer processing unit 3B has the surface 7a facing upward in the front transfer processing unit 3A. Placed in the temporary placement part D in a posture The wafer 7 is held by holding down the lower surface 7b of the wafer 7, and the held wafer 7 is transferred into the transfer container E with the front surface 7a facing upward. Yes.

  As shown in FIG. 8, the pre-transport processing unit 3 </ b> A includes a front transport base 31, a front transport support 32 in which the lower end side is slidably fitted in the up and down direction, and the front transport base 31. Then, the front transport drive mechanism 33 that slides the front transport support 32 relative to the front transport base 31 and the upper end of the front transport support 32 are laterally driven by the drive of the front transport motor 34. A front transfer arm 35 that swings around a shaft center with a base end side as a fulcrum, and a front transfer suction pad 36 supported on the front end side of the front transfer arm 35 are provided.

  As shown in FIG. 9, the post-conveying processing unit 3B includes a post-conveying base 41, a post-conveying support body 42 in which the lower end side is slidably moved in the vertical direction and is rotatably fitted around the vertical axis. A rear transport drive mechanism 43 that is mounted on the rear transport base 41 and slides and rotates the rear transport support 42 relative to the rear transport base 41, and an upper end portion of the rear transport support 42. And a rear transfer arm 45 that swings around the vertical axis around the base end side as a fulcrum, and an upper surface on the distal end side of the rear transfer arm 45. A post-delivery suction pad 46 is provided. The rear transfer arm 45 has three arm portions connected by two joint mechanisms 47, and the respective arm portions relatively rotate around the longitudinal axis at the joint mechanism 47 by a drive mechanism (not shown). The rear end of the rear transfer arm 45, that is, the rear transfer suction pad 46 is configured to be movable relative to the rear transfer support 42.

  As shown in FIG. 10, the interposer transfer means 4 includes an interposer base 51 and an interposer support 52 that is fitted in the lower end side so as to be slidable in the vertical direction and rotatable about the vertical axis. An intervening body drive mechanism 53 that is slidably moved and rotated with respect to the intervening body base 51 and is mounted on the intervening body base 51, and an upper end of the intervening body support body 52. And an intermediate arm 55 that swings about the longitudinal axis about the base end side as a fulcrum, and a lower surface on the distal end side of the intermediate arm 55. It is comprised including the suction pad 56 for the intervening body provided in the.

  In the temporary placement portion D, four wafer support columns 27 are erected on the work table 5, and the wafer 7 is placed in a posture in which the surface 7 a faces upward over the respective tip portions of the wafer support columns 27. The space inside the wafer supporting column 27 below the placed wafer 7 is formed as the operation space 26. Each tip of the wafer support column 27 is provided with a protrusion that acts on the side surface of the wafer 7. Further, the transfer container E is configured to support the peripheral edge of the wafer 7 by the support portion 29, and is held on the work table 5 by a clamp with the opening portion facing sideways.

  Next, the operation of each means when taking out the wafers stored in a stacked state in the storage container 6 will be described. The storage container 6 storing the wafers 7 and the like as described above is received by the external device (not shown) in the upright position where the lid 10 is positioned above the bottom portion 9 at the preliminary receiving location A, and the preliminary receiving location. A storage container 6 is placed on A in an upright position.

The supply operation of the storage container 6 to the receiving location B by the storage container top / bottom reversing means 1 will be described. The supply operation starts when the storage container 6 is placed in the upright position at the preliminary receiving location A.
As shown in FIGS. 4 and 5, first, the swing frame 15 is moved around the horizontal axis so that the storage container 6 placed at the preliminary receiving location A is positioned between the pair of open gripping arms 16. The storage container 6 is gripped with the gripping arm 16 in a closed state by swinging to the preliminary receiving location A side. Then, while holding the storage container 6, the swing frame 15 is horizontally moved so that the storage container 6 is supplied to the receiving location B in the upside down state where the bottom portion 9 is positioned above the lid portion 10. Swing to the receiving location B side around the shaft core. Thereafter, the gripping arm 16 is opened, the swing frame 15 is swung toward the preliminary receiving position A, and the storage container top / bottom reversing means 1 is retracted from the receiving position B.

An opening operation for opening the bottom 9 of the storage container 6 by the storage container opening means 2 will be described. The opening operation starts when the storage container 6 is placed in the upside-down state at the receiving location A and the bottom portion 9 is assembled to the lid portion 10.
As shown in FIG. 6, first, the clamping mechanism 18 holds the lid 10 of the storage container 6 so as not to move. Then, as shown in FIG. 7, the release arm 22 is slid inward to raise the release main body 23 so that the tip 22a of the release arm 22 is positioned on the inner side of the locking portion 9c. The release arm 23 is slid outward and the action portion 22a is moved outward from the storage container to release the lock of the lock portion 9c from the locked portion 10c. Thereafter, the bottom lifting mechanism 21 is lowered, the bottom 9 is sucked and held by the bottom suction pad 20, and the bottom lifting mechanism 21 is lifted, so that the bottom of the storage container 6 is opened.

A pre-transfer operation for transferring to the temporary placement unit D by the pre-conveying processing unit 3A in the plate-like body transfer means 3 will be described. Note that the pre-transfer operation starts when the storage container 6 with the bottom 9 opened at the receiving location B is placed upside down and the wafer 7 is stored in the uppermost position in the storage unit 12.
As shown in FIG. 8, first, the front transport arm 35 is swung to the receiving position B side, and the front transport support 32 is slid downward so that the front transport suction pad 36 is lowered, The front transfer suction pad 36 is brought into contact with the back surface 7b facing upward of the wafer 7, and the back surface 7b of the wafer 7 is sucked and held by the suction action of the front transfer suction pad 36. Thereafter, the front transfer support 31 is slid upward so that the front transfer suction pad 36 is lifted, the suctioned and held wafer 7 is taken out of the storage container 6, and the front transfer arm 35 is temporarily placed in the temporary placement portion D. The wafer 7 that has been sucked and held is inverted so that the surface 7a faces upward, and the front carrier support 32 is moved downward so that the front carrier suction pad 36 is lowered. By sliding, the wafer 7 is placed on the temporary placement part D so that the surface 7a faces upward. Then, the suction holding by the front carrying suction pad 36 is released, and the front carrying support 32 is slid downward and retracted so that the front carrying suction pad 36 is lowered.

The post-transfer operation of transferring to the transfer container E by the post-transfer processing unit 3B in the wafer transfer means 3 will be described. The post-transfer operation starts in a state where the wafer 7 is placed on the temporary placement portion D with the surface 7a facing upward.
As shown in FIG. 9, first, the rear transfer arm 45 is moved by the rear transfer suction pad 46 by the rear transfer arm 45 with respect to the rear transfer support 42 and the rotation of the rear transfer support 42. The rear transport suction pad 46 is positioned in the operation space 26, and the rear transport support 42 is slid upward so that the rear transport suction pad 46 is lifted, so that the rear transport suction is performed. The pad 46 is brought into contact with the back surface 7 b facing downward of the wafer 7, and the back surface 7 b of the wafer 7 is sucked and held by the suction action of the post-transport suction pad 46. Thereafter, the rear transport support 42 is slid upward so that the rear transport suction pad 46 is raised, and the rear transport suction pad 46 is moved far and near with respect to the rear transport support 42 by the rear transport arm 45. In addition, the post-conveyance support 42 is rotated and stored in the conveyance container E. When the wafer 7 is stored in the transfer container E, the rear transfer support 42 is slid up and down so as to be placed on a predetermined support portion 29 in the transfer container E. Then, the suction holding by the rear transport suction pad 46 is released, and the rear transport support 42 is slid down and retracted so that the rear transport suction pad 46 is lowered.

The delivery operation of delivering the inner 8 and the cushioning material 12 to the inclusion collection point D by the cushioning material transfer means 4 will be described. The delivery operation starts when the storage container 6 with the bottom 9 opened at the receiving location B is placed upside down and the inner part 8 or the cushioning material 12 is stored in the uppermost part in the storage part 11.
As shown in FIG. 10, first, the intervening body support body 52 is rotated so that the intervening body suction pad 56 is positioned above the inner 8 or the cushioning material 12 housed in the housing portion 11. The intermediate support 52 is slid downward so that the suction pad 56 is lowered, and the intermediate suction pad 56 is brought into contact with the upper surface of the inner 8 or the buffer material 12. The upper surface of the inner 8 or the buffer material 12 is sucked and held by the sucking action. Thereafter, the intermediate support 52 is slid upward so that the intermediate suction pad 56 rises, the intermediate support 52 is rotated, and the intermediate suction pad 56 is moved to the intermediate collection location. Located above C. Thereafter, the suction holding by the intervening body suction pad 56 is released, and the inner 8 or the buffer material 12 is dropped to the intervening body collection point C and delivered.

[Another embodiment]
(1) In the above-described embodiment, the plate-shaped body transfer means includes a pre-transport processing section and a post-transport processing section, and transports the plate-shaped body transported from the storage container to the plate-shaped body supply location. In order to temporarily place in the temporary placement unit, it is configured to transfer to the temporary placement unit, but without being temporarily placed in the temporary placement unit, it is transferred directly from the storage container to the plate-like body supply location. It may be configured.

That is, as shown in FIGS. 11 and 12, the conveyance processing unit 60 as the plate-like body transfer means is configured so that the conveyance base 61 and the lower end side are slidable in the vertical direction and are rotatable around the vertical axis. The transport support 62 fitted, the transport base 61, and a transport drive mechanism 63 that slides and rotates the transport support 62 with respect to the transport base 61, and the transport support. The base end side is connected to the upper end portion of 62, and a transport arm 65 that swings around the vertical axis around the base end side as a fulcrum by the rotation of the transport support 62, and provided at the front end side of the transport arm 65. And a conveyance suction pad 66. The transfer arm 65 has three arm portions connected by a base end side joint mechanism 67 and a front end side joint mechanism 68, and is driven by a drive mechanism (not shown) at the base end side joint mechanism 67. The intermediate arm portion and the intermediate arm portion rotate relative to each other around the longitudinal axis, and the intermediate arm portion and the distal arm portion rotate relative to each other around the longitudinal axis at the joint mechanism 68 on the distal end side. The transfer arm 65 is configured such that the front end side of the transfer arm 65, that is, the transfer suction pad 66 is movable relative to the transfer support body 62, and further includes the transfer suction pad 66. The distal arm portion is connected and configured to swing around a horizontal axis located on the distal end side of the intermediate arm portion.

A transfer operation of transferring to the transfer container E by the plate-like body transfer means 60 will be described. The transfer operation starts when the storage container 6 having the bottom 9 opened at the receiving location B is placed upside down and the wafer 7 is stored in the uppermost position in the storage unit 12.
As shown in FIG. 12, first, the transfer arm 65 is swung to the receiving location B side, and the transfer arm 65 moves the distance between the transfer suction pad 66 and the transfer support 62, and the transfer support 62. , The transfer suction pad 66 is brought into contact with the back surface 7b facing upward of the wafer 7, and the back surface 7b of the wafer 7 is sucked and held by the suction action of the transfer suction pad 66. Thereafter, the transport support 62 is slid upward so that the transport suction pad 66 rises, the transport arm 65 is swung to the transport container E side, and the transport suction pad 66 is moved by the transport arm 65. The container is accommodated in the transport container E by the near-far movement with respect to the transport support 62 and the rotation of the transport support 62. When the wafer 7 is stored in the transfer container E, the rear transfer support 62 is slid up and down so as to be placed on a predetermined support portion 29 in the transfer container E. Then, the suction holding by the transport suction pad 66 is released, and the rear transport support 62 is slid downward to be retracted so that the transport suction pad 66 is lowered.

(2) In the above-described embodiment, when the post-conveying processing unit 3B transfers from the temporary storage unit to the transport container E, the back surface of the plate-like body is sucked and held. You may comprise so that it may hold | maintain by hold | gripping to a surface direction.

(3) In the above embodiment and the other embodiments (1) and (2), a semiconductor wafer is used as the plate-like body. However, a glass substrate for liquid crystal may be used, and the shape and size of the plate-like body may be used. Is not limited to the above embodiment.

Plan view of plate-shaped body take-out device Exploded perspective view of storage container Perspective view of storage container Top view of storage container top and bottom reversing means Side view of storage container top and bottom reversing means The figure which shows a storage container opening means The figure which shows a storage container opening means Side view of the front transfer processing unit Side view of rear transfer processing unit Side view of buffer material transfer means The top view of the plate-shaped object taking-out apparatus in another embodiment Side view of the conveyance processing unit in another embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Storage container top and bottom reversing means 2 Storage container opening means 3 Plate-shaped body transfer means 3A Front conveyance processing part 3B Rear conveyance processing part 4 Inclusion transfer means 6 Storage container 7 Plate-shaped body 7a Surface 7b Back surface 8 Inclusion (inner )
9 Bottom part 10 Lid part 12 Buffer material A Preliminary receiving part B Receiving part C Temporary placing part D Inclusion body collecting part E Plate body supply part S Plate body taking out apparatus

Claims (5)

A plate-like body take-out device for taking out a plate-like body stored in a stacked state in a storage container,
The plate-like body is held and acted on the back surface of the plate-like body, which is stored in a stacked state in the storage container placed in the receiving place with the bottom inverted, with the bottom open. A plate shape that holds, moves the held plate-like body so as to be removed from the storage container, and reverses the surface so that the surface faces upward, and delivers the plate-like body with the surface facing upward to the plate-like body supply location. A plate-like body take-out device provided with body transfer means. The plate-like body is stored in the storage container in a stacked state in a form of loading an intervening body between adjacent ones,
The plate-shaped body taking-out apparatus according to claim 1, further comprising an intermediary transferring means for holding the interposing body, taking it out from the storage container, and delivering it to an intervening body collection point. The plate-like body transfer means is composed of a pre-conveying processing unit and a post-conveying processing unit,
The pre-transport processing unit holds the back surface facing upward of the plate-like body stored in a stacked state in the storage container placed in the receiving place with the bottom inverted and the bottom open. The plate-like body is held, and the held plate-like body is moved so as to be taken out from the storage container, and is inverted so that the surface is directed upward, and transferred to the temporary placement portion,
The temporary placement unit is configured to form an operation space below the plate-like body placed in a posture in which the surface is directed upward in the pre-conveying processing unit,
The post-conveying processing unit holds the plate-shaped body by holding and acting on the downwardly facing back surface of the plate-shaped body placed on the temporary placement unit in a posture in which the surface is facing upward in the pre-conveying processing unit. The plate-shaped body take-out device according to claim 1, wherein the held plate-shaped body is configured to be delivered to the plate-shaped body supply portion with the surface thereof facing upward.   The plate-shaped body according to any one of claims 1 to 3, further comprising a storage container top / bottom reversing means for reversing the storage container received in a top-and-bottom position at a preliminary receiving position and supplying the storage container to the receiving position. Take-out device.   5. The plate-like body take-out device according to claim 1, further comprising a storage container opening operation unit configured to open a bottom portion of the storage container placed in an inverted state at the receiving location.

Images