JP2005039261A5 - - Google Patents

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Publication number
JP2005039261A5
JP2005039261A5 JP2004192542A JP2004192542A JP2005039261A5 JP 2005039261 A5 JP2005039261 A5 JP 2005039261A5 JP 2004192542 A JP2004192542 A JP 2004192542A JP 2004192542 A JP2004192542 A JP 2004192542A JP 2005039261 A5 JP2005039261 A5 JP 2005039261A5
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JP
Japan
Prior art keywords
opening
insulating film
manufacturing
semiconductor device
conductive layer
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Application number
JP2004192542A
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English (en)
Japanese (ja)
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JP2005039261A (ja
JP4619050B2 (ja
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Priority to JP2004192542A priority Critical patent/JP4619050B2/ja
Priority claimed from JP2004192542A external-priority patent/JP4619050B2/ja
Publication of JP2005039261A publication Critical patent/JP2005039261A/ja
Publication of JP2005039261A5 publication Critical patent/JP2005039261A5/ja
Application granted granted Critical
Publication of JP4619050B2 publication Critical patent/JP4619050B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004192542A 2003-06-30 2004-06-30 表示装置の作製方法 Expired - Fee Related JP4619050B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004192542A JP4619050B2 (ja) 2003-06-30 2004-06-30 表示装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003186144 2003-06-30
JP2004192542A JP4619050B2 (ja) 2003-06-30 2004-06-30 表示装置の作製方法

Publications (3)

Publication Number Publication Date
JP2005039261A JP2005039261A (ja) 2005-02-10
JP2005039261A5 true JP2005039261A5 (https=) 2007-07-05
JP4619050B2 JP4619050B2 (ja) 2011-01-26

Family

ID=34220428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004192542A Expired - Fee Related JP4619050B2 (ja) 2003-06-30 2004-06-30 表示装置の作製方法

Country Status (1)

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JP (1) JP4619050B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1920459A4 (en) * 2005-08-12 2012-07-25 Semiconductor Energy Lab METHOD OF MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
JP5014749B2 (ja) * 2006-11-27 2012-08-29 三菱電機株式会社 炭化珪素半導体装置の製造方法
WO2011046025A1 (en) 2009-10-16 2011-04-21 Semiconductor Energy Laboratory Co., Ltd. Logic circuit and semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215043A (ja) * 1988-02-24 1989-08-29 Hitachi Ltd 層間膜への透孔加工方法
JP3248234B2 (ja) * 1992-04-21 2002-01-21 ソニー株式会社 埋め込みプラグの形成方法
JPH05335424A (ja) * 1992-05-28 1993-12-17 Alps Electric Co Ltd 絶縁層を介した上部電極と下部電極の導通方法及びその構造
JP3317095B2 (ja) * 1995-06-30 2002-08-19 株式会社村田製作所 圧電共振子及びこの圧電共振子を用いた圧電部品
JPH10270442A (ja) * 1997-03-27 1998-10-09 Seiko Epson Corp 半導体集積装置の製造方法、および半導体集積装置
JPH1197392A (ja) * 1997-09-16 1999-04-09 Ebara Corp 微細窪みの充填方法及び装置
JP4202454B2 (ja) * 1997-11-27 2008-12-24 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
TW486824B (en) * 1999-03-30 2002-05-11 Seiko Epson Corp Method of manufacturing thin-film transistor
JP4954380B2 (ja) * 2000-03-27 2012-06-13 株式会社半導体エネルギー研究所 発光装置、半導体装置
JP3896770B2 (ja) * 2000-07-07 2007-03-22 セイコーエプソン株式会社 配線間接続孔の形成方法
JP2003149831A (ja) * 2001-11-09 2003-05-21 Seiko Epson Corp 単分子層のパターン形成方法、パターン化単分子層を利用した導電膜パターンの形成方法、及び電気光学装置
JP2003243327A (ja) * 2002-02-20 2003-08-29 Seiko Epson Corp 電子デバイス、配線形成方法および配線形成装置

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