JP2005011649A - Bonding method, manufacturing method of electroluminescent panel capable of utilizing the bonding method, and electroluminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an effective bonding technology of substrates and a technology of manufacturing an organic EL panel of high quality as concerns a method of bonding two substrates without using an adhesive and a manufacturing method of an electroluminescent panel capable of utilizing the bonding method. <P>SOLUTION: The bonding method is provided with the following processes. An organic EL element is formed on a substrate (S10). Next, a resin layer and a jointing layer are formed on the organic EL element (S12). An active functional group or a radical is made generated by applying an atmospheric pressure glow discharge plasma treatment or the like under an inactive gas atmosphere under existence of reactive gas on the surface of an element substrate and the surface of a sealing substrate thus made (S14). Subsequently, the surfaces with the treatment applied are adhered together to bond the substrates (S16). Here, the substrates are pressurized or heated as needed (S18). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate bonding technique, and more particularly to a method for bonding two substrates without using an adhesive, and a method for manufacturing an electroluminescence panel that can use the bonding method.
[0002]
[Prior art]
In recent years, with the diversification of information equipment, there is an increasing need for a flat display element that consumes less power than a conventionally used cathode ray tube (CRT). As one of such flat display elements, an organic electroluminescence (hereinafter referred to as “organic EL”) element having features such as high efficiency, thinness, light weight, and low viewing angle dependency has attracted attention. Development of displays using elements is in progress.
[0003]
Among organic EL elements, organic EL elements using an organic material as a light-emitting layer can change the emission color by selecting a fluorescent material that is a light-emitting material, and can be applied to multi-color and full-color display devices. Expectations for are increasing. In addition, since the organic EL element can emit light with a low voltage, it can also be used as a backlight for a liquid crystal display device or the like.
[0004]
The organic EL element is currently in the stage of application to small displays such as digital cameras and mobile phones. However, organic EL elements are extremely sensitive to moisture. Specifically, the interface between the metal electrode and the organic layer is altered or peeled off due to the influence of moisture, or the metal electrode is oxidized to increase resistance, Phenomena such as the material itself being altered by moisture occur, and as a result, problems such as an increase in driving voltage, generation and growth of dark spots, and a decrease in emission luminance may occur.
[0005]
In order to solve such a problem, a photo-curing resin layer having moisture resistance and a low water-permeable substrate fixed on the photo-curing resin layer are provided so as to cover the organic EL element. A structure has been proposed (see, for example, Patent Document 1). Here, non-water-permeable glass is mentioned as a board | substrate fixed on photocurable resin.
[0006]
[Patent Document 1]
JP-A-5-182759 [0007]
[Problems to be solved by the invention]
However, as described in Patent Document 1, when glass is bonded to a substrate on which an organic EL element is formed via a photocurable resin layer, when the resin is cured by light, the resin shrinks to the substrate. Stress is applied, and there is a possibility of damaging the substrate and the element. This problem can be avoided to some extent by using a photo-curing resin with a low shrinkage rate. However, since the problem of shrinkage will become more prominent as the screen size of organic EL displays increases in the future, it is an effective countermeasure. Is required.
[0008]
The present invention has been made in view of these circumstances, and an object thereof is to provide an effective technique for bonding substrates. Another object of the present invention is to provide a technique for manufacturing a high-quality organic EL panel.
[0009]
[Means for Solving the Problems]
One embodiment of the present invention relates to a bonding method. This adhesion method is a method of adhering two substrates, and at least one of nitrogen gas, carbon dioxide gas, polymerizable unsaturated compound gas, and lower aliphatic hydrocarbon gas is formed on the surfaces of both substrates. Reaction containing oxygen or nitrogen by performing a treatment including at least one of plasma treatment under atmospheric pressure, plasma treatment under reduced pressure, and photo-ozone treatment in the presence of gas containing A step of generating a group or a radical, and a step of bonding two substrates together by bringing the treated surfaces into close contact with each other and applying pressure.
[0010]
By bonding a substrate using a chemical bond by a reactive group or radical generated on the surface of the substrate, even a large area substrate can be bonded without applying stress. This adhesion method may further include features in the method for manufacturing an electroluminescence panel described below.
[0011]
Another embodiment of the present invention relates to a method for manufacturing an electroluminescence panel. This method is a method of manufacturing an electroluminescent panel, and generates a reactive group or radical on the surface of a first substrate on which an electroluminescent element is formed and a second substrate for sealing the electroluminescent element. And a step of bonding the first substrate and the second substrate by bringing the treated surfaces of the first substrate and the second substrate into close contact with each other and pressurizing them. It is characterized by including.
[0012]
Using a chemical bond generated between a reactive group or radical generated on the surface of the first substrate and a reactive group or radical generated on the surface of the second substrate, the first substrate and the second substrate Are joined directly. Thereby, compared with the method of joining a board | substrate with an adhesive agent, since the stress concerning a board | substrate at the time of joining can be reduced significantly, a board | substrate can be joined without damaging a board | substrate or an organic EL element. . This method is particularly suitable for manufacturing a large screen organic EL panel. The radical may be an oxygen radical or a nitrogen radical. The reactive group may be a functional group containing oxygen or nitrogen.
[0013]
Still another embodiment of the present invention also relates to a method for manufacturing an electroluminescence panel. This method is a method of manufacturing an electroluminescence panel, and increases the content of oxygen or nitrogen on the surface of a first substrate on which an electroluminescence element is formed and a second substrate for sealing the electroluminescence element. And a step of bonding the first substrate and the second substrate by bringing the treated surfaces of the first substrate and the second substrate into close contact with each other and pressurizing them. It is characterized by including.
[0014]
The treatment may include at least one of plasma treatment under atmospheric pressure, plasma treatment under reduced pressure, and optical ozone treatment. The treatment may be performed in an inert gas atmosphere containing at least one of helium gas, argon gas, xenon gas, and krypton gas. The treatment may be performed in the presence of a gas containing at least one of nitrogen gas, carbon dioxide gas, polymerizable unsaturated compound gas, and lower aliphatic hydrocarbon gas. By performing plasma treatment or the like in the presence of a gas containing oxygen atoms or nitrogen atoms, radicals or reactive groups containing highly reactive oxygen or nitrogen can be introduced on the surface. Thereby, a board | substrate can be joined directly effectively and reliably. In addition, by introducing a chemical species having a high reaction activity on the surface, the pressure and temperature during the bonding process can be lowered, so that the substrates can be directly bonded without damaging the device. In addition, by performing such treatment in an inert gas atmosphere or a reduced pressure atmosphere, it is possible to prevent the introduced radicals and reactive groups from being deactivated by oxygen in the air and to efficiently bond the substrates. In addition, the bonding strength can be improved.
[0015]
The step of applying the treatment and the step of bonding may be performed in the same apparatus under the same gas atmosphere or a reduced pressure atmosphere. Thereby, since surface treatments such as plasma treatment and a bonding step can be performed continuously, the efficiency in mass production can be improved.
[0016]
The first substrate and the second substrate have a structure in which a bonding layer made of an inorganic material or a metal material is formed on the surface of any one of a glass plate, a plastic plate, and a metal plate. Also good. Note that the bonding layer and the base may be made of the same material. For example, when two glass substrates are bonded to each other, the glass substrate itself may be referred to as a bonding layer. By providing a bonding layer made of a material that is easy to introduce radicals or reactive groups by plasma treatment or the like on the surface, the substrates can be bonded more effectively. The bonding layer of the first substrate and the bonding layer of the second substrate may be made of the same material or different materials.
[0017]
The first substrate or the second substrate may have an elastic resin layer below the bonding layer. The resin layer may include natural rubber or synthetic rubber, such as silicon rubber or butyl rubber. By providing an elastic layer, the adhesiveness of the bonding layer can be improved and the entire surface can be reliably bonded when pressed to bond the substrates together.
[0018]
In the bonding step, the pressure applied during pressurization may be 100 kg / cm ² or less. The step of bonding includes a step of heating the surfaces, and the temperature when heating may be 100 ° C. or less. Thereby, the bad influence which acts on a board | substrate and an organic EL element in a bonding process can be suppressed to the minimum. The heating step may be performed in a reduced pressure atmosphere.
[0019]
Yet another embodiment of the present invention relates to an electroluminescence panel. In the electroluminescence panel, a first substrate on which an electroluminescence element is formed, and a second substrate for sealing the electroluminescence element include surface atoms of the first substrate and surface atoms of the second substrate. The adhesive force between the first substrate and the second substrate is 5.1 kgf / cm ² or more. That is, the first substrate and the second substrate may be bonded without using an adhesive. The first substrate and the second substrate may be bonded by a chemical bond between reactive groups or radicals introduced on the surface of each substrate. The reactive group or radical may contain an oxygen atom or a nitrogen atom. The chemical bond here is a concept including a bond by an atomic force, an intermolecular force (Van der Waals force), in addition to a covalent bond, an ionic bond, a metal bond, a coordinate bond, and a hydrogen bond.
[0020]
Still another embodiment of the present invention also relates to an electroluminescence panel. In this electroluminescence panel, a first substrate on which an electroluminescence element is formed, and a second substrate for sealing the electroluminescence element are oxygen atoms or nitrogen atoms introduced on the surface of the first substrate. It has a structure bonded by a chemical bond with oxygen or nitrogen atoms introduced on the surface of the second substrate, and the amount of oxygen atoms on the bonding surface of the first substrate or the second substrate is the first substrate. The amount of oxygen atoms in the substrate or the second substrate is 8 atm. % Or more, or the amount of nitrogen atoms on the bonding surface of the first substrate or the second substrate is 0.8 atm. Compared to the amount of nitrogen atoms inside the first substrate or the second substrate. It is characterized by more than%.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a configuration of an organic EL panel 1 according to the embodiment. In order to protect the organic EL element 20 functioning as a display element from moisture and external impact, the organic EL panel 1 is provided on a first substrate (hereinafter referred to as “element substrate”) 10 on which the organic EL element 20 is formed. It has a structure in which a second substrate (hereinafter referred to as “sealing substrate”) 30 for sealing the organic EL element is bonded. The organic EL element 20 includes a positive electrode 21, a hole injection layer 22, a hole transport layer 23, a light emitting layer 24, an electron transport layer 25, an electron injection layer on a substrate 12 on which a driving circuit such as glass or TFT is formed. 26 and the negative electrode 27 are stacked in this order. An elastic resin layer 28 and a bonding layer 29 are formed on the organic EL element 20.
[0022]
The resin layer 28 includes a resin such as silicon rubber, and is provided for imparting elasticity so that the surface of the bonding layer 29 is in close contact with the entire surface of the other substrate. As will be described later, the bonding layer 29 is provided to introduce chemical species such as radicals containing oxygen or nitrogen and active reactive groups onto the surface, and glass, plastic, SiO, SiON, SiN and other inorganic materials, It may be made of a metal material such as aluminum or ITO. In the example shown in FIG. 1, the resin layer 28 and the bonding layer 29 also function as a protective film for protecting the organic EL element 20 from moisture or the like, but in another example, an inorganic layer made of an inorganic material. A protective film constituted by a composite layer in which an organic layer made of an organic material and an inorganic layer are stacked may be further provided.
[0023]
The element substrate 10 may be an active matrix substrate or a passive matrix substrate. The sealing substrate 30 is preferably made of a material having a high transmittance in the visible light region and a high moisture permeation resistance. For example, the sealing substrate 30 may be a substrate having a base plate made of glass, plastic, metal or the like. Alternatively, glass with a color filter, glass with CCM (color conversion function), or the like may be used. In the example shown in FIG. 1, a bonding layer is not provided on the sealing substrate 30 side, but an inorganic material such as glass, plastic, SiO, SiON, or SiN, aluminum, ITO, or the like is provided on the surface of the sealing substrate 30. A bonding layer made of any of the above metal materials may be provided. The bonding layer 29 of the element substrate 10 and the bonding layer of the sealing substrate 30 may be made of the same material or different materials. Moreover, when the sealing substrate 30 is comprised from the material mentioned above, sealing substrate 30 itself has a function of a joining layer.
[0024]
In the present embodiment, when the element substrate 10 and the sealing substrate 30 are bonded together, a technique is proposed in which the substrates are directly bonded to each other by chemical bonding without using an adhesive. Thereby, the stress concerning a board | substrate by hardening shrinkage | contraction of an adhesive agent can be avoided, and a high quality organic electroluminescent panel can be manufactured.
[0025]
As a technique for adhering an object without using an adhesive, an adhesion technique using hydrogen bonding, a solid phase diffusion adhesion technique, and the like have been proposed. For example, when bonding two silicon wafers, after adding a hydroxyl group to the wafer surface, the wafers are brought into close contact with each other to form hydrogen bonds, and further heated to 200 ° C. or higher for dehydration treatment. Techniques for forming and bonding Si—O—Si bonds have been proposed. However, this method requires high-temperature treatment, and water molecules may remain at the interface, and therefore cannot be applied to the manufacture of an organic EL panel. Also, the solid phase diffusion bonding technique cannot be applied to the manufacture of an organic EL panel because high temperature and high pressure conditions are required to diffuse atoms in the solid phase.
[0026]
As shown in Examples described later, the present inventors do not adversely affect the organic EL device by introducing a reactive group or radical containing a highly reactive atom such as oxygen or nitrogen into the substrate surface. It was confirmed that the substrate can be effectively bonded under the conditions. Methods for introducing reactive groups or radicals onto the substrate surface include atmospheric pressure plasma treatment, plasma treatment under reduced pressure, and photo-ozone treatment. For example, in the atmospheric pressure glow discharge plasma processing method, an inert gas, or an inert gas and a reactive gas are introduced into a plasma reactor in which a solid dielectric is disposed on the surface of at least one of opposing parallel electrodes. Then, a voltage is applied between the electrodes to excite the atmospheric pressure glow discharge plasma, and reactive groups or radicals are introduced into the substrate surface disposed between the opposing electrodes. When the surface of the substrate thus treated was analyzed by XPS (X-ray Photoelectron Spectroscopy), an increase in the content of oxygen atoms or nitrogen atoms was observed, and a carboxyl group (-COO-) or carbonyl group (-C = O) peak increase and new expression were confirmed. Similar results are obtained when the substrate surface is treated by the photo-ozone method.
[0027]
The above treatment is preferably performed in an inert gas atmosphere or a reduced pressure atmosphere in order to prevent the introduced reactive groups or radicals from being deactivated. The inert gas may be helium gas, argon gas, xenon gas, krypton gas, or the like. In addition, the reactive gas used for introducing reactive groups or radicals in the above treatment may be nitrogen gas, carbon dioxide gas, polymerizable unsaturated compound gas, lower aliphatic hydrocarbon gas, or the like. The polymerizable unsaturated compound may be, for example, ethylene or propylene. The lower aliphatic hydrocarbon may be, for example, a methane hydrocarbon having 1 to 6 carbon atoms. Specifically, methane, ethane, propane, n-butane, isobutane, pentane, isopentane, neopentane, hexane 2-methylpentane, 3-methylpentane, 2,2, -dimethylbutane, 2,3-dimethylbutane, and the like. In the above treatment, one or more inert gases and one or more reactive gases may be mixed and introduced into the reactor.
[0028]
After performing the above-described treatment on the surface of the bonding layer 29 to introduce active reactive groups or radicals, the bonding layers of the element substrate 10 and the sealing substrate 30 are brought into close contact with each other to form a chemical bond and bond the substrates together. . At this time, the substrate may be pressurized or heated as necessary. Thereby, a chemical bond can be formed effectively. At this time, in order not to adversely affect the substrate and the organic EL element 20, the pressure when applying pressure is preferably 100 kg / cm ² , more preferably 10 kg / cm ^2, and the temperature when heating is preferably 100 It shall be below ℃. When pressurizing, it may pressurize over the whole surface or may be local. Moreover, also when heating, it may heat over the whole surface and may be local.
[0029]
By providing the resin layer 28 below the bonding layer 29, the stress applied to the organic EL element 20 when pressed is reduced. Even when the surfaces of the bonding layer 29 are not flat because the surfaces are not flat, the entire surface of the bonding layer 29 can be securely bonded by applying pressure to bend the resin layer 28.
[0030]
The step of bonding the substrates is preferably performed in an inert atmosphere or a reduced-pressure atmosphere in order not to deactivate the introduced active reactive groups or radicals. The step of treating the surface of the bonding layer 29 and the step of bonding the substrates may be performed in the same apparatus under the same gas atmosphere or a reduced pressure atmosphere. Thereby, manufacturing efficiency can be improved.
[0031]
FIG. 2 is a flowchart showing a method for manufacturing the organic EL panel of the present embodiment. First, the organic EL element 20 is formed on the substrate 12 on which a driving circuit such as a glass substrate or TFT is formed (S10). Subsequently, the resin layer 28 and the bonding layer 29 are formed on the organic EL element 20 (S12). Further, if necessary, a resin layer and a bonding layer are also formed on the sealing substrate 30 side. At this time, a process for flattening a surface to be a bonding surface may be performed. The surface of the element substrate 10 thus manufactured and the surface of the sealing substrate 30 are subjected to an atmospheric pressure glow discharge plasma treatment in the presence of an inert gas atmosphere and a reactive gas to generate active functional groups or radicals. (S14). Subsequently, the treated surfaces are brought into close contact with each other and the substrates are bonded together (S16). At this time, the substrate is pressurized or heated as necessary (S18).
[0032]
Hereinafter, an example in which a substrate is bonded using the technique of this embodiment and a comparative example in which a substrate is bonded without using the technique of this embodiment will be described.
[0033]
【Example】
FIG. 3 shows experimental conditions when the substrate A and the substrate B are bonded together in the examples and the comparative examples. In addition, the measurement of adhesive force is based on the JISK6850 adhesive-rigid adherence tensile shear bond strength test method, and the number of specimens is set to 12.5 ± 0.25 mm. It carried out as 5 pieces for each example and each comparative example. Moreover, the result of having measured the increase amount of the oxygen atom and nitrogen atom after surface treatment by the XPS analysis in case the surface of a board | substrate is glass, ITO, SiN, SiON, SiO, Al is shown in FIG.
[0034]
(Example 1)
In Example 1, the glass substrate A and the substrate B, which was formed as a bonding layer by depositing ITO on the glass substrate by a sputtering method, were bonded to each other. The ITO film thickness was 100 nm. The substrate A and the substrate B are placed in the apparatus with the bonding surfaces facing upwards, and the mixture is mixed with an argon gas: nitrogen gas: carbon dioxide gas = 100 moles: 5 moles: 5 moles at room temperature (25 ° C.) and atmospheric pressure. Inside, a discharge treatment was performed for 60 seconds. As a result of the XPS analysis, the oxygen atomic weight (atm.%) Increased by 8% and the nitrogen atomic weight (atm.%) Increased by 0.8% on the glass substrate A. Similarly, on the ITO of the substrate B, the oxygen atomic weight increased by 9% and the nitrogen atomic weight increased by 1%. However, if it is not stored in an inert atmosphere or under reduced pressure, this increased amount disappears in several minutes to several hours. The substrate subjected to the surface treatment was bonded to the treated surface with the treated surface facing each other under a press condition of 90 ° C. and 5 kg / cm ² . The tensile shear strength of the bonded substrates was an average of 5.1 kg / cm ² .
[0035]
(Examples 2 to 15)
A test was performed in the same manner as in Example 1 on substrate A and substrate B on which a bonding layer made of the material shown in FIG. Here, ITO (100 nm) was formed by sputtering, and SiN (300 nm), SiON (300 nm), and SiO (300 nm) were formed by CVD. In Example 15, the same test was performed on the aluminum substrates A and B. As a result of XPS analysis of the substrate surface after the discharge treatment, the amount of oxygen atoms was 10%, the amount of nitrogen atoms was 0.9% on the SiN surface, 12% and 1.1% on the SiON surface, and on the SiO surface, respectively. On the 10%, 1.3%, and Al surfaces, increases of 9% and 1.1% were observed, respectively. The results of measuring the tensile shear strength of these examples are shown in FIG.
[0036]
(Comparative Examples 1-15)
FIG. 3 shows the result of bonding the substrates used in Examples 1 to 15 under the same conditions as in Examples 1 to 15 without performing surface treatment. As a result, in Comparative Examples 1 to 15, adhesion of the substrate could not be confirmed.
[0037]
FIG. 5 shows a moisture resistance test (85 ° C.-85%) for the element substrate on which the organic EL element is formed and the sealing substrate, in which the same bonding layers as in Examples 1 to 15 are formed and bonded together. The result of having performed rh) is shown. In the moisture resistance test, the degree of progress of the non-light emitting portion of the organic EL element due to moisture permeating from the edge portion of the aluminum electrode was measured. For example, in Example 1, the progress of the non-light emitting portion of about 100 μm was observed after 1000 hours. It was found that the higher the adhesive force, the slower the progress of the non-light emitting portion, and the sealing substrate functions effectively. In Examples 10 to 14 in which particularly high adhesive strength was obtained, the progress of the non-light-emitting portion was slow, indicating that this was a suitable combination.
[0038]
The present invention has been described based on the embodiments. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to combinations of the respective constituent elements and processing processes, and such modifications are also within the scope of the present invention. is there.
[0039]
In the embodiment, an example in which an element substrate and a sealing substrate are bonded to each other in order to manufacture an organic EL panel has been described. However, the technique of the present embodiment can also be applied to the case where another substrate is bonded. . Moreover, it is applicable not only to an organic EL panel but also to an inorganic EL panel. In the case of an inorganic EL panel, similarly to the organic EL panel described in the embodiment, in order to protect the inorganic EL element, a structure in which a sealing substrate is bonded to an element substrate on which the inorganic EL element is formed is used. By using the technique of the embodiment, the substrates can be bonded to each other securely and firmly.
[0040]
【The invention's effect】
According to the present invention, an effective substrate bonding technique can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of an organic EL panel according to an embodiment.
FIG. 2 is a flowchart showing a method for manufacturing the organic EL panel of the embodiment.
FIG. 3 is a diagram showing experimental conditions in examples and comparative examples.
FIG. 4 is a graph showing the results of measuring the increase in oxygen atoms and nitrogen atoms after surface treatment by XPS analysis.
FIG. 5 is a diagram showing a result of a moisture resistance test performed on an element substrate on which an organic EL element is formed and a sealing substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Organic EL panel, 10 ... Element substrate, 12 ... Substrate, 20 ... Organic EL element, 21 ... Positive electrode, 22 ... Hole injection layer, 23 ... Positive Hole transport layer, 24 ... light emitting layer, 25 ... electron transport layer, 26 ... electron injection layer, 27 ... negative electrode, 28 ... resin layer, 29 ... bonding layer, 30 ... ..Sealing substrate.

Claims (19)

A method of bonding two substrates,
Plasma treatment under atmospheric pressure in the presence of a gas containing at least one of nitrogen gas, carbon dioxide gas, polymerizable unsaturated compound gas, and lower aliphatic hydrocarbon gas on the surfaces of both substrates, A step of generating a reactive group or radical containing oxygen or nitrogen by performing a treatment comprising at least one of plasma treatment under reduced pressure and photo-ozone treatment; and
Bonding the two substrates together by pressing the treated surfaces together and pressurizing;
A bonding method comprising the steps of: A method of manufacturing an electroluminescence panel,
A step of generating a reactive group or radical on the surface of the first substrate on which the electroluminescent element is formed and the second substrate for sealing the electroluminescent element;
Bonding the first substrate and the second substrate by bringing the treated surfaces of the first substrate and the second substrate into close contact with each other and applying pressure;
The manufacturing method of the electroluminescent panel characterized by including. The method for manufacturing an electroluminescent panel according to claim 2, wherein the radical is an oxygen radical or a nitrogen radical. The method for manufacturing an electroluminescent panel according to claim 2, wherein the reactive group is a functional group containing oxygen or nitrogen. A method of manufacturing an electroluminescence panel,
Performing a process of increasing the content of oxygen or nitrogen on the surface of the first substrate on which the electroluminescent element is formed and the second substrate for sealing the electroluminescent element;
Bonding the first substrate and the second substrate by bringing the treated surfaces of the first substrate and the second substrate into close contact with each other and applying pressure;
The manufacturing method of the electroluminescent panel characterized by including. 6. The electroluminescence according to claim 2, wherein the treatment includes at least one of plasma treatment under atmospheric pressure, plasma treatment under reduced pressure, and photo-ozone treatment. Panel manufacturing method. 7. The electro according to claim 2, wherein the treatment is performed in an inert gas atmosphere containing at least one of helium gas, argon gas, xenon gas, and krypton gas. Manufacturing method of luminescence panel. The process is performed in the presence of a gas containing at least one of nitrogen gas, carbon dioxide gas, polymerizable unsaturated compound gas, and lower aliphatic hydrocarbon gas. The manufacturing method of the electroluminescent panel in any one of. 9. The method of manufacturing an electroluminescent panel according to claim 2, wherein the step of performing the treatment and the step of bonding are performed in the same apparatus under the same gas atmosphere or a reduced pressure atmosphere. . The first substrate and the second substrate have a structure in which a bonding layer made of an inorganic material or a metal material is formed on the surface of any one of a glass plate, a plastic plate, and a metal plate. The method for producing an electroluminescence panel according to claim 2, wherein the electroluminescence panel is manufactured. The method for manufacturing an electroluminescence panel according to claim 10, wherein the bonding layer of the first substrate and the bonding layer of the second substrate are made of the same kind of material. 12. The method of manufacturing an electroluminescence panel according to claim 11, wherein the bonding layer of the first substrate and the bonding layer of the second substrate are made of different materials. 14. The method of manufacturing an electroluminescence panel according to claim 10, wherein the first substrate or the second substrate includes a resin layer having elasticity in a lower layer of the bonding layer. The method according to claim 13, wherein the resin layer includes natural rubber or synthetic rubber. The method for producing an electroluminescence panel according to claim 2, wherein, in the bonding step, a pressure applied during pressurization is 100 kg / cm ² or less. The method for manufacturing an electroluminescence panel according to claim 2, wherein the bonding step includes a step of heating the surfaces, and a temperature at the time of heating is 100 ° C. or less. The method of manufacturing an electroluminescent panel according to claim 16, wherein the heating step is performed in a reduced-pressure atmosphere. The first substrate on which the electroluminescent element is formed and the second substrate for sealing the electroluminescent element are formed by a chemical bond between the surface atoms of the first substrate and the surface atoms of the second substrate. Having a bonded structure,
The electroluminescence panel according to claim 1, wherein an adhesive force between the first substrate and the second substrate is 5.1 kgf / cm ² or more. A first substrate on which an electroluminescence element is formed and a second substrate for sealing the electroluminescence element are oxygen atoms or nitrogen atoms introduced into the surface of the first substrate, and the surface of the second substrate. Having a structure bonded by a chemical bond between oxygen or nitrogen atoms introduced into
The amount of oxygen atoms in the bonding surface of the first substrate or the second substrate is 8 atm. Compared to the amount of oxygen atoms in the first substrate or the second substrate. % Or more, or the amount of nitrogen atoms on the bonding surface of the first substrate or the second substrate is 0.8 atm. Compared to the amount of nitrogen atoms inside the first substrate or the second substrate. An electroluminescence panel characterized by having more than%.

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