CN109037479A - Packaging method and display panel - Google Patents
Packaging method and display panel Download PDFInfo
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- CN109037479A CN109037479A CN201810847514.9A CN201810847514A CN109037479A CN 109037479 A CN109037479 A CN 109037479A CN 201810847514 A CN201810847514 A CN 201810847514A CN 109037479 A CN109037479 A CN 109037479A
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- inorganic encapsulated
- binder course
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- encapsulated layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The embodiment of the present application provides a kind of packaging method and display panel, which includes: to provide a substrate to be packaged and a cover board；Inorganic encapsulated layer is formed on substrate to be packaged；The middle layer comprising light-sensitive material is formed on inorganic encapsulated layer, and the illumination of preset wavelength is used to hit interbed to form binder course；Organic encapsulation layer is formed on binder course；Implement preset temperature treatment process, so that light-sensitive material in binder course is respectively in conjunction with inorganic encapsulated layer and organic encapsulation layer, to ultimately form packaging film.Binder course makes inorganic encapsulated layer and organic encapsulation layer combine even closer, improve the ability that packaging film bears external force, reduce the probability of the interface peeling off phenomenon between inorganic encapsulated layer and organic encapsulation layer, and then improve the barriering effect of packaging film, the packaging film is formed on the substrate in display panel using the packaging method, steam can be effectively prevented and oxygen is in contact with substrate, the substrate is avoided to be corroded damage.
Description
Technical field
This application involves the technical fields of display panel encapsulation, specifically, this application involves a kind of packaging method and showing
Show panel.
Background technique
OLED (Organic Light-Emitting Diode, organic luminous semiconductor or Organic Electricity laser display) is close
The display lighting engineering that has gradually developed over year, due to its have many advantages, such as it is high respond, high contrast and can flexibility and by
Widely apply.Especially in display field, the application prospect of OLED is very wide, for example, booming display panel at present
Just the relevant technologies of OLED have been generallyd use.
The phenomenon that corrosion and damage is easy to appear under the action of steam and oxygen due to OLED device, it uses
The display panel of OLED device must be implemented effectively to encapsulate.Has the characteristics that flexible, display surface to adapt to display panel
The packaging film of plate is also required to the flexibility for having certain.In the prior art, the packaging film of display panel is generally by inorganic envelope
Dress layer and organic encapsulation layer is overlapping is formed, inorganic encapsulated layer can obstruct extraneous steam and oxygen, and organic encapsulation layer can be with
Guarantee the planarization on packaging film surface and stress can be discharged.
However, in the prior art, the bonding defective tightness between the inorganic encapsulated layer and organic encapsulation layer of packaging film,
It will affect the barriering effect of packaging film.For example, after display panel is by external force (such as in the handling process of display panel by
Stress in power or display panel bending process) interface that will lead between inorganic encapsulated layer and organic encapsulation layer is peeling-off
Phenomenon, so that generate gap between inorganic encapsulated layer and organic encapsulation layer, steam and oxygen enter in the gap simultaneously and display surface
For the substrate contact of display in plate, substrate is caused to be corroded damage, in this way, the barrier action of packaging film is just entirely ineffective
?.
In conclusion the prior art effectively can not obstruct steam there are packaging film and lead to the substrate quilt in display panel
The defect of corrosion and damage.
Summary of the invention
The application is directed to the shortcomings that existing way, a kind of packaging method and display panel is proposed, to solve the prior art
There is technical issues that packaging film effectively can not obstruct steam and the substrate in display panel is caused to be corroded.
First aspect, the embodiment of the present application provide a kind of packaging method, comprising: provide a substrate to be packaged and one
Cover board；Inorganic encapsulated layer is formed on substrate to be packaged；The middle layer comprising light-sensitive material is formed on inorganic encapsulated layer, is adopted
Interbed is hit with the illumination of preset wavelength to form binder course；Organic encapsulation layer is formed on binder course；Implement at preset temperature
Science and engineering skill, so that light-sensitive material in binder course is respectively in conjunction with inorganic encapsulated layer and organic encapsulation layer, to ultimately form encapsulation
Film.
Optionally, in the embodiment of the present application, inorganic encapsulated layer is silicon oxide layer, and the light-sensitive material in middle layer includes cage modle
Polysilsesquioxane based polyurethanes, cage modle polysilsesquioxane based polyurethanes include between silicon oxygen bond and silicon and other groups
Covalent bond；Organic encapsulation layer is organic resin layer, and organic resin layer includes ethylene oxide group.
Optionally, in the embodiment of the present application, the illumination of preset wavelength is used to hit interbed to form binder course, comprising: to adopt
Interbed is hit with the illumination of preset wavelength, so that the covalent bond between the silicon oxygen bond or silicon and other groups in middle layer is disconnected
It splits, obtains the binder course comprising silicon atom and oxygen atom with dangling bonds.
Optionally, in the embodiment of the present application, implement preset temperature treatment process, so that the light-sensitive material in binder course is distinguished
In conjunction with inorganic encapsulated layer and organic encapsulation layer, to ultimately form packaging film, comprising: implement preset temperature treatment process, make
It obtains the silicon atom in binder course with dangling bonds to be combined with the oxyethylene group group in organic resin layer, and the oxygen with dangling bonds
Atom is combined with the siloxy group in silicon oxide layer.
Optionally, it in the embodiment of the present application, is formed after inorganic encapsulated layer on substrate to be packaged, and in inorganic envelope
It fills and is formed before the middle layer comprising light-sensitive material on layer, further includes: using plasma bombardment method by the table of inorganic encapsulated layer
Face roughening.
Optionally, in the embodiment of the present application, after implementing preset temperature treatment process, further includes: implement stoving process.
Optionally, in the embodiment of the present application, the temperature range of preset temperature treatment process is 100 degrees Celsius to 120 Celsius
Degree, time range are 10 minutes to 20 minutes.
Optionally, in the embodiment of the present application, forming inorganic encapsulated layer on substrate to be packaged includes: using atomic layer deposition
Product technique is deposited into inorganic encapsulated layer on substrate to be packaged.
Optionally, in the embodiment of the present application, it includes: to coat or spray on binder course that organic encapsulation layer is formed on binder course
Ink printing forms organic encapsulation layer.
The second aspect, the embodiment of the present application also provides a kind of display panel, display panel uses the embodiment of the present application
The packaging method of offer is packaged；Display panel includes packaging film, and packaging film includes: on the substrate in display panel
Inorganic encapsulated layer, binder course and organic encapsulation layer, and the light-sensitive material in binder course respectively with inorganic encapsulated layer and organic envelope
Layer is filled to combine.
Optionally, in the embodiment of the present application, inorganic encapsulated layer is silicon oxide layer, and the light-sensitive material in binder course includes cage modle
Polysilsesquioxane based polyurethanes, organic encapsulation layer are organic resin layer.
Optionally, in the embodiment of the present application, inorganic encapsulated layer with a thickness of 10 nanometers to 200 nanometers；
And/or binder course with a thickness of 95 nanometers to 105 nanometers；
And/or organic encapsulation layer with a thickness of 0.5 nanometer to 5 nanometers.
Technical solution bring advantageous effects provided by the embodiments of the present application are:
During packaging film of the embodiment of the present application in formation, middle layer makes after the irradiation of the light of preset wavelength
Light-sensitive material occurs chemical change and forms binder course, and binder course, inorganic encapsulated layer and organic encapsulation layer are using preset temperature
Treatment process and chemically react so that light-sensitive material in binder course respectively with inorganic encapsulated layer and organic encapsulation layer knot
It closes, this chemically combined mode to combine even closer between inorganic encapsulated layer and organic encapsulation layer, improves encapsulation
Film bears the ability of external force, and the interface reduced between the inorganic encapsulated layer of packaging film and organic encapsulation layer is peeling-off existing
The probability of elephant, and then the barriering effect of packaging film is improved, using packaging method provided by the embodiments of the present application in display surface
The packaging film is formed on substrate in plate for display, steam can be effectively prevented and oxygen is in contact with substrate, avoid base
Plate is corroded damage, ensure that the quality of the display panel comprising the substrate.
The additional aspect of the application and advantage will be set forth in part in the description, these will become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The application is above-mentioned and/or additional aspect and advantage will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, in which:
Fig. 1 is a kind of flow diagram of packaging method provided by the embodiments of the present application；
Fig. 2 is a kind of flow diagram of the packaging method of extension provided by the embodiments of the present application；
Fig. 3 is a kind of structural schematic diagram of display panel provided by the embodiments of the present application；
Fig. 4 is the enlarged drawing in Fig. 3 provided by the embodiments of the present application at A；
Fig. 5 a is the first structural formula of cage modle polysilsesquioxane based polyurethanes provided by the embodiments of the present application；
Fig. 5 b is second of structural formula of cage modle polysilsesquioxane based polyurethanes provided by the embodiments of the present application；
Fig. 5 c is the third structural formula of cage modle polysilsesquioxane based polyurethanes provided by the embodiments of the present application；
In figure:
1- substrate；2- cover board；
3- packaging film；31- inorganic encapsulated layer；32- binder course；33- organic encapsulation layer.
Specific embodiment
The application is described below in detail, the example of embodiments herein is shown in the accompanying drawings, wherein identical from beginning to end
Or similar label indicates same or similar component or component with the same or similar functions.In addition, if known technology
Detailed description the application shown is characterized in unnecessary, then omit it.Below with reference to attached drawing description
Embodiment is exemplary, and is only used for explaining the application, and cannot be construed to the limitation to the application.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific term), there is meaning identical with the general understanding of those of ordinary skill in the application fields.Should also
Understand, those terms such as defined in the general dictionary, it should be understood that have in the context of the prior art
The consistent meaning of meaning, and unless idealization or meaning too formal otherwise will not be used by specific definitions as here
To explain.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singular " one " used herein, " one
It is a ", " described " and "the" may also comprise plural form.It is to be further understood that being arranged used in the description of the present application
Diction " comprising " refer to that there are the feature, integer, step, operation, element and/or component, but it is not excluded that in the presence of or addition
Other one or more features, integer, step, operation, element, component and/or their group.It should be understood that when we claim member
Part is " connected " or when " coupled " to another element, it can be directly connected or coupled to other elements, or there may also be
Intermediary element.In addition, " connection " used herein or " coupling " may include being wirelessly connected or wirelessly coupling.It is used herein to arrange
Diction "and/or" includes one or more associated wholes for listing item or any cell and all combinations.
How the technical solution of the application and the technical solution of the application are solved with specifically embodiment below above-mentioned
Technical problem is described in detail.
The embodiment of the present application provides a kind of packaging method, and the flow diagram of this method is as shown in Figure 1, comprising:
S1, a substrate 1 to be packaged and a cover board 2 are provided, forms inorganic encapsulated layer 31 on substrate 1 to be packaged；
S2, the middle layer comprising light-sensitive material is formed on inorganic encapsulated layer 31；
S3, the illumination of preset wavelength is used to hit interbed to form binder course 32；
S4, organic encapsulation layer 33 is formed on binder course 32；
S5, implement preset temperature treatment process so that light-sensitive material in binder course 32 respectively with inorganic encapsulated layer 31 and
Organic encapsulation layer 33 combines, to ultimately form packaging film 3.
During packaging film 3 of the embodiment of the present application in formation, middle layer makes after the irradiation of the light of preset wavelength
It obtains light-sensitive material chemical change occurs and forms binder course 32, binder course 32, inorganic encapsulated layer 31 and organic encapsulation layer 33 pass through again
Cross preset temperature treatment process and chemically react so that the light-sensitive material in binder course 32 respectively with inorganic encapsulated layer 31 and
Organic encapsulation layer 33 combines, and this chemically combined mode to combine more between inorganic encapsulated layer 31 and organic encapsulation layer 33
Step up it is close, improve packaging film 3 bear external force ability, reduce the inorganic encapsulated layer 31 and organic packages of packaging film 3
The probability of interface peeling off phenomenon between layer 33, and then improve the barriering effect of packaging film 3.To be used in display panel
In display substrate as substrate 1 to be packaged, which is formed using packaging method provided by the embodiments of the present application on substrate 1
Film 3 is filled, steam and oxygen can be effectively prevented and contacted with substrate 1, avoids substrate 1 from being corroded damage, ensure that comprising base
The quality of the display panel of plate 1.
Optionally, in the embodiment of the present application, inorganic encapsulated layer 31 is silicon oxide layer.Light-sensitive material in middle layer includes cage
Type polysilsesquioxane based polyurethanes (POSS based polyurethanes), the structural formula of cage modle polysilsesquioxane based polyurethanes include at least
Three kinds of forms as shown in Fig. 5 a to 5c comprising the covalent bond between silicon oxygen bond and silicon and other groups.Organic encapsulation layer
33 be organic resin layer, and organic resin layer includes ethylene oxide group.
Above step is described in detail separately below.
Optionally, the S3 in the embodiment of the present application, use the illumination of preset wavelength to hit interbed to form binder course 32, packet
It includes:
Interbed is hit using the illumination of preset wavelength, so that between the silicon oxygen bond or silicon and other groups in middle layer
Breaking of covalent bonds, obtain comprising with dangling bonds silicon atom and oxygen atom binder course 32.Wherein, the light of preset wavelength can
To use ultraviolet light.
Optionally, the S5 of the embodiment of the present application, implementation preset temperature treatment process, so that the light-sensitive material in binder course 32
It is combined respectively with inorganic encapsulated layer 31 and organic encapsulation layer 33, to ultimately form packaging film 3, comprising:
Implement preset temperature treatment process, so that in the silicon atom and organic resin layer in binder course 32 with dangling bonds
Oxyethylene group group combines, and the oxygen atom with dangling bonds is combined with the siloxy group in silicon oxide layer.Wherein, preset temperature
The temperature range for the treatment of process can be 100 degrees Celsius to 120 degrees Celsius, and time range can be 10 minutes to 20 minutes.
In the embodiment of the present application, first with ultraviolet light cage modle polysilsesquioxane based polyurethanes, make its silicon oxygen bond with
And the breaking of covalent bonds between silicon and other groups, the combination comprising silicon atom and oxygen atom with dangling bonds is obtained, then real
Preset temperature treatment process is applied, so that the ethylene oxide group in the silicon atom and organic resin layer in binder course 32 with dangling bonds
In conjunction with, with dangling bonds oxygen atom in silicon oxide layer siloxy group is combined, and then realization binder course 32 respectively with it is organic
Resin layer and silicon oxide layer are combined by the way that chemical reaction occurs.
In the prior art, in display panel bending, in addition to the inorganic encapsulated layer 31 and organic encapsulation layer of packaging film 3
Outside interface peeling off phenomenon between 33, inorganic encapsulated layer 31 is also due to the malleability of its own is poor and cracks, water
Vapour and oxygen can enter packaging film 3 through organic encapsulation layer 33 and can penetrate into the crackle, so with the substrate 1 in display panel
Contact causes substrate 1 to be corroded damage.In the binder course 32 of the embodiment of the present application, light-sensitive material includes the poly- sesquialter silicon of cage modle
Oxyalkyl polyurethane, which is a kind of organic inorganic hybridization molecule, can reduce organic envelope
Fill layer 33 surface can, to increase the hydrophobicity of organic encapsulation layer 33, steam and oxygen just can not from organic encapsulation layer 33 into
Enter packaging film 3, naturally also can not just penetrate into the crackle of inorganic layer, this is the further high barriering effect of packaging film 3, drop
Substrate 1 in low display panel is corroded the risk of damage.
Optionally, it in the embodiment of the present application, is formed after inorganic encapsulated layer 31 on S1, substrate 1 to be packaged, and
S2, it is formed before the middle layer comprising light-sensitive material on inorganic encapsulated layer 31, further includes:
Using plasma bombardment method by the surface roughening of inorganic encapsulated layer 31.
After the surface roughening of inorganic encapsulated layer 31, the combination between inorganic encapsulated layer 31 and binder course 32 is helped to improve
Intensity.On the one hand, staggered structure can be formed between the roughened surface of inorganic encapsulated layer 31 and the surface of binder course 32,
The staggered structure helps to increase adhesive force between the two, increases the bond strength of the two.On the other hand, inorganic encapsulated layer
After 31 surface roughening, equivalent to increase the surface area of inorganic encapsulated layer 31, this also increases 31 He of inorganic encapsulated layer
Contact area between binder course 32, and then increase the quantity of the oxygen atom combined therebetween and siloxy group, further
Increase the bond strength of the two.
Optionally, in the embodiment of the present application, after S5, implementation preset temperature treatment process, further includes:
Implement stoving process.Stoving process facilitates 3 rapid curing of packaging film.In the embodiment of the present application, stoving process
Temperature range can be 80 degrees Celsius to 100 degrees Celsius, time range can be 30 minutes to 60 minutes.
Optionally, in the embodiment of the present application, a substrate 1 to be packaged and a cover board 2 S1, are provided, in substrate 1 to be packaged
Upper formation inorganic encapsulated layer 31 specifically includes:
It is deposited on substrate 1 to be packaged using atomic layer deposition (ALD, Atomic Layer Deposition) technique
At inorganic encapsulated layer 31.Atomic layer deposition is the method for being plated in substrate surface by substance with monatomic form membrane in layer.
In atomic layer deposition process, the chemical reaction of new one layer of atomic film is that directly preceding layer is associated therewith, and this mode makes
Each reaction only deposits one layer of atom.Inorganic encapsulated layer 31 is formed using atom layer deposition process, it is ensured that inorganic encapsulated layer
31 thickness is uniform, improves the flatness of display panel；In addition, inorganic encapsulated layer 31 in homogeneous thickness can to avoid its by
There is stress raisers phenomenon during power, avoids its structure by stress rupture.
Optionally, in the embodiment of the present application, S4, formation organic encapsulation layer 33 is specifically included on binder course 32:
(Coating) is coated on binder course 32 or inkjet printing (IJP, Ink Jet Printing) forms organic packages
Layer 33.Materials'use rate can be improved in coating and inkjet printing, also can simplify the forming process of organic encapsulation layer 33.
The embodiment of the present application also provides a kind of packaging methods of extension, and the flow diagram of this method is as shown in Fig. 2, packet
It includes:
S11, a substrate 1 to be packaged and a cover board 2 are provided, forms silicon oxide layer on substrate 1 to be packaged；
S12, using plasma bombardment method by the surface roughening of silicon oxide layer.
S13, the middle layer comprising cage modle polysilsesquioxane based polyurethanes is formed on silicon oxide layer；
S14, using ultraviolet light middle layer, make cage modle polysilsesquioxane based polyurethanes silicon oxygen bond and silicon and its
Breaking of covalent bonds between its group obtains the binder course 32 comprising silicon atom and oxygen atom with dangling bonds；
S15, organic resin layer is formed on binder course 32；
S16, implement preset temperature treatment process, so that with the silicon atom and organic resin layer of dangling bonds in binder course 32
In oxyethylene group roll into a ball combine, and with dangling bonds oxygen atom in silicon oxide layer siloxy group combined；
S17, implement stoving process, to ultimately form packaging film 3.
Optionally, it in the embodiment of the present application, is also wrapped after ultimately forming packaging film 3 in S17, implementation stoving process
It includes: cover board 2 is covered on packaging film 3.
Based on the same inventive concept, the embodiment of the present application also provides a kind of display panel, the structure of the display panel such as Fig. 3
With shown in Fig. 4, the thickness of each layer, area size, shape do not react the actual proportions of each layer in attached drawing, and purpose is schematically illustrate
The content of the embodiment of the present application.The display panel is packaged using packaging method provided by the embodiments of the present application.Display panel
Including packaging film 3, packaging film 3 includes: inorganic encapsulated layer 31 on the substrate 1 in display panel, binder course 32 and has
Machine encapsulated layer 33, and the light-sensitive material in binder course 33 is combined with inorganic encapsulated layer 31 and organic encapsulation layer 33 respectively.
Optionally, during the application is implemented, inorganic encapsulated layer 31 is silicon oxide layer, and the light-sensitive material in binder course 32 includes cage
Type polysilsesquioxane based polyurethanes, organic encapsulation layer 33 are organic resin layer.
Specifically, in the embodiment of the present application, the light-sensitive material in binder course 32 includes the poly- sesquialter of cage modle in reference state
Siloxy group polyurethane, the oxygen second in the silicon atom and organic resin layer of the cage modle polysilsesquioxane based polyurethanes of the reference state
Alkenyl group combines and the siloxy in the oxygen atom and silicon oxide layer of the cage modle polysilsesquioxane based polyurethanes of the reference state
Group combines.
Optionally, in the embodiment of the present application, inorganic encapsulated layer 31 with a thickness of 10 nanometers to 200 nanometers.
Optionally, binder course 32 with a thickness of 95 nanometers to 105 nanometers.
Optionally, machine encapsulated layer 33 with a thickness of 0.5 nanometer to 5 nanometers.
Optionally, the substrate 1 in display panel provided by the embodiments of the present application includes OLED (Organic Light-
Emitting Diode, Organic Light Emitting Diode).
Optionally, display panel provided by the embodiments of the present application further includes cover board 2, and cover board 2 is covered on packaging film 3.
Display panel provided by the embodiments of the present application can be applied to various display equipment, such as can be with are as follows: desktop computer, flat
Plate computer, laptop, mobile phone, PDA, GPS, car-mounted display, Projection Display, video camera, digital camera, electronic watch, meter
It is any with aobvious to calculate device, electronic instrument and meter, liquid crystal display panel, Electronic Paper, television set, display, Digital Frame, navigator etc.
The products or components for showing function can be applied to the multiple fields such as public display and illusory display.
Using the embodiment of the present application, at least can be realized it is following the utility model has the advantages that
1, during packaging film in the embodiment of the present application in formation, middle layer makes after the irradiation of the light of preset wavelength
It obtains light-sensitive material chemical change occurs and forms binder course, binder course, inorganic encapsulated layer and organic encapsulation layer are using default temperature
Degree treatment process and chemically react so that light-sensitive material in binder course respectively with inorganic encapsulated layer and organic encapsulation layer knot
It closes, this chemically combined mode to combine even closer between inorganic encapsulated layer and organic encapsulation layer, improves encapsulation
Film bears the ability of external force, and the interface reduced between the inorganic encapsulated layer of packaging film and organic encapsulation layer is peeling-off existing
The probability of elephant, and then the barriering effect of packaging film is improved, using packaging method provided by the embodiments of the present application in display surface
The packaging film is formed on the substrate of plate, steam can be effectively prevented and oxygen is in contact with substrate, and substrate is avoided to be corroded damage
It is bad, it ensure that the quality of the display panel comprising the substrate.
2, in the binder course of the embodiment of the present application, light-sensitive material includes cage modle polysilsesquioxane based polyurethanes, the cage
Type polysilsesquioxane based polyurethanes are a kind of organic inorganic hybridization molecules, can reduce the surface energy of organic encapsulation layer, thus
Increase the hydrophobicity of organic encapsulation layer, steam and oxygen just can not enter packaging film from organic encapsulation layer, just can not naturally also
It penetrates into the crackle of inorganic layer, this is further high, and the barriering effect of packaging film, the substrate reduced in display panel are rotten
Deteriorate bad risk.
3, it in the embodiment of the present application, after the surface roughening of inorganic encapsulated layer, helps to improve inorganic encapsulated layer and combines
Bond strength between layer.On the one hand, friendship can be formed between the roughened surface of inorganic encapsulated layer and the surface of binder course
Wrong structure, the staggered structure help to increase adhesive force between the two, increase the bond strength of the two.On the other hand,
After the surface roughening of inorganic encapsulated layer, equivalent to increase the surface area of inorganic encapsulated layer, this also increases inorganic encapsulated
Contact area between layer and binder course, and then increase the quantity of the oxygen atom combined therebetween and siloxy group, into one
Step increases the bond strength of the two.
4, the embodiment of the present application forms inorganic encapsulated layer using atom layer deposition process, it is ensured that the thickness of inorganic encapsulated layer
Degree uniformly, improves the flatness of display panel；In addition, the thickness of inorganic encapsulated layer uniformly can be to avoid it in loading process
There is stress raisers phenomenon, avoids structure by stress rupture.
5, materials'use rate can be improved using coating or inkjet printing in the embodiment of the present application, also can simplify inorganic encapsulated
The forming process of layer.
In the description of this specification, particular features, structures, materials, or characteristics can be real in any one or more
Applying can be combined in any suitable manner in example or example.
It should be understood that although each step in the flow chart of attached drawing is successively shown according to the instruction of arrow,
These steps are not that the inevitable sequence according to arrow instruction successively executes.Unless expressly stating otherwise herein, these steps
Execution there is no stringent sequences to limit, can execute in the other order.Moreover, at least one in the flow chart of attached drawing
Part steps may include that perhaps these sub-steps of multiple stages or stage are not necessarily in synchronization to multiple sub-steps
Completion is executed, but can be executed at different times, execution sequence, which is also not necessarily, successively to be carried out, but can be with other
At least part of the sub-step or stage of step or other steps executes in turn or alternately.
The above is only some embodiments of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (12)
1. a kind of packaging method characterized by comprising
One substrate to be packaged and a cover board are provided；
Inorganic encapsulated layer is formed on the substrate to be packaged；
The middle layer comprising light-sensitive material is formed on the inorganic encapsulated layer, and the middle layer is irradiated using the light of preset wavelength
To form binder course；
Organic encapsulation layer is formed on the binder course；
Implement preset temperature treatment process so that light-sensitive material in the binder course respectively with inorganic encapsulated layer and described organic
Encapsulated layer combines, to ultimately form packaging film.
2. the method according to claim 1, wherein
The inorganic encapsulated layer is silicon oxide layer,
Light-sensitive material in the middle layer includes cage modle polysilsesquioxane based polyurethanes, the cage modle polysilsesquioxane base
Polyurethane includes the covalent bond between silicon oxygen bond and silicon and other groups；
The organic encapsulation layer is organic resin layer, and the organic resin layer includes ethylene oxide group.
3. according to the method described in claim 2, it is characterized in that, the light for using preset wavelength irradiate the middle layer with
Form binder course, comprising:
The middle layer is irradiated using the light of preset wavelength so that the silicon oxygen bond or silicon and other groups in the middle layer it
Between breaking of covalent bonds, obtain comprising with dangling bonds silicon atom and oxygen atom binder course.
4. according to the method described in claim 3, it is characterized in that, the implementation preset temperature treatment process, so that the knot
The light-sensitive material in layer is closed respectively in conjunction with inorganic encapsulated layer and the organic encapsulation layer, to ultimately form packaging film, comprising:
Implement preset temperature treatment process, so that in the silicon atom and the organic resin layer in the binder course with dangling bonds
Oxyethylene group roll into a ball combine, and with dangling bonds oxygen atom in the silicon oxide layer siloxy roll into a ball combined.
5. the method according to claim 1, wherein described form inorganic encapsulated on the substrate to be packaged
After layer, and before the formation on inorganic encapsulated layer includes the middle layer of light-sensitive material, further includes: banged using plasma
Method is hit by the surface roughening of the inorganic encapsulated layer.
6. the method according to claim 1, wherein also being wrapped after the implementation preset temperature treatment process
It includes: implementing stoving process.
7. the method according to claim 1, wherein the temperature range of the preset temperature treatment process is 100
Degree Celsius to 120 degrees Celsius, time range is 10 minutes to 20 minutes.
8. the method according to claim 1, wherein described form inorganic encapsulated on the substrate to be packaged
Layer includes: that the inorganic encapsulated layer is deposited on the substrate to be packaged using atom layer deposition process.
9. the method according to claim 1, wherein described form organic encapsulation layer packet on the binder course
Include: coating or inkjet printing form the organic encapsulation layer on the binder course.
10. a kind of display panel, which is characterized in that the display panel is using any encapsulation side in claim 1-9
Method is packaged；
The display panel includes packaging film, and the packaging film includes: inorganic on the substrate in the display panel
Encapsulated layer, binder course and organic encapsulation layer, and the light-sensitive material in the binder course respectively with inorganic encapsulated layer and described organic
Encapsulated layer combines.
11. display panel according to claim 10, which is characterized in that the inorganic encapsulated layer is silicon oxide layer, described
Light-sensitive material in binder course includes cage modle polysilsesquioxane based polyurethanes, and the organic encapsulation layer is organic resin layer.
12. display panel according to claim 10, which is characterized in that
The inorganic encapsulated layer with a thickness of 10 nanometers to 200 nanometers；
And/or the binder course with a thickness of 95 nanometers to 105 nanometers；
And/or the organic encapsulation layer with a thickness of 0.5 nanometer to 5 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810847514.9A CN109037479B (en) | 2018-07-27 | 2018-07-27 | Packaging method and display panel |
Applications Claiming Priority (1)
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